CN101219259A - Application of chip integration LED in photon burn treatment and photon burn treating equipment - Google Patents
Application of chip integration LED in photon burn treatment and photon burn treating equipment Download PDFInfo
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- CN101219259A CN101219259A CNA2007100506668A CN200710050666A CN101219259A CN 101219259 A CN101219259 A CN 101219259A CN A2007100506668 A CNA2007100506668 A CN A2007100506668A CN 200710050666 A CN200710050666 A CN 200710050666A CN 101219259 A CN101219259 A CN 101219259A
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Abstract
The invention provides an application of a chip integrated LED in photon burn wound and a photon burn wound therapy equipment that employs the chip integrated LED. The burn wound comprises burn wound, scald, electric burn, chemical burn, cold injury, etc. In the same way, the invention also can be applied in dermatology department, cosmetic department and chirurgery. The therapy equipment comprises an irradiation head of the chip integrated LED, an adjustable system and a console. The invention can be widely applied in the treatment of patients with large burn area and various chemical burn wound. Radiation area is more that 200cm<2> and light power intensity is more than 40mW/cm<2>. The invention has high power, good heat elimination and convenient and flexible use and solves the conflict between large area and high light power intensity.
Description
Technical field
The present invention relates to the application of multi-chip integrated high-power LED (this paper abbreviates chip assembly LED as) in photon therapy, and with the photon burn treating equipment of chip assembly LED as monochromater.
Background technology
Hospital mainly contains electric filament lamp, silicon carbide rod silk and TDP audiofrequency spectrometer in the light treatment means of clinical use at present.Chinese patent 94117516.2 provides a kind of equipment that filters out the red light treatment burn from halogen tungsten lamp.Its shortcoming is impure from the filtering HONGGUANG of bulb, and contains non-treatment spectrum composition, as infrared ray and a small amount of ultraviolet.Above-mentioned spectrum is without special filtration treatment, and infrared ray can produce heat and cause the dry and cracked dehydration of skin surface cell dead.Another shortcoming is the contradiction that can not solve large tracts of land and big optical power density.(optical power density is defined as the luminous power on the unit are, the mW/cm of unit
2).This equipment can enlarge irradiated area by increasing irradiation distance, but the optical power density of skin surface reduces greatly, does not reach the minimum threshold values of the required optical power density of treatment, and large-area burns are not had therapeutic effect.Also have the laser burn therapy equipment in addition, also there is the problem that can not solve large-area burns in laser equipment.
Patent ZL200520129964.2, described red light treatment device, shortcoming is that employed LED power is little, general power is 6W～12W, and causes the shell heating easily, does not solve the contradiction of irradiated area and optical power density.Patent ZL200620042286.0, described optical dynamic therapy unit is the skin cancer treatment head that cooperates photosensitizer drug to use.It is less demanding to optical power density, and a kind of solution of large area light emitting diode array heat radiation only is provided, and does not solve the problem of big optical power density under the large tracts of land, can't use in the burn field, and this scheme is inapplicable.Chinese patent 02147643.8, described red light treatment device is to adopt low power LED equally, it has added a layer printed circuit board between diode end liner and radiator.Its heat-conducting effect is very poor, does not solve heat dissipation problem.Patent ZL200520108617.1, described blue-light treatment device is single low power LED, permutation and combination becomes the one side battle array, i.e. simple combination, though general power can reach 15W, its optical power density only is 2mw/cm
2, can't be applicable to large-area burns.But its structure and method all are not suitable for the burn treating of large tracts of land and big optical power density.Patent ZL200620110797.1, described LED shaven head is a plurality of low power LED arrays, has the low problem of optical power density equally.Other similar above-mentioned patents all have similar shortcoming and problem, especially are not suitable for burn and use.Its structure and method all are not suitable for the burn treating of large tracts of land and big optical power density.Patent CN2589003Y, described photon therapy device, light source are that 30-100W halogen tungsten lamp and patent CN1121435A have similar defective.Patent CN184352A, this patent and CN200939298Y, CN1795944A have identical defective, can not be used for burn treating.
In sum, traditional light emitting diode (LED:Light Emitting Diode) can be used for dermatosis such as acne, acne erythematosa etc., cooperates the PDT skin cancer treatment of photo-dynamical medicine, but all can not be used for large-area burns.Reason is that single power of light emitting diode of traditional sense all reaches optical power density (40mW/cm can not be in large tracts of land below the 3W time
2) threshold values, do not have the large-area burns therapeutical effect.Light emitting diode can not increase but the power on the unit are is optical power density by multiple assembled arrangement such as matrix, hexagonal array enlarged-area, does not solve the contradiction of large tracts of land and big optical power density yet.Large tracts of land and high-power problem own solve easily, but the contradiction between large tracts of land and the big optical power density does not all have to solve.And on the treatment large-area burns theory of medicine large tracts of land and big optical power density (〉=40mW/cm must to be arranged simultaneously
2) use simultaneously and just can reach due therapeutic effect.
Chip assembly LED (single power＞25w) now come out, little because of its volume, optical power density is big, shadow surface is big, will be the luminaire of new generation that replaces common LED and electric filament lamp, halogen tungsten lamp, and occur some illuminations with relevant patent.Up to the present, the application on people all are confined to throw light on to the understanding of chip assembly LED, be called the 4th generation semiconductor illuminating light source.But do not expect applying it in the light treatment field, especially it is used in photon burn treating.
Summary of the invention
The present invention is the defective that overcomes above prior art, in conjunction with the characteristics of chip assembly LED, provides the application of chip assembly LED in photon burn treating, and a kind of photon burn treating equipment that adopts chip assembly LED is provided.
The technical solution used in the present invention is as follows:
The application of chip assembly LED in photon burn treating.
Burn of the present invention explains it is burn, scald, electric burn, chemical injury, cold injury etc. according to routine.
The same application mode of the present invention also can be used in department of dermatologry, beauty treatment section, surgery, and indication comprises:
Department of dermatologry: herpes zoster, alopecia areata, eczema etc.;
Beauty treatment section: chloasma, acne etc.;
Surgery: postoperative infection, arthritis, union of fracture etc.
Be the contradiction between high power density and large tracts of land in the solution burn treating, the present invention has used chip assembly LED.The LED of chip assembly LED and traditional sense is essentially different.Chip assembly LED is to utilize multicore sheet assembling (Multi-Chip Module Assembly) technology and face-down bonding technique (Flip-Chip Technology) that more than one led chip, signal controlling chip and antistatic chip (Electrostatic Discharge) is integrated and assemble by technology, forms a big LED module of can antistatic, can control.Wherein led chip can be a different wave length, the led chip of different size.As required, upside-down mounting is in different size, and difformity above the base plate of unlike material, has been omitted complicated packaging technology, and the heat dissipation problem of disposable solution LED satisfies the requirement of big optical power density simultaneously.And traditional LED is for satisfying powerful requirement, just must concentrate the luminous energy of many LED can reach designing requirement, but that shortcoming is an equipment volume is big, complex circuit, it is not smooth to dispel the heat, for the current-voltage correlation power supply circuits between each LED of balance very complicated.
Its structure of chip assembly LED and packing forms are more, mainly contain to adopt chip on board directly-mounting type (COB) LED encapsulation and system in package formula (Sip) LED encapsulation.COB is the english abbreviation of Chip on Board.Be mainly used in the LED encapsulation of high-power chip array, improved package power density greatly, reduced packaging thermal resistance.Sip is the abbreviation of Sytem in Package.It is good to have processing compatibility, the integrated level height, and cost is low, is easy to the piecemeal test.Adopt the power of the multi-chip integrated LED of above technology can accomplish 25W～1500W at present, light-emitting area is 5 * 5mm
2～50 * 50mm
2
Chip assembly LED and traditional LED have following some main distinction: 1, power is big, and single power of chip assembly LED is between 25W～1500W, and traditional LED is between 0.5w～3w.2, plane or convex surface are luminous, and the chip assembly LED light-emitting area is 5 * 5mm
2～150 * 150mm
2Plane or convex surface light-emitting area, traditional LED is a point light source light-emitting.3, electro-optical efficiency height, the light output efficiency of chip assembly LED are about 20 ± 2%, and the light output efficiency of traditional LED is about 10%.4, high optical power density, chip assembly LED is because the integrated level high power is big, and the several times that its Output optical power density is traditional LED are to tens of times.
The technical solution adopted in the present invention is to adopt and includes the irradiation head that chip assembly LED is made, and regulates the adjustable system and the control station of lifting and horizontal range.Described irradiation head also comprises LED front end and the reflection shield of being concentrated by treatment body glazed thread except that adopting chip assembly LED, prevent the heat abstractor that the LED heat production is too high, and described heat abstractor includes radiator and forces refrigerative radiator fan; Described control station includes cabinet panel, and power supply, information processing system and temperature inductor, optical power detector also are installed in the cabinet.But panel touch display screen displays temperature, power density, time etc. are arranged on the cabinet, and described information processing system is by single-chip microcomputer (or computer) keyboard, display and patient administration system who is correlated with and therapeutic scheme etc.
The chip assembly LED that the present invention uses is flat luminous, and its power is 25w～1500w, and light-emitting area is 5 * 5mm
2～150 * 150mm
2, wavelength is preferably elected 630nm ± 20nm as, also can adopt the wavelength of 670nm ± 20nm.For solving the radiator problem of chip assembly LED, this new invention is lined with heat-conducting cream between LED end liner and radiator, to reduce the influence to radiating effect of chip assembly LED end liner and radiator intermediate air poor thermal conductivity.Radiator area is much larger than chip assembly LED end liner area.And on radiator, drive the ventilation slot that communicates up and down, not only ventilation can be solved but also area of dissipation can be enlarged.Usually fluting can be emitting shape or mesh shape on the radiator.The heat of chip assembly LED makes in the shell aperture of its heat by the irradiation head periphery by radiator fan, radiator and discharges.
The material of described radiator is the material of high thermal conductivities such as copper, aluminum, aluminium alloy.
Chip assembly LED front end reflection shield of the present invention is shaped as divergent shape taper or cylindricality.Can be circular cone, side's awl, cylinder, square column, prism etc.Its material selection copper, aluminium alloy also plate high reflecting material, and also optional plastics, ferrum, copper close, rubber etc. plates high reflecting material and make reflection shield.
Chip assembly LED irradiation head up-down adjustment of the present invention can be manual, but also electric up-down.Its electric up-down switch is positioned on the control panel, also can use foot switch control certainly, and its horizontal adjustment is a lever arm free to rotate, be designed to can free bend to regulate the horizontal range of irradiation head and control station.Irradiation head is positioned on before the lever arm that horizontal adjustment freely rotates on the end support, and can adjust irradiating angle, to satisfy the needs of different irradiated sites.
Irradiated area＞200cm that the present invention converges through reflection shield
2The time its human body surface optical power density＞40mw/cm
2Can use expansion taper reflection shield angle for enlarging irradiated area, or use the chip assembly LED combination more than 1, guarantee optical power density＞40mw/cm simultaneously
2This combination is simple and convenient.A plurality of chip assembly LEDs also can change a plurality of chip assembly LEDs same reflection shield altogether into when making up, and enlarge radiator area, equally also can reach requirement.For guaranteeing the operate as normal of chip assembly LED, be provided with a temperature inductor that detects the LED temperature in the fixture.After temperature surpasses setting value, alarm can transmit messages alert signal and shutdown on the control station.
The skin surface optical power detector is arranged among the present invention, can regulate luminous power output size according to the state of an illness, its adjusting can manually also can be regulated automatically.
The present invention has solved the irradiated area and the problem of optical power density greatly greatly in burn treating owing to adopted chip assembly LED, makes the treatment of burn patients become possibility.
For further setting forth relative section of the present invention, be described further below in conjunction with accompanying drawing.
Description of drawings
Fig. 1, be the cutaway view of irradiation head internal structure sketch map of the present invention;
Fig. 2, be the vertical view of the irradiation head structural representation of Fig. 1 of the present invention;
Fig. 3, be irradiation head LED of the present invention and circular radiator mounting structure sketch map;
Fig. 4, be irradiation head LED of the present invention and square heat spreader structures sketch map;
Fig. 5, be population structure sketch map of the present invention;
Fig. 6, be electric power system theory diagram of the present invention.
The specific embodiment
As Fig. 1, shown in Figure 2, the present invention includes irradiation head and control station and constitute.Be lined with heat-conducting cream 2 under irradiation head chips integrated LED 1 end liner, and tightly be fixed on the radiator 3,4 of radiator fan is fixed on the radiator 3.Reflection shield 5 usefulness screws are fixed on the radiator 3, and reflection shield is identical at the square catercorner length of the diameter of LED end opening and chip assembly LED 1, allows chip assembly LED just be included in the reflection shield.Radiator 3 is fixed on the shell 6.Air vent 7 is arranged around the shell.Have air vent and power line inlet at shell 6 rear portions.It is 24V that power supply provides the constant current source of chip assembly LED 1.It is 630nm ± 20nm that chip assembly LED 1 adopts wavelength, and single power is between 25W～500W.
Fig. 3 is the mounting structure sketch map of radiator 2 and chip assembly LED 1.Fig. 3 is the radial fluting of circular radiator, and is open-minded up and down.It is close as far as possible to slot, to enlarge the area of dissipation of radiator.The shape of radiator also can be designed as rectangle, and square, ellipse, Fig. 4 are a kind of square wherein.Use an above chip assembly LED integrated package to be combined into required chip assembly LED for enlarging irradiated area.As becoming square, rectangular or oval through simple combination, also can be fixed on a plurality of chip assembly LEDs on the bigger radiator with the structure of a plurality of Fig. 3 or Fig. 4.
Fig. 5 is overall complete machine structure sketch map.8 is elevating lever.Change the height of irradiation head 6 by the control lifting.But 9 is the lever arm of horizontal curvature and rotation, and 14 and 15 is rotating interface.Can make irradiation head 6 in 360 degree rotations.14 the rotation scalable irradiation head 6 and the distance of control station are to satisfy the needs of different patient's irradiated sites.13 is the fixed support of irradiation head 6 and horizontal anomalous movement arm 9.11 is the height of foot switch scalable irradiation head 6.16 is control station bottom universal wheel.10 is cabinet, in power supply, jacking system, information processing system are housed.12 is the panel touch display screen, but displays temperature, and optical power density, also can show case-management and therapeutic scheme simultaneously at the time.17 is hidden type keyboard, is used for the input of patient and therapeutic scheme.
Fig. 6 is electric theory diagram, comprises control unit, irradiation head, single-chip microcomputer/computer, display (comprising temperature demonstration, optical power density demonstration, time showing and patient information and therapeutic scheme), power supply.
Treatment has obvious curative effects to burn patient to use power of the present invention and be the therapy equipment of 100W chip assembly LED.Particularly shone through 10 times 20 minutes in II ° of fresh wound surface, its effective percentage reaches 100%; III ° of infective wound surface irradiation in 15 times 30 minutes effective percentage reaches 95%, especially deep burn patient (as electric burn) very fast elimination after irradiation is infected and the quick wound healing that promotes, avoids skin grafting, reduces patient's misery and expense.
It is flat luminous using chip assembly LED especially, and its power is 25w ~ 1500w, and light-emitting area is 5 * 5mm
2～150 * 150mm
2, wavelength is elected the blue light of 420nm ± 20nm as, uses the optical dynamic therapy principle, can be used for treatments such as skin acne.Wavelength is elected the light absorption peak value coupling of gold-tinted and the blood vessel of 590nm ± 20nm as, and safe and effective microcirculation improvement under no heat effect effect is regulated cytoactive, can effectively improve because caused dermatosis problem of years.
The present invention has that power is big, good heat dissipation, treatment irradiated area are big, use flexibly, advantages of simple operation.Particularly solved the contradiction between large tracts of land and big optical power density.
Description of the present invention is a preferred embodiment of the present invention.All technical staff in the art are according to design of the present invention, and on the basis of existing technology by logical analysis, reasoning or the limited available technical scheme of experiment all should be in claim protection domains of the present invention.
Claims (10)
1. the application of chip assembly LED in photon burn treating.
2. the application of chip assembly LED according to claim 1 in photon burn treating, it is characterized in that: burn of the present invention comprises medically alleged burn, scald, electric burn, chemical injury, cold injury.
3. the application of chip assembly LED in department of dermatologry, beauty treatment section, surgery, indication comprises:
Department of dermatologry: herpes zoster, alopecia areata, eczema;
Beauty treatment section: chloasma, acne;
Surgery: postoperative infection, arthritis, union of fracture.
4. chip assembly LED photon burn treating equipment, comprise irradiation head, regulate the adjustable system and the control station of adjustable height and horizontal range, it is characterized in that: irradiation head is the chip assembly LED irradiation head, comprise chip assembly LED, substrate, reflection shield, heat abstractor, chip assembly LED is fixed on the radiator by its substrate, and reflection shield is installed in the chip assembly LED outer end.
5. chip assembly LED photon burn treating equipment according to claim 1 is characterized in that: described adjustable system comprises elevating lever, horizontal anomalous movement arm, rotate connect, the fixed support foot switch; Described control station includes cabinet, panel touch display screen, and power supply, information processing system are installed in the cabinet, temperature inductor, optical power detector; Described information processing system includes single-chip microcomputer or computer, keyboard and display.
6. chip assembly LED photon burn treating equipment according to claim 4 is characterized in that: described chip assembly LED is flat luminous, and light-emitting area is 5 * 5mm
2--150 * 150mm
2, power is between 25W～1500W, and wavelength is 630nm ± 20nm or 670nm ± 20nm HONGGUANG, or wavelength is the blue light of 420nm ± 20nm and the gold-tinted of 590nm ± 20nm.
7. chip assembly LED photon burn treating equipment according to claim 4 is characterized in that: be lined with heat-conducting cream between described chip assembly LED substrate and the radiator.
8. according to claim 4 or 7 described chip assembly LED photon burn treating equipments, it is characterized in that: described heat abstractor comprises radiator and radiator fan, and its radiator area is greater than the chip assembly LED Substrate Area; Have the emitting shape that communicates up and down or netted ventilation and heat groove on the radiator; Radiator is made with high conductivity material copper, aluminum, aluminium alloy.
9. chip assembly LED photon burn treating equipment according to claim 4, it is characterized in that: described reflection shield is made with high reflecting material, reflectorized material is aluminium alloy, plastics, ferrum, copper, rubber or steel, it is shaped as the divergent shape taper, and the cross section is circular, square, polygon or ellipse.
10. chip assembly LED photon burn treating equipment according to claim 4 is characterized in that: the lifting of chip assembly LED irradiation head is manual or electronic; Electric up-down is controlled with hand control or with foot switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100506668A CN101219259A (en) | 2007-11-30 | 2007-11-30 | Application of chip integration LED in photon burn treatment and photon burn treating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100506668A CN101219259A (en) | 2007-11-30 | 2007-11-30 | Application of chip integration LED in photon burn treatment and photon burn treating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN101219259A true CN101219259A (en) | 2008-07-16 |
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|---|---|---|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103405855A (en) * | 2013-08-29 | 2013-11-27 | 湖南泰启信息科技开发有限公司 | Miniature optical energy instrument for facial care |
| CN108888872A (en) * | 2018-06-07 | 2018-11-27 | 深圳鑫洲林科技有限公司 | A kind of periosteum rehabilitation illumination apparatus |
-
2007
- 2007-11-30 CN CNA2007100506668A patent/CN101219259A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103405855A (en) * | 2013-08-29 | 2013-11-27 | 湖南泰启信息科技开发有限公司 | Miniature optical energy instrument for facial care |
| CN108888872A (en) * | 2018-06-07 | 2018-11-27 | 深圳鑫洲林科技有限公司 | A kind of periosteum rehabilitation illumination apparatus |
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