CN101174734A - Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering - Google Patents
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering Download PDFInfo
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- CN101174734A CN101174734A CNA2007101669342A CN200710166934A CN101174734A CN 101174734 A CN101174734 A CN 101174734A CN A2007101669342 A CNA2007101669342 A CN A2007101669342A CN 200710166934 A CN200710166934 A CN 200710166934A CN 101174734 A CN101174734 A CN 101174734A
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Abstract
In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.
Description
The cross reference of related application
The application is based on October 30th, 2006 and Japanese patent application No.2006-294350 and No.2007-148377 that June 4 in 2007, bu you can well imagine to be handed over, and the explanation of described patent application all is incorporated into this by reference.
Technical field
The present invention relates to have busbar assembly and pass through the electronic installation that electronic unit is thereon assembled in welding.
Background technology
As having the wiring board that uses predetermined circuit patterns and assembling an example of the traditional electronic devices of a plurality of electronic units thereon, a kind of electronic installation is disclosed in the U.S. Patent Application Publication No.2004/0119155 corresponding to Japanese Patent Application Publication No.2004-200464.
The wiring board of disclosed electronic installation comprises the circuit board module of forming with a plurality of metal circuit boards (busbar) that predetermined circuit patterns is provided by assembling each other in this U.S. Patent Application Publication.A plurality of weld pads form on the precalculated position on a surface of circuit board module, make that a plurality of electronic units of electronic installation are welded on respectively on the corresponding weld pad of circuit board module.
Fusion welding can not guarantee the sufficient intensity of solder joints along the excessive wick effect of weld pad and the busbar around it.In order to address this problem, disclosed wiring board is furnished with the solder mask of the predetermined non-welding region on a surface that covers circuit board module in this U.S. Patent Application Publication.Predetermined non-welding region is positioned on this surface of the circuit board module except weld pad wherein.Solder mask stops the undue of fusion welding on the weld pad to move, and keeps the sufficient intensity of solder joints.
Summary of the invention
In making this U.S. Patent Application Publication during disclosed electronic installation, need be with the step of the predetermined non-welding region of solder mask coating.This increases the quantity of making the required step of electronic installation.
Consider above-mentioned situation, the purpose of at least one aspect of the present invention provides the sufficient intensity that can guarantee solder joints and the electronic installation that need not this solder mask coating process.
In order to realize this purpose, the inventor of present patent application has studied the concrete measure of realizing this purpose in earnest, has carried out a large amount of trial and error experiments simultaneously.The result of research, the inventor has finished the present invention, wherein the contact angle of fusion welding is limited in 40 to 60 predetermined angular ranges of spending and moves with interior the excessive of fusion welding that stoped.This can keep the sufficient intensity corresponding to the solder joints of the fusion welding between electronic unit and the busbar.
Particularly, according to an aspect of the present invention, provide electronic installation.This electronic installation comprises electronic unit and comprises the busbar assembly of a plurality of busbars that at least a metal material of selecting is in advance made.Each of a plurality of busbars has a surface.A plurality of busbars are configured so that be assembled into the formation predetermined circuit patterns.This electronic installation comprises at least one a lip-deep solder joints of being made and be placed on a plurality of busbars by the alloy of the metal material of selecting in advance.Solder joints changes into solid-state from molten condition, mechanically and electrically electronic unit is connected at least one a surface of a plurality of busbars thus.The metal material of selecting in advance of at least a metal material of selecting in advance of at least one of a plurality of busbars and the alloy of solder joints determines to be at least one the contact angle on this surface of the relative a plurality of busbars of solder joints of molten condition in the angular ranges of 40 to 60 degree.
According to another aspect of the present invention, provide the method for making electronic installation.This method comprises the preparation electronic unit, and selects the busbar assembly of at least a metal material to prepare to be made up of a plurality of busbars that the metal material of this at least a selection is made, and wherein each of a plurality of busbars has a surface.A plurality of busbars are configured so that be assembled into the formation predetermined circuit patterns.This method comprises selects metallic material alloy so that form the solder joints of being made by the metallic material alloy of selecting, and solder joints is placed at least one the surface of a plurality of busbars.This method comprises and at least one a lip-deep solder joints that is placed on a plurality of busbars is changed into solid-state from molten condition, mechanically and electrically electronic unit is connected at least one a surface of a plurality of busbars thus.The solder joints that the alloy of the metal material of the metal material of at least a selection of a plurality of busbars and the selection of solder joints determines to be in molten condition with respect at least one the contact angle on a surface of a plurality of busbars in the angular ranges of 40 to 60 degree.
Description of drawings
Other purpose of the present invention and aspect will with reference to the accompanying drawings to embodiment did describe below in and become more obvious, in the accompanying drawings:
Fig. 1 is the perspective view of the example of structure of schematically illustrated electronic installation according to the first embodiment of the present invention;
Fig. 2 A is one of lead-in wire of schematically illustrated IC parts according to first embodiment and the partial cross section view that engages in the fusion weld of its placed around;
Fig. 2 B is the partial cross section view that the fusion weld of placing between the weld pad of the bottom surface of IC parts and corresponding busbar shown in schematically illustrated Fig. 1 engages;
Fig. 3 is the schematically illustrated right-angle view that substrate is immersed fusion welding according to first embodiment, the well-known arc surfaced tin sticky test of use (JIS C 0053);
Fig. 4 A is the partial cross section view under the schematically illustrated situations that are configured to be lower than 40 degree according to first embodiment, at the welding contact angle between the plating face of outline line that the corresponding fusion weld of anchor leg engages and corresponding busbar;
Fig. 4 B is the partial cross section view under the schematically illustrated situations that are configured to be higher than 60 degree according to first embodiment, at the welding contact angle between the plating face of outline line that the corresponding fusion weld of anchor leg engages and corresponding busbar;
Fig. 5 A is schematically illustrated according to first embodiment, different tin-base lead-free welding alloy and the table of two kinds of leaded welding alloies of tinbase (20 different samples);
Fig. 5 B is a curve chart (a) and (b), wherein curve chart (a) schematically show according to first embodiment, when the temperature (reflux temperature) of each sample of sample No. 1 to No. 20 remains on 250 ℃, the measurement contact angle (degree) of the corresponding sample that sample is No. 1 to No. 20, and wherein curve chart (b) schematically show temperature (reflux temperature) when each sample of the sample of solder alloy No. 1 to No. 20 remain on its liquidus temperature add 50 ℃ and the time, the measurement contact angle (degree) of the corresponding sample that sample is No. 1 to No. 20;
Fig. 6 be schematically illustrated according to first embodiment, according to the well-known arc surfaced tin sticky method shown in Fig. 3 by the contact angle (degree) of the molten braze alloy of the SAC that immerses first to the 4th routine different-alloy and obtain and the measurement result of outline line (fillet);
Fig. 7 is the perspective view of the example of structure of schematically illustrated bus board according to first embodiment;
Fig. 8 is the perspective view of example of structure of the plate of schematically illustrated clip-like according to first embodiment;
Fig. 9 is the perspective view that schematically illustrated bus board according to first embodiment is installed in the state in the anchor clamps;
Figure 10 is the schematically illustrated perspective view that is assemblied in the state on the bus board according to the IC parts of first embodiment;
The perspective view of Figure 11 state that to be schematically illustrated bus board according to first embodiment remove from anchor clamps excision and intercell connector from bus board;
Figure 12 is the perspective view of the example of structure of schematically illustrated bus board according to a second embodiment of the present invention;
Figure 13 is the perspective view of the example of structure of schematically illustrated bus board according to second embodiment;
Figure 14 is the perspective view of example of structure of the anchor clamps of schematically illustrated similar plate according to second embodiment;
Figure 15 is the perspective view that schematically illustrated bus board according to second embodiment is installed in the state in the anchor clamps;
Figure 16 is the schematically illustrated perspective view that is assemblied in the state on the bus board according to the IC parts of second embodiment;
The perspective view of Figure 17 state that to be schematically illustrated bus board according to second embodiment remove from anchor clamps excision and intercell connector from bus board;
Figure 18 is that the fixing outstanding of schematically illustrated first stamping die according to second embodiment is inserted into the partial cross section view of the state the mating holes of another transverse end of busbar from being inserted in wherein other surface (non-plating surface); And
Figure 19 is the zoomed-in view of the part busbar of schematically illustrated modification according to second embodiment.
Embodiment
Embodiments of the present invention will be described by referring to the drawings hereinafter.
First embodiment
Referring to figs. 1 to 11, comprise according to the electronic installation 1 of the first embodiment of the present invention:
Busbar assembly BA;
A plurality of for example 3 IC parts 2,3 and 4 according to first embodiment as electronic unit; With
The a plurality of solder joints 13 of IC parts 2,3 and 4 between the busbar assembly BA are used for electrically and mechanically IC parts 2,3 and 4 are connected to busbar assembly BA.
Busbar assembly BA is made up of to 12 a plurality of busbar 5.Each of busbar 5 to 12 is by conducting metal that transmits high electric current such as for example smooth tabular conductor that copper constitutes.
As shown in Figure 1, a plurality of busbars 5 to 12 that all have a reservation shape are disposed on the same level so that assembling each other, so that the wiring board of the basic rectangle that constitutes predetermined circuit patterns to be provided.
A surface of each busbar 5 to 12 applies with metal cladding PL.Hereinafter, this surface that has formed each busbar 5 to 12 of metal cladding PL on it also is known as " plating face PL ".
In first embodiment, no solder mask (resin bed) forms on this surface of each busbar 5 to 12.
For example, shown in Fig. 1 and 7, transverse end 5a of rectangular bus-bar 5 and the first rectangle part 6a of busbar 6 constitute the transverse end of rectangular bus-bar assembly BA.The first rectangle part 11a of the rectangle part 6a of busbar 6 and busbar 11 constitutes the vertical end of rectangular bus-bar assembly BA.
A transverse end 12a of the transverse end of the transverse end of the first rectangle part 11a, the second rectangle part 11b of busbar 11 and rectangular bus-bar 12 constitutes another transverse end of rectangular bus-bar assembly BA.The first and second rectangle part 11a are connected by the 3rd rectangle part 11c each other continuously with 11b.
Another vertical part of end that the top of the extension 6c of the transverse end of the top of the extension 5b of another transverse end of rectangular bus-bar 5 and the second rectangle part 6b that extends from transverse end of the first rectangle part 6a constitutes rectangular bus-bar assembly BA.Similarly, busbar 7,8,9 and 10 separately transverse end 7a, 8a, 9a and a 10a and the second rectangle part 11b of busbar 11 another vertical remainders of end of constituting rectangular bus-bar assembly BA.
Busbar 9 has basic L-shape, so that crooked 90 degree of its another transverse end 9b extend with the 3rd rectangle part 11c to busbar 11, between keeps one at interval simultaneously.Busbar 10 is provided with by the 3rd rectangle part 11c with respect to busbar 11, has one between the two at interval.
Transverse end 7a, 8a, 9a and a 10a at the top of extension 5b and 6c and each busbar 7,8,9 and 10 form terminal strip 14,15,16,17,18 and 19 continuously.
Rectangular bus- bar 5,11 and a transverse end 5a of 12, a transverse end 11d and a transverse end 12a are crooked orthogonally towards its coating side respectively.Similarly, the terminal strip 14,15,16,17,18 and 19 that forms continuously at transverse end 7a, 8a, 9a and a 10a of the top of extension 5b and 6c and each busbar 7,8,9 and 10 is by the coating side towards busbar 5,6,7,8,9 and 10 is crooked orthogonally respectively.
IC parts (IC chip) 2 its lower surface place by IC parts 2 lower surface and the weld pad of busbar 5 and 6 between the solder joints 13 of placing be fixedly fitted on the weld pad that pre-determines the position of plating face PL of busbar 5 and busbar 6.
Each IC parts 3 and 4 for example is designed to the low profile package parts.Each IC parts 3 and 4 are made up of IC chip and its rectangle encapsulation of encapsulation.
Each IC parts 3 and 4 also comprises a plurality of intensive lead-in wire L, and these lead-in wires are stretched from every epitaxial lateral overgrowth of encapsulation along the plating face PL of corresponding busbar, extends downwardly into surface of encapsulation and stretches along its plating facing epitaxy.
The solder joints 13 of placing between the weld pad of lower surface by the plating face PL of lower surface and busbar 6 of its rectangle encapsulation is fixedly fitted on the weld pad that pre-determines the position of plating face PL of busbar 6;
Plating face PL corresponding that the solder joints 13 of placing between the corresponding weld pad of five lead-in wire L by the plating face PL of lead-in wire L and busbar 6 that extends from a side of the encapsulation of IC parts 3 is fixedly fitted to busbar 11 respectively pre-determines on the weld pad of position;
Plating face PL corresponding that the solder joints 13 of placing between the corresponding weld pad of a lead-in wire L by the plating face PL of lead-in wire L and busbar 6 that extends from the opposite side of the encapsulation of IC parts 3 is fixedly fitted to busbar 7 pre-determines on the weld pad of position; And
The pair of lead wires L that extends from the opposite side of the encapsulation of IC parts 3 is fixedly fitted to busbar 8 by the solder joints 13 of placing between this corresponding weld pad to the plating face PL of lead-in wire L and busbar 8 plating face PL corresponding pre-determines on the weld pad of position.
The solder joints 13 of placing between the weld pad of lower surface by the plating face PL of lower surface and busbar 11 of its rectangle encapsulation is fixedly fitted on the weld pad that pre-determines the position of plating face PL of busbar 11;
Plating face PL corresponding that the solder joints 13 of placing between the corresponding weld pad of five lead-in wire L by the plating face PL of lead-in wire L and busbar 12 that extends from a side of the encapsulation of IC parts 4 is fixedly fitted to busbar 12 respectively pre-determines on the weld pad of position;
Plating face PL corresponding that the solder joints 13 of placing between the corresponding weld pad of a lead-in wire L by the plating face PL of lead-in wire L and busbar 9 that extends from the opposite side of the encapsulation of IC parts 4 is fixedly fitted to busbar 9 pre-determines on the weld pad of position; And
The pair of lead wires L that extends from the opposite side of the encapsulation of IC parts 4 is fixedly fitted to busbar 10 by the solder joints 13 of placing between this corresponding weld pad to the plating face PL of lead-in wire L and busbar 10 plating face PL corresponding pre-determines on the weld pad of position.
Fig. 2 A is one of schematically illustrated IC parts 4 lead-in wire and engages 13 partial cross section view in the fusion weld of its placed around.Fig. 2 B is that the fusion weld of placing between the corresponding weld pad of the lower surface of schematically illustrated IC parts 2 and busbar 5 engages 13 partial cross section view.
As being shown in the example, engaging 13 around the corresponding lead placement of each lead-in wire L or each fusion weld of between the plating face PL of the lower surface of corresponding encapsulation (chip self) and corresponding busbar, placing and have predetermined profile line (scolder outline line) SF with Fig. 2 A and 2B.
In first embodiment, term " outline line " expression engages the structure of the outer surface of 13 cross section with each fusion weld of the direction quadrature of the plating face PA of busbar assembly BA.
Usually, fusion welding outline line between lead-in wire connected to one another and the weld pad pattern to be used as to determine corresponding to the first whether good evaluation index of the solder joints of this welding.
Particularly, when outline line has the same shape that tilts gradually of Xiangshan pin, be confirmed as well corresponding to the solder joints of this outline line.
Except outline line, whether the second good evaluation index is welding contact angle θ to the solder joints between definite lead-in wire and the weld pad pattern.Welding contact angle θ represents the respective wheel profile of fusion welding and the angle between lead-in wire or the weld pad pattern.This contact angle θ measures by line (vector) TL of structure and the tangent starting point of passing the crossing plane between outline line and lead-in wire or weld pad pattern of fusion welding outline line.
The reason that welding contact angle θ is used as second evaluation index is a wetability, and wetability is the fundamental characteristics that fusion weld engages, and it depends on welding contact angle θ.Fig. 3 is the right-angle view that the well-known arc surfaced tin sticky test of schematically illustrated use (JIS C 0053) is immersed in the substrate in the fusion welding.As shown in Figure 3, wetting power F is provided by following equation:
F＝p·γ
1f·cosθ-B
Wherein, P is the girth of substrate, and B is a buoyancy, known both are constants, θ be the welding contact angle, the solder flux interfacial tension is γ
1f
It is low more that this equation illustrates welding contact angle θ, and wetting power F is high more.Thereby usually, contact angle θ is low more, and fabulous solder joints is many more.
Whether the 3rd good evaluation index is whether the lead-in wire profile is by the visible information of solder joints determine to want welding between lead-in wire connected to one another and the weld pad pattern.
Yet, in first embodiment, owing on the plating face PL of busbar assembly BA, do not form solder mask, so second evaluation index can not directly apply to solder joints 13.Particularly, very little welding contact angle θ can make corresponding fusion weld engage and flow to corresponding busbar outside, makes the respective profile line loss bad.
Consider first to the 3rd evaluation index, the present inventor finds the welding contact angle θ of each fusion weld joint 13 is limited in the predetermined angular ranges of 40 to 60 degree with the interior excessive wick effect that has stoped corresponding fusion weld joint 13.
Particularly, Fig. 4 A corresponding fusion weld of schematically showing anchor leg L engages the situation that welding contact angle θ between the plating face PL of 13 outline line F and corresponding busbar 12 is configured to be lower than 40 degree (lower limit of the angle limits of contact angle).In this case, fusion weld joint 13 exceedingly moves from corresponding busbar 12.This can make the fusion weld on the corresponding busbar 12 engage 13 amount reduction, may reduce the intensity of solder joints 13.
On the other hand, Fig. 4 B corresponding fusion weld of schematically showing anchor leg L engages the another kind of situation that welding contact angle θ between the plating face PL of 13 outline line F and corresponding busbar 12 is configured to be higher than 60 degree (upper limit of the angle limits of contact angle).In another case, fusion weld joint 13 exceedingly is assemblied on the respective lead L.This can make the lead-in wire profile invisible by solder joints 13, and is used in respective lead L crooked invalid of strain relief.As a result, stress is concentrated on the solder joints 13, makes 4 damages of IC parts.
As mentioned above, in first embodiment, each fusion weld is engaged angular ranges that 13 welding contact angle θ adjusts to 40 to 60 degree can make a corresponding fusion weld engage 13 outline line to remain on the such fabulous structure that tilts gradually of Xiangshan pin with interior.
Note, be positioned at a fusion weld on the plating face PL of corresponding busbar and engage the metal material (alloy material) that 13 contact angle θ depends on the alloy material of this solder joints 13 and depends on the coating PL of busbar assembly BA.
In order determine to use which kind of solder alloy as solder joints 13 and use which kind of metal material (alloy material) as coating PL, the present inventor has prepared 13 kinds of different tin (Sn) base unleaded (Pb) solder alloy and 2 kinds of tinbase solder containing pb alloys (20 kinds of different samples).
Fig. 5 A and 5B that the measurement result of every kind of sample in these 20 kinds of different samples is shown are disclosed in the non-patent literature below.
“Characteristics?evaluation?of?Pb?free?solder?alloys(1)-Meltingproperties?and?wettability-in?3rd?Symposium?on“Microjoining?andAssembly?Technology?in?Electronics”February?6-7，1997，Yokohama”
Particularly, shown in Fig. 5 A, sample is for No. 1 Xi Yin (Ag) alloy, and sample is for No. 2 tin copper (Cu) alloy, and sample is respectively the SAC alloy No. 3 and No. 4, and sample is for No. 5 tin silver bismuth (Bi) alloy.Sample is respectively for No. 6 and No. 7 a tin silver bismuth copper alloy, and sample is respectively for No. 8, No. 9, No. 10 and No. 11 tin silver bismuth indium (In) alloy, and sample is for No. 12 a tin silver indium copper alloy, and sample is for No. 13 a tin bismuth copper alloy.
Sample is for No. 14 a tin bismuth indium copper alloy, and sample is for No. 15 tin silver zinc (Zn) alloy, and sample is a red brass No. 16, and sample is for No. 17 a tin zinc bismuth alloy.Sample is for No. 18 a tin zinc indium alloy, and sample is for No. 19 a tin silver cerrobase alloy, and sample is a leypewter No. 20.
After having prepared No. 1 to No. 20 solder alloy of sample, the contact angle θ (degree) of each sample in the present inventor's use No. 1 to No. 20 solder alloy of well-known arc surfaced tin sticky experimental measurement sample as shown in Figure 3.
Fig. 5 B schematically shows measurement result.
Particularly, in Fig. 5 B, (a) show when the temperature (reflux temperature) of No. 1 each sample in No. 20 of sample remains on 250 ℃ the contact angle θ (degree) of a corresponding sample in the measured sample No. 1 to No. 20.In Fig. 5 B, (b) show temperature (reflux temperature) when each sample in No. 1 to No. 20 solder alloy of sample remain on its liquidus temperature add 50 ℃ and the time, the contact angle θ (degree) of a corresponding sample in the measured sample No. 1 to No. 20.
Note, in (a) of Fig. 5 B because oxidizing process and can not obtain reproducible data corresponding to No. 15, sample, therefore in view with its omission.
Be shown clearly in as Fig. 5 A and 5B, the contact angle θ of No. 1, the sample of 9 different tin base lead-free solder alloys each sample in No. 19, the sample of No. 14 and one leaded tin solders is arranged in the angular ranges of 30 to 40 degree substantially.The contact angle θ of each sample in the sample of 3 different tin base lead-free solder alloys No. 15 to No. 18 is positioned in the angular ranges of 40 to 60 degree substantially.
Contrast therewith, the contact angle θ of No. 20 tin-lead solder alloys of sample is positioned at 10 degree and angular ranges on every side thereof outside 40 to 60 angular ranges of spending substantially.
Fusion welding depends on the metal material of coating on a surface of a corresponding busbar 5 to 12 with respect to the actual contact angle θ on a surface of each busbar 5 to 12.
For this reason, fusion welding is with respect to the actual contact angle θ on a surface of each busbar 5 to 12 contact angle θ greater than each sample in the arc surfaced tin sticky test.
Therefore, in first embodiment, any one in the sample of 9 different tin base lead-free solder alloys No. 1 to No. 14 preferably is elected to be the solder alloy of each solder joints 13.Particularly, in first embodiment, No. 3, the sample of SAC alloy or No. 4 selected solder alloys as each solder joints 13.
As mentioned above, whether the 4th good evaluation index is the information of expression which kind of metal of use (alloy) as the coating on a surface of each busbar 5 to 12 to the solder joints between definite lead-in wire and the weld pad pattern.
The thickness of coating of supposing a surface of each busbar 5 to 12 is constant, and the Typical Metals that then is used for coating for example nickel (Ni), nickel phosphorus (P) alloy, palladium (Pd), gold (Au) palladium-nickel alloy, tin, sn-ag alloy, silver, nickel billon and Jin Ze depends on the wetability of fusion welding.Notice that the thickness of the coating on a surface of each busbar 5 to 12 depends on the wetability of fusion welding on a surface of a corresponding busbar 5 to 12.
Particularly, using under nickel or the situation of nickel-phosphorus alloy as the coating on a surface of each busbar 5 to 12, the wetability of fusion welding is lower than the wetability of the fusion welding under the situation of using palladium or golden palladium-nickel alloy.
Using under palladium or the situation of golden palladium-nickel alloy as the coating on a surface of each busbar 5 to 12, the wetability of fusion welding is lower than the wetability of the fusion welding under the situation of using tin, sn-ag alloy or silver.Using under tin, sn-ag alloy or the situation of silver as the coating on a surface of each busbar 5 to 12, the wetability of fusion welding is lower than the wetability of the fusion welding under the situation of using tin, nickel billon or gold.
Particularly, for example, a kind of typical metal material of coating that selection is used as a surface of each busbar 5 to 12 is controlled the contact angle θ with respect to the fusion welding on a surface of corresponding at least one busbar 5 to 12, thereby stably keeps its contact angle with respect to a surface of corresponding at least one busbar 5 to 12 to spend in the angular ranges of 60 degree 40.
Particularly, before selecting, the present inventor tests by the following outline line that immerses the molten braze alloy of having measured contact angle θ (degree) and SAC according to the well-known arc surfaced tin sticky shown in Fig. 3:
In the molten braze alloy of SAC, immerse nickel plating (Ni) substrate as first example;
In the molten braze alloy of SAC, immerse nickel plating phosphorus substrate as second example;
In the molten braze alloy of SAC, immerse tinning substrate as the 3rd example; And
In the molten braze alloy of SAC, immerse nickel plating gold (Au) substrate as the 4th example.
Fig. 6 schematically shows each the measurement result in first to the 4th example.
As shown in Figure 6, have bad shape, and corresponding with it measurement contact angle θ is outside the angular ranges of 40 to 60 degree corresponding to each the meter wheel profile in third and fourth example.
Especially, in the 3rd example, tin (Sn) is fusion, and in the 4th example, the cost of nickeline plate is high relatively.Thereby, for above-mentioned reasons, determine to use tin (Sn) or bazar metal improper as the coating on a surface of each busbar 5 to 12.
On the contrary, as shown in Figure 6, have excellent in shape corresponding to each the meter wheel profile in first and second examples, the same shape that tilts gradually of Xiangshan pin for example, and the contact angle θ of corresponding measurement with it is positioned in the angular ranges of 40 to 45 degree.
Especially, nickel plate cost is low relatively and have high relatively solderability in reprocessing, determines that therefore using nickel (Ni) is suitable as the metal material of the coating on a surface of each busbar 5 to 12.
Particularly, the diffusion coefficient that is installed in the solder projection on the copper coin is usually greater than the diffusion coefficient that is installed in the solder projection on the nickel-plated sheet for example, thus fusion welding with respect to the contact angle of nickel-plated sheet greater than the contact angle of fusion welding with respect to copper coin.
The inventor use arc surfaced tin sticky experimental measurement supposition have each the scolder sample 1,3～12 that is roughly spherical form and 14 diffusion coefficient.Particularly, each scolder sample 1,3～12 and 14 diffusion coefficient provide by the following equation of JIS Z3197 definition:
CS(％)＝100×(D-H)/D
Wherein CS represents the diffusion coefficient of each scolder sample (solder projection), and D represents the diameter of preceding each the scolder sample of arc surfaced tin sticky test, and H represents the height of each scolder sample of arc surfaced tin sticky test back.
The result is that each diffusion coefficient that is deposited on the scolder sample on the brazing fishplate bar with coat of metal is positioned in the scope of 80～82 (%).
Contrast therewith, each diffusion coefficient that is deposited on the scolder sample on the nickel-plated sheet is positioned in the scope of 59～65 (%).
The scope that is deposited on 80～82 (%) that each diffusion coefficient was positioned at of the scolder sample on the brazing fishplate bar with coat of metal is convertible into the scope of 32.8～34.6 degree that corresponding contact angle fell into of scolder sample.
Contrast therewith, the scope that is deposited on 59～65 (%) that each diffusion coefficient was positioned at of the scolder sample on the nickel-plated sheet is convertible into the scope of 49.1～55.0 degree that corresponding contact angle fell into of scolder sample.
Therefore, nickel-plated sheet can be adjusted the contact angle of scolder sample 1,3～12 and 14 to the right place in the angular range of 40～60 degree.
As mentioned above, in first embodiment,, be chosen in and form nickel coating PL on the surface of each busbar 5 to 12 as metal cladding.
As mentioned above, in first embodiment, the metal material of metal cladding PL of adjusting the solder alloy of each solder joints 13 and adjust covering the surface of busbar assembly BA makes each fusion weld engage 13 welding contact angle θ in the angular ranges of 40 to 60 degree.This makes it possible to keep each fusion weld to engage 13 the same fabulous structure that tilts gradually of outline line Xiangshan pin, guarantees the enough intensity of each solder joints 13 reliably.
The example of the method for making electronic installation 1 then, is described hereinafter.
As shown in Figure 7, prepare bus board 20 in the first step of manufacture method.
Intercell connector 29 connects a transverse end 8a of busbars 8 and a transverse end 9a of busbar 9, and intercell connector 30 connects adjacent end bars 17 and 18.
The basic copper coin on a surface that for example, has nickel coating PL coated is pressed into bus board.
Then, in second step of manufacture method, prepare the anchor clamps 35 of similar plate, the area of one surface 35a is greater than the area (referring to Fig. 8) of the nickel plating surface PL of bus board 20.
Anchor clamps 35 are formed with groove 36 in one surface 35a.The profile of groove 36 is consistent with the profile of bus board 20, and this permission is installed in bus board 20 in the groove 36.
Then, in the 3rd step of manufacture method, as shown in Figure 9, bus board 20 is installed in the groove 36 of anchor clamps 35.
After this, at least one of nickel plating face PL that soldering paste projection 13 is deposited at least some busbars 5 to 12 pre-determines on the weld pad of position, and wherein each soldering paste projection 13 is mixtures of the similar paste of solder alloy powder and solder flux.
Notice that the measurer of the solder flux that comprises in each soldering paste projection 13 has the function of the oxide on the nickel plating face PL that removes busbar assembly BA, and therefore, its wetability is had bigger influence.The amount that reduces the solder flux that comprises in each soldering paste projection 13 makes it possible to control its wetability.
Yet the amount that reduces the solder flux that comprises in each soldering paste projection 13 may be removed the oxide on the nickel plating face PL of busbar assembly BA deficiently.For this reason, in first embodiment, adjust the solder alloy of each solder joints 13 and the metal material of the metal cladding PL on a surface that covers busbar assembly BA, the amount of the solder flux that comprises in each soldering paste projection 13 is a constant simultaneously, so that each fusion weld engages the scolder contact angle θ of (projection) 13 in the angular range of 40 to 60 degree.
Particularly, on the transverse end of the second rectangle part 6b of the busbar 6 that two soldering paste projections 13 another transverse end of being deposited over busbar 5 is adjacent with it.A soldering paste projection 13 is deposited over the basic remainder of the second rectangle part 6b of busbar 6.
Five soldering paste projections 13 are deposited on another transverse end of the first rectangle part 11a of busbar 11.Five soldering paste projections 13 are aimed at along the vertical side of the second rectangle part 6b of busbar 6, so that separate thick and fast each other.A soldering paste projection 13 is deposited over another transverse end of busbar 7, and two soldering paste projections are deposited over another transverse end of busbar 8.
A soldering paste projection 13 is deposited on the 3rd rectangle part 11c of busbar 11.A soldering paste projection 13 is deposited on another transverse end 9b of busbar 9, and two soldering paste projections are deposited over another transverse end of busbar 10.Five soldering paste projections 13 are deposited over another transverse end of busbar 12.
Then, in the 4th step of manufacture method, as shown in figure 10, IC parts 2 are assembled at its lower surface place on the soldering paste projection 13 on the transverse end of the second rectangle part 6b of another transverse end that is positioned at busbar 5 and busbar 6.
After this, in the 5th step of manufacture method, bus board 20 and the anchor clamps 35 that assembled IC parts 2 to 4 by soldering paste projection 13 are put into reflow soldering together thereon.In reflow soldering, each the soldering paste projection 13 on a corresponding weld pad of busbar 5 to 12 is refluxed (fusing), and after this is solidified (reformation).
The solidifying of the soldering paste projection 13 of fusion (reformation) makes and by corresponding solder joints 13 electronic unit 2 to 4 is fixedly fitted on the nickel plating face PL of corresponding busbar.
In first embodiment, as mentioned above, the metal material of metal cladding PL of adjusting the solder alloy of each solder joints 13 and adjust covering the surface of busbar assembly BA makes each fusion weld engage the welding contact angle θ of (projection) 13 in the angular ranges of 40 to 60 degree.This makes each fusion weld on the plating face PL that can stop more corresponding busbars 5 to 12 engage 13 excessive moving, thereby reliably electronic unit 2 to 4 is welded on more corresponding busbars 5 to 12.
In the 5th step (welding step) of manufacture method afterwards, excision bus board 20 from anchor clamps 35, and remove intercell connector 21 to 34 (referring to Figure 11) from bus board 20.
After this, rectangular bus- bar 5,11 and a transverse end 5a of 12, a transverse end 11d and a transverse end 12a are crooked orthogonally towards its coating side respectively.Similarly, terminal strip 14,15,16,17,18 and 19 is by the coating side towards busbar 5,6,7,8,9 and 10 is crooked orthogonally respectively.The result obtains the electronic installation 1 shown in Fig. 1.
As mentioned above, in electronic installation 1, select the solder alloy of SAC alloy, select the metal material of nickel as the coating on the surface of busbar assembly BA as each solder joints (soldering paste projection) 13 according to first embodiment.These selections make the welding contact angle θ of each fusion weld joint 13 be in the angular ranges of 40 to 45 degree.This makes it possible to keep each fusion weld to engage 13 the same fabulous structure that tilts gradually of outline line Xiangshan pin, guarantees the sufficient intensity of each solder joints 13 reliably.
Therefore, electronic unit 2,3 and 4 is welded on more corresponding busbars 5 to 12 forming the welding cheaply that solder mask keeps making electronic unit 1 simultaneously on the busbar 5 to 12 reliably by need not.
In addition, electronic installation 1 can use the bus board of being made up of the busbar 5 to 12 before the bending and a plurality of intercell connector 21 to 34 20 to make.Electronic unit 2 to 4 all be assemblied in by welding the more corresponding busbar that provides at first 5 on 12 after, remove intercell connector 21 to 34 from bus board 20.This makes each electronic unit 2 to 4 be welded on effectively on more corresponding busbars 5 to 12.
This can use on the smooth bus board 20 that supports by anchor clamps 35 scrape (squeegee-print) and/or electronic installation 1 is made in the parts assembling; Scraping with parts assemblings on these smooth bus boards 20 can be used for making the ordinary printed plate usually.Therefore, can need not any modification ground uses the equipment of assembling electronic unit on the ordinary printed plate to make electronic installation 1.
Can be directly connected to external equipment to 19 by terminal strip 14 according to the electronic installation 1 of first embodiment.
Second embodiment
Referring to figs. 12 to 19, electronic installation 37 according to a second embodiment of the present invention comprises:
Busbar assembly BA1;
According to second embodiment, as a plurality of for example 3 IC parts 38,39 and 40 of electronic unit; And
A plurality of solder joints 49 between the IC parts 38,39 and 40 to busbar assembly BA1.
Busbar assembly BA1 is by the conducting metal that transmits high electric current, and for example a plurality of busbars 41 to 48 of copper formation are formed.
As shown in figure 12, a plurality of busbars 41 to 48 that all have a reservation shape are arranged at grade to be assembled each other so that the wiring plate of the basic rectangle that constitutes predetermined circuit patterns to be provided.
A surface of each busbar 41 to 48 applies with the nickel coating PL1 of similar first embodiment.
On the nickel plating face PL1 of each busbar 41 to 48, do not form solder mask (resin bed).
For example, shown in Figure 12 and 13, the paired support 42a1 of the transverse end 41a of rectangular bus-bar 41 and the concave portions of busbar 42 and 42a2 end constitute the transverse end of rectangular bus-bar assembly BA1.The rectangle part 42b of the busbar 42 that extends from the pedestal 42a3 of the basic rectangle of its concave portions constitutes one of rectangular bus-bar assembly BA1 vertically end.
The transverse end of the transverse end of the rectangle part 42b of busbar 42 and the rectangle part 48a of busbar 48 constitutes another transverse end of rectangular bus-bar assembly BA1.
The support 42a2 of busbar 42 and busbar 43,44,45 and 46 transverse end separately is aligned with each other to constitute another part of vertically holding of rectangular bus-bar assembly BA1.
The L-shape part 42c's that extends from the middle part of rectangle part 42b is terminal and aligned with each other from the outstanding end 47a of the square part 47b of busbar 47, with another the vertical another part of end that constitutes rectangular bus-bar assembly BA1.The first 48b outstanding from rectangle part 48a aims at each other substantially with the contiguous 48b of first and from the outstanding second portion 48c of its rectangle part 48a, to constitute another vertical end of rectangular bus-bar assembly BA1.
At a transverse end of busbar 43 to 46, an end 47a of busbar 47 and the second portion 48c of busbar 48, form terminal strip 50 to 53,54 and 55 continuously.Terminal strip 50 to 55 is crooked orthogonally towards the coating side of corresponding busbar 43 to 48 respectively.
IC parts (IC chip) 40 are by the solder joints 49 between the weld pad of the lower surface of IC parts 40 and busbar 47 and 48, are fixedly fitted at its lower surface place on the weld pad that pre-determines the position of plating face PL of busbar 47 and busbar 48.
Each IC parts 38 and 39 is designed to for example low profile package parts.Each IC parts 38 and 39 are made up of IC chip and its rectangle encapsulation of encapsulation.
Each IC parts 38 and 39 also is made up of a plurality of intensive lead-in wire L1, and these lead-in wires are stretched, extended downwardly into surface of encapsulation and stretch along its plating facing epitaxy along the plating face PL1 of corresponding busbar from every epitaxial lateral overgrowth of encapsulation.
The solder joints 13 of placing between the weld pad of lower surface by the plating face PL1 of this lower surface and each busbar 41 and 42 of its rectangle encapsulation is fixedly fitted on the weld pad that pre-determines the position of plating face PL1 of each busbar 41 and 42;
Five lead-in wire L1 that extend from a side of IC parts 38 encapsulation are by the solder joints 49 between the corresponding weld pad of the plating face PL1 of lead-in wire L1 and busbar 43 and 44, and plating face PL1 corresponding that is fixedly fitted to busbar 43 and 44 pre-determines on the weld pad of position; And
Five lead-in wire L1 that extend from the opposite side of the encapsulation of IC parts 38 are by the solder joints 49 between the corresponding weld pad of the plating face PL1 of lead-in wire L1 and busbar 41, are fixedly fitted on the weld pad that pre-determines the position accordingly of plating face PL1 of busbar 41.
The lower surface of its rectangle encapsulation is by the solder joints 49 between the weld pad of the plating face PL1 of this lower surface and busbar 42, is fixedly fitted on the weld pad that pre-determines the position of plating face PL1 of busbar 42;
Five lead-in wire L1 that extend from a side of the encapsulation of IC parts 39 are by the solder joints 49 between the corresponding weld pad of the plating face PL1 of lead-in wire L1 and busbar 47, are fixedly fitted on the weld pad that pre-determines the position accordingly of plating face PL1 of busbar 47; And
Five lead-in wire L1 that extend from the opposite side of IC parts 39 encapsulation are by the solder joints 49 between the corresponding weld pad of the plating face PL1 of lead-in wire L1 and busbar 45 and 46, are fixedly fitted on the weld pad that pre-determines the position accordingly of plating face PL1 of busbar 45 and 46.
A transverse end of busbar 43 to 46 is formed with the little mating holes 50b that passes along its thickness direction respectively to 53b.Similarly, an end 47a who stretches out from the square part 47b of busbar 47 and be formed with little mating holes 54b and the 55b that passes along its thickness direction respectively from the second portion 48c that the rectangle part 48a of busbar 48 stretches out.
In this second embodiment, the same with first embodiment, select the solder alloy of SAC alloy, and select the coated metal material of nickel as the surface of busbar assembly BA1 as each solder joints (soldering paste projection) 49.These select to allow the welding contact angle θ of each fusion weld joint 49 in the angular ranges of 40 to 45 degree.This makes each fusion weld engage 49 the same fabulous structure that tilts gradually of outline line maintenance Xiangshan pin, guarantees the sufficient intensity of each solder joints 49 reliably.
The example of the method for making electronic installation 37 then, is described hereinafter.
As shown in figure 13, prepare bus board 56 at the first step of manufacture method.
Intercell connector 57 connects the support 42a1 of busbar 42 and a transverse end 41a of 42a2 and busbar 41, and intercell connector 58 connects intercell connector 57 and terminal strip 50.Intercell connector 58 connects neighboring terminals bar 50 and 51, and intercell connector 59 connects neighboring terminals bar 51 and 52, and intercell connector 60 connects neighboring terminals bar 52 and 53, and intercell connector 61 connects neighboring terminals bar 52 and 53.
Intercell connector 62 connects neighboring terminals bar 53 and 54, and intercell connector 63 connects neighboring terminals bar 54 and 55.
Intercell connector 65 connects the transverse end of rectangle part 42b of busbars 42 and a transverse end 48a of busbar 48.Intercell connector 64 connecting terminal bars 53 and intercell connector 65.
Small through hole 42d is formed on the core of pedestal 42a3 of the concave portions of busbar 42 aligned with each otherly.On the pedestal 42a3 of the concave portions of busbar 42, the part lower surface of the rectangle encapsulation of assembling IC parts 38.
Similarly, small through hole 42e is formed on the center of basic rectangular susceptor of L-shape part 42c at the middle part that extends to rectangle part 42b of busbar 42 aligned with each otherly.The part lower surface of the rectangle of IC parts 39 encapsulation is assemblied on the pedestal of L-shape part 42c of busbar 42.
For example, have surface coated the basic copper coin of nickel coating PL be pressed into bus board 56.
Then, in second step of manufacture method, prepare the anchor clamps 75 of similar plate, the area of its surperficial 75a is greater than the area (referring to Figure 14) of the nickel plating face PL1 of bus board 56.
Anchor clamps 75 are formed with groove 76 in one surface 75a.The profile of groove 76 is consistent with the profile of bus board 56, and its permission is installed in bus board 56 in the groove 76.
Then, in the 3rd step of manufacture method, as shown in figure 15, bus board 56 is installed in the groove 76 of anchor clamps 75.
After this, at least one of nickel coating PL1 that soldering paste projection 49 is deposited at least some busbars 41 to 48 pre-determines on the weld pad of position, and wherein each soldering paste projection 49 is mixtures of the similar paste of solder alloy powder and solder flux.
Particularly, five soldering paste projections 49 are deposited on another transverse end of busbar 41, and five soldering paste projections 49 are formed on another transverse end of busbar 43 and 44.The pedestal 42a3 that soldering paste projection 49 is deposited on the concave portions of busbar 42 goes up and is not applied in through hole 42d.
Similarly, five soldering paste projections 49 are deposited on the side of square part 47b of the busbar 47 relative with the pedestal of the L-shape part 42c of busbar 42.Five soldering paste projections 49 are formed on another transverse end of busbar 45 and 46.Soldering paste projection 49 is deposited on the pedestal of L-shape part 42c of busbar 42 and is not applied in through hole 42e.
Two soldering paste projections 49 are deposited on the opposite side relative with this side of square part 47b, and are deposited on another transverse end of rectangle part 48a of busbar 48.
Then, in the 4th step of manufacture method, as shown in figure 16, IC parts 40 are assembled in its lower surface on the soldering paste projection 49 on this another transverse end of rectangle part 48a of this opposite side that is positioned at square part 47b and busbar 48.
After this, in the 5th step of manufacture method, the bus board 56 via soldering paste projection 49 assembling IC parts 38 to 40 is put into reflow soldering together with anchor clamps 75 thereon.In reflow soldering, each soldering paste projection 49 on a corresponding weld pad of busbar 41 to 48 is refluxed (fusing), and is solidified (reformation) afterwards.Solidify (reformation) of the soldering paste projection 49 of fusion allows by corresponding solder joints 49 electronic unit 38 to 40 to be fixedly fitted on the nickel plating face PL1 of corresponding busbar.
In a second embodiment, similar first embodiment, the metal material of adjusting the metal cladding PL1 on the solder alloy of each solder joints 49 and the surface that adjustment covers busbar assembly BA1 makes each fusion weld engage the welding contact angle θ of (projection) 49 in the angular ranges of 40 to 60 degree.This makes it possible to prevent that each fusion weld on the plating face PL1 of more corresponding busbars 41 to 48 from engaging 49 and excessively being moved, thereby reliably electronic unit 38 to 40 is welded on these more corresponding busbars 41 to 48.
In the 5th step (welding step) of manufacture method afterwards, bus board 56 from anchor clamps 75 excisions, and is removed (referring to Figure 17) with intercell connector 57 to 65 from bus board 56.
After this, make terminal strip 50,51,52,53,54 and 55 respectively towards the coating side vertical curve of busbar 43,44,45,46,47 and 48.
For example, when curved extremities bar 50, prepare a pair of first and second stamping dies (press die) 77 and 78 that each has the rectangular parallelepiped protrusion part shape.First stamping die 77 heart place therein is formed with pressed surface, and wherein, this center has from the fixing of this pressed surface gives prominence to.Should be designed to be fit to be placed among the corresponding mating holes 50b of busbar 43 by fixing outstanding 77a.
Then, as shown in figure 18, the fixing outstanding 77a of first stamping die 77 is inserted into by another surface (non-plating surface) from busbar 43 the mating holes 50b of another transverse end of busbar 43, to be installed in wherein.This allows another transverse end of busbar 43 to be placed on the pressed surface of first stamping die 77.
After this, second stamping die 78 is assembled in another transverse end of the busbar 43 that extends to counterpart terminal bar 50, so that be pressed to the pressed surface of first stamping die 77, this makes it possible to support regularly another transverse end of busbar 43.
After supporting another transverse end of busbar 43 regularly by first and second stamping dies 77 and 78, terminal strip 50 is met at right angles by the coating lateral bending song towards busbar 43.Other terminal strip 51 to 55 is to meet at right angles with coating lateral bending song that the crooked identical mode of terminal strip 50 is configured to respectively by towards corresponding busbar 44 to 48.
The bending of each terminal strip 50 to 55 the electronic installation 1 that provides shown in Fig. 1 is provided.
As mentioned above, in electronic installation 37 according to second embodiment, the same with first embodiment, select the solder alloy of SAC alloy, and select the metal material of nickel as the coating on the surface of busbar assembly BA1 as each solder joints (soldering paste projection) 49.These select to allow the welding contact angle θ of each fusion weld joint 49 to be in the angular ranges of 40 to 45 degree.This makes it possible to each fusion weld and engages 49 the same fabulous structure that tilts gradually of outline line maintenance Xiangshan pin, guarantees the sufficient intensity of each solder joints 49 reliably.
Therefore, electronic unit 38,39 and 40 is welded on more corresponding busbars 41 to 48 forming the welding cheaply that solder mask keeps making electronic unit 37 simultaneously on the busbar 41 to 48 reliably by need not.
Particularly, in a second embodiment, through hole 42d is formed on the core of the rectangular susceptor 42a3 of busbar 42, and the lower surface of the rectangle encapsulation of IC parts 38 is assembled on this part by the corresponding soldering paste projection 49 that deposits thereon.During welding process, the gas that through hole 42d produces in the central part office of rectangular susceptor 42a3 when allowing to be released in effectively the corresponding soldering paste projection 49 of fusing.
Particularly, supposing does not have through hole 42d to form in the core of rectangular susceptor 42a3, then compares with the edge of rectangular susceptor 42a3, and the heart gas of partly locating to produce is difficult to be transferred out pedestal 42a3 therein.Therefore, this has prevented to produce space (bubble) in corresponding solder joints 49, makes it possible to improve the reliability of the solder joints 49 between IC parts 38 and the corresponding busbar 42.
Similarly, through hole 42e is formed in the core of rectangular susceptor of L-shape part 42c, and the lower surface of the rectangle of IC parts 39 encapsulation is assembled on this part by the corresponding soldering paste projection 49 of deposition thereon.During welding process, the gas that through hole 42e produces when allowing to be released in effectively the corresponding soldering paste projection 49 of fusing.
Particularly, supposing does not have through hole 42e to form in the core of the rectangular susceptor of L shaped part 42c, then compares with the edge of its rectangular susceptor, and the gas that produces in the central part office is difficult to be transferred out pedestal.Therefore, this has prevented to produce space (bubble) in corresponding solder joints 49, makes it possible to improve the reliability of the solder joints 49 between IC parts 39 and the corresponding busbar 42.
In electronic installation 37, absorbed the stress that when terminal strip 50 to 55 is connected to external equipment, is applied on these terminal strips 50 to 55 respectively to 55a at the quadrature sweep of terminal strip 50 to 55 and the U-shaped sweep 50a between the top according to second embodiment.
Particularly, terminal strip 50 to 55 is stretched out with a cross side towards the busbar assembly BA1 vertical with its thickness direction by convex curvature, and it provides U-shaped sweep 50a to 55a.Therefore, need not in another pressing process, and easily form U-shaped part 50 to 55 respectively with terminal strip 50 to 55 with the thickness direction bending of terminal strip 50 to 55 along busbar assembly BA1 (bus board 56).This can simplify the manufacturing process of electronic installation 37, and has kept making the cost of electronic installation 37.
In a second embodiment, each mating holes 50b allows first stamping die 77 to be fixed to reliably on the corresponding busbar 43 to 48 to 55b.In addition, each mating holes 50b allows a corresponding mating holes 50b narrower than the remainder of a corresponding busbar 43 to 48 to the width of a corresponding busbar 43 to 48 at 55b place to 55b.
When each terminal strip 50 to 55 when bent, might be focused the stress to the part of the corresponding mating holes 50b of formation of a corresponding busbar 43 to 48 to 55b towards the coating lateral bending of a corresponding busbar 43 to 48 along the thickness direction of busbar assembly BA1 thus.Can reduce the stress to a corresponding solder joints 49 to be applied thus.
In a second embodiment, busbar 43 to 48 is formed with mating holes 50b respectively to 55b, but the present invention is not limited to this structure.
Typically, busbar 43 can be formed with occlusion portion, and it allows when corresponding terminal bar 50 in its first type surface (surface with surperficial another relative surface) therewith is crooked, the part of anchor clamps by regularly with its interlock.
For example, busbar 43 can be in along being formed with a pair of groove 50c and 50d (referring to Figure 19) on the first type surface on its thickness direction in its another transverse end.
In this modification, the fixing outstanding 77a of first stamping die 77 is installed in the groove 50c of another transverse end of busbar 43 and any one among the 50d.This allows another transverse end of busbar 43 to be placed on the pressed surface of first stamping die 77.
After this, second stamping die 78 is assembled in another transverse end of busbar 43, so that be pressed to the pressed surface of first stamping die 77, this makes it possible to support regularly another transverse end of busbar 43.
After supporting another transverse end of busbar 43 regularly by first and second stamping dies 77 and 78, terminal strip 50 meets at right angles towards the coating lateral bending song of busbar 43.Other terminal strip 51 to 55 is to meet at right angles with coating lateral bending song that crooked identical mode according to the terminal strip 50 of this modification is configured to respectively towards corresponding busbar 44 to 48.
In each embodiment of first and second embodiment, select the solder alloy of SAC alloy, and select the metal material of nickel as the coating on the surface of busbar assembly BA (BA1) as each solder joints (soldering paste projection) 13 (49).Yet the present invention is not limited to these selections.
Particularly, as long as each fusion weld engages the welding angle θ of (projection) 13 in the angular range of 40 to 60 degree, the solder alloy of each solder joints 13 (49) can be adjusted to another kind of alloy, and the metal material of the metal cladding PL (PL1) on the surface of covering busbar assembly BA (BA1) can be adjusted to another kind of metal material.
For example, as long as each fusion weld engages the welding angle θ of (projection) 13 in the angular range of 40 to 60 degree, the solder alloy of each solder joints 13 (49) can be adjusted to the tin-zinc-based leadless solder alloy, and the metal material of the metal cladding PL (PL1) on the surface of covering busbar assembly BA (BA1) can be adjusted to gold (Au).
In addition, as long as each fusion weld engages the welding angle θ of (projection) 13 in the angular range of 40 to 60 degree, the solder alloy of each solder joints 13 (49) can be adjusted to the SAC alloy, and the metal material of the metal cladding PL (PL1) on the surface of covering busbar assembly BA (BA1) can be adjusted to the alloy of nickel (Ni) and phosphorus (P).
Although described current first and second embodiment of the present invention and the modification of thinking thereof, be appreciated that the various modifications of wherein can also not describing, and it is intended to cover all modifications that falls in true spirit of the present invention and the scope in appended claims.
Claims (18)
1. electronic installation comprises:
Electronic unit;
Busbar assembly, it comprises a plurality of busbars of being made by at least a metal material of selecting in advance, and each of described a plurality of busbars has a surface, and described a plurality of busbars are provided so that and are assembled into the formation predetermined circuit patterns; And
Solder joints, its alloy by the metal material of selecting is in advance made and is placed at least one the surface of described a plurality of busbars, described solder joints changes into solid-state from molten condition, thus described electronic unit mechanically and electrically being connected to described at least one the described surface of described a plurality of busbars, in described a plurality of busbars described at least one at least a metal material of selecting in advance and the metal material of selecting in advance of the alloy of the described solder joints solder joints of determining to be in molten condition with respect to described at least one the contact angle on a described surface of described a plurality of busbars in the angular ranges of 40 to 60 degree.
2. electronic installation as claimed in claim 1, wherein said solder joints is made by the alloy of the unleaded metal material of selecting in advance.
3. electronic installation as claimed in claim 1, each of wherein said a plurality of busbars has the coating of being made and being formed by the described at least a metal material of selecting in advance on its described surface, the described at least a metal material of selecting in advance of described coating is a nickel.
4. electronic installation as claimed in claim 1, wherein said busbar assembly are formed treats that described bus board comprises from the bus board excision:
Be provided so that assembling constitutes described a plurality of busbars of described predetermined circuit patterns; And
Connector, its with in described a plurality of busbars at least one be connected in described a plurality of busbar at least another.
5. electronic installation as claimed in claim 1, wherein, described busbar assembly comprises the terminal strip that is connected at least one the outside connection busbar that is included in described a plurality of busbar, and described terminal strip allows external equipment and described at least one outside electrical connection that connects between busbar.
6. electronic installation as claimed in claim 5, wherein, described terminal strip is constructed to respect to corresponding at least one outside connection busbar bending.
7. electronic installation as claimed in claim 6, wherein, each of described a plurality of busbars has and another relative surface of a described surface, described at least one outside connect busbar corresponding with terminal strip is formed with occlusion portion, when described terminal strip when one in a described surface and described another surface is crooked towards it, the part of anchor clamps by regularly with described occlusion portion interlock.
8. electronic installation as claimed in claim 7, wherein, described at least one outside described occlusion portion that connects busbar is to pass the described outside through hole that connects busbar along the thickness direction between its described surface and described another surface, at described terminal strip when one in a described surface and described another surface is crooked towards it, the described part of described anchor clamps is inserted into to be installed in described at least one outside through hole that connects busbar.
9. electronic installation as claimed in claim 7, wherein, described at least one outside described occlusion portion that connects busbar is the groove that forms in its described surface and described another surface at least one, described terminal strip towards it described one when crooked in described surface and described another surface, the described part of described anchor clamps is installed in described at least one outside described groove that connects busbar.
10. electronic installation as claimed in claim 1, wherein, each of described a plurality of busbars has and another relative surface of a described surface, described electronic unit is assembled in and will mechanically and electrically be connected on described at least one the symmetric part on a described surface in described a plurality of busbars of described electronic unit by solder joints, and described at least one the described symmetric part on a described surface in described a plurality of busbar is formed with through hole, and described through hole is walked along the direction of the thickness between its described surface and described another surface.
11. electronic installation as claimed in claim 10, wherein, described through hole is formed on described at least one the described antimeric central portion office on a described surface in described a plurality of busbar, to walk along the thickness direction between its described surface and described another surface.
12. electronic installation as claimed in claim 1, wherein, each of described a plurality of busbars has and another relative surface of a described surface, and described terminal strip be formed with its described surface and described another surface between the vertical sweep of thickness direction.
13. a method of making electronic installation comprises:
Prepare electronic unit;
Select at least a metal material so that prepare to comprise the busbar assembly of a plurality of busbars, described a plurality of busbar is made by the metal material of described at least a selection, each of described a plurality of busbars has a surface, and described a plurality of busbars are provided so that and are assembled into the formation predetermined circuit patterns;
Select the alloy of metal material so that form the solder joints of making by the alloy of described selection metal material; And
Described solder joints is placed at least one the described surface in described a plurality of busbar; And
Change into described at least one a described lip-deep solder joints that is placed on described a plurality of busbars solid-state from molten condition; Mechanically and electrically described electronic unit being connected to thus described at least one the described surface of described a plurality of busbars, described a plurality of busbars described at least one the metal material of described at least a selection and the alloy of the metal material of the described selection of the described solder joints described solder joints of determining to be in molten condition with respect to described at least one the contact angle on a described surface of described a plurality of busbars in the angular ranges of 40 to 60 degree.
14. method as claimed in claim 13, wherein, described solder joints is made by the alloy of the unleaded metal material of selecting.
15. method as claimed in claim 13, wherein, each of described a plurality of busbars has the coating of being made and being formed by the metal material of described at least a selection on its described surface, the metal material of the described at least a selection of described coating is a nickel.
16. method as claimed in claim 13, wherein, described busbar assembly is formed treats that described bus board comprises from the bus board excision:
Be provided so that and be assembled into the described a plurality of busbars that constitute described predetermined circuit patterns; And
Connector, its with at least one of described a plurality of busbars be connected to described a plurality of busbars at least another, after described electronic unit mechanically and electrically being connected to described at least one the described surface of described a plurality of busbars by described solder joints, carry out of the excision of described busbar assembly from described bus board.
17. method as claimed in claim 13, wherein, described busbar assembly comprises the terminal strip that is connected at least one the outside connection busbar that is included in described a plurality of busbar, and described terminal strip allows being electrically connected between external equipment and described at least one outside connection busbar.
18. method as claimed in claim 17 also comprises:
Described electronic unit mechanically and electrically has been connected to described at least one the described surface of described a plurality of busbars by described solder joints after, with respect to corresponding at least one outside crooked described terminal strip of busbar that connects.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006294350 | 2006-10-30 | ||
| JP2006294350 | 2006-10-30 | ||
| JP2007148377 | 2007-06-04 |
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| CN101174734A true CN101174734A (en) | 2008-05-07 |
| CN100553035C CN100553035C (en) | 2009-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007101669342A Expired - Fee Related CN100553035C (en) | 2006-10-30 | 2007-10-30 | Have busbar assembly and reach the electronic installation of adorning electronic unit thereon by welding |
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| CN (1) | CN100553035C (en) |
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| CN102668070A (en) * | 2009-09-15 | 2012-09-12 | 利萨·德雷克塞迈尔有限责任公司 | Electronic device for switching currents and method for producing the same |
| CN103378283A (en) * | 2012-04-11 | 2013-10-30 | 松下电器产业株式会社 | Thermoelectric conversion module |
| CN104094680A (en) * | 2012-02-06 | 2014-10-08 | 萱场工业株式会社 | Bus bar |
| CN104518297A (en) * | 2013-10-07 | 2015-04-15 | 株式会社富士克 | Connecting member of electronic component and electric component |
| CN104953395A (en) * | 2014-03-27 | 2015-09-30 | 矢崎总业株式会社 | Circuit body and electronic component unit |
| CN111108347A (en) * | 2017-09-19 | 2020-05-05 | 罗伯特·博世有限公司 | Support for a sensor unit |
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2007
- 2007-10-30 CN CNB2007101669342A patent/CN100553035C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102668070A (en) * | 2009-09-15 | 2012-09-12 | 利萨·德雷克塞迈尔有限责任公司 | Electronic device for switching currents and method for producing the same |
| CN102668070B (en) * | 2009-09-15 | 2015-06-03 | 利萨·德雷克塞迈尔有限责任公司 | Electronic device for switching currents and method for producing the same |
| CN104094680A (en) * | 2012-02-06 | 2014-10-08 | 萱场工业株式会社 | Bus bar |
| CN104094680B (en) * | 2012-02-06 | 2017-10-17 | Ｋｙｂ株式会社 | Busbar |
| CN103378283A (en) * | 2012-04-11 | 2013-10-30 | 松下电器产业株式会社 | Thermoelectric conversion module |
| CN104518297A (en) * | 2013-10-07 | 2015-04-15 | 株式会社富士克 | Connecting member of electronic component and electric component |
| CN104518297B (en) * | 2013-10-07 | 2017-10-17 | 株式会社富士克 | The connecting elements of electronic unit, electric part |
| CN104953395A (en) * | 2014-03-27 | 2015-09-30 | 矢崎总业株式会社 | Circuit body and electronic component unit |
| CN111108347A (en) * | 2017-09-19 | 2020-05-05 | 罗伯特·博世有限公司 | Support for a sensor unit |
| CN111108347B (en) * | 2017-09-19 | 2022-05-03 | 罗伯特·博世有限公司 | Support for a sensor unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100553035C (en) | 2009-10-21 |
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