Electromagnetic wave shielding element
Technical field
The present invention relates to a kind of electromagnetic wave shielding technology, refer to the electromagnetic wave shielding element of a kind of application apparatus in electronic installation especially.
Background technology
In response to such as the deal with data amount of portable electronic devices such as notebook computer or the expansion demand of operation efficiency, various portable electronic installations all face noise and the Electromagnetic Interference problem in intraware or the electronic component work, in the face of this problem, except the internal interface ground structure was set, modal settling mode was nothing more than being that design prevents the shielding measure that electromagnetic wave (EMI) leaks.
As shown in Figure 1, TaiWan, China is announced No. 528280 utility model patent and is disclosed the interior ground structure that prevents Electromagnetic Interference of a kind of electronic product, with notebook computer 1 is example, main holding wire 13 an outside conductive material 14 and the conductive clips 15 of coating between the electronic component of this notebook computer 1 inside, by this conductive clip 15, the folder in the ground connection source 17 of 14 pairs of these ground structures 16 of this conductive material is established and is contacted, can make this conductive clip 15, this conductive material 14, form a contact action with ground connection source 17, prevent to transmit noise and electromagnetic effect by this holding wire 13 thereby reach.
The display screen 11 and main frame 12 of aforementioned this holding wire in order to connect notebook computer 1, and be electrically connected to main frame 12 in these holding wire 13 ends by a connector 131, the ground connection source 17 that noise that is produced when coating conductive clip 15 that conductive material 14 and folder establish with display screen 11 work by the outside and electromagnetic wave are sent to this ground structure 16.But these ways are except must and installing the conductive clip 15 with artificial coated with conductive material 14, still need in main frame 12, to set up ground connection source 17 such as metallic plate, so not only cause and inconvenience is installed, and need set up ground connection source 17 and cause the shortcoming that cost increases and notebook computer 1 is difficult to slimming with time-consuming.
In addition, mentioning that the form in this ground connection source 17 is replaceable before this patent in the case in addition is the conductive paint of shell application outside this notebook computer 1, though adopt the pattern of conductive paint can solve the problem of notebook computer 1 slimming and the inconvenience of extra assembling, but, because conductive paint is to make with plating or sputtering way, not only the manufacture method cost is very high, and manufacture method is time-consuming, main frame 12 lower casings with notebook computer 1 are that example promptly needs the plating or the sputter time of twenty four hours at least, really be not inconsistent economic benefit, particularly, be difficult to meet demand really at the low price machine of notebook computer.
At present existing insider adopts metal forming or conductive fabric to replace aforesaid conductive paint, though this kind way can provide comparatively economical and install easily, but because metal forming or conductive fabric must carry out structural design according to the allocation position of each assembly of notebook computer inside or electronic component, therefore derive complex structure own and the shortcoming that increases design cost.
Therefore, how effectively solve the shortcoming of above-mentioned prior art, a kind of simple structure, the with low cost and electromagnetic wave shielding element that is easy to assemble are provided, real be the problem that needs solution at present.
Summary of the invention
In view of the shortcoming of the above technology that sets the scene, a purpose of the present invention is promptly providing a kind of electromagnetic wave shielding element of simple structure.
Another object of the present invention provides a kind of electromagnetic wave shielding element with low cost.
A further object of the present invention provides a kind of electromagnetic wave shielding element that is easy to assemble.
For reaching above-mentioned and other purpose, the invention provides a kind of electromagnetic wave shielding element, be preset with in the electronic installation of first joint portion for being fixed in one, and have at least in this electronic installation adjacent to this first joint portion first, second, and the 3rd electronic component, this electromagnetic wave shielding element comprises: conductive body has second joint portion that is bonded to this first joint portion for corresponding; The first elasticity lead foot is located at this conductive body one side, contacts this first electronic component in order to correspondence; The second elasticity lead foot is located at this conductive body side adjacent with this first elasticity lead foot, contacts this second electronic component in order to correspondence; And the 3rd elasticity lead foot, be located at this conductive body side relative with this second elasticity lead foot, contact the 3rd electronic component in order to correspondence.
