CN101197234A - Functional device fabrication apparatus and functional device fabricated with the same - Google Patents

Abstract

The present invention provides a function block manufacturing device which is used for depositing the solid phase object of solution on the substrate adopting paper or paper-based material thereby forming a wiring circuit or electric device on the substrate. A nozzle injects the solution containing electric functional material on the substrate as the point pattern. The nozzle includes a device which is used for distributing solution liquid drop with the nozzle. The driving signal exerted to the device leads to that the liquid drop injected from the device has a special shape before impacting the surface of the substrate.

Description

Function element manufacturing installation and the function element made from this device

Technical field

The application relates generally to and a kind ofly makes the apparatus and method of the feature board with wiring diagram or electronic device by applying electronic functional material in substrate, and the feature board made from this device.

Background technology

In recent years, people have studied the light emitting devices/medium of use subparticle/ultra-fine grain and the various elements in light processor/medium field.For fine particle is applied on the different elements, containing the film of fine particle materials or high density that layer obtains integrated by deposition on solid substrate is key factor.For example, once reported the film that forms by highly dense fine particle.

Inorganic compound thin film with ideal orientation can adopt known method to form, as molecular beam epitaxy (MBE), ion beam method, ion beam irradiation vacuum deposition method, CVD (Chemical Vapor Deposition) method (CVD), physical vaporous deposition (PVD) and liquid phase epitaxial method (LPE).Organic compound thin film can adopt known method to form, as Langmuir (Langmuir) air-jet method (LB method).The method of usually, can be by using vacuum plant that material is distilled in high vacuum (as the MBE method) thereby forming particle in the self-organizing mode on solid substrate obtains a particle.

Yet said method has difficulties on the particle size distribution of control point interparticle distance or some particle, and the some particle that obtains to expect needs higher cost.

Consider above-mentioned disadvantage, people once proposed a kind of liquid jet method, promptly used fluid jetting head to form the technology of the film that contains fine grain material.For example, in a correlation technique, use the suspended emulsion that spraying technology will contain nano particle to be coated on the solid substrate, thereby on anchoring base, form the film that forms by ultrafine particle (nano particle).

Except that liquid jet method, some traditional known methods in order to make circuit board are described below:

(1) a kind of method that forms copper wiring was proposed, wherein copper wiring is formed on the copper-coated laminate that is coated with resist, adopt photoetching that it is come out to form circuit diagram then, dissolve unexposed resist then, on the part that its resist is removed, carry out etching then.

(2) in addition, once proposed a kind of method that forms conductive pattern, wherein adopted screen printing, on ceramic bases, formed in order to print the conductive pattern of needed circuitous pattern with conductive paste, in nonoxidizing atmosphere, heat-treat then, make the metal fine sintering in the conductive paste.

(3) in addition, a kind of method that forms copper wiring was once proposed, wherein copper wiring is formed on the dielectric base that is coated with resist, form the thin conductive layer of one deck by conductive metal deposition, adopt photoetching that it is come out to form circuit diagram then, dissolve unexposed resist then, on the part that its resist is removed, carry out etching then.

Yet above-mentioned traditional known method also is not suitable for forming fine pattern.Therefore, the method for proposing to use ink-jet technology formation fine pattern is arranged.In the method for an exemplary, adopt ink ejecting method to make wiring diagram or circuit board, wherein circuit diagram directly is plotted in the substrate by using metal-to-metal adhesive.These methods can be simplified the manufacturing process of fine pattern, and the necessity that does not dispose waste liquid requires manufacturing cost still less simultaneously.

Though mentioned the whole bag of tricks that uses ink ejecting method above, the method that adopts ink-jet technology to form various devices and base pattern still has and needs improvements.

Summary of the invention

An aspect according to the application provides a kind of function element manufacturing installation, by the solid matter of deposit solution in the substrate of paper or paper base material, thereby forms wiring diagram or electronic device in substrate.This function element manufacturing installation comprises first shower nozzle.The solution that first shower nozzle will contain electronic functional material is ejected in the substrate as dot pattern.First shower nozzle comprises that electro-mechanical can conversion element, can be out of shape when applying electric energy, and distribute solution droplets from first shower nozzle by the distortion that electro-mechanical can conversion element.When drop flies before the impact basement surface, drop be first shape of substantially spherical or have spherical part and spherical part after second shape of extended stylolitic part, the length of second shape is less than three times of the spherical part diameter.Put on the electro-mechanical of first shower nozzle drive signal on can conversion element and be used for making first shower nozzle to spray the drop that contains the solution of electronic functional material or be equal to solution, make the drop of ejection before the impact basement surface, have first shape or second shape.

According to the application on the other hand, provide a kind of function element manufacturing installation that comprises first shower nozzle, wherein first shower nozzle comprises the heater element with heat in next life, and heat makes and produce bubble in the solution that the bubble of generation is used for from the first shower nozzle sprayed solution drop.When the drop of ejection when flying before the impact basement surface, drop presents the shape with extended stylolitic part after spherical part and the spherical part, and the length of this drop is at least five times of spherical part diameter.Put on drive signal on the heater element of first shower nozzle with so that first shower nozzle sprays the drop of this shape.

According to the application's another aspect, provide a kind of feature board that comprises substrate and dot pattern.This substrate is made by paper or paper base material, contains the solid matter of the solution of electronic functional material by deposition, this dot pattern is arranged at least one face of substrate.

Description of drawings

In conjunction with the accompanying drawings and by following detailed description, can obtain more complete understanding to the application's theme and many characteristics thereof and advantage, wherein:

Figure 1A and 1B show the example of use according to the wiring diagram of the manufacturing installation formation of exemplary embodiment;

Fig. 2 shows the manufacturing installation in order to manufacturing wiring diagram substrate or device substrate according to exemplary embodiment;

Fig. 3 shows in order to make another example of manufacturing installation of wiring diagram substrate or device substrate;

Fig. 4 A and 4B are the schematic diagrames according to the used shower nozzle of manufacturing installation of exemplary embodiment;

Fig. 5 shows the schematic diagram as the cellulose fibre of paper base material;

Fig. 6 shows the generalized section of employing according to the top lock type organic crystal tube elements of the method manufacturing of exemplary embodiment;

Fig. 7 shows the generalized section of employing according to the end lock type organic crystal tube elements of the method manufacturing of exemplary embodiment;

Fig. 8 shows the generalized section of employing according to organic electroluminescent (EL) element of the method manufacturing of exemplary embodiment;

Fig. 9 A and 9B show the course of injection of the shower nozzle that uses piezoelectric element;

Figure 10 shows the demonstrative structure of the shower nozzle that uses piezoelectric element;

Figure 11 shows the exemplary shapes of the flight drop of telling from the shower nozzle of Figure 10;

Figure 12 shows another exemplary shapes of the flight drop of telling from the shower nozzle of Figure 10;

Figure 13 A, 13B and 13C show the example of thermal type shower nozzle;

Figure 14 shows the exemplary shapes of the flight drop of telling from the shower nozzle of Figure 13 A;

Figure 15 shows the multiinjector type shower nozzle of observing from the nozzle side;

Figure 16 shows a multiinjector type shower nozzle that is stacked on another;

Figure 17 is the perspective view of the multiinjector type shower nozzle of Figure 16;

Figure 18 shows the example of the wiring diagram that is formed by the point according to the drop of the method for exemplary embodiment or solution;

Figure 19 shows the example of the device that is formed by the point according to the drop of the method for exemplary embodiment or solution;

Figure 20 shows the example of wiring diagram, and it is alleviating the improper discharge at the corner portions located place of the wiring diagram among Figure 18;

The example of Figure 21 display device, it is alleviating the improper discharge at the corner portions located place of the device among Figure 19;

Figure 22 shows another example of wiring diagram, and it is alleviating the improper discharge at the corner portions located place of the wiring diagram among Figure 18;

Another example of Figure 23 display device, it is alleviating the improper discharge at the corner portions located place of the device among Figure 19;

Figure 24 shows another example of wiring diagram, and it is alleviating the improper discharge at the corner portions located place of the wiring diagram among Figure 18;

Another example of Figure 25 display device, it is alleviating the improper discharge at the corner portions located place of the device among Figure 19;

Figure 26 shows another example of wiring diagram, and it is alleviating the improper discharge at the corner portions located place of this wiring diagram;

Another example of Figure 27 display device, it is alleviating the improper discharge at the corner portions located place of this device;

Figure 28 is the enlarged drawing of the corner portions located of wiring diagram shown in Figure 1B;

Figure 29 shows the exemplary configurations of use according to the wiring diagram substrate of the manufacturing installation manufacturing of exemplary embodiment;

Figure 30 shows use another exemplary configurations according to the wiring diagram substrate of the manufacturing installation manufacturing of exemplary embodiment;

Figure 31 shows the example of use according to the device substrate of the manufacturing installation manufacturing of exemplary embodiment;

Figure 32 shows use another exemplary configurations according to the device substrate of the manufacturing installation manufacturing of exemplary embodiment;

Figure 33 shows the imaging area of the imaging device that adopts Carlson process, and wherein photoconductor drum is arranged to the serial connection form;

Figure 34 shows the imaging device of the imaging area with the Carlson process that adopts Figure 33, and wherein this imaging device is used as the manufacturing installation according to exemplary embodiment;

Figure 35 shows to have the electronic panels of a plurality of electronic devices, and this electronic device is to use to be made according to the manufacturing installation of exemplary embodiment; And

Figure 36 and Figure 37 show the electronic device with separator bar pattern shown in Figure 35.

Accompanying drawing is to be used for describing exemplary embodiment of the present invention, and should not do is restriction to its scope.Unless clearly indicate, accompanying drawing should not think to draw in proportion that in a plurality of views, same or similar reference signs is pointed to same or similar assembly.

Embodiment

Describe below in conjunction with the exemplary embodiment among the present invention.It should be noted that, though the term as first, second grade can be used for illustrating various elements, component, zone, layer and/or part at this, but be to be understood that, this class component, component, zone, layer and/or part are not limited by this, this is relative because of this term, that is to say, only be used to make an element, component, zone, layer or part to be different from another element, zone, layer or part.So, such as, first element as described below, component, zone, layer or part can be marked as second element, component, zone, layer or part, and do not break away from purport of the present invention.

In addition, should be noted that the term purpose only is specific execution mode is described as used herein, rather than be used to limit the present invention.So, such as, singulative also can be used to comprise plural form as used herein, unless context clearly show outside.In addition, term " comprises " and " comprising " is meant when being used for this specification and has described feature, integer, step, operation, element and/or component, rather than gets rid of one or more existence of planting other features, integer, step, operation, element, component and/or its combination or additional.

In addition, though in explanation exemplary embodiment as shown in the figure, the specific term that has used specific term, content of the present invention to be not limited to choose for clarity, should be appreciated that each specific key element comprises the equivalence techniques that all are operated in a similar manner.

Referring now to accompanying drawing, in conjunction with the accompanying drawings the apparatus and method that are used for forming pattern in the substrate that papery or paper base material are made according to exemplary embodiment are described.In the disclosure, " ink ejecting method (inkjet method) ", " injection method (jetting method) " etc. are used similarly, and " distributing (dispense) ", " spraying (jet) ", " distributing (dispensing) ", " spraying (jetting) " are also used similarly.

Figure 1A and 1B are depicted as by use the example of the pattern that forms according to the liquid jet method of exemplary embodiment in the substrate 10 that papery or paper base material are made.Figure 1A represents terminal 2 and 3 states that are formed in the substrate 10, and wherein, dotted portion 1 ' shows the zone that wherein will form wiring diagram.Figure 1B is depicted as by distribute the solution comprise electronic functional material to make wiring diagram 1 be formed at state in the substrate 10 with liquid jet method.

In exemplary embodiment, this liquid jet method can be an ink ejecting method, and this method is used as the solution that is used for comprising electronic functional material and is coated in suprabasil method.Hereinafter, can think that liquid jet method or ink ejecting method are meant ink ejecting method.Below this method is elaborated.

Figure 2 shows that the manufacturing installation that is used to form wiring diagram or electronic device according to exemplary embodiment.Such as, manufacturing installation comprises the scanning motor 18 of shower nozzle element 11, saddle 12, base seat 13, substrate 14, supply pipe 15, signal cable 16, shower nozzle control cabinet (comprising dissolving tank) 17, X-direction, scanning motor 19, computer 20, control cabinet 21 and the substrate location/holding element 22 (22X1,22Y1,22X2,22Y2) of Y direction.

Such as, can use substrate 14 as the substrate that is used for forming wiring diagram or electronic device thereon.Use supply pipe 15 that the solution that comprises electronic functional material in the dissolving tank is supplied in the shower nozzle element 11.Use signal cable 16 that the signal in the shower nozzle control cabinet 17 is delivered in the shower nozzle element 11.Use the scanning motor 18 of X-direction and the scanning motor 19 of Y direction that saddle 12 is moved inward.In this structure, when the solution that will comprise electronic functional material is ejected in the substrate 14 that is arranged on the base seat 13, come mobile shower nozzle element 11 by edge X/Y scanning direction saddle 12 as shown in Figure 2.

Figure 3 shows that the structural representation according to another manufacturing installation of exemplary embodiment, this device is used for making wiring diagram or the electronic device that uses ink ejecting method in substrate.Figure 4 shows that the structural representation of shower nozzle as shown in Figure 3.

Structure among Fig. 3 is different from the structure among Fig. 2, wherein in the structure in Fig. 3, by mobile substrate 14 wiring diagram or electronic device is formed in the substrate 14.Such as, as described in Fig. 3 and 4, another manufacturing installation comprises scanning element 37, position detecting element 38, position correction control element 39 and the shower nozzle driving/control element 40 of shower nozzle element 11, control computer 35, image recognition element 36, X/Y direction.In addition, shower nozzle element 11 comprises shower nozzle calibration control element 31, optical detection element 32, shower nozzle 33 and shower nozzle calibrating element 34.

Shower nozzle 33 in the shower nozzle element 11 (as the drop applicator) can use any device that can distribute to quantitative drop.For example, shower nozzle 33 can preferably use the ink discharge device of the drop that can distribute 0.1pl (skin liter)～hundreds of pl (skin liter).

In ink ejecting method, the signal of telecommunication is applied on the piezoelectric vibrator, the signal of telecommunication being changed into the mechanical oscillation of piezoelectric vibrator, thereby cause being assigned with from the drop in the nozzle.Usually this method is called the drop control method.

