CN101149235A - Heat pipe radiator and its production method - Google Patents

Heat pipe radiator and its production method Download PDF

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Publication number
CN101149235A
CN101149235A CNA2006100627969A CN200610062796A CN101149235A CN 101149235 A CN101149235 A CN 101149235A CN A2006100627969 A CNA2006100627969 A CN A2006100627969A CN 200610062796 A CN200610062796 A CN 200610062796A CN 101149235 A CN101149235 A CN 101149235A
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CN
China
Prior art keywords
heat
endothermic section
pipe
heat pipe
pedestal
Prior art date
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Granted
Application number
CNA2006100627969A
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Chinese (zh)
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CN101149235B (en
Inventor
杜建军
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Shenzhen Fluence Technology Co Ltd
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杜建军
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Application filed by 杜建军 filed Critical 杜建军
Priority to CN 200610062796 priority Critical patent/CN101149235B/en
Priority to PCT/CN2006/003618 priority patent/WO2008037135A1/en
Publication of CN101149235A publication Critical patent/CN101149235A/en
Application granted granted Critical
Publication of CN101149235B publication Critical patent/CN101149235B/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention relates to a heat pipe radiator and its production method. The heat pipe radiator includes: heat pipe with heat absorbing part and radiator part bended-connecting to the heat absorbing part; base supporting the heat pipe. One lateral face of the base is arranged with groove. The heat absorbing part of heat pipe is clamped in the said groove by extruding. The base includes several stacked and fixed base pieces. The production technique of radiator is simplified. It increases radiating efficiency and reduces production costs.

