CN101252330A - Apparatus and method for stacking precision positioning with piezoelectricity - Google Patents
Apparatus and method for stacking precision positioning with piezoelectricity Download PDFInfo
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- CN101252330A CN101252330A CNA2008100108608A CN200810010860A CN101252330A CN 101252330 A CN101252330 A CN 101252330A CN A2008100108608 A CNA2008100108608 A CN A2008100108608A CN 200810010860 A CN200810010860 A CN 200810010860A CN 101252330 A CN101252330 A CN 101252330A
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Abstract
The invention discloses a piezoelectric stack precise positioning method and a device thereof, belonging to sensing measurement and control technical field and relating to precise positioning methods and positioning devices for actuators. Firstly, a relation curve of external force and output displacement is built up through the calibration to the precise positioning device, and results are recorded through stepwise loading method; the elastic displacements of the external force and a piezoelectric ceramic stack, and the relation curve of the quadratic converse piezoelectric displacement of the piezoelectric stack and the external force are respectively described; afterwards, pretreatment is carried out, and then rough positioning and finally precise positioning are carried. The device adopted in the piezoelectric stack precise positioning method is composed of a pedestal, a piezoelectric ceramic stack, an elastic plate, an adjusting shim, an upper cover and a pre-tightening screw. The device needs no driving source and is highly precise in positioning, simple in structure, low in cost, small in size and is convenient to manufacture, and is applicable for precise positioning in ultra-precision machining field as well as for sub-micron and nano-scale precise compensation in micro-systems.
Description
Technical field
The invention belongs to sensing observation and control technology field, relate to the precision positioning method and the positioner technical field of microactrator.
Background technology
Precision positioning technology be one with the closely-related new and high technology of many production practices, it has widely in fields such as ultraprecise processing, precision optical machinery, semiconductor device manufacturing, electronic product assembly line, bioengineering and little/receive Mechatronic Systems uses.Microactrator technology with high accuracy, quick response, high displacement resolution and control precision has become the inexorable trend of its development.The type of drive of microactrator comprises at present: static driven, Electromagnetic Drive, Piezoelectric Driving, thermal expansion driving, magnetostriction type driving, the driving of pneumatic, electric liquid and the driving of marmem diaphragm etc.Wherein Piezoelectric Driving is because of its resolution height, and motive force is big, and response speed is fast, and is low in energy consumption, can as operate as normal under the ultralow temperature, and be widely used in various precision instruments and the electromechanical integration equipment in adverse circumstances.The mechanism of Piezoelectric Driving generally is based on the inverse piezoelectric effect of piezoelectrics, promptly can produce deformation when piezoelectrics are subjected to effect of electric field, drives the microactrator action.Piezoelectric ceramic can produce micron even the displacement of nanometer scale or motion as a kind of high-precision micro displacement device; And have that volume is little, power output is big, response speed is fast, positioning accuracy is high, in use noiseless, advantage such as do not generate heat are used widely in fields such as Aero-Space, microelectronics, accurate measurement, bioengineering, robot and Precision Machining.Theoretically, piezo actuator can obtain infinitesimal displacement, but the piezoelectric ceramic resolution that can reach is limited in actual applications, because its output accuracy is based upon on the performance basis of drive control power supply, in order to improve the output accuracy of actuator, need the driving power performance to promote at double, cause the cost several times to increase, restricted the further application of piezo actuator.The piezoelectric ceramic actuator inherent shortcoming is exactly that the output displacement is obvious with the hesitation of control between the voltage in addition, need be aided with usually and boost and sluggish compensating circuit.Present domestic most of Piezoelectric Driving power supply all is made up of the separation property device, and not only structure is complicated, and is easy to generate self-oscillation.Driving power has become the bottleneck of piezo actuator to the development of high accuracy field more.For solving this difficult problem, on the one hand, the scientific research personnel is just getting down to the research work that improves the driving power cost performance, and on the other hand, probing into of the new theory of functional material and new technology also is a focus of rerum natura type actuator research.