In other method, use the continuous oscillation generation technique to prepare the drop of the recording liquid of electrostatic charge with controlled quentity controlled variable.The drop of the recording liquid that makes is assigned with between the polarizing electrode that has applied uniform electric field, thus on recording-member duplicating image.Usually this technology is called continuous flow method or electric charge control method.In addition, in other method, in liquid, produce bubble,, thereby cause being assigned with from the drop in the nozzle so bubble acts on liquid.Usually this technology is called hot ink ejecting method or bubble jet Bubble Jet (registered trade mark) method.

The user can select any in liquid control method, continuous flow method and the hot ink ejecting method as required for use.

In exemplary embodiment, manufacturing installation as shown in Figure 2 is used in substrate making wiring diagram or electronic device, wherein by regulate with substrate location/holding element 22 and definite substrate holding position with substrate 14 maintenances and be fixed on the given position.As shown in Figure 2, each contacts side surfaces of substrate location/holding element 22 and substrate 14, thereby along carrying out the accurate adjustment of the sub-micron order of magnitude as the X/Y direction.In addition, substrate location/holding element 22 links to each other with shower nozzle control cabinet 17, computer 20 and control cabinet 21, thereby realization substrate locating information and accurate adjustment information are to the lasting feedback of substrate, drop locating information and distribution timing.

In addition, except that the location regulation method of X/Y direction, the manufacturing installation that is used in substrate making wiring diagram or electronic device has the position regulator of rotation, and this device is because of being positioned at the following demonstration in the drawings of substrate 14.

Now the substrate that is used for making wiring diagram or electronic device is thereon described.

In exemplary embodiment, in the substrate that papery or paper base material are made, make wiring diagram or electronic device.Hereinafter, paper or paper base material can be referred to as paper substrates or paper substrate substrate.

As mentioned below, the solution that will comprise electronic functional material is coated in the paper substrate substrate forming dot pattern, thereby makes wiring diagram or electronic device in the paper substrate substrate.Because this paper substrate substrate has pliability, when keeping its function (such as circuit function), can have some pliabilities (such as bending) so be formed at the suprabasil wiring diagram of paper substrate or electronic device.In addition, except that above-mentioned pliability, the paper substrate substrate also has lightweight and portable advantage, therefore, be formed at suprabasil wiring diagram of paper substrate or electronic device and also have the advantage that also has lightweight and portability outside the pliability, this can improve the marketability of wiring diagram substrate or electronic substrate.

In exemplary embodiment, wiring chart board, electronic device and electronic panels can define as described below.

The wiring chart board is to be formed at the suprabasil circuit pattern of paper substrate.This circuit pattern can be as the combination with the electric wire that is used to be connected electronic device of wiring diagram or electronic device (such as transistor, resistance, capacitor).

Electronic device comprises as transistor, resistance and capacitor and display.In addition, electronic device comprises as electronic device being integrated in a suprabasil IC (integrated circuit) or LSI (large scale integrated circuit).

Electronic panels is the plate that has a plurality of electronic devices on it.Electronic panels can cut into the chip that is used to produce in batches electronic device.

Describe being used to make below according to the wiring chart board of exemplary embodiment or the substrate of electronic panels.

In exemplary embodiment, paper or paper base material are as aforesaid substrate.

Usually, " paper " can be defined as by decomposing the aggregation of plant such as the string of acquisitions such as grass, timber, bamboo.For example, can be by string be suspended in the water, then the string in the filtrate is stacked into flat shape with string then and makes paper.This string be as raw material by use paper technology make paper (such as, foreign paper, Japan paper) cellulose fibre.

In foreign paper, this cellulose fibre can be the wood-fibred of the thickness of the width of length with 1～3mm, 20～40 μ m and 3～6 μ m, and this cellulose fibre can one be stacked on another to form multilayer.For example, one of 10～100 cellulose fibre can be stacked on another to form the layer of cellulose fibre.This paper has porosity, smoothness and the affinity of higher degree.

In Japan paper, this cellulose fibre can be the bast fiber with width of the length of 3～7mm and 5～20 μ m, and it is longer than above-mentioned wood-fibred, and has the molecular structure that is different from wood-fibred.Japan paper can be hand-made or machine-processed paper.

Figure 5 shows that the schematic diagram of the surface appearance of paper, wherein each lines are represented cellulose fibre.Paper is made up of the space that forms between a cellulose fiber peacekeeping cellulose fibre that is stacked on another.

The basic paper that the paper that only has cellulose fibre like this is reserved as preparation commodity paper uses.For example, can in the space between the cellulose fibre of basic paper, fill the filler ion of particle diameter, such as talcum, clay, calcium carbonate, titanium dioxide etc., to improve opacity, whiteness, smoothness and the air penetrability of commodity paper with 0.2～10 μ m.

In addition, can prepare coated paper on the paper by masking liquid is coated in, wherein this masking liquid can be by will be as binding agent (such as emulsion, starch) and the size particles with 0.5～1 μ m such as kaolin (Al ₂O ₃/ 2SiO ₂/ 2H ₂O), calcium carbonate (CaCO ₃) and satin white (3CaO/Al ₂O ₃/ 3CaSO ₄/ 31～32H ₂O) etc. be dispersed in the solution and make.

In addition, commodity paper can be such as printing paper, paper in the office, wrapping paper, the toilet paper of the coil paper that is used for newspaper, uncoated printing paper, coating, be used for the corrugated paper of cardboard etc., but is not limited to this.

The substrate that preferred papery or paper base material are made need have the mechanical strength of given standard.As mentioned above, can use manufacturing installation manufacturing such as shown in Figure 2 according to the electronic panels of exemplary embodiment or wiring chart board.When making electronic panels or wiring chart board with manufacturing installation as shown in Figure 2, can support substrate with base seat 13, support that by this shape of substrate can not deform.Therefore, when making electronic panels or wiring chart board with manufacturing installation as shown in Figure 2, have larger sized substrate even use, electronic panels or wiring chart board can not deform yet.

The electronic device or the wiring diagram element (being called " chip device " later on) that are made by this electronic panels or wiring chart board can be used in the various environment that change with the device application field.

If chip device deforms, so should distortion can cause the reduction of the function of chip device in the environment of specific area.Therefore, chip device need have the mechanical strength of given standard.For example, chip device need have the shape of given mechanical strength when keeping not applying external force on it.If chip device deforms under the condition of external force not having, this chip device does not have practical use so.

Specifically, can not support the chip device of himself weight (promptly being out of shape) not have practical use because of own wt.In other words, because of can not keeping the material of its shape, the own wt effect is not preferred for substrate.For example, thin paper or the cloth (such as handkerchief) with too little hardness do not have practical use as substrate.

Yet if chip device does not cause the reduction of the function of chip device because of the distortion of own wt, this chip device has practical use so.Admissible deformation extent to chip device describes now.

For example, strain detection sensor such as straingauge or resistance strain gauge, can be used for determining the admissible deformation extent of chip device.Strain detection sensor is used for determining by the resistance variations of inspected object strain (or distortion) degree of object.If detect the strain (or distortion) of substrate by strain detection sensor, this substrate can not be used as substrate so, and this is the reduction that can cause the function (such as electrology characteristic) of chip device because of the distortion that can change substrate resistance.

In addition, for example can assess the admissible deformation extent of substrate (or hardness) based on the density of paper.

As shown in table 1, use has the chip device of the 10 * 10mm that gets everything ready made of paper～50 * 50mm size of different densities, wherein, then assess this chip device sample and whether have function preferably with each ten chip device samples fully made of paper with different densities.

Table 1

Test piece number (Test pc No.)	The type of paper	The density of paper
			1	Glassine paper	1.10g/cm 3
2	Indian paper	0.80g/cm 3
			3	Common paper	0.78g/cm 3
4	Rice paper	0.62g/cm 3
			5	The news printing paper	0.57g/cm 3
6	Impregnated paper A	0.51g/cm 3
			7	Impregnated paper B	0.40g/cm 3
8	Hand-made Japan paper A	0.18g/cm 3
			9	Hand-made Japan paper B	0.09g/cm 3

As shown in table 1, test piece number (Test pc No.) 8 and 9 has more weak mechanical strength, thereby easy deformation.Therefore, test piece number (Test pc No.) 8 and 9 paper do not have sufficient intensity, thereby can not be used as substrate.Other pattern has sufficient intensity, thereby can be used as substrate.Though test piece number (Test pc No.) 7 deforms, use " chip device " of test piece number (Test pc No.) 7 to have function preferably.

According to result as shown in table 1 as can be known, can need have 0.40g/cm as the substrate of substrate ³Or the density of bigger paper is to set the intensity of preferred standard.The density of paper is the density that paper manufacturers is used, and wherein the density of paper is by (being 1m with basis weight ²The grammes per square metre of paper) THICKNESS CALCULATION divided by paper obtains.

Can determine according to this result,, need paper to have 0.40g/cm having the chip device of 10 * 10mm～50 * 50mm size ³Or bigger paper density.Have more on the paper of large scale such as 1000 * 1000mm though above-mentioned result about paper density can not be applied to other automatically, the electrical testing of density that can be by selecting paper and size and the deformation extent by chip device being used for determine chip device determines to have the practicality of larger sized chip device similarly.

Can obtain the required hardness of chip device by using aforesaid paper or paper base material with better intensity.

Except that this method, on chip device, increase the intensity that guard block can improve chip device.For example, this guard block can be applied or is coated on the front or the back side of chip device.

So; the substrate (as paper or paper base material) that has increased by working strength and apply or be coated on hardness or the intensity that suprabasil guard block can further improve chip device, wherein this guard block can be as the guard block of chip device with as the mechanical strength reinforcement.

As this guard block of mechanical strength reinforcement can be to be formed on resin bed on the chip device by ink ejecting method.For example, by ink ejecting method resin solution is coated on the front or the back side of substrate.When resin being carried out drying and being fixed on substrate in as resin bed it, this resin bed can improve the hardness of substrate.Below this guard block is described.

In addition, paper or paper base material as substrate in the exemplary embodiment are described.Paper has small concavity and convexity in its surface.For example, concavity and convexity can form because of the space between a cellulose fibre that is stacked on another and the particle that adds in the paper.Small concavity and convexity become and are unfavorable for forming wiring diagram or the electronic device that has than good quality on the paper surface, and this is to be allocated to dot pattern because comprise on the paper that the solution of electronic functional material has concavity and convexity in its surface.

By using coating can reduce or suppress the concavity and the convexity of paper effectively, will be explained below.

In exemplary embodiment, directly be coated in the substrate by the solution that will comprise electronic functional material, form wiring diagram or electronic device in substrate on such as paper or paper base material.

When this wiring diagram substrate or electronic substrate are used for various environment (such as, office, factory) in the time, the back side of substrate (face that does not promptly have wiring diagram or electronic device) can become wet because of moisture, and the moisture porous is in the front of the substrate with wiring diagram or electronic device, thereby causes the damage of wiring diagram or electronic device.

Considering the moisture effect, in exemplary embodiment, can make substrate avoid moisture effects as follows, also be like this even got wet by moisture in the back side of substrate.For example, can be on the back side of substrate the stacked waterproof material that can stop moisture penetration, such as resin molding.

This resin molding can as described belowly be layered in the substrate.For example, the substrate that is laminated with resin molding can be used for making wiring chart board or electronic panels, perhaps can be after forming wiring diagram or electronic device, at the back side of substrate laminated resin film.

For example, this resin molding can be made such as vinyl chloride resin and acrylic resin by any resin material.Specifically, known polyolefins is the polymer of environmental sound such as acrylic resin, therefore preferably is used to form this resin molding.

In addition, except the laminated resin film of the back side of substrate, can also make composite sheet as the substrate of making wiring chart board or electronic panels with one deck resin molding.

In addition, thus can be by with resin solution being distributed in the back side of substrate at the back side of substrate coating resin layer as ink ejecting method or rolling method.

By having the substrate of this structure, can have the wiring chart board or the electronic panels of water proofing property with paper or paper base material manufacturing.

Now the preferable shape to the substrate that is used to form wiring chart board or electronic panels describes.

Consider the practicality of making substrate and final products (such as wiring diagram substrate or electronic substrate) economically, the shape that is used to make the substrate of being made by papery or paper base material of wiring diagram substrate or electronic substrate can be rectangle.Rectangular base has two vertical edges parallel to each other and two horizontal sides parallel to each other.Vertical edges and horizontal sides are each other in right angle intersection.

In exemplary embodiment, one group of electronic device is arranged in this rectangle substrate with matrix-style, make that two mutually orthogonal directions in this matrix are parallel with the direction of the direction of the vertical edges of rectangle substrate and horizontal sides respectively.Below the reason of carrying out this setting (that is, make electronic device be arranged in matrix and make the vertical edges of substrate parallel with two orthogonal directions of matrix with horizontal sides) is described.

Described in Fig. 2 and 3,, just can not carry out complicated Position Control in case determined the position of shower nozzle 11 with respect to substrate 14.In other words, when forming electronic device, shower nozzle element 11 distributes solution, moves with respect to substrate 14 and while and the given distance (or gap) of substrate 14 maintenances along the X/Y direction simultaneously.

Directions X and Y direction are the directions of two mutually orthogonals.Therefore, when making shower nozzle element 11 be positioned on the substrate, by being arranged to directions X with Y direction parallel with horizontal sides the vertical edges of substrate, can make the electronic device group accurately form arranged in substrate, this is because the both direction of the matrix array of electronic device is configured to parallel with the limit of substrate.In other words, by using rectangular base and making substrate along directions X with the Y direction moves and in that liquid droplet distribution was accurately located substrate before substrate, can form the matrix with more high-precision electronic device.Now position of rotation adjusting device mentioned earlier is described.As mentioned above, in exemplary embodiment, by with liquid droplet distribution accurately locate substrate 14 before the substrate 14 and under the control operation of not carrying out extra complexity by can form the matrix array of high-precision electronic device along directions X and the relatively mobile substrate of Y direction.When carrying out the first location of substrate 14, there is skew (or offset) along the direction of rotation of the perpendicular Z axle in the plane of determining with directions X and Y direction.

Be the rotation skew of compensation substrate 14, position of rotation adjusting device (showing in the drawings below the substrate 14 because of it is positioned at) is set in manufacturing installation as shown in Figure 2.By the compensation rotating deviation and by liquid droplet distribution was correctly being located substrate 14 before substrate 14, can be simply by come the high accuracy matrix array of electron gain device along directions X and the relatively mobile substrate of Y direction.

Position of rotation adjusting device in above-mentioned (because being arranged in the following and invisible of substrate 14) is called as the separator of the substrate location/holding element 22 (22X1,22Y1,22X2,22Y2) of Fig. 2.