Description

A kind of heat-pipe radiator and manufacture method thereof
[technical field]
The present invention relates to a kind of heat-pipe radiator and manufacture method thereof, particularly be used for heat-pipe radiator and manufacture method thereof that electronic devices and components are dispelled the heat.
[background technology]
At present, aspect the heat dissipation problem of electronic device, because heat pipe has characteristics such as capacity of heat transmission height, pyroconductivity height, heat transfer rate be fast, in light weight, simple in structure, add it and can transmit a large amount of heat but do not consume electric power, so heat pipe is widely used in the heat abstractor of various electronic products.Therefore, heat-pipe radiator has become the important topic that solves the dissipation from electronic devices problem.
For example, the title of submitting on July 6th, 2005 discloses a kind of heat-pipe radiator among the Chinese utility model patent ZL 200520112344.8 of " heat-pipe radiator ", in this radiator,, heat pipe is fixed on the pedestal by the heating end of this through hole engine clipping heat pipe by with in the urgent through hole that penetrates the bar ditch of the condensation end of heat pipe.The plane is processed in advance so that flush with the bottom surface of pedestal in fixing back in the heating end bottom of this heat pipe.
Yet, the complex manufacturing of above-mentioned known heat-pipe radiator, that is: the condensation end of heat pipe need be processed into the plane earlier; Need form bar ditch, through hole and compression part at pedestal, produce complicated; Only by through hole engine clipping heat pipe condensation end, lifting surface area is little, fixed effect is poor fixedly the time for heat pipe and pedestal.In addition, the pedestal of radiator is the one block structure, and its manufacturing cost height and fixed thickness can't change according to actual conditions after the manufacturing.
[summary of the invention]
In order to overcome the technical problem of prior art radiator manufacturing process complexity and fixed effect difference, the present invention proposes a kind of heat-pipe radiator of fixing by pressing method opposite heat tube and pedestal.In addition, the present invention also improves the pedestal of radiator.
The present invention solves the technical scheme that the technical problem of the radiator manufacturing process complexity of prior art and fixed effect difference takes: a kind of heat-pipe radiator is provided, this heat-pipe radiator comprises: have endothermic section and the heat pipe of the radiating part that is connected with the endothermic section bending and the pedestal that supports heat pipe, pedestal is provided with groove, the endothermic section of heat pipe by press nip in groove.
According to one preferred embodiment of the present invention, the endothermic section of extruding heat pipe makes the compressive plane of endothermic section equal with the base plane of pedestal.
According to one preferred embodiment of the present invention, the endothermic section of heat pipe is clamped between the two side of groove.
According to one preferred embodiment of the present invention, pedestal comprises a plurality of piling up each other and fixing base pieces.
According to one preferred embodiment of the present invention, base pieces is fixed to one another by riveted joint, welding, viscose glue or screw fixed form.
According to one preferred embodiment of the present invention, heat pipe is U type heat pipe or L type heat pipe.
The present invention solves another technical scheme that the technical problem of pedestal manufacturing process complexity in the radiator of prior art and fixed effect difference takes: a kind of heat-pipe radiator manufacture method is provided, the heat-pipe radiator manufacture method comprises: a. provide has the endothermic section and with the heat pipe of the crooked radiating part that is connected in endothermic section and the pedestal that is provided with groove, b. push heat pipe the endothermic section so that the endothermic section be clamped in the groove.
According to one preferred embodiment of the present invention, in step a, provide a plurality of base pieces, base pieces is piled up each other and fixing so that pedestal to be provided.
According to one preferred embodiment of the present invention, in step b, the endothermic section of heat pipe is set to the groove that part is protruded pedestal, utilizes the projection of anchor clamps extruding endothermic section that the endothermic section is clamped between the sidewall of groove.
According to one preferred embodiment of the present invention, in step b, the extruding endothermic section makes the compressive plane of endothermic section equal with the base plane of pedestal.
By adopting said structure and method, utilize on extrusion process is fixed to heat pipe in the groove of pedestal, can simplify radiator production technology, improve radiating efficiency, reduce production costs.In addition, pedestal is formed by the base pieces of piling up each other and fix, and can reduce the production cost of pedestal a step.
[description of drawings]
Fig. 1 is the decomposing schematic representation of heat-pipe radiator one embodiment of the present invention;
Fig. 2 is the decomposing schematic representation of heat pipe and pedestal in the heat-pipe radiator of Fig. 1;
Fig. 3 is the assembling schematic diagram of heat-pipe radiator one embodiment of the present invention.
[specific embodiment]
Relevant feature of the present invention and technology contents please refer to following detailed description and accompanying drawing, and accompanying drawing only provides reference and explanation, is not to be used for the present invention is limited.
As shown in Figure 1-Figure 3, radiator 1 of the present invention mainly comprises: have the heat pipe 11 of endothermic section 111 and the radiating parts 112 that are connected with endothermic section 111 bendings and support the pedestal 12 of heat pipe 11, the lip-deep fastener 14 of pyrotoxin that is located in a plurality of fin 13 on the heat pipe 11 and pedestal 12 is fixed on electronic component.Pedestal 12 is provided with groove 121, and the endothermic section 111 of heat pipe 12 by press nip in groove 121.In the present embodiment, fin 13 is made with aluminium, copper or other thermal diffusivity good metal material, is provided with a plurality of perforation thereon.Heat pipe 11 can be L type, U type or has the heat pipe of other curved shape, and its inside has capillary structure and hydraulic fluid, and the outside is formed with endothermic section 111 and radiating part 112.In addition, radiator 1 can also adopt other appropriate configuration except that can be above-mentioned kenel.Because in groove 121, the manufacturing process of radiator 1 is simpler by press nip in endothermic section 111, fixed effect is better.
In the present embodiment, the a plurality of base pieces 122 of pedestal 12 preferred employings superpose each other and fixedly form, and base pieces 122 can adopt Sheet Metal Forming Technology or other suitable modes to make, and utilizes various known fixing means to fix, and for example rivets, welding, viscose glue or screw be fixing or the like.Adopt this multi-disc combining structure, can reduce the manufacturing cost of pedestal 12 and can make the pedestal of desired thickness according to actual needs by the base pieces 122 of piling up right quantity.Certainly, pedestal also can adopt the single tabular base plate (not shown) identical with prior art.
In the process of extruding endothermic section 111, should make the compressive plane of endothermic section 111 equal with the base plane of pedestal 12.With radiator 1 and electronic component (not shown) when fixing, the compressive plane of endothermic section 111 directly contacts with the pyrotoxin of electronic component is surperficial, increases the heat-conducting effect and the heat dispersion of radiator thus like this.
Introduce manufacture method one preferred embodiment of heat-pipe radiator of the present invention below, in the present embodiment, at first provide a plurality of base pieces 122 by Sheet Metal Forming Technology or other suitable technology, and utilize fixing means such as riveted joint, welding, viscose glue or screw that base pieces 122 is piled up each other and fixing, form pedestal 12 with groove 121; Endothermic section 111 with heat pipe 11 is set to the groove 121 that part is protruded pedestal 12 subsequently, utilizes the projection of anchor clamps extruding endothermic section 111 that endothermic section 111 is clamped in the groove 121.In extrusion process, endothermic section 111 distortion, endothermic section 111 is clamped between the two side of groove 121 thus.In addition, in extrusion process, make the compressive plane of endothermic section 111 equal with the base plane of pedestal 12, and with this compressive plane as the heat pipe heat-absorbent surface.
By adopting said structure and method, utilize on extrusion process is fixed to heat pipe in the groove of pedestal, can simplify radiator production technology, improve radiating efficiency, reduce production costs.In addition, pedestal is formed by the base pieces of piling up each other and fix, and further reduces the production cost of pedestal.
The above, be the preferred embodiments of the present invention only, be not so promptly limit claim of the present invention, the equivalent structure transformation that every application specification of the present invention and accompanying drawing content are done, direct or letter scoops out and is used in other relevant technical field, all in like manner is included in the claim of this invention.

