CN101166373B - Capacitance type microphone - Google Patents
Capacitance type microphone Download PDFInfo
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- CN101166373B CN101166373B CN 200710180821 CN200710180821A CN101166373B CN 101166373 B CN101166373 B CN 101166373B CN 200710180821 CN200710180821 CN 200710180821 CN 200710180821 A CN200710180821 A CN 200710180821A CN 101166373 B CN101166373 B CN 101166373B
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Abstract
In a capacitance type microphone leading a microphone bag to support on a bag supporting part mounted on a supporting tube, leading the rear side cavity of the microphone bag and the supporting tube side cavity of the bag supporting part to insulate reliably. A capacitance type microphone comprises a bag supporting part mounted on the front end of the supporting tube, and a microphone bag connecting on the bag supporting part by a screw embedded mechanism, a circuit substrate with FET (impedance inverter) is arranged into the bag supporting part, and a contacting terminal (140) contacting with the contacting pin of the microphone bag, FET (13) is mounted on the back on microphone bag opposite side of the circuit substrate, an electrode pattern electric connecting with given terminal of the FET by a via forming at about central part of the circuit substrate upper surface, the contacting terminal hold on the electrode pattern by a given holding mechanism (160), leading the via arranged on the circuit substrate to block by a given blocking mechanism (optimum is a pad (190)).
Description
Technical field
On the front end that the present invention relates to comprise the microphone utricule and be installed in support column and support the gooseneck type condenser microphone of the utricule support of above-mentioned microphone utricule; More particularly, relate to the technology that is insulated in the rear portion side cavity and the support column side cavity in the utricule support of microphone utricule on sound.
Background technology
Small-sized microphone nearly all is a condenser microphone, but for for the condenser microphone of the gooseneck type that often can see in for example meeting-place etc., has in order to change the structure that microphone characteristics can be changed the microphone utricule according to occasion.Through Fig. 5 the one of which example is described.
In view of the above, this condenser microphone possess on the front end that is installed in support column P utricule support 10 and through screw is chimeric dismounting is attached at the microphone utricule 20 on the utricule support 10 freely.Usually, support column P is located on the desk via not shown support is upright, in its part, comprises flexible shaft.In addition, support column P also being arranged all is the situation of flexible shaft.
The rear side of housing 21 cover 22 and is closed by the back of the body, is connected contact plug 23 that said fixing extremely goes up and covers 22 from the back of the body and give prominence to.In addition,, be fixed with the binding threaded portion 24 that on the inner face that is used for linking with utricule support 10, has negative thread 241, so that itself and electrically conducting of housing 21 in the rear side of housing 21.
Utricule support 10 possesses the housing cylindraceous 11 that is made up of for example brass material, in this housing 11, disposes circuit substrate 12, so that its inside with housing is stopped up.FET (field-effect transistor) 13 as impedance transformer is installed on circuit substrate 12.In the lower face side of circuit substrate 12 is being welded slotting logical support column P and an end of derivative microphone cable 17.
On the gate terminal of FET13, welding by bending roughly is a side of the contact terminal 14 that constitutes of the leaf spring of V word shape, and above-mentioned contact terminal 14 is flexibly contacted with above-mentioned contact plug 23.Circuit substrate 12 is fixed in the housing 11 through retainer ring 15.
Promptly; Retainer ring 15 has pin thread 151 on outer peripheral face; Corresponding with it; In housing 11, be provided with the order difference part 111 of accepting circuit substrate 12 and the negative thread 112 that screws togather with above-mentioned pin thread 151, through retainer ring 15 being threaded in the above-mentioned negative thread 112, circuit substrate 12 is pressed against on the order difference part 111 and fixing.
In addition, the amount of being screwed into respect to above-mentioned negative thread 112 of retainer ring 15 is about Lower Half, and the pin thread 151 of the first half is reserved in order to link microphone utricule 20.After circuit substrate 12 is fixing, for example fill packing materials 16 such as silicone resin in the depression between impedance transformer 13 and retainer ring 15.
According to above-mentioned binding structure; Only through microphone utricule 20 is just rotated dismounting microphone utricule 20 simply with respect to utricule support 10; But owing to for example fill packing material 16 such as silicone resin in the depression between FET13 and retainer ring 15, so there is the problem in problem, the problem on the assembling operation property and the maintenance on the following sound.
