CN101149656A - Infra red touch screen and multiple point touching positioning method - Google Patents
Infra red touch screen and multiple point touching positioning method Download PDFInfo
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- CN101149656A CN101149656A CNA2007100310826A CN200710031082A CN101149656A CN 101149656 A CN101149656 A CN 101149656A CN A2007100310826 A CNA2007100310826 A CN A2007100310826A CN 200710031082 A CN200710031082 A CN 200710031082A CN 101149656 A CN101149656 A CN 101149656A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
- G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/048—Indexing scheme relating to G06F3/048
- G06F2203/04808—Several contacts: gestures triggering a specific function, e.g. scrolling, zooming, right-click, when the user establishes several contacts with the surface simultaneously; e.g. using several fingers or a combination of fingers and pen
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Abstract
This invention discloses an infrared touching screen and the multi-spot touching localization method, in an examination direction, the ray of light send out by the infrared emission part on the infrared emission sweep circuit not only can be received at least by one infrared sweep circuit's infrared receive part which is vertical to the part's position, but may also be received by another inclined relative infrared receive sweep circuit's infrared receive part at least which is deviated vertical to the part's position. Thus, in a scanning period, the ray of light send out by an infrared emission part may be received by two different position infrared receive parts in the different time, through a checking calculation between touching possible coordinate figure and location parameter, then may determine each touching position data, this invention realizes the multi-spot localization scanning examination method to be simple, the touching position data computation convenient, accurate, reliable, the circuit wafer type is few, the shape is rule, easy to realize the large scale production, does not have the complex succession corresponding relationships, easy to realize.
Description
Technical field
The present invention relates to a kind of infrared touch panel, particularly a kind ofly can distinguish infrared touch panel and the multi-point touch locating method of operating simultaneously a plurality of touch points.
Background technology
Infrared touch panel basic structure in the market is to install some to infrared emission and infrared receiver component in a certain order a display surface edge that is fit to install.It is right that these emissions and infrared receiver component are formed the emission reception according to mode one to one, edge along display surface constitutes a mutually perpendicular emission receiving array, under the control of microcomputer system, connect each in a certain order respectively to emission and infrared receiver component, detect each whether the Infrared between infrared emission and the infrared receiver component is blocked, judge whether have touch event to take place with this.This lattice structure detection mode makes existing infrared touch panel in the given period, detection system receives only unique one group of position coordinate data, therefore when having only a touch point, touch-screen can operate as normal, when operating simultaneously for two or more touch points, system is with the position coordinates of miscount, and the touch place that causes reporting is not the place of actual touch.
For above-mentioned reasons, existing infrared touch panel technology need use the occasion of multiple point touching to lose efficacy at some, and for example many people play simultaneously, many people's while Writing-paintings etc., great like this use field of having limited infrared touch panel.
Along with development of science and technology, innovation about the infrared touch panel technology is also constantly being carried out with development, for solving the problem that multiple point touching can't be discerned, industry has been made many good tries, as strengthening the judgement of infrared touch panel to a plurality of touch points by designing complicated auxiliary judgment circuit, distinguish a plurality of touch points or the like at additionally additional one or two camera of the outward flange of infrared touch panel, so all, all need to change the structure of existing infrared touch panel and the composition of system, on the basis of existing infrared touch panel, increase more cost.Also have at present not change the sequencing that hardware takes place by the senses touch incident and discern the method for a plurality of touch points, but do not relatively move for having between a plurality of touch points, do not have yet the shape sizes values of touch point can the situation of reference under, judge by accident easily.
In view of present Infrared touch screen systems above shortcomings, provide a kind of and can realize that multiple point touching is located and the minimizing erroneous judgement, the while need not increase extra cost, and the touch screen structure and the method that do not change existing infrared touch panel composition structure are necessity in fact.
Summary of the invention
The object of the present invention is to provide a kind of Infrared touch screen systems, do not need to design complicated circuit structure and also do not need to be strict with the optical axis of infrared components over against just discerning two or more touch operation.
Another object of the present invention provides a kind of multiple spot of can realizing and touches the multi-point touch locating method that also can report effective touch location simultaneously.
For achieving the above object, the present invention by the following technical solutions:
A kind of infrared touch panel, comprise infrared emission component that is arranged on the infrared emission sweep circuit plate and the infrared receiver component that is arranged on the infrared ray reception sweep circuit plate, at least one detection side upwards, the light that infrared emission component on the described infrared emission sweep circuit sends except can by one with its vertical infrared receiver component that receives over against locational infrared ray on the sweep circuit receives, can also be departed from the infrared receiver component that vertically promptly tilts infrared ray relative and receive on the sweep circuit by at least one and receive constantly in difference over against the position.
Infrared components recited above vertically opposite with tilt relatively, just represent infrared components at the locational corresponding relation of actual installation, be not that the position that infrared components is accurately adjusted in requirement makes their optical axis keep above-mentioned corresponding relation.Because the installation site, in the corner of emission scan circuit, it is relative that a part of infrared emission component does not have infrared receiver component and them to tilt, and the light that this part infrared emission component sends can only be received by a vertically opposite receiving element; Equally, in the corner that receives sweep circuit, some infrared receiver component does not have infrared emission component relative with their inclinations yet, and this part infrared receiver component receives only the light that a vertically opposite radiated element sends.
The installation corresponding relation of infrared emission component and infrared receiver component has dual mode, a kind of be the part infrared emission component vertically over against infrared receiver component with tilt relative infrared receiver component on same block of infrared reception sweep circuit plate, remaining infrared emission component vertically over against the infrared receiver component infrared receiver component relative with inclination on different infrared reception sweep circuit plates; Another mode be with same infrared emission component vertical over against the infrared receiver component and the relative infrared receiver component that tilts lay respectively at different infrared rays and receive on the sweep circuit plate.