Claims (10)

1. heat-pipe radiator, described heat-pipe radiator comprises: have endothermic section and the heat pipe of the radiating part that is connected with the bending of described endothermic section and the pedestal that supports described heat pipe, it is characterized in that: described pedestal is provided with groove, the endothermic section of described heat pipe by press nip in described groove.
2. heat-pipe radiator according to claim 1 is characterized in that: the endothermic section of pushing described heat pipe makes the compressive plane of described endothermic section equal with the base plane of described pedestal.
3. heat-pipe radiator according to claim 1 and 2 is characterized in that: the endothermic section of described heat pipe is clamped between the two side of described groove.
4. heat-pipe radiator according to claim 1 and 2 is characterized in that: described pedestal comprises a plurality of piling up each other and fixing base pieces.
5. heat-pipe radiator according to claim 4 is characterized in that: described base pieces is fixed to one another by riveted joint, welding, viscose glue or screw fixed form.
6. heat-pipe radiator according to claim 1 and 2 is characterized in that: described heat pipe is U type heat pipe or L type heat pipe.
7. heat-pipe radiator manufacture method, described heat-pipe radiator manufacture method comprises:
A. provide to have endothermic section and the heat pipe of the radiating part that is connected with the bending of described endothermic section and the pedestal that is provided with groove,
B. push described heat pipe the endothermic section so that described endothermic section be clamped in the described groove.
8. manufacturing method of heat radiator according to claim 7 is characterized in that: in described step a, provide a plurality of base pieces, described base pieces is piled up each other and fixing so that described pedestal to be provided.
9. manufacturing method of heat radiator according to claim 8, it is characterized in that: in described step b, the endothermic section of described heat pipe is set to the groove that part is protruded described pedestal, and the projection that utilizes anchor clamps to push described endothermic section is clamped between the sidewall of described groove described endothermic section.
10. according to any described manufacturing method of heat radiator of claim 7-9, it is characterized in that: in described step b, push described endothermic section and make the compressive plane of described endothermic section equal with the base plane of described pedestal.
CN 200610062796 2006-09-22 2006-09-22 Heat pipe radiator and its production method Active CN101149235B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200610062796 CN101149235B (en) 2006-09-22 2006-09-22 Heat pipe radiator and its production method
PCT/CN2006/003618 WO2008037135A1 (en) 2006-09-22 2006-12-27 Heat sink with heat pipe and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200610062796 CN101149235B (en) 2006-09-22 2006-09-22 Heat pipe radiator and its production method

