CN101236887A - Processing system and method for common storage position in semiconductor manufacturing - Google Patents
Processing system and method for common storage position in semiconductor manufacturing Download PDFInfo
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- CN101236887A CN101236887A CNA2007100047417A CN200710004741A CN101236887A CN 101236887 A CN101236887 A CN 101236887A CN A2007100047417 A CNA2007100047417 A CN A2007100047417A CN 200710004741 A CN200710004741 A CN 200710004741A CN 101236887 A CN101236887 A CN 101236887A
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- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000004065 semiconductor Substances 0.000 title description 6
- 238000000034 method Methods 0.000 title description 5
- 238000012546 transfer Methods 0.000 claims abstract description 40
- 238000003672 processing method Methods 0.000 claims abstract description 23
- 239000000725 suspension Substances 0.000 claims description 174
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
The invention provides a processing method for sharing storage space, which is suitable to transfer a wafer box between a first wafer factory and a second wafer factory, wherein, the first wafer factory comprises at least one suspended type shuttle vehicle which spans the first wafer factory area, a suspended type transportation vehicle in the first wafer factory area and a first suspended type temporary storage device; the second wafer factory comprises at least one suspended type shuttle vehicle which spans the second wafer factory area, a suspended type transportation vehicle in the second wafer factory area and a second suspended type temporary storage device; the processing method includes the following steps that: the wafer box is picked up by the suspended type transportation vehicle in the first wafer factory area and placed on the first suspended type temporary storage device, and the wafer box is taken away from the first suspended type temporary storage device by the suspended type shuttle vehicle which spans the first wafer factory area.
Description
Technical field
The present invention relates to a kind of semi-conductor manufacturing system, and particularly relate to a kind of treatment system and method for common storage position of semiconductor manufacturing.
Background technology
At present, wafer factory (Fabrication, the wafer handling between FAB) needs by wafer storage (Stocker) as bridge joint, so that (Front Opening Unified Pod FOUP) passes to another wafer factory from a wafer factory with wafer case.In addition, between wafer region inside (Intra-bay) and wafer region between (Inter-bay) when transmitting wafer case (FOUP), also need by wafer storage (Stocker) as bridge joint.
The schematic diagram that wafer case between Fig. 1 shows wafer factory transmits.
Wafer factory 1 (FAB-1) and wafer factory 2 (FAB-2) have suspension type shuttle (the Inter Overhead Shuttle Vehicle between the wafer plant area respectively, Inter OHS) 110,210 and the suspension type transfer cart (Intra Overhead Transport Vehicle, Intra OHT) 120,220 of wafer on-site.Suspension type shuttle between the wafer plant area of wafer factory 1 (Inter OHS 1) is obtained wafer case (FOUP), sends it suspension type transfer cart (Intra OHT) 110 of wafer on-site to.Then, if desire is transported to wafer factory 2 with this wafer case (FOUP) from wafer factory 1, then the suspension type transfer cart of the wafer on-site of wafer factory 1 (Intra OHT) 110 is sent to this wafer case (FOUP) suspension type apparatus for temporary storage (the Overhead Buffer of wafer factory 1 (FAB-1), OHB) 130, by the mechanical arm of relaying wafer storage (Relay Stocker) this wafer case (FOUP) is sent to the suspension type apparatus for temporary storage (OHB) 230 of wafer factory 2 then.Then, the suspension type transfer cart of the wafer on-site of wafer factory 2 (Intra OHT) 220 is obtained this wafer case (FOUP) from suspension type apparatus for temporary storage (OHB) 230.
As mentioned above, at present the wafer case between the different chips factory transmit must be by robotic arm apparatus for temporary storage as the equipment that passes on, so will increase the maintenance cost of delivery time and robotic arm, and wafer storage (Stocker) space in many factories that can account for.Therefore, the invention provides a kind of treatment system and method for common storage position of semiconductor manufacturing, it is used as transfer station by suspension type apparatus for temporary storage (OHB), can reduce the actual floor space (Footprint) of wafer storage (Stocker) and the maintenance cost of delivery time and minimizing robotic arm.
