CN101154027B - Optical device and projection machine - Google Patents

Optical device and projection machine Download PDF

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Publication number
CN101154027B
CN101154027B CN2007101616824A CN200710161682A CN101154027B CN 101154027 B CN101154027 B CN 101154027B CN 2007101616824 A CN2007101616824 A CN 2007101616824A CN 200710161682 A CN200710161682 A CN 200710161682A CN 101154027 B CN101154027 B CN 101154027B
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China
Prior art keywords
aforementioned
heat
heat pipe
optical element
conduction member
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CN101154027A (en
Inventor
柳泽佳幸
百濑泰长
藤森基行
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Seiko Epson Corp
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Seiko Epson Corp
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Priority claimed from JP2006267944A external-priority patent/JP4301277B2/en
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Abstract

The invention provides an optical device and a projector. The main body of the optical device is provided with: a light modulating device of an optical element which switches the optical property of the incident light beam and emits; a heat conducting element which can be connected with the light modulating device in a heat transferring way to cool the light modulating device and constituted by the heat conducting tube doing a heat transferring by refluxing the refrigerant inside the tube and holding the refrigerant and having the capillary structure inside. A connecting portion which connects the light modulating device to the optical element side of the heat conducting element and a connecting portion at the heat conducting element side have a contacted shape in a connection state.

Description

Optical devices and projector
Technical field
The present invention relates to optical devices and projector.
Background technology
Existing, known projector possesses and has: corresponding to image information to optic modulating device of modulating from the emitted light beam of light source and the projecting optical device that the light beam of being modulated by optic modulating device is carried out enlarging projection.
As optic modulating device, for example, generally adopt the airtight optical modulation element of enclosing liquid crystal (liquid crystal panel) between 1 pair of substrate.And usually, at the light beam light incident side and the light beam emitting side of optical modulation element, configuration makes the light beam with predetermined polarization axle carry out the light incident side polarization plates and the emitting side polarization plates of transmission respectively.
In the projector that possesses just like optical elements such as above-mentioned optical modulation element, light incident side polarization plates and emitting side polarization plates, because light beam from light source, light absorption by liquid crystal layer, black matrix and various wirings etc. causes the optical modulation element temperature to rise easily, and also is easy to generate heat in polarization plates.
Therefore, following technology is proposed: in inside has projector as above-mentioned optical element, adopt heat pipe that optical element is cooled off (for example, reference literature: the spy opens the 2001-312002 communique).
Be recorded in the technology in the document, set heat pipe, and make the endothermic section (evaporation part) of cooling fins thermo-contact in heat pipe in the position of leaving from optical elements such as liquid crystal panels.Then, near the heat of the air the optical elements such as liquid crystal panel is transmitted to cooling fins, absorbs the heat of cooling fins by heat pipe, is delivered to the radiating part (condensation part) of heat pipe and dispels the heat.
Yet, in the technology in being recorded in aforementioned documents, because be the structure of optical element being cooled off by air, so the thermal resistance that the heat of the evaporation part of air and heat pipe (cooling fins) is transmitted is big, the temperature of air reduces difficulty, as a result of be to cool off optical element effectively.
Summary of the invention
Fundamental purpose of the present invention relates to optical devices and the projector that can cool off optical element effectively.
Projector of the present invention possesses: light supply apparatus, corresponding to image information to optical devices of modulating from the emitted light beam of aforementioned light supply apparatus and the projecting optical device that the light beam of being modulated by aforementioned optical devices is carried out enlarging projection; Aforementioned optical devices are characterised in that, possess: incident beam is carried out optical conversion and the optical element that penetrates; With comprise that heat pipe constitutes, can heat be connected in aforementioned optical element and heat conduction member that aforementioned optical element is cooled off with transmitting, this heat pipe forms the tubulose that has capillary pipe structure in inside and places cooling medium in pipe inside, carries out thermophoresis by aforementioned cooling medium in the pipe internal reflux; The optical element side connecting portion that is connected in aforementioned heat conduction member in the aforementioned optical element, and the heat conduction member side connecting portion that is connected in aforementioned optics component side connecting portion in the aforementioned heat conduction member have the shape that contacts below interconnected state.
At this,, can adopt: possess optical modulation element is arranged, the formation of optical element main body such as light incident side polarization plates, emitting side polarization plates and maintenance frame that the optical element main body is kept as optical element; Or omit the maintenance frame, only have the formation of optical element main body.
And, as heat conduction member, can adopt: possess heat pipe is arranged, with the formation of other members that can be connected to the heat transmission with this heat pipe; Or omit aforementioned other members, only have the formation of heat pipe.
And, capillary pipe structure as heat pipe, can adopt various structures, for example can illustration: the superfine line style capillary wick (wick) that is constituted by many fine copper wires etc., cancellous wire netting type capillary wick, in the inner capillary wick that is formed with the grooved of multiple tracks groove of pipe, perhaps pulverous slug type capillary wick etc.
And then, as optical element and heat conduction member, as long as have the shape of interconnected each connecting portion (optical element side connecting portion and heat conduction member side connecting portion) face contact, can illustration: with optical element side connecting portion as the outside surface of optical element and the formation of the shape ground formation heat conduction member side connecting portion of consistent outside surface in optical element; With heat conduction member side connecting portion as the outside surface of heat conduction member and the shape ground of consistent outside surface in heat conduction member forms the formation of optical element side connecting portion; Perhaps optical element side connecting portion and the mutual face of heat conduction member side connecting portion form the formation of each connecting portion etc. contiguously respectively.
In the present invention, heat conduction member comprises that heat pipe constitutes, and can heat be connected in optical element with transmitting.Thus, compare with existing formation because heat conduction member between itself and optical element by air, and be directly connected in optical element, so can reduce thermal resistance in the heat transfer path of optical element~heat conduction member.
And optical element and heat conduction member have the shape that interconnected each connecting portion (optical element side connecting portion and heat conduction member side connecting portion) carries out the face contact.Thus, can increase the contact area between optical element and heat conduction member, can make from optical element good to the heat transfer characteristic of heat conduction member.
Thereby, can cool off optical element effectively, the temperature of optical element is risen suppress and can prevent the hot deterioration of optical element effectively.
In projector of the present invention, preferred: aforementioned optics component side connecting portion is the outside surface of aforementioned optical element; Aforementioned heat conduction member forms aforementioned heat conduction member side connecting portion at the outside surface of aforementioned heat pipe; The aforementioned heat conduction member side connecting portion of aforementioned heat pipe, unanimity forms by pressure processing in the shape ground of the outside surface of aforementioned optical element.
In the present invention, optical element and heat pipe, mutual outside surface are connected with can carrying out the heat transmission each other.And, being formed at the heat conduction member side connecting portion of the outside surface of heat pipe, the shape ground of consistent outside surface in optical element forms by pressure processing.Thus, for example with the outside surface of heat pipe as heat conduction member side connecting portion and the shape ground of consistent outside surface in heat pipe forms the formation of optical element side connecting portion and compares, only, heat pipe just can realize that each connecting portion (optical element side connecting portion and heat conduction member side connecting portion) of optical element and heat pipe carries out the face contacting structure by being implemented pressure processing, with simple formation, just can cool off above-mentioned optical element effectively, can reach well rises to the temperature of optical element suppresses and prevents the effect of the hot deterioration of optical element effectively.
In projector of the present invention, preferred: aforementioned heat conduction member, possess that face is contacted with the outside surface of aforementioned heat pipe and the outer framework that can heat connect with transmitting, the outside surface of framework forms aforementioned heat conduction member side connecting portion outside aforementioned.
In the present invention, heat conduction member possesses heat pipe and outer framework, is clipping between heat pipe and optical element under the state that has disposed outer framework, contacts with the optical element face.Thus, the formation that heat pipe and optical element face is contacted with for example heat pipe being implemented pressure processing etc. is compared, because be the formation that framework disposes outside heat pipe and optical element chien shih mediately, so needn't implement pressure processing etc. to heat pipe, the shape that only the heat conduction member side connecting portion of the outside surface of outer framework is processed into the shape of consistent outside surface in optical element gets final product, can keep the characteristic of heat pipe well, and effectively above-mentioned optical element is cooled off, can reach well rises to the temperature of optical element suppresses and can prevent the effect of the hot deterioration of optical element effectively.
In projector of the present invention, preferred: aforementioned optics component side connecting portion is formed at each side end of the mutual subtend of aforementioned optical element respectively; Aforementioned heat conduction member, form have the base end part that extends predetermined direction and roughly be orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part from the two end portions of aforementioned base end part overlook the コ shape, form aforementioned heat conduction member side connecting portion at aforementioned a pair of extension respectively corresponding to each aforementioned optics component side connecting portion.
In the present invention, heat conduction member, form have base end part and an a pair of extension overlook the コ shape, form heat conduction member side connecting portion respectively at a pair of extension.And heat conduction member can hot each optical element side connecting portion that be connected to each side end of the mutual subtend that is formed at optical element with each the heat conduction member side connecting portion that is formed at a pair of extension with transmitting.That is, constitute the heat pipe of heat conduction member, at least a portion of a pair of extension works respectively as the evaporation part that absorbs heat, and the side of leaving from each evaporation part (for example, base end part) then works as the condensation part of dispelling the heat.Thus, for example with any 1 side end among each side end of optical element only, the formation that heat conduction member can be connected to the heat transmission is compared, in heat pipe, can make return flow path at the inner cooling medium of pipe, (for example become in the condensation part of each evaporation part of at least a portion of each extension and the side left from each evaporation part, base end part) mulitpath between (for example, 2 paths), the migration amount of the inner heat of pipe is increased, can cool off above-mentioned optical element effectively, can reach better rises to the temperature of optical element suppresses and can prevent the effect of the hot deterioration of optical element effectively.And, in order effectively optical element to be cooled off, though for example can consider 2 heat conduction members can heat be connected to with transmitting the formation of each side end of the mutual subtend of optical element, but in formation of the present invention, because just can cool off optical element effectively by 1 heat conduction member, so can make the designs simplification of optical devices, and can seek the cost reduction of optical devices.
In projector of the present invention, preferred: aforementioned optics component side connecting portion is formed at each side end of the mutual subtend of aforementioned optical element respectively; Aforementioned heat conduction member has the ring-type of the peripheral end that surrounds aforementioned optical element, and subtend forms aforementioned heat conduction member side connecting portion in the inside part ground of ring-type respectively corresponding to each aforementioned optics component side connecting portion ground mutually.
In the present invention, heat conduction member has the ring-type of the peripheral end that surrounds optical element, and subtend forms heat conduction member side connecting portion respectively in the inside part ground of ring-type mutually.And, heat conduction member, formed each heat conduction member side connecting portion can hot each optical element side connecting portion that be connected to each side end of the mutual subtend that is formed at optical element with transmitting in the inside part ground of ring-type with mutual subtend.Promptly, constitute the heat pipe of heat conduction member, the at least a portion that is formed with each position of each heat conduction member side connecting portion works respectively as the evaporation part that absorbs heat, then works respectively as the condensation part of heat radiation in each position that is positioned between each heat conduction member side connecting portion of the side of leaving from each evaporation part.Thus, for example with any 1 side end among each side end of optical element only, the formation that heat conduction member is connected with can carrying out the heat transmission is compared, in heat pipe, can make return flow path at the inner cooling medium of pipe, become between each condensation part (being positioned at each position between each heat conduction member side connecting portion) of each evaporation part of at least a portion at each position that is formed with each heat conduction member side connecting portion and the side left from each evaporation part mulitpath (for example, 4 paths), the migration amount of the inner heat of pipe is increased, can cool off above-mentioned optical element effectively, can reach better rises to the temperature of optical element suppresses and can prevent the effect of the hot deterioration of optical element effectively.And, in order effectively optical element to be cooled off, though for example can consider 2 heat conduction members can heat be connected to with transmitting the formation of each side end of the mutual subtend of optical element, but in formation of the present invention, because just can cool off optical element effectively and the temperature of optical element risen suppress by 1 heat conduction member, so can make the designs simplification of optical devices, and can seek the cost reduction of optical devices.
In projector of the present invention, preferred: as, the wing tabs of heat transmission to be set at the outside surface of aforementioned heat conduction member.
If according to the present invention, then, the wing tabs of heat transmission is set because at the outside surface of heat conduction member, so by the evaporation part of heat conduction member from the heat that optical element absorbed, by the wing tabs, dispel the heat in the outside.Therefore, in heat conduction member, can fully guarantee area of dissipation and make heat dissipation characteristics good.
In projector of the present invention, preferred: aforementioned wing tabs forms the formation of fin shape for the outside surface with aforementioned heat conduction member.
If according to the present invention, then because the wing tabs, form the formation of fin shape for outside surface with heat conduction member, so for example with the wing tabs compare with the situation that heat conduction member has carried out constituting with split, can make the heat of moving be transmitted to the wing tabs well, dispel the heat well by the wing tabs in the pipe inside of heat conduction member.
In projector of the present invention, preferred: aforementioned wing tabs, constituted with split with aforementioned heat conduction member, can be connected in to the heat transmission outside surface of aforementioned heat conduction member.
If according to the present invention, then because wing tabs and heat conduction member are constituted with split, so for example with as the formation of wing tabs and the situation that the outside surface of heat conduction member forms the fin shape is compared, can not limit the shape of wing tabs and form different shape, can improve the degree of freedom of the design of wing tabs.
Projector of the present invention possesses: light supply apparatus, corresponding to image information to optical devices of modulating from the emitted light beam of aforementioned light supply apparatus and the projecting optical device that the light beam of being modulated by aforementioned optical devices is carried out enlarging projection; Aforementioned optical devices are characterised in that, possess: incident beam is carried out optical conversion and the optical element that penetrates; With form the tubulose that has capillary pipe structure in inside and place cooling medium in pipe inside, carry out thermophoresis in the pipe internal reflux by aforementioned cooling medium, can heat be connected in aforementioned optical element and heat pipe that aforementioned optical element is cooled off with outside surface with transmitting; At the outside surface of aforementioned heat pipe, the wing tabs of heat transmission is set.
At this,, can adopt: possess optical modulation element is arranged, the formation of optical element main body such as light incident side polarization plates, emitting side polarization plates and maintenance frame that the optical element main body is kept as optical element; Or omit the maintenance frame, only have the formation of optical element main body.
And, capillary pipe structure as heat pipe, can adopt various structures, for example can illustration: the superfine line style capillary wick that is constituted by many fine copper wires etc., cancellous wire netting type capillary wick, in the inner capillary wick that is formed with the grooved of multiple tracks groove of pipe, perhaps pulverous slug type capillary wick etc.
In the present invention, heat pipe can heat be connected in optical element with outside surface with transmitting.Thus, compare with existing formation because heat pipe between itself and optical element by air, and be directly connected in optical element, so can reduce thermal resistance in the heat transfer path of optical element~heat pipe.
And,, the wing tabs of heat transmission is set at the outside surface of heat pipe.Thus,,, dispel the heat from the heat that optical element absorbed by the evaporation part of heat pipe in the outside by the wing tabs.Therefore, in heat pipe, can fully guarantee area of dissipation and make heat dissipation characteristics good, reduce the temperature of the condensation part that is positioned at the side of leaving from the evaporation part.That is, in heat pipe, can set the temperature difference between evaporation part and condensation part greatly, the migration amount of the inner heat of pipe is increased.
Thereby, can cool off optical element effectively, the temperature of optical element is risen suppress and can prevent the hot deterioration of optical element effectively.
In projector of the present invention, preferred: aforementioned heat pipe has the I of overlooking shape.
If according to the present invention,,, just can cool off optical element effectively with heat pipe with easy structure so needn't implement to make the processing of this heat pipe bending etc. then because heat pipe has the I of overlooking shape.
And, because heat pipe, has the I of overlooking shape, so for example if constitute with the essentially identical length dimension of physical dimension (longitudinal size or lateral dimension) with optical element, and the outside surface of connection and optical element, even then optical element is being equipped with under the state of heat pipe, do not increase the size of optical devices yet, make the optical devices densification, can seek the miniaturization of optical devices.
In projector of the present invention, preferably: aforementioned heat pipe, form and have the base end part that extends predetermined direction, overlook the コ shape with two end portions from aforementioned base end part roughly is orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part, can heat be connected in aforementioned optical element with transmitting with either party outside surface of コ shape Outboard Sections of extension among the aforementioned a pair of extension.
In the present invention, heat pipe, form have base end part and an a pair of extension overlook the コ shape, can heat be connected in optical element with either party outside surface of コ shape Outboard Sections of extension among a pair of extension with transmitting.Thus, for example if the side end of the direction (vertical direction) that produces along conducting oneself with dignity among each side end of optical element connects heat pipe, then in the projector that optical devices are installed, can not become big owing to heat pipe makes the length dimension (gauge) of vertical direction.And, when optical devices being equipped on projector inside, can easily make heat pipe be arranged in the space of each member of projector inside, can avoid the maximization of projector.And, because by making heat pipe become above-mentioned shape as connect above-mentionedly, can avoid the maximization of projector, and must be long with the length setting of heat pipe, so in heat pipe, area of dissipation is further increased, can set the temperature difference between evaporation part and condensation part biglyyer, the migration amount of the inner heat of pipe is further increased.
In projector of the present invention, preferred: aforementioned wing tabs possesses: be arranged at aforementioned heat pipe コ shape inside part outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of outside surface of the コ shape Outboard Sections of aforementioned heat pipe.
If according to the present invention, then because the wing tabs, in heat pipe, the 1st wing tabs and the 2nd wing tabs that is arranged at the outside surface of コ shape Outboard Sections that possess the outside surface that is arranged at コ shape inside part, so can the size increase of the optical devices that caused by the wing tabs that is arranged at heat pipe be suppressed, and guarantee area of dissipation fully.
In projector of the present invention, preferred: aforementioned heat pipe has ring-type, and can heat be connected in aforementioned optical element with the outside surface of the Outboard Sections of ring-type with transmitting.
In the present invention, heat pipe has ring-type, and can heat be connected in optical element with the outside surface of the Outboard Sections of ring-type with transmitting.Thus, because for example if the side end of the direction (vertical direction) that produces along conducting oneself with dignity among each side end of optical element connects heat pipe, then with similarly above-mentioned, can avoid the maximization of projector, and must be long, so in heat pipe, area of dissipation be further increased with the length setting of heat pipe, can set the temperature difference between evaporation part and condensation part biglyyer, the migration amount of the inner heat of pipe is further increased.
And then, by making heat pipe become above-mentioned shape as connect above-mentionedly, heat pipe, at least a portion that is connected in the connecting portion of optical element works as the evaporation part, and then work as the condensation part in the position of leaving of the side of leaving from the evaporation part.Thus,,, between evaporation part and condensation part, become 2 paths, the migration amount of the inner heat of pipe is further increased so in heat pipe, can make return flow path at the inner cooling medium of pipe because heat pipe has ring-type.