Yet substrate location/holding element 22 can have the function of this position of rotation adjusting device.As mentioned above, substrate location/holding element 22 contacts with the limit of substrate 14, thereby can be along the position of directions X and Y direction adjustment substrate 14.In this case, the structure by being formed for rotating substrate location/holding element 22 (such as, screw calibration steps), can locate with substrate/holding element 22 carries out angle correct.

This rotary position information is delivered to shower nozzle control cabinet 17, computer 20 and control cabinet 21 with the positional information of directions X and Y direction and the information that is used for the accurate adjustment substrate.Use this setting, can feed back the drop locating information constantly and distribute clocking information to be used in substrate, making wiring diagram or electronic device.

Next another structure that is used to locate substrate is described.As mentioned above, substrate location/holding element 22 contacts with the limit of substrate 14, so substrate location/holding element 22 is used to along the position of directions X and Y direction adjustment substrate 14.

Except the method for the side that uses substrate 14, thereby can also in substrate 14, form the bar paten that extends along two orthogonal directions position along X/Y direction adjustment substrate 14.Specifically, use known printing technology in substrate 14, to form the bar paten that extends along two orthogonal directions.

Can form this bar paten on the given area of substrate, this can not influence the function of substrate.In addition, except formation only is used to adjust the bar paten of substrate location, can also for example use the bar paten that is used to adjust substrate location along the wiring diagram or device electrode 42 (seeing Fig. 3 and the 4) conduct of directions X and Y direction (seeing Figure 1B) extension.Can detect bar paten by optical detection element 32, then feed back the position adjustment that this detection information is used for substrate with CCD (charge coupled device) camera and lens.

As for the Z direction vertical with X-Y plane, in case tying up to the batch operation of carrying out solution, pass, the position between shower nozzle element 11 and the substrate 14 determines before, just can not carry out along the Position Control of Z direction.Specifically, shower nozzle element 11 moves the solution that comprises electronic functional material with distribution in substrate 14 upper edge X/Y directions, simultaneously keeps given distance (such as, 1mm～3mm) with substrate 14.

If during distribution shower nozzle element 11 is carried out along the Position Control of Z direction, need in manufacturing installation, be provided for the device and the control system of this control so, thereby cause control procedure the complexity of this device.In addition, if carry out position adjustment along the Z direction in the distributes of solution, it is elongated to be used for forming the required time cycle of electronic device so in substrate, thereby causes productivity ratio to reduce.

Though can not carry out along the Position Control of Z direction in the distributes of solution, can carry out following control to the distance between substrate 14 and the shower nozzle element 11 in the distributes of drop.

Specifically, the plane of substrate 14 and substrate holder is enhanced, so can accurately control the saddle device that drives the shower nozzle element 11 in the substrate 14 along the X/Y direction.Use this structure, can make shower nozzle element 11 move and not be used in distributes and carry out in substrate 14 upper edge X/Y directions, can improve the productivity ratio of wiring chart board or electronic panels thus along the Position Control of Z direction with higher speed.For example, be of a size of in the situation of 100 * 100mm～4000 * 4000mm, can the distance fluctuation between substrate 14 and the shower nozzle element 11 be arranged in 2mm or the littler scope in liquid droplet distribution operating period in substrate 14.

Usually, along continuous straight runs will be fixed in the manufacturing installation by the plane that the X/Y direction is determined.Yet, if substrate 14 has littler size, such as 500 * 500mm or following, do not need along continuous straight runs to be fixed in the manufacturing installation so by the plane that the X/Y direction is determined, but can retrain it along the assigned direction that is suitable for forming wiring chart board or electronic panels (such as, incline direction).

The structure of shower nozzle element 11 is described now in conjunction with Fig. 4 A and 4B.Shown in Fig. 4 A and 4B, optical detection element 32 reads the image information in the substrate 14.This optical detection element 32 next-door neighbours distribute the shower nozzle 33 of drop 43.In the structure shown in Fig. 4 A and 4B, the impact point 44 of drop 43 of the focus of optical axis 41 and optical detection element 32 and ejection from shower nozzle 33 aligns along a direction.

Optical detection element 32 as shown in Figure 3 and the relation of the position between the shower nozzle 33 can accurately be calibrated with shower nozzle calibrating element 34 and shower nozzle calibration control element 31.In addition, optical detection element 32 comprises as CCD (charge coupled device) camera and lens.

In structure as shown in Figure 3, the image information that 36 identifications of image recognition element detect by optical detection element 32.Image recognition element 36 will be transformed into binary data as contrast, then calculate the centre of equilibrium of specific part in the binary contrast.Specifically, the high-resolution picture recognition device VX-4210 that can use Keyence company to make.The image information that position detecting element 38 usefulness pattern recognition devices 36 obtain provides the positional information in the substrate 14.By use the measurement mechanism of the scanning element 37 of X/Y direction is housed,, can obtains this positional information such as linear encoder.According to the image information that the positional information and the optical detection element 32 of position detecting element 38 detected substrates 14 detects, position correction control element 39 carries out position correction by the moving of scanning element 37 of corrected X/Y direction to substrate 14.Drive shower nozzle 33 by shower nozzle control/drive unit 40, whereby drop-coated is overlayed in the substrate 14.By above-mentioned each control procedure of control computer 35 controls.Though in order to clearly illustrate that optical detection element 32 is injected in the drop shown in Fig. 4 B on the surface of substrate with shower nozzle 33 with becoming diagonal, in actual use, can from the vertical substantially direction in the surface of substrate with droplet jet to substrate.

In exemplary embodiment, can as shown in Figure 3 shower nozzle element 11 be fixed on the given position and make substrate 14 motion campaign with the scanning element 37 of X/Y direction below shower nozzle element 11, perhaps can as shown in Figure 2 substrate 14 be fixed on the given position and shower nozzle element 11 is moved above substrate 14 along the X/Y direction.

For example, equidimension is such as substrate～large-size of 200 * 200mm during such as 2000 * 2000mm or above substrate in the mill, the structure that the preferred shower nozzle element 11 that makes substrate 14 be fixed on the given position and make substrate 14 tops moves along the directions X and the Y direction of two quadratures, along the X/Y direction with the liquid droplet distribution of solution in substrate 14.

If the size of substrate is 200 * 200mm or littler, can designs the long shower nozzle element of shower nozzle so and be used in this substrate, distributing drop with a plurality of nozzles and 200mm.Because this shower nozzle element can cover the base length of 200mm, so with liquid droplet distribution to substrate the time, the shower nozzle element can be only moves above substrate rather than moves along two orthogonal directions (such as, X/Y direction) along a direction (such as, directions X).So this scheme can improve the productivity ratio of producing wiring chart board or electronic panels in batches.

On the other hand, if the size of substrate surpasses 200 * 200mm, consider that so cost and technology are difficult to make the shower nozzle element of the nozzle with a plurality of whole width that can cover substrate.In this case, preferred use can distribute the shower nozzle element 11 of the drop of solution along the directions X of two quadratures and Y direction being used to of moving.

Usually, large-size that can be by will being formed with electronic device on it cuts into smallclothes manufacturing such as 400 * 400mm and 2000 * 2000mm or bigger substrate and has the wiring diagram substrate or the electronic substrate of reduced size such as 200 * 200mm.Therefore, the preferred use shower nozzle element 11 that can move along the directions X and the Y direction of two quadratures is to be distributed in solution droplets on the suprabasil precalculated position.

Can prepare the solution that comprises electronic functional material in the solution by conductive fine particle is dispersed in, then this solution is distributed into drop 43.For example, the preferred use comprises metal fine such as the solution of Au, Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn, Ga and/or In or comprise the fine grain solution of the metal oxide of above-mentioned metal.

Especially, by using metal fine,, can obtain to have more low resistance and the more circuit pattern preferably of high corrosion-resistant such as Au, Ag and Cu.

The solution that comprises conductive fine particle can be made the aqueous solution and oil solution.

For example, can preparation as described below comprise as the water of dispersant and the aqueous solution of dispersion small conductive fine particle within it.

At first, be dissolved in water-soluble polymer in the metal ion aqueous solution (such as chlorauride, silver nitrate) and add alkanolamine, stir simultaneously such as dimethylaminoethanol.Solution is carried out the processing to a few minutes in tens seconds with the reducing metal ion, be deposited so have the metal fine of 0.5 μ m (500nm) or following average diameter.Then, remove chloride ion or nitrate ion, then concentrate/dry to obtain to comprise the solution of concentrated conductive fine particle by milipore filter.Can water, alcoholic solution or be used for sol gel process binding agent (such as, tetraethoxy-silicane, triethoxy-silicane) effectively dissolving this comprise the solution of concentrated conductive fine particle.

In addition, can preparation as described below comprise as the oil of dispersant and the oil solution of dispersion small conductive fine particle within it.

At first, in the water-soluble solubleness organic solvent of oil-soluble polymers (such as acetone), then mix with the metal ion aqueous solution.Though this mixture is a heterogeneous system, when stirring the mixture when adding alkanolamine, the metal fine that is dispersed in the polymer is extracted in the oil phase.By concentrating/drying composite, can obtain to comprise the solution of concentrated conductive fine particle.For example, can use solvent, such as aromatic compound, ketone compounds or ester type compound or resin such as mylar, epoxy resin, acrylic resin or polyurethane resin effectively dissolving comprise the solution of concentrated conductive fine particle.

Though the density maximum of the conductive fine particle in this solution can be 80wt%, can suitably dilute the solution that this comprises conductive fine particle according to application target.

For example, in comprising the solution of conductive fine particle, the conductive fine particle that comprises in it typically is 2wt%～50wt%, and surfactant that comprises in it and resin are 0.3wt%～30wt%, and its viscosity is 3～30 centipoises (centipoise).

In exemplary embodiment, by using any in the above-mentioned material, the volatile component by in gasification (evaporation) solution deposits solid constituent in substrate, thereby formation makes wiring diagram and electronic device.This solid constituent can become suprabasil wiring diagram or electronic device, and solvent (volatile component) is used as the carrier use that distributes above-mentioned solution with ink ejecting method.

In addition, the solution that is distributed into drop 43 can comprise, such as, I-VII family semiconducting compound such as CuCl, II-VI family semiconducting compound such as CdS, CdSe etc., III-V family semiconducting compound such as the semiconductor crystal of InAs, IV family, metal oxide such as TiO ₂, SiO, SiO ₂Such as any such as in phthalocyanine, the azo-compound of fluorescent material, fullerene, dendrimer, dendritic polymer etc. and organic compound, or comprise the solution of nano particle of the composite material of above-mentioned material in, inorganic compound.

The nano particle that can be used for exemplary embodiment typically has 0.0001 μ m～0.2 μ m, and (particle diameter of 0.1nm～200nm) further preferably has 0.0001 μ m～0.05 μ m (particle diameter of 0.1nm～50nm).For example, more particularly, determine particle diameter such as being dispersed in the fine grain stability in the solution that makes, the possibility of during distribution (or injection), blocking and the surface roughness of substrate by considering some factors.

Should be noted that in protection scope of the present invention, can carry out chemistry or physical treatment, perhaps can also add auxiliary agent, such as surfactant, dispersion stabilizer or antioxidant to the surface of this nano particle.For example, can use the colloid chemistry method, such as THORP (cultivation is handled in thermal oxidation again) the method synthesis of nano particle of reverse micelle method or heat.

In exemplary embodiment, the solution that comprises nano particle is dispersing liquid preferably, and wherein nanoparticulate dispersed is that liquid phase and its decentralized photo are in the emulsion (O/W emulsion) of oil phase in its continuous phase.

Though this liquid phase mainly is a water, can in water, add water-miscible organic solvent.As for water-miscible organic solvent, can be for example ethylene glycol, propylene glycol, butanediol, diethylene glycol (DEG), triethylene glycol, polyethylene glycol (#200, #400), glycerine, the alkyl ether of above-mentioned dihydroxylic alcohols, N-methyl pyrrolidone, 1,3-dimethyl-imidazolinone, sulfo-diethylene glycol (DEG), 2-Pyrrolidone, sulfolane, methyl-sulfoxide, diethanol amine, triethanolamine, ethanol and isopropyl alcohol.The content of the water-miscible organic solvent that uses in water dispersion medium is preferably 30wt% or following, and 20wt% more preferably.

Though be included in the content range of the nano particle in the dispersing liquid depend on be formed on suprabasil film or the layer type and/or the expection film (layer) thickness and change, but it is preferably 0.01wt%～15wt%, and 0.05wt%～10wt% more preferably.If the content of nano particle is too little, wiring diagram substrate or electronic substrate do not have the functional of enough degree so, and if the content of nano particle too big, distributing with ink ejecting method or can not obtain jetting stability during liquid droplets so.

In addition, preferably comprise in the dispersing liquid of solution of nano particle and comprise surfactant and the solvent that is used for the dispersing nanometer particle.As for surfactant, can use such as anion surfactant (such as, the ammonium salt of dodecyl sodium sulfate, neopelex, sodium laurate, polyoxyethylene alkyl ether sulfuric acid) and non-ionic surface active agent (such as, polyoxyethylene alkyl ether, polyxyethylated ester, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene alkyl phenyl ether, polyoxyethylene alkyl amine, polyoxyethylene alkylamide).This reagent can use separately, also can mix use in two or more ground.

The scope of the typical amount of the surfactant in the whole solution is 0.1wt%～30wt%, and 5wt%～20wt% more preferably.If the amount with respect to this scope surfactant is too little, water-oil may take place in moisture dispersing liquid so separate, so when drop was assigned with, pattern can not be formed in or be coated in the substrate by adequate relief.On the other hand, if too big with respect to the amount of this scope surfactant, the viscosity in the so moisture dispersing liquid becomes too high, thereby reduces the dispersive property of drop.

As for the solvent that is used for the dispersing nanometer particle, can use, for example, the volatile liquid of toluene, n-hexane, pyridine, chloroform.The weight range that is used for the solvent of dispersing nanometer particle is approximately 0.1wt%～20wt%, and 1wt%～10wt% more preferably.If be used for the amount of solvent of dispersing nanometer particle with respect to this scope too little, the quantitative change that can be contained in the ultrafine particle in the moisture dispersing liquid so gets less.On the other hand, if be used for the amount of solvent of dispersing nanometer particle with respect to this scope too big, water-oil may take place in moisture dispersing liquid so separate.