Summary of the invention
Based on above-mentioned purpose, the embodiment of the invention has disclosed a kind of processing method of common storage position, it is applicable to that the wafer case between the first wafer factory and the second wafer factory transmits, wherein, this first wafer factory comprises the suspension type shuttle between at least one first wafer plant area, the suspension type transfer cart and the first suspension type apparatus for temporary storage of the first wafer on-site, this second wafer factory comprises the suspension type shuttle between at least one second wafer plant area, the suspension type transfer cart and the second suspension type apparatus for temporary storage of the second wafer on-site, and this processing method comprises the following steps.Suspension type transfer cart by this first wafer on-site is obtained wafer case, this wafer case is placed on this first suspension type apparatus for temporary storage, and on this first suspension type apparatus for temporary storage, this wafer case is taken away by the suspension type shuttle between this first wafer plant area.
The processing method of the common storage position of the embodiment of the invention also comprises by the suspension type shuttle between this second wafer plant area and obtains wafer case, this wafer case is placed on this second suspension type apparatus for temporary storage, and on this second suspension type apparatus for temporary storage, this wafer case is taken away by the suspension type transfer cart of this second wafer on-site.
The processing method of the common storage position of the embodiment of the invention also comprises by the suspension type shuttle between this first wafer plant area wafer case is placed on this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage, and directly takes this wafer case away from this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage by the suspension type shuttle between this second wafer plant area.
The processing method of the common storage position of the embodiment of the invention also comprises by the suspension type shuttle between this first wafer plant area wafer case is placed on this second suspension type apparatus for temporary storage, and directly takes this wafer case away from this second suspension type apparatus for temporary storage by the suspension type transfer cart of this second wafer on-site.
The embodiment of the invention has also disclosed a kind of treatment system of common storage position, comprises the suspension type transfer cart of the first suspension type apparatus for temporary storage, the first wafer on-site and the suspension type shuttle between the first wafer plant area at least.The suspension type transfer cart of this first wafer on-site is obtained wafer case, and this wafer case is placed on this first suspension type apparatus for temporary storage.Suspension type shuttle between this first wafer plant area is taken this wafer case away on this first suspension type apparatus for temporary storage.
The embodiment of the invention has also disclosed a kind of treatment system of common storage position, comprises the suspension type shuttle between the second suspension type apparatus for temporary storage, the second wafer plant area and the suspension type transfer cart of the second wafer on-site at least.Suspension type shuttle between this second wafer plant area is obtained wafer case, and this wafer case is placed on this second suspension type apparatus for temporary storage.The suspension type transfer cart of this second wafer on-site, it is in order on this second suspension type apparatus for temporary storage to take this wafer case away certainly.
The embodiment of the invention has also disclosed a kind of treatment system of common storage position, comprises suspension type shuttle between the first suspension type apparatus for temporary storage, the second suspension type apparatus for temporary storage, the first wafer plant area and the suspension type shuttle between the second wafer plant area at least.Suspension type shuttle between this first wafer plant area is placed on wafer case on this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage.Suspension type shuttle between this second wafer plant area is directly taken this wafer case away from this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage.
The embodiment of the invention has also disclosed a kind of treatment system of common storage position, comprises the suspension type shuttle between the second suspension type apparatus for temporary storage, the first wafer plant area and the suspension type transfer cart of the second wafer on-site at least.Suspension type shuttle between this first wafer plant area is placed on wafer case on this second suspension type apparatus for temporary storage.The suspension type transfer cart of this second wafer on-site is directly taken this wafer case away from this second suspension type apparatus for temporary storage.
Description of drawings
Fig. 1 is the schematic diagram that the wafer case between the shows wafer factory transmits.
Fig. 2 is the configuration diagram of treatment system that shows the common storage position of the embodiment of the invention.
Fig. 3 is the flow chart of steps of processing method that shows the common storage position of first embodiment of the invention.
Fig. 4 is the flow chart of steps of processing method that shows the common storage position of second embodiment of the invention.
Fig. 5 is the flow chart of steps of processing method that shows the common storage position of third embodiment of the invention.
Fig. 6 is the flow chart of steps of processing method that shows the common storage position of fourth embodiment of the invention.