When the part infrared emission component vertically over against infrared receiver component with tilt relative infrared receiver component on same block of infrared reception sweep circuit plate the time, infrared emission sweep circuit plate adopts identical sequential working, and a detection scan period is divided into two stages at least.The light that infrared emission component sends in preceding half or back half scan period by with it vertically over against an infrared receiver component receive and detect, infrared emission component is connected one by one and is lighted, vertical with them over against infrared receiver component receive detection one by one.This process and common infrared touch panel detection method are similar, are called vertical scanning here and detect; Continue to be scanned up to other half period, when this infrared emission component is lighted once more, its light that sends is received by another infrared receiver component that tilts relative with it and detects, and infrared emission component is connected one by one and lighted, and the infrared receiver component relative with their inclinations receives detection one by one.Detect for being different from vertical scanning, this process is called dip sweeping here and detects.Like this, in a scan period, the light that infrared emission component sends can be received in the different moment by the infrared receiver component of two diverse locations.
Process for better explanation infrared emission sweep circuit plate and the work of infrared reception sweep circuit plate, supposing has N infrared emission component or infrared receiver component on the every circuit board, suppose that with the 1st radiated element relative receiving element that tilts be M receiving element, with the 2nd radiated element relative receiving element that tilts is M+1 receiving element, arrange according to this, the receiving element relative with N-M+1 radiated element inclination is N receiving element.When carrying out vertical scanning, radiated element and receiving element are all connected one by one since the 1st, up to N; When carrying out dip sweeping, radiated element is still since the 1st, radiated element is connected one by one from the 1st to N-M+1 and is lighted, the receiving element relative with their inclinations also connected one by one from M to N and detected, continue scanning, N-m+2 connects when lighting one by one to N radiated element, the connection of receiving element turns back to the front in proper order, connect detection one by one from the 1st to M-1, at this moment, the 1st to M-1 receiving element received be from the other radiating circuit plate with they the relative light that infrared emission component sent that tilts.Equally, N-M+2 light that sends to N infrared emission component is received by the infrared receiver component relative with their inclinations on the other circuit board for receiving.
Realize such scheme, also can adopt infrared reception sweep circuit plate to adopt identical sequential working, a detection scan period is divided into two stages equally at least.In preceding half or back half scan period infrared receiver component receive detect from it vertically over against the light that infrared emission component sends, infrared receiver component is connected detection one by one, vertical with them over against infrared emission component light one by one.Here being called vertical scanning detects; Continue to be scanned up to other half period, when this infrared receiver component is connected once more, the light of its detection that receives is from another relative infrared emission component that tilts with it, and infrared receiver component is connected detection one by one, and the infrared emission component relative with their inclinations lighted one by one.This process is called dip sweeping and detects.Like this, in a scan period, infrared receiver component can receive the light that the infrared emission component from two diverse locations sends in the different moment.
Infrared emission circuit board and infrared receiving circuit plate adopt the course of work of this scanning sequence and preamble described similar, supposing has N infrared emission component or infrared receiver component on the every circuit board, with mentioned above identical, suppose with M receiving element tilt relative radiated element be vertical on the radiating circuit plate of radiated element place the 1st radiated element, with M+1 receiving element tilt relative radiated element be vertical on the radiating circuit plate of radiated element place the 2nd radiated element, be arranged in order, with N receiving element relative radiated element that tilts is N-M+1 radiated element, equally, with the 1st receiving element relative radiated element that tilts is N-M+2 radiated element on another piece radiating circuit plate, with M-1 receiving element relative radiated element that tilts is N radiated element on another piece radiating circuit plate, when carrying out the vertical scanning detection, radiated element and receiving element are all connected one by one since the 1st, up to N; When carrying out the dip sweeping detection, receiving element is still since the 1st, receiving element is connected one by one from the 1st to M-1 and is detected, the individual connection one by one to N infrared emission component of N-M+2 lighted, at this moment, reception is individual to N the light that infrared emission component sent from the N-M+2 relative with their inclinations on the other radiating circuit plate.Continue scanning, connect one by one when detecting to N receiving element for M, the connection of radiated element turns back to the front in proper order, and connection is lighted one by one from the 1st to N-M+1.
In the above-described method, the part infrared emission component vertically over against infrared receiver component with tilt relative infrared receiver component on same block of infrared reception sweep circuit plate, remaining infrared emission component vertically over against infrared receiver component with tilt relative infrared receiver component on different infrared reception sweep circuit plates, infrared emission circuit board or infrared receiving circuit plate can adopt identical sequential working.In fact, same infrared emission component vertically over against infrared receiver component can lay respectively at different infrared rays with the relative infrared receiver component that tilts and receive on the sweep circuit plate, this moment, each infrared emission circuit board or circuit board for receiving may adopt different sequential in order to reduce the phase mutual interference between the circuit board.All adopting identical sequential with infrared emission sweep circuit plate in vertical scanning and dip sweeping is example, a detection scan period is divided into two stages at least, disturb for reducing, the infrared emission sweep circuit plate that each infrared emission sweep circuit plate is especially adjacent adopts different sequential, in the vertical scanning stage, each infrared reception sweep circuit plate employing over against the identical sequential working of infrared emission sweep circuit plate, realizes that vertical scanning detects with vertical; In the dip sweeping stage, each infrared emission circuit board adopts the sequential working identical with the vertical scanning stage, and the sequential of each circuit board for receiving will change, and becomes the sequential of the relative infrared emission circuit board of the inclination adjacent with it, thereby realizes that dip sweeping detects.This sequence change is easier to just can realize under the CPU of touch system control.Do not tilt opposed circuit boards or infrared components be installed in the circuit board or the infrared components of corner for part, owing to can not process by scanning sequence is pre-defined when dip sweeping detects.
Equally, adopt identical sequential in vertical scanning and dip sweeping, and the sequential of infrared emission circuit board changes in the different scanning stage and also can realize touch-screen of the present invention for the infrared receiving circuit plate.Similar with preamble, a detection scan period is divided into two stages at least, infrared reception sweep circuit plate all adopts identical sequential at vertical scanning with dip sweeping, the infrared reception sweep circuit plate that each infrared reception sweep circuit plate is especially adjacent adopts different sequential, in the vertical scanning stage, each infrared emission sweep circuit plate employing over against the identical sequential working of infrared reception sweep circuit plate, realizes that vertical scanning detects with vertical; In the dip sweeping stage, each infrared receiving circuit plate adopts the sequential working identical with the vertical scanning stage, and the sequential of each radiating circuit plate will change, and becomes the sequential of the relative infrared receiving circuit plate of the inclination adjacent with it, thereby realizes that dip sweeping detects.This sequence change is easier to just can realize under the CPU of touch system control.Do not tilt opposed circuit boards or infrared components be installed in the circuit board or the infrared components of corner for part, owing to can not process by scanning sequence is pre-defined when dip sweeping detects.