In addition, organic compound can be dissolved in the dispersing liquid.As for organic compound, can use, for example, oxidation trioctylphosphine phosphorus (TOPO), thiophenol, photochromic compound (spiro-pyrans, fulgide), charge transfer type compound and be subjected to electron compound, wherein organic compound preferably at room temperature is a solid.In this case, the organic compound in the dispersing liquid with respect to the amount of nano particle be 1/10000wt% or more than, and more preferably about 1/1000wt%～10 times of wt%.

Should be noted that in protection scope of the present invention, can in suspension, add auxiliary agent, such as surfactant, dispersion stabilizer or antioxidant, polymer or with the material of coating/drying process gelling.

With ink ejecting method the above-mentioned solution that comprises nano particle is injected in the substrate, in substrate, forms wiring diagram or electronic device thereby then carry out drying.

In exemplary embodiment, for example, by carrying out drying, can carry out drying under reduced pressure as required then in air-dry 1 hour or above (more preferably 3 hours or more than) under the temperature of-20～120 ℃ (more preferably about 0～80 ℃) and under the normal pressure.Reduced pressure can be 1 * 10 ⁵Pa or following, and more preferably about 1 * 10 ⁴Pa or following.In addition, drying under reduced pressure can typically carry out under-20～110 ℃ temperature, and further preferably carries out under about 0～70 ℃ temperature.In addition, the time that is used for drying under reduced pressure is about 1～24 hour.

Though the thickness of the film of the nano particle that obtains by said method is not subject to any particular value, the thickness of this film is generally the diameter of nano particle to 1mm, and the diameter that further preferably is about nano particle is to 100 μ m.In addition, the nano particle in the preferred nanometer particle film distributes in the mode that surpasses a certain density.So the typical equispaced (distance) between the nano particle in the nanoparticle aggregate thing is for being no more than 10 times of particle diameter of nano particle, and more preferably be no more than 2 times of particle diameter of nano particle.If intergranular equispaced is too big, nano particle can not be brought into play aggtegation so.

In addition, the solution that is distributed into drop 43 can be the solution that comprises organic semiconducting materials.For example, this organic semiconducting materials can be pi-conjugated material, and this material can be a polypyrrole, such as polypyrrole, poly-(N-substituting group pyrroles), poly-(3-substituting group pyrroles), poly-(3, the disubstituted pyrroles of 4-); Polythiophene is such as polythiophene, poly-(3-substituting group thiophene), poly-(3, the disubstituted thiophene of 4-), polyphenyl bithiophene; Polyisothianaphthene is such as polyisothianaphthene; Polythiophene base ethene is such as polythiophene base (チ ェ ニ レ Application) ethene; Poly-(to phenylene ethene) is such as poly-(to phenylene ethene); Polyaniline is such as polyaniline, poly-(N-substituting group aniline), poly-(3-substituting group aniline), poly-(2,3-substituting group aniline); Polyacetylene is such as polyacetylene; Poly-diacetylene is such as poly-diacetylene; Poly-azulenes is such as poly-azulenes; Poly-pyrene is such as poly-pyrene; Polycarbazole is such as polycarbazole; Poly-(N-substituting group carbazole); Poly-selenium benzene is such as poly-selenium benzene; Poly-furans is such as poly-furans, paracoumarone; Poly-(p-phenylenediamine (PPD)) is such as poly-(p-phenylenediamine (PPD)); Poly-indoles is such as poly-indoles; Poly-pyridazine is such as poly-pyridazine; Polyacene, such as four acenes, five acenes, six acenes, seven acenes, dibenzo five acenes, four benzos, five acenes, pyrene, dibenzo pyrene, bend, the derivative of perylene, coronene, pentacene, ovalene, four pentacenes, circumanthracene, polyacene, such as triphen dioxazines, triphen dithiazine, six acenes 6, with N, S, O or functional group 15-benzoquinones such as the carbon atom preparation of carbonyl substituted polyacene; And polymer, such as Polyvinyl carbazole, polyphenylene sulfides, polyvinylene sulfide.

In addition, the solution that is distributed into drop 43 can be made by the oligomer with repetitive.For example, can use the thiophene that constitutes by six monomers, such as α-property thiophene, α, ω-dodecyl-α-property thiophene, α, the derivative of ω-two (3-butoxy propyl group)-α-property thiophene and styryl benzene.

In addition, the solution that is distributed into drop 43 can be by making such as following material: metal phthalocyanine, such as copper phthalocyanine, fluoro copper phthalocyanine; Naphthalenetetracarbacidic acidic diimide, such as naphthalene 1,4,5,8-tetracarboxylic acid diimide, N, N '-two (4-trifluoromethyl benzyl) naphthalene 1,4,5,8-tetracarboxylic acid diimide; N, N '-two (1H, 1H-perfluoro capryl), N, N '-two (1H, 1H-perfluoro butyl), N, N '- dioctyl naphthalene 1,4,5, the derivative of 8-tetracarboxylic acid diimide, naphthalene 2,3,6,7-tetracarboxylic acid diimide and condensed ring tetracarboxylic acid diimide, such as comprising anthracene 2,3,6, the anthracene tetracarboxylic acid diimide of 7-tetracarboxylic acid diimide; Fullerene is such as C60, C70, C76, C78, C84; Carbon nano-tube is such as SWNT (Single Walled Carbon Nanotube); And dye composition, such as merocyanine dyes, half cyanine dye.

As for this pi-conjugated material, the preferred use such as following compound: have thiophene, ethenylidene, thienyl ethene, inferior phenylene ethylene, at least two kinds in phenylene and its substituting group of deriving as repetitive and have the oligomer of the repetitive of 4～10 these compounds; Polymer with repetitive of 20 or more a plurality of these compounds; Aromatic compound with a plurality of rings of polycondensation; Fullerene; Tetracarboxylic acid diimide with condensed ring; And metal phthalocyanine.

Other organic semiconducting materials that can be used for drop 43 can be the organic molecule compounds, such as tetrathiafulvalene (TTF)-tetra cyanogen subculture dimethyl benzene quinone (TCNQ) compound, divinyl tetrathiafulvalene (BEDTTTF)-perchloric acid compound, BEDTTTF-Surgidine and TCNQ-Surgidine.In addition, the solution that is distributed into drop 43 can be as the σ conjugated polymer, such as polysilane, poly-germane.

At the preferred organic semiconducting materials that mainly constitutes that uses in the exemplary embodiment by polymer with the repetitive shown in general formula (1).Below this organic semiconducting materials and synthetic method thereof are described.

General formula (1)

For example, the carboxyl compound shown in general formula (2) with as general formula (3) thus shown in the acquisition that reacts of Phosphorus compound have the polymer shown in general formula (4) of a plurality of repetitives that comprise carbon-to-carbon double bond.

General formula (2)

General formula (3)

General formula (4)

In general formula (2), A ¹And A ²Representative is substituted or unsubstituted monocycle or propinyl or the different propinyl that encircles more; R ¹Represent hydrogen, substituted or unsubstituted alkyl and substituted or unsubstituted aryl; V representative-O-,-S-, NR2-(the substituted or unsubstituted monocycle of propinyl of the R2 substituted or unsubstituted monocycle of representative or many rings or the different propinyl of many rings), the n representative is greater than zero (n 〉=0).

In general formula (3), A ³And A ⁴Representative is substituted or unsubstituted monocycle or propinyl or the different propinyl that encircles more; R3 is for hydrogen, substituted or unsubstituted alkyl, aryl or iso-aryl; W representative-O-,-S-,-NR4-(propinyl of the R4 substituted or unsubstituted monocycle of representative or many rings, the different propinyl of perhaps substituted or unsubstituted monocycle or many rings); The m representative is greater than zero (m 〉=0); X represents PO (OR5) 2 (R5 represents than low alkyl group) or P (R6) 3+Y-(R6 substituted or unsubstituted aryl of representative or substituted or unsubstituted alkyl); And Y represents halogen atom.

Though the matrix compounds that can be dissolved in equably in the nonaqueous solvents can be used to prepare organic semiconductor compound, consider alkalescence and form the carbonic acid phosphonate ester, preferably use this matrix compounds, such as metal alkoxide, metal hydride, organo-lithium compound etc.

For example, can use potassium tert-butoxide, sodium tert-butoxide, tert-butyl alcohol lithium, 2-methyl-2-butanols potassium, 2-methyl-sodium butoxide, sodium methoxide, caustic alcohol, potassium ethoxide, potassium methoxide, sodium hydride, hydrofining, lithium methide, ethyl-lithium, propyl lithium, n-BuLi, s-butyl lithium, tert-butyl lithium, phenyl lithium, lithium amide and diisopropyl amide lithium.

The solvent that need be used for the dissolved matrix compound with the dissolved matrix compound, and has solubility preferably to matrix compounds as stable state solution.In addition, this solvent need have the performance that the solubility of the macromolecular compound in the reaction dissolvent that does not cause forming macromolecular compound within it reduces, and this solution needs to dissolve the macromolecular compound that makes effectively.According to the performance of matrix compounds and macromolecular compound, this solvent can be ethanol, ether, amine, hydrocarbons solvent etc.

For example, have matrix compounds and equably the example of the solution of the solvent of dissolved matrix compound have: sodium methoxide/methanol solution, caustic alcohol/ethanolic solution, potassium tert-butoxide/2-propanol solution, potassium tert-butoxide/2-methyl-2-propanol solution, potassium tert-butoxide/tetrahydrochysene furan is fed solution, potassium tert-butoxide/dioxanes solution, n-BuLi/hexane solution, lithium methide/ethereal solution, tert-butyl alcohol lithium/tetrahydrofuran solution, LDA/cyclohexane solution, two front three silicon alkylamides potassium/toluene solutions etc.In this solution some are commodity.

Consider gentle reaction condition and easy operating, preferably use metal alkoxide solution.Consider solubility, the easy operating of the polymer that makes, the efficient of reaction rate, the further preferred ethereal solution that uses tert-butyl alcohol metal, and further preferably use the tetrahydrofuran solution of potassium tert-butoxide.

The matrix compounds solution of solution with the stoichiometric Phosphorus compound of equivalent and aldehyde compound and the matrix compounds of Phosphorus compound with twice or above mole and aldehyde compound can be mixed for polymerization reaction, so can preferably obtain to have the heavy polymer of littler range of molecular weight distributions.

Though the content of matrix compounds can be arranged to equate with the amount of the Phosphorus compound that is used for polymerization reaction, can use excessive Phosphorus compound to be used for polymerization reaction, this is because excessive Phosphorus compound can not exert an influence to reaction.

Can be by in the solution of Phosphorus compound and aldehyde compound, adding base fluid, carrying out this polymerization reaction by the solution of Phosphorus compound of interpolation and aldehyde compound in base fluid or by the solution that in reaction system, adds base fluid and Phosphorus compound and aldehyde compound simultaneously.Therefore, can add this solution with any order.

Carry out the polymerization reaction time of this polymerization reaction according to the expection molecular weight setting of the reaction rate of monomer and the polymer that makes.0.2～30 hour polymerization reaction time for example, preferably is set.In addition, can locate at any given time, in reaction solution, add the terminator that is used to stop polymerization reaction such as before beginning to react, between the stage of reaction and reaction back.

This polymerization reaction can be carried out under the condition of control reaction temperature not, but at room temperature can carry out in mode preferably.Yet, can improve this reaction temperature to improve reaction efficiency, perhaps can reduce this reaction temperature so that gentle reaction condition to be set.

Now the example to the polymer that is preferred for the organic semiconducting materials in the exemplary embodiment describes.Yet, also can use other polymer in the protection range of the present invention.

Polymer is determined as follows.With gel dialysis chromatography (GPC) number-average molecular weight (Mn), weight average molecular weight (Mw) and molecular weight distribution (Mw/Mn) are measured, and based on using monodisperse polystyrene as UV (ultraviolet) absorptivity and the residual quantity refractive index of benchmark polymer the polymer as the polystyrene compound that makes to be calculated.

The polymer of exemplary organic semiconducting materials is as described below to be prepared.Specifically, the dialdehyde of 0.852g (2.70mmol) that will be shown in chemical formula (5) and the bisphosphate of the 1.525g (2.70mmol) shown in chemical formula (6) are put into the flask of 100ml, then replace with nitrogen, the oxolane with 75ml adds in the flask then.Then, the dm-3 tetrahydrofuran solution that will have the 6.75ml (6.75mmol) of the potassium tert-butoxide of 1.0mol splashes in the flask, then at room temperature solution is stirred 20 hours.Then, Phenylphosphine acid esters and benzaldehyde are added in the flask, then solution was stirred 2 hours 30 minutes.Then, the acetate with 1ml adds in the flask with end reaction, then water rinse solution.After removal of solvent under reduced pressure, residue is dissolved in the methyl alcohol of the oxolane of 15ml and 80ml, then with its precipitation and purify to obtain the polymer of 1.07g shown in chemical formula (7).

Chemical formula (5)

Chemical formula (6)

Chemical formula (7)

The polymer that makes that is used for molecular weight and molecular weight distribution determination has 73% productive rate, 104000 weight average molecular weight (Mw), 36000 number-average molecular weight (Mn), 2.89 molecular weight distribution (Mw/Mn) and the number of repeat unit of 63 polymer.

For example, this solution with comprising organic semiconducting materials can form the OTFT shown in Fig. 6 and 7.This OTFT can be as top lock type or end lock type.

In the lock type of top, OTFT comprises and is formed at substrate such as source electrode on the organic semiconductor layer on the paper base material and drain electrode, and grid is formed on source electrode, drain electrode and the organic semiconductor layer through gate insulation layer.

In end lock type, OTFT comprises and is formed at suprabasil grid and gate insulation layer and is formed at the organic semiconductor layer on the gate insulation layer and is formed at source electrode and drain electrode on the organic semiconductor layer.

Figure 6 shows that the example of the OTFT of top lock type.As shown in Figure 6, form organic semiconductor layer 8 on such as paper base material, then on organic semiconductor layer 8, form the source electrode 4 (as first electrode) that is electrically connected and 5 (as second electrodes) that drain in substrate 10.In addition, form gate insulation layer 6 on source electrode 4, drain electrode 5 and organic semiconductor layer 8, form grid 7 (as third electrode) then on gate insulation layer 6, wherein grid 7 is at source electrode 4 with drain between 5.Voltage is applied to be applied on the grid 7 in source electrode 4 and the drain electrode 5 and with voltage is used for oxide-semiconductor control transistors.

