CN101209604A - Stainless steel products and preparation thereof - Google Patents

Stainless steel products and preparation thereof Download PDF

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Publication number
CN101209604A
CN101209604A CNA2006101726020A CN200610172602A CN101209604A CN 101209604 A CN101209604 A CN 101209604A CN A2006101726020 A CNA2006101726020 A CN A2006101726020A CN 200610172602 A CN200610172602 A CN 200610172602A CN 101209604 A CN101209604 A CN 101209604A
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stainless steel
nonferrous metal
intermediate layer
power supply
target
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CN101209604B (en
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李清明
钟源
宫清
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Jiangsu Lesiyuan New Energy Technology Co ltd
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BYD Co Ltd
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Abstract

The invention relates to a stainless steel product, including a stainless steel base material and a film arranged on the surface of the stainless steel base material, wherein, the film comprises a bottom layer, an intermediate layer and a surface layer. The bottom layer is made of stainless steel, and the intermediate layer is an alloy combined by stainless steel and non-iron metal, and the surface layer is made of carbide or nitride of the alloy combined by stainless steel and non-iron metal. The invention also provides a manufacturing method of the stainless steel product. The stainless steel product of the invention has high surface smoothness and hardness, and better wearing-resistance capability.

Description

A kind of stainless steel products and preparation method thereof
Technical field
The invention relates to a kind of stainless steel products and preparation method thereof.
Background technology
Stainless steel products is applied to manufacturing industry and electronic enterprises more and more, and stainless steel products generally comprises stainless steel substrate and is positioned at the ganoine thin film on stainless steel substrate surface, and the kind of ganoine thin film mainly contains titanium carbide, titanium nitride, chromium nitride.The preparation method of ganoine thin film mainly contains two kinds of physical vaporous deposition and chemical vapour deposition techniques, and physical vaporous deposition comprises arc ion plating and magnetic controlled sputtering ion plating.
The ganoine thin film that adopts arc ion plating to form has high hardness and good abrasion resistance and decay resistance, and still, the surface smoothness of this type of ganoine thin film is relatively poor, is mainly used in less demanding cutter of surface smoothness and instrument etc.Present stage, stainless steel as the base material of electronic product and electronic product components, forms ganoine thin film if adopt arc ions to be plated in the stainless steel substrate surface more and more widely, does not then satisfy the requirement to outward appearance.So, people propose to adopt the method for magnetic controlled sputtering ion plating to form ganoine thin film on the stainless steel substrate surface, the surface smoothness of this ganoine thin film is higher, can reach the appearance requirement of electronic product, but, the hardness of existing magnetic controlled sputtering ion plating ganoine thin film is not high, so the wearability of stainless steel products is relatively poor.
In sum, existing stainless steel products can not have high surface smoothness, hardness and anti-wear performance simultaneously.
Summary of the invention
The objective of the invention is to have the shortcoming of high surface smoothness, hardness and anti-wear performance simultaneously, good stainless steel products of a kind of surface smoothness and hardness height and wearability and preparation method thereof is provided in order to overcome existing stainless steel products.
The invention provides a kind of stainless steel products, this stainless steel products comprises stainless steel substrate and is positioned at the film on stainless steel substrate surface, wherein, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
The present invention also provides the preparation method of described stainless steel products, this method is included under the sputtering condition, make the target material sputter of magnetic control target and be deposited on and form film on the stainless steel substrate applying power supply on the magnetic control target, wherein, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, and the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
The ganoine thin film of stainless steel products provided by the invention comprises the stainless steel bottom, the carbide of the alloy intermediate layer of stainless steel and nonferrous metal and the alloy of stainless steel and nonferrous metal or nitride surface layer, the material of stainless steel substrate and bottom is identical, adhesion between the two is fine, stress is less, bottom has with the intermediate layer and contains identical composition stainless steel, adhesion between the two is also fine, stress is less, the intermediate layer has identical alloying component with surface layer, adhesion between the two is also fine, stress is less, between each of film layer and the stress between film and the stainless steel substrate obtained alleviation, therefore the adhesion between described film and the stainless steel substrate is good, the hardness height, wearability is good.In addition, the ganoine thin film of stainless steel products of the present invention adopts the magnetic controlled sputtering ion plating method to form, so the surface smoothness height.Therefore, the surface smoothness of stainless steel products of the present invention and hardness height and wearability are good.