In projector of the present invention, preferred: aforementioned wing tabs, possess the ring-type that is arranged at aforementioned heat pipe inside part outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of outside surface of the Outboard Sections of aforementioned ring-type.
If according to the present invention, then because the wing tabs, in heat pipe, possess the ring-type of being arranged at inside part outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of outside surface of the Outboard Sections of ring-type, so can the size increase of the optical devices that caused by the wing tabs that is arranged at heat pipe be suppressed, and guarantee area of dissipation fully.
In projector of the present invention, preferably: aforementioned heat pipe, form and have the base end part that extends predetermined direction, overlook the コ shape with two end portions from aforementioned base end part roughly is orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part, can heat be connected to each side end of the mutual subtend of aforementioned optical element with aforementioned a pair of extension with transmitting.
In the present invention, heat pipe, form have base end part and an a pair of extension overlook the コ shape, can heat be connected to each side end of the mutual subtend of optical element with a pair of extension with transmitting.That is, heat pipe, at least a portion of a pair of extension works as the evaporation part, and the side of leaving from each evaporation part (for example, base end part) then works as the condensation part.Thus, for example with only any 1 side end among each side end of optical element, heat pipe can the hot formation that be connected be compared with transmitting, in heat pipe, can make return flow path at the inner cooling medium of pipe, become between the condensation part (for example, base end part) of each evaporation part of at least a portion of each extension and the side left from each evaporation part mulitpath (for example, 2 paths), the migration amount of the inner heat of pipe is increased.And, in order effectively optical element to be cooled off, though for example can consider can heat to be connected to the formation of each side end of the mutual subtend of optical element as the above-mentioned heat pipe of overlooking the I shape with transmitting, but in formation of the present invention, because just can cool off optical element effectively by 1 heat pipe, so that the designs simplification of optical devices, and the cost that can seek optical devices reduces.
In projector of the present invention, preferred: aforementioned wing tabs is arranged at the outside surface of aforementioned a pair of extension respectively.
If according to the present invention, then in heat pipe, 2 wing tabs of the outside surface by being arranged at a pair of extension respectively can fully be guaranteed area of dissipation.
In projector of the present invention, preferably: aforementioned heat pipe has from each fore-end of aforementioned a pair of extension crooked and extend and bearing of trend fore-end subtend is carried out bending in aforementioned a pair of extension ground and the portion that is bent to form of extending by the direction of leaving mutually.
In the present invention, heat pipe is made of the shape that has base end part, a pair of extension and be bent to form portion.Thus, for example with adopt 2 with as above-mentioned a pair of extension among either party outside surface of コ shape Outboard Sections of extension can heat be connected in the heat pipe of overlooking the コ shape of optical element with transmitting, the formation of each side end that these heat pipes can heat be connected to with transmitting the mutual subtend of optical element is compared, because just can cool off optical element effectively with 1 heat pipe, so that the designs simplification of optical devices, and the cost that can seek optical devices reduces.
In projector of the present invention, preferably: aforementioned wing tabs, possess the 1st wing tabs of the outside surface that is arranged at each the コ shape inside part that surrounds by aforementioned a pair of extension and the aforementioned portion that is bent to form respectively and be arranged at the 2nd wing tabs of the outside surface of each the コ shape Outboard Sections that surrounds by aforementioned a pair of extension and the aforementioned portion that is bent to form respectively.
If according to the present invention, then because the wing tabs, in heat pipe, possess the 1st wing tabs of the outside surface that is arranged at each the コ shape inside part that surrounds by a pair of extension and the portion that is bent to form respectively and be arranged at the 2nd wing tabs of the outside surface of each the コ shape Outboard Sections that surrounds by a pair of extension and the portion that is bent to form respectively, so can the size increase of the optical devices that caused by the wing tabs that is arranged at heat pipe be suppressed, and guarantee area of dissipation fully.
In projector of the present invention, preferably: aforementioned optical devices, possesses look composite projection machine, these look composite projection facility have 3 light beam light incident side end faces that make light beam carry out incident, and the light beam emitting side end face of outgoing beam, and form and overlook rectangular-shapedly, each light beam of going into to shine is synthesized and penetrates; Aforementioned optical element is provided with 3, surrounds aforementioned look composite projection machine ground and is installed on aforementioned 3 light beam light incident side end faces respectively; Aforementioned heat pipe is provided with a plurality ofly, can heat be connected to each side ends of overlooking four rectangular-shaped angle parts corresponding to aforementioned look composite projection machine of 3 aforementioned optical elements with transmitting; Be arranged at each aforementioned wing tabs of a plurality of aforementioned heat pipes, extend rectangular-shaped ground, angular direction is formed of overlooking of aforementioned look composite projection machine.
In the present invention, heat pipe, be provided with a plurality of, can heat be connected to with transmitting in each optical element of each the light beam light incident side end face that is installed on look composite projection machine, corresponding to each side ends of four rectangular-shaped angle parts of overlooking of look composite projection machine.And, be arranged at each wing tabs of a plurality of heat pipes, extend rectangular-shaped ground, angular direction is formed of overlooking of look composite projection machine.Thus, because assembling under the state of optical devices, be arranged at the not interference mechanically of each wing tabs of each heat pipe, so can form each wing tabs biglyyer.Therefore, in heat pipe, area of dissipation is further increased, can set the temperature difference between evaporation part and condensation part bigger, the migration amount of the heat in the pipe inside is further increased.Thereby, can make 3 optical elements, look composite projection machine and a plurality of heat pipe integrated the optical devices densification, effectively each optical element is cooled off.
Description of drawings
Fig. 1 is the figure that the summary of the projector in pattern ground expression the 1st embodiment constitutes.
Fig. 2 is the figure that the summary of the optical devices main body in the expression aforementioned embodiments constitutes.
Fig. 3 is the figure that the summary of the optical devices main body in the expression aforementioned embodiments constitutes.
Fig. 4 A is the figure that the summary of the optic modulating device in the expression aforementioned embodiments constitutes.
Fig. 4 B is the figure that the summary of the optic modulating device in the expression aforementioned embodiments constitutes.
Fig. 5 is the stereographic map of the heat conduction member of expression in the aforementioned embodiments with respect to the syndeton of optic modulating device.
Fig. 6 is the stereographic map of the syndeton of the structure of the heat conduction member of expression in the 2nd embodiment and heat conduction member and optic modulating device.
Fig. 7 is the stereographic map of the syndeton of the structure of the heat conduction member of expression in the 3rd embodiment and heat conduction member and optic modulating device.
Fig. 8 is the sectional view of the structure of the heat conduction member in the model utility ground expression aforementioned embodiments.
Fig. 9 A is the stereographic map of the syndeton of the structure of the heat conduction member of expression in the 4th embodiment and heat conduction member and liquid crystal panel.
Fig. 9 B is the stereographic map of the syndeton of the structure of the heat conduction member of expression in the 4th embodiment and heat conduction member and liquid crystal panel.
Figure 10 A is the figure of the syndeton of the structure of the heat conduction member of expression in the aforementioned embodiments and heat conduction member and liquid crystal panel.
Figure 10 B is the figure of the syndeton of the structure of the heat conduction member of expression in the aforementioned embodiments and heat conduction member and liquid crystal panel.
Figure 11 is the figure of the variation of aforementioned the 1st embodiment of expression.
Figure 12 is the figure of the variation of aforementioned the 1st embodiment of expression.
Figure 13 A is the figure of the variation of aforementioned each embodiment of expression.
Figure 13 B is the figure of the variation of aforementioned each embodiment of expression.
Figure 14 is the figure that the summary of the optical devices main body in expression the 5th embodiment constitutes.
Figure 15 is the figure that the summary of the optical devices main body in the expression aforementioned embodiments constitutes.
Figure 16 is the stereographic map of the heat pipe of expression in the aforementioned embodiments with respect to the syndeton of optic modulating device.
Figure 17 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 6th embodiment and heat pipe and optic modulating device.
Figure 18 is the heat pipe of expression in the aforementioned embodiments and the exploded perspective view of the syndeton of wing tabs.
Figure 19 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 7th embodiment and heat pipe and optic modulating device.
Figure 20 is used for the figure that the bearing of trend to the radiating component of aforementioned embodiments describes.
Figure 21 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 8th embodiment and heat pipe and optic modulating device.
Figure 22 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 9th embodiment and heat pipe and optic modulating device.
Figure 23 is used for the figure that the bearing of trend of base end part, wing tabs and heat sink to aforementioned embodiments describes.
Figure 24 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 10th embodiment and heat pipe and optic modulating device.
Figure 25 is the stereographic map of the syndeton of the structure of the heat pipe of expression in the 11st embodiment and heat pipe and optic modulating device.
Figure 26 is the figure of the variation of aforementioned the 6th embodiment of expression.
Figure 27 is the figure of the variation of aforementioned the 6th embodiment of expression.
Embodiment
The 1st embodiment
Below, based on accompanying drawing the 1st embodiment of the present invention is described.
(summary of projector constitutes)
Fig. 1 is the figure of the summary formation of pattern ground expression projector 1.
Projector 1 forms coloured image (optical image) corresponding to image information to modulating from the emitted light beam of light source, and with this coloured image enlarging projection on screen (diagram slightly).This projector 1, as be shown among Fig. 1 ground possesses: roughly rectangular-shaped external shell 2, and as the projecting lens 3 of projecting optical device and optical unit 4 etc.
Also have, in Fig. 1, though concrete diagram is omitted, but in external shell 2, space beyond projecting lens 3 and optical unit 4, configuration: to the power supply unit of each member of formation supply capability of projector 1 inside, possess the cooling unit that cooling fan that pair projector 1 inside cools off etc. is arranged, and the control device that each member of formation of projector 1 inside is controlled etc.
Projecting lens 3 constitutes as the lens combination that places a plurality of lens in the lens barrel of tubular, will be by optical unit 4 formed coloured image enlarging projections on screen.
(the detailed formation of optical unit)
Optical unit 4, under the control of aforementioned control device, form coloured image (image light) corresponding to image information, as be shown among Fig. 1 ground, have from the front face side of external shell 2 and extend towards rear side, and the bearing of trend end is crooked and extend along the back side, so towards front face side crooked and extend overlook roughly U-shaped shape.This optical unit 4, as be shown among Fig. 1 ground possesses: light supply apparatus 41, even illumination optics device 42, look dissociated optical device 43, relay optics 44, optical devices 45 and optical component casing 46.
Light supply apparatus 41 makes the light beam unanimity of radiating from illuminator 411 penetrate in certain orientation, and optical devices 45 are thrown light on.This light supply apparatus 41, as be shown among Fig. 1 ground possesses illuminator 411 and reverberator 412 constitutes.
As illuminator 411, adopt Halogen lamp LED, metal halide lamp mostly, or high-pressure mercury-vapor lamp.
As reverberator 412, adopt to make the paraboloid that reflects from illuminator 411 emitted light beam almost parallelizations.Also have, as reverberator 412, outside paraboloid, also can adopt combined with the parallelization lens, make the ellipsoidal reflector that reflects in ground, precalculated position from illuminator 411 emitted beam convergences.
Evenly illumination optics device 42 is to be divided into a plurality of segment beams from light supply apparatus 41 emitted light beams, and makes the optical system of the interior illumination homogenising of face of field of illumination.This even illumination optics device 42, as be shown among Fig. 1 ground, possess: the 1st lens arra 421, the 2 lens arras 422, polarization conversion device 423, catoptron 424 and overlapping lens 425.
The 1st lens arra 421 has as will cutting apart the function of optical element from the light beam that light supply apparatus 41 emitted light beams are divided into a plurality of segment beams, and possesses being arranged in rectangular a plurality of lenslet in the face of quadrature mutually with lighting optical axis A and constitute.
The 2nd lens arra 422, for making a plurality of segment beams of being cut apart by the 1st above-mentioned lens arra 421 carry out the optical element of optically focused, with the 1st lens arra 421 similarly, have to possess and be arranged in the formation of rectangular a plurality of lenslets mutually in the face of quadrature with lighting optical axis A.
Polarization conversion device 423 is that to make the polarization direction of the each several part light beam of being cut apart by the 1st lens arra 421 consistent be the polarization conversion device of the rectilinearly polarized light of a direction roughly.
This polarization conversion device 423 though omitted diagram, possesses and alternately is arranged with respect to the polarization separating film of lighting optical axis A institute tilted configuration and the formation of reflectance coating.Polarization separating film among the P light beam and S light beam in being included in the each several part light beam, makes a side light beam carry out transmission, and the opposing party's light beam is reflected.The opposing party's of being reflected light beam, institute is crooked by reflectance coating, presses the ejaculation direction of a side light beam, promptly penetrates by the direction along lighting optical axis A.The either party of emitted light beam, the polarizer of the light beam outgoing plane by being arranged at polarization conversion device 423 carries out polarisation transformation, makes the polarization direction of roughly whole light beams obtain unanimity.By adopting so polarization conversion device 423, because can make, consistently become the roughly light beam of a direction, so can improve the utilization factor of the light source light of in optical devices 45, utilizing from the emitted light beam of light supply apparatus 41.
Overlapping lens 425 are to make a plurality of segment beams through the 1st lens arra the 421, the 2nd lens arra 422, polarization conversion device 423 and catoptron 424 carry out optically focused and be overlapped in optical element on the image forming area of 3 liquid crystal panels described later of optical devices 45.
Look dissociated optical device 43, as be shown among Fig. 1 ground, possess 2 dichronic mirrors 431,432 and catoptron 433; Possessing will be from the emitted a plurality of segment beam of even illumination optics device 42 by dichronic mirror 431,432, is separated into the function of coloured light of 3 looks of red (R), green (G), blue (B).
Dichronic mirror 431,432 reflects and makes the light beam of other wavelength region may carry out the optical element of the wavelength selective membrane of transmission for be formed with light beam to the presetted wavelength zone on substrate.And, be disposed at the dichronic mirror 431 of light path prime, be that blue light is reflected, and the mirror body that makes other coloured light carry out transmission.And, be disposed at the dichronic mirror 432 of level after the light path, be that green light is reflected, and make red light carry out the mirror body of transmission.
Relay optics 44, as be shown among Fig. 1 ground, possess light incident side lens 441, relay lens 443, and catoptron 442,444; Has the function that red light that the dichronic mirror 431,432 of the dissociated optical device 43 of will checking colors carried out transmission guides to optical devices 45.Also having, so relay optics 44 is set in the light path of red light, is because the length of the light path of red light is longer than the length of the light path of other coloured light, so will prevent the cause of reduction of the utilization ratio of the light that causes because of dispersing of light etc.Though in the present embodiment because the long institute of the length of the light path of red light thinks so to be constituted, the length of the light path of the blue light of also can considering to extend and relay optics 44 is used for the formation of the light path of blue light.
Blue light by above-mentioned dichronic mirror 431 is separated by after 433 bendings of catoptron, is supplied in optical devices 45 by field lens 426.And by the green light that dichronic mirror 432 is separated, an as original ground is supplied in optical devices 45 by field lens 426.And, red light, the lens 441,443 by constituting relay optics 44 and 442,444 optically focused of catoptron, bending and be supplied in optical devices 45 by field lens 426.Also have, be arranged at the field lens 426 of light path prime of each coloured light of optical devices 45, for will be from the emitted each several part light beam of the 2nd lens arra 422, it be set to be transformed into the light beam parallel with respect to the chief ray of each several part light beam.
Optical devices 45 are modulated the light beam of going into to shine corresponding to image information and are formed coloured image.These optical devices 45, as be shown among Fig. 1 ground, possess: as having liquid crystal panel 4511 as optical modulation element (optical element main body) (with reference to Fig. 2, (optic modulating device with the red light side is 451R to 3 optic modulating devices 451 of optical element Fig. 3), optic modulating device with the green light side is 451G, optic modulating device with the blue light side is 451B), be disposed at the light incident side polarization plates 452 of the light path preceding-stage side of each optic modulating device 451, be disposed at the field angle compensating plate 453 of light path rear-stage side of each optic modulating device 451 and emitting side polarization plates 454 and as the cross colour splitting prism 455 of look composite projection machine.And, among these each members 451~455, integrated each optic modulating device 451, each field angle compensating plate 453, each emitting side polarization plates 454 and cross colour splitting prism 455 and constitute optical devices main body 45A (with reference to Fig. 2).Detailed formation about optical devices main body 45A is carried out aftermentioned.Also have, as optical devices main body 45A, also can adopt except these each members 451,453~455, each light incident side polarization plates 452 is also carried out incorporate formation.
3 light incident side polarization plates 452, among each coloured light that is separated by look dissociated optical device 43, only make have with by polarization conversion device 423 the polarized light of roughly the same polarization direction, consistent polarization direction carry out transmission, absorb other light beam; Attaching polarizing coating on light-transmitting substrate constitutes.
Constitute each liquid crystal panel 4511 of 3 optic modulating devices 451, have that airtight inclosure is the formation of the liquid crystal of electro-optical substance among rectangular-shaped a pair of substrate 4511A, the 4511B (with reference to Figure 10 A and Figure 10 B) overlooking of being made of glass etc.Wherein, substrate 4511A, be to be used for driving substrate that liquid crystal is driven, have: arrange many data lines that form parallel to each other, arranging the multi-strip scanning line that forms on the direction of quadrature mutually, arrange the pixel electrode of formation corresponding to the friendship crook of sweep trace and data line, TFT (Thin Film Transistor with many data lines rectangularly, thin film transistor (TFT)) etc. on-off element and drive division that on-off element is driven.And substrate 4511B is a subtend substrate of vacating the subtend configuration of predetermined space institute with respect to substrate 4511A, has the common electrode that applies predetermined voltage Vcom.And, at these substrates 4511A, 4511B, connect conduct and be electrically connected, and export the FPC cable 4511C of the circuit substrate of predetermined drive signal to aforementioned sweep trace, aforementioned data line, aforementioned switches element and aforementioned common electrode etc. with aforementioned control device.By by this FPC cable 4511C from aforementioned control device input drive signal, between predetermined aforementioned pixel electrode and aforementioned common electrode, apply voltage, the state of orientation of the liquid crystal of control between between this pixel electrode and common electrode, modulation is from the polarization direction of the emitted light beam of light incident side polarization plates 452.
And, in this liquid crystal panel 4511, the outer shape of driving substrate 4511A, set comparison to the outer shape of substrate 4511B big (with reference to Figure 10 A and Figure 10 B).That is, this liquid crystal panel 4511 forms stepped along with what diminish towards light beam light incident side, outer shape.
And,, attach and to have and roughly the same outer shape of the outer shape of driving substrate 4511A and dustproof glass 4511D (with reference to Figure 10 A and Figure 10 B) with heat conductivity at the outside surface of driving substrate 4511A.At the outside surface of subtend substrate 4511B similarly, attach the roughly the same outer shape of outer shape that has with subtend substrate 4511B, and the dustproof glass 4511E (with reference to Figure 10 A and Figure 10 B) with heat conductivity.And by attaching these dustproof glass 4511D, 4511E, even adhere to dust at the outside surface of liquid crystal panel 4511, the also state that departs from from focal position for dust can prevent that this dust from becoming shade and be shown on projected image.