Adopt same infrared emission component to distinguish the method for corresponding different infrared receiver components constantly, under the situation that need not increase circuit cost, just can realize the multipoint positioning method of back in difference.If adopt a plurality of receiving elements to receive this mode of light that same radiated element sends simultaneously, also can realize the multipoint positioning of back, but need to increase more analog to digital conversion circuit, require single-chip microcomputer to gather a plurality of simulating signals simultaneously simultaneously, make the touch screen circuitry complex system like this, increased the difficulty that circuit is realized, be unfavorable for that touch-screen develops to the direction of miniaturization, lighting.
Receive infrared receiver component on the sweep circuit all to the identical angle of same direction deflection at the infrared emission component on the described infrared emission sweep circuit that same detection side makes progress and infrared ray, make infrared emission component and infrared receiver component towards relative.Because the installation site, in the corner of emission scan circuit, a part of infrared emission component does not have infrared receiver component to tilt relative with them; Equally, in the corner that receives sweep circuit, some infrared receiver component does not have infrared emission component relative with their inclinations yet, and these infrared emission component/receiving elements are deflection angle not.This deflection angle size can be calculated definite in conjunction with the size that touches surveyed area according to the parameter of selected infrared emission component and infrared receiver component; Also can test by experiment, determine according to actual effect.Under the prerequisite that satisfies the infrared receiver component received energy, the deflection angle of infrared components should be big as far as possible, like this, can distinguish each touch point position better, improves a plurality of touch points Coordinate Calculation precision.Reach effect of the present invention and also can realize, select this element for use by selecting the emission angle element bigger for use than common infrared components, can be infrared emission component and the certain angle of infrared receiver component deflection.
With same described infrared emission component vertical over against the described infrared receiver component and the relative described infrared receiver component that tilts lay respectively at different infrared rays and receive on the sweep circuit plate, also can receive on the sweep circuit plate at same block of infrared ray, this depends on the deflection angle size of infrared emission component and infrared receiver component.
In the infrared receiving array of this infrared touch panel, infrared emission component in infrared emission component in the horizontal array, infrared receiver component and the vertical array, the frequency of infrared receiver component are different, to avoid the interference between the infrared emission infrared receiver component.For example in horizontal array, use the infrared emission receiving element of 940nm, in vertical array, then use the infrared emission receiving element of 850nm, like this, surveyed area in the corner, the situation that adjacent infrared emission receiving element phase mutual interference can not occur, concrete method can be the infrared touching device of the adjacent infrared scan of 200610037391.X unit varied-frequency infrared tube referring to application number.
Corresponding foregoing circuit structural change, the present invention realizes that the localization method of multiple point touching mainly may further comprise the steps:
A), start scanning generator, elder generation's normalization and/or initialization vertical with infrared emission component over against infrared receiver component, renormalization and/or the initialization relative infrared receiver component that tilts is noted the inclination normalized value and/or the inclination initialization value of each infrared receiver component respectively; Perhaps first normalization and/or initialization tilt relative infrared receiver component renormalization and/or initialization vertically over against element, write down inclination normalized value and/or initialization value and vertical normalized value and/or initialization value respectively;
B), successively connect and light each infrared emission component, connection simultaneously is vertical with infrared emission component over against locational infrared receiver component, reads output valve and the perpendicular normalized value and/or the initialization value comparison of infrared emission component;
C), according to each infrared receiver component output valve and normalized value and/or the initialization value situation of change of back gained relatively, calculate the possible position coordinates in each touch point;
D), continue scanning, connect successively and light each infrared emission component, connect simultaneously with infrared emission component inclination relative position on infrared receiver component, read with infrared emission component tilt relative receiving element output valve and with inclination normalized value and/or initialization value relatively;
E), according to each infrared receiver component output valve and inclination normalized value and/or the initialization value situation of change of back gained relatively, obtain each location parameter, determine the relation between touch point actual coordinate X and the Y, check in the formula that the touch point that calculates among the step c may the coordinate figure substitution be determined by each location parameter, determine each touch point position coordinates, and coordinate data is delivered to Computer Processing;
F), according to the method for step b to step e, begin new circulation.
The another kind of localization method of multiple point touching of realizing of the present invention mainly may further comprise the steps:
A), start scanning generator, elder generation's normalization and/or initialization vertical with infrared emission component over against infrared receiver component, renormalization and/or the initialization relative infrared receiver component that tilts is noted the inclination normalized value and/or the inclination initialization value of each infrared receiver component respectively; Perhaps first normalization and/or initialization tilt relative infrared receiver component renormalization and/or initialization vertically over against element, write down inclination normalized value and/or initialization value and vertical normalized value and/or initialization value respectively;
B), each infrared emission component is lighted in connection successively, connect simultaneously with infrared emission component inclination relative position on infrared receiver component, read with infrared emission component tilt relative infrared receiver component output valve and with inclination normalized value and/or initialization value relatively, situation of change according to each infrared receiver component output valve and inclination normalized value and/or the relatively back gained of initialization value obtains each location parameter;
C), successively connect and light each infrared emission component, connection simultaneously is vertical with infrared emission component over against locational infrared receiver component, reads output valve and the perpendicular normalized value and/or the initialization value comparison of infrared emission component;
D), according to each infrared receiver component output valve and normalized value and/or the initialization value situation of change of back gained relatively, calculate the possible position coordinates in each touch point;
E), determine the relation between touch point actual coordinate X and the Y, check in the formula that the touch point that calculates in the steps d may the coordinate figure substitution be determined by the location parameter of step b, determine each touch point position coordinates, and coordinate data delivered to Computer Processing;
F), begin new circulation according to the method for step b to step e.
