CN101200540A - Method for employing anion polymeric polyamide as epoxy resin curing agent - Google Patents
Method for employing anion polymeric polyamide as epoxy resin curing agent Download PDFInfo
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- CN101200540A CN101200540A CNA2006101195021A CN200610119502A CN101200540A CN 101200540 A CN101200540 A CN 101200540A CN A2006101195021 A CNA2006101195021 A CN A2006101195021A CN 200610119502 A CN200610119502 A CN 200610119502A CN 101200540 A CN101200540 A CN 101200540A
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Abstract
The present invention relates to a method which uses anion polymerized polyamide as epoxy curing agent. The method utilizes the open-loop reaction of amido and epoxy; the epoxy is added in the anion polymerization of lactam monomer; after full being stirred and mixed, the anion polymerization reaction and epoxy curing reaction are carried out simultaneously under a certain temperature, thus finally obtaining the reactive alloy of the two reactions. Compared with the prior technology, the curing agent provided by the present invention is low in viscosity and can improve the shock resistance of the epoxy system.
Description
Technical field
The present invention relates to epoxy resin cure modification technology field, relate in particular to the method for anion polymeric polyamide that adopt as epoxy curing agent.
Background technology
Resins, epoxy is through forming three-dimensional, insoluble infusible network structure behind the crosslinking curing, has performances such as high strength, low-shrinkage, good chemical resistant properties and cohesiveness.But the Resins, epoxy impact property after solidifying is low, and for improving its toughness, the epoxy-resin systems of many interpolation rubber polymers is applied.Multiple in addition thermoplastic polymer has also caused attention to Resins, epoxy toughness reinforcing, comprising polyamide polymers.Polymeric amide is as epoxy hardener the time, and the alloy of the two has good toughness, erosion resistance and low toxicity, but this class solidifying agent has the shortcomings such as appearance color of low thermal characteristics, high viscosity, difference.
Summary of the invention
Purpose of the present invention is exactly to provide a kind of low viscosity in order to overcome the defective that above-mentioned prior art exists, and the employing anion polymeric polyamide of shock resistance that can improve epoxy-resin systems is as the method for epoxy curing agent.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of method that adopts anion polymeric polyamide as epoxy curing agent, it is characterized in that, this method is utilized the ring-opening reaction of amide group and epoxide group, in the anionoid polymerization process of lactam monomers, add Resins, epoxy, through fully mixing, make the curing reaction of anionic polymerisation and Resins, epoxy carry out simultaneously at a certain temperature, finally obtain the reaction alloy of the two.
Described method is with the lactam monomers fusion; add catalyzer and remove moisture 120~160 ℃ of following vacuum distillings; add the Resins, epoxy of in 60~100 ℃ of vacuum drying ovens, removing moisture then; after under nitrogen protection, fully stirring; add activator; be cast in 120~160 ℃ the mould, curing reaction fully after, obtain the reaction alloy of nylon/Resins, epoxy.
Described lactam monomers comprises one or more of butyrolactam, Valerolactim, hexanolactam, oenantholactam, spicy inner formyl amine, ninth of the ten Heavenly Stems lactan, caprinolactam, 11 lactan or laurolactam.
Described catalyzer comprises one or more of sodium Metal 99.5, sodium hydride, sodium alkoxide, sodium hydroxide or yellow soda ash.
Described Resins, epoxy is E-51 Resins, epoxy.
Described activator comprises one or more of acyl chlorides, acid anhydrides, isocyanic ester or carbonic acid gas.
The requirement of anion polymeric polyamide reaction conditions is low, reaction system viscosity is low and reaction is quick, utilize the amide group on the growing chain and the ring-opening reaction of epoxide group, can make Resins, epoxy form three-dimensional cross-linked reticulated structure rapidly, thereby make this alloy system be applicable to reaction injection technology.
Compared with prior art, the present invention utilizes the ring-opening reaction of amide group and epoxide group, in the anionoid polymerization process of lactam monomers, add Resins, epoxy, through fully mixing, make the curing reaction of anionic polymerisation and Resins, epoxy carry out simultaneously at a certain temperature, finally obtain the reaction alloy of the two, gained solidifying agent viscosity is low, and can improve the shock resistance of epoxy-resin systems.
Embodiment
Below in conjunction with specific embodiment method involved in the present invention and technology are described.
Embodiment 1
The solidify reaction process of Resins, epoxy and caprolactam monomer anionoid polymerization growing chain; with the caprolactam monomer fusion; add catalyzer sodium hydroxide and remove moisture 140 ℃ of following vacuum distillings; add the E-51 Resins, epoxy of in 80 ℃ of vacuum drying ovens, removing moisture then, after under nitrogen protection, fully stirring, add activator 2; the 4-tolylene diisocyanate; be cast in 140 ℃ the mould, curing reaction fully after, obtain the reaction alloy of nylon 6/ Resins, epoxy.