The specific embodiment
Stainless steel products provided by the invention comprises stainless steel substrate and is positioned at the film on stainless steel substrate surface, wherein, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
The thickness of described bottom can be the 0.1-0.8 micron, is preferably the 0.3-0.6 micron; The thickness in described intermediate layer can be the 0.1-0.8 micron, is preferably the 0.3-0.6 micron; The thickness of described surface layer can be the 2-7 micron, is preferably the 3-6 micron.
In the intermediate layer, described nonferrous metal can contain any metal that is applicable to the magnetic controlled sputtering ion plating method, is preferably in copper, nickel, chromium, aluminium and the titanium one or more, more preferably chromium and/or titanium.
In surface layer, described nonferrous metal can contain any metal that is applicable to the magnetic controlled sputtering ion plating method, is preferably in copper, nickel, chromium, aluminium and the titanium one or more, more preferably chromium and/or titanium.
Under the preferable case, the kind of contained nonferrous metal is identical in intermediate layer and the surface layer, can further alleviate the stress between intermediate layer and the surface layer like this, improves the adhesion between the two, and improves the hardness of ganoine thin film.
The preparation method of the stainless steel products that the present invention also provides is included under the sputtering condition, make the target material sputter of magnetic control target and be deposited on and form film on the stainless steel substrate applying power supply on the magnetic control target, wherein, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
Described sputtering condition can be the sputtering condition of routine, and for example sputtering condition comprises that pressure (absolute pressure) is the 0.1-1.0 handkerchief, is preferably the 0.3-0.8 handkerchief, and temperature is 20-200 ℃, is preferably 50-100 ℃.
Described power supply can be preferably intermediate frequency power supply for the existing various power supplys that are used for magnetic controlled sputtering ion plating, and the frequency of intermediate frequency power supply is generally the 10-150 kilohertz, is preferably the 10-100 kilohertz.The power of described power supply can be 8-20 kilowatt, is preferably 12-18 kilowatt.
Magnetic controlled sputtering ion plating method of the present invention can be used existing various magnetic controlled sputtering ion plating equipment, and magnetic controlled sputtering ion plating equipment can be commercially available.Described magnetic controlled sputtering ion plating equipment comprises vacuum chamber, heater, goes up part frame and magnetic control target, and heater, work rest and magnetic control target are arranged in vacuum chamber.
The structure of described magnetic control target has been conventionally known to one of skill in the art, and for example, magnetic control target can comprise target stand and target, and target is installed on the target stand.Described target stand is a magnet, and described magnet can be existing various magnets, for example, can be in ferromagnet, the neodymium iron boron magnetic body one or more.Described magnetic control target is preferably target structure, can use one or more pairs of magnetic control targets; Every pair of magnetic control target is powered by a power supply, and two magnetic control targets extremely link to each other with one of power supply separately, and insulate mutually with whole vacuum chamber.
Described target contains target material, can select the kind of target material according to the composition of rete.
When forming bottom, described target material is a stainless steel.Sputtering time is 2-15 minute, is preferably 5-10 minute.
When forming the intermediate layer, described target material is stainless steel and nonferrous metal.By adjusting the power be applied to the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target respectively, the weight ratio that makes stainless steel and nonferrous metal in the alloy of the stainless steel of formation and nonferrous metal is within required scope.Generally speaking, the ratio that is applied to the power of the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target can be 1.1-1.6, is preferably 1.2-1.4; Sputtering time can be 2-15 minute, is preferably the 5-10 clock.
When forming surface layer, described target material is stainless steel and nonferrous metal.By adjusting the power be applied to the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target respectively, the weight ratio that makes stainless steel and nonferrous metal in the carbide of alloy of the stainless steel of formation and nonferrous metal or the nitride is within required scope.For example, the ratio that is applied to the power of the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target can be 1.1-1.6, is preferably 1.2-1.4.Sputtering time can be 60-240 minute, is preferably 80-200 minute.