Among the step e, be used for determining that the concrete form of the check formula of touch event generation physical location has various form, wherein a kind of can be following form:
Y＝(X-l)ctgθ，
Y=(L-X) tg α+h, what equation was set up is the actual coordinate value;
Wherein the coordinate axis initial point is in the upper right side, X-direction scanning from right to left, Y direction scanning from the top down, X, Y represents touch point coordinate figure to be determined, L represents the total length of touch area in X-direction, l be the infrared receiver component output valve of directions X when changing with this receiving element distance of relative infrared emission component that tilt to initial point, it is the location parameter on the X-direction, h be the infrared receiver component output valve of Y direction when changing with this receiving element distance of relative infrared emission component that tilt to initial point, it is the location parameter of Y direction, the infrared receiver component line that θ represents the infrared emission component on the X-direction and tilts relative and infrared emission component and vertical angle between the infrared receiver component line, α are represented infrared emission component on the Y direction and the infrared receiver component line and infrared emission component and vertical angle between the infrared receiver component line that tilt relative.When position that true origin is chosen not simultaneously, the expression-form of check formula can change to some extent, but no matter how the form of formula changes, the implication of formulate still is the relation between the horizontal ordinate value in touch point.
Mentioned above those are installed in the radiated element or the receiving element of corner, because there do not have infrared components and them to tilt to be relative, these infrared emission components or infrared receiver component can not process by scanning sequence is pre-defined when carrying out the dip sweeping detection.
Use structure of the present invention and method,, only need the detection judgement of a direction just can realize the multiple point touching location in some occasion.Be difficult to calculate the touch point position coordinate time when using a direction to touch and detecting, can use both direction to detect aggregation of data and judge.For example, when the touch point near corner areas or when a plurality of touch points are close when overlapping phenomenon a zonule, comprehensively judge it is necessary in conjunction with the detection data of both direction.
Multi-point touch locating method of the present invention, to scan to detect and be divided into vertical scanning detection and two processes of dip sweeping detection, in fact, dip sweeping needn't be carried out always, when each touch point position coordinate is determined, and when keeping stablizing, can only carry out vertical scanning detects, just a plurality of touch points can be discerned by the movement tendency of judging each touch point like this, the Chinese patent of a CN 200710028038.X multi-point touch locating method can be application reference number be about the method for discerning a plurality of touch points by the detected touch point movement tendency.At this moment, the step of dip sweeping can be omitted, and can make the refresh rate that touches detection remain on a higher level by such method.
Technical scheme of the present invention, in the division of the stage of scan period, two stages have only been divided, in fact, need and a scan period can be divided into the three or more stages if having, carry out scanning several times detection, so more, radiated element can corresponding three or more receiving elements, correspondingly, detection system just can obtain more location parameter, uses more check formula to determine the actual position coordinate of a plurality of touch points.
The circuit structure change that process is above-mentioned also uses corresponding multipoint positioning algorithm, Infrared touch screen systems just can distinguish a plurality of touch points that touch simultaneously, multiple point touching is positioned on the infrared touch panel is achieved.On this basis, further, can determine the mobile trend of each touch point can define different touch operation functions in view of the above according to the situation of change of position coordinates, amplify or reduction operation such as two touch point direction of motion phase antirepresentations; A touch point is motionless, and movement in a curve is done in the another one touch point, and expression is rotated operation or the like, finish the single-point touches system the function that can't finish, all these functions can define flexibly by corresponding application software.
Compare with existing infrared touch technology, the present invention has following beneficial effect:
One, do not need to increase hardware cost, can realize the multiple point touching location.
Two, scanning detection method is simple, does not have complicated sequential corresponding relation between radiating circuit and the receiving circuit, realizes easily on the software.
Three, the algorithm of realization multipoint positioning is simpler, touch point position coordinates convenience of calculation, accurate, reliable.
Four, the circuit board kind is few, and regular shape is easy to realize large-scale production.
Description of drawings
Accompanying drawing 2 is embodiment of the invention circuit scanning work synoptic diagram;
Accompanying drawing 3 is that two points of the embodiment of the invention touch the location synoptic diagram;
Accompanying drawing 4 is embodiment of the invention multi-point touch locating method schematic flow sheets.
Embodiment
Embodiment:
Fig. 1 is the electrical block diagram of a specific embodiment of the present invention.Among the figure, 121,122,123,124th, the radiating circuit plate of infrared emission component is installed, 101,102,103,104,105,106,107 are mounted in the infrared emission component on the foregoing circuit plate.108,109,110,111,112,113,114 are mounted in circuit board for receiving 125,126, the infrared receiver component on 127,128.As can be seen from the figure, the corresponding relation of infrared emission component and infrared receiver component and common infrared touch panel are different, infrared emission component 101 except with it vertical over against infrared receiver component 108 correspondences, also corresponding infrared receiver component 109, because 109 position deviation 108 has certain distance, be to simplify to describe, to call inclination relative with 109 corresponding relation 101 here, same 102 except vertical with 109 over against, also relative with 110 inclinations; 103 vertical with 110 over against, with 111 tilt relative, 104 vertical with 111 over against, relative with 112 inclinations, 105 vertical with 112 over against, with 113 tilt relative, 106 vertical with 113 over against, relative with 114 inclinations, owing to reason in the corner, 107 and the infrared emission component of back, only vertical with receiving element over against, do not have receiving element relative with their inclinations.Equally, the part infrared receiver component before 109 comprises 108, does not also have infrared emission component to tilt relative with them.The emission of another direction is identical with the corresponding relation of infrared receiver component, herein not at repeated description.