Figure 7 shows that the example of the OTFT of end lock type.As shown in Figure 7, form grid 7 on such as paper base material, then on grid 7, form gate insulation layer 6 and organic semiconductor layer 8 successively in substrate 10.Then, on organic semiconductor layer 8, form the source electrode 4 and the drain electrode 5 that are electrically connected, then on organic semiconductor layer 8, form sealant 9.Voltage is applied to be applied on the grid 7 in source electrode 4 and the drain electrode 5 and with voltage is used for oxide-semiconductor control transistors.

In addition, the solution that is distributed into drop 43 can comprise the material as organic EL (electroluminescence).This solution can be made up of solvent and the dyestuff that is used for RGB (red, green, blueness).For example, solvent is detergent alkylate/dichloro-benzenes (1/1 a volume ratio), and orchil is poly-fluorenes/perylene dyes (98/2 weight ratio), and green colouring material is poly-fluorenes/coumarine dye (weight ratio of 98.5/1.5), and blue dyes is poly-fluorenes.

In addition, the solution that is distributed into drop 43 can be the solution that comprises low-molecular-weight organic EL Material, polymer organic EL material and polyvinylcarbazole, and this solution is dissolvable in water benzene derivative, polyphenylene ethylene (polyparaphenylene ethene derivatives) and polyphenylene derivative.For example, this organic EL Material can be rubrene, perylene, 9,10-dibenzo triphen, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and polythiofuran derivative.

In exemplary embodiment, preferred solution comprises solvent, such as the benzene derivative with 150 ℃ or above boiling point.For example, this solvent can be o-dichlorohenzene, m-dichlorobenzene, 1,2,3-trichloro-benzenes, ortho-chlorotolu'ene, parachlorotoluene, 1-chloronaphthalene, bromobenzene, adjacent dibromobenzene and 1-dibromine naphthalene.When selecting solvent for use, preferably consider to suppress the volatilization or the gasification of solvent.In addition, when selecting solvent for use, preferably consider the bigger solubility of aromatic compound.In addition, preferred solution comprises detergent alkylate as solvent, and wherein detergent alkylate can be the mixture of isomers as dodecyl benzene or dodecyl benzene.

This solvent preferably has 300 ℃ or above boiling point and 6 centipoises or above viscosity (locating at 20 ℃).Solution can comprise a kind of solvent, but preferably includes volatilization or the gasification of another solvent to suppress solvent effectively.In addition, because except that detergent alkylate, above-mentioned solvent has less relatively viscosity, thus preferably by in solution, add another solvent with the viscosity adjustment of above-mentioned solvent to set-point.

In exemplary embodiment, with above-mentioned solution being distributed into substrate such as the drop on the paper base material as Fig. 2 or device shown in Figure 3, then by in substrate, forming functional layer (or film) under the fixed temperature substrate being handled, should be set to be higher than temperature when in substrate, distributing drop to fixed temperature.Usually, preferably at room temperature with liquid droplet distribution in substrate, then substrate is heated to higher temperature.Can carry out this heating process, this is because the solid formation that volatilization by solvent or gasification or the temperature that reduces when distributing solution deposit can be because of the heating refuse, so can be formed uniformly functional layer or film in substrate.

In addition, when in substrate, forming functional layer or film, preferably under pressurized conditions, carry out this heating process.By this pressurized conditions is set, thereby can further suppress volatilization or the gasification refuse that further promote solid formation of solvent in heating process, so in substrate, can form more uniform functional layer or film.

In addition, after this heating process, can immediately substrate be arranged in the reduced pressure atmosphere and desolvate to remove rapidly.By this decompression technology, being separated of the composition in the solution that exists in the time of can being suppressed at concentrated solvent.

As mentioned above, by the volatile material in the gasification solution solid formation is deposited in the substrate and can in substrate, forms organic EL.So the solid formation in the solution is as light-emitting material, the solvent of being made by volatile material is used for solid formation is distributed in substrate as carrier, wherein carries out this distribution by ink ejecting method.

Figure 8 shows that the cutaway view of the display unit of using the organic EL Material in the exemplary embodiment.

As shown in Figure 8, electrode 23 and dividing wall 24 are formed at substrate 10 such as on the paper base material.Dividing wall 24 can be made by the organic photo material.Then, comprise the solution of above-mentioned organic EL Material, then desolvate, and, in by dividing wall 24 region surrounded, form organic EL layer 25 by the deposition solid composition by removing by distribution.In addition, on organic EL layer 25, form transparency electrode 26,, and on transparency electrode 26, form transparent panel 27 such as ITO (indium tin oxide).This transparency electrode 26 and transparent panel 27 can be made by transparent PET (polyethylene terephthalate) plate that has ITO (indium tin oxide) layer on a side of plate.

Use structure as shown in Figure 8, display unit can be along the light of the emission of the direction shown in the arrow 29 by organic EL layer 25 generations.In addition, preferably this display unit has pliability and lightweight.

In addition, being distributed into the solution of drop 43 can be by making as the parent material of the silex glass of semi-conductive insulating barrier or the material that is used for quartz glass.For example, this parent material can be poly-silazane (for example, the product of TonenGeneral Sekiyu K.K) and organic SOG (in spin on glass) material.

In addition, electrode can be made such as the conducting polymer that has the conductivity of enhancing by doping by material.For example, this conducting polymer can be the polyaniline of conduction, the polypyrrole of conduction, the polythiophene (for example compound of polyethylene dioxythiophene and polystyrolsulfon acid) of conduction.In addition, the solution of the nano particle (size with 1nm～50nm) of dispersion platinum, gold or silver is preferred for forming the antenna radiation pattern of wiring diagram and RFID (radio-frequency (RF) identification) device that is used for illustrating subsequently.

In exemplary embodiment, the solution that is distributed into drop 43 can comprise any electronic functional material that is used to make wiring diagram or electronic device.So this electronic functional material can comprise electric conducting material described in the present disclosure and insulating material.

Next, describe in conjunction with Fig. 9 A, 9B and 10 pairs of shower nozzle elements 11 according to exemplary embodiment.

Shown in Fig. 9 A and 9B, fluid jetting head 11 comprises as piezoelectric element 46 and container 45 and nozzle 48.Piezoelectric element 46 produces vibrational energy and it is applied on the container 45 of storage solutions 47, thereby sprays drop 43 from nozzle 48.

Specifically, pulse signal is applied on the piezoelectric element 46 so that piezoelectric element 46 distortion shown in Fig. 9 A, thereby reduces the volume of container 45, so in container 45, pressure wave occurs.This pressure wave causes drop 43 to spray from nozzle 48.Fig. 9 B is depicted as the state that piezoelectric element 46 resiles, and therefore the volume of container 45 increases.

When drop 43 was sprayed from shower nozzle element 11, drop 43 had the shape shown in Figure 11 or 12, and wherein drop 43 is because of the power ejection of piezoelectric element 46 by electric energy being transformed into mechanical displacement and producing.Specifically, the flight drop class cylindricality that can have subcircular as shown in figure 11 or extend along the heading shown in the arrow F among Figure 12.Flight drop as shown in figure 12 can have the circular portion that diameter is d, and its length overall is length L, and wherein length L is less than three times of diameter d.

When by the effect that converts electrical energy into mechanical location drop being sprayed from the nozzle of shower nozzle with piezoelectric element, can according to from piezoelectric element, be applied to solution (such as, liquid) pressure on is determined the shape of drop, and wherein this pressure can change in time and have different numerical value.

Be used under specified criteria at the shower nozzle that uses piezoelectric element (such as, when driving pulse voltage) spraying drop, the ejection drop can have subcircular or have the class cylindricality of circular portion, and the length that wherein sprays drop is no more than three times of diameter of the circular portion shown in Figure 11 and 12.

In this situation, this ejection drop stabilized flight uninterruptedly, wherein the flying speed of drop can be 5m/s～12m/s for example.

In exemplary embodiment, the solution that shower nozzle can be used for comprising electronic functional material is distributed in the substrate, and has at the flight drop and to form wiring diagram or electronic device under the condition of shape shown in Fig. 11 or 12.

If the allocation situation of shower nozzle departs from the expection situation as shown in Figure 11 or 12, can carry out following adjusting technology so.Specifically, ejection comprises the solution of electronic functional material or equivalent liquid (considering viscosity, surface tension) from shower nozzle, then sprays the shape of solution (or flight drop) with microscopic examination.Then, regulate Adjusting Shape with the drop that will fly to the anticipated shape shown in Figure 11 or 12 to being applied to driving pulse on the piezoelectric element.Regulate technology according to this, for the manufacturing installation in the exemplary embodiment is set the adjusting drive pulse signal, and it is applied to the drop that has above-mentioned anticipated shape with ejection on the piezoelectric element in the shower nozzle, wherein this adjusting drive pulse signal can be determined by pulse voltage, burst length and impulse waveform that set-point is set.

As described in Figure 10, solution 47 is introduced in the container 45 through filters 49, thereby this filter 49 can be arranged in the shower nozzle element 11 and plays a role in filtering in the given position near nozzle 48.Thereby filter 49 can be captured the function deterioration that prevents to be formed at suprabasil wiring diagram or electronic device than the conductive fine particle in the solution or the bigger impurity particle of nano particle.Filter 49 can manufacture has tight size and simple structure, so shower nozzle element 11 can embed filter 49 as shown in figure 10 within it, has tight size so also shower nozzle element 11 can be manufactured.

For example, preferred filters 49 can be by making such as polytetrafluoroethylene or Teflon (registered trade mark) and polyacrylic material such as stainless steel order net or resin material.In other words, filter 49 should be made by the material that has effective corrosion resistance for the solution in the exemplary embodiment.In addition, 30 times or above impurity (or impurity particle) of the fine grain diameter that is of a size of in the solution can be captured in the order footpath (or aperture) that has of filter 49.

Specifically, in exemplary embodiment, use comprise have 0.0001 μ m～0.2 μ m (solution of the fine particle of diameter of 0.1nm～200nm) (as electronic functional material), and further preferred use to comprise have 0.0001 μ m～0.05 μ m (the fine grain solution of diameter of 0.1nm～50nm).Therefore, if having to capture, filter 49 has 0.003 μ m～0.6 μ m, the order footpath (or aperture) of the impurity of 0.003 μ m～1.5 μ m or above size more preferably, filter 49 can be captured the impurity with this size effectively so, so nozzle 48 can not blocked by impurity.Usually, the strainability of filter (or removing performance) can be measured with absolute clearance or average removal rate.In exemplary embodiment, filter 49 can have the order footpath determined according to the absolute clearance size of captive impurity (can).

Be embedded in the structure in the shower nozzle element 11 though Figure 10 shows that filter 49, do not require that filter 49 is embedded in the shower nozzle element 11.In addition, should be noted that and in manufacturing installation, a plurality of filters to be set.If a plurality of filters are set up, a filter that is arranged in so near the position of nozzle 48 can have above-mentioned order footpath to filter or to remove the impurity of solution effectively.Except above-mentioned use converts electrical energy into the shower nozzle of piezoelectric element of mechanical displacement, filter 49 can be arranged on other shower nozzles similarly that use moving method of heat or bubble method.

Next, in conjunction with Figure 13 A～13C another shower nozzle is described.Figure 13 A～13C is depicted as the shower nozzle element 11a that uses bubble method, wherein by during short time (such as 1 μ s～10 μ s), liquid heat arrived higher temperature (such as, 300 ℃～500 ℃) and in liquid, generate bubble immediately, then drop is sprayed from nozzle with bubble effect.

For example, will be called edge shooter's type from the shower nozzle of the end of liquid container ejection drop.

For example, shower nozzle element 11a as shown in figure 13 has four nozzles.Can make shower nozzle element 11a by linking temperature-sensitive element device 66 and cladding system 67.Temperature-sensitive element device 66 has single electrode 69, common electrode 70 and is formed at heater element 71 on the silicon base by wafer process.

Shown in Figure 13 C, cladding element 67 has as groove 74 and recess 75.Groove 74 becomes the passage that is used to guide the solution that comprises functional material, and recess 75 is equipped with that the common fluid chamber is used to preserve will be through the solution of groove 74 guiding.

Cladding element 67 and temperature-sensitive element device as shown in FIG. 13A 66 are made up to form above-mentioned passage and common fluid chamber.When temperature-sensitive element device 66 and cladding element 67 are connected to each other, temperature-sensitive element 71 is arranged on and the corresponding position of passage.

In this structure, at the end formation nozzle 65 of passage, from then on the drop of solution sprays.Though nozzle 65 be shaped as rectangle, the shape of nozzle 65 can be circle.

In addition, in cladding element 67, form solution inlet port 76 with in the solution supply chamber that allows to use the feed element (not shown) solution is supplied to.

Consider the stability of droplet jet process, nozzle plate can be set on nozzle 65 with the nozzle form of nozzle diameter that expection is set and expection (such as, circle).This nozzle plate can be made such as Ni by material, and by forming high accuracy as the use galvanoplastics.Alternatively, can be by on as resin molding (substrate), carrying out the nozzle plate that laser technology formation has nozzle bore.

When drop 43 was sprayed from shower nozzle element 11a as shown in figure 13, drop 43 can have shape as shown in figure 14, and wherein drop 43 is ejected because of the power of the bubble of the heating effect generation of heater element.Specifically, the flight drop can have the nearly cylindricality of extending along the heading shown in the arrow F among Figure 14.This nearly cylindricality comprises having the circular portion that diameter is d, and its length overall is length L, wherein length L can be five times of diameter d or more than.

When the power of using the bubble that heating effect produced of heater element by bubble method makes drop spray from the nozzle of shower nozzle because of the living thermal effect of heater element, can determine the shape of drop according to the power on the solution (such as, liquid) of being applied to by bubble.

The shower nozzle that is used to spray the piezoelectric element of drop with use is compared, and uses the shower nozzle of bubble method to spray drop with high pressure, so the flying speed of drop is bigger relatively, such as 8m/s～18m/s.When the shower nozzle that uses heater element is used to spray the drop with specified criteria, the ejection drop can be the class cylindricality with circular portion, the length that wherein sprays drop be five times of diameter of circular portion or more than, and have as shown in figure 14 satellite droplets SD.Because satellite droplets SD also can so satellite droplets SD can clash into the suprabasil position of having been clashed into by the class cylindrical section of drop, thereby can form wiring diagram or electronic device exactly with bigger flying speed flight in substrate.

In exemplary embodiment, have under the condition of shape as shown in figure 14 at the flight drop, the solution that shower nozzle can be used for comprising electronic functional material is distributed in and forms wiring diagram or electronic device in the substrate.

