CN101213657A - Epoxy bleedout-preventing agent - Google Patents

Epoxy bleedout-preventing agent Download PDF

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Publication number
CN101213657A
CN101213657A CNA2007800000508A CN200780000050A CN101213657A CN 101213657 A CN101213657 A CN 101213657A CN A2007800000508 A CNA2007800000508 A CN A2007800000508A CN 200780000050 A CN200780000050 A CN 200780000050A CN 101213657 A CN101213657 A CN 101213657A
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CN
China
Prior art keywords
epoxy resin
prevents
reagent
oozing out
wiring substrate
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Granted
Application number
CNA2007800000508A
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Chinese (zh)
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CN100546018C (en
Inventor
相场玲宏
中村久
三村智晴
土田克之
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JX Nippon Mining and Metals Corp
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Nippon Mining and Metals Co Ltd
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Publication of CN101213657A publication Critical patent/CN101213657A/en
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
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    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
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  • Epoxy Resins (AREA)

Abstract

Disclosed is an epoxy bleedout-preventing agent which has no adverse effect on die bonding strength and assembly characteristics and does not deteriorate effects of coloration preventing treatment and sealing even when a low-stress die bonding resin is used. Specifically disclosed is an epoxy bleedout-preventing agent for die bonding processes, which is characterized by containing a fluorine-containing organic compound having a fluorohydrocarbon group CxHyFz-(wherein x = 3-24, y = 0-48, z = 1-49, and y + z = 2x + 1) having 3-24 carbon atoms and a polar group R-.

Description

Prevent the reagent that epoxy resin oozes out
Technical field
The present invention relates to a kind ofly in chip join (die bonding) the technology semiconductor wires base material of lead frame, printed wiring board etc. and IC chip adhesive is fixing with epoxy resin, prevent the reagent that epoxy resin oozes out and prevent the method that epoxy resin oozes out.
Background technology
In the chip join technology of the semiconductor wires base material and the IC chip adhesive of lead frame, printed wiring board etc. being fixed with epoxy resin, if the surface roughness of adhesive surface (having implemented the plating of gold, silver, copper, palladium etc. usually) is excessive or surperficial by the organic pollutants of anti-blushing agent, sealing of hole inorganic agent etc., then when epoxy resin coating, resin or additive can ooze out (epoxy resin oozes out).Oozing out of this epoxy resin can reduce chip join intensity, becomes the bad reason of wire-bonded (wirebonding) technology thereafter.At present, ooze out in order to prevent such epoxy resin, the surface roughness that reduce adhesive surface is with the inhibition capillarity, or washing surface is to remove pollutant.But, therefore can not reduce surface roughness owing to the surface roughness affect chip join intensity of adhesive surface, the recognition capability of mounting equipment without exception.In addition, therefore surface washing also has problems because variable color processing, sealing of hole treatment effect are prevented in infringement.
In order to address the above problem, as as described in the patent documentation 1, by being impregnated into base material with carboxylic acid, mercaptan etc. is in the solution of main component, making its absorption thickness is 1 organic envelope to about the several molecule, thereby anti-variable color tunicle is peeled off in the surface roughness or the washing that can not change substrate surface, sealing of hole is handled tunicle, in addition because the organic envelope of absorption is extremely thin, so the assembling characteristic (assembly characteristics) to wire-bonded performance, molding performance etc. does not have adverse effect, can prevent that epoxy resin from oozing out.
But, along with the maximization of nearest semiconductor chip, the slimming of semiconductor package body, for problem of improving warpage etc., the use of low stress, low elasticity, low viscous chip join resin (hereinafter referred to as the chip join resin of low stress type) is more and more, because it is more that these resins contain the situation of the composition that easily oozes out, its result causes easy initial ring epoxy resins to be oozed out.The technology of above-mentioned patent documentation 1 can not be tackled the situation of the chip join resin that uses the low stress type, understands oozing out of initial ring epoxy resins.Therefore wish the reagent that epoxy resin oozes out that prevents of a kind of chip join resin of also tackling the low stress type of exploitation.
Patent documentation 1: the spy opens flat 11-195662 communique
Summary of the invention
The object of the present invention is to provide a kind of reagent that prevents that epoxy resin from oozing out, it is in the chip join technology of the semiconductor wires base material and the IC chip adhesive of lead frame, printed wiring board etc. being fixed with epoxy resin, even under the situation of the chip join resin of the low stress type of stating in the use, chip join intensity, assembling characteristic there is not adverse effect yet, and do not damage anti-variable color processing, sealing of hole treatment effect, can prevent the generation that epoxy resin oozes out.