Summary of the invention
The technical barrier that the present invention will solve is will overcome above-mentioned drive control power supply to the piezo actuator Effect on Performance, a kind of precision positioning device that conventional piezoelectric drives that is different from is proposed, secondary inverse piezoelectric effect principle based on piezoelectric ceramic, do not need drive control power supply, just can realize thick, smart two-stage location and reach sub-micron even nano level displacement.This apparatus structure is simple, and cost is low.
A kind of method with the piezoelectric stack precision positioning of the technical solution used in the present invention is: at first by precision positioning device being demarcated the relation curve of setting up external force and output displacement, adopt Loading Method step by step, from 10% of full scale, add to full scale step by step, the record result, and depict external force and piezoelectric ceramic respectively and stack 2 elastic displacement, external force and piezoelectric ceramic stack the relation curve of the contrary displacement bimorph of 2 secondaries, the size that needs to load external force in definite thus Precision Positioning, realize precision positioning by following step then: the first step, preliminary treatment: will install fixing by through hole c, regulating four pretension screws 6 respectively makes it produce specified pretightning force, eliminate between piezoelectric chip and piezoelectric ceramic stacks 2 and the splicing gap of flexure strip 3, the short circuit piezoelectric ceramic stacks two electrodes of 2, neutralizes the electric charge that is brought by pretension; In second step, coarse positioning: stack at piezoelectric ceramic and to apply under 2 the circuit off-state on the center line that external force F acts on boss b, external force F affacts piezoelectric ceramic by loam cake 5 and stacks and produce elastic displacement on 2 and realize coarse positioning; The 3rd step, fine positioning: after coarse positioning is finished immediately the short circuit piezoelectric ceramic stack two electrodes of 2, the induced electric field that direct piezoelectric effect produces is eliminated, and stacks the displacement bimorph that 2 secondary inverse piezoelectric effect produces by piezoelectric ceramic and realizes fine positioning.
The device that a kind of precision positioning method with piezoelectric stack adopts be by base 1, piezoelectric ceramic stack 2, flexure strip 3, adjusting pad 4, loam cake 5 and pretension screw 6 constitute, base 1 is made up of two cylinders, evenly arrange four through hole c on the following cylinder, last cylinder hollow is provided with the groove a that is used to feel relieved; Piezoelectric ceramic is stacked 2 put into groove a, the flexure strip 3 of rectangle is bonded to the piezoelectric ceramic that scribbles 704 high resistant insulating cements and stacks 2 upper surface, 704 high resistant insulating cements form adhesive layer 7, the adjusting pad 4 that is used for regulating the pretension surplus ε between the upper surface of loam cake 5 and base 1 is put on the flexure strip 3, lay circular loam cake 5 on the adjusting pad 4, its top is useful on the boss b of centering, and boss b overlaps with the center of groove a, connects loam cake 5 and base 1 with four pretension screws 6.
Remarkable result of the present invention is: the present invention is not only applicable to the precision positioning of ultraprecise processing and other fields, also be applicable to the flow control and the control little, nanoscale one dimension micro displacement workbench of nozzle-baffle mechanism, also, can be used for sub-micron, nano-precision compensation in the micro-system for the little/micro-clamp that is used for clamping and operation small items in the Mechatronic Systems of receiving provides a kind of new method.This precision positioning device is simple in structure, and cost is low, and volume is little, is convenient to processing and manufacturing.
Description of drawings
Fig. 1 is the A-A cutaway view of Fig. 2, and among the figure: the 1-base, the 2-piezoelectric ceramic stacks, 3-flexure strip, 4-adjusting pad, 5-loam cake, 6-pretension screw, 7-adhesive layer, a-groove, b-boss, c-through hole, ε-pretension surplus, F-external force.
Fig. 2 is the vertical view of precision positioning device.
