CN101209554A - Semiconductor special-purpose equipment wafer grabbing device - Google Patents
Semiconductor special-purpose equipment wafer grabbing device Download PDFInfo
- Publication number
- CN101209554A CN101209554A CNA2007102033813A CN200710203381A CN101209554A CN 101209554 A CN101209554 A CN 101209554A CN A2007102033813 A CNA2007102033813 A CN A2007102033813A CN 200710203381 A CN200710203381 A CN 200710203381A CN 101209554 A CN101209554 A CN 101209554A
- Authority
- CN
- China
- Prior art keywords
- wafer
- fork
- grabbing device
- plate
- gripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a wafer gripping device which is the equipment specially used for semiconductor, comprising a wafer gripping plate and a vacuum system which is connected with the wafer gripping plate. The wafer gripping plate is a thin-piece shaped integration structure which is bonded by three layers: a gripping panel, a mainbody core plate and a sealing cover plate; the mainbody core plate is provided with a through trough; the gripping panel is provided with a wafer adsorption hole which is correspondingly communicated with the through trough; the position of the sealing cover plate corresponding to the through trough is provided with a vacuum interface. The wafer gripping plate is a fork-shape or claw-shape; the vacuum interface is arranged on a fork handle or a fork handle; wherein, at least two wafer adsorption holes are arranged on a fork tooth or a claw tooth respectively; at least one wafer adsorption hole is arranged on the common boundary position between the fork tooth or claw tooth and the fork handle or claw handle. The device has low requirement to the surface smoothness of an object article to be gripped, reduces manufacture difficulty, has the advantages of simple structure, convenient application, low cost and energy saving, and can be widely applied to the gripping operation of wafer in the equipment specially used for a semiconductor.
Description
(1) technical field
The present invention relates to a kind of target pick-up device, particularly a kind of device of automatic extracting semiconductor wafer.
(2) background technology.
The automatic transmission that realization takes, puts wafer and wafer automatically is the prerequisite of the full-automatic processing of semiconductor manufacturing equipment.Wafer is a kind of disk of thin and fragile, is placed in the special-purpose film magazine in full-automatic semiconductor manufacturing equipment production.Distance in the film magazine between wafer and the wafer is 4 millimeters of less thaies usually, for finishing the action of automatic clamping and placing sheet, need a kind of have certain rigidity and thin wafer grabbing device.In modern production equipment, common has the target pick-up device: clipping, electromagnetic adsorption type, vacuum cup absorption type etc.Wherein clipping target pick-up device causes wafer damage easily, and electromagnetic adsorption type target pick-up device and vacuum adsorption type target pick-up apparatus structure are comparatively complicated, and the part processing difficulty is big; Traditional vacuum adsorption type target pick-up device comprises the vacuum system that wafer grasps plate and is attached thereto, its wafer grasps the big face absorption wafer of plate by whole adsorption plate, like this, not only waste energy, and to grasping having relatively high expectations of object surface smoothness, the difficulty of processing of each part is bigger, also has restive problem.
(3) summary of the invention
The purpose of this invention is to provide a kind of semiconductor special-purpose equipment wafer grabbing device, solve wafer and be difficult to grasp, cause the problem of wafer damage easily, and solve traditional wafer grabbing device complex structure, to grasping bigger, the restive technical problem of difficulty of processing of the having relatively high expectations of object surface smoothness, each part.
For achieving the above object, solution of the present invention is:
This semiconductor special-purpose equipment wafer grabbing device, comprise the vacuum system that wafer grasps plate and is attached thereto, it is characterized in that: wafer grasps plate by grasping panel 1, main body central layer 2 and 3 three layers of bonding flakiness shape overall structure of seal cover board, on main body central layer 2, have connectivity slot 5, grasping the wafer adsorption hole 4 that has on the panel 1 with above-mentioned connectivity slot 5 corresponding connections, having a vacuum interface 6 corresponding to the position of connectivity slot 5 at seal cover board 3.
Above-mentioned wafer adsorption hole 4 has three at least, is polygon and distributes on the extracting panel.
The shape of above-mentioned wafer adsorption hole 4 can be circle, ellipse or polygon.
