CN101148509A - Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate - Google Patents
Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate Download PDFInfo
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- CN101148509A CN101148509A CNA2007100531513A CN200710053151A CN101148509A CN 101148509 A CN101148509 A CN 101148509A CN A2007100531513 A CNA2007100531513 A CN A2007100531513A CN 200710053151 A CN200710053151 A CN 200710053151A CN 101148509 A CN101148509 A CN 101148509A
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Abstract
The present invention proposes one kind of modified end capped polyamide resin and its preparation process and application in flexible no-glue two-layer copper clad plate, and belongs to the field of flexible printed circuit board material technology. The modified maleimide end capped polyamide resin consists of maleimide end capped polyamide resin and allyl compound. The flexible no-glue two-layer copper clad plate of the modified maleimide end capped polyamide resin has no surface pore, and possesses excellent heat resisting performance, adaptability for no-lead soldering, low crimpability, high size stability, high mechanical strength, high stripping strength, high bending strength, low thermal expansion coefficient, low dielectric constant and low water absorption rate.
Description
Technical field:
The present invention relates to flexible printed circuit with flexible copper-clad plate substrate and field of compound material thereof, comprise a kind of modified maleimide end-sealed type polyimide resin and preparation method thereof and its application on a kind of gum-free two-layer method flexibility coat copper plate.
Technical background:
At present in flexible printed circuit (FPC) base material of producing, the modal tackiness agent that is to use has glue type three-layer process product with Kapton and Copper Foil bonding compound, and the tackiness agent of the bi-maleimide modified paracril preparation of the use described in CN1138782A and CN1178237A is used for copper-clad plate production.
Along with the fast development of electronic industry, the outward appearance and the performance of electronic product proposed requirements at the higher level, short, little, light, thin, U.S. and excellent comprehensive performance have become manufacturer and human consumer's first-selection.FPC industry has been developed two layers of method base material of gum-free that thickness is thinner, performance is more excellent in succession in order to address that need.The production method of this gum-free two-layer method flexibility coat copper plate base material mainly contains three kinds: the first forms copper conductive layer (CN95106677) on the Kapton surface by electroless plating and electric plating method; It two is to adopt vacuum sputtering technology or evaporation precipitation technology, and copper is deposited to (CN01109402/CN1579754A) on the insulating film; It three is directly to be coated on the polyamic acid solution as polyimide precursor on the tinsel, carry out the gradient increased temperature cyclodehydration then and become polyimide clad with metal foil (CN00137383/CN1410471A), the great advantage of this kind method is that production cost is low, technology is fairly simple.But because of use polyimide precursor solution---polyamic acid is very easily degraded, make its storage period too short, can not satisfy the needs that large scale industry is produced well, and its hot imidization process must be under nitrogen atmosphere, under the high temperature more than 350 ℃, finish, very harsh to the requirement of equipment and envrionment conditions.
In thermoset polyimide resin branch, bismaleimides (BMI) is except that having outstanding heat-resisting, the moisture-proof of general Thermocurable polyimide, radiation hardness, insulation and good processing characteristics, it also has the low solidification value (below 250 ℃) of loop-like epoxy resins, the characteristics of low solidifying pressure (0.7MPa is following), can cut down finished cost dramatically and the requirement of production process, therefore be widely used in resin matrix, high-temperature insulation material and the tackiness agent etc. of advanced composite material in the industrial circles such as Aeronautics and Astronautics, machinery, electronics equipment.At present, its applied research on electronic industry such as printed circuit board is very active.But because of traditional B MI cured resin is generally more crisp, the ability of shock resistance and anti-stress cracking is also relatively poor, thereby has limited its application on the gum-free two-layer method flexibility coat copper plate.The matrix resin that the bismaleimide amine resins will be produced as the gum-free two-layer method flexibility coat copper plate must carry out modification to it.