If the allocation situation of shower nozzle departs from expection situation as shown in Figure 14, can carry out following adjusting technology so.Specifically, ejection comprises the solution of electronic functional material or equivalent liquid (considering viscosity, surface tension) from shower nozzle, then sprays the shape of solution (or flight drop) with microscopic examination.Then, regulate with the Adjusting Shape of the drop that will fly to as shown in figure 14 anticipated shape being applied to driving pulse on the heater element.Regulate technology according to this, for the manufacturing installation in the exemplary embodiment is set the adjusting drive pulse signal, and it is applied on the heater element in the shower nozzle to eject the drop with above-mentioned anticipated shape, wherein this adjusting drive pulse signal can be determined by pulse voltage, burst length and impulse waveform that set-point is set.For example, increase pulse voltage or burst length (or width) gradually so that the drop of anticipated shape to be set.

In exemplary embodiment,, a plurality of drop forms electronic device or wiring diagram thereby impacting substrate.So, if use shower nozzle with a plurality of nozzles, so can be in substrate effectively (such as, shorter time) form electronic device or wiring diagram.Though shower nozzle element 11a as shown in figure 13 comprises four nozzles, the number of nozzle can be adjusted to any fixed number of giving to strengthen the formation efficient of pattern.Yet, excessive if nozzle number increases, can increase the production cost of unnecessary shower nozzle element, and nozzle that the probability that blocks takes place is higher.Therefore, based on of the consideration of some factors, can determine the nozzle number in the shower nozzle element such as the production cost of device, the production efficiency of device etc.

Figure 15 shows that the shower nozzle of observing from nozzle 65 with a plurality of nozzles.Shown in Figure 16 and 17, the shower nozzle with a plurality of nozzle arrays can form nozzle component, and this nozzle component can be used for distributing various solution from the different spray nozzles array.In addition, can support this nozzle component with the saddle in the manufacturing installation.

Specifically, shown in Figure 16 and 17, nozzle component comprises as shower nozzle A, B, C and D.Each shower nozzle of A, B, C and D comprises nozzle 65.The solution that comprises all cpds (such as electronic functional material, conductive fine particle, nano particle) can spray from the nozzle 65 each shower nozzle A, B, C and the D.

In exemplary embodiment, can be coated in by the solution that will comprise electronic functional material and make electronic device etc. in the substrate.This solution can be various dissimilar solution.

For example, when dissimilar solution sprays, can more easily make device shown in Fig. 6 and 7 from the shower nozzle shown in Figure 15～17 by the different pattern of the corresponding solution of stacked one by one use in substrate.When stacked different pattern, can after the previous pattern of drying, formerly form pattern on the pattern.If formerly formed pattern on the pattern before the previous pattern of drying, these two patterns are easier to mix so, so can not accurately form pattern in substrate, this is not preferred.

Specifically, device shown in Fig. 6 and 7 can be made as follows: promptly form first pattern by ejection first solution in the shower nozzle of being supported by saddle in substrate, volatile material and dry first pattern then gasify, by forming second pattern, wherein after being used for the solution of each pattern, ejection make saddle move to initial position then by ejection second solution in the shower nozzle of saddle support.

At saddle that move not support shower nozzle and along assigned direction (such as, directions X, Y direction) in the manufacturing installation of mobile substrate, device shown in Fig. 6 and 7 can be made as follows: form first pattern by ejection first solution in the shower nozzle of being supported by saddle in substrate, volatile material and dry first pattern then gasify, then by ejection second solution in the shower nozzle of supporting by saddle and on first pattern, form second pattern, wherein after being used for the solution of each pattern, ejection make substrate move to initial position by substrate conveyor.Though this substrate conveyor is not presented in the manufacturing installation among Fig. 2, substrate conveyor can be set, such as roller conveyor or belt-type conveyer in as manufacturing installation.Use this structure, can in substrate, form more pattern with high precision, can make thus and have more high-quality wiring diagram or electronic device.

In addition, above-mentioned substrate conveyor is used on the back side of substrate and forms pattern.Specifically, on the first surface of substrate, form after wiring diagram or the electronic device, with substrate conveyor overturn in the surface of substrate, on the second surface of substrate, form wiring diagram or electronic device then, can on each surface of substrate, form wiring diagram or electronic device thus.For example, can make the substrate upset such as the double face printing method that is used for ink-jet printer with known method.

If on two faces of substrate, form wiring diagram or electronic device by this, can make the electronic component of function so with enhancing.For example, can make electronic component having multi-functions, have more jumbo memory device, have the electronic component of complex function etc.In addition, if form wiring diagram or electronic device by this on two faces of substrate, what the size of substrate can be provided with so is littler.

In addition, if on two faces of substrate, form wiring diagram or electronic device, can make the electronic component of mixed type so with difference in functionality.For example, by go up at the first surface of substrate (or positive) form memory and the second surface (or back side) of substrate go up form telecommunication circuit and miniature antenna can make have memory, RFID (radio frequency identification) device of telecommunication circuit and miniaturization electric wire.

Now the RFID device is described, this device is preferably used the method manufacturing according to exemplary embodiment.

The RFID device can comprise memory, telecommunication circuit and miniature antenna, wherein can be by use next each element that forms of solution that has different electronic functional materials according to the method ejection of exemplary embodiment in substrate.

Traditionally, the RFID chip comprises substrate of making by semiconducter process and antenna and the electrode pattern of making by another technology, wherein needs integrated this substrate, antenna and electrode pattern to make the RFID chip.Usually, the complicated and technology consuming time of this arts demand.

Compare with this conventional method, can form or the required element of printing RFID device in substrate with relative simple technology according to the method for exemplary embodiment, in being to use this method can reduce the production cost of RFID device such as paper.

The application of this injection method is not limited to form chip device in substrate on such as cardboard, this injection method can be applied to other paper such as on the corrugated board that is used for clad plate on clad plate, to form " chip device ".

For example, the RFID device can be used for forming on the cardboard of clad plate or printing with this injection method.This RFID device can store goods historical data tracing back property information maybe.So the clad plate with RFID device can have the function of enhancing in using such as product management system and logic system as industry.

Usually, clad plate can form cube or the box with three-dimensional structure.If the RFID device will be formed on this cube, can preferably use ink ejecting method so, this be because shower nozzle not with condition that clad plate directly contacts under, the solution that comprises electronic functional material can be injected on cubical.On the other hand, use the imaging device of Carlson process to be difficult to have formation RFID device on the packing of three-dimensional structure.

Next, to describing at suprabasil formation pattern according to exemplary embodiment.Figure 18 shows that by using method to be formed at a suprabasil wiring diagram according to exemplary embodiment.

As shown in figure 18, by comprising the next wiring Figure 92 that in substrate, forms of fine grain solution to being pre-formed in suprabasil terminal pattern (or electrode pattern) 91 injections.Terminal pattern 91 can have as rectangle.In the drawings, draw for simplifying, to represent each point with the tangent mode of the point of another diagonal position.Yet, make the wiring diagram part that is used for actual product not have uncoated zone with higher density set-point (being provided with) in more multiple folded mode.

Figure 19 shows that by using method to be formed at a suprabasil device according to exemplary embodiment.As shown in figure 19, by spraying the solution that comprises electronic functional material and in substrate, form dot pattern 94 and form device being pre-formed between the suprabasil a pair of device electrode 93 of rectangle.

Yet above-mentioned wiring diagram or device may have the defective of improper discharge, and this may take place at terminal pattern 91 or device electrode 93 places during using wiring diagram or device.Describe below in conjunction with Figure 18 and 19 pairs of these improper discharges.

In exemplary embodiment, the wiring Figure 92 that will be formed by the dot pattern of the solution that comprises electronic functional material is arranged between a plurality of terminal patterns 91, similarly, the dot pattern 94 that will be formed by the dot pattern of the solution that comprises electronic functional material is arranged between the device electrode 93.

Typically, the combination of 93 one-tenth rectangular patterns of terminal pattern 91 or device electrode or rectangular patterns, this is economical because of rectangular shape to making.

Yet, because corner portions located 91C and 93C in electrode pattern 91 and the device electrode 93 have sharp edge, so electric field is concentrated at corner portions located 91C and 93C place.Therefore, when applying voltage between electrode, at corner portions located 91C and 93C place improper discharge can take place, so can not obtain to expect the device function of standard or be damaged at corner portions located 91C and 93C place.

Consider this phenomenon, in exemplary embodiment, the corner portions located in electrode pattern 91 and the device electrode 93 forms as chamfering shape (seeing Figure 20 and 21).Make this corner portions located become chamfering by regulation number of degrees c in machine drawing, or determine chamfering by regulation radius of curvature R XX in machine drawing.Typically, the size of chamfered part be approximately dot pattern diameter 1/2～1/5.That is to say,, electric field can not take place at the electrode place so concentrate if form the size of c2 μ m～c5 μ m or r2 μ m～r5 μ m at the corner portions located place of electrode.

So, thereby suppress concentrating of electric field by the sharp edge part of removing in the electrode, improper generating can not taken place, so wiring diagram or electronic device can keep its function preferably in the longer time.

Next, forming pattern according to exemplary embodiment at suprabasil another in conjunction with Figure 22 and 23 pairs describes.Wiring diagram shown in Figure 22 and 23 or electronic device are similar to wiring diagram or the electronic device shown in Figure 18～21.

In Figure 18～21, by to be pre-formed in suprabasil metallic film (such as, Al, Au, Cu) carry out photoetching technique, etching technique and make electrode pattern 91 or device electrode 93 form anticipated shape.On the other hand, in Figure 22 and 23, form electrode pattern 91 and device electrode 93 in the substrate by using method according to exemplary embodiment that solution is coated in.

That is to say, use the method identical, use the solution that comprises conductive fine particle material (such as Ag) to form electrode pattern 91 and device electrode 93 as the combination of point with forming wiring diagram and electronic device.This method has the advantage that can use the manufacturing installation shown in Fig. 2 and 3, and the advantage that can suppress the above-mentioned improper discharge that is partly caused by sharp edge.

Shown in Figure 22 and 23, form electrode pattern 91 and device electrode 93 with dot pattern and can make the corner portions located in electrode pattern 91 and the device electrode 93 automatically form chamfering shape by spraying the solution that is dispersed with metal fine in it, this is because each point forms the circle that does not have limit portion.

Though will be used to form the spot diameter of electrode pattern 91 and device electrode 93 in Figure 22 and 23 is expressed as greater than the spot diameter in wiring Figure 92 and the dot pattern 94, but have the identical shower nozzle of identical jet size by use, can in substrate, form the identical dot pattern that is used for electrode pattern 91 and device electrode 93 of spot size be used to connect up Figure 92 and dot pattern 94.

Wiring Figure 92 (as shown in figure 18) that is combined to form by point can form the bar paten that extends longitudinally, so also can form device (as shown in figure 19) with the dot pattern 94 with bar paten.By moving saddle 12 that shower nozzle element 11 is housed along the X/Y direction or can forming the bar paten (seeing Fig. 2 and 3) that extends along the direction parallel with the X/Y direction by move substrate 14 along the X/Y direction.During mobile shower nozzle element 11 or substrate 14, relatively change the position of the shower nozzle element 11 above substrate 14.So, because shower nozzle element 11 or substrate 14 are moved along the X/Y direction, forming so can control suprabasil pattern with straightforward procedure, the pattern of pinpoint accuracy reduces the cost that is used to form this pattern simultaneously thereby can form more in substrate.

The bearing of trend of this pattern can be arranged to parallel with each side of rectangular base or parallel with the matrix array of device to be formed, can carry out the location and/or the formation of figure with higher accuracy thus.

Next, the other method that pair is used to suppress above-mentioned improper discharge in conjunction with Figure 24～27 describes.

Shown in 24 and 25 figure, form wiring Figure 92 or dot pattern 94 to prevent the fall method of part of exposure angle with the corner portions located in coated electrode pattern 91 and the device electrode 93.Though wiring Figure 92 as shown in figure 24 is expressed as four row's dot patterns, wiring Figure 92 can be single dot pattern as shown in figure 26.Similarly, the device that is expressed as four row's dot patterns as shown in figure 25 can be single dot pattern as shown in figure 27.

In a word, concentrate the improper discharge that causes by the electric field that can suppress partly to locate, so wiring diagram or electronic device can keep its function preferably in the longer time because of sharp edge with the part of the sharp edge in dot pattern coated electrode pattern 91 and the device electrode 93.

Next, form at suprabasil another pattern according to exemplary embodiment in conjunction with Figure 28 and 32 pairs and describe.Figure 28 is the enlarged drawing of the corner portions located in the wiring diagram 1 shown in Figure 1B.As shown in figure 28, wiring diagram 1 can have corner portions located 1c, and when wiring diagram 1 was crooked on this corner portions located 1c place approximate right angle ground, this corner portions located 1c had and circularly concentrates to suppress above-mentioned electric field.

Now describe in conjunction with this sweep in pair wiring diagram of Figure 29～32.

Shown in Figure 29 for be formed at the example of suprabasil wiring diagram according to the ink ejecting method of exemplary embodiment by use.In this embodiment, with making wiring Figure 92 become 90 ° (right angles) crooked method combined spot pattern in middle reaches.That is to say that wiring Figure 92 forms the bar paten that extends along the direction parallel with two orthogonal directions (as shown by arrows), and according to the situation that the is provided with bending of wiring Figure 92.In this case, shown in the part A among Figure 29, the perimeter of the sweep among wiring Figure 92 becomes curve.By forming dot pattern with this method, the corner portions located among wiring Figure 92 does not form sharp edge, concentrates thereby can suppress electric field.

Shown in Figure 30ly be another example of having with wiring Figure 92 of the dot pattern of single formation with the formation of a kind of method.In this case, the corner portions located (part among Figure 30) among wiring Figure 92 does not form sharp edge yet, concentrates thereby can suppress electric field.

Shown in Figure 31 for be formed at the example of suprabasil electronic device according to the ink ejecting method of exemplary embodiment by use.

In this embodiment, by forming device spraying the solution that comprises electronic functional material with being combined to form between suprabasil device electrode 93 of rectangle or rectangle in advance.In this case, dot pattern 94 (or device pattern part) also forms bar shaped, and this bar paten is in 90 ° of device shape to obtain to expect of middle reaches bending.Shown in the part B among Figure 31, the corner portions located in the dot pattern 94 does not form sharp edge, concentrates thereby can suppress electric field.

Shown in Figure 32ly be another example of having with the electronic device of the dot pattern 94 of single formation with the formation of a kind of method.In this case, the corner portions located in the dot pattern 94 (the part B among Figure 32) does not form the sharp edge part yet.So, can suppress electric field and concentrate.