The shape that above-mentioned wafer grasps plate can be fork-shaped or claw type, includes fork handle or latch spoon 8 and at least two prongs or cat's paw 7.
Above-mentioned vacuum interface 6 is positioned on fork handle or the latch spoon 8, and wherein at least two wafer adsorption holes 4 are each positioned on a prong or the cat's paw 7, and at least one wafer adsorption hole 4 is positioned at the position, boundary of prong or cat's paw 7 and fork handle or latch spoon 8.
Compared with prior art the present invention has following characteristics and beneficial effect:
The present invention provides a kind of have certain rigidity and thin wafer grabbing device for semiconductor manufacturing equipment.Solved the problem that wafer is difficult to grasp, cause easily wafer damage.Wafer grabbing device is to grasping the less demanding of object surface smoothness, and the difficulty of processing of each part is little, and is easy to grasp control.After adopting above-mentioned semiconductor special-purpose equipment wafer grabbing device, because its three layers of bonding structures have improved whole rigidity, make this device reduce manufacture difficulty, have simple in structure, it is convenient to use, with low cost, the characteristics of saving energy consumption can be widely used in the extracting transhipment of wafer in the semiconductor manufacturing equipment.
(4) description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention;
Fig. 2 is a decomposition texture schematic diagram of the present invention.
Reference numeral: 1-grasps panel, 2-main body central layer, 3-seal cover board, 4-wafer adsorption hole, 5-connectivity slot, 6-vacuum interface, 7-prong or cat's paw, 8-fork handle or latch spoon.
(5) specific embodiment
Embodiment is referring to shown in Fig. 1,2, this semiconductor special-purpose equipment wafer grabbing device, comprise the vacuum system that wafer grasps plate and is attached thereto, its wafer grasps plate by grasping panel 1, main body central layer 2 and 3 three layers of bonding flakiness shape overall structure of seal cover board, on main body central layer 2, have connectivity slot 5, grasping the wafer adsorption hole 4 that has on the panel 1 with above-mentioned connectivity slot 5 corresponding connections, having a vacuum interface 6 corresponding to the position of connectivity slot 5 at seal cover board 3.Connectivity slot 5 corresponding connections in the connectivity slot 5 corresponding connections on wafer adsorption hole 4 on the above-mentioned extracting panel and the main body central layer, the vacuum interface 6 on the capping plate and main body central layer.Connectivity slot 5 is a Y shape.
Above-mentioned wafer adsorption hole 4 has three, is grasping distribution triangular in shape on the panel.The shape of wafer adsorption hole 4 can be circle, ellipse, polygon or abnormity.
That grasps panel 1, main body central layer 2 and seal cover board 3 is shaped as two fork-shapeds or two claw types, includes fork handle or latch spoon 8 and two prongs or cat's paw 7.Above-mentioned vacuum interface 6 is positioned on fork handle or the latch spoon 8, and wherein two wafer adsorption holes 4 are each positioned on a prong or the cat's paw 7, and a wafer adsorption hole 4 is positioned at the position, boundary of prong or cat's paw 7 and fork handle or latch spoon 8.
Claims (5)
1. semiconductor special-purpose equipment wafer grabbing device, comprise the vacuum system that wafer grasps plate and is attached thereto, it is characterized in that: wafer grasps plate by grasping panel (1), main body central layer (2) and (3) three layers of bonding flakiness shape overall structure of seal cover board, on main body central layer (2), have connectivity slot (5), grasping the wafer adsorption hole (4) that has on the panel (1) with the corresponding connection of above-mentioned connectivity slot (5), having a vacuum interface (6) corresponding to the position of connectivity slot (5) at seal cover board (3).
2. semiconductor special-purpose equipment wafer grabbing device according to claim 1 is characterized in that: above-mentioned wafer adsorption hole (4) has three at least, is polygon and distributes on the extracting panel.
3. semiconductor special-purpose equipment wafer grabbing device according to claim 1 and 2 is characterized in that: above-mentioned wafer adsorption hole (4) be shaped as circle, ellipse or polygon.