3 field angle compensating plates 453 are equipped on the light path rear-stage side of each optic modulating device 451 respectively, have the formation that is pasted with optical compensation films 4532 (with reference to Fig. 3) on the rectangular-shaped light-transmitting substrate 4531 (with reference to Fig. 3) overlooking.
In the present embodiment, as light-transmitting substrate 4531, by having the material of heat conductivity, for example crystal or sapphire etc. constitute.
Optical compensation films 4532 compensates the phase differential that results between normality light and the unusual light because of the birefringence that produces at liquid crystal panel 4511, improves the photopic vision characteristic of liquid crystal panel 4511.This optical compensation films 4532, for having negative uniaxiality optically anisotropic body, the predetermined direction of its optic axis in face, and be orientated by predetermined angle incline ground from this face direction outside face.
As this optical compensation films 4532, for example, can constitute with the material that on the transparent support of triacetyl cellulose (TAC) etc., is formed with discoid compound layer by alignment films, can adopt WV film (Fuji Photo Film Co Ltd.'s system).
3 emitting side polarization plates 454 have the function roughly same with light incident side polarization plates 452, and among the light beam emitted by liquid crystal panel 4511 and field angle compensating plate 453, make the polarized light of certain orientation carry out transmission, and absorb other light beam.These emitting side polarization plates 454, as be shown among Fig. 1 ground are made of respectively the 1st emitting side polarization plates 4541 that is disposed at the light beam light incident side and 2 bodies that are disposed at the 2nd emitting side polarization plates 4542 of light beam emitting side.And, the 1st emitting side polarization plates 4541 and the 2nd emitting side polarization plates 4542, with light incident side polarization plates 452 similarly, go up to attach polarizing coating 4542B (with reference to Fig. 3) and constitute overlooking rectangular-shaped light-transmitting substrate 4541A, 4542A (with reference to Fig. 3).Also have, in Fig. 3, in the 1st emitting side polarization plates 4541, because polarizing coating is attached at the light beam emitting side end face of light-transmitting substrate 4541A, so and not shown.And, in the present embodiment, as light-transmitting substrate 4541A, 4542A, with the light-transmitting substrate 4531 of field angle compensating plate 453 similarly, by having the material of heat conductivity, for example crystal or sapphire etc. constitute.
The 1st emitting side polarization plates 4541 and the 2nd emitting side polarization plates 4542, optical absorption characteristics constitutes unequally, and polarization axle separately becomes abreast and disposes.By so making emitting side polarization plates 454, become 2 body ground and constitute, for example compare with situation about constituting with 1 body, the heat that absorbs with emitting side polarization plates 454 can be pro rata distributed with 2 bodies, can prevent the hot deterioration of emitting side polarization plates 454.
Also have, the 1st emitting side polarization plates 4541 and the 2nd emitting side polarization plates 4542, polarization axle becomes abreast and disposes, and roughly disposes orthogonally with the polarization axle of light incident side polarization plates 452.
Cross colour splitting prism 455 is to synthesizing from emitted each coloured light modulated by every kind of coloured light of emitting side polarization plates 454 and form coloured image.This cross colour splitting prism 455 is and makes the roughly square shape of overlooking that 4 right-angle prisms fit, and right-angle prism is fitted at the interface each other, forms 2 dielectric multilayer films.These dielectric multilayer films, make coloured light emitted from optic modulating device 451G and that passed through field angle compensating plate 453 and emitting side polarization plates 454 carry out transmission, and each coloured light emitted from optic modulating device 451R, 451B and that passed through field angle compensating plate 453 and emitting side polarization plates 454 is reflected.So carry out synthetic each coloured light and form coloured image.Then, by cross colour splitting prism 455 formed coloured images, by above-mentioned projecting lens 3 to screen institute enlarging projection.
Optical component casing 46, for each above-mentioned optics 41~45 being disposed at member with respect to the precalculated position that is set in inner lighting optical axis A, though concrete diagram is omitted, but be disposed at inner container-like parts and place the cap-like structure that portion and inaccessible above-mentioned parts place the opening portion of portion and constituted by each optics 41~45 is placed.
(the detailed formation of optical devices main body)
Fig. 2 and Fig. 3 are the figure of the summary formation of expression optical devices main body 45A.Particularly, Fig. 2 is a stereographic map of seeing optical devices main body 45A from optic modulating device 451G side.Fig. 3 is the exploded perspective view of optical devices main body 45A.Also have, though in Fig. 3, in optical devices main body 45A, only optic modulating device 451G side is decomposed, each optic modulating device 451R, 451B side also have and the same formation of optic modulating device 451G side.
Optical devices main body 45A is except each above-mentioned optic modulating device 451, each field angle compensating plate 453, each emitting side polarization plates 454, and outside the cross colour splitting prism 455, as be shown among Fig. 2 or Fig. 3 ground, possess: 456,3 optical elements of body support structure keep body 457 and 3 heat conduction members 458; Integrated these each members 451,453~458.
At this, in 3 emitting side polarization plates 454, each the 2nd emitting side polarization plates 4542, as be shown among Fig. 2 or Fig. 3 ground, under the state of light beam light incident side, be adhered to each light beam light incident side end face of cross colour splitting prism 455 respectively at polarizing coating 4542B.
And optic modulating device 451 except above-mentioned liquid crystal panel 4511, as is shown among Fig. 2 or Fig. 3 ground, possesses the maintenance frame 4512 that liquid crystal panel 4511 is kept.
Fig. 4 A and Fig. 4 B are the figure of the summary formation of expression optic modulating device 451.Particularly, Fig. 4 A is a stereographic map of seeing optic modulating device 451 from the light beam light incident side.Fig. 4 B is a stereographic map of seeing optic modulating device 451 from the light beam emitting side.Also have, in Fig. 4 A and Fig. 4 B, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
Also have,, describe based on following definition following, along X-direction and with left in scheming to being+directions X, with right be-directions X; Along Y direction and to go up direction in scheming is+the Y direction that following direction is-the Y direction; Be+Z direction along Z-direction with right in scheming, with left to being-the Z direction.And, in the end face of each member, with in the face of+directions X be+the X end, with in the face of-directions X be-X holds.About the Y direction, the Z direction also is same.
Keep frame 4512, for liquid crystal panel 4511 being placed the member of maintenance, as be shown among Fig. 4 A and Fig. 4 B ground, possess: be disposed at the rectangular-shaped maintenance frame main body 4512A of overlooking of light beam light incident side and be disposed at the rectangular-shaped shadow shield 4512B of overlooking of light beam emitting side.
Keep frame main body 4512A, as be shown among Fig. 4 A ground, partly have peristome 4512A1 overlooking substantial middle corresponding to the image forming area of liquid crystal panel 4511.
And, in keeping frame main body 4512A, at the light beam emitting side, though concrete diagram is omitted, but in the peripheral part of peristome 4512A1, form recess, liquid crystal panel 4511 is placed maintenance with this recess corresponding to the outer shape (stepped) of liquid crystal panel 4511.
And, in keeping frame main body 4512A, in four angle parts, as be shown among Fig. 4 A and Fig. 4 B ground, form respectively and connect light beam light incident side end face and light beam emitting side end face, be used for optic modulating device 451 is fixed in the fixing hole 4512A2 that uses that optical element keeps body 457.
And in keeping frame main body 4512A, 2 of lower side (Y direction side) are fixing with the position between the 4512A2 of hole, and side (+Y direction side) caves in and forms the recess 4512A3 that overlooks the コ shape upward.
And, in keeping frame main body 4512A, the Y direction substantial middle part in X-direction two ora terminalis (about two ora terminalis), as be shown among Fig. 4 A and Fig. 4 B ground, form and overlook rectangular-shaped recess 4512A4.And, at the bottom surface portions of recess 4512A4, as be shown among Fig. 4 A and Fig. 4 B ground, be formed for the crook 4512A5 that is connected with shadow shield 4512B.
Shadow shield 4512B, as be shown among Fig. 4 B ground by being constituted overlooking the rectangular-shaped plate body that substantial middle partly has corresponding to the peristome 4512B1 of the image forming area of liquid crystal panel 4511, is fixed in the light beam emitting side that keeps frame main body 4512A.This shadow shield 4512B, prevent: the light that liquid crystal panel 4511 has been carried out transmission, reflect with field angle compensating plate 453, emitting side polarization plates 454 or cross colour splitting prism 455 etc. and shine in the drive division of liquid crystal panel 4511 and liquid crystal panel 4511 is delayed work.
In this shadow shield 4512B, Y direction substantial middle part at X-direction two ora terminalis, as be shown among Fig. 4 A and Fig. 4 B ground, form and have with the essentially identical flat shape of recess 4512A4 that keeps frame main body 4512A and be engaged in the crook junction surface 4512B2 of the crook 4512A5 that is formed at recess 4512A4.And, be engaged in crook 4512A5 by making crook junction surface 4512B2, keeping fixedly shadow shield 4512B of frame main body 4512A.
As above-mentionedly with respect to keeping frame main body 4512A to fix under the state of shadow shield 4512B, keep the X-direction both sides end face (except the end face of recess 4512A4) among the frame main body 4512A, basically become a face with the outside surface of the crook junction surface 4512B2 of shadow shield 4512B, keep X-direction both sides end face 4512C, the 4512D of frame 4512 to become the flat condition that is parallel to the YZ plane.And these X-direction both sides end face 4512C, 4512D become the optical element side connecting portion that heat conduction member 458 is connected.
And above-mentioned maintenance frame 4512 is made of the material with heat conductivity.
As material with this heat conductivity, for example can illustration: nickel-ferro alloys such as invar and 42Ni-Fe, magnesium alloy, aluminium alloy, carbon steel, the metal of stainless steel etc., perhaps carbon fibre, the resin of infiltrating carbon filler of carbon nano-tube etc. (polycarbonate, polyphenylene sulfide, liquid crystalline resin etc.) etc.Also have,, both can also can constitute keeping frame main body 4512A and shadow shield 4512B to constitute with identical materials among the above-mentioned material with different materials as keeping frame 4512.Keep frame 4512 by so constituting, can effectively the heat that produces at liquid crystal panel 4511 owing to the irradiation of light beam be dispelled the heat in keeping frame 4512 with material with heat conductivity.
Body support structure 456, as be shown among Fig. 2 or Fig. 3 ground is to have roughly rectangular shape, at the precalculated position of end face mounting cross colour splitting prism 455, and the member that optical devices main body 45A integral body is supported.
At this body support structure 456, as be shown among Fig. 2 or Fig. 3 ground, form and extend toward the outer side, and the above-mentioned parts that is connected in optical component casing 46 places the wrist shape portion 4561 of portion from four angle parts.And, placing portion by the above-mentioned parts that wrist shape portion 4561 is connected in optical component casing 46, optical devices main body 45A overall fixed places portion in above-mentioned parts.
3 optical elements keep body 457, for being equipped on respectively between optic modulating device 451 and the cross colour splitting prism 455, respectively to each optic modulating device 451, each field angle compensating plate 453, and each emitting side polarization plates 454 in each the 1st emitting side polarization plates 4541 support and the member of fixing with respect to cross colour splitting prism 455.This optical element keeps body 457, as is shown among Fig. 3 ground, possesses: the 1st support sector 4571 and the 2nd support sector 4572.
The 1st support sector 4571, as be shown among Fig. 3 ground, by the plate-like portion 4571A that overlooks the essentially rectangular shape and from about the plate-like portion 4571A two ora terminalis constituted towards the outstanding teat 4571B of light beam light incident side.
In the substantial middle part of plate-like portion 4571A, as be shown among Fig. 3 ground, be formed for making light beam to carry out the rectangular-shaped peristome 4571A1 of overlooking of transmission.
At each teat 4571B, as be shown among Fig. 3 ground, form 3 peristome 4571B1 that arrange along vertical direction respectively.These peristomes 4571B1, as be shown among Fig. 3 ground has along what the projected direction of each teat 4571B extended and overlooks rectangular shape.
And the 1st support sector 4571 supports the 2nd support sector 4572 with each teat 4571B.And, the 1st support sector 4571, with respect to the 2nd emitting side polarization plates 4542 of the light beam light incident side end face that is fixed in cross colour splitting prism 455, insert at polarizing coating 4542B lead under the state of peristome 4571A1, the light beam emitting side end face of plate-like portion 4571A is fixed in light-transmitting substrate 4542A by bonding agent etc. light beam light incident side end face.
The 2nd support sector 4572, for respectively to optic modulating device 451, field angle compensating plate 453, and emitting side polarization plates 454 in the 1st emitting side polarization plates 4541 support the member fixed.The 2nd support sector 4572, as be shown among Fig. 3 ground, possess: the 2nd support sector's main body 4573 and a pair of afterburning member 4574.
The 2nd support sector's main body 4573, as be shown among Fig. 3 ground, by the plate-like portion 4573A that overlooks the essentially rectangular shape and from about the plate-like portion 4573A two ora terminalis constituted towards the outstanding teat 4573B of light beam emitting side, be equipped between each teat 4571B of the 1st support sector 4571.
At plate-like portion 4573A, as be shown among Fig. 3 ground, the lower side ora terminalis forms breach towards upper side from Fig. 3, is formed for making light beam to carry out the breach 4573A1 that overlooks the コ shape of transmission.
And, in this plate-like portion 4573A,, as be shown among Fig. 3 ground in four angle parts, be formed for the fixing hole 4573A2 that uses that optic modulating device 451 is fixed respectively.And, fixing by 4 with a pair of fixing hole 4573A2 that uses that is formed at diagonal position among the 4573A2 of hole, and 4 of maintenance frame 4512 of being formed at optic modulating device 451 are fixing with a pair of fixing hole 4512A2 that uses that is formed at diagonal position among the 4512A2 of hole, by the 2nd support sector's main body 4573 and maintenance frame 4512 are connected with each screw element 459 (Fig. 3), optic modulating device 451 is fixed in the 2nd support sector's main body 4573.
And, in this plate-like portion 4573A, about the substantial middle part of two ora terminalis, as be shown among Fig. 3 ground, form to the light beam emitting side outstanding respectively, the plate face ground that the projected direction fore-end is roughly parallel to plate-like portion 4573A extends, and is connected in the connecting portion 4573A3 of each teat 4573B with fore-end.
And, in this plate-like portion 4573A, each corner part of upper side end in Fig. 3, form along the light beam emitting side outstanding respectively, and under the state of supporting with 4572 pairs of field angle compensating plates 453 of the 2nd support sector, be contacted with the upper side end of field angle compensating plate 453, the 1st 4573A4 of position limit portion that the position of the vertical direction of field angle compensating plate 453 is limited.
Each teat 4573B, as be shown among Fig. 3 ground, fore-end 4573B1 and plate-like portion 4573A almost parallel ground institute are crooked, extend direction near each other.
And, in each fore-end 4573B1, lower side end in Fig. 3, form along the light beam light incident side outstanding respectively, and under the state of supporting with 4572 pairs the 1st emitting side polarization plates 4541 of the 2nd support sector, be contacted with the lower side end of the 1st emitting side polarization plates 4541, the 2nd 4573B3 of position limit portion that the position of the vertical direction of the 1st emitting side polarization plates 4541 is limited.
And, at the lateral surface of the cardinal extremity part 4573B2 of each teat 4573B, as be shown among Fig. 3 ground, form 3 protuberance 4573B4 that are arranged in vertical direction respectively corresponding to each peristome 4571B1 of the 1st support sector 4571.And these protuberances 4573B4 when being equipped with the 2nd support sector 4572 between each the teat 4571B in the 1st support sector 4571, is embedded in each peristome 4571B1 with the gap engagement state.By so constituting, each protuberance 4573B4 (the 2nd support sector 4572) is slided with respect to each peristome 4571B1 (the 1st support sector 4571), promptly, the optic modulating device 451 (liquid crystal panel 4511) that is fixed in the 2nd support sector 4572 is moved on the approaching direction of leaving with respect to cross colour splitting prism 455, can focus on adjustment.
A pair of afterburning member 4574, as be shown among Fig. 3 ground, constituted by leaf spring, possess respectively: be positioned at the base portion 4574A of substantial middle part and extend to the roughly a pair of extension 4574B of Ha shape respectively from base portion 4574A.And, a pair of afterburning member 4574, be equipped between field angle compensating plate 453 and the 1st emitting side polarization plates 4541, base portion 4574A is contacted with the light beam emitting side end face of field angle compensating plate 453, the fore-end of a pair of extension 4574B is contacted with the light beam light incident side end face of the 1st emitting side polarization plates 4541, and by the direction reinforcing that field angle compensating plate 453 and the 1st emitting side polarization plates 4541 are left mutually.
And, the 2nd above-mentioned support sector 4572, as be shown in following ground, field angle compensating plate 453 and the 1st emitting side polarization plates 4541 are supported to fix.
Promptly, in the space that is surrounded by the plate-like portion 4573A in the 2nd support sector's main body 4573 and each teat 4573B, to the field angle compensating plate 453 of optical compensation films 4532 towards the state of light beam light incident side, a pair of afterburning member 4574, and polarizing coating sets towards the 1st emitting side polarization plates 4541 of the state of light beam emitting side.Under this state, loading force by a pair of afterburning member 4574 generations, field angle compensating plate 453 is pressed towards the light beam light incident side, and the light beam light incident side end face of the light-transmitting substrate 4531 in the field angle compensating plate 453 is contacted with the light beam emitting side end face of the plate-like portion 4573A in the 2nd support sector 4572.And, loading force by a pair of afterburning member 4574 generations, the 1st emitting side polarization plates 4541 is pressed towards the light beam emitting side, and the light beam emitting side end face of the light-transmitting substrate 4541A in the 1st emitting side polarization plates 4541 is contacted with each the fore-end 4573B1 of each the teat 4573B in the 2nd support sector 4572.As above ground, by the loading force that a pair of afterburning member 4574 produces, field angle compensating plate 453 and the 1st emitting side polarization plates 4541 are supported to fix by the 2nd support sector 4572.
3 heat conduction members 458, as be shown among Fig. 2 or Fig. 3 ground are can heat be connected to 3 optic modulating devices 451 with transmitting and the irradiation owing to light beam is resulted from the member that the heat of optic modulating device 451 is dispelled the heat.This heat conduction member 458, be made of so-called heat pipe, this heat pipe forms the tubulose that has capillary pipe structure (capillary wick) in inside, and places cooling medium in pipe inside, in the pipe internal reflux, carry out the thermophoresis in this heat conduction member 458 by cooling medium.
At this, though concrete diagram is omitted, the capillary pipe structure of heat conduction member 458 is made of pulverous slug type capillary wick.And,, adopt water as cooling medium.Also have, as aforementioned capillary pipe structure, be not limited to the slug type capillary wick, also can be used as other capillary wick, the superfine line style capillary wick that is constituted by many fine copper wires etc. for example, cancellous wire netting type capillary wick perhaps constitutes in the capillary wick of the inner grooved that is formed with the multiple tracks groove of pipe.And, as cooling medium, be not limited to water, also can adopt other cooling medium, for example alcohols etc.