Publications (2)

Publication Number Publication Date
CN101149235A true CN101149235A (en) 2008-03-26
CN101149235B CN101149235B (en) 2010-05-12

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WO (1) WO2008037135A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101927304A (en) * 2009-06-23 2010-12-29 株式会社三社电机制作所 The manufacture method of heat abstractor and heat abstractor
CN103759561A (en) * 2014-01-21 2014-04-30 华南理工大学 Heat pipe radiator based on phase change compression, and manufacturing method of heat pipe radiator

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103096684B (en) * 2011-11-01 2016-09-07 富瑞精密组件（昆山）有限公司 Heat abstractor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321779A (en) * 1997-05-21 1998-12-04 Hitachi Ltd Heat pipe type cooling equipment
CN2500070Y (en) * 2001-08-03 2002-07-10 富准精密工业(深圳)有限公司 Radiator device
US7143819B2 (en) * 2002-09-17 2006-12-05 Hewlett-Packard Development Company, L.P. Heat sink with angled heat pipe
CN2691054Y (en) * 2004-02-07 2005-04-06 鸿富锦精密工业（深圳）有限公司 Heat pipe radiator
CN2694359Y (en) * 2004-04-02 2005-04-20 鸿富锦精密工业（深圳）有限公司 Heat pipe radiator
WO2005100899A2 (en) * 2004-04-09 2005-10-27 Aavid Thermalloy, Llc Multiple evaporator heat pipe assisted heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101927304A (en) * 2009-06-23 2010-12-29 株式会社三社电机制作所 The manufacture method of heat abstractor and heat abstractor
CN103759561A (en) * 2014-01-21 2014-04-30 华南理工大学 Heat pipe radiator based on phase change compression, and manufacturing method of heat pipe radiator

Also Published As

Publication number Publication date
CN101149235B (en) 2010-05-12
WO2008037135A1 (en) 2008-04-03

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Shenzhen YYC-LED Lighting Co., Ltd.

Assignor: Du Jianjun

Contract record no.: 2010440020208

Denomination of invention: Heat pipe radiator and its production method

Granted publication date: 20100512

License type: Exclusive License

Open date: 20080326

Record date: 20100930

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Free format text: CORRECT: ADDRESS; FROM: 518000 3-25D, JINGPENG BUILDING, FUTIAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 1-3/F, BUILDING 3, JUNTIAN INDUSTRIAL AREA, PINGSHAN, LONGGANG DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE

TR01 Transfer of patent right

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Address after: Longgang District of Shenzhen City, Guangdong province 518000 Ping Jun Tian Industrial Zone third building 1-3

Patentee after: Shenzhen Fluence Technology Co., Ltd.

Address before: 518000, Shenzhen, Guangdong province Futian District Jing Peng building 3-25D

Patentee before: Du Jianjun

C56 Change in the name or address of the patentee

Owner name: SHENZHEN FLUENCE TECHNOLOGY PLC.

Free format text: FORMER NAME: SHENZHEN FLUENCE TECHNOLOGY CO., LTD.

CP03 Change of name, title or address

Address after: 518118 Guangdong city of Shenzhen province Pingshan Pingshan office six community Jun Tian Industrial Zone No. 3 building first

Patentee after: SHENZHEN FLUENCE TECHNOLOGY CO., LTD.

Address before: Longgang District of Shenzhen City, Guangdong province 518000 Ping Jun Tian Industrial Zone third building 1-3

Patentee before: Shenzhen Fluence Technology Co., Ltd.

EC01 Cancellation of recordation of patent licensing contract

Assignee: Shenzhen YYC-LED Lighting Co., Ltd.

Assignor: Shenzhen Fluence Technology Co., Ltd.

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