That is, if between FET13 and retainer ring 15, there is depression, then the rear portion air chamber of microphone utricule 20 becomes big, and it becomes the reason that on sound, produces resonance, brings harmful effect for the frequency characteristic and the directive property of microphone utricule 20.
In order to prevent this problem; In above-mentioned example in the past with the depression between FET13 and the retainer ring 15 with packing materials such as silicone resin 16 landfills; But because the management of its loading is difficult; So for each goods, in to the volume of the rear portion air chamber of microphone utricule 20, produce inhomogeneously, this bring delicate influence can for the frequency characteristic and the directive property of microphone utricule 20.
In addition, owing to after packing material 16 is filled, drying process must be set, so correspondingly expend time in and the productivity ratio variation.And then packing material 16 has the situation of damage when when safeguarding, for example circuit substrate 12 being pulled down etc., must packing material 16 all be got under these circumstances and remove and carry out filling operation again.
As the problem different problems of bringing with packing material, in above-mentioned example in the past, because contact terminal 14 is welded on the gate terminal of FET13, so that assembling operation becomes is complicated, productivity ratio descends.
In addition, containing in use also need be to the consideration of environment under the situation of lead solder.In addition,, do not have lead solder and compare the not only higher heating-up temperature of needs, and cost is higher, so be not easy to adopt with containing lead solder though also have or not lead solder.
So, the condenser microphone of above-mentioned each problem has been proposed to improve in the patent documentation 1 of the former submission of the applicant (japanese open 2005-184410 communique), through Fig. 6, Fig. 7 its structure is described.In addition, the example in the past of Fig. 5 is routine in the past as the 1st, patent documentation 1 described condenser microphone is routine in the past as the 2nd.
Fig. 6 is with as the 2nd cutaway view of the microphone utricule that comprises 20 and microphone support 10A discrete representation in the patent documentation 1 described condenser microphone of example in the past, and Fig. 7 is with the contact terminal 140 and the end view of block 180 discrete representations that are located on the microphone support 10A.
In addition, microphone utricule 20 is and above-mentioned routine in the past identical structure, in addition, and for microphone support 10A, also for the above-mentioned the 1st the microphone support 10 of example was identical maybe can regard identical structural element as and give identical Reference numeral in the past.
The 2nd in the past in the example; Also in microphone support 10A, take in circuit substrate 120, but in the case, FET13 is installed on circuit substrate 120 and back sides microphone utricule 20 opposition sides; Corresponding to this; Substantial middle portion at the upper surface of microphone utricule 20 sides of circuit substrate 120 though there is not shown in detail in figs, is formed with via via: Via Hole (intercommunicating pore: the electrode pattern that Through Hole) electrically is connected with the gate terminal of FET13.
On the upper surface of circuit substrate 120; Dispose contact terminal 140 as the other side of the contact plug 23 of microphone utricule 20; In the case; Contact terminal 140 is as shown in Figure 7, forms roughly コ word shape, possess the base plate 141 that preferably has contact protrusion 141a in order to contact with above-mentioned electrode pattern, from an end approximate right angle of base plate 141 the side plate 142 holded up and the contact piece of holding up with set angle from the upper end of side plate 142 143; Wrap in the portion within it under the state of the block 180 that constitutes by elastomeric material, be configured on the above-mentioned electrode pattern via cap member 160 as holding member.
According to the above-mentioned the 2nd example in the past, the volume of the rear portion air chamber of utricule support side is because by the cap member high-air-tightness ground little certain value that suppress to be to try one's best, so the resonance on the sound can not take place.In addition, just passable as long as cap member is embedded on the block, and in the installation of contact terminal, do not use soldering, so improved assembling operation property significantly.
In addition, when safeguarding, also can easily decompose, assemble again.And then, can the housing of microphone utricule and the housing of utricule support be connected on ground connection (the グ ラ Application De) pattern of circuit substrate reliably.
But; The above-mentioned the 2nd in the past in the example, also have because of as the combination on the sound of the inner space of the microphone support 10A that is communicated with support column P of the lower face side of the back space of the microphone utricule 20 of the upper surface side of circuit substrate 120 and circuit substrate 120, point to the situation of frequency response deterioration.