Aforementioned this first joint portion and second joint portion can be tenon and jack respectively, and preferably, this tenon is the plastic cement tenon, can melt concora crush and fix the corresponding jack outer rim of this conductive body through heat.
This first elasticity lead foot can be the shell fragment that extends from this conductive body one side, and in order to this first electronic component of Elastic Contact, described this first electronic component can be CD-ROM device.This second elasticity lead foot can be the shell fragment that extends from this conductive body side adjacent with this first elasticity lead foot, and in order to this second electronic component of Elastic Contact, described this second electronic component can be Hard Disk Drive.The 3rd elasticity lead foot can be the bent sheet of extending from this conductive body side relative with this second elasticity lead foot, and in order to Elastic Contact the 3rd electronic component, described the 3rd electronic component can be audio-frequency module (Audio Module).
Than prior art, since electromagnetic wave shielding element of the present invention comprise conductive body with first, second, reach the 3rd elasticity lead foot, its structure is simple and can make by metal plate punching technology, so reached simple structure and characteristic with low cost, this conductive body is bonded to this first joint portion by its second joint portion in addition, and this combination can be and fastens or the heat of plasthetics is melted concora crush, and therefore the effect that is easy to assemble also is provided relatively.
Description of drawings
Fig. 1 shows that China announces the structural representation of No. 528280 patent ground structure that case discloses;
Fig. 2 is the example structure figure that shows electromagnetic wave shielding element of the present invention;
Fig. 3 A is the schematic diagram that demonstration electromagnetic wave shielding element application apparatus of the present invention is located at electronic installation; And
Fig. 3 B is the local enlarged diagram of displayed map 3A.
The main element symbol description
1 notebook computer, 11 display screens
12 main frames, 13 holding wires
14 conductive material, 15 conductive clips
16 ground structures, 17 ground connection sources
2 electromagnetic wave shielding elements, 21 conductive body
211 second joint portions, 22 first elasticity lead foots
23 second elasticity lead foots 24 the 3rd elasticity lead foot
241 perforates, 3 electronic installations
31 first electronic components, 32 second electronic components
33 the 3rd electronic components, 331 salient points
34 first joint portions
Embodiment
Below by conjunction with figs. explanation specific embodiments of the invention, so that those skilled in the art can understand technical characterictic of the present invention easily and reach effect.
In following listed embodiment, it is example that electromagnetic wave shielding element is installed in the notebook computer with application, but what must illustrate is, the present invention only can be applicable in the notebook computer, allly having Electromagnetic Interference or the electronic installation of the problem that leaks all belongs to the applicable scope of the present invention, also is that electronic installation of the present invention is taken off the notebook computer shown in the embodiment after absolutely not only and exceeded.
Shown in Fig. 2 and Fig. 3 A, electromagnetic wave shielding element provided by the present invention, be preset with in the electronic installation 3 of first joint portion 34 for being fixed in one, and has first electronic component 31 in this electronic installation 3 at least adjacent to this first joint portion 34, second electronic component 32, and the 3rd electronic component 33, this electromagnetic wave shielding element 2 comprises the conductive body 21 with second joint portion 211, be located at the first elasticity lead foot 22 of these conductive body 21 1 sides, be located at the second elasticity lead foot 23 of this conductive body 21 and these first elasticity lead foot, 22 adjacent sides, and the 3rd elasticity lead foot 24 of being located at the relative side of this conductive body 21 and this second elasticity lead foot 23.
Described this electronic installation 3 is an example with a notebook computer, particularly be applied to for example use in the main frame that is installed on notebook computer, with form with described first electronic component 31, second electronic component 32, and the 3rd electronic component 33 between contact action, thereby reach shielding electromagnetic wave and prevent the effect of Electromagnetic Interference.And described first electronic component 31, second electronic component 32, and the 3rd electronic component 33 for example be respectively CD-ROM device, Hard Disk Drive, and, audio-frequency module (AudioModule), 34 of this first joint portions can be arranged at aforementioned first electronic component 31, second electronic component 32, and wherein on of the 3rd electronic component 33, perhaps be arranged on the supporting construction in the notebook host, generally the structure setting of both having deposited with inside, and be good with the tenon that is protruded out on the plastic cement element.