Summary of the invention:
The object of the present invention is to provide a kind of gum-free two-layer method flexibility coat copper plate that is used for to produce required modified maleimide end-sealed type polyimide resin.This resin has excellent thermotolerance, dimensional stability, anti-bending, workability and low-k, the low-dielectric loss factor.
Another object of the present invention is to provide a kind of preparation method of modified maleimide end-sealed type polyimide resin.
Another object of the present invention is to provide the application method of a kind of modified maleimide end-sealed type polyimide resin on the gum-free two-layer method flexibility coat copper plate.
For achieving the goal, the technical solution used in the present invention is:
A kind of modified maleimide end-sealed type polyimide resin, its special character is: the composition of described modified maleimide end-sealed type polyimide resin and weight proportion are:
100 parts of maleimide end-sealed type polyimide resins
4～50 parts of allylic cpds
Described allylic cpd is a kind of or the two blend in diallyl bisphenol and the diallyl bisphenol S.
In the prescription of resin system, the consumption of allylic cpd is chosen to be 4%～50% of maleimide end-sealed type polyimide resin demand, if the consumption of allylic cpd is less than 4%, then the toughness of system is relatively poor, if its consumption is greater than 50%, then the thermotolerance of system and dielectric properties reduce significantly.
Above-mentioned maleimide end-sealed type polyimide resin, its preparation process is: with diamine, MALEIC ANHYDRIDE and tetracarboxylic dianhydride are (n+1) by the amount of substance ratio: 2: n successively joins in the polar solvent, making its solid content is 25 ± 1% (grams per milliliters), under nitrogen protection, after stirring 8～24 hours under the room temperature, generate the intermediate polyamic acid, add dewatering agent diacetyl oxide and dehydration catalyst triethylamine and an amount of polar solvent immediately, make its solid content reduce to 15% (grams per milliliter), again in 30 ℃～80 ℃ following chemical imidization reactions 4～16 hours, reaction solution is poured in the dehydrated alcohol of high-speed stirring, obtain throw out, after the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying promptly got the maleimide end-sealed type polyimide resin; Perhaps with the intermediate polyamic acid that generates under the effect of entrainer orthodichlorobenzene, chlorobenzene or toluene, carry out hot cyclodehydration and obtain the maleimide end-sealed type polyimide resin product, reaction process as the formula (1),
In the formula; N is the resin polymerization degree, 1≤n≤20; Tetracarboxylic dianhydride is O (CO)
2R
1(CO)
2Diamine is H
2N-R
2-NH
2
Selected tetracarboxylic dianhydride monomer O (CO)
2R
1(CO)
2, what wherein be suitable for can enumerate R
1For as the formula (2).Wherein X is O, S, SO
2, CO, CH
2, C (CH
3)
3, CF
2, C (CF
3)
2Perhaps do not exist.R
1Substituting group can be arranged, but preferably do not have substituting group, or C
1～C
6Low alkyl group or lower alkoxy.When synthetic maleimide end-sealed type polyimide resin, can use single tetracarboxylic dianhydride, the mixture that also can select for use two kinds or more tetracarboxylic dianhydrides to form.Preferred tetracarboxylic dianhydride has: 3,3 ', 4,4 '-BPDA (BPDA), 3,3 ', 4,4 '-benzophenone tetracarboxylic dianhydride (BTDA), 3,3 ', 4,4 '-phenyl ether tetracarboxylic dianhydride (ODPA), 2,2 '-it is two that [4-(3,4-dicarboxyl phenoxy group) phenyl] propane tetracarboxylic dianhydride (BPADA), 2,2 '-two (3,4-two carboxyphenyls) HFC-236fa tetracarboxylic dianhydride (6FDA).Five amount can not be zero simultaneously, and wherein any one amount of substance mark that accounts for the tetracarboxylic dianhydride blend is 0%～100%;
Selected diamine H
2N-R
2-NH
2, the enumerated R of Shi Yonging wherein
2As the formula (3).Wherein Z is O, S, SO
2, CO, CH
2, C (CH
3)
3, CF
2, C (CF
3)
2Perhaps do not exist; R
2Substituting group can be arranged, but preferably do not have substituting group, or C
1～C
6Low alkyl group or lower alkoxy; R
3Be C
1～C
12Alkyl or-oxyl; When synthetic maleimide end-sealed type polyimide resin, can select wherein a kind of, two kinds or multiple diamine monomer mixture for use; Preferred diamine has: 1,6-hexanediamine, 1, two (the 3-aminopropane base) tetramethyl disiloxanes, 1 of 3-, two (the 4-amino-benzene oxygen methane)-1 of 3-, 1,3,3-tetramethyl disiloxane, 3,4 '-diaminodiphenyl oxide (3,4 '-ODA), 4,4 '-diaminodiphenyl oxide (4,4 '-ODA), 4,4 (4,4 '-DDS), 1, two (4-amino-benzene oxygen) benzene of 4-(1,4-BAB), 2, two [(4-amino-benzene oxygen) phenyl] propane (4-BAPP) of 2-, two [4-(4-phenoxy group) phenyl] sulfone (BAPS); Nine amount can not be zero simultaneously, and wherein any one amount of substance mark that accounts for the diamine blend is 0%～100%.