Present inventors further investigate, found that one group of organic compound, it is by being impregnated into base material in the solution that contains the reagent that prevents that epoxy resin from oozing out, organic envelope is adsorbed on prevent on the surface of coating face in the process that epoxy resin oozes out, compare with existing product, even to the chip join resin of low stress type, also has the better anti-effect of oozing out.That is, found to ooze out the higher compound of effect, thereby finished the present invention than the epoxy resin that prevents of the described carboxylic acid of above-mentioned document, mercaptan compound etc.
The present invention is as described below.
(1) a kind ofly prevent the reagent that epoxy resin oozes out in chip join technology, it is characterized in that, contain fluorinated organic compound, it is 3～24 fluorocarbon based C that this fluorinated organic compound has carbon number xH yF z-(x=3～24, y=0～48, z=1～49, y+z≤2x+1) and polar group R-.
As above-mentioned (1) the described reagent that prevents that epoxy resin from oozing out, it is characterized in that (2) polar group R-is any the polar group that contains in sulphur (S), nitrogen (N), phosphorus (P), the oxygen (O).
As above-mentioned (2) the described reagent that prevents that epoxy resin from oozing out, it is characterized in that (3) polar group R-is any in sulfydryl, amino, nitrogen heterocycle, phosphate-based, the carboxyl.
(4) as above-mentioned (3) the described reagent that prevents that epoxy resin from oozing out, it is characterized in that, nitrogen heterocycle be imidazole radicals, triazolyl, tetrazole radical, and their derivative in any.
(5) as each described reagent that prevents that epoxy resin from oozing out of above-mentioned (1)～(4), it is characterized in that, contain anti-blushing agent or sealing of hole inorganic agent.
(6) as above-mentioned (5) the described reagent that prevents that epoxy resin from oozing out, it is characterized in that anti-blushing agent contains nitrogen-containing heterocycle compound.
As above-mentioned (6) the described reagent that prevents that epoxy resin from oozing out, it is characterized in that (7) nitrogen-containing heterocycle compound is any in imdazole derivatives, triazole derivative, terazole derivatives, the thiazole.
(8) a kind of method that prevents that epoxy resin from oozing out, it is characterized in that, wiring substrate is impregnated in the described solution that prevents the reagent that epoxy resin oozes out of each that contain above-mentioned (1)～(7), perhaps will contains this solution that prevents the reagent that epoxy resin oozes out and scatter and be applied on the wiring substrate.
(9) a kind of wiring substrate, it is characterized in that, by wiring substrate being impregnated in the described solution that prevents the reagent that epoxy resin oozes out of each that contain above-mentioned (1)～(7), perhaps will contain this solution that prevents the reagent that epoxy resin oozes out and scatter and be applied on the wiring substrate, and implement the processing that prevents that epoxy resin from oozing out.
(10) a kind of wiring substrate is characterized in that, each described reagent that prevents that epoxy resin from oozing out of above-mentioned (1)～(7) is arranged in surface adsorption.
(11) a kind of semiconductor package body is characterized in that, has used above-mentioned (9) or (10) described wiring substrate.
The invention effect
The application of the invention prevent the reagent that epoxy resin oozes out, make have prevent organic compound that epoxy resin oozes out function be adsorbed on the semiconductor wires substrate surface of lead frame, printed wiring board etc., prevent the processing that epoxy resin oozes out, even feasible chip join resin to the low stress type, also anti-color changeable effect, sealing of hole treatment effect can be do not damaged, the oozing out of epoxy resin in the chip join technology can be prevented.In addition, the assembling characteristic to wire-bonded characteristic, molded feature etc. does not have adverse effect yet.
Description of drawings
Fig. 1 is the figure of the assay method of the anti-epoxy resin that the is illustrated in embodiment epoxy resin seepage discharge when oozing out performance evaluation.
Embodiment
The reagent that prevents that epoxy resin from oozing out of the present invention contains fluorinated organic compound, and it is 3～24 fluorocarbon based C that this fluorinated organic compound has carbon number xH yF z-(x=3～24, y=0～48, z=1～49, y+z≤2x+1) and polar group R-.
