CN101237721A - Digital microphone sealing method - Google Patents
Digital microphone sealing method Download PDFInfo
- Publication number
- CN101237721A CN101237721A CNA2008100657107A CN200810065710A CN101237721A CN 101237721 A CN101237721 A CN 101237721A CN A2008100657107 A CNA2008100657107 A CN A2008100657107A CN 200810065710 A CN200810065710 A CN 200810065710A CN 101237721 A CN101237721 A CN 101237721A
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- Prior art keywords
- shell
- digital microphone
- pad
- circuit board
- connecting ring
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a method for sealing a digital microphone. The method comprises the following steps of: providing a shell; arranging a membrane unit inside the shell; placing a pad on the membrane unit; positioning a back seat carrying a back plate and a connecting ring close to the pad inside the shell; butt jointing a circuit board with the connecting ring; and spreading glue on four inner walls of the shell. The glue spread on the four inner walls of the shell, after becoming solid, fills gaps between the circuit board and the shell, thereby well sealing the digital microphone.
Description
[technical field]
The present invention relates to a kind of microphone and encapsulating method thereof, relate in particular to a kind of encapsulating method of digital microphone.
[background technology]
Mobile communication technology is rapidly developed in recent years.The consumer uses mobile communication equipment more and more, and for example portable phone, the portable phone that can surf the Net, personal digital assistant, laptop computer, laptop computer, figure input card maybe can be by other equipment public or that dedicated communications network communicates.The technological progress of the expansion at honeycomb networking and mobile communication aspect makes more consumers use mobile communication equipment.The growing demand of communication equipment has been promoted to be integrated in the improvement of manufacturing process, power consumption, reception, manufacturing and the miniaturization aspect of the audio components in the mobile communication equipment.Competitive pressure between the supplier of mobile communication equipment has increased demand littler, more cheap and the digital microphone that performance is more excellent.
Fig. 1 is a kind of three-dimensional exploded view of digital microphone 80 related to the present invention, and this digital microphone 80 comprises shell 81, membrane combination 82, pad 83, back-pole base 84, back pole plate 85, connecting ring 86 and circuit board 87.Circuit board 87 is a rectangular plate shape body, has four first roughly rectangular corners 871; The straight side walls 810 that shell 81 extends by diapire (indicate), from diapire and form by the host cavity 812 that diapire and straight side walls 810 surround, host cavity 812 is formed with opening 813 in the end away from diapire, this opening 813 has the resemblance that is complementary with circuit board 87, and promptly four of this opening 813 second corners 814 are also roughly rectangular.
Yet, during edge sealing, the material at opening 813 places of shell 81 curls to circuit board 87, the part material of second corner 814 of shell will be piled up in rectangular first corner, 871 places of circuit board 87, cause, this digital microphone 80 is because of first corner, 813 place's edge sealing inequalities of circuit board 87, the phenomenon that leaks air.
Therefore, be necessary to provide a kind of encapsulating method of new digital microphone to overcome above-mentioned shortcoming.
[summary of the invention]
The object of the present invention is to provide a kind of encapsulating method of excellent sealing digital microphone.
The object of the present invention is achieved like this:
The concrete steps of digital microphone sealing method of the present invention are as follows: a shell is provided; Membrane combination is placed in the shell; On membrane combination, place pad; The back-pole base that carries back pole plate and connecting ring is placed near in the shell of pad; Circuit board is connected on the connecting ring; Cementing around the inwall of shell.
Compared with prior art, the present invention has the following advantages: cementing around the inwall of shell, after glue curing, can fill the gap between circuit board and the shell, and play the wind action of excellent sealing digital microphone.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of digital microphone related to the present invention.
Fig. 2 is the three-dimensional exploded view of this microphone in the encapsulating method of digital microphone of the present invention.
[embodiment]
Digital microphone sealing method of the present invention, wherein digital microphone 100 comprise shell 1, be contained in membrane combination 2 in the shell 1, be positioned over pad 3 on the membrane combination 2, with the back-pole base 5 of pad 3 adjacency, be embedded at back pole plate 4, connecting ring 6 that links to each other with back pole plate 4 in the back-pole base 5 and the circuit board 9 that electrically connects with shell 1.Wherein, back pole plate 4 and connecting ring 6 are contained in respectively in the back-pole base 5.
Shell 1 is square, and it comprises roof 11 and the sidewall 12 that extends from roof 11, wherein offers on the roof 11 in order to accept first tone-entering hole 13 of outside sound source, so that sound wave can be sent to membrane combination 2.This first tone-entering hole 13 can form by any suitable mode (for example boring, punching or molded).
Though the shape of membrane combination 2 is corresponding with the shape of shell 1 in the present embodiment, in different execution modes, can adopt multiple shape, membrane combination 2 that size is different.
The through hole 52 that back-pole base 5 is provided with annular side wall 51 and is enclosed to form by side wall 51 is extended with groove 53 in the annular side wall 51 of back-pole base 5 to through hole 52, and described groove 53 is in order to hold glue.Back-pole base 5 can be made multiple shape and size to adapt to the needs of application.Back-pole base 5 is made for cube shaped and by electrical insulating material in the present embodiment.
Connecting ring 6 is circular, and this connecting ring 6 also can take different shapes according to different performances and size.
The concrete steps of digital microphone sealing method of the present invention are as follows: a shell 1 is provided; Membrane combination 2 is placed in the shell 1; On membrane combination 2, place pad 3; The back-pole base 5 that carries back pole plate 4 and connecting ring 6 is placed near in the shell 1 of pad 3; Circuit board 7 is connected on the connecting ring 6; Cementing (not shown) around the inwall of shell 1.
Cementing around the inwall of shell 1 after glue curing, can be filled the gap between circuit board 7 and the shell 1, plays the effect of excellent sealing digital microphone 100.In addition, groove 53 is set on back-pole base 5, when cementing, glue is subjected to himself capillary effect after flowing into this groove 53, no longer flow downward after accumulating in groove 53, can avoid glue to flow into membrane combination 2, not only play the effect of excellent sealing digital microphone 100, and guarantee the vibration performance of digital microphone 100.
The above only is a better embodiment of the present invention; protection scope of the present invention is not exceeded with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (2)
1. digital microphone sealing method, it is characterized in that: this method may further comprise the steps:
A., one shell is provided;
B. membrane combination is placed in the shell;
C. on membrane combination, place pad;
The back-pole base that d. will carry back pole plate and connecting ring places near in the shell of pad;
E. circuit board is contained in the shell;
F. cementing around the inwall of shell.
2. as 1 described digital microphone sealing method of claim the, it is characterized in that: the through hole that described back-pole base is provided with annular side wall and is enclosed to form by side wall, be extended with groove in the annular side wall of back-pole base to through hole, described groove is in order to hold glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100657107A CN101237721A (en) | 2008-02-22 | 2008-02-22 | Digital microphone sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100657107A CN101237721A (en) | 2008-02-22 | 2008-02-22 | Digital microphone sealing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101237721A true CN101237721A (en) | 2008-08-06 |
Family
ID=39921003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100657107A Pending CN101237721A (en) | 2008-02-22 | 2008-02-22 | Digital microphone sealing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101237721A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096238A (en) * | 2013-02-20 | 2013-05-08 | 歌尔声学股份有限公司 | Method of manufacturing microphone unit |
-
2008
- 2008-02-22 CN CNA2008100657107A patent/CN101237721A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096238A (en) * | 2013-02-20 | 2013-05-08 | 歌尔声学股份有限公司 | Method of manufacturing microphone unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080806 |