This conductive body 21 has second joint portion 211 that is bonded to this first joint portion 34 for corresponding.In present embodiment, this conductive body is a metal sheet metal component, and the surface is provided with jack to constitute this second joint portion 211.
This first elasticity lead foot 22 is located at this conductive body 21 1 sides, contacts aforesaid first electronic component 31 in order to correspondence.In present embodiment, this first elasticity lead foot 22 is the shell fragment that extends from these conductive body 21 1 sides, in order to this first electronic component 31 of Elastic Contact, also promptly when carrying out stamping manufacture method by sheet metal process, this conductive body 21 forms in the lump, so have the conductive characteristic that electrically connects and be same as this conductive body 21.
This second elasticity lead foot 23 is located at the adjacent side of this conductive body 21 and this first elasticity lead foot 22, contacts aforesaid second electronic component 32 in order to correspondence.In present embodiment, this second elasticity lead foot 23 is the shell fragment that extends from this conductive body 21 and this first elasticity lead foot 22 adjacent sides, in order to this second electronic component 32 of Elastic Contact, also promptly when carrying out stamping manufacture method by sheet metal process, this conductive body 21 forms equally in the lump, so also have the conductive characteristic that electrically connects and be same as this conductive body 21.
The 3rd elasticity lead foot 24 is located at the relative side of this conductive body 21 and this second elasticity lead foot 23, contacts aforesaid the 3rd electronic component 33 in order to correspondence.In present embodiment, this second elasticity lead foot 23 is the bent sheet of extending from this conductive body 21 and this second elasticity lead foot 23 relative sides, in order to Elastic Contact the 3rd electronic component 33, also promptly when carrying out stamping manufacture method by sheet metal process, this conductive body 21 forms equally in the lump, so also have the conductive characteristic that electrically connects and be same as this conductive body 21, and this for example has a perforate 241 for the 3rd elasticity lead foot 24 ends of bent sheet, and the 3rd electronic component 33 has relative salient point 331 (shown in Fig. 3 B), so that this this salient point 331 of perforate 241 corresponding sockets.
Also see also shown in Fig. 3 A and Fig. 3 B, electromagnetic wave shielding element 2 provided by the present invention is mounted in this electronic installation 3, for example be that second joint portion 211 of jack plugs to this with this for example be first joint portion 34 of plastic cement system tenon, melting the concora crush mode by heat then makes this tenon extend out and flatten to fix this conductive body 21 corresponding jack outer rims, wherein, these first elasticity lead foot, 22 Elastic Contact for example are first electronic component 31 of CD-ROM device to this, particularly for example Elastic Contact to this CD-ROM device on the bracing frame; This for example is second electronic component 32 of Hard Disk Drive for these second elasticity lead foot, 23 Elastic Contact, particularly for example Elastic Contact to the end face of this Hard Disk Drive; This for example is the 3rd electronic component 33 of source of sound module for the 3rd elasticity lead foot 24 Elastic Contact, particularly for example Elastic Contact to the salient point 33 of this source of sound module, so that this this salient point 331 of perforate 241 corresponding sockets.
By this first elasticity lead foot 22, the second elasticity lead foot 23, and the 3rd elasticity lead foot 24 respectively Elastic Contact to this first electronic component 31, second electronic component 32, and the 3rd electronic component 33, can make electromagnetic wave shielding element 2 provided by the present invention and this first electronic component 31, second electronic component 32, and the 3rd electronic component 33 between form contact action, and then shield the electromagnetic wave that respectively this electronic component work is produced, thereby be beneficial to Electromagnetic Wave Detection standard by this electronic installation 3.
Since electromagnetic wave shielding element of the present invention comprise conductive body with first, second, reach the 3rd elasticity lead foot, its structure is simple and can make by metal plate punching technology, so reached simple structure and characteristic with low cost, this conductive body is bonded to this first joint portion by its second joint portion in addition, and this combination can be and fastens or the heat of plasthetics is melted concora crush, therefore the effect that is easy to assemble also is provided relatively, so the present invention overcomes existing in prior technology variety of problems and shortcoming already, so the present invention overcomes existing in prior technology variety of problems and shortcoming already.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be listed as claim.