Being combined in less hole or the gap slightly on this sound also takes place.The above-mentioned the 2nd in the past in the example, the less hole that the combination on the sound takes place is the via that is located on the circuit substrate 120.
In addition, cap member 160 is made up of rubber elastomer, even but cap member 160 usefulness retainer rings are fastening, also on the contact site of the lower hem 162 of cap member 160 and circuit substrate 120, produce the gap slightly that combines that takes place on the sound sometimes.
This gap slightly can be by ca(u)lk clogged with material such as for example RTV rubber, but for example when the safeguarding of the dismounting that needs circuit substrate 120, must the ca(u)lk material be got and remove, so the use of ca(u)lk material is not preferred.
In addition; In the time will inserting the microphone cable 17 that leads in support column P and be pulled in the utricule support 10A; Though on microphone cable 17, be formed with knob ball as stop part; But stop up the situation of the opening portion of support column P according to this knob ball, combine on the tut also to change, have as former thereby point to the situation of frequency response deterioration.
In order to prevent that this situation from taking place; Paddings such as sponge are pressed in the opening portion of support column P and partly seek the insulation on the sound; Though can see something of improvement thus,, make the deterioration complete obiteration of pointing to frequency response so not only can not reach because the insulating effect on its sound is not certain; And as problem before, it is not preferred in the aspect of assembling operation property that paddings such as sponge are pressed into this.
In addition, as another problem, the problem that the noise that has the lip-deep leakage current of circuit substrate 120 to cause takes place.Circuit substrate 120 is clipped between the lower hem 162 of order difference part 111 and cap member 160 of housing 11; But accumulate humidity in the gap portion between it easily, have the leakage current that is produced because of surface resistivity minimizing that the situation of noise takes place along with circuit substrate 120.
The noise that this leakage current brings only takes place under the such high humility of microphone dewfall; Under common user mode, take place hardly, but for example microphone be arranged on put cold air the room in, door is opened etc. and flow into the ambient atmos of high humility from the outside, take place at microphone can become remarkable under the situation of dewfall.
Summary of the invention
Thereby, the objective of the invention is the microphone utricule is being bearing in the condenser microphone that forms on the utricule support that is installed on the support column, insulated on sound reliably in the rear portion side cavity and the support column side cavity in the utricule support of microphone utricule.
To achieve these goals; The present invention provides a kind of condenser microphone; Comprise the utricule support on the front end that is installed in support column and be attached at the microphone utricule on the above-mentioned utricule support via the chimeric mechanism of screw thread; Lead to the contact plug of signal output usefulness towards above-mentioned utricule support side from the rear end of above-mentioned microphone utricule; In above-mentioned utricule support, be provided with the circuit substrate and the contact terminal that contacts with above-mentioned contact plug that have as the FET of impedance transformer; Above-mentioned FET is installed on the back side of microphone utricule opposition side of foregoing circuit substrate, is formed with the electrode pattern that electrically is connected via via and the set terminal of above-mentioned FET in the substantial middle portion of the upper surface of the microphone utricule side of foregoing circuit substrate, and above-mentioned contact terminal is remained on the above-mentioned electrode pattern by set maintaining body; Along with above-mentioned microphone utricule and above-mentioned utricule support being linked via the chimeric mechanism of above-mentioned screw thread; Above-mentioned contact plug electrically contacts with above-mentioned contact terminal, it is characterized in that, the above-mentioned via that is located on the foregoing circuit substrate is stopped up by set blockage mechanism.
Thus; Because the via that wears on the circuit substrate in being disposed at the utricule support is stopped up by set blockage mechanism; So insulated on sound with the support column side cavity in the utricule support reliably in the rear portion side of microphone utricule cavity, so can access good sensing frequency response.
It is characterized in that; Above-mentioned via is located at the outside of above-mentioned electrode pattern; The above-mentioned maintaining body cap member that lower hem is fixed on by set fixed mechanism on the circumference of foregoing circuit substrate by keep above-mentioned contact terminal with central portion constitutes, and above-mentioned blockage mechanism is made up of the pad of the ring-type between the lower hem of roughly whole configuration of the upper surface side that except the part of above-mentioned electrode pattern, spreads all over the foregoing circuit substrate, the circumference that enters into the foregoing circuit substrate and above-mentioned cap member.