The simple symbol explanation
110,210,310, the suspension type shuttle between 410～wafer plant area
120,220,320, the suspension type transfer cart of 420～wafer on-site
130,230,330,430～suspension type apparatus for temporary storage
FAB～wafer factory
Embodiment
For purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. 2 to 5 are done detailed explanation.Specification of the present invention provides different embodiment that the technical characterictic of the different execution modes of the present invention is described.Wherein, the usefulness that is configured to explanation of each element among the embodiment is not in order to restriction the present invention.And the part of drawing reference numeral repeats among the embodiment, is for the purpose of simplifying the description, is not the relevance that means between the different embodiment.
The embodiment of the invention has disclosed a kind of treatment system and method for common storage position of semiconductor manufacturing.
Fig. 2 is the configuration diagram of treatment system that shows the common storage position of the embodiment of the invention.
The treatment system of the common storage position of the embodiment of the invention comprises the first wafer factory (FAB-1) and the second wafer factory (FAB-2) at least.The first wafer factory and the second wafer factory have the suspension type transfer cart (IntraOHT) 320 and 420 and suspension type apparatus for temporary storage (OHB) 330 and 430 of suspension type shuttle (Inter OHS) 310 and 410 between the wafer plant area, wafer on-site respectively.Note, in embodiments of the present invention, explain with sending between the wafer factory, but in practical operation then not as limit.
In the prior art, the wafer case between two plates factory (FOUP) transmission is to realize by the mechanical arm of relaying wafer storage.And in embodiments of the present invention, then the suspension type transfer cart (Intra OHT) by suspension type shuttle between the wafer plant area (Inter OHS) or wafer on-site transmits wafer case (FOUP).Below explain with a plurality of different embodiment.
First embodiment at first is described, with reference to figure 2, when the wafer in 1 pair of wafer case of machine (FOUP) of the first wafer factory was finished manufacturing process, the suspension type transfer cart of wafer on-site (Intra OHT) 320 obtained this wafer case (FOUP) and is placed on the suspension type apparatus for temporary storage (OHB) 330 from the port (Load-port) that is written into of machine 1.Then, the suspension type shuttle between the wafer plant area (Inter OHS) 310 is taken this wafer case (FOUP) away on suspension type apparatus for temporary storage (OHB) 330, so needn't transmit via the mechanical arm of relaying wafer storage.
Second embodiment then is described,, when the suspension type shuttle (InterOHS) 310 between the wafer plant area is obtained wafer case (FOUP), this wafer case (FOUP) is placed on the suspension type apparatus for temporary storage (OHB) 330 with reference to figure 2.Then, the suspension type transfer cart of wafer on-site (Intra OHT) 320 is taken this wafer case (FOUP) away on suspension type apparatus for temporary storage (OHB) 330, and the port that is written into that can be sent to machine 2 carries out manufacturing process, so needn't transmit via the mechanical arm of relaying wafer storage.
The 3rd embodiment then is described, with reference to figure 2, if will transmit wafer case (FOUP) at the two plates inter-plant, then can wafer case (FOUP) be placed on suspension type apparatus for temporary storage (OHB) 330 or the suspension type apparatus for temporary storage (OHB) 430 by the suspension type shuttle between the wafer plant area of the first wafer factory (Inter OHS) 310, the suspension type shuttle between the wafer plant area of the second wafer factory (Inter OHS) 410 is directly taken this wafer case (FOUP) away from suspension type apparatus for temporary storage (OHB) 330 or suspension type apparatus for temporary storage (OHB) 430 then.Perhaps, suspension type shuttle between the wafer plant area (Inter OHS) 310 is placed on this wafer case (FOUP) on the suspension type apparatus for temporary storage (OHB) 430, and the suspension type transfer cart of the wafer on-site of the second wafer factory (Intra OHT) 420 is directly taken this wafer case (FOUP) away from suspension type apparatus for temporary storage (OHB) 430 then.
According to aforesaid way, wafer case (FOUP) needn't transmit via the mechanical arm of relaying wafer storage as can be known, thus, can shorten the delivery time, will have more spaces can supply to put machine in the wafer factory, and reduces the maintenance cost of robotic arm.
Fig. 3 is the flow chart of steps of processing method that shows the common storage position of first embodiment of the invention.