This corresponding relation can be taked in the process of installing the method for the certain angle of element deflection to be realized, for the infrared components that is installed in the corner as 107 and the infrared emission component of back and 109 before the part infrared receiver component owing to there is not infrared components relative with their inclinations, deflection angle not.The size of infrared components deflection angle can be calculated definite in conjunction with the size that touches surveyed area according to the parameter of selected infrared emission component and infrared receiver component; Also can test by experiment, determine according to actual effect.For example, the emission angle nominal value of certain infrared emission component is 35 degree, in fact its emitted energy concentrates in the scope of 0-18 degree, if be used in 100 " touch-screen on; because the operating distance of radiated element and receiving element is far away, in order to guarantee effect preferably, about radiated element and receiving element deflection angle can select 8 to spend; certain, also the actual effect that can test is by experiment selected suitable deflection angle.Except the angle that radiated element and receiving element deflection is certain realizes the top corresponding relation, deflection angle not, realize by selecting the emission angle element bigger for use than common infrared components, usually has less emission angle owing to be used in the infrared components of infrared touch panel, make infrared energy concentrate on preferably on the relative receiving element like this, and to realize above-mentioned corresponding relation, then need adopt the bigger infrared components of emission angle, concrete grammar can be consulted the Chinese patent that application number is 200710028616.X.
For ease of describing the scanning detection method of the embodiment of the invention, here the scanning detection method of common infrared screen being called vertical scanning detects, different with common infrared touch panel scanning testing process is, adopt above-mentioned circuit structure, in each scanning sense cycle, the scanning testing process is divided into two stages.With Fig. 1 is example, and in preceding half scan period, expelling plate is lighted since 101, and connect 108 this moment, output numerical value is then lighted the infrared components after 101, connect simultaneously with it over against receiving element ... light each infrared emission component 102,103,104 successively, 105,106,107 etc., connect successively simultaneously with they separately over against receiving element 109,110,111,112,113,114 output numerical value.This moment, half period was carried out in scanning, finished vertical scanning and detected.In ensuing half period, infrared emission component is lighted according to the mode identical with preceding half period, and the order that receiving element is connected is then according to different order, 101 when lighting, 109 connect, and output numerical value is when the infrared components after 101 is lighted, infrared receiver component after 109 is connected, output numerical value ..., 102 light, 110 connect, output numerical value, 103 light, and 111 connect output numerical value, 104 light, 112 connect output numerical value, and 105 light, and 113 connect output numerical value, 106 light, 114 connect the output numerical value, light each radiated element successively and connect simultaneously and their the relative receiving element that tilts separately, and this process is different from vertical scanning and detects, here it is called dip sweeping and detect, just finish a complete scan period this moment.As for 107 and the infrared emission component of back, and the part infrared receiver component before 109, owing to the reason that is installed in the corner does not have infrared components relative with their inclinations, this part infrared components can not process by scanning sequence is pre-defined when dip sweeping detects.
The process of Fig. 2 indication circuit scanning work.As shown in Figure 2, scanning detects and is divided into two stages, vertical scanning stage and dip sweeping stage, supposing has n infrared emission component or infrared receiver component on the every circuit board, suppose that with the 1st radiated element relative receiving element that tilts be m receiving element, the receiving element relative with the 2nd radiated element inclination is m+1 receiving element ... arrange according to this, the receiving element relative with n-m+1 radiated element inclination is n receiving element.When carrying out vertical scanning, radiated element and receiving element are all connected one by one since the 1st, up to n; When carrying out dip sweeping, radiated element is still since the 1st, radiated element is connected one by one from the 1st to n-m+1 and is lighted, the receiving element relative with their inclinations also connected one by one from m to n and detected, continue scanning, n-m+2 connects when lighting one by one to n radiated element, the connection of receiving element turns back to the front in proper order, connect detection one by one from the 1st to m-1, at this moment, the 1st to m-1 receiving element received be from the other radiating circuit plate with they the relative light that infrared emission component sent that tilts.Equally, n-m+2 light that sends to n infrared emission component is received by the infrared receiver component relative with their inclinations on the other circuit board for receiving.
In scan method shown in Figure 2, infrared emission circuit board or infrared receiving circuit plate adopt identical sequential working, and in fact, in order to reduce the phase mutual interference between the circuit board, each infrared emission circuit board or circuit board for receiving may adopt different sequential.For example, adjacent infrared emission sweep circuit plate adopts different sequential, and in the vertical scanning stage, each circuit board for receiving employing over against the identical sequential working of infrared emission sweep circuit plate, realizes that vertical scanning detects with vertical; In the dip sweeping stage, each infrared emission circuit board adopts the sequential working identical with the vertical scanning stage, and the sequential of each circuit board for receiving will change, and becomes the sequential of the infrared emission circuit board relative with its inclination, thereby realizes that dip sweeping detects.This sequence change is easier to just can realize under the CPU of touch system control.The relative element that do not tilt is installed in the circuit board or the infrared components of corner for part, owing to can not process by scanning sequence is pre-defined when dip sweeping detects.
Adopt the circuit structure of present embodiment, for simultaneous multiple point touching incident, touch-screen system can detect the possible position coordinates in definite touch point by carrying out a vertical scanning earlier, detect by a dip sweeping then, determine each touch point position coordinates relation, again vertical scanning is detected the possible position coordinate value substitution in touch point that obtains and determine to check in the coordinate relation formula, determine each touch point position coordinate by the dip sweeping detection.The method that realizes the multiple point touching location is described below in conjunction with Fig. 3.
As shown in Figure 3, suppose that the touch area is L at the total length of X-direction, towards relative, Y direction radiated element and receiving element deflection α angle are towards relative in X-direction radiated element and receiving element deflection θ angle.The scanning of X-direction is carried out from right to left, and the scanning of Y direction is carried out from the top down, and the true origin that need use during calculating is selected in the scanning of upper right side directions X and Y scanning direction and begins the place of carrying out.Operate on touch-screen simultaneously touch point 201 and 202, certain constantly their coordinates on touch-screen be respectively (Xa, Ya), (Xb, Yb).Touching device shown in Figure 3 is before beginning to touch detection, need finish the normalization or the initialization of each infrared receiver component earlier, in the present embodiment, because circuit structure is different from traditional touch-screen, normalization or initialized step are carried out in two steps, elder generation normalization or initialization vertically over against infrared receiver component, again according to the corresponding relation of dip sweeping, normalization or initialization and the relative receiving element of radiated element inclination, two normalized values or initialization value save as vertical normalized value or initialization value respectively, inclination normalized value or initialization value.Finish after normalization or the initialization procedure, according to scanning detection method mentioned above, beginning connect successively each infrared emission component with it vertical over against infrared receiver component, whether the output valve that detects each infrared components is compared with vertical normalized value or initialization value changes.In X-direction, when connecting infrared emission component at 204,206 o'clock, vertical with them over against infrared receiver component 207,209 output valves change, detection system thinks that two places have touch event to take place, and note their X-axis coordinate figure X
1, X
2Equally, when the infrared emission component that scans Y direction 213,214 o'clock, vertical with them over against infrared receiver component 215,216 output valves change, can judge that thus this two place of Y direction touches touch event and takes place, note their Y-axis coordinate figure Y
1, Y
2Like this, system just can draw 201, the 202 four groups of possible touch point coordinate figure (X in touch point
1, Y
1), (X
1, Y
2), (X
2, Y
1), (X
2, Y
2).