As above-mentioned fluorocarbon based, can list fluoroalkyl, contain two keys the fluorine alkenyl, contain the fluorine alkynyl group of triple bond etc., be preferably fluoroalkyl.In addition, if the carbon number of these fluorocarbon based fluorocarbon based integral body is 3～24, then can be the straight chain shape, also can have side chain.The carbon number x of fluorocarbon based is 3～24, is preferably 5～12 especially.If carbon number is very few, then prevent the weak effect that epoxy resin oozes out, if too much, molding performance (adhesiveness of moulding resin) is reduced.In addition, number of fluorine atoms z is many more, prevents that the effect that epoxy resin oozes out is high more, thereby but under the situation of the many molecular chain lengths of carbon number, if number of fluorine atoms is too much, then also can cause the reduction of molding performance sometimes, thereby number of fluorine atoms z is preferably 11～25.
As above-mentioned fluorocarbon based, can preferably use F (CF 2) 6-, F (CF 2) 8-, F (CF 2) 10-, F (CF 2) 6(CH 2) 2-, F (CF 2) 8(CH 2) 2-, F (CF 2) 10(CH 2) 2-etc.
In addition, as above-mentioned polar group R-, can preferably use any the polar group that contains in sulphur (S), nitrogen (N), phosphorus (P), the oxygen (O), any in sulfydryl, amino, nitrogen heterocycle, phosphate-based, the carboxyl for example, as nitrogen heterocycle, can preferably use imidazole radicals for example, triazolyl, tetrazole radical, and their derivative.
When being phosphate-based, (OP (O) (OH) can to use monoesters at above-mentioned polar group 2), diester ((O) 2P (O) is (OH)), three esters ((O) 3P (O)).
There are isomers in imidazole radicals, triazolyl, tetrazole radical about as nitrogen heterocycle, but can use any isomers in the present invention, also can use its mixture in addition.On synthetic convenience, the compound that the nitrogen of nitrogenous cyclic compound directly combines with fluorocarbon based obtains easily, can preferably use.In addition, as the derivative of imidazole radicals, triazolyl, tetrazole radical, can list the derivative that has alkyl, phenyl etc. as substituting group.
Therefore, prevent preferred fluorinated organic compound in the reagent that epoxy resin oozes out as of the present invention, if represent above-mentioned fluorocarbon based C with A- xH yF z-, then can list for example A-SH, A-NH 2, A-OP (O) (OH) 2, (A-O) 2P (O) (OH), (A-O) 3P (O), A-COOH, A-N 2C 3H 3(1-imidazole radicals), A-N 3C 2H 2(1,2,3-triazoles-1-yl), A-N 4CH (1-tetrazole radical) etc.
The reagent that prevents that epoxy resin from oozing out of the present invention is, it is dissolved in the solvent of water, organic solvent etc., in case the form of the solution of the reagent that the stop ring epoxy resins is oozed out is used.The concentration of the above-mentioned organic compound in the above-mentioned solution that prevents the reagent that epoxy resin oozes out is 0.1mg/L～100g/L, is preferably 10mg/L～10g/L.
If the concentration of above-mentioned organic compound is low excessively, then there is not the effect that prevents that epoxy resin from oozing out, in addition, and if excessive concentration then because effect is saturated, can not obtain better effect, thus not preferred.
When water during as solvent, be insoluble at above-mentioned organic compound under the situation of water, as required, add organic solvents such as alcohol, ketone.Addition can be to make the water-soluble necessary concentration of above-mentioned organic compound, but is generally 0.1g/L～200g/L, is preferably 1g/L～50g/L.If addition is very few, then dissolubility is low, in addition, if too much, then not only can not change the solute effect of above-mentioned organic compound, and the concentration of above-mentioned organic compound is rare excessively, thereby also not preferred.
And then, when above-mentioned organic compound is difficult to be dissolved in water, add 1 μ g/L～10g/L as required, any of the surfactant that anion system, cation system, the nonionic that is preferably 10 μ g/L～1g/L is or their mixture.
In addition,, add 0.1g/L～200g/L as required, the pH buffer that phosphoric acid system, boric acid system, the organic acid that is preferably 1～50g/L is preventing that epoxy resin from oozing out in the solution of reagent.If addition is low excessively, then the pH buffering effect is low, if too much, then because effect is saturated, the therefore interpolation is unhelpful more.
In addition,, as required, add 0.1g/L～200g/L, be preferably amine system, the amino carboxylic acid system of 1g/L～50g/L, the complexing agent of carboxylic acid system as the metal shadowing agent preventing that epoxy resin from oozing out in the solution of reagent and have under the situation of metal stripping.If addition is low excessively, then that metal complex, the effect of sheltering is little, if too much, then because effect is saturated, the therefore interpolation is unhelpful more.