Fig. 3 is a piezoelectric stack secondary inverse piezoelectric effect principle schematic, among the figure: the I-piezoelectric stack is in the initial condition that circuit disconnects, and the II-piezoelectric stack is subjected to the state that a direct piezoelectric effect takes place in external force F effect, the state of two electrodes of III-short circuit piezoelectric stack, F-external force, δ
1-elastic displacement, δ
2The contrary displacement bimorph of-secondary.
Embodiment
Combination technology scheme and accompanying drawing describe concrete enforcement of the present invention in detail, the direct piezoelectric effect principle that piezoelectric ceramic stacks in the precision positioning device is seen (II) in the accompanying drawing 3, promptly apply external force F under the circuit off-state of the piezoelectric stack shown in (I) in accompanying drawing 3, piezoelectric ceramic is subjected to external force F effect to certainly lead to an elastic displacement δ
1, simultaneously piezoelectric ceramic will direct piezoelectric effect produces polarization owing to one time, and the electric charge of generation can not run off on the piezoelectric ceramic electrode surface of open circuit, forms electric displacement D
i (1), be exactly usually said piezoelectric effect, get according to piezoelectric equations:
T in the formula
μ-act on the stress that piezoelectric ceramic stacks, S
λ-piezoelectric ceramic stacks the strain of generation, s
λ μ E-elastic compliance constant, d
I μ-piezoelectric strain constant is because above-mentioned electric displacement D
i (1)Existence, cause the relative displacement at the inner positive and negative charge of piezoelectrics center and cause distortion, be i.e. electric displacement D
i (1)Produced additional piezoelectric strain S
λ (2), piezoelectrics generation secondary inverse piezoelectric effect can get
g
I μ-piezoelectric voltage constant is as seen at electric displacement D
i (1)Effect under, the secondary inverse piezoelectric effect has produced the piezoelectric strain S opposite with the elastic strain direction
λ (2)If two electrodes that this moment, the short circuit piezoelectric ceramic stacked have been equivalent to act on a reverse electric field on piezoelectric stack, then piezoelectric ceramic stacks generation and the equidirectional displacement δ of elastic deformation
2, see (III) in the accompanying drawing 3.Elastic strain and the contrary piezoelectric strain of secondary are all linear with external force as can be known by formula (1) and (3), so the actuator of using secondary inverse piezoelectric effect principle design can realize that fully thick, smart two-stage locatees.
For example: the employing precision positioning device comes the distance between controllable register and nozzle, piezoelectric ceramic stacks 2 and is superposeed successively by 100 lead zirconate titanates and to pile, this precision positioning device maximum load capacity is 3000N, flexure strip 3 materials adopt the high-speed steel of high rigidity, roughness is less than 0.02 μ m, and the material of base 1, adjusting pad 4 and loam cake 5 all adopts stainless steel, and adjusting pad 4 and loam cake 5 require to have enough rigidity, piezoelectric ceramic stacks 2 same sex electric charges that produce on same electrode behind the loading F, sees accompanying drawing 1.During use, make by adjusting pad 4 that pretension surplus ε is 1mm between the upper surface of loam cake 5 and base 1, at first this precision positioning device is demarcated, from 300N, add to 3000N step by step, measure elastic displacement under each loading respectively by inductance amesdial, and piezoelectric ceramic stacks the displacement bimorph that 2 secondary inverse piezoelectric effect produces after the short circuit, write down the result who loads for 10 times, make the relation curve of external force and elastic displacement and external force and the contrary displacement bimorph of secondary respectively according to the result, this curve is exactly a foundation of determining the loading force size in the precision positioning.Come the position of controllable register then by following step, the first step, preliminary treatment: c fixes precision positioning device by through hole, for stacking that 100 piezoelectric ceramic are formed, need to regulate the pretightning force that four pretension screws 6 produce about 600N, the short circuit piezoelectric ceramic stacks two electrodes of 2 again, neutralizes the electric charge that is brought by pretension; Second step, coarse positioning: should make piezoelectric ceramic stack 2 after the preliminary treatment and be in the circuit off-state, piezoelectric ceramic stacks 2 can produce repeatedly piezoelectric effect under external force, determine to load the value of external force F by calibration curve according to the size of coarse positioning, apply the center that external force F acts on boss b, piezoelectric ceramic stacks 2 and produces elastic displacement, drive baffle plate and realize coarse positioning, 100 precision positioning devices that piezoelectric ceramic stacks, apply 100N external force under the 600N pretightning force, baffle plate produces the displacement of 1.2 μ m; In the 3rd step, fine positioning: finish behind the coarse positioning of baffle plate 1.2 μ m short circuit piezoelectric ceramic immediately and stack two electrodes of 2, the secondary inverse piezoelectric effect that 100 piezoelectric ceramic stack produces 0.08 μ m displacement bimorph, realizes the fine positioning of baffle plate.Therefore realized the coarse positioning of 1.2 μ m by above step baffle plate, the fine positioning of 0.08 μ m has reached adjusting nozzle and baffle spacing from the purpose of carrying out flow control.