Shown in Figure 18,20,24,26,29 and 30, form the bar paten that extends longitudinally by the wiring Figure 92 that is combined to form that puts, shown in Figure 19,21,25,31 and 32, also form electronic devices with dot pattern 94 with bar paten.

By moving saddle 12 that shower nozzle element 11 is housed along the X/Y direction or can forming the bar paten that extends along the direction parallel with X/Y direction (seeing Fig. 2 and 3) by move substrate 14 along the X/Y direction.During mobile shower nozzle element 11 or substrate 14, relatively change the position of the shower nozzle element 11 above substrate 14.So, because shower nozzle element 11 or substrate 14 are moved along the X/Y direction, forming so can control suprabasil pattern with straightforward procedure, the pattern of pinpoint accuracy reduces the cost that is used to form this pattern simultaneously thereby can form more in substrate.

The bearing of trend of this pattern can be arranged to parallel with each side of rectangular base or parallel with the matrix array of device to be formed, can carry out the location and/or the formation of pattern with higher accuracy thus.

As mentioned above, apply the substrate of use paper or paper base material to form electronic device or the wiring diagram in the exemplary embodiment with the solution that comprises electronic functional material.This substrate can have surface property, and this can be owing to the cellulose fibre that constitutes paper.For example, because the interval between the varied in thickness of cellulose fibre and cellulose fibre that is stacked on another makes paper have concavity and convexity in its surface.This concavity and convexity are not preferred for making has more high-quality wiring chart board or electronic panels.

Consider this situation, in exemplary embodiment, the surface property of paper and the relation of wiring diagram quality are assessed.As mentioned above, though the thickness of cellulose fibre can change according to the kind of paper, the mono cellulose fiber can have the thickness of 5 μ m～20 μ m.Usually, paper technology comprises by beater and is used to impact the beating process of cellulose fibre with the softening fibre cellulose fiber.Therefore, can make paper products less than the cellulose fibre of the thickness of 5 μ m～20 μ m with thickness.Usually, can be with the beating process manufacturing by the paper products of making such as cellulose fibre with 4 μ m～10 μ m thickness.

In exemplary embodiment, be deposited as dot pattern by the solid formation in the solution that will have electronic functional material and on the surface of the paper made from this cellulose fibre, form wiring diagram or electronic device.Therefore, the surface property of paper can influence the quality of dot pattern, such as the circularity standard of point.

Consider this situation, in exemplary embodiment, the relation between the quality of the surface roughness of paper and wiring diagram or electronic device is carried out following assessment.As mentioned above, paper has and can be determined by cellulose fiber peacekeeping coating, can influence the surface property that pattern forms situation, such as concavity and convexity.

As described below, prepare paper by the amount of adjusting fiber thickness, coating, thereby on each paper, form wiring diagram as shown in figure 26 with different surfaces performance.Endurance test by sensory evaluation's method and wiring diagram is assessed this wiring diagram.

In this paper technology, use method of roll coating that coating is coated on the paper, wherein one of paper whole is applied by coating.Though coating can be coated in by spraying method on whole of paper, coating be coated on the paper equably with method of roll coating.In addition, though can coating be coated on the paper, in the shorter time, coating is coated on the paper with method of roll coating with ink ejecting method.

Have as Fig. 9 and piezoelectric element shown in Figure 10 and shower nozzle that nozzle plate is set thereon by use to form wiring diagram on paper, wherein nozzle plate electricity consumption forming technique is formed and is had the thickness of 20 μ m by nickel (Ni).

In addition, this shower nozzle is provided with 256 nozzles, and the density of nozzle is set to 180dpi (dots per inch), and each nozzle has diameter (or the 314 μ m of 20 μ m ²Area).

The formulations prepared from solutions that is used for exemplary embodiment becomes to comprise the aqueous solution of collargol, and its preparation process is as described below.

At first, DISPERBYK  190 (BYK-Chemie GmbH, the solid concentration ratio of 40 mass%) and the ion exchange water of 420.5g of 23.3g are put into 2 liters Kolben.Kolben is put into bain-marie, then stir dissolved down up to DISPERBYK  at 50 ℃.Then in above-mentioned solution, add the silver nitrate of the 100g in the ion exchange water that has been dissolved in 420.5g while stirring, then stirred 10 minutes down at 70 ℃.Then, in above-mentioned solution, add the dimethylaminoethanol of 262g.The color of liquid becomes black rapidly, and the temperature of liquid is elevated to 76 ℃.Place liquid by original state.When the temperature of liquid dropped to 70 ℃, continuous stirring liquid was 2 hours under this temperature.So acquisition shows the aqueous solution of luteotestaceous collargol.

The reaction liquid that makes transferred in 1 liter the plastic bottle, then this bottle was placed 18 hours in 60 ℃ thermostatic chamber.3 liters the stainless steel cup structure ultrafiltration system that has the pipe connector that is connected with each other with silicone tube with ultrafiltration module AHP1010 (trade name of Asahi Kasei company, 50000 molecular cut off, 400 filters), magnetic pumping with in its underpart.

The reaction liquid of placing 18 hours in 60 ℃ thermostatic chamber is put into stainless steel cup, and the ion exchange water of following 2 liters adds in this liquid.Then, pump is operated to carry out ultrafiltration technology.After about 40 minutes, the filter liquide by ultrafiltration module reaches 2 liters.At this moment, 2 liters ethanol is put into stainless steel cup.Afterwards, confirm that the conductivity of filter liquide is 300 μ S/cm or following, and carry out concentration technology and reach 500ml up to the amount of liquid.

Subsequently, construct another ultrafiltration system with stainless steel cup, ultrafiltration module (trade name of " AHP0013 ", Asahi Kasei company, 50000 molecular cut off, 100 filters), test tube pump and the air exhauster of 500ml.The mother liquor that had before prepared is put into stainless steel cup, then it is concentrated to increase solid concentration.When mother liquor reached about 100ml, test tube pump out of service was so when concentration operation finishes, obtained to have the silver colloid ethanolic solution of 10% solid.

The average grain diameter of the collargol particle in the solution is 0.017 μ m (17nm).Measurement result by instrument TG-DTA (Seiko Instr Ltd.) shows that the content of the silver in the solid is 90mass%, and it provides the electric charge of 87mass%.

This aqueous solution that will have a collargol with above-mentioned shower nozzle is sprayed on substrate with different surfaces performance (such as, paper base material) and goes up to form wiring diagram as shown in figure 26, and wherein each point superposes with consecutive points with about 1/3rd (1/3) of a spot size.Though spot diameter can change according to the surface property of substrate, spot diameter is about 40 μ m～50 μ m.Be formed at the thickness that suprabasil electrode pattern 91 has 0.5 μ m by sputtered aluminum (Al) in advance.To have the driving frequency of 12kHz, the driving voltage that is used for the 30V of drive pressure electric device is applied to shower nozzle.

In substrate, form after the wiring diagram, with substrate put into stove with under 100 ℃ temperature with dry 10 minutes of suprabasil wiring diagram, thereby obtain to have the thickness of about 0.2 μ m and the drying layer of metallic luster.With the surface resistivity of measuring by Loresta FP (Mitsubishi Chemical Ind) conductivity of drying layer is assessed, some surface resistivity be not measurable (such as, 108 Ω/sq or more than).

By Cooper-Hewitt lamp with having 5J/cm ²This drying layer of rayed after, 100 ℃ down heating substrates 40 minutes to obtain metal level.With the surface resistivity of measuring by Loresta FP (Mitsubishi Chemical Ind) conductivity of metal level is assessed, the surface resistivity of mensuration is 3.76 * 100 Ω/sq.

Then, between electrode pattern 91, repeat to apply the electric energy of the pulsewidth of pulse voltage with 30V and 50ms with pulse spacing of 100ms, continue 60 minutes whether broken string takes place as endurance test on the assessment wiring diagram.

Table 2 and table 3 are depicted as the result of this evaluation test.By the sensory evaluation's method with the microexamination of 100 multiplying powers each sample is carried out the assessment of wiring diagram shape, " O " representative is qualified, and " X " representative is defective.Each sample is carried out the endurance test assessment of wiring diagram, and " O " representative is broken string not, and there is broken string in " X " representative.

Having the unbeaten fiber of the fiber thickness of 6 μ m～15 μ m, spacing between stratified fiber by use is that paper and the coating of 4 μ m～6 μ m carries out evaluation test 1, this coating be dispersed with in it 1 μ m particle diameter calcium carbonate with the solution of starch as binding agent.

Table 2

Numbering	Coating	Surface roughness (μ m)	Pattern is checked	Durability
					1	Uncoated	6-10	X	X
2	Once coating	3-6	X	X
					3	Twice coating	1-3	O	O
4	Three coatings	1	O	O

Having the mashing fiber of the fiber thickness of 5 μ m～8 μ m, spacing between stratified fiber by use is that paper and the coating of 4 μ m～5 μ m carries out evaluation test 2, this coating be dispersed with in it 1 μ m particle diameter calcium carbonate with the solution of starch as binding agent.

Table 3

Numbering	Coating	Surface roughness (μ m)	Pattern is checked	Durability
					1	Uncoated	4-6	X	X
2	Once coating	1-3	O	O
					3	Twice coating	1	O	O

In above-mentioned evaluation test, by apply coating (such as, calcium carbonate and starch) surface property as the paper of substrate is polished such as concavity and convexity, wherein the concavity of paper and convexity are determined by the thickness and the interval between stratified fiber of cellulose fibre.According to the result shown in table 2 and table 3, compare with the convexity level with the concavity of paper before the surface treatment, when paper when surface treatment rear surface roughness is suppressed effectively, can not break on the wiring diagram, have the wiring diagram of shape and durability preferably so can form.

In addition, in exemplary embodiment, can use to have fine grain other coating of insulation.For example, can preferably use by what add in acid anhydrides and vulcabond that amine catalyst makes and have 10 ¹⁴The porous polyimide fine particle of Ω/sq or above surface resistivity, by in arc-plasma, introducing AIN fine particle that Al particle (20 μ m) makes or the SiOx fine particle that makes by the gas evaporation method with 20nm～30nm.

Though carry out above-mentioned evaluation test by the simple relatively wiring diagram that forms as shown in figure 26, the result shown in table 2 and 3 also is applicable to other wiring diagrams or electronic device similarly, such as transistor.So,, can use said method to suppress the concavity and the convexity of paper can when need in substrate, forming when having more high-quality device.

In the above description, ink ejecting method is mainly used in by basad direct injection electronic functional material and comes to form wiring diagram or electronic device in the substrate of using paper or paper base material.Yet, can use other technologies to be used in substrate, forming wiring diagram or electronic device.For example, use the imaging device of so-called xeroprinting or Carlson process can be preferred in substrate, forming wiring diagram or electronic device.Now the imaging device that uses so-called xeroprinting or Carlson process is described.

Figure 33 and Figure 34 have shown that another is in order to form the imaging device of image on paper.Figure 33 has shown the imaging area of imaging device, and this imaging device can adopt electrophotography or Carlson process, and Figure 34 has shown to have photoconductor drum (as image-carrier) that is provided with in the serial connection mode and the structural representation that uses the imaging device of two-component developing agent.

As shown in figure 34, imaging device 1000 for example comprises: imaging area 101, paper supply element 102 and scanner 103.As shown in figure 34, imaging area 101 is positioned at the center of imaging device 1000, and paper supply element 102 is positioned at the below of imaging area 101.Paper supply element 102 can comprise a plurality of paper pallets 121.In addition, scanner 103 is positioned at the top of imaging area 101, in order to the scanning document paper.In addition, discharge tray 10 is positioned at the left side of imaging area 101, stacks the paper that is formed with image and discharges from imaging area 101 on it.

As shown in figure 33, imaging area 101 comprises a plurality of image-generating units 106 of intermediate transfer belt 105 and the yellow above intermediate transfer belt 105 (Y), magenta (M), cyan (C) and black (K).Intermediate transfer belt 105 can be the endless belt.Light writing unit 107 is positioned at the top of imaging area 101.As shown in figure 33, image-generating unit 106 disposes optical conductor 161, charger 162, developing cell 163 and cleaning unit 164 for every kind of yellow (Y), magenta (M), cyan (C) and black (K).Optical conductor 161 can be a cydariform, and by for example charger 16, developing cell 163 and cleaning unit 164 center on.Charger 162 makes the surface charging of optical conductor 161.Light writing unit 107 gives off laser beam 165 to the surface of optical conductor 161, thereby forms the sub-image based on the image information of scanner 103 scanning gained.Developing cell 163 usefulness toner particles make the image development on the optical conductor 161.After the toner particle was transferred on the record-paper, cleaning unit 164 was removed the toner particle of staying on the optical conductor 161 and is made it get back to the original place.

In such imaging device 1000, the colored image that forms on each optical conductor 161 is folded into respectively on the intermediate transfer belt 105 to form monochrome image.

For example, yellow (Y) toner image is developed via developing cell 163Y, and is being transferred on the intermediate transfer belt 105 under the influence of primary transfer unit 166Y.Then, magenta (M) toner image is developed via developing cell 163M, and is being transferred on the intermediate transfer belt 105 under the influence of primary transfer unit 166M.Then, cyan (C) toner image is developed via developing cell 163C, and is being transferred on the intermediate transfer belt 105 under the influence of primary transfer unit 166C.Then, black (K) toner image is developed via developing cell 163K, and is being transferred on the intermediate transfer belt 105 under the influence of primary transfer unit 166K.Such four kinds of color images superpose on intermediate transfer belt 105 and form panchromatic toner image.

This panchromatic toner image is being transferred under the influence of secondary transfer printing unit 151 on the record-paper 120 that sends from paper supply unit 102 then.Then record-paper 120 is sent to fused unit 108 places,, record-paper 120 is discharged on the discharge tray 104 or via exit roller 141 is sent on the paper turning unit 109 then four-color image is fixed on the record-paper 120.

For image is formed on two faces of record-paper 120, record-paper 120 is provided to 109 places, paper turning unit by branch components 191, is overturn in the two sides of record-paper 120.Such turn-over record-paper 120 is sent to aligning roller 123 places, and after proofreading and correct the paper deflection, record-paper 120 is provided to imaging area 101 and sentences at its back side formation image.After panchromatic toner image was transferred to record-paper 120, the toner that band cleaning unit 152 will be stayed on the intermediate transfer belt 105 was disposed.

The record-paper that is kept in the paper tray 121 is pushed out with the direction that makes progress, so that the uppermost paper in the paper tray 121 contacts with pick-up roller 125.Specifically, the support plate 124 in the paper tray 121 can pivot rising to release the record-paper of depositing in the paper tray 121.

Along with the rotation of paper feed roller 126, the superiors' paper is extracted out from paper tray 121, and record-paper 120 is transported to aligning roller 123 via vertical transmission lines 127 then.Aligning roller 123 has temporarily stopped the transmission of record-paper 120, makes toner image synchronous with the opportunity of supplying with record-paper 120 opportunity in the formation of intermediate transfer belt 105, and record-paper 120 is supplied to imaging area 101.Aligning roller 123 also can carry out same paper supply to be handled the record-paper of supplying with from manual feed pallet 184.

In addition, imaging device can comprise disengaging pawl 181 and paperboard pallet 182, in order to remove or to discharge the paper that is blocked.When paperboard occurred in the downstream of vertical transmission lines 127, disengaging pawl 181 was activated to guide the paper that is blocked to paperboard pallet 182 places.

Scanner 103 comprises first and second saddles 132 and 133, and it moves mutually and is placed on the paper (not shown) of holding on the sheet glass 131 with scanning.First and second saddles 132 and 133 can comprise light source and the reflective mirror in order to the optical scanner file.The three primary colors filter that is scanned the image information process red (R) that obtains, green (G) and blue (B) by first and second saddles 132 and 133 filters, and scioptics 134 focus on the CCD (charge coupled device) 135, thereby convert image information to picture signal.Then such picture signal is digitized as color image data in order to image processing.

Scanner 103 has given scanning resolution, as 300dpi (dots per inch), 600dpi, 1200dpi etc.

Based on through the view data of image processing, the laser diode LD (not shown) of light writing unit 107 gives off laser beam on the optical conductor 161 to form sub-image.This laser beam points on the optical conductor 161 of yellow (Y), magenta (M), cyan (C) and black (K) by polygon mirror and lens.As shown in figure 34, ADF (autofile feed machine) 136 is positioned on the scanner 103, holds sheet glass 131 places in order to automatically file paper is delivered to.

Usually, adopt the imaging device of Carlson process can use toner.Yet, in exemplary embodiment, used the particle that contains electronic functional material to substitute normally used toner.For example, use the imaging device of Carlson process, will be applied in the substrate such as paper or paper base material in order to the material that forms conductive material of electrodes, can variable color when applying the signal of telecommunication, insulating material etc., thereby form wiring diagram or electronic device.For example, can be by the view data input imaging device 1000 of scanner 103, perhaps with computer-generated image data input imaging device 1000 with wiring diagram or electronic device.By the pattern of a plurality of use different materials of stack on intermediate transfer belt 105, and should a plurality of pattern transfer to paper, thereby can on paper, form such wiring diagram or electronic device.In addition, forming such wiring diagram or electronic device on paper can also form by the image that repeats each material, adopts the mode of formation patterned layer one by one.

Usually, the toner that Carlson process is commonly used comprises resin, colouring agent, charge control agent, release agent and additive.Such resin can be the styrene (as acrylic acid styrene) or the polyester of 1～10um size.Colouring agent is used for producing color.

In exemplary embodiment, use electronic functional material rather than colouring agent to come in substrate, to form wiring diagram or electronic device.Therefore, the conductive fine particle, light-emitting material, semi-conducting material, insulating material etc. that are used for above-mentioned ink ejecting method are added into resin with the particle of preparation in order to the electronic functional material that forms wiring diagram or electronic device.

Adopt the imaging device of ink ejecting method can have in order to distribute the nozzle assembly of solution.If nozzle assembly has the length that can be complementary with base widths, can in substrate, form pattern so with higher speed.If this nozzle assembly does not have the length that is complementary with base widths, the speed that forms pattern so in substrate is slower, and this is because nozzle assembly may move around above substrate.In addition, if nozzle assembly is designed to then can form pattern in larger sized substrate, as the A0 size more moving in the length.

On the other hand, adopt the imaging device of Carlson process in substrate, to form pattern, as the pattern formation of 100 to 200 of per minutes with higher speed and quantity.Therefore, can unite the imaging process that utilization Carlson process and ink-jet method realize more speed and quantity in order to the formation device.For example, adopt the imaging device of Carlson process to can be used for forming wide area level, insulating barrier and guard block as in whole of the substrate adopt the imaging device of ink-jet method to be used in the less area level that forms electronic functional material in the substrate.

In addition, the imaging device of employing Carlson process is preferably used on whole of paper (as substrate) and imposes coating, to improve the smooth surface performance (for example concavity and convexity) of paper, because adopt the imaging device of Carlson process in substrate, to form pattern with higher speed.Coating can be used to make the surface condition of substrate to reach the degree of smooth surface, and this is that the stacked concavity that causes and convexity realize mutually because of cellulose fibre by suppressing.In addition, adopt the imaging device of Carlson process can comprise fused unit 108 with the used warm-up mill of fixing and hold-down roller.Except that imposing coating, can further make the concavo-convex of substrate surface become level and smooth by roller institute applied pressure.

In addition, above-mentioned wiring diagram or electronic device can on two face, coat resin bed (as guard block) with protection have wiring diagram or electronic device the front and make the back side avoid the influence of environmental effect such as moisture.

Except arriving the electric connection of other external electronic component in order to connecting wiring figure or electronic device, this guard block can be coated in the substrate selectively.In so selectively applied process, preferably use ink-jet method.For example, use wax material in substrate, to form guard block.

Can adopt other method for printing, rolling method etc. in substrate, to form this guard block.In addition, can in substrate, form this guard block as the photosensitive polymer of photoresist by using selectively.

This guard block can the protecting cloth line chart or electronic device avoid for example aqueous vapor/moisture, pollution or physical impact.Therefore, wiring chart board or electronic panels in the exemplary embodiment have higher reliability in many aspects, as water-resistance, shock resistance, anti-luminous energy, resistance tocrocking and insulation property etc.

Electronic device 200 according to exemplary embodiment is described now.

Figure 35 has shown the electronic panels that has a plurality of electronic devices 200 in the substrate 10 of the material of papery or paper substrate.Though do not show, electronic device 200 can be to have a plurality of circuit and transistorized integrated circuit, and this is to form by apply the different solutions that contains electronic functional material or insulating material in substrate 10.As shown in figure 35, electronic device 200 is arranged in the substrate 10 in the mode that has device isolation regions 201 therebetween.

In addition, electronic panels can comprise separator bar pattern 202 in device isolation regions 201, as shown in figure 36.Separator bar pattern 202 can be formed in the device isolation region 201 so that the device isolation line can clearly be identified.Separator bar pattern 202 can also use the imaging device according to exemplary embodiment to be formed in the substrate 10 (as paper or paper base material).Separator bar pattern 202 can use the solution that contains electronic functional material or colouring agent to form, so that the identification separator bar.Separator bar pattern 202 can be used as from the mark of substrate 10 cutting electronic devices 200, can discern cutting part easily by it.

Separator bar pattern 202 can further form and extend to the edge of substrate 10, as shown in figure 37.Therefore, each electronic device 200 can downcut from substrate 10 with higher accuracy.

Except being provided with in the substrate 10 the separator bar pattern 202, can be provided with the mechanical strength corresponding to the zone of separator bar pattern 202 in the substrate 10 lower than other zones of substrate 10.For example, in the hole that can beat a plurality of one-tenth linear array in the substrate 10 between the electronic device 200, make each electronic device 200 to downcut with less power (as hand force).In addition, can this mechanical strength be set similarly by the thickness that reduces the substrate 10 between the electronic device 200.

As mentioned above, in exemplary embodiment, has the imaging device manufacturing that fine pattern such as several μ m can use Carlson process or ink-jet method rather than conventional photolithography to wiring diagram substrate or the electronic substrate of dozens of μ m (for example 1 μ m～50 μ m).

Adopt the imaging device of ink-jet method to have shower nozzle, shower nozzle has undersized nozzle, and the solution that is used for comprising electronic functional material is assigned in the substrate to form wiring diagram or electronic device in substrate.For the situation of the imaging device that adopts Carlson process, the particle that comprises electronic functional material can be used to form wiring diagram or electronic device in substrate.

Because comparing, the used expensive process equipment of such imaging device and semiconductor fabrication process has the structure of more simplifying, thus can in substrate, form wiring diagram or electronic device in more low-cost and more reliable mode, so be preferable.

In addition, can adopt other printing methods in substrate, to form wiring diagram or electronic device, as thermal transfer, hectographic printing, letterpress, lithographic printing and silk screen printing.

According to above-mentioned enlightenment, multiple other change and modification all is possible.Therefore, within the scope of the appended claims, content of the present invention is interpreted as can also be to realize except specifically described other modes here.

Teachings herein has required on November 21st, 2006 and on August 17th, 2007 to you can well imagine the Japanese patent application No.2006-314882 of friendship and the priority of No.2007-213083 to the Japan Patent score of the game, and its full content merges introduces the application with for referencial use.

Claims (17)

1. function element manufacturing installation, thus be used in substrate, forming wiring diagram or electronic device by the solid formation of deposit solution in the substrate of adopting paper or paper base material, and described device comprises:

First shower nozzle is ejected in the described substrate as dot pattern in order to the solution that will comprise electronic functional material, and described first shower nozzle comprises:

Electro-mechanical energy conversion element, it can be out of shape when being subjected to electric energy, and the deformation of described electro-mechanical energy conversion element is used to distribute the solution droplets from described first shower nozzle,

Wherein, described electro-mechanical to described first shower nozzle can apply drive signal by conversion element, the drop that make to distribute before the surface of the described substrate of bump, present basic for the first spherical shape or have spherical part and spherical part after second shape of stylolitic part of extension, the length of described second shape is less than three times of described spherical part diameter.

2. function element manufacturing installation as claimed in claim 1, it is characterized in that, described device also comprises second shower nozzle, wherein said first shower nozzle and described second shower nozzle spray dissimilar solution, in described substrate, form separately pattern in a mode that is stacked on another, thereby in described substrate, form wiring diagram or electronic device.

3. function element manufacturing installation as claimed in claim 2 is characterized in that, described device further comprises:

Base seat is in order to fixing described substrate; With

Saddle, be used for above described substrate, carrying and moving described first shower nozzle and described second shower nozzle, by spraying first solution of first pattern, make the first pattern drying, on first pattern, spray second solution of second pattern then, thereby make described first shower nozzle and described second shower nozzle in described substrate, form separately pattern.

4. function element manufacturing installation as claimed in claim 2 is characterized in that, described device further comprises:

Substrate conveyor is in order to move described substrate; With

Saddle, in order to carrying described first shower nozzle and described second shower nozzle,

Wherein said substrate conveyor makes described substrate move with respect to described saddle, by spraying first solution of first pattern, by described substrate conveyor described substrate is retracted into given reference position, on first pattern, spray second solution of second pattern then, thereby make described first shower nozzle and described second shower nozzle in described substrate, form separately pattern.

5. function element manufacturing installation as claimed in claim 4, it is characterized in that, when forming given pattern on the face in described substrate, described substrate conveyor moves described substrate, thereby and described substrate conveyor make described substrate upset on the another side of described substrate, form given pattern.

6. function element manufacturing installation, thus be used in substrate, forming wiring diagram or electronic device by the solid formation of deposit solution in the substrate of adopting paper or paper base material, and described device comprises:

First shower nozzle is ejected in the described substrate as dot pattern in order to the solution that will comprise electronic functional material, and described first shower nozzle comprises:

Heater element, thus make and generate bubble in the solution in order to produce heat, and the bubble of generation is in order to the drop from the described first shower nozzle sprayed solution,

Wherein, heater element to described first shower nozzle applies drive signal, the drop that make to distribute before the surface of the described substrate of bump, present have spherical part and spherical part after the shape of stylolitic part of extension, the length of described droplet profile is at least five times of described spherical part diameter.

7. function element manufacturing installation as claimed in claim 6, it is characterized in that, described device also comprises second shower nozzle, wherein said first shower nozzle and described second shower nozzle spray dissimilar solution, in described substrate, form separately pattern in a mode that is stacked on another, thereby in described substrate, form wiring diagram or electronic device.

8. function element manufacturing installation as claimed in claim 7 is characterized in that, described device further comprises:

Base seat is in order to fixing described substrate; With

Saddle, be used for above described substrate, carrying and moving described first shower nozzle and described second shower nozzle, by spraying first solution of first pattern, make the first pattern drying, on first pattern, spray second solution of second pattern then, thereby make described first shower nozzle and described second shower nozzle in described substrate, form different pattern.

9. function element manufacturing installation as claimed in claim 7 is characterized in that, described device further comprises:

Substrate conveyor is in order to move described substrate; With

Saddle, in order to carrying described first shower nozzle and described second shower nozzle,

Wherein said substrate conveyor makes described substrate move with respect to described saddle, by spraying first solution of first pattern, by described substrate conveyor described substrate is retracted into given reference position, on first pattern, spray second solution of second pattern then, thereby make described first shower nozzle and described second shower nozzle in described substrate, form different pattern.

10. function element manufacturing installation as claimed in claim 9, it is characterized in that, when forming given pattern on the face in described substrate, described substrate conveyor moves described substrate, thereby and described substrate conveyor make described substrate upset on the another side of described substrate, form given pattern.

11. a feature board comprises:

Substrate, it is made by paper or paper base material;

Dot pattern, it is positioned at least one face of described substrate, forms by the solid formation that deposits in the solution that contains electronic functional material in described substrate.

12. feature board as claimed in claim 11 is characterized in that, described feature board forms a wiring diagram or an electronic device at least.

13. feature board as claimed in claim 11 is characterized in that, the surface of described substrate scribbles concavity and the convexity of coating with the described substrate that suppresses to cause because of the paper fiber, and described dot pattern is positioned on the described surface that scribbles coating of described substrate.

14. feature board as claimed in claim 11, it is characterized in that, described dot pattern comprises the strip pattern of being made up of a plurality of points of bunchiness, described o'clock with two direction arrangements of quadrature respectively, and in the place of described strip pattern any direction bending in two other orthogonal directions of branch, described strip pattern has the corner portions located of a curve shape.

15. feature board as claimed in claim 12 is characterized in that, described wiring diagram be positioned on the face of described feature board or two faces on.

16. feature board as claimed in claim 12 is characterized in that, described electronic device be positioned on the face of described feature board or two faces on.

17. feature board as claimed in claim 12 is characterized in that, described wiring diagram is positioned on the face of described feature board and described electronic device is positioned on another face of described feature board.

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