Proceed down the scanning of half period, the receiving element of connecting this moment is and the infrared emission component relative receiving element that tilts, and whether the output valve that detects each infrared receiver component is compared with inclination normalized value or initialization value changes.In X-direction, when lighting 203, receiving element 208 output valves relative with its inclination change, can judge thus has touch event to take place on 203 and 208 line, write down 203 to true origin apart from l1, same method can determine that another touch event occurs on 205 and 210 the line, write down 205 to true origin apart from l2.On the y direction of principal axis, when lighting 211,212 o'clock, with their the relative receiving element 217 that tilts respectively, 218 output valves change, can judge all there being touch event to take place on 211 and 217 the line and on 212 and 218 the line, note the distance h 1 of 211,212 range coordinate initial points respectively, h2.Relation from figure as can be seen, the coordinate of touch point 201,202 relation need satisfy the following relationship formula:
Ya＝(Xa-l1).ctgθ，
Yb＝(Xb-l2).ctgθ，
Ya＝(L-Xa).tgα+h1，
Yb＝(L-Xb).tgα+h2，
With above-mentioned four possible touch point coordinate (X
1, Y
1), (X
1, Y
2), (X
2, Y
1), (X
2, Y
2) substitution formula checking computations, promptly can accurately judge 201 coordinate is (X
1, Y
1), 202 coordinate is (X
2, Y
2).
Comprehensive above content with reference to Fig. 4, can draw the process of embodiment of the invention multiple point touching implementation method, and it mainly comprises the steps:
1. startup scanning generator, elder generation normalization and/or initialization be vertically over against receiving element, and tilt relative receiving element or first normalization and/or initialization of renormalization and/or initialization tilts relative receiving element renormalization and/or initialization vertically over against receiving element.
2. connect infrared emission component successively, connect successively vertical with radiated element on the position receiving element, read output valve and with vertical normalized value and/or initialization value comparison;
3. according to the situation of change of each infrared receiver component output valve and normalized value and/or the relatively back gained of initialization value, calculate the possible position coordinates in touch point;
4. continue scanning, connect successively and light each infrared emission component, connect simultaneously with infrared emission component inclination relative position on infrared receiver component, read with radiated element tilt relative receiving element output valve and with inclination normalized value and/or initialization value relatively;
5. according to record in the scan period, obtain each location parameter in the check formula, with the touch point possible position coordinate substitution formula checking computations of calculating in the step 3, determine the position coordinates of touch point reality, and coordinate data is delivered to Computer Processing;
6. according to the method for step 2, begin new circulation to step 5.
In step 3, calculate the possible position coordinates in touch point and can use common touch location detection algorithm to calculate.In the step 5, the formula that is used for checking the touch point coordinate can use but be not limited to following form:
Y＝(X-l)ctgθ
Y＝(L-X)tgα+h
Wherein, X, Y represent touch point coordinate figure to be determined, and process step 2, the coordinate figure substitution formula checking computations that the touch point that draws after step 3 scanning detects is possible if equation is set up, promptly can be determined the coordinate figure of actual touch point.The prerequisite that top formula is set up is that the initial point of coordinate axis is taken at the upper right side, and X-direction scans from right to left, and Y direction scans from the top down, as shown in Figure 3.L is a definite value, the expression touch area is at the total length of X-direction, l is the location parameter on the X-direction, during expression step 4 detects, when the infrared receiver component output valve of directions X changes with this receiving element distance of relative infrared emission component that tilt to initial point, h is the location parameter of Y direction, during expression step 4 detects, when the infrared receiver component output valve of Y direction changes with this receiving element distance of relative infrared emission component that tilt to initial point, θ represents the infrared emission/receiving element deflection angle (infrared emission component and the infrared receiver component line and infrared emission component and vertical angle between the infrared receiver component line that tilt relative) on the X-direction, α represents infrared emission on the Y direction/receiving element deflection angle (infrared emission component and the infrared receiver component line and infrared emission component and vertical angle between the infrared receiver component line that tilt relative), θ can get identical value with α, also can get different value.
In the present embodiment true origin be chosen in the upper right side, in fact the selection of initial point can freely be selected, and can be selected in the lower left, upper left side or other optional positions are carried out simple conversion to check formula thereupon and are got final product.Scanning sequency can be changed, and first dip sweeping is vertical scanning again, and the normalization process can be like this, and the actual detection process also can be like this.
In the present embodiment, to scan to detect and be divided into vertical scanning detection and two processes of dip sweeping detection, in fact, dip sweeping needn't be carried out always, when each touch point position coordinate is determined, and when keeping stablizing, only carrying out vertical scanning detects, judge that the movement tendency of each touch point just can discern a plurality of touch points, can application reference number be the Chinese patent of a CN200710028038.X multi-point touch locating method about the method for discerning a plurality of touch points by the detected touch point movement tendency.At this moment, the step of dip sweeping can be omitted, and can make the refresh rate that touches detection remain on a higher level like this.
Through above-mentioned calculating, can correctly find each position, touch point, after each touch point position coordinate of identification, just can define various operating functions, the identification operation intention of user according to the movement tendency of each point.Such as, in certain application scenario, two touch point counter motions, amplifieroperation is carried out in expression; A touch point is motionless, and movement in a curve is done in the another one touch point, and expression is rotated operation or the like.These operating functions can be defined flexibly by corresponding application software.