Described stainless steel substrate can rotate with the revolution form in vacuum chamber, and rotating speed is 0.5-10 revolutions per second, is preferably 2.0-6.0 revolutions per second.
When forming bottom and intermediate layer, described sputtering under the inert gas atmosphere carried out.Described inert gas for example can be helium and/or argon gas for not participating in the gas of sputter reaction; As long as the pressure the when consumption of described inert gas makes sputter reaches the 0.1-1.5 handkerchief.Can vacuumize earlier, make the absolute pressure in the magnetic controlled sputtering ion plating equipment reach 2 * 10 -3Handkerchief to 6 * 10 -3In the scope of handkerchief, and then charge into inert gas, make the absolute pressure in the magnetic controlled sputtering ion plating equipment reach the 0.1-1.5 handkerchief.
When forming surface layer, described sputtering under nitrogen or the gaseous hydrocarbon atmosphere carried out.Described gaseous hydrocarbon has been conventionally known to one of skill in the art, can be saturated hydrocarbons and/or the unsaturated hydrocarbons of 1-4 for carbon number, the example of gaseous hydrocarbon includes but not limited to methane, ethane, propane, normal butane, iso-butane, ethene, propylene, butylene and isomers thereof, butadiene, acetylene, propine, butine and isomers thereof.The consumption of described nitrogen or gaseous hydrocarbon can be preferably 20-500sccm, more preferably 50-300sccm for 10-800 standard ml/min (sccm).
In order in sputter procedure, the film that forms to be cleaned, improve adhesion of thin film, can on base material, apply grid bias power supply, the bias voltage of grid bias power supply can lie prostrate for 50-2000, is preferably the 100-1500 volt; Dutycycle is 15-90%, is preferably 30-80%.
Before carrying out sputter, can also clean magnetic control target.The method that magnetic control target is cleaned has been conventionally known to one of skill in the art, for example, can magnetic control target be cleaned by apply power supply on magnetic control target under the pressure of 0.5-1.5 handkerchief, the frequency of this power supply can be the 10-150 kilohertz, is preferably the 10-100 kilohertz; The power of this power supply can be 1-100 kilowatt, is preferably 2-60 kilowatt.Wherein, the step that magnetic control target is cleaned can be carried out in described magnetic controlled sputtering ion plating equipment.
Below by embodiment the present invention is described in more detail.
Embodiment 1
This embodiment is used to illustrate stainless steel products provided by the invention and preparation method thereof.
Adopt magnetic controlled sputtering ion plating equipment (magnetron sputtering ion plating machine, Beijing Beiyi Innovation Vacuum Technology Co., Ltd. makes, model is JP-700), this magnetic controlled sputtering ion plating equipment comprises vacuum chamber, heater, work rest, magnetic control target and biasing device, and heater, work rest and magnetic control target are arranged in vacuum chamber.Magnetic control target is to target structure, comprises a pair of chromium target and a pair of stainless steel target.Distance between two targets of a pair of chromium target is 18 centimetres, and two targets link to each other with the both positive and negative polarity that a frequency is 40 kilo hertzs a power supply; Distance between two targets of stainless steel target is 18 centimetres, and two targets and another frequency are that the both positive and negative polarity of 40 kilo hertzs power supply links to each other.Stainless steel substrate is fixed on the work rest, and stainless steel substrate equates with distance between two targets of a pair of target between to target.Biasing device is a grid bias power supply, and the positive pole of grid bias power supply links to each other with the housing of vacuum chamber, and negative pole links to each other with work rest.
Pressure in the vacuum chamber is transferred to 0.5 handkerchief, temperature transfers to 150 ℃, start stainless steel target (promptly opening the power supply that is connected with the stainless steel target) and carry out magnetic controlled sputtering ion plating, the power of the power supply that is connected with the stainless steel target is 15 kilowatts, open described grid bias power supply simultaneously, the bias voltage of grid bias power supply is 200 volts, and dutycycle is 55%, the rotating speed of work rest is 2 rev/mins, forms stainless steel coating on stainless steel substrate.