4. semiconductor special-purpose equipment wafer grabbing device according to claim 3, it is characterized in that: above-mentioned extracting panel (1), main body central layer (2) and seal cover board (3) be shaped as fork-shaped or claw type, include fork handle or latch spoon (8) and at least two prongs or cat's paw (7).
5. semiconductor special-purpose equipment wafer grabbing device according to claim 4, it is characterized in that: above-mentioned vacuum interface (6) is positioned on fork handle or the latch spoon (8), wherein at least two wafer adsorption holes (4) are each positioned on a prong or the cat's paw (7), and at least one wafer adsorption hole (4) is positioned at the position, boundary of prong or cat's paw (7) and fork handle or latch spoon (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007102033813A CN101209554A (en) | 2007-12-25 | 2007-12-25 | Semiconductor special-purpose equipment wafer grabbing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007102033813A CN101209554A (en) | 2007-12-25 | 2007-12-25 | Semiconductor special-purpose equipment wafer grabbing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101209554A true CN101209554A (en) | 2008-07-02 |
Family
ID=39609901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007102033813A Pending CN101209554A (en) | 2007-12-25 | 2007-12-25 | Semiconductor special-purpose equipment wafer grabbing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101209554A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103879747A (en) * | 2014-03-12 | 2014-06-25 | 黟县越驰科技电子有限公司 | Reclaiming device of magnet forming equipment |
| WO2017172646A1 (en) * | 2016-04-01 | 2017-10-05 | Sunpower Corporation | Gripper for semiconductor devices |
| CN107487626A (en) * | 2017-08-11 | 2017-12-19 | 京东方科技集团股份有限公司 | Storing mechanism, method for carrying and the handling system of mask plate |
-
2007
- 2007-12-25 CN CNA2007102033813A patent/CN101209554A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103879747A (en) * | 2014-03-12 | 2014-06-25 | 黟县越驰科技电子有限公司 | Reclaiming device of magnet forming equipment |
| WO2017172646A1 (en) * | 2016-04-01 | 2017-10-05 | Sunpower Corporation | Gripper for semiconductor devices |
| CN107487626A (en) * | 2017-08-11 | 2017-12-19 | 京东方科技集团股份有限公司 | Storing mechanism, method for carrying and the handling system of mask plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5464532B2 (en) | Chip ejector and chip attaching / detaching method using the same | |
| KR101731932B1 (en) | Collet for semiconductor chip pickup | |
| WO2009020051A1 (en) | Securing tool and work processing method | |
| WO2008129976A1 (en) | Method for manufacturing chip with adhesive | |
| CN101209554A (en) | Semiconductor special-purpose equipment wafer grabbing device | |
| WO2012057991A3 (en) | Apparatus and method for testing back-contact solar cells | |
| CN206123690U (en) | Grab table device based on sucking disc is gathered | |
| WO2009076346A3 (en) | Lift pin for substrate processing | |
| CN104552327A (en) | Inferior pot seedling removing and transplanting packaged type clamping end executor | |
| US6341808B1 (en) | Flexible sheet handling apparatus | |
| CN206011104U (en) | A kind of discarded sand paper is separated and collection structure | |
| WO2011138684A3 (en) | Pick and bond method and apparatus for transferring adhesive element to substrate | |
| CN201455993U (en) | Robot arm and wafer transferring disk using same | |
| WO2009011165A1 (en) | Thin board transfer apparatus, thin board processing/transfer system and thin board transfer method | |
| CN203401778U (en) | Laminating tool capable of accurately aligning | |
| JP2012508460A5 (en) | ||
| JP2009160711A (en) | End effector and transfer device equipped with the same | |
| CN204818862U (en) | Sucking disc air jig | |
| CN201708140U (en) | Tool for picking up semi-conductor crystal block | |
| CN207580878U (en) | The high intensity gripping tool of photovoltaic glass | |
| JP6258235B2 (en) | Pickup device | |
| CN207781564U (en) | A kind of silicon dice transfer device | |
| CN204589371U (en) | Epitaxial wafer picture-taking device | |
| CN106956146B (en) | Clamping device | |
| CN109794877A (en) | A kind of earpiece mesh enclosure fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080702 |