Fig. 5 is the stereographic map of expression heat conduction member 458 with respect to the syndeton of optic modulating device 451.Also have, in Fig. 5, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axle).
This heat conduction member 458, by implementing pressure processing, as be shown among Fig. 5 ground, form following shape: become corresponding to the outer shape of optic modulating device 451 have along optic modulating device 451-the Y direction side end face extends the base end part 458A of X-direction, reach a pair of extension 458B that extends Y direction along the X-direction both sides end face of optic modulating device 451 respectively, 458C is bent to form with overlooking the コ shape, and corresponding to the optical element side connecting portion 4512C of optic modulating device 451,4512D and the section that forms コ shape inner side end and become the flat condition that is parallel to the YZ plane is seen rectangular-shaped.And, heat conduction member 458, as be shown among Fig. 5 ground, the roughly the same ground of physical dimension that leaves the X-direction in size (X-direction leave size) and the optic modulating device 451 between a pair of extension 458B, 458C forms, and the length dimension of the bearing of trend (Y direction) of a pair of extension 458B, 458C forms longways than the physical dimension of the Y direction in the optic modulating device 451.And in heat conduction member 458, subtend face 4581B, the 4581C of the mutual subtend of a pair of extension 458B, 458C becomes the heat conduction member side connecting portion that can be connected in to the heat transmission optic modulating device 451.
And, by the chimeric optic modulating device 451 of コ shape inside part in heat conduction member 458 (make optic modulating device 451-the Y direction side end is contacted with the state of base end part 458A), optical element side connecting portion 4512C, the 4512D of optic modulating device 451 carries out face and contacts with heat conduction member side connecting portion 4581B, the 4581C of heat conduction member 458, and optic modulating device 451 and heat conduction member 458 are connected on heat transmission ground mutually.At this, syndeton as heat conduction member 458 and optic modulating device 451, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 4581B, 4581C are connected by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.By for so constituting, the not contact portion of the microstage that produces because of the rough surface between optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 4581B, 4581C also can be connected in the mode of can heat transmitting.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
As above-mentioned ground, under the state that heat conduction member 458 and optic modulating device 451 can heat carry out connecting with transmitting, owing to the irradiation of light beam results from the heat of liquid crystal panel 4511, as be shown in followingly heat radiation.
For example, result from the heat of liquid crystal panel 4511, as be shown in the arrow R1 ground of Fig. 5, optical element side connecting portion 4512C, 4512D towards can being connected in to the heat transmission heat conduction member 458 move along X-direction, and are transmitted to maintenance frame 4512.
Be transmitted to the heat that keeps frame 4512, as be shown in the arrow R1 ground of Fig. 5, by can heat being connected in the heat conduction member side connecting portion 4581B of maintenance frame 4512, the Y direction substantial middle part that 4581C is transmitted to a pair of extension 458B, 458C in the heat conduction member 458 with transmitting.
At this, in the Y direction substantial middle inside partly of a pair of extension 458B, 458C, the heat of passing through to be transmitted makes cooling medium be heated, evaporate gasification, and absorbs heat as latent heat (heat of gasification) at this moment.That is, the Y direction substantial middle part of a pair of extension 458B, 458C works as evaporation part 4582A, 4582B in the heat conduction member 458.
Then, the cooling medium that has gasified, become steam flow, as be shown in the arrow R1 ground of Fig. 5, move to each fore-end and base end part 458A as a pair of extension 458B, the 458C of the heat conduction member 458 of low temperature side (side of leaving from each evaporation part 4582A, 4582B).Then, move to each fore-end of a pair of extension 458B, 458C and the cooling medium of base end part 458A, be cooled and liquefy, and emit heat (because the heat that condensation latent heat causes discharges).That is, each fore-end of a pair of extension 458B, 458C, and base end part 458A is as condensation part 4583A, 4583B in the heat conduction member 458,4584 and work.And the cooling medium in that condensation part 4583A, 4583B, 4584 have liquefied turns back to evaporation part 4582A, 4582B once more by capillary pipe structure (capillary wick).
As above ground, result from the heat of liquid crystal panel 4511, as be shown in the arrow R1 ground of Fig. 5, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat conduction member 458,, dispel the heat in the outside to condensation part 4583A, 4583B, 4584 thermophoresis by evaporation part 4582A, 4582B from heat conduction member 458 from condensation part 4583A, 4583B, 4584.
If according to the 1st above-mentioned embodiment, following effect is arranged then.
In the present embodiment, heat conduction member 458 is made of heat pipe, can heat be connected in optic modulating device 451 with transmitting.Thus, compare with existing formation because heat conduction member 458 between itself and optic modulating device 451 by air, be directly connected in optic modulating device 451, so can reduce thermal resistance in the heat transfer path of optic modulating device 451~heat conduction member 458.
And optic modulating device 451 and heat conduction member 458 have the shape that interconnected each connecting portion (optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 4581B, 4581C) carries out the face contact.Thus, can increase the contact area of 458 of optic modulating device 451 and heat conduction members, can make from optic modulating device 451 good to the heat transfer characteristic of heat conduction member 458.
Thereby, can cool off optic modulating device 451 effectively, the temperature of optic modulating device 451 is risen suppress and can prevent the hot deterioration of optic modulating device 451 (liquid crystal panel 4511) effectively.That is, can keep projected image well, and seek long lifetime from projector 1.
And in the present embodiment, optic modulating device 451 and heat conduction member 458, mutual outside surface can heat connect each other with transmitting.And, being formed at heat conduction member side connecting portion 4581B, the 4581C of the outside surface of heat conduction member 458, the shape ground of consistent outside surface (optical element side connecting portion 4512C, 4512D) in optic modulating device 451 forms by pressure processing.Thus, for example with heat conduction member (for example, section is seen the heat pipe of toroidal) outside surface as heat conduction member side connecting portion and the shape ground of consistent outside surface in heat pipe forms the formation of optical element side connecting portion and compares, only just can realize each connecting portion (optical element side connecting portion 4512C of optic modulating device 451 and heat conduction member 458 by processing that heat conduction member 458 is exerted pressure, 4512D and heat conduction member side connecting portion 4581B, 4581C) carry out the face contacting structure, with simple formation, just can cool off above-mentioned optic modulating device 451 effectively, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 effectively.
And, in the present embodiment, heat conduction member 458, form have base end part 458A and a pair of extension 458B, a 458C overlook the コ shape, form each heat conduction member side connecting portion 4581B, 4581C at a pair of extension 458B, 458C.And heat conduction member 458 can hot each optical element side connecting portion 4512C, 4512D that be connected in the optic modulating device 451 with each heat conduction member side connecting portion 4581B, 4581C of being formed at a pair of extension 458B, 458C with transmitting.Thus, for example with any 1 side end among each side end of optic modulating device 451 only, the formation that heat conduction member (heat pipe) can connect to the heat transmission is compared, in heat conduction member 458, can make return flow path at the inner cooling medium of pipe, become at each extension 458B, each evaporation part 4582A of the part of 458C, 4582B, with from each evaporation part 4582A, each condensation part 4583A of the side that 4582B leaves, 4583B, mulitpath between 4584 (in the present embodiment, be 4 paths), the migration amount of the heat in the pipe inside is increased, can cool off above-mentioned optic modulating device 451 effectively, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 effectively.And, in order effectively optic modulating device 451 to be cooled off, for example, though can consider 2 heat conduction members (heat pipe) can be connected to the heat transmission formation of each optical element side connecting portion 4512C, 4512D of optic modulating device 451, but in the formation of present embodiment, because just can cool off optic modulating device 451 effectively with 1 heat conduction member 458, so can seek the designs simplification of optical devices main body 45A, and the cost of optical devices main body 45A is reduced, and then seek the cost reduction of projector 1.
And in the present embodiment, the capillary pipe structure of heat conduction member 458 is made of the slug type capillary wick.Thus, in the moving of cooling medium, gravity be needn't utilize, condensation part 4583A, 4583B, 4584 and the equipping position of evaporation part 4582A, 4582B do not limited.Therefore, for example, in projector 1, the posture state of the projector 1 that the state that can place posture corresponding to forward, hang posture, make it to tilt for the position of adjusting projected image etc. are all, implement the thermophoresis in the heat conduction member 458 well, can cool off above-mentioned optic modulating device 451 effectively, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 effectively.
And, because the capillary pipe structure of heat conduction member 458 is made of the slug type capillary wick, so with other capillary wick (superfine line style capillary wick, wire netting type capillary wick, the capillary wick of grooved etc.) compare, can make evaporation part 4582A, 4582B and condensation part 4583A, 4583B, 4584 thermal resistance fully low, and because so the heat conductivity of capillary wick itself well can make heat be transmitted to cooling medium well, thermophoresis in the heat conduction member 458 is more promptly carried out, the cooling effectiveness of optic modulating device 451 is further improved.
The 2nd embodiment
Next, based on accompanying drawing the 2nd embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 1st embodiment, its detailed explanation is omitted or is simplified.
Fig. 6 is the structure of the heat conduction member 558 in expression the 2nd embodiment, and the stereographic map of the syndeton of heat conduction member 558 and optic modulating device 451.Also have, in Fig. 6, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
Present embodiment with respect to aforementioned the 1st embodiment, as is shown among Fig. 6 ground, only the structure difference of heat conduction member 558.Other formation, same with aforementioned the 1st embodiment.
Heat conduction member 558, with the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment similarly, constituted by heat pipe, as be shown among Fig. 6 ground, for the heat conduction member in being shown in Fig. 5 458, be connected to each other between each leading section of only a pair of extension 458B, 458C and to have a point of ring-type inequality.
This heat conduction member 558, by implementing pressure processing, as be shown among Fig. 6 ground, become rectangular-shaped being bent to form annularly of overlooking of the outer circumferential side end that surrounds optic modulating device 451 corresponding to the outer shape of optic modulating device 451, and the section that forms the ring-type inner side end corresponding to optical element side connecting portion 4512C, the 4512D of optic modulating device 451 and become the flat condition that is parallel to the YZ plane is seen rectangular-shaped.And, heat conduction member 558, as be shown among Fig. 6 ground, the basic identical ground of the physical dimension of the X-direction in the length dimension of the X-direction of ring-type inside part and the optic modulating device 451 forms, and the length dimension of Y direction forms longways than the physical dimension of the Y direction of optic modulating device 451.And in heat conduction member 558, the mutual subtend of ring-type inner side end becomes the heat conduction member side connecting portion that can be connected in to the heat transmission optic modulating device 451 in each subtend face 5581B, 5581C of X-direction.
And, by the chimeric optic modulating device 451 of the ring-type inside part in heat conduction member 558 (make optic modulating device 451-the Y direction side end be contacted with ring-type inside part in the heat conduction member 558-state of Y direction side part), optical element side connecting portion 4512C, the 4512D of optic modulating device 451 carries out face and contacts with heat conduction member side connecting portion 5581B, the 5581C of heat conduction member 558, and optic modulating device 451 and heat conduction member 558 can heat be connected to each other with transmitting.At this, syndeton as heat conduction member 558 and optic modulating device 451, with aforementioned the 1st embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 5581B, 5581C are connected by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 2nd embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 1st embodiment, dissimilarity is as following.
In the present embodiment, because heat conduction member 558, as above-mentioned ground, for the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment, a pair of extension 458B, be connected to each other between each leading section of 458C and have ring-type, so as be shown among Fig. 6 ground, the part that extends Y direction parallel to each other is (corresponding to a pair of extension 458B that is illustrated with aforementioned the 1st embodiment, the part of 458C) Y direction substantial middle part is as evaporation part 5582A, 5582B and working, and be positioned at as low temperature side (from each evaporation part 5582A, the side that 5582B leaves) each evaporation part 5582A, each position between the 5582B is (corresponding to a pair of extension 458B that is illustrated with aforementioned the 1st embodiment, the position of each fore-end of 458C, corresponding to the position of the base end part that is illustrated with aforementioned the 1st embodiment, and in+Y direction side along position that X-direction is extended) as condensation part 5583A, 5583B, 5584,5585 and work.
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R2 ground of Fig. 6, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat conduction member 558,, dispel the heat in the outside to condensation part 5583A, 5583B, 5584,5585 thermophoresis by evaporation part 5582A, 5582B from heat conduction member 558 from condensation part 5583A, 5583B, 5584,5585.
In the above-described 2nd embodiment, except with the same effect of aforementioned the 1st embodiment, also have following effect.
In the present embodiment, heat conduction member 558 forms the ring-type of the peripheral end that surrounds optic modulating device 451.Thus, in heat conduction member 558, except corresponding to evaporation part 4582A, 4582B in the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment and condensation part 4583A, 4583B, 4584 evaporation part 5582A, the 5582B and condensation part 5583A, 5583B, 5584, can also be arranged on+the Y direction side is along condensation part 5585 that X-direction is extended.Promptly, in heat conduction member 558, compare with the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment, can increase the zone of the condensation part that heat is dispelled the heat and make area of dissipation big, set the temperature difference between evaporation part and condensation part greatly, the migration amount of the inner heat of pipe is increased.Thereby, can more effectively cool off optic modulating device 451.
The 3rd embodiment
Next, based on accompanying drawing the 3rd embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 1st embodiment, its detailed explanation is omitted or is simplified.
Fig. 7 is the structure of the heat conduction member 658 in expression the 3rd embodiment, and the stereographic map of the syndeton of heat conduction member 658 and optic modulating device 451.
Fig. 8 is the sectional view of the structure of model utility ground expression heat conduction member 658.
Present embodiment with respect to aforementioned the 1st embodiment, as is shown among Fig. 7 or Fig. 8 ground, only the structure difference of heat conduction member 658.Other formation, same with aforementioned the 1st embodiment.
Heat conduction member 658, as be shown among Fig. 7 or Fig. 8 ground, possess: heat pipe 6581 and outer framework 6582.
Heat pipe 6581, it is the heat pipe that has with the same function of the heat conduction member that is illustrated with aforementioned the 1st embodiment 458, as be shown among Fig. 7 or Fig. 8 ground, has section circular shape, and become have corresponding to the outer shape of optic modulating device 451 along optic modulating device 451-the base end part that extends the Y direction side end face, and being bent to form of a pair of extension that extends along the X-direction both sides end face of optic modulating device 451 with overlooking the コ shape.And, heat pipe 6581, though concrete diagram is omitted, but the size (X-direction leave size) of leaving of aforementioned a pair of extension forms longways than the physical dimension of the X-direction in the optic modulating device 451, and the length dimension of the bearing of trend of aforementioned a pair of extension (Y direction) forms longways than the physical dimension of the Y direction in the optic modulating device 451.
Outer framework 6582 is made of the material with heat conductivity, as is shown among Fig. 7 or Fig. 8 ground, and the outer peripheral face ground that covers heat pipe 6581 can be connected in to the heat transmission this outer peripheral face.And this outer framework 6582, as be shown among Fig. 7 ground becomes that shape corresponding to heat pipe 6581 has the base end part 658A that extends along X-direction and the コ shape ground of overlooking of a pair of extension 658B, the 658C that extend along Y direction forms.Also having, as the material of outer framework 6582, so long as have the material of heat conductivity, can be any material, for example, can adopt maintenance frame 4512 identical materials with optic modulating device 451.
And, be somebody's turn to do outer framework 6582, as be shown among Fig. 8 ground, constituted by cutting apart the 1st outer framework 6582A and the 2nd outer framework 6582B that form 2 parts, by the 1st outer framework 6582A and the 2nd outer framework 6582B combination and can heat be connected in the outer peripheral face of heat pipe 6581 mutually with transmitting.
More specifically, the 1st outer framework 6582A, by pressure processing or injection molding forming etc., become corresponding to the outer shape of optic modulating device 451 along optic modulating device 451-the コ shape ground of overlooking of Y direction side end face and X-direction both sides end face forms, and the section that forms コ shape inner side end corresponding to optical element side connecting portion 4512C, the 4512D of optic modulating device 451 and become the flat condition that is parallel to the YZ plane is seen the essentially rectangular shape.And, outside the 1st framework 6582A+the Z-direction end face, as be shown among Fig. 8 ground, form the concave curved surface 6582A1 that sees circular shape corresponding to the section of the outside surface of heat pipe 6581.And, the 1st outer framework 6582A, as be shown among Fig. 7 ground, the size (X-direction leave size) of leaving of a pair of extension 658B, 658C forms with the basic identical ground of the physical dimension of the X-direction of optic modulating device 451, and the length dimension of the bearing of trend (Y direction) of a pair of extension 658B, 658C forms longways than the physical dimension of the Y direction of optic modulating device 451.And the 2nd outer framework 6582B also similarly forms with the 1st outer framework 6582A, as is shown among Fig. 8 ground, at-Z-direction end face, as is shown among Fig. 8 ground, forms the concave curved surface 6582B1 that sees circular shape corresponding to the section of the outside surface of heat pipe 6581.
Then, make up mutually by making the 1st outer framework 6582A and the 2nd outer framework 6582B, the space so that each concave curved surface 6582A1,6582B1 form tubular can set heat pipe 6581 in this space.Framework 6582B is mutual outside the framework 6582A and the 2nd outside the 1st makes up to set in aforesaid space under the state of heat pipe 6581 making, each concave curved surface 6582A1,6582B1 carry out face with the outside surface of heat pipe 6581 and contact, and heat pipe 6581 and outer framework 6582 can be connected to each other to the heat transmission.At this, syndeton as heat pipe 6581 and outer framework 6582, for example can adopt: the formation that outside surface and each concave curved surface 6582A1,6582B1 of heat pipe 6581 is connected by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.By for so constituting, the not contact portion of the microstage that outside surface and the rough surface between each concave curved surface 6582A1,6582B1 because of heat pipe 6581 are produced also can connect in the mode of can heat transmitting.
And, as make the 1st outside framework 6582A and the 2nd outside under the mutual state that makes up of framework 6582B above-mentionedly, the コ shape inner side end of the コ shape inner side end of the 1st outer framework 6582A and the 2nd outer framework 6582B becomes a face basically, and the コ shape inner side end of outer framework 6582 has the flat condition that is parallel to the YZ plane.And in heat conduction member 658, the subtend face 6582C1 of the mutual subtend of a pair of extension 658B, 658C in the outer framework 6582,6582C2 (Fig. 7) become the heat conduction member side connecting portion that can be connected in to the heat transmission optic modulating device 451.