In the present embodiment,, can take some measures for improving the jamproof performance of touch-screen system.For example, different detection sides to the infrared emission receiving array in the infrared components of different frequency is installed, at the infrared components of horizontal detection side to use 940nm, then use the infrared components of 850nm at longitudinal direction, like this, the situation of adjacent infrared components phase mutual interference can not appear in the surveyed area in the corner.
The above only is an one embodiment of the invention, in fact the work schedule of infrared emission component and infrared receiver component also can be according to actual adjustment, need and a scan period can be divided into the three or more stages if having, how to scan detection several times, like this, radiated element can corresponding three or more receiving elements, correspondingly, detection system just can obtain more location parameter, uses more check formula to determine the actual position coordinate of a plurality of touch points.In addition; the touch point of enumerating among the embodiment has only two; and it can be two or more according to the touch point that the inventive method can realize; therefore protection scope of the present invention is not limited thereto, and those of skill in the art are any to be included within protection domain of the present invention based on non-material change on the technical solution of the present invention.
Claims (14)
1. infrared touch panel, comprise infrared emission component that is arranged on the infrared emission sweep circuit plate and the infrared receiver component that is arranged on the infrared ray reception sweep circuit plate, it is characterized in that: upwards at least one detection side, infrared emission component on the described infrared emission sweep circuit can not satisfy the following corresponding relation except the reason of corner part owing to the installation site, the light that remaining infrared emission component sends except can by one with its vertical infrared receiver component on locational infrared reception sweep circuit receives, can also be departed from vertically the infrared receiver component that promptly tilts on the relative infrared reception sweep circuit over against the position by at least one and receive constantly in difference.
2. a kind of infrared touch panel according to claim 1, it is characterized in that: except the infrared emission component that is installed in the corner and/or infrared receiver component not the deflection angle, infrared receiver component on the infrared emission component on the described infrared emission sweep circuit that same detection side makes progress and infrared reception sweep circuit is all to the identical angle of same direction deflection, and infrared emission component and infrared receiver component are towards relative.
3. a kind of infrared touch panel according to claim 2 is characterized in that: part and infrared emission component vertical over against the infrared receiver component and the relative infrared receiver component that tilts be positioned on the same block of infrared reception sweep circuit plate.
4. a kind of infrared touch panel according to claim 2 is characterized in that: with same described infrared emission component vertical over against the described infrared receiver component and the relative described infrared receiver component that tilts lay respectively on the different infrared reception sweep circuit plates.
5. according to claim 3 or 4 described a kind of infrared touch panels, it is characterized in that: infrared emission sweep circuit plate adopts identical sequential working, a detection scan period is divided into two stages at least, in preceding half or back half scan period, the light that infrared emission component sends by with it vertically over against an infrared receiver component receive and detect, infrared emission component is connected one by one and is lighted, vertical with them over against infrared receiver component receive detection one by one; In other half scan period, when this infrared emission component is lighted once more, its light that sends is received by another infrared receiver component that tilts relative with it and detects, and infrared emission component is connected one by one and lighted, and the infrared receiver component relative with their inclinations receives detection one by one;
Perhaps infrared reception sweep circuit plate adopts identical sequential working, and a detection scan period is divided into two stages at least; In preceding half or back half scan period, infrared receiver component receive detect from it vertically over against the light that infrared emission component sends, infrared receiver component is connected detection one by one, vertical with them over against infrared emission component light one by one; In other half scan period, when this infrared receiver component is connected once more, the light of its detection that receives is from another relative infrared emission component that tilts with it, and infrared receiver component is connected detection one by one, and the infrared emission component relative with their inclinations lighted one by one.
6. according to claim 3 or 4 described a kind of infrared touch panels, it is characterized in that: in the infrared receiving array of this infrared touch panel, the infrared emission component in the infrared emission component in the horizontal array, infrared receiver component and the vertical array, the frequency of infrared receiver component are different.
7. multi-point touch locating method that uses the described a kind of infrared touch panel of claim 1 is characterized in that it mainly may further comprise the steps:
A), start scanning generator, elder generation's normalization and/or initialization vertical with infrared emission component over against infrared receiver component, renormalization and/or the initialization relative infrared receiver component that tilts is noted inclination normalized value and/or inclination initialization value and the vertical normalized value and/or the initialization value of each infrared receiver component respectively; Perhaps first normalization and/or initialization tilt relative infrared receiver component renormalization and/or initialization vertically over against element, write down inclination normalized value and/or initialization value and vertical normalized value and/or initialization value respectively;
B), successively connect and light each infrared emission component, connection simultaneously is vertical with infrared emission component over against locational infrared receiver component, reads output valve and the perpendicular normalized value and/or the initialization value comparison of infrared emission component;
C), according to each infrared receiver component output valve and normalized value and/or the initialization value situation of change of back gained relatively, calculate the possible position coordinates in each touch point;
D), continue scanning, connect successively and light each infrared emission component, connect simultaneously with infrared emission component inclination relative position on infrared receiver component, read with infrared emission component tilt relative receiving element output valve and with inclination normalized value and/or initialization value relatively;
E), according to each infrared receiver component output valve and inclination normalized value and/or the initialization value situation of change of back gained relatively, obtain each location parameter, determine the relation between touch point actual coordinate X and the Y, check in the formula that the touch point that calculates among the step c may the coordinate figure substitution be determined by each location parameter, determine each touch point position coordinates, and coordinate data is delivered to Computer Processing;
F), according to the method for step b to step e, begin new circulation.