The circuit substrate integrally closed that can will comprise thus, the circumference of via and circuit substrate through above-mentioned pad.
As preferred technical scheme, it is characterized in that, in above-mentioned pad, use the polyflon film.
According to the present invention; If the PTFE resin because surface resistivity, specific insulation is all high and compress then easy deformation to be adapted to the gap; So can accumulate humidity hardly in the gap between the lower hem of the circumference of circuit substrate and cap member, can prevent effectively that thus the noise that leakage current causes from taking place.
Description of drawings
Fig. 1 will be included in utricule support and the exploded view that in a part, comprises section of microphone utricule discrete representation in the condenser microphone of the present invention.
Fig. 2 is the view sub-anatomy of the above-mentioned utricule support of expression.
Fig. 3 (a)～Fig. 3 (c) is vertical view, end view and the upward view that is accommodated in the circuit substrate in the utricule support.
Fig. 4 is (a) vertical view, (b) cutaway view of the pad representing to use in embodiments of the present invention.
Fig. 5 is with being included in the 1st utricule support and the exploded view that in a part, comprises section of microphone utricule discrete representation in the condenser microphone of example in the past.
Fig. 6 is with being included in the 2nd utricule support and the exploded view that in a part, comprises section of microphone utricule discrete representation in the condenser microphone of example in the past.
Fig. 7 is with the above-mentioned the 2nd contact terminal and the end view of block discrete representation of example in the past.
Embodiment
Then, through Fig. 1 to Fig. 4 execution mode of the present invention is described, but the present invention is not limited to this.
Fig. 1 will be included in utricule support 10B and the exploded view that in a part, comprises section of microphone utricule 20 discrete representations in the condenser microphone of the present invention; Fig. 2 is the view sub-anatomy of expression utricule support 10B; Fig. 3 (a)～Fig. 3 (c) is vertical view, end view and the upward view that is accommodated in the circuit substrate 120 in the utricule support 10B, and Fig. 4 (a), Fig. 4 (b) are the vertical view and the cutaway views of expression pad.
Here the execution mode of explanation is the above-mentioned the 2nd structure in the example in the past by Fig. 6, Fig. 7 explanation that the present invention is applied to the front, thereby for routinely in the past identically maybe regarding identical structural element as and give identical Reference numeral with the above-mentioned the 2nd.In addition, in the explanation of this execution mode, the structure of microphone utricule 20 sides also can be routine in the past identical with the above-mentioned the 1st, the 2nd, so omit its explanation, the structure to utricule support 10B describes specially.
Like Fig. 1 and shown in Figure 2, in this embodiment, utricule support 10B also possesses the housing cylindraceous 11 on the front end of the support column P that is installed in the gooseneck type.In housing 11, use metal materials such as brass or aluminium.
In housing 11, take in circuit substrate 120, and in housing 11, be screwed into the retainer ring 150 of permanent circuit substrate 120.Therefore, in housing 11, be formed with the order difference part 111 of the circumference of accepting circuit substrate 120 and be used for screwing togather the negative thread 112 of retainer ring 150.
Also shown in Fig. 3 (c); In the present invention; Be installed in the rear side (with microphone utricule opposition side) of circuit substrate 120 as the FET13 of impedance transformer, thereupon, shown in Fig. 3 (a); Substantial middle portion in the upper surface side (microphone utricule side) of circuit substrate 120 is formed with the gate electrode pattern 122 that is connected with the gate terminal of FET13 via via (intercommunicating pore) 121 as circular pattern.
In addition, shown in Fig. 3 (a), Fig. 3 (c), grounding pattern 123a, 123b that the earth terminal (source electrode or drain electrode) beyond the gate terminal that is formed with along the circumference of circuit substrate 120 on the upper and lower surface of the circumference of circuit substrate 120 with FET13 is connected.The grounding pattern 123a of upper surface side and the grounding pattern 123b of lower face side are via via 124 conductings.