After 6 minutes, start chromium target (promptly opening the power supply that is connected with the chromium target), the power of the power supply that is connected with the chromium target is 12 kilowatts, forms the alloy layer of stainless steel and chromium on above-mentioned stainless steel coating.
After 10 minutes, feed acetylene gas, the initial content of acetylene gas is 50sccm, the acetylene gas flow is incremented to 100sccm in 15 minutes, bias voltage and dutycycle with described grid bias power supply is adjusted into 120 volts and 30% respectively simultaneously, forms the carbide coating of the alloy of stainless steel and chromium on the alloy layer of above-mentioned stainless steel and chromium.
After 100 minutes, close stainless steel target, chromium target, grid bias power supply and stop to feed acetylene gas, when naturally cooling to 80 ℃, take out stainless steel products, form the carbide surface layer that thickness is respectively the alloy of the alloy intermediate layer of stainless steel bottom, stainless steel and chromium of 0.5 micron, 0.5 micron and 4 microns and stainless steel and chromium successively on the stainless steel substrate surface, note is stainless steel products A1.
Embodiment 2
This embodiment is used to illustrate stainless steel products provided by the invention and preparation method thereof.
Adopt magnetic controlled sputtering ion plating equipment (magnetron sputtering ion plating machine, Beijing Beiyi Innovation Vacuum Technology Co., Ltd. makes, model is JP-700), this magnetic controlled sputtering ion plating equipment comprises vacuum chamber, heater, work rest, magnetic control target and biasing device, and heater, work rest and magnetic control target are arranged in vacuum chamber.Magnetic control target is to target structure, comprises a pair of titanium target and a pair of stainless steel target.Distance between two targets of a pair of titanium target is 18 centimetres, and two targets link to each other with the both positive and negative polarity that a frequency is 40 kilo hertzs a power supply; Distance between two targets of stainless steel target is 18 centimetres, and two targets and another frequency are that the both positive and negative polarity of 40 kilo hertzs power supply links to each other.Stainless steel substrate is fixed on the work rest, and stainless steel substrate equates with distance between two targets of a pair of target between to target.Biasing device is a grid bias power supply, and the positive pole of grid bias power supply links to each other with the housing of vacuum chamber, and negative pole links to each other with work rest.
Pressure in the vacuum chamber is transferred to 0.5 handkerchief, temperature transfers to 150 ℃, start stainless steel target (promptly opening the power supply that is connected with the stainless steel target) and carry out magnetic controlled sputtering ion plating, the power of the power supply that is connected with the stainless steel target is 12 kilowatts, open described grid bias power supply simultaneously, the bias voltage of grid bias power supply is 200 volts, and dutycycle is 55%, the rotating speed of work rest is 2 rev/mins, forms stainless steel coating on stainless steel substrate.
After 10 minutes, start titanium target (promptly opening the power supply that is connected with the titanium target), the power of the power supply that is connected with the titanium target is 8 kilowatts, forms the alloy layer of stainless steel and titanium on above-mentioned stainless steel coating.
After 15 minutes, feed nitrogen, the flow of nitrogen is 50sccm, and bias voltage and the dutycycle with described grid bias power supply is adjusted into 120 volts and 30% respectively simultaneously, forms the nitride coating of the alloy of stainless steel and titanium on the alloy layer of above-mentioned stainless steel and titanium.
After 200 minutes, close stainless steel target, titanium target, grid bias power supply and stop to feed acetylene gas, when naturally cooling to 80 ℃, take out stainless steel products, form the nitride surface layer that thickness is respectively the alloy of the alloy intermediate layer of stainless steel bottom, stainless steel and titanium of 0.5 micron, 0.5 micron and 6 microns and stainless steel and titanium successively on the stainless steel substrate surface, note is stainless steel products A2.
Embodiment 3 and 4
Embodiment 3 and 4 is used to measure the performance of the stainless steel products that embodiment 1 and 2 makes.
Use following method to measure surface smoothness, wearability and the hardness of stainless steel products A1 and A2.