The polar solvent that reacts used is N-N-methyl-2-2-pyrrolidone N-(NMP), N, N '-dimethyl formamide (DMF), N, N '-N,N-DIMETHYLACETAMIDE (DMAc), dimethyl sulfoxide (DMSO) (DMSO), meta-cresol, methyl-sulfate, tetramethylene sulfone, butyrolactone, tetrahydrofuran (THF) etc., wherein preferred N-N-methyl-2-2-pyrrolidone N-(NMP), N, N '-dimethyl formamide (DMF), N, a kind of or several mixtures in N '-N,N-DIMETHYLACETAMIDE (DMAc), the dimethyl sulfoxide (DMSO) (DMSO).
Described dewatering agent is a diacetyl oxide, and consumption is 2～4 times of diamine amount of substance; Dehydration catalyst is triethylamine, pyridine and metal-salt such as sodium acetate, nickelous acetate, magnesium acetate, sal epsom, magnesium chloride, cobaltous acetate, rose vitriol, manganous acetate, Manganous chloride tetrahydrate etc., wherein preferred triethylamine, and consumption is 0.2～1 times of diacetyl oxide amount of substance.
Preferred 50 ℃～70 ℃ of above-mentioned chemical imidization temperature of reaction; Preferred 6～8 hours of chemical imidization reaction times.
The application of modified maleimide end-sealed type polyimide resin of the present invention on the gum-free two-layer method flexibility coat copper plate, its special character is:
Take by weighing raw material according to above-mentioned maleimide end-sealed type polyimide resin and allylic cpd ratio of weight and number; after the two mixing; be dissolved in the polar solvent; fully stir; forming solid content is the homogeneous phase solution of 10%～50% (grams per milliliter); solid content is preferably 20%～30% (grams per milliliter); this solution is coated on the Copper Foil of 5 microns～35 micron thickness; control liquid film thickness after solvent evaporates is 10 microns～30 microns; in high temperature oven, under nitrogen protection, carry out gradient increased temperature and solidify promptly.
The polar solvent of above-mentioned soluble modified maleimide end-sealed type polyimide resin is N-N-methyl-2-2-pyrrolidone N-(NMP), N, N '-dimethyl formamide (DMF), N, N '-N,N-DIMETHYLACETAMIDE (DMAc), dimethyl sulfoxide (DMSO) (DMSO), meta-cresol, methyl-sulfate, tetramethylene sulfone, butyrolactone, tetrahydrofuran (THF) etc.Wherein preferred N-N-methyl-2-2-pyrrolidone N-(NMP), N, N '-dimethyl formamide (DMF), N, a kind of or several mixtures in N '-N,N-DIMETHYLACETAMIDE (DMAc), the dimethyl sulfoxide (DMSO) (DMSO).
Above-mentioned gradient increased temperature curing process