Embodiment 2
The solidify reaction process of Resins, epoxy and laurolactam monomer anionoid polymerization growing chain; with the laurolactam molten monomer; add catalyst metal sodium and remove moisture 160 ℃ of following vacuum distillings; add the E-51 Resins, epoxy of in 100 ℃ of vacuum drying ovens, removing moisture then; after under nitrogen protection, fully stirring, add the activator acyl chlorides, be cast in 160 ℃ the mould; after curing reaction is complete, obtain the reaction alloy of nylon 12/ Resins, epoxy.
Embodiment 3
The solidify reaction process of Resins, epoxy and butyrolactam monomer anionoid polymerization growing chain; with the butyrolactam molten monomer; add the catalyzer sodium hydride and remove moisture 120 ℃ of following vacuum distillings; add the E-51 Resins, epoxy of in 60 ℃ of vacuum drying ovens, removing moisture then; after under nitrogen protection, fully stirring, add the activator isocyanic ester, be cast in 120 ℃ the mould; after curing reaction is complete, obtain the reaction alloy of nylon 4/ Resins, epoxy.
Below be the solidify reaction process of Resins, epoxy and caprolactam monomer anionoid polymerization growing chain:
Claims (6)
1. method that adopts anion polymeric polyamide as epoxy curing agent, it is characterized in that, this method is utilized the ring-opening reaction of amide group and epoxide group, in the anionoid polymerization process of lactam monomers, add Resins, epoxy, through fully mixing, make the curing reaction of anionic polymerisation and Resins, epoxy carry out simultaneously at a certain temperature, finally obtain the reaction alloy of the two.
2. a kind of method that adopts anion polymeric polyamide as epoxy curing agent according to claim 1; it is characterized in that; described method is with the lactam monomers fusion; add catalyzer and remove moisture 120~160 ℃ of following vacuum distillings; add the Resins, epoxy of in 60~100 ℃ of vacuum drying ovens, removing moisture then; after under nitrogen protection, fully stirring; add activator; be cast in 120~160 ℃ the mould; after curing reaction is complete, obtain the reaction alloy of nylon/Resins, epoxy.
3. a kind of method that adopts anion polymeric polyamide as epoxy curing agent according to claim 1 and 2, it is characterized in that described lactam monomers comprises one or more of butyrolactam, Valerolactim, hexanolactam, oenantholactam, spicy inner formyl amine, ninth of the ten Heavenly Stems lactan, caprinolactam, 11 lactan or laurolactam.
4. a kind of method that adopts anion polymeric polyamide as epoxy curing agent according to claim 2 is characterized in that described catalyzer comprises one or more of sodium Metal 99.5, sodium hydride, sodium alkoxide, sodium hydroxide or yellow soda ash.
5. a kind of method that adopts anion polymeric polyamide as epoxy curing agent according to claim 1 and 2 is characterized in that described Resins, epoxy is E-51 Resins, epoxy.
6. a kind of method that adopts anion polymeric polyamide as epoxy curing agent according to claim 2 is characterized in that described activator comprises one or more of acyl chlorides, acid anhydrides, isocyanic ester or carbonic acid gas.
Priority Applications (1)
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CNA2006101195021A CN101200540A (en) | 2006-12-12 | 2006-12-12 | Method for employing anion polymeric polyamide as epoxy resin curing agent |
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CNA2006101195021A CN101200540A (en) | 2006-12-12 | 2006-12-12 | Method for employing anion polymeric polyamide as epoxy resin curing agent |
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CN101200540A true CN101200540A (en) | 2008-06-18 |
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CNA2006101195021A Pending CN101200540A (en) | 2006-12-12 | 2006-12-12 | Method for employing anion polymeric polyamide as epoxy resin curing agent |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103554484A (en) * | 2013-10-11 | 2014-02-05 | 合肥工业大学 | Hydrotalcite like-polyamide functional nanocomposite and preparation method thereof |
CN106566205A (en) * | 2016-11-08 | 2017-04-19 | 宁波永的电子科技有限公司 | Rigid composite resin material for automobile relay outer shell and preparation method of rigid composite resin material |
-
2006
- 2006-12-12 CN CNA2006101195021A patent/CN101200540A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103554484A (en) * | 2013-10-11 | 2014-02-05 | 合肥工业大学 | Hydrotalcite like-polyamide functional nanocomposite and preparation method thereof |
CN103554484B (en) * | 2013-10-11 | 2016-03-02 | 合肥工业大学 | A kind of Hydrotalcite like-polyamide functional nanocomposite and preparation method thereof |
CN106566205A (en) * | 2016-11-08 | 2017-04-19 | 宁波永的电子科技有限公司 | Rigid composite resin material for automobile relay outer shell and preparation method of rigid composite resin material |
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Open date: 20080618 |