Should determine that piezoelectric ceramic stacks 2 sheet number according to specific requirement in actual the use, just can obtain different positioning accuracies by applying different external force F, compare with the piezo actuator of power drives, the easier acquisition of drive source, more cheap, and this precision positioning method can realize thick, smart two-stage location, the positioning accuracy height, and localization method is easy.
Claims (2)
1. method with the piezoelectric stack precision positioning, it is characterized in that: at first by precision positioning device being demarcated the relation curve of setting up external force and output displacement, adopt Loading Method step by step, from 10% of full scale, add to full scale step by step, the record result, and depict external force respectively and piezoelectric ceramic stacks the elastic displacement of (2), external force and piezoelectric ceramic stack the relation curve of the contrary displacement bimorph of (2) secondary, need to load the size of external force in definite thus Precision Positioning, realize precision positioning by following step then:
The first step, preliminary treatment: will install fixing by through hole (c), regulating four pretension screws (6) respectively makes it produce specified pretightning force, eliminate between piezoelectric chip and piezoelectric ceramic stacks the splicing gap of (2) and flexure strip (3), the short circuit piezoelectric ceramic stacks two electrodes of (2), neutralizes the electric charge that is brought by pretension;
In second step, coarse positioning: stack at piezoelectric ceramic and apply under the circuit off-state of (2) on the center line that external force F acts on boss (b), external force F affacts piezoelectric ceramic by loam cake (5) and stacks (2) and go up and produce elastic displacement realization coarse positioning;
The 3rd step, fine positioning: after coarse positioning is finished immediately the short circuit piezoelectric ceramic stack two electrodes of (2), the induced electric field that direct piezoelectric effect produces is eliminated, and stacks the displacement bimorph that the secondary inverse piezoelectric effect of (2) produces by piezoelectric ceramic and realizes fine positioning.
2. according to the described a kind of device that adopts with the piezoelectric stack precision positioning method of claim 1, it is characterized in that: stack (2), flexure strip (3), adjusting pad (4), loam cake (5) and pretension screw (6) by base (1), piezoelectric ceramic and constitute, base (1) is made up of two cylinders, evenly arrange four through holes (c) on the following cylinder, last cylinder hollow is provided with the groove (a) that is used to feel relieved; Piezoelectric ceramic is stacked (2) and put into groove (a), the flexure strip of rectangle (3) is bonded to the upper surface that the piezoelectric ceramic that scribbles 704 high resistant insulating cements stacks (2), 704 high resistant insulating cements form adhesive layer (7), the adjusting pad (4) that will be used for regulating the pretension surplus ε between the upper surface of loam cake (5) and base (1) is put on the flexure strip (3), lay circular loam cake (5) on the adjusting pad (4), its top is useful on the boss (b) of centering, boss (b) overlaps with the center of groove (a), connects loam cake (5) and base (1) with four pretension screws (6).
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CN102810628A (en) * | 2011-06-02 | 2012-12-05 | 中国科学院合肥物质科学研究院 | Piezoelectric stack positioner with piezoelectric plates in different positioning directions stacked in turn |
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