And, by the chimeric optic modulating device 451 of the コ of heat conduction member 658 shape inside part (make optic modulating device 451-Y side direction side end is contacted with the state of base end part 658A), optical element side connecting portion 4512C, the 4512D of optic modulating device 451 carries out face and contacts with heat conduction member side connecting portion 6582C1, the 6582C2 of heat conduction member 658, and optic modulating device 451 and heat conduction member 658 mutually can heat transmit ground and connect.At this, syndeton as heat conduction member 658 and optic modulating device 451, with aforementioned the 1st embodiment similarly, for example, can adopt: the formation that optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 6582C1,6582C2 are adhesively fixed by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 3rd embodiment, with respect to the radiator structure that is illustrated with aforementioned the 1st embodiment, only in the heat transfer path that keeps frame 4512~heat pipe 6581, the point that is gripped with outer framework 6582 is inequality.Promptly, result from the heat of liquid crystal panel 4511, as be shown in the arrow R3 ground of Fig. 7, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~outer framework 6582~heat pipe 6581,, dispel the heat in the outside to condensation part 6584A, 6584B, 6585 thermophoresis by evaporation part 6583A, 6583B from heat conduction member 658 (heat pipe 6581) from condensation part 6584A, 6584B, 6585.
In the above-described 3rd embodiment, except with the same effect of aforementioned the 1st embodiment, also have following effect.
In the present embodiment, heat conduction member 658 possesses heat pipe 6581 and outer framework 6582, inserts and puts under the state that has disposed outer framework 6582 at heat pipe 6581 and 451 of optic modulating devices, carries out face with optic modulating device 451 and contacts.Thus, compare with the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment, because be the formation that outer framework 6582 is inserted and put be disposed at 6581 of optic modulating device 451 and heat pipes, so needn't implement pressure processing etc. to heat pipe 6581, only with the heat conduction member side connecting portion 6582C1 of the outside surface of outer framework 6582,6582C2 is processed into consistent with outside surface (the optical element side connecting portion 4512C of optic modulating device 451, the shape of shape 4512D) gets final product, can keep the characteristic of heat pipe 6581 well, and effectively optic modulating device 451 is cooled off, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 (liquid crystal panel 4511) effectively.
And, because outer framework 6582, for cutting apart the formation of 2 parts that form the 1st outer framework 6582A and the 2nd outer framework 6582B, so can easily implement installation with respect to heat pipe 6581.
The 4th embodiment
Next, based on accompanying drawing the 4th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 1st embodiment, its detailed explanation is omitted or is simplified.
Fig. 9 A to Figure 10 B is the structure of the heat conduction member 758 in expression the 4th embodiment, and the figure of the syndeton of heat conduction member 758 and liquid crystal panel 4511.Particularly, Fig. 9 A is the stereographic map of seeing from the light beam light incident side.Fig. 9 B is the stereographic map of seeing from the light beam emitting side.Figure 10 A is the sectional view of seeing from the side.Figure 10 B is the sectional view of seeing from upper side.
Also have, in Fig. 9 A to Figure 10 B, for the convenience that illustrates, will be from the optical axis of the emitted light beam of liquid crystal panel 4511 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
Present embodiment, with respect to aforementioned the 1st embodiment, as be shown in Fig. 9 A to Figure 10 B ground, the structure difference of heat conduction member 758 only, and the maintenance frame 4512 in the omission optic modulating device 451,758 pairs of liquid crystal panels 4511 as optical element of heat conduction member are maintained fixed, and it is inequality liquid crystal panel 4511 can be equipped on the point of precalculated position ground formation.Other formation, same with aforementioned the 1st embodiment.
Heat conduction member 758, with the heat conduction member 458 that is illustrated with aforementioned the 1st embodiment similarly, constituted by heat pipe.
This heat conduction member 758, by being implemented pressure processing, as be shown among Fig. 9 A and Fig. 9 B ground, become have corresponding to the outer shape of liquid crystal panel 4511 along liquid crystal panel 4511+the base end part 758A that extends the Y direction side end face, and being bent to form of a pair of extension 758B, the 758C that extend along the X-direction both sides end face of liquid crystal panel 4511 with overlooking the コ shape.
And heat conduction member 758 by being implemented pressure processing, as is shown among Fig. 9 A ground, and the outside surface of-Z-direction side (light beam light incident side) forms flat condition.And the outside surface 7581 of aforementioned flat condition works as the seating surface that the optical element (for example, the light incident side polarization plates 452) that is disposed at the light path preceding-stage side is supported.
And, heat conduction member 758, by being implemented pressure processing, as be shown among Figure 10 A and Figure 10 B ground, form: the コ shape peripheral part of+Z-direction side (light beam emitting side) corresponding to the outer shape of liquid crystal panel 4511 to the recess of overlooking the コ shape 7582 of-Z-direction side depression.More specifically, this recess 7582, as be shown among Figure 10 A and Figure 10 B ground, have shape corresponding to the outer shape of the subtend substrate 4511B of liquid crystal panel 4511 and dustproof glass 4511E, and with respect to this recess 7582 with the gap engagement state can chimeric liquid crystal panel 4511 subtend substrate 4511B and dustproof glass 4511E ground constituted.And, the bottom surface portions of this recess 7582, as be shown among Figure 10 A and Figure 10 B ground, form flat condition.And in heat conduction member 758, the bottom surface portions 7582A of recess 7582 becomes the heat conduction member side connecting portion that can be connected in to the heat transmission liquid crystal panel 4511.
And, be contacted with recess 7582 in the heat conduction member 758 by the light beam light incident side end face that makes liquid crystal panel 4511, the light beam light incident side end face 4511E1 (optical element side connecting portion) of dustproof glass 4511E in the liquid crystal panel 4511 carries out face with the heat conduction member side connecting portion 7582A of heat conduction member 758 and contacts, and liquid crystal panel 4511 and heat conduction member 758 mutually can heat transmit ground and connect.At this, optical element side connecting portion 4511E1 and heat conduction member side connecting portion 7582A are adhesively fixed by the bonding agent with heat conductivity.By so being adhesively fixed, the not contact portion of the microstage that produces because of the rough surface between optical element side connecting portion 4511E1 and heat conduction member side connecting portion 7582A also can be connected in the mode of can heat transmitting.
Promptly, by making heat conduction member 758 be above-mentioned structure, can directly be maintained fixed liquid crystal panel 4511, and for example, by keeping the precalculated position of body 457 that heat conduction member 758 is fixed with respect to optical element and liquid crystal panel 4511 can being equipped on the precalculated position; By in optical component casing 46 inside heat conduction member 758 being fixed and liquid crystal panel 4511 can being equipped on the precalculated position.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 4th embodiment, with respect to the radiator structure that is illustrated with aforementioned the 1st embodiment, only in the heat transfer path of liquid crystal panel 4511~heat conduction member 758, the point that has omitted maintenance frame 4512 is inequality.Promptly, result from the heat of liquid crystal panel 4511, as be shown in the arrow R4 ground of Fig. 9 A, heat transfer path through liquid crystal panel 4511~heat conduction member 758,, dispel the heat in the outside to condensation part 7584A, 7584B, 7585 thermophoresis by evaporation part 7583A, 7583B from heat conduction member 758 from condensation part 7584A, 7584B, 7585.
In the above-described 4th embodiment, except with the same effect of aforementioned the 1st embodiment, also have following effect.
In the present embodiment, heat conduction member 758, have and comprise that base end part 758A and a pair of extension 758B, 758C's overlooks the コ shape, and liquid crystal panel 4511 is maintained fixed, and liquid crystal panel 4511 can be equipped on ground, precalculated position and constitutes with the bottom surface portions (heat conduction member side connecting portion 7582A) of the recess 7582 that is formed at コ shape inner peripheral.That is, can be with respect to the optic modulating device 451 that is illustrated with aforementioned the 1st embodiment and omit and keep frame 4512, make heat conduction member 758 self possess function as the maintenance frame that liquid crystal panel 4511 is kept.Therefore, can omit maintenance frame 4512, make the designs simplification of optical devices main body 45A, and seek the cost reduction of optical devices main body 45A, and then seek the cost reduction of projector 1.
And, keep frame 4512 because can omit, so can be not by keeping frame 4512, and the heat that directly will result from liquid crystal panel 4511 is dispelled the heat in heat conduction member 758, can make the heat transfer characteristic of 758 of liquid crystal panel 4511~heat conduction members good, can improve the cooling effectiveness of liquid crystal panel 4511.
The variation of the 1st~the 4th embodiment
Also have, the present invention is defined in aforesaid embodiment, comprises in the present invention in the distortion of the scope that can reach purpose of the present invention, improvement etc.
Though in aforementioned each embodiment, to adopting heat conduction member 458,558,658,758, the formation that optic modulating device 451, liquid crystal panel 4511 are cooled off is illustrated, but be not limited to this, also can be to other optical element, for example polarization conversion device 423, light incident side polarization plates 452, emitting side polarization plates 454 etc. constitute with cooling off.
Though in aforementioned each embodiment, heat conduction member 458,558,658,758, have the コ of overlooking shape, form annularly, but, can be Any shape so long as be contacted with under the state of maintenance frame 4512, liquid crystal panel 4511 of optic modulating device 451 shape that can heat connect at face with transmitting.
Though in aforementioned each embodiment, optical element side connecting portion 4512C, 4512D and heat conduction member side connecting portion 4581B, 4581C, 5581B, 5581C, 6582C1,6582C2,7582A form flat condition, but be not limited to this, also can form other shape, curve form or concaveconvex shape.
Though in aforementioned each embodiment, with optical element side connecting portion is the maintenance frame 4512 of optic modulating device 451, the outside surface of liquid crystal panel 4511, consistent heat conduction member side connecting portion 4581B, 4581C, 5581B, 5581C, 6582C1,6582C2, the 7582A of forming in this outside surface ground, but be not limited to this, for example, also can be with the outside surface of heat pipe of overlooking toroidal as heat conduction member side connecting portion, consistent outside surface ground in heat pipe is at maintenance frame, the liquid crystal panel formation optical element side connecting portion of optic modulating device.And, also can be maintenance frame, liquid crystal panel at optic modulating device, and heat conduction member, optical element side connecting portion and the heat conduction member side connecting portion that carries out the face contact mutually formed respectively.
Figure 11 and Figure 12 are the figure of the variation of aforementioned the 1st embodiment of expression.
Though in the 1st embodiment, heat conduction member 458 by pressure processing, forms section and sees the essentially rectangular shape, but plane as long as each subtend face 4581B, 4581C of the mutual subtend of a pair of extension 458B, 458C form, then section shape is not particularly limited.For example, as be shown among Figure 11 ground, both heat conduction member 458 can be formed section by pressure processing and see the general triangular shape, perhaps also heat conduction member 458 can be formed section by pressure processing and see semi-circular shape.
And, though in the 3rd embodiment, outer framework 6582 is formed section to be seen rectangular-shaped, but as long as each subtend face 6582C1,6582C2 of the mutual subtend of a pair of extension 658B, 658C form plane, then section shape is not particularly limited, and can have section and sees that triangle, section see semi-circular shape with above-mentioned similarly forming.
Though in the 4th embodiment, heat conduction member 758, having the コ of overlooking shape ground forms, as long as but have along the shape of at least a portion of the periphery ora terminalis of liquid crystal panel 4511, for example, also can with the heat conduction member 558 that is illustrated with aforementioned the 2nd embodiment similarly, form and have ring-type.And, also can be to filling with bonding agent between the side of the dustproof glass 4511E of liquid crystal panel 4511 and subtend substrate 4511B and the recess 7582 with heat conductivity, can carry out the area that heat transmits and increase and make.
Figure 13 A and Figure 13 B are the figure of the variation of aforementioned each embodiment of expression.
In the present invention, so long as carry out mutually can the hot formation that be connected getting final product under the face state of contact, for example, also can adopt to be shown in following formation at maintenance frame, the liquid crystal panel of heat conduction member and optic modulating device with transmitting.
For example, as be shown among Figure 13 A ground, form the breach 4512A that sees the heat conduction member (heat pipe) 458 ' of toroidal corresponding to section at the side end of the maintenance frame 4512 ' that constitutes optic modulating device 451 '.Then, as be shown in the dotted line ground of Figure 13 A, the fore-end that makes breach 4512A ' is by hot ca(u)lk bending, makes the internal face of breach 4512A ' be contacted with the outside surface of heat conduction member 458 ' and connects.
And, for example, as be shown among Figure 13 B ground, constituting optic modulating device 451 " maintenance frame 4512 " the side end side form the heat conduction member (heat pipe) 458 of can the break-through section seeing toroidal " reach through hole 4512A ".Then, as be shown in the dotted line ground of Figure 13 B, when heat conduction member 458 " manufacturing the time; at reach through hole 4512A " in break-through heat conduction member 458 " state under; on one side to heat conduction member 458 " heat, on one side to heat conduction member 458 " pipe inside pressurize and make it to expand, make heat conduction member 458 " outside surface be contacted with reach through hole 4512A " internal face and connecting.Then, to heat conduction member 458 " each end carry out sealing.
So to constitute, also can make maintenance frame, the liquid crystal panel of heat conduction member and optic modulating device carry out face mutually and contact and carry out the heat transmission well.
The 5th embodiment
Next, based on accompanying drawing the 5th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 1st embodiment, its detailed explanation is omitted or is simplified.
(the detailed formation of optical devices main body)
Figure 14 and Figure 15 are the figure of the summary formation of expression optical devices main body 45A.Particularly, Figure 14 is a stereographic map of seeing optical devices main body 45A from optic modulating device 451G side.Figure 15 is the exploded perspective view of optical devices main body 45A.Also have, though in Figure 15, in optical devices main body 45A, only optic modulating device 451G side is decomposed, each optic modulating device 451R, 451B side also have and the same formation of optic modulating device 451G side.
Optical devices main body 45A, except each above-mentioned optic modulating device 451, each field angle compensating plate 453, each emitting side polarization plates 454, and outside the cross colour splitting prism 455, as be shown among Figure 14 or Figure 15 ground, possess: body support structure 456,3 optical elements keep body 457 and 3 heat pipes 1158 (heat conduction member); Integrated these each members 451,453~457,1158.
At this, in 3 emitting side polarization plates 454, each the 2nd emitting side polarization plates 4542, as be shown among Figure 14 or Figure 15 ground is fixed in each light beam light incident side end face of cross colour splitting prism 455 respectively by bonding agent etc. under the state of light beam light incident side at polarizing coating 4542B.
3 heat pipes 1158, as be shown among Figure 14 or Figure 15 ground are heat to be connected to 3 optic modulating devices 451 with transmitting, and the irradiation by light beam is resulted from the member that the heat of optic modulating device 451 is dispelled the heat.This heat pipe 1158 forms the tubulose that has capillary pipe structure (capillary wick) in inside, and places cooling medium in pipe inside, in the pipe internal reflux, carries out the thermophoresis in this heat pipe 1158 by cooling medium.
At this, though concrete diagram is omitted, the capillary pipe structure of heat pipe 1158 is made of pulverous slug type capillary wick.And,, adopt water as cooling medium.Also have,, be not limited to the slug type capillary wick as aforementioned capillary pipe structure, also can be used as other capillary wick, the superfine line style capillary wick that is made of many fine copper wires etc. for example, cancellous wire netting type capillary wick perhaps constitutes in the capillary wick of the inner grooved that is formed with the multiple tracks groove of pipe.And, as cooling medium, be not limited to water, also can adopt other cooling medium, for example alcohols etc.
Figure 16 is the stereographic map of expression heat pipe 1158 with respect to the syndeton of optic modulating device 451.Also have, in Figure 16, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
This heat pipe 1158, by being implemented pressure processing, as be shown among Figure 16 ground, form following shape: become corresponding to the outer shape of optic modulating device 451 have along optic modulating device 451-the Y direction side end face extends the base end part 1158A of X-direction, reach a pair of extension 1158B that extends Y direction along the X-direction both sides end face of optic modulating device 451 respectively, the コ shape ground of overlooking of 1158C is bent to form, and corresponding to the optical element side connecting portion 4512C of optic modulating device 451,4512D and the section that forms コ shape inner side end and become the flat condition that is parallel to the YZ plane is seen the substantially elliptical shape.And, heat pipe 1158, as be shown among Figure 16 ground, the size (X-direction leave size) of leaving between a pair of extension 1158B, 1158C forms with the roughly the same ground of the physical dimension of the X-direction of optic modulating device 451, and the length dimension of the bearing of trend (Y direction) of a pair of extension 1158B, 1158C forms longways than the physical dimension of the Y direction of optic modulating device 451.And in heat pipe 1158, subtend face 11581B, the 11581C of the mutual subtend of a pair of extension 1158B, 1158C becomes the pipe side connecting portion that can be connected in to the heat transmission optic modulating device 451.
And, in this heat pipe 1158,, as be shown among Figure 16 ground at base end part 1158A, be provided with the heat of transmitting from evaporation part described later is dispelled the heat in the wing tabs 4585 of outside.
More specifically, in the present embodiment, wing tabs 4585, form the formation of fin shape (concavo-convex) for outside surface with the base end part 1158A of heat pipe 1158, as be shown among Figure 16 ground, by from base end part 1158A+the Y direction end face towards+a plurality of upper side wing tabs 4585A that Y direction is extended and from base end part 1158A-the Y direction end face constituted towards-a plurality of lower side wing tabs 4585B that Y direction is extended.
A plurality of upper side wing tabs 4585A, as be shown among Figure 16 ground form tabularly respectively, and the plate face is parallel to the YZ plane, and is arranged in the X-direction ground formation of arranging.And, a plurality of upper side wing tabs 4585A, as be shown among Figure 16 ground, corresponding to optic modulating device 451-outer shape of Y direction end, promptly corresponding to the shape of the recess 4512A3 in the optic modulating device 451, the height dimension of Y direction that is positioned at the upper side wing tabs 4585A of X-direction substantial middle part forms than the height dimension highland of the Y direction of the upper side wing tabs 4585A that is positioned at the X-direction both end sides.And, heat pipe 1158 and optic modulating device 451 are being carried out under the state that connects, as are being shown among Figure 16 ground, a plurality of upper side wing tabs 4585A corresponding to optic modulating device 451-following of the state of Y direction end sets.
A plurality of lower side wing tabs 4585B, as be shown among Figure 16 ground form tabularly respectively, and the plate face is parallel to the YZ plane, and is arranged in the X-direction ground formation of arranging.And, a plurality of lower side wing tabs 4585B, as be shown among Figure 16 ground, basic identical ground, the position of fore-end institute forms respectively.
And, by the chimeric optic modulating device 451 of コ shape inside part in heat pipe 1158, optical element side connecting portion 4512C, the 4512D of optic modulating device 451 carries out face and contacts with pipe side connecting portion 11581B, the 11581C of heat pipe 1158, and optic modulating device 451 and heat pipe 1158 mutually can heat transmit ground and connect.At this, syndeton as heat pipe 1158 and optic modulating device 451, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 11581B, 11581C are connected by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.By for so constituting, the not contact portion of the microstage that produces because of the rough surface between optical element side connecting portion 4512C, 4512D and pipe side connecting portion 11581B, 11581C also can be connected in the mode of can heat transmitting.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
As above-mentioned ground, under the state that heat pipe 1158 and optic modulating device 451 can heat carry out connecting with transmitting, owing to the irradiation of light beam results from the heat of liquid crystal panel 4511, as be shown in followingly heat radiation.