The grounding pattern 123a of upper surface side and the following end in contact of retainer ring 150, the grounding pattern 123b of lower face side contacts with the order difference part 111 of housing 11.In addition, insert lead in support column P and derivative microphone cable 17 with the above-mentioned the 2nd in the past example likewise be welded on the set pattern of lower face side of circuit substrate 120.
In addition, in this example, shown in Fig. 3 (a), Fig. 3 (c), on 180 ° opposed of the left and right sides of circuit substrate 120, be formed with D section 125,125 with respect to housing 11 location usefulness.
On above-mentioned gate electrode pattern 122, example was same in the past with the above-mentioned the 2nd, carried the contact terminal 140 that is equipped with respect to contact plug 23 contacts of microphone utricule 20 sides with the state that block 180 is wrapped into.
Fig. 7 with reference to the front; Contact terminal 140 form have base plate 141, from an end of base plate 141 to microphone utricule 20 side approximate right angle the roughly コ word shape of the substrate 142 holded up and the contact piece 143 holded up to oblique upper with set angle from the upper end of side plate 142, its integral body is made up of the leaf spring material.
, uses contact terminal 140 cap member 160 of electric insulating quality for being positioned on the above-mentioned gate electrode pattern 122 with block 180.Cap member 160 possess the contact piece that makes contact terminal 140 143 to above be entrenched in the peristome 161 on the block 180 under the outstanding state and be configured in block 180 and the circumference of circuit substrate 120 between the lower hem 162 of roughly umbrella shape shape.
The retainer ring 150 of example was same in the past with the above-mentioned the 2nd for retainer ring 150; Possessing the pin thread 151 that screws togather with the negative thread 241 that is formed on negative thread 112 and microphone utricule 20 sides on the housing 11 on its outer peripheral face, and pressing against the rank portion 152 on the circuit substrate 120 at the lower hem 162 that the inner face side of this retainer ring 150 is formed with cap member 160.
Through not shown instrument being engaged in the hook hole 153 on the upper surface that is formed at retainer ring 150 and the latter half of the pin thread 151 of retainer ring 150 is threaded in the negative thread 112 of housing 11; The lower hem 162 of cap member 160 is pressed against on the circuit substrate 120, and the circumference of circuit substrate 120 is fixed between the order difference part 111 of lower end and housing 11 of retainer ring 150.
In addition, be threaded into through negative thread 241 on the first half of pin thread 151 of retainer ring 150, microphone utricule 20 is installed on the utricule support 10B microphone utricule 20 sides.
But; Owing on circuit substrate 120, be formed with via 121,124; So cavity (air chamber) A2 of the support column P side in the cavity of the rear portion side of microphone utricule 20 (air chamber) A1 and the utricule support 10B combines on sound, make sometimes as reason and to point to the frequency response deterioration.In addition, the situation that also has above-mentioned air chamber A1, A2 on sound, to combine via the part of the D section 125 of circuit substrate 120.
So, in the present invention, possess the mechanism that via 121,124 is stopped up.Via 121,124 also can be through obstructions such as application of resin or splicing tapes, but in this example, use the pad 190 of that kind shown in Figure 4 as blockage mechanism.
In this example; Roughly the same circular of the internal diameter of the grounding pattern 123a of the upper surface side that pad 190 forms that internal diameter φ 1 is bigger slightly than the diameter of gate electrode pattern 122, external diameter φ 2 and circumference along circuit substrate 120 form; As shown in Figure 2; Be configured between cap member 160 and the circuit substrate 120, its circumference is fixing with the lower hem 162 of cap member 160 through retainer ring 150.
Thus; Because the lower hem 162 of the hole of via 121,124 and cap member 160 is stopped up through pad 190 with the gap between the circuit substrate 120, so can the empty A1 of the rear portion side of microphone utricule 20 and the empty A2 of the support column P side in the utricule support 10B be insulated on sound reliably.
In the case, pad 190 preferably is made up of the film of polytetrafluoroethylene (PTFE) resin.Thickness also can be about 0.1mm.
If the PTFE resin film because surface resistivity, specific insulation is all high and the compression then be out of shape to be adapted to the gap; So can the lower hem 162 of cap member 160 and the gap between the circuit substrate 120 be stopped up reliably; In this gap, can not accumulate humidity, so can prevent the noise that circuit substrate 120 lip-deep leakage currents bring effectively.
In addition, in the above-described embodiment, make the external diameter φ 2 of pad 190 roughly the same with the internal diameter of above-mentioned grounding pattern 123a, but also can make the external diameter φ 2 of pad 190 and above-mentioned grounding pattern 123 external diameter, be that the external diameter of circuit substrate 120 is roughly the same.
Come what may, the housing 21 of microphone utricule 20 electrically is connected via retainer ring 150 with the housing 11 of utricule support 10B, is connected on the ground wire of circuit substrate 120 via at least one grounding pattern among grounding pattern 123a, the 123b.
Claims (3)
1. condenser microphone; Comprise the utricule support on the front end that is installed in support column and be attached at the microphone utricule on the above-mentioned utricule support via the chimeric mechanism of screw thread; Lead to the contact plug of signal output usefulness towards above-mentioned utricule support side from the rear end of above-mentioned microphone utricule; In above-mentioned utricule support, be provided with the circuit substrate and the contact terminal that contacts with above-mentioned contact plug that have as the FET of impedance transformer; Above-mentioned FET is installed on the back side of microphone utricule opposition side of foregoing circuit substrate; Central portion at the upper surface of the microphone utricule side of foregoing circuit substrate is formed with the electrode pattern that electrically is connected via via and the set terminal of above-mentioned FET, and above-mentioned contact terminal is remained on the above-mentioned electrode pattern by set maintaining body, along with via the chimeric mechanism of above-mentioned screw thread above-mentioned microphone utricule and above-mentioned utricule support being linked; Above-mentioned contact plug electrically contacts with above-mentioned contact terminal; The cavity of the support column side in the cavity of the rear portion side of above-mentioned microphone utricule and the above-mentioned utricule support combines on sound via above-mentioned via, it is characterized in that
The above-mentioned via that is located on the foregoing circuit substrate is stopped up by set blockage mechanism.
2. condenser microphone as claimed in claim 1; It is characterized in that; Above-mentioned via is located at the outside of above-mentioned electrode pattern; The above-mentioned maintaining body cap member that lower hem is fixed on by set fixed mechanism on the circumference of foregoing circuit substrate by keep above-mentioned contact terminal with central portion constitutes, and above-mentioned blockage mechanism is made up of the pad of the ring-type between the lower hem of whole configuration of the upper surface side that except the part of above-mentioned electrode pattern, spreads all over the foregoing circuit substrate, the circumference that enters into the foregoing circuit substrate and above-mentioned cap member.
3. condenser microphone as claimed in claim 2 is characterized in that, in above-mentioned pad, uses the polyflon film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006282493 | 2006-10-17 | ||
| JP2006-282493 | 2006-10-17 | ||
| JP2006282493A JP4637076B2 (en) | 2006-10-17 | 2006-10-17 | Condenser microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101166373A CN101166373A (en) | 2008-04-23 |
| CN101166373B true CN101166373B (en) | 2012-12-12 |
Family
ID=39334773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710180821 Active CN101166373B (en) | 2006-10-17 | 2007-10-17 | Capacitance type microphone |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4637076B2 (en) |
| CN (1) | CN101166373B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5705930B2 (en) * | 2013-08-21 | 2015-04-22 | 日本写真印刷株式会社 | Composite molded article and manufacturing method thereof |
| CN108225583A (en) * | 2017-12-08 | 2018-06-29 | 中国北方发动机研究所(天津) | A kind of T-shaped sensor Anti-blocking device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4691363A (en) * | 1985-12-11 | 1987-09-01 | American Telephone & Telegraph Company, At&T Information Systems Inc. | Transducer device |
| JP2003102096A (en) * | 2001-09-20 | 2003-04-04 | Hosiden Corp | Electret condenser microphone |
-
2006
- 2006-10-17 JP JP2006282493A patent/JP4637076B2/en active Active
-
2007
- 2007-10-17 CN CN 200710180821 patent/CN101166373B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP4637076B2 (en) | 2011-02-23 |
| JP2008103815A (en) | 2008-05-01 |
| CN101166373A (en) | 2008-04-23 |
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