To preventing that the pH that epoxy resin oozes out the solution of reagent from there is no need to limit especially, but be generally between pH1～14, preferably between pH2～12, handle.If depart from this scope, then the infringement to material is big, prevents the weak effect that epoxy resin oozes out.
In addition, prevent that epoxy resin from oozing out the temperature of the solution of reagent, can in the temperature range that can carry out with the aqueous solution, be generally 5～90 ℃, be preferably 10～60 ℃.If temperature is low excessively, then prevent the weak effect that epoxy resin oozes out, if too high, then effect is saturated, and is unfavorable for operation, improves temperature and is no advantage.
When with organic solvent during,, can list the ketone of the alcohol, acetone, methylethylketone etc. of methyl alcohol, ethanol, isopropyl alcohol etc. as organic solvent as solvent.The temperature that epoxy resin oozes out the solution of reagent that prevents in the time of with an organic solvent is preferably room temperature.
And then, be more than 0.1 second below 300 seconds with preventing that epoxy resin from oozing out time that the solution of reagent handles, can suitably adjust according to effect, consider the reappearance and the efficient of operation, be preferably more than 1 second below 120 seconds.If too short, then prevent the weak effect that epoxy resin oozes out, and the reappearance of operation is low, if long, then effect is saturated, and operating efficiency reduces.
In addition, prevent the method that epoxy resin oozes out, can be wiring substrate to be impregnated into prevent that epoxy resin from oozing out in the solution of reagent, to prevent perhaps that solution that epoxy resin oozes out reagent from spreading on the base material by spray, spraying etc. or by spin coater etc. be applied on the base material or the like contact after, washing, drying.
In addition, also contain anti-blushing agent, the sealing of hole inorganic agent of the metal surface of plating epithelium, metal material etc. when making the above-mentioned fluorinated organic compound that prevents to contain in the reagent that epoxy resin oozes out as main component, can give anti-color changeable effect, sealing of hole treatment effect and the anti-effect of oozing out simultaneously.
As this anti-blushing agent or sealing of hole inorganic agent, can use known reagent respectively.For example, as anti-blushing agent, preferably use the nitrogen-containing heterocycle compound of imdazole derivatives, triazole derivative, terazole derivatives, thiazole etc.
By carrying out the processing that prevents that epoxy resin from oozing out as described above, above-mentioned fluorinated organic compound is adsorbed on the coating face on wiring substrate surface, forms thickness and be 1 the tunicle that contains fluorinated organic compound to about the several molecule.Therefore, can increase the contact angle of coating face and epoxy resin, suppress oozing out of epoxy resin.In addition, because the tunicle of the fluorinated organic compound of absorption is extremely thin, therefore there is not adverse effect for assembling performances such as wire-bonded performance, molding performances.Do not damage anti-color changeable effect, sealing of hole treatment effect in addition yet.Adopt the wiring substrate of the processing that said method implemented to prevent that epoxy resin from oozing out and used the semiconductor package body of this wiring substrate to be also included among the present invention.
Embodiment
Based on embodiment the present invention is described below, but the present invention is not limited to these embodiment.
Embodiment 1～10
On the lead frame base material of copper alloy (Cu:97.7%-Sn:2.0%-Ni:0.2%-P:0.03%) system, carry out copper striking plating as substrate, to improve adhesiveness, on whole of lead frame, carry out in gold-plated, silver-plated, the copper facing any then.Then, carry out the processing that epoxy resin oozes out that prevents as described in Table 1 by dipping.
In addition, the polar group-N that prevents the reagent that epoxy resin oozes out that uses among the embodiment 8,9,10 2C 3H 3,-N 3C 2H 2,-N 4CH is respectively 1-imidazole radicals, 1,2,3-triazoles-1-base, 1-tetrazole radical.
These base materials are carried out chip join, estimate anti-epoxy resin exudative (anti-EBO), wire-bonded performance (W/B), molding performance and discoloration-resistant.The result is as shown in table 1.In the table 1, [-] expression of bathing in forming is not added, and [-] expression in the evaluation is not an evaluation object.
Carry out the exudative evaluation of anti-epoxy resin according to the methods below.
With the commercially available epoxy resin that is used for the low stress chip join (ェ ィ Block Le ボ Application De 8340, ェ ィ Block Le ス テ ィ ッ Network society system), with syringe be applied to through prevent agent treatment that epoxy resin oozes out the coating face on, in atmosphere, adopt electric hot plate to heat 30 minutes down to solidify then at 175 ℃, then, observe the epoxy resin coating part with metallurgical microscopes (100 times).The chip join of measuring is as shown in Figure 1 oozed out (among Fig. 1 with visible epoxy resin around the epoxy resin, chip join is represented with the black circle of used for epoxy resin, should black circumference enclose the narrow part representative ring epoxy resins of the light slightly width of color and ooze out portion) in the zone, epoxy resin oozes out the seepage discharge (EBO amount) of the most serious part, estimates as described below.
Zero: less than 10 μ m
△: more than the 10 μ m, less than 100 μ m
*: more than the 100 μ m
Carry out the evaluation of wire-bonded performance according to the methods below.
Adopt the spun gold of 25 μ m, by and carry out wire-bonded with hyperacoustic thermo-compressed mode (temperature: 200 ℃, load: 50g, time: 10 milliseconds), pull with tensile testing machine mensuration and draw intensity, estimate as described below.
Zero: more than the 10gf
*: less than 10gf
Carry out the evaluation of molding performance in accordance with the following methods.
With the commercially available epoxy resin that is used for molding (ベ one Network ラ ィ ト in Sumitomo makes EME-6300) be applied to through prevent agent treatment that epoxy resin oozes out surfacing on after, heat 5 hours down to solidify at 175 ℃, measure shear strength then, estimate as described below.
Zero: 10kgf/cm 2More than
*: less than 10kgf/cm 2
Prevent the evaluation of color changeable effect according to following method.
After 96 hours, observe outward appearance at 40 ℃, 90% time humidification of humidity, estimate as described below.
Zero: no variable color
*: variable color is arranged
Comparative example 1
Use carboxylic acid as principal component, implement the agent treatment that epoxy resin oozes out that prevents as described in Table 1, in addition, prevent the agent treatment that epoxy resin oozes out similarly to Example 1, estimate similarly to Example 1.The result is as shown in table 1.
Comparative example 2
Use the described substrate of table 1, do not prevent the agent treatment that epoxy resin oozes out, in addition, operate similarly to Example 1, estimate similarly to Example 1.The result is as shown in table 1.
In addition, among the present invention the expression number range " more than ", " following " include given figure.
Figure A20078000005000121
Figure A20078000005000141

Claims (11)

1. one kind prevents the reagent that epoxy resin oozes out in chip join technology, it is characterized in that, contains fluorinated organic compound, and it is 3～24 fluorocarbon based C that this fluorinated organic compound has carbon number xH yF z-and polar group R-, wherein x=3～24, y=0～48, z=1～49, y+z≤2x+1.
2. the reagent that prevents that epoxy resin from oozing out as claimed in claim 1 is characterized in that, described polar group R-is any the polar group that contains among sulphur (S), nitrogen (N), phosphorus (P), the oxygen (O).
3. the reagent that prevents that epoxy resin from oozing out as claimed in claim 2 is characterized in that, described polar group R-is any in sulfydryl, amino, nitrogen heterocycle, phosphate-based, the carboxyl.
4. the reagent that prevents that epoxy resin from oozing out as claimed in claim 3 is characterized in that, described nitrogen heterocycle be imidazole radicals, triazolyl, tetrazole radical, and their derivative among any.
5. as each described reagent that prevents that epoxy resin from oozing out of claim 1～4, it is characterized in that, contain anti-blushing agent or sealing of hole inorganic agent.
6. the reagent that prevents that epoxy resin from oozing out as claimed in claim 5 is characterized in that anti-blushing agent contains nitrogen-containing heterocycle compound.
7. the reagent that prevents that epoxy resin from oozing out as claimed in claim 6 is characterized in that, nitrogen-containing heterocycle compound is any in imdazole derivatives, triazole derivative, terazole derivatives, the thiazole.
8. method that prevents that epoxy resin from oozing out, it is characterized in that, wiring substrate is impregnated in the described solution that prevents the reagent that epoxy resin oozes out of each that contain claim 1～7, perhaps will contains this solution that prevents the reagent that epoxy resin oozes out and scatter and be applied on the wiring substrate.
9. wiring substrate, it is characterized in that, by wiring substrate being impregnated in the described solution that prevents the reagent that epoxy resin oozes out of each that contain claim 1～7, perhaps will contain this solution that prevents the reagent that epoxy resin oozes out and scatter and be applied on the wiring substrate, and implement the processing that prevents that epoxy resin from oozing out.
10. a wiring substrate is characterized in that, is adsorbed with each described reagent that prevents that epoxy resin from oozing out of claim 1～7 from the teeth outwards.
11. a semiconductor package body is characterized in that, has used claim 9 or 10 described wiring substrates.
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