For example, result from the heat of liquid crystal panel 4511, as be shown in the arrow R1 ground of Figure 16, optical element side connecting portion 4512C, 4512D towards can being connected in to the heat transmission heat pipe 1158 move along X-direction, and are transmitted to maintenance frame 4512.
Be transmitted to the heat that keeps frame 4512, as be shown in the arrow R1 ground of Figure 16, be transmitted to Y direction substantial middle part among a pair of extension 1158B, the 1158C by pipe side connecting portion 11581B, the 11581C that can heat be connected in maintenance frame 4512 in the heat pipe 1158 with transmitting.
At this, the inside of the Y direction substantial middle part in a pair of extension 1158B, 1158C, the heat of passing through to be transmitted is heated cooling medium and is evaporated and gasifies, and absorbs heat as latent heat (heat of gasification) at this moment.That is, the Y direction substantial middle part of a pair of extension 1158B, 1158C works as the evaporation part in the heat pipe 1,158 4582.
Then, the cooling medium that has gasified becomes steam flow, as is shown in the arrow R1 ground of Figure 16, moves to each fore-end and base end part 1158A as a pair of extension 1158B, the 1158C of the heat pipe 1158 of low temperature side (side of leaving from each evaporation part 4582).Then, move to each fore-end of a pair of extension 1158B, 1158C, and the cooling medium of base end part 1158A, cooling and liquefying, and emit heat (because the heat that condensation latent heat causes discharges).That is, each fore-end of a pair of extension 1158B, 1158C, and base end part 1158A work as the condensation part in the heat pipe 1,158 4583,11584.Then, the heat of condensation part 11584 is dispelled the heat in the outside by wing tabs 4585 among each condensation part 4583,11584.And the heat of each condensation part 4583 is directly dispelled the heat in the outside.Cooling medium with having liquefied in condensation part 4583,11584 turns back to evaporation part 4582 once more by capillary pipe structure (capillary wick).
As above ground, result from the heat of liquid crystal panel 4511, as be shown in the arrow R1 ground of Figure 16, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 1158, by the thermophoresis of the evaporation part from heat pipe 1,158 4582 to condensation part 4583,11584,4583 dispel the heat in the outside from the condensation part, and 11584 dispel the heat in the outside by wing tabs 4585 from the condensation part.
If according to the 5th above-mentioned embodiment, following effect is arranged then.
In the present embodiment, heat pipe 1158 can heat be connected in optic modulating device 451 with outside surface with transmitting.Thus, compare with existing formation because heat pipe 1158 between itself and optic modulating device 451 by air, be directly connected in optic modulating device 451, so can reduce thermal resistance in the heat transfer path of optic modulating device 451~heat pipe 1158.
And,, the wing tabs 4585 of heat transmission is set at the outside surface of heat pipe 1158.Thus,,, dispel the heat by the heat that the evaporation part 4582 of heat pipe 1158 is absorbed from optic modulating device 451 in the outside by wing tabs 4585.Therefore, in heat pipe 1158, fully guarantee area of dissipation and make heat dissipation characteristics good, can reduce the temperature of the condensation part 4583,11584 that is positioned at 4582 sides of leaving from the evaporation part.That is, in heat pipe 1158, can set the temperature difference of 4583,11584 of evaporation part 4582 and condensation parts greatly, the migration amount of the heat in the pipe inside is increased.
Thereby, can cool off optic modulating device 451 effectively, the temperature of optic modulating device 451 is risen suppress and can prevent the hot deterioration of optic modulating device 451 (liquid crystal panel 4511) effectively.That is, can keep projected image well, and seek long lifetime from projector 1.
And, wing tabs 4585, because be the formation that the outside surface of heat pipe 1158 is formed the fin shape, so for example with the wing tabs compare with the situation that the mode with the heat pipe split constitutes, can make in the inner heat that moves of the pipe of heat pipe 1158 and be transmitted to wing tabs 4585 well, can dispel the heat well by wing tabs 4585.
And, in the present embodiment, heat pipe 1158, form have base end part 1158A and a pair of extension 1158B, a 1158C overlook the コ shape, can heat be connected to each optical element side connecting portion 4512C, 4512D in the optic modulating device 451 with a pair of extension 1158B, 1158C (respectively managing side connecting portion 11581B, 11581C) with transmitting.Thus, for example compare with the formation that only any 1 side end, heat pipe can be connected to the heat transmission among each side end of optic modulating device 451, in heat pipe 1158, can make return flow path at the inner cooling medium of pipe, become each evaporation part 4582 in the part of each extension 1158B, 1158C, and the mulitpath between each condensation part 4583,11584 of the side of leaving from each evaporation part 4582 (in the present embodiment, be 4 paths), the migration amount of the heat in the pipe inside is increased.And, in order effectively optic modulating device 451 to be cooled off, for example, though can consider 2 heat pipes can be connected to the heat transmission formation of each optical element side connecting portion 4512C, 4512D of optic modulating device 451, but in the formation of present embodiment, because just can cool off optic modulating device 451 effectively with 1 heat pipe 1158, so that the simplifying the structure of optical devices main body 45A, and the cost that can seek optical devices main body 45A reduces, and then the cost of seeking projector 1 reduces.
And in the present embodiment, the capillary pipe structure of heat pipe 1158 is made of the slug type capillary wick.Thus, in the moving of cooling medium, needn't utilize gravity, not limit the equipping position of condensation part 4583,11584 and evaporation part 4582.Therefore, for example, in projector 1, the posture state of the projector 1 that the state that can place posture corresponding to forward, hang posture, make it to tilt for the position of adjusting projected image etc. are all, implement the thermophoresis in the heat pipe 1158 well, can cool off above-mentioned optic modulating device 451 effectively, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 effectively.
And, because the capillary pipe structure of heat pipe 1158 is made of the slug type capillary wick, so with other capillary wick (superfine line style capillary wick, wire netting type capillary wick, the capillary wick of grooved etc.) compare, can make evaporation part 4582 fully low with the thermal resistance of condensation part 4583,11584, and because the heat conductivity of capillary wick self is good, so can make heat be transmitted to cooling medium well, thermophoresis in the heat pipe 1158 is more promptly carried out, the cooling effectiveness of optic modulating device 451 is further improved.
And optic modulating device 451 and heat pipe 1158 have the shape that interconnected each connecting portion (optical element side connecting portion 4512C, 4512D and pipe side connecting portion 11581B, 11581C) carries out the face contact.Thus, can increase the contact area of 1158 of optic modulating device 451 and heat pipes, can make from optic modulating device 451 good to the heat transfer characteristic of heat pipe 1158.
And, in the present embodiment, being formed at pipe side connecting portion 11581B, the 11581C of the outside surface of heat pipe 1158, unanimity forms by pressure processing in the shape ground of the outside surface (optical element side connecting portion 4512C, 4512D) of optic modulating device 451.Thus, for example with heat pipe (for example, section is seen the heat pipe of toroidal) outside surface as pipe side connecting portion and the shape ground of consistent outside surface in heat pipe forms the formation of optical element side connecting portion and compares, only just can realize each connecting portion (optical element side connecting portion 4512C of optic modulating device 451 and heat pipe 1158 by processing that heat pipe 1158 is exerted pressure, 4512D and pipe side connecting portion 11581B, 11581C) carry out the face contacting structure, with simple formation, just can cool off above-mentioned optic modulating device 451 effectively, be fit to seek temperature to optic modulating device 451 and rise and suppress and can prevent the effect of the hot deterioration of optic modulating device 451 effectively.
The 6th embodiment
Next, based on accompanying drawing the 6th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 5th embodiment, its detailed explanation is omitted or is simplified.
Figure 17 is the structure of the heat pipe 1258 (heat conduction member) in expression the 6th embodiment, and the stereographic map of the syndeton of heat pipe 1258 and optic modulating device 451.Also have, in Figure 17, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
Present embodiment with respect to aforementioned the 5th embodiment, as is shown among Figure 17 ground, and only wing tabs 12585 constitutes with heat pipe 1258 splits, and the point of outside surface that is installed on heat pipe 1258 is inequality.Other formation, same with aforementioned the 5th embodiment.
Figure 18 is the exploded perspective view of the syndeton of expression heat pipe 1258 and wing tabs 12585.Also have, in Figure 18, for the convenience that illustrates, with Figure 17 similarly, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
Heat pipe 1258, it is the heat pipe that has with same function of the heat pipe that is illustrated with aforementioned the 5th embodiment 1158 and roughly same shape, as be shown among Figure 17 or Figure 18 ground, by being implemented pressure processing, have with the base end part 1158A of heat pipe 1158 and a pair of extension 1158B, 1158C (comprising pipe side connecting portion 11581B, 11581C) same, base end part 1258A (Figure 18) and a pair of extension 1258B, 1258C (comprising pipe side connecting portion 11581B, 11581C).
At this, heat pipe 1258 by being implemented pressure processing, as is shown among Figure 18 ground, and the Z-direction both ends of the surface that form base end part 1258A become the section of the flat condition that is parallel to the XY plane and see the substantially elliptical shape.And in heat pipe 1258, Z-direction both ends of the surface 1258A1, the 1258A2 among the base end part 1258A becomes the fin connecting portion that can be connected in to the heat transmission wing tabs 12585.
Wing tabs 12585, by material with heat conductivity, for example the metal material of aluminium etc. constitutes, as is shown among Figure 17 or Figure 18 ground, is made of 2 parts of each fin connecting portion 1258A1,1258A2 among the base end part 1258A that can heat be connected to heat pipe 1258 with transmitting.These wing tabs 12585, as be shown among Figure 17 or Figure 18 ground, form plate body 12585A and a plurality of fin 12585B institute and constitute respectively.
Plate body 12585A is to have the plate body of overlooking the essentially rectangular shape.More specifically, this plate body 12585A, as be shown among Figure 17 or Figure 18 ground, corresponding to optic modulating device 451-outer shape of Y direction end, promptly, corresponding to the shape of the recess 4512A3 in the optic modulating device 451, the X-direction substantial middle part of+Y direction ora terminalis, towards+Y direction is outstanding.
A plurality of fin 12585B, as be shown among Figure 17 or Figure 18 ground are formed at the end face of a side among the Z-direction end face among the plate body 12585A.More specifically, a plurality of fin 12585B, as be shown among Figure 17 or Figure 18 ground form tabularly respectively, and the plate face is parallel to the YZ plane, and be arranged in X-direction ground from plate body 12585A+the Y direction ora terminalis extends to form to-Y direction ora terminalis.
And, in each wing tabs 12585, can heat be connected to each fin connecting portion 1258A1,1258A2 of heat pipe 1258 with the end face of the end face opposition side that is formed with a plurality of fin 12585B with transmitting.Also have, syndeton as each wing tabs 12585 and heat pipe 1258, for example also can adopt: the formation that each fin connecting portion 1258A1,1258A2 and each wing tabs 12585 are connected by scolding tin etc., the formation of welding and connecting, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.And, at heat pipe 1285 to being connected with each wing tabs 12585, and optic modulating device 451 has carried out under the state (same with the syndeton of heat pipe 1158 that is illustrated with aforementioned the 5th embodiment and optic modulating device 451) of connection, as be shown among Figure 17 ground, by each wing tabs 12585+the Y direction ora terminalis corresponding to optic modulating device 451-state of Y direction end sets.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 6th embodiment, same with the radiator structure that is illustrated with aforementioned the 5th embodiment.Promptly, result from the heat of liquid crystal panel 4511, as be shown in the arrow R2 ground of Figure 17, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 1258, by in the heat pipe 1258 from the thermophoresis of evaporation part 4582A to condensation part 4583,11584 (Figure 18), 4583 dispel the heat in the outside from the condensation part, and 11584 dispel the heat in the outside by wing tabs 12585 from the condensation part.
In the above-described 6th embodiment, except with the same effect of aforementioned the 5th embodiment, also have following effect.
In the present embodiment, wing tabs 12585 constitutes with heat pipe 1258 splits.Thus, compare with the structure (outside surface of heat pipe 1158 being formed the structure of fin shape as the formation of wing tabs 4585) that has described with aforementioned the 5th embodiment, do not limit the shape of wing tabs 12585 and can form different shape, can improve the degree of freedom of the design of wing tabs 12585.
The 7th embodiment
Next, based on accompanying drawing the 7th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 5th embodiment, its detailed explanation is omitted or is simplified.
Figure 19 is the structure of the heat pipe 1358 (heat conduction member) in expression the 7th embodiment, and the stereographic map of the syndeton of heat pipe 1358 and optic modulating device 451.Also have, in Figure 19, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
In the present embodiment, with respect to aforementioned the 5th embodiment, as be shown among Figure 19 ground, only the structure of heat pipe 1358 is inequality.Other formation, same with aforementioned the 5th embodiment.
Heat pipe 1358 is the heat pipes that have with the same function of the heat pipe that is illustrated with aforementioned the 5th embodiment 1158, as is shown among Figure 19 ground, and what have the Y direction of extending overlooks the I shape, and has section circular shape ground and form.And, heat pipe 1358, as be shown among Figure 19 ground, the length dimension of Y direction forms longways than the physical dimension of the Y direction of optic modulating device 451.And this heat pipe 1358, as be shown among Figure 19 ground, its outside surface can heat be connected to each optical element side connecting portion 4512C, the 4512D in the optic modulating device 451 with transmitting.That is, as be shown among Figure 19 ground, in heat pipe 1358, the part 13581 that can heat be connected in the outside surface of optical element side connecting portion 4512C, 4512D become with transmitting manages the side connecting portion.
Also have, syndeton as heat pipe 1358 and optic modulating device 451, with aforementioned the 5th embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 13581 are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
And, in the present embodiment, heat pipe 1358, in optical devices main body 45A integral body, the quantity corresponding to optic modulating device 451 (each optical element side connecting portion 4512C, 4512D) adopts 6 (with reference to Figure 20).
Figure 20 is to be used for the figure that the bearing of trend to wing tabs 13585 describes.
In this heat pipe 1358, at its outside surface, as be shown among Figure 19 ground, the wing tabs 13585 that extends the direction of leaving from pipe side connecting portion 13581 is installed in the position of pipe side connecting portion 13581 in subtend roughly.
This wing tabs 13585, by the material with heat conductivity, for example the metal material of aluminium etc. constitutes, as is shown among Figure 19 ground, forms the essentially identical rectangular plate shape of overlooking of length dimension of the Y direction of the length dimension of Y direction and heat pipe 1358.And this wing tabs 13585, as be shown among Figure 19 ground can heat be connected in roughly subtend in the heat pipe 1358 in the position of managing side connecting portion 13581 along a side's of Y direction side end with transmitting.Also have, syndeton as wing tabs 13585 and heat pipe 1358, for example can adopt: the formation that wing tabs 13585 and heat pipe 1358 are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
At this, wing tabs 13585, as be shown among Figure 20 ground, integrated under the state of optical devices main body 45A, extend overlooking of cross colour splitting prism 455 rectangular-shaped to the angular direction be installed on heat pipe 1358.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 7th embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 5th embodiment, dissimilarity is as following.
In the present embodiment, because adopt 2 heat pipes 1358 of overlooking the I shape with respect to 1 optic modulating device 451, so each heat pipe 1358, as be shown among Figure 19 ground, Y direction substantial middle part works respectively as evaporation part 13582, then works as condensation part 13583A, 13583B as the Y direction both ends side of low temperature side (side of leaving from each evaporation part 13582).
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R3 ground of Figure 19, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~each heat pipe 1358, by 13582 the thermophoresis in each heat pipe 1358, dispel the heat in the outside by wing tabs 13585 from condensation part 13583A, 13583B to condensation part 13583A, 13583B from the evaporation part.And, because wing tabs 13585, outside surface at heat pipe 1358, be connected in the position of subtend roughly in pipe side connecting portion 13581, so that be transmitted to the part of the heat of pipe side connecting portion 13581 and transmit, and dispel the heat towards condensation part 13583A, 13583B side in the outside as the arrow R3 ground that is shown in Figure 19.
In the above-described 7th embodiment, except with the same effect of aforementioned the 5th embodiment, also have following effect.
In the present embodiment, because heat pipe 1358 has the I of overlooking shape,, can effectively optic modulating device 451 be cooled off with heat pipe 1358 with simple structure so needn't implement to make the processing of heat pipe 1358 bendings etc.
And, because heat pipe 1358, has the I of overlooking shape, so by making length dimension (length dimension of Y direction) be the size longer slightly than the physical dimension of the Y direction of optic modulating device 451, by being connected in optical element side connecting portion 4512C, the 4512D of optic modulating device 451, even be equipped with at optic modulating device 451 under the state of heat pipe 1358, do not increase the size of optical devices main body 45A yet, make optical devices main body 45A densification, can seek the miniaturization of optical devices main body 45A.
And, outside surface at heat pipe 1358, in the position of subtend, install and extend the direction of leaving from pipe side connecting portion 13581 and have wing tabs 13585 with the length dimension of the essentially identical Y direction of length dimension of the Y direction of heat pipe 1358 in pipe side connecting portion 13581.Thus, in heat pipe 1358, can fully guarantee area of dissipation, the temperature difference between evaporation part 13582 and condensation part 13583A, 13583B can be set to such an extent that the migration amount of the inner heat of pipe is increased.
And, wing tabs 13585, integrated under the state of optical devices main body 45A, extend overlooking of cross colour splitting prism 455 rectangular-shaped to the angular direction be installed on heat pipe 1358.Thus, because under the state of optical devices main body 45A, be installed on the not interference mechanically of each wing tabs 13585 of each heat pipe 1358, so can form each wing tabs 13585 biglyyer integrated.Therefore, in heat pipe 1358, area of dissipation is further increased, can set the temperature difference between evaporation part 13582 and condensation part 13583A, 13583B biglyyer, the migration amount of the inner heat of pipe is further increased.Thereby, make optical devices main body 45A densification, and can cool off each optic modulating device 451 effectively.
The 8th embodiment
Next, based on accompanying drawing the 8th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 7th embodiment, its detailed explanation is omitted or is simplified.
Figure 21 is the structure of the heat pipe 1458 (heat conduction member) in expression the 8th embodiment, and the stereographic map of the syndeton of heat pipe 1458 and optic modulating device 451.Also have, in Figure 21, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
In the present embodiment, with respect to aforementioned the 7th embodiment, as be shown among Figure 21 ground, only the structure of heat pipe 1458 is inequality.Other formation, same with aforementioned the 7th embodiment.
Heat pipe 1458, it is the heat pipe that has with same function of the heat pipe that is illustrated with aforementioned the 7th embodiment 1358 and same section shape (section is seen toroidal), as be shown among Figure 21 ground, only the heat pipe of each in being shown in Figure 19 1358-be connected to each other between the Y direction end and to have a point of the コ of overlooking shape inequality.