Surface smoothness: adopt roughness tester to test.Scriber with instrument moves a segment distance at surface of the work, and the waveform of scriber being walked out by the computer processor that is connected with scriber amplifies and measures its crest and trough spacing, the surface roughness Ra value of reading workpiece by dial gauge, i.e. surface smoothness.The Ra value is more little, and the surface roughness of workpiece is more little, and surface smoothness is good more.
Wearability is measured: the stainless steel work-piece that respectively surface that obtains among the embodiment 1-2 is formed with rete is put into oscillating mill continuous shaking and is ground after 2 hours and take out product, and whether the rete of observing the corner angle of workpiece and surface (being non-property at parts of edges and corners) has comes off.
Hardness is measured: adopt micro Vickers to test, utilize the standard of instruments pressure head and add little load, be pressed into 1/3rd of thicknesses of layers, impression is measured, calculate the hardness of rete by MICROCOMPUTER PROCESSING.
Measurement result is as shown in table 1.
Table 1
The embodiment numbering Embodiment 3 Embodiment 4
The stainless steel products numbering A1 A2
Surface roughness (Ra) 0.06 0.08
Wearability Goods corner angle and surface are without any coming off The goods corner angle have slightly and come off, and the surface does not come off
Hardness (HV) 1200 1050
From the test result shown in the table 1 as can be seen, the Ra value of stainless steel products A1 and A2 all is lower than 0.1, and wearability is very good, and hardness all is higher than 1000HV, illustrates that the surface smoothness of stainless steel products provided by the invention and hardness height and wearability are good.

Claims (10)

1. stainless steel products, this stainless steel products comprises stainless steel substrate and is positioned at the film on stainless steel substrate surface, it is characterized in that, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
2. goods according to claim 1, wherein, the thickness of described bottom is the 0.1-0.8 micron, and the thickness in described intermediate layer is the 0.1-0.8 micron, and the thickness of described surface layer is the 2-7 micron.
3. goods according to claim 1, wherein, in the intermediate layer, described nonferrous metal is one or more in copper, nickel, chromium, aluminium and the titanium.
4. goods according to claim 1, wherein, in surface layer, described nonferrous metal is one or more in copper, nickel, chromium, aluminium and the titanium.
5. goods according to claim 1, wherein, the kind of the nonferrous metal in the nonferrous metal in the intermediate layer and the surface layer is identical.
6. the preparation method of a stainless steel products, this method is included under the sputtering condition, make the target material sputter of magnetic control target and be deposited on and form film on the stainless steel substrate applying power supply on the magnetic control target, it is characterized in that, described film comprises bottom, intermediate layer and surface layer, described bottom is a stainless steel, and the intermediate layer is the alloy of stainless steel and nonferrous metal, and surface layer is the carbide or the nitride of the alloy of stainless steel and nonferrous metal.
7. method according to claim 6, wherein, described sputtering condition comprises that pressure is the 0.1-1.0 handkerchief, and temperature is 20-200 ℃, and the power of power supply is 8-20 kilowatt.
8. method according to claim 7, wherein, when forming bottom, described sputtering condition comprises that also described sputtering under the inert gas atmosphere carry out, and described target material is a stainless steel, and sputtering time is 2-15 minute.
9. method according to claim 7, wherein, when forming the intermediate layer, described sputtering condition comprises that also described sputtering under the inert gas atmosphere carry out, described target material is stainless steel and nonferrous metal, described nonferrous metal is one or more in copper, nickel, chromium, aluminium and the titanium, and the ratio that is applied to the power of the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target is 1.1-1.6, and sputtering time is 2-15 minute.
10. method according to claim 7, wherein, when forming surface layer, described sputtering condition comprises that also described sputtering under nitrogen or the gaseous hydrocarbon atmosphere carry out, described target material is stainless steel and nonferrous metal, described nonferrous metal is one or more in copper, nickel, chromium, aluminium and the titanium, and the ratio that is applied to the power of the power supply on stainless steel magnetic control target and the nonferrous metal magnetic control target is 1.1-1.6, and sputtering time is 60-240 minute.
CN2006101726020A 2006-12-30 2006-12-30 Stainless steel products and preparation thereof Expired - Fee Related CN101209604B (en)

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