8. multi-point touch locating method that uses the described a kind of infrared touch panel of claim 1, it is characterized in that: it mainly may further comprise the steps:
A), start scanning generator, elder generation's normalization and/or initialization vertical with infrared emission component over against infrared receiver component, renormalization and/or the initialization relative infrared receiver component that tilts is noted inclination normalized value and/or inclination initialization value and the vertical normalized value and/or the initialization value of each infrared receiver component respectively; Perhaps first normalization and/or initialization tilt relative infrared receiver component renormalization and/or initialization vertically over against element, write down inclination normalized value and/or initialization value and vertical normalized value and/or initialization value respectively;
B), each infrared emission component is lighted in connection successively, connect simultaneously with infrared emission component inclination relative position on infrared receiver component, read with infrared emission component tilt relative infrared receiver component output valve and with inclination normalized value and/or initialization value relatively, situation of change according to each infrared receiver component output valve and inclination normalized value and/or the relatively back gained of initialization value obtains each location parameter;
C), successively connect and light each infrared emission component, connection simultaneously is vertical with infrared emission component over against locational infrared receiver component, reads output valve and the perpendicular normalized value and/or the initialization value comparison of infrared emission component;
D), according to each infrared receiver component output valve and normalized value and/or the initialization value situation of change of back gained relatively, calculate the possible position coordinates in each touch point;
E), determine the relation between touch point actual coordinate X and the Y, check in the formula that the touch point that calculates in the steps d may the coordinate figure substitution be determined by the location parameter of step b, determine each touch point position coordinates, and coordinate data delivered to Computer Processing;
F), according to the method for step b to step e, begin new circulation.
9. according to claim 7 or 8 described multi-point touch locating methods, it is characterized in that: among the described step e, Method for Checking is: calculate in the following formula of possible coordinate figure substitution with the touch point:
Y＝(X-l)ctgθ，
Y=(L-X) tg α+h, what equation was set up is the actual coordinate value;
Wherein the coordinate axis initial point is in the upper right side, X-direction scanning from right to left, Y direction scanning from the top down, X, Y represents touch point coordinate figure to be determined, L represents the total length of touch area in X-direction, l be the infrared receiver component output valve of directions X when changing with this receiving element distance of relative infrared emission component that tilt to initial point, it is the location parameter on the X-direction, h be the infrared receiver component output valve of Y direction when changing with this receiving element distance of relative infrared emission component that tilt to initial point, it is the location parameter of Y direction, the infrared receiver component line that θ represents the infrared emission component on the X-direction and tilts relative and infrared emission component and vertical angle between the infrared receiver component line, α are represented infrared emission component on the Y direction and the infrared receiver component line and infrared emission component and vertical angle between the infrared receiver component line that tilt relative; θ gets identical value or different value with α.
10. according to claim 7 or 8 described multipoint positioning methods, it is characterized in that: N infrared emission component or infrared receiver component are arranged on the every circuit board, with the 1st radiated element relative receiving element that tilts is M receiving element, with the 2nd radiated element relative receiving element that tilts is M+1 receiving element, arrange according to this, the receiving element relative with N-M+1 radiated element inclination is N receiving element; Carry out vertical scanning when detecting, radiated element and receiving element are all connected one by one since the 1st, up to N; When carrying out the dip sweeping detection, radiated element is still since the 1st, radiated element is connected one by one from the 1st to N-M+1 and is lighted, the receiving element relative with their inclinations also connected one by one from M to N and detected, continue scanning, N-m+2 connects when lighting one by one to N radiated element, and the connection of receiving element turns back to the front in proper order, connects detection one by one from the 1st to M-1.
11. according to claim 7 or 8 described multipoint positioning methods, it is characterized in that: N infrared emission component or infrared receiver component are arranged on the every circuit board, with the 1st radiated element relative receiving element that tilts is M receiving element, with the 2nd radiated element relative receiving element that tilts is M+1 receiving element, being arranged in order, is N receiving element with N-M+1 radiated element relative receiving element that tilts; Carry out vertical scanning when detecting, receiving element and radiated element are all connected one by one since the 1st, up to N.When carrying out the dip sweeping detection, receiving element is connected detection one by one still since the 1st connection from the 1st to M-1, and at this moment, infrared emission component is lighted from N-M+2 to individual the connection one by one of N; Continue scanning, connect one by one when detecting to N receiving element for M, the connection of radiated element turns back to the front in proper order, and connection is lighted one by one from the 1st to N-M+1.
12. according to claim 7 or 8 described multipoint positioning methods, it is characterized in that: with same described infrared emission component vertical over against the described infrared receiver component and the relative described infrared receiver component that tilts when laying respectively on the different infrared reception sweep circuit plates, a detection scan period is divided into two stages at least, adjacent infrared emission circuit board adopts different sequential, in preceding half or back half scan period, each circuit board for receiving employing over against the identical sequential working of infrared emission sweep circuit plate, realizes that vertical scanning detects with vertical; In other half scan period, each infrared emission circuit board adopts the sequential working identical with the vertical scanning stage, and the sequential of each circuit board for receiving becomes the sequential of the relative infrared emission circuit board of the inclination adjacent with it, thereby realize that dip sweeping detects, be installed in the circuit board or the infrared components of corner for part, opposed circuit boards or infrared components owing to do not tilt can not process by scanning sequence is pre-defined when dip sweeping detects.
13. according to claim 7 or 8 described multipoint positioning methods, it is characterized in that: a detection scan period is divided into two stages at least, adjacent infrared receiving circuit plate adopts different sequential, in preceding half or back half scan period, each radiating circuit plate employing over against the identical sequential working of infrared receiving circuit plate, realizes that vertical scanning detects with vertical; In other half scan period, each infrared receiving circuit plate adopts the sequential working identical with the vertical scanning stage, and the sequential of each radiating circuit plate becomes the sequential of the relative infrared receiving circuit plate of the inclination adjacent with it, thereby realizes that dip sweeping detects; Do not tilt opposed circuit boards or infrared components be installed in the circuit board or the infrared components of corner for part, owing to can not process by scanning sequence is pre-defined when dip sweeping detects.
14. according to claim 7 or 8 described multi-point touch locating methods, it is characterized in that: the dip sweeping testing process needn't be carried out always, after using vertical scanning and dip sweeping to determine each touch point, can only carry out vertical scanning and detect, omit dip sweeping and detect.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100310826A CN101149656A (en) | 2007-10-26 | 2007-10-26 | Infra red touch screen and multiple point touching positioning method |
| PCT/CN2008/000847 WO2008154792A1 (en) | 2007-06-15 | 2008-04-25 | Infrared touch screen and multi-point touch positioning method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100310826A CN101149656A (en) | 2007-10-26 | 2007-10-26 | Infra red touch screen and multiple point touching positioning method |
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2007
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