This heat pipe 1458, by being implemented pressure processing, as be shown among Figure 21 ground, become have corresponding to the outer shape of optic modulating device 451 along optic modulating device 451-the base end part 1458A that extends the Y direction side end face, and being bent to form of a pair of extension 1458B, the 1458C that extend along the X-direction both sides end face of optic modulating device 451 with overlooking the コ shape.And, heat pipe 1458, as be shown among Figure 21 ground, the basic identical ground of physical dimension that leaves the X-direction in size (X-direction leave size) and the optic modulating device 451 of a pair of extension 1458B, 1458C forms, and the length dimension of the bearing of trend (Y direction) of a pair of extension 1458B, 1458C forms longways than the physical dimension of the Y direction in the optic modulating device 451.And this heat pipe 1458, as be shown among Figure 21 ground, each outside surface of the mutual subtend among a pair of extension 1458B, the 1458C can heat be connected to each optical element side connecting portion 4512C, the 4512D in the optic modulating device 451 with transmitting.That is, as be shown among Figure 21 ground, in heat pipe 1458, a part of 14581B, the 14581C of each outside surface that can heat be connected in a pair of extension 1458B, the 1458C of optical element side connecting portion 4512C, 4512D becomes and manages the side connecting portion with transmitting.
Also have, syndeton as heat pipe 1458 and optic modulating device 451, with aforementioned the 7th embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 14581B, 14581C are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
And by above formation, in the present embodiment, heat pipe 1458 in optical devices main body 45A integral body, corresponding to the quantity of optic modulating device 451, adopts 3.
And, in this heat pipe 1458,, as be shown among Figure 21 ground at the outside surface of a pair of extension 1458B, 1458C, with aforementioned the 7th embodiment similarly, wing tabs 13585 is installed respectively.Also have, each wing tabs 13585, with aforementioned the 7th embodiment similarly, to the rectangular-shaped angular direction is extended of overlooking of cross colour splitting prism 455.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 8th embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 7th embodiment, dissimilarity is as following.
In the present embodiment, because heat pipe 1458, as above-mentioned ground, have each heat pipe 1358 of being illustrated with aforementioned the 7th embodiment-the Y direction end between the interconnected コ of overlooking shape, so as be shown among Figure 21 ground, the Y direction substantial middle part of a pair of extension 1458B, 1458C works as evaporation part 14582, as Y direction both ends side and the base end part 1458A a pair of extension 1458B, the 1458C of low temperature side (side of leaving from each evaporation part 14582), as condensation part 14583A, 14583B, 14584 and work.
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R4 ground of Figure 21, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 1458, by in the heat pipe 1458 from the evaporation part 14582 to condensation part 14583A, 14583B, 14584 thermophoresis, dispel the heat in the outside by each wing tabs 13585 from condensation part 14583A, 14583B, and 14584 dispel the heat in the outside from the condensation part.And, because each wing tabs 13585, with aforementioned the 7th embodiment similarly, outside surface at heat pipe 1458, be formed at the position of subtend roughly respectively in pipe side connecting portion 14581B, 14581C, so that be transmitted to the part of the heat of pipe side connecting portion 14581B, 14581C and transmit, and dispel the heat towards condensation part 14583A, 14583B side in the outside as the arrow R4 ground that is shown in Figure 21.
In the above-described 8th embodiment, except with the same effect of aforementioned the 7th embodiment, also have following effect.
In the present embodiment because heat pipe 1458, form each heat pipe 1358 of being illustrated with aforementioned the 7th embodiment-be connected to each other between the Y direction end and have base end part 1458A and a pair of extension 1458B, a 1458C overlook the コ shape.Thus, in heat pipe 1458, except each evaporation part 14582 and each condensation part 14583A, 14583B, condensation part 14584 can also be set corresponding to each evaporation part 13582 in 2 heat pipes 1358 that are illustrated with aforementioned the 7th embodiment and each condensation part 13583A, 13583B.Promptly, in heat pipe 1458, compare with the heat pipe 1358 that is illustrated with aforementioned the 7th embodiment, increase the zone of condensation part and make area of dissipation big, can set the temperature difference between evaporation part and condensation part greatly, the migration amount of the inner heat of pipe is increased.And, compare with the formation of aforementioned the 7th embodiment, because need not 2 heat pipes, just can cool off optic modulating device 451 effectively with a heat pipe 1458, so that the designs simplification of optical devices main body 45A, and the cost that can seek optical devices main body 45A reduces, and then the cost of seeking projector 1 reduces.
The 9th embodiment
Next, based on accompanying drawing the 9th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 7th embodiment, its detailed explanation is omitted or is simplified.
Figure 22 is the structure of the heat pipe 858 (heat conduction member) in expression the 9th embodiment, and the stereographic map of the syndeton of heat pipe 858 and optic modulating device 451.Also have, in Figure 22, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
In the present embodiment, with respect to aforementioned the 7th embodiment, as be shown among Figure 22 ground, only the structure of heat pipe 858 is inequality.Other formation, same with aforementioned the 7th embodiment.
Heat pipe 858, it is the heat pipe that has with same function of the heat pipe that is illustrated with aforementioned the 7th embodiment 1358 and same section shape (section is seen toroidal), as be shown among Figure 22 ground, only exist: be shown in each heat pipe 1358 among Figure 19-the Y direction end is further crooked and carried out extending and to have a point of the コ of overlooking shape inequality.
This heat pipe 858, by being implemented pressure processing, as be shown among Figure 22 ground, become being bent to form of a pair of extension 858B, the 858C that have the base end part 858A that extends predetermined direction along the XZ plane and extend from the two end portions edge+Y direction of base end part 858A with overlooking the コ shape.And, heat pipe 858, as be shown among Figure 22 ground, the length dimension of the bearing of trend (Y direction) of a pair of extension 858B, 858C forms longways than the physical dimension of the Y direction of optic modulating device 451.And, each heat pipe 858, as being shown among Figure 22 ground, each outside surface of the コ shape Outboard Sections of a side extension 858B can heat be connected to each optical element side connecting portion 4512C, the 4512D in the optic modulating device 451 with transmitting among a pair of extension 858B, the 858C.That is, as be shown among Figure 22 ground, in heat pipe 858, the part 8581 of outside surface that can heat be connected in the extension 858B of optical element side connecting portion 4512C, 4512D becomes with transmitting manages the side connecting portion.
Also have, syndeton as heat pipe 858 and optic modulating device 451, with aforementioned the 7th embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 8581 are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
And, by above formation, in the present embodiment, heat pipe 858, in optical devices main body 45A integral body, with aforementioned the 7th embodiment similarly, adopt 6.
Figure 23 is the base end part 858A that is used for heat pipe 858, and the figure that describes of the bearing of trend of wing tabs 8585.
In this heat pipe 858, at its outside surface, as be shown among Figure 22 ground, wing tabs 8585 is installed.This wing tabs 8585 is made of the 1st wing tabs 8585A of the outside surface that is installed on the コ shape inside part in the heat pipe 858 and the 2nd wing tabs 8585B that is installed on the outside surface of the コ shape Outboard Sections in the heat pipe 858.
The 1st wing tabs 8585A, have and wing tabs 13585 identical materials that are illustrated with aforementioned the 7th embodiment, and essentially identical shape, and as be shown among Figure 11 ground, can heat be connected in roughly subtend in the heat pipe 858 in the position of managing side connecting portion 8581 along a side's of Y direction side end with transmitting.And, the 1st wing tabs 8585A, as being shown among Figure 22 ground, each side end can also heat be connected in the outside surface of the コ shape inside part of base end part 858A in the heat pipe 858 and extension 858C with transmitting, and the installation of the コ shape inside part ground of confined bed heat pipe 858.Also have,, can adopt the identical syndeton of syndeton with wing tabs 13585 that is illustrated with aforementioned the 7th embodiment and heat pipe 1358 as the syndeton of heat sink 8586 and heat pipe 858.
The 2nd wing tabs 8585B, have and the 1st above-mentioned wing tabs 8585A identical materials, and essentially identical shape, and as be shown among Figure 22 ground, extend and the same direction of the bearing of trend of the base end part 858A of heat pipe 858 ground, can heat be connected in the outside surface of the コ shape Outboard Sections among the extension 858C of heat pipe 858 along a side's of Y direction side end with transmitting.Also have,, can adopt the identical syndeton of syndeton with the 1st above-mentioned wing tabs 8585A and heat pipe 858 as the syndeton of the 2nd wing tabs 8585B and heat pipe 858.
And, the above base end part 858A of Shuo Ming heat pipe 858, each wing tabs 8585A, 8585B, as be shown among Figure 23 ground, integrated under the state of optical devices main body 45A, extend overlooking of cross colour splitting prism 455 rectangular-shaped to the angular direction be installed on optic modulating device 451.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 9th embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 7th embodiment, dissimilarity is as following.
In the present embodiment, because heat pipe 858, as above-mentioned ground, have the heat pipe 1358 that is illustrated with aforementioned the 7th embodiment-the Y direction end further crooked and carried out extending overlook the コ shape, and a pair of extension 858B, the outside surface of the コ shape Outboard Sections among the 858C among a side the extension 858B can heat be connected in optic modulating device 451 with transmitting, so as be shown among Figure 22 ground, the Y direction substantial middle part of extension 858B works as evaporation part 8582, as the Y direction both ends side the extension 858B of low temperature side (side of leaving from each evaporation part 8582), base end part 858A, and extension 858C, as condensation part 8583A, 8583B, 8584A, 8584B and working.
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R5 ground of Figure 22, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 858, by 8582 the thermophoresis in the heat pipe 858 to condensation part 8583A, 8583B, 8584A, 8584B from the evaporation part, dispel the heat in the outside by the 1st wing tabs 8585A from condensation part 8583A, 8583B, 8584A, and dispel the heat in the outside by the 2nd wing tabs 8585B from condensation part 8584B.And, because the 1st wing tabs 8585A, with aforementioned the 7th embodiment similarly, outside surface at heat pipe 858, be formed at the position of subtend roughly respectively in pipe side connecting portion 8581, so that the part of heat that is transmitted to pipe side connecting portion 8581 as being shown in the arrow R5 ground of Figure 22, transmit, and dispel the heat in the outside towards condensation part 8583A, 8583B, 8584A, 8584B side.
In the above-described 9th embodiment, except with the same effect of aforementioned the 7th embodiment, also have following effect.
In the present embodiment, because heat pipe 858, form have base end part 858A and a pair of extension 858B, a 858C overlook the コ shape, can heat be connected in optic modulating device 451 with the outside surface (pipe side connecting portion 8581) of the コ shape Outboard Sections of the extension 858B among a pair of extension 858B, the 858C with transmitting.Thus, connect heat pipe 858 by the X-direction both side ends among each side end of optic modulating device 451 along Y direction, in the projector 1 of carrying optical devices main body 45A, the length dimension of Y direction (gauge) is owing to heat pipe 858 becomes big.And, when optical devices main body 45A being equipped on projector 1 inside, can easily make heat pipe 858 be arranged in the gap of each member of projector 1 inside, can avoid the maximization of projector 1.And, because by making heat pipe 858 be above-mentioned shape such as above-mentioned the optic modulating device 451 that is connected in, can avoid the maximization of projector 1, can must be long with the length setting of heat pipe 858, so in heat pipe 858, area of dissipation is further increased, can set the temperature difference between evaporation part 8582 and condensation part 8583A, 8583B, 8584A, 8584B biglyyer, the migration amount of the heat in the pipe inside is further increased.
And, at heat pipe 858, because outside surface at コ shape inside part, and the outside surface of the Outboard Sections of the コ shape Outboard Sections of extension 858C is installed wing tabs 8585, so can be to because the size of the optical devices main body 45A that causes of wing tabs 8585 increases suppresses, and fully guarantee area of dissipation.
The 10th embodiment
Next, based on accompanying drawing the 10th embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 9th embodiment, its detailed explanation is omitted or is simplified.
Figure 24 is the structure of the heat pipe 958 (heat conduction member) in expression the 10th embodiment, and the stereographic map of the syndeton of heat pipe 958 and optic modulating device 451.Also have, in Figure 24, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
In the present embodiment, with respect to aforementioned the 9th embodiment, as be shown among Figure 24 ground, only the structure of heat pipe 958 is inequality.Other formation, same with aforementioned the 9th embodiment.
Heat pipe 958, it is the heat pipe that has with same function of the heat pipe that is illustrated with aforementioned the 9th embodiment 858 and same section shape (section is seen toroidal), as be shown among Figure 24 ground, only each the extension 858B with each heat pipe 858 that is shown among Figure 22+point that carries out interconnected shape between the Y direction end is inequality.
This heat pipe 958, by being implemented pressure processing, as be shown among Figure 24 ground, become have corresponding to the outer shape of optic modulating device 451 along optic modulating device 451+the base end part 958A that extends the Y direction side end face, and being bent to form of a pair of extension 958B, the 958C that extend along the X-direction both sides end face of optic modulating device 451 with overlooking the コ shape.And, heat pipe 958, by being implemented pressure processing, become the shape ground same with the heat pipe that is illustrated with aforementioned the 9th embodiment 858, have a pair of extension 958B, 958C-the Y direction end is by the further crooked formed 958D of portion, the 958E of being bent to form.And, heat pipe 958, as be shown among Figure 24 ground, the basic identical ground of physical dimension that leaves size (X-direction leave size) and the X-direction of optic modulating device 451 of a pair of extension 958B, 958C forms.And this heat pipe 958, as be shown among Figure 24 ground, each outside surface of the mutual subtend among a pair of extension 958B, the 958C can heat be connected to each optical element side connecting portion 4512C, the 4512D in the optic modulating device 451 with transmitting.That is, as be shown among Figure 24 ground, in heat pipe 958, a part of 9581B, the 9581C of each outside surface that can heat be connected in a pair of extension 958B, the 958C of optical element side connecting portion 4512C, 4512D becomes and manages the side connecting portion with transmitting.
Also have, syndeton as heat pipe 958 and optic modulating device 451, with aforementioned the 9th embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 9581B, 9581C are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
And by above formation, in the present embodiment, heat pipe 958 in optical devices main body 45A integral body, corresponding to the number of optic modulating device 451, adopts 3.
And, in this heat pipe 958, at extension 958B and be bent to form the 958D of portion (corresponding to the heat pipe 858 that is illustrated with aforementioned the 9th embodiment), with extension 958C and be bent to form the 958E of portion (corresponding to the heat pipe 858 that is illustrated with aforementioned the 9th embodiment), as be shown among Figure 24 ground, with aforementioned the 9th embodiment similarly, wing tabs 8585 (the 1st wing tabs 8585A, the 2nd wing tabs 8585B) are installed.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 10th embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 9th embodiment, dissimilarity is as following.
In the present embodiment, heat pipe 958, as above-mentioned ground, because have each extension 858B in each heat pipe 858 that is illustrated with aforementioned the 9th embodiment+carried out the shape that connects mutually between the Y direction end, so as be shown among Figure 24 ground, a pair of extension 958B, the Y direction substantial middle part of 958C works as evaporation part 9582, a pair of extension 958B as low temperature side (side of leaving from each evaporation part 9582), the Y direction both ends side of 958C, base end part 958A, and respectively be bent to form the 958D of portion, 958E (corresponding to base end part 858A that is illustrated with aforementioned the 9th embodiment and extension 858C) is as condensation part 9583A, 9583B, 9583C, 9584A, 9584B and working.
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R6 ground of Figure 24, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 958, by 9582 the thermophoresis in the heat pipe 958 to condensation part 9583A, 9583B, 9583C, 9584A, 9584B from the evaporation part, dispel the heat in the outside by each heat sink 8586 from condensation part 9583A, 9583B, dispel the heat in the outside from condensation part 9583C, dispel the heat in the outside by each wing tabs 8585, each heat sink 8586 from condensation part 9584A, 9584B.And, because each heat sink 8586, with aforementioned the 9th embodiment similarly, outside surface at heat pipe 958, be formed at the position of subtend roughly respectively in pipe side connecting portion 9581B, 9581C, so that a part that is transmitted to the heat of respectively managing side connecting portion 9581B, 9581C as being shown in the arrow R6 ground of Figure 24, transmit, and dispel the heat in the outside towards condensation part 9583A, 9583B, 9584A, 9584B side.
In the above-described 10th embodiment, except with the same effect of aforementioned the 9th embodiment, also have following effect.
In the present embodiment, heat pipe 958, by each the extension 858B in each heat pipe 858 that is illustrated with aforementioned the 9th embodiment+be connected to each other between the Y direction end and have a base end part 958A, a pair of extension 958B, 958C, and the shape that is bent to form the 958D of portion, 958E constitutes.Thus, in heat pipe 958, except corresponding to each evaporation part 9582 of each evaporation part 8582 in 2 heat pipes 858 that are illustrated with aforementioned the 9th embodiment and each condensation part 8583,8584 and each condensation part 9583A, 9583B, 9584A, the 9584B, condensation part 9583C can also be set.Promptly, in heat pipe 958, compare with the heat pipe 858 that is illustrated with aforementioned the 9th embodiment, increase the zone of condensation part and make area of dissipation big, can set the temperature difference between evaporation part and condensation part greatly, the migration amount of the inner heat of pipe is increased.And, compare with the formation of aforementioned the 9th embodiment,, just can cool off optic modulating device 451 effectively with a heat pipe 958 because need not 2 heat pipes, so that the designs simplification of optical devices main body 45A, and the cost that can seek optical devices main body 45A reduces.
The 11st embodiment
Next, based on accompanying drawing the 11st embodiment of the present invention is described.
In the following description, to structure and the same member additional prosign same with aforementioned the 9th embodiment, its detailed explanation is omitted or is simplified.
Figure 25 is the structure of the heat pipe 1058 (heat conduction member) in expression the 11st embodiment, and the stereographic map of the syndeton of heat pipe 1058 and optic modulating device 451.Also have, in Figure 25, for the convenience that illustrates, will be from the optical axis of the emitted light beam of optic modulating device 451 as the Z axle, and will be orthogonal to 2 of this Z axle as X-axis (transverse axis) and Y-axis (vertical axis).
In the present embodiment, with respect to aforementioned the 9th embodiment, as be shown among Figure 25 ground, only the structure of heat pipe 1058 is inequality.Other formation, same with aforementioned the 9th embodiment.
Heat pipe 1058, it is the heat pipe that has with same function of the heat pipe that is illustrated with aforementioned the 9th embodiment 858 and same section shape (section is seen toroidal), as be shown among Figure 25 ground, only a pair of extension 858B, the 858C in having the heat pipe 858 that is shown among Figure 22+the Y direction end between the point of interconnected ring-type inequality.
This heat pipe 1058 by being implemented pressure processing, as is shown among Figure 25 ground, becomes and overlooks rectangular-shaped being bent to form annularly.And, heat pipe 1058, as be shown among Figure 25 ground, the length dimension of the Y direction of ring-type inside part forms longways than the physical dimension of the Y direction in the optic modulating device 451.And, this heat pipe 1058, as being shown among Figure 25 ground, the outside surface that extends the ring-type Outboard Sections among the position 1058B (corresponding to the extension 858B that is illustrated with aforementioned the 9th embodiment) of a side among a pair of position of Y direction can heat be connected in each optical element side connecting portion 4512C, the 4512D in the optic modulating device 451 with transmitting.That is, as be shown among Figure 25 ground, in heat pipe 1058, the part 10581 of outside surface that can heat be connected in the position 1058B of optical element side connecting portion 4512C, 4512D becomes with transmitting manages the side connecting portion.
Also have, syndeton as heat pipe 1058 and optic modulating device 451, with aforementioned the 9th embodiment similarly, for example can adopt: the formation that optical element side connecting portion 4512C, 4512D and pipe side connecting portion 10581 are connected by scolding tin etc., the formation that connects by welding, perhaps formation that is adhesively fixed by bonding agent etc. with heat conductivity.
And, in this heat pipe 1058, outside surface at the ring-type inside part, and extend the outside surface of the ring-type Outboard Sections among the position 1058C (corresponding to the extension 858C that is illustrated with aforementioned the 9th embodiment) of the opposing party among a pair of position of Y direction, as be shown among Figure 25 ground, with aforementioned the 9th embodiment similarly, wing tabs 8585 (the 1st wing tabs 8585A, the 2nd wing tabs 8585B) are installed.
Also have, the 1st wing tabs 8585A, can be connected to the heat transmission each position 1058B, 1058C of extending Y direction in the heat pipe 1058, and the outside surface of the ring-type inside part of a pair of position 1058A (corresponding to the base end part 858A that is illustrated with aforementioned the 9th embodiment) that extends along the XY plane and position 1058ID.
Next, the radiator structure that the irradiation owing to light beam is resulted from the heat of liquid crystal panel 4511 describes.
Also have, the radiator structure in the 11st embodiment, basic identical with the radiator structure that is illustrated with aforementioned the 9th embodiment, dissimilarity is as following.
In the present embodiment, heat pipe 1058, as above-mentioned ground, because have a pair of extension 858B in the heat pipe 858 that is illustrated with aforementioned the 9th embodiment, 858C+carried out the ring-type that connects between the Y direction end mutually, so as be shown among Figure 25 ground, the Y direction substantial middle part of position 1058B that extends a side of Y direction works as evaporation part 10582, as the Y direction both ends side the position 1058B of low temperature side (side of leaving from evaporation part 10582), and each position 1058A, 1058C, 1058D is as condensation part 10583A, 10583B, 10584A, 10584B, 10584C and working.
And, result from the heat of liquid crystal panel 4511, as be shown in the arrow R7 ground of Figure 22, heat transfer path through liquid crystal panel 4511~maintenance frame 4512~heat pipe 1058, by 10582 the thermophoresis in the heat pipe 1058 to condensation part 10583A, 10583B, 10584A, 10584B, 10584C from the evaporation part, dispel the heat in the outside by the 1st wing tabs 8585A from condensation part 10583A, 10583B, 10584A, 10584C, and dispel the heat in the outside by the 2nd wing tabs 8585B from condensation part 10584B.And, because the 1st wing tabs 8585A, with aforementioned the 9th embodiment similarly, outside surface at heat pipe 1058, be formed at the position of subtend roughly respectively in pipe side connecting portion 10581, so that the part of heat that is transmitted to pipe side connecting portion 10581 as being shown in the arrow R7 ground of Figure 25, transmit, and dispel the heat in the outside towards condensation part 10583A, 10583B, 10584A, 10584B, 10584C side.
In the 11st above-mentioned embodiment, except with the same effect of aforementioned the 9th embodiment, also have following effect.
In the present embodiment, heat pipe 1058, have a pair of extension 858B, 858C in the heat pipe 858 that is illustrated with aforementioned the 9th embodiment+carried out the ring-type that connects mutually between the Y direction end.Thus, in heat pipe 1058, can make return flow path, between evaporation part 10582 and condensation part 10584B, become 2 paths, the migration amount of the heat in the pipe inside is further increased at the inner cooling medium of pipe.
And, at heat pipe 1058, because outside surface at the ring-type inside part, and the outside surface of the ring-type Outboard Sections of position 1058C is installed wing tabs 8585, so can be to because the size of the optical devices main body 45A that causes of wing tabs 8585 increases suppresses, and fully guarantee area of dissipation.
The variation of the 5th~the 11st embodiment
Also have, the present invention is defined in aforesaid embodiment, comprises in the present invention in the distortion of the scope that can reach purpose of the present invention, improvement etc.
In aforementioned the 5th embodiment to the 11 embodiments, the formation position of wing tabs 4585,12585,13585,8585, the outside surface of heat pipe (heat conduction member) is not limited to the formation position that is illustrated with aforementioned each embodiment, so long as can be any position.
Though in aforementioned the 5th embodiment to the 11 embodiments, to adopting heat pipe 1158,1258,1358,1458,858,958,1058, the formation that optic modulating device 451 is cooled off is illustrated, but be not limited to this, also can be to other optical element, for example polarization conversion device 423, light incident side polarization plates 452, emitting side polarization plates 454 etc. constitute with cooling off.
Though at aforementioned the 7th embodiment to aforementioned the 11st embodiment, heat pipe 1358,1458,858,958,1058, have section and see toroidal, but be not limited to this, as being illustrated ground with aforementioned the 5th embodiment and aforementioned the 6th embodiment, also can be following formation: change section shape by pressure processing, flat condition ground forms pipe side connecting portion 13581,14581B, 14581C, 8581,9581B, 9581C, 10581, and makes its face be contacted with optic modulating device 451.
Though at aforementioned the 7th embodiment to aforementioned the 11st embodiment, wing tabs 13585,8585, with set with the mode of heat pipe 1358,1458,858,958,1058 splits, but be not limited to this, with aforementioned the 5th embodiment similarly, also can form the formation of fin shape for outside surface with heat pipe.
Though at aforementioned the 5th embodiment, aforementioned the 6th embodiment, and in aforementioned the 8th embodiment, heat pipe 1158,1258,1458, have the コ of overlooking shape, but for example, also can be for being connected to each other between コ shape leading section and having and the formation of the heat pipe 1058 essentially identical ring-types that are illustrated with aforementioned the 11st embodiment.
Though in aforementioned each embodiment, heat pipe 1158,1258,1358,1458,858,958,1058, have section and see that elliptical shape or section see toroidal, but section shape is not particularly limited, also can be for having other shapes, for example section is seen rectangular shape, and section is seen triangle, and section is seen the formation of semi-circular shape.
Figure 26 and Figure 27 are the figure of the variation of aforementioned the 6th embodiment of expression.
In aforementioned the 6th embodiment, the shape of wing tabs 12585 is not limited to the shape that is illustrated with aforementioned the 6th embodiment, also can adopt other shape.
For example, also can adopt the wing tabs 12585 ' that is shown among Figure 26.More specifically, wing tabs 12585 ', as be shown among Figure 26 ground, by tabular component being carried out pressure processing (bending machining), the fin connecting portion 1258A1 of clamping heat pipe 1258,1258A2 ground have section and see roughly コ shape.And wing tabs 12585 ' can heat be connected in fin connecting portion 1258A1,1258A2 with each end face of コ shape inside part with transmitting.And, wing tabs 12585 ', as be shown among Figure 26 ground, have コ shape fore-end corresponding to optic modulating device 451-shape of Y direction end.And, wing tabs 12585 ', as be shown among Figure 26 ground, handing over crook, form the projecting strip part 12585A ' that extends along Y direction in the end face of Z-direction.
And, for example, also can adopt the wing tabs 12585 that is shown among Figure 27 ".More specifically, wing tabs 12585 "; " outside surface ground forms the curved surface shape as shown in figure 27; be made of 2 parts; by implementing sheet metal processing to the hardware of aluminium etc.; see the heat pipe 1258 of toroidal corresponding to section, and from heat pipe 1258 " side left forms respectively 2 fin 12585A respectively ".And, each wing tabs 12585 ", can heat be connected in heat pipe 1258 with curved outside surface with transmitting " outside surface, and carrying out covering heat pipe 1258 under the state that connects " outside surface.
The variation of the 1st~the 11st embodiment
Though in aforementioned each embodiment, light supply apparatus 41, light supply apparatus with the Discharge illuminating type constitutes, but be not limited to this, also can adopt laser diode, LED (Light EmittingDiode, light emitting diode), organic EL (Electro Luminescence, electroluminescence) element, various solid-state light emitting elements such as silicon light-emitting component.
And, though in aforementioned each embodiment, only adopt 1 light supply apparatus 41 and be separated into 3 kinds of coloured light, but also can omit look dissociated optical device 43, and 3 aforementioned solid-state light emitting elements that penetrate 3 kinds of coloured light are respectively constituted as light supply apparatus with look dissociated optical device 43.
Though in the respective embodiments described above, projector 1 constitutes with the projector of the three-plate type that possesses 3 liquid crystal panels 4511, is not limited to this, also can constitute with the projector of the one-board that possesses 1 liquid crystal panel.And, also can be used as the projector that possesses 2 liquid crystal panels, the projector that possesses 4 above liquid crystal panels constitutes.
Though in aforementioned each embodiment, adopted the also liquid crystal panel of transmission-type inequality of light entrance face and light emergence face, also can adopt light entrance face and light emergence face is the liquid crystal panel of same reflection-type.
Though in aforementioned each embodiment, adopted liquid crystal panel, also can adopt the optical modulation element beyond the liquid crystal of the device that utilized micro mirror etc. as optical modulation element.In this case, can omit the light incident side polarization plates 452 and the emitting side polarization plates 454 of light beam light incident side and light beam emitting side.
Though in aforementioned each embodiment, only lifted the example of projector of carrying out the front projection type of projection from the direction of watching screen, the present invention also can be applied to from carrying out the projector of back projection type of projection with the direction opposition side of watching screen.
Though be used to formation of implementing the best of the present invention etc., disclosed by above record, the present invention is defined in this.Promptly, the present invention, though relate generally to specific special diagram of embodiment institute and explanation, but in the scope that does not break away from technical thought of the present invention and purpose, embodiment for above narration, shape, material, quantity, and other detailed formation in, in addition various distortion of technician.
Thereby, because carried out the record that limits to being disclosed in above-mentioned shape, material etc., be used to make understanding of the present invention to put down in writing easily and illustratively, be not that the present invention is limited, so the record of the title of the member outside part or all of the qualification of those shapes, material etc. limits comprises in the present invention.
The present invention because can cool off optical element effectively, so can as be used to show, the projector of home theater utilizes.

Claims (21)

1. optical devices is characterized in that possessing:
Optical element, it carries out optical conversion to incident beam and penetrates; With
Heat conduction member, it comprises heat pipe, and energy heat be connected in aforementioned optical element with transmitting and aforementioned optical element is cooled off, and this heat pipe forms the tubulose that has capillary pipe structure in inside, and the pipe inside place cooling medium, by aforementioned cooling medium the pipe internal reflux carry out thermophoresis;
The optical element side connecting portion that is connected in aforementioned heat conduction member of aforementioned optical element, and the heat conduction member side connecting portion that is connected in aforementioned optics component side connecting portion of aforementioned heat conduction member have the shape that contacts below the state that has been connected to each other.
2. according to the described optical devices of claim 1, it is characterized in that:
Aforementioned optics component side connecting portion is the outside surface of aforementioned optical element;
Aforementioned heat conduction member is formed with aforementioned heat conduction member side connecting portion at the outside surface of aforementioned heat pipe;
The aforementioned heat conduction member side connecting portion of aforementioned heat pipe, unanimity forms by pressure processing in the shape ground of the outside surface of aforementioned optical element.
3. according to the described optical devices of claim 2, it is characterized in that:
Aforementioned heat pipe forms along at least a portion of the periphery ora terminalis of aforementioned optical element, constitutes, and with aforementioned heat conduction member side connecting portion aforementioned optical element is maintained fixed, and aforementioned optical element can be equipped on the precalculated position.
4. according to the described optical devices of claim 1, it is characterized in that:
Aforementioned heat conduction member possesses that face is contacted with the outside surface of aforementioned heat pipe and the outer framework that can heat connect with transmitting, and the outside surface of framework is formed with aforementioned heat conduction member side connecting portion outside aforementioned.
5. according to any one the described optical devices in the claim 1~4, it is characterized in that:
Aforementioned optics component side connecting portion is formed at each side end of the mutual subtend of aforementioned optical element respectively;
Aforementioned heat conduction member, form have the base end part that extends predetermined direction and roughly be orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part from the two end portions of aforementioned base end part overlook the コ shape, be formed with aforementioned heat conduction member side connecting portion at aforementioned a pair of extension respectively corresponding to each aforementioned optics component side connecting portion.
6. according to any one the described optical devices in the claim 1~4, it is characterized in that:
Aforementioned optics component side connecting portion is formed at each side end of the mutual subtend of aforementioned optical element respectively;
Aforementioned heat conduction member has the ring-type of the peripheral end that surrounds aforementioned optical element, and subtend is formed with aforementioned heat conduction member side connecting portion in the inside part ground of ring-type respectively corresponding to each aforementioned optics component side connecting portion mutually.
7. optical devices is characterized in that possessing:
Optical element, it carries out optical conversion to incident beam and penetrates; With
Heat pipe, it forms the tubulose that has capillary pipe structure in inside, and place cooling medium in pipe inside, and carry out thermophoresis by aforementioned cooling medium in the pipe internal reflux, surface energy heat is connected in aforementioned optical element with transmitting and aforementioned optical element is cooled off in addition;
At the outside surface of aforementioned heat pipe, be provided with the wing tabs of heat transmission.
8. according to the described optical devices of claim 7, it is characterized in that:
Aforementioned wing tabs forms the formation of fin shape for the outside surface with aforementioned heat pipe.
9. according to the described optical devices of claim 7, it is characterized in that:
Aforementioned wing tabs constitutes with aforementioned heat pipe split, can be connected in to the heat transmission outside surface of aforementioned heat pipe.
10. according to any one the described optical devices in the claim 7~9, it is characterized in that:
Aforementioned heat pipe has the I of overlooking shape.
11. any one the described optical devices according in the claim 7~9 is characterized in that:
Aforementioned heat pipe, form and have the base end part that extends predetermined direction, overlook the コ shape with two end portions from aforementioned base end part roughly is orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part, can heat be connected in aforementioned optical element with transmitting with either party outside surface of コ shape Outboard Sections of extension among the aforementioned a pair of extension.
12., it is characterized in that according to the described optical devices of claim 11:
Aforementioned wing tabs, possess the コ shape inside part that is arranged at aforementioned heat pipe outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of outside surface of the コ shape Outboard Sections of aforementioned heat pipe.
13. any one the described optical devices according in the claim 7~9 is characterized in that:
Aforementioned heat pipe has ring-type, can heat be connected in aforementioned optical element with the outside surface of the Outboard Sections of ring-type with transmitting.
14., it is characterized in that according to the described optical devices of claim 13:
Aforementioned wing tabs, possess the ring-type that is arranged at aforementioned heat pipe inside part outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of outside surface of the Outboard Sections of aforementioned ring-type.
15. any one the described optical devices according in the claim 7~9 is characterized in that:
Aforementioned heat pipe, form and have the base end part that extends predetermined direction, overlook the コ shape with two end portions from aforementioned base end part roughly is orthogonal to a pair of extension that extends on the bearing of trend ground of aforementioned base end part, can heat be connected to each side end of the mutual subtend of aforementioned optical element with aforementioned a pair of extension with transmitting.
16., it is characterized in that according to the described optical devices of claim 15:
Aforementioned wing tabs is arranged at the outside surface of aforementioned a pair of extension respectively.
17., it is characterized in that according to the described optical devices of claim 15:
Aforementioned heat pipe has the portion of being bent to form, and this is bent to form portion and extends by the direction of leaving mutually is crooked from each fore-end of aforementioned a pair of extension, and bearing of trend fore-end subtend is carried out the bending extension in aforementioned a pair of extension ground.
18., it is characterized in that according to the described optical devices of claim 17:
Aforementioned wing tabs, possess: be arranged at respectively each the コ shape inside part that surrounds by aforementioned a pair of extension and the aforementioned portion that is bent to form outside surface the 1st wing tabs and be arranged at the 2nd wing tabs of the outside surface of each the コ shape Outboard Sections that surrounds by aforementioned a pair of extension and the aforementioned portion that is bent to form respectively.
19., it is characterized in that according to the described optical devices of claim 7:
Possess look synthesizing optical device, this look synthesizing optical device has 3 the light beam light incident side end faces of incident beam and the light beam emitting side end face of outgoing beam, forms to overlook rectangular-shapedly, and each light beam of going into to shine is synthesized and penetrates;
Aforementioned optical element is provided with 3, surrounds aforementioned look synthesizing optical device ground and is installed on aforementioned 3 light beam light incident side end faces respectively;
Aforementioned heat pipe, be provided with a plurality of, can heat be connected to with transmitting 3 aforementioned optical elements, corresponding to each side ends of four rectangular-shaped angle parts of overlooking of aforementioned look synthesizing optical device;
Be arranged at each aforementioned wing tabs of a plurality of aforementioned heat pipes, extend rectangular-shaped ground, angular direction is formed of overlooking of aforementioned look synthesizing optical device.
20., it is characterized in that according to claim 1 or 7 described optical devices:
The capillary pipe structure of aforementioned heat pipe is made of the slug type capillary wick.
21. a projector, it possesses light supply apparatus, corresponding to image information to optic modulating device of modulating from the emitted light beam of aforementioned light supply apparatus and the projecting optical device that the light beam of being modulated by the aforementioned lights modulating device is carried out enlarging projection; It is characterized in that possessing:
The described optical devices of in the claim 1~20 any one.
CN2007101616824A 2006-09-29 2007-09-28 Optical device and projection machine Active CN101154027B (en)

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JP267944/2006 2006-09-29
JP2006267943A JP4301276B2 (en) 2006-09-29 2006-09-29 Optical device and projector
JP2006267944A JP4301277B2 (en) 2006-09-29 2006-09-29 Optical device and projector
JP267943/2006 2006-09-29

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US20110007281A1 (en) * 2008-03-26 2011-01-13 Minoru Yoshikawa Projector
JP4816799B2 (en) * 2009-04-03 2011-11-16 セイコーエプソン株式会社 projector
JP2018128490A (en) * 2017-02-06 2018-08-16 セイコーエプソン株式会社 Electrooptical device and electronic apparatus
CN110780517A (en) * 2019-10-31 2020-02-11 青岛海信激光显示股份有限公司 Laser projection device
KR102328975B1 (en) * 2019-12-20 2021-11-19 고려대학교 산학협력단 Battery module
CN113721411B (en) * 2020-05-26 2023-08-18 苏州佳世达光电有限公司 Liquid crystal projector
CN113727082B (en) * 2021-08-20 2023-12-01 深圳亮仔光电科技有限公司 Initiative intelligent heat abstractor and projector sealing ray apparatus

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