At first, obtain wafer case (FOUP) (step S31), and this wafer case (FOUP) is placed on the first suspension type apparatus for temporary storage (OHB 1) upward (step S32) by the suspension type transfer cart (Intra OHT 1) of the first wafer on-site.Then, take this wafer case (FOUP) away (step S33) on this first suspension type apparatus for temporary storage (OHB 1) certainly by the suspension type shuttle between the first wafer plant area (Inter OHS 1).
Fig. 4 is the flow chart of steps of processing method that shows the common storage position of second embodiment of the invention.
At first, the suspension type shuttle between the second wafer plant area (Inter OHS 2) is obtained wafer case (FOUP) (step S41), and this wafer case (FOUP) is placed on the second suspension type apparatus for temporary storage (OHB 2) upward (step S42).Then, take this wafer case (FOUP) away (step S43) on this second suspension type apparatus for temporary storage (OHB 2) certainly by the suspension type transfer cart (IntraOHT 2) of the second wafer on-site.
Fig. 5 is the flow chart of steps of processing method that shows the common storage position of third embodiment of the invention.
By the suspension type shuttle between the first wafer plant area (Inter OHS 1) wafer case (FOUP) is placed on first suspension type apparatus for temporary storage (OHB 1) or the second suspension type apparatus for temporary storage (OHB 2) last (step S51), directly takes this wafer case (FOUP) (step S52) away by the suspension type shuttle between the second wafer plant area (Inter OHS 2) then from this first suspension type apparatus for temporary storage (OHB 1) or the second suspension type apparatus for temporary storage (OHB 2).
Fig. 6 is the flow chart of steps of processing method that shows the common storage position of fourth embodiment of the invention.
By the suspension type shuttle between the first wafer plant area (Inter OHS 1) wafer case (FOUP) is placed on the second suspension type apparatus for temporary storage (OHB 2) and goes up (step S61), directly take this wafer case (FOUP) (step S62) away by the suspension type transfer cart (Intra OHT 2) of the second wafer on-site then from this second suspension type apparatus for temporary storage (OHB 2).
Though the present invention discloses as above with preferred embodiment; yet it is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention is with being as the criterion that claims were defined.
Claims (8)
1. the processing method of a common storage position, it is applicable to that the wafer case between the first wafer factory and the second wafer factory transmits, wherein, this first wafer factory comprises the suspension type shuttle between at least one first wafer plant area, the suspension type transfer cart and the first suspension type apparatus for temporary storage of the first wafer on-site, this second wafer factory comprises the suspension type shuttle between at least one second wafer plant area, the suspension type transfer cart and the second suspension type apparatus for temporary storage of the second wafer on-site, and this processing method comprises the following steps:
Suspension type transfer cart by this first wafer on-site is obtained wafer case;
This wafer case is placed on this first suspension type apparatus for temporary storage; And
This wafer case is taken away on this first suspension type apparatus for temporary storage by the suspension type shuttle between this first wafer plant area.
2. the processing method of a common storage position, it is applicable to that the wafer case between the first wafer factory and the second wafer factory transmits, wherein, this first wafer factory comprises the suspension type shuttle between at least one first wafer plant area, the suspension type transfer cart and the first suspension type apparatus for temporary storage of the first wafer on-site, this second wafer factory comprises the suspension type shuttle between at least one second wafer plant area, the suspension type transfer cart and the second suspension type apparatus for temporary storage of the second wafer on-site, and this processing method comprises the following steps:
Obtain wafer case by the suspension type shuttle between this second wafer plant area;
This wafer case is placed on this second suspension type apparatus for temporary storage; And
Suspension type transfer cart by this second wafer on-site is taken this wafer case away on this second suspension type apparatus for temporary storage.
3. the processing method of a common storage position, it is applicable to that the wafer case between the first wafer factory and the second wafer factory transmits, wherein, this first wafer factory comprises the suspension type shuttle between at least one first wafer plant area, the suspension type transfer cart and the first suspension type apparatus for temporary storage of the first wafer on-site, this second wafer factory comprises the suspension type shuttle between at least one second wafer plant area, the suspension type transfer cart and the second suspension type apparatus for temporary storage of the second wafer on-site, and this processing method comprises the following steps:
By the suspension type shuttle between this first wafer plant area wafer case is placed on this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage; And
Directly take this wafer case away by the suspension type shuttle between this second wafer plant area from this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage.
4. the processing method of a common storage position, it is applicable to that the wafer case between the first wafer factory and the second wafer factory transmits, wherein, this first wafer factory comprises the suspension type shuttle between at least one first wafer plant area, the suspension type transfer cart and the first suspension type apparatus for temporary storage of the first wafer on-site, this second wafer factory comprises the suspension type shuttle between at least one second wafer plant area, the suspension type transfer cart and the second suspension type apparatus for temporary storage of the second wafer on-site, and this processing method comprises the following steps:
By the suspension type shuttle between this first wafer plant area wafer case is placed on this second suspension type apparatus for temporary storage; And
Suspension type transfer cart by this second wafer on-site is directly taken this wafer case away from this second suspension type apparatus for temporary storage.
5. the treatment system of a common storage position comprises:
The first suspension type apparatus for temporary storage;
The suspension type transfer cart of the first wafer on-site, it is in order to obtaining wafer case, and this wafer case is placed on this first suspension type apparatus for temporary storage; And
Suspension type shuttle between the first wafer plant area, it is in order on this first suspension type apparatus for temporary storage to take this wafer case away certainly.
6. the treatment system of a common storage position comprises:
The second suspension type apparatus for temporary storage;
Suspension type shuttle between the second wafer plant area, it is in order to obtaining wafer case, and this wafer case is placed on this second suspension type apparatus for temporary storage; And
The suspension type transfer cart of the second wafer on-site, it is in order on this second suspension type apparatus for temporary storage to take this wafer case away certainly.
7. the treatment system of a common storage position comprises:
The first suspension type apparatus for temporary storage;
The second suspension type apparatus for temporary storage;
Suspension type shuttle between the first wafer plant area, it is in order to be placed on wafer case on this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage; And
Suspension type shuttle between the second wafer plant area, it is in order to directly to take this wafer case away from this first suspension type apparatus for temporary storage or this second suspension type apparatus for temporary storage.
8. the treatment system of a common storage position comprises:
The second suspension type apparatus for temporary storage;
Suspension type shuttle between the first wafer plant area, it is in order to be placed on wafer case on this second suspension type apparatus for temporary storage; And
The suspension type transfer cart of the second wafer on-site, it is in order to directly to take this wafer case away from this second suspension type apparatus for temporary storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100047417A CN101236887A (en) | 2007-01-30 | 2007-01-30 | Processing system and method for common storage position in semiconductor manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100047417A CN101236887A (en) | 2007-01-30 | 2007-01-30 | Processing system and method for common storage position in semiconductor manufacturing |
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| Publication Number | Publication Date |
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| CN101236887A true CN101236887A (en) | 2008-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2007100047417A Pending CN101236887A (en) | 2007-01-30 | 2007-01-30 | Processing system and method for common storage position in semiconductor manufacturing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105984687A (en) * | 2015-03-16 | 2016-10-05 | 株式会社大福 | Apparatus for storing and handling article at ceiling |
| TWI556344B (en) * | 2011-03-17 | 2016-11-01 | 大福股份有限公司 | Article transport facility |
| CN111746992A (en) * | 2019-07-05 | 2020-10-09 | 北京京东乾石科技有限公司 | AGV-based automatic warehouse goods storage position determination method and device |
-
2007
- 2007-01-30 CN CNA2007100047417A patent/CN101236887A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI556344B (en) * | 2011-03-17 | 2016-11-01 | 大福股份有限公司 | Article transport facility |
| CN105984687A (en) * | 2015-03-16 | 2016-10-05 | 株式会社大福 | Apparatus for storing and handling article at ceiling |
| CN105984687B (en) * | 2015-03-16 | 2019-03-22 | 株式会社大福 | The device of article is stored and processed on the ceiling |
| CN111746992A (en) * | 2019-07-05 | 2020-10-09 | 北京京东乾石科技有限公司 | AGV-based automatic warehouse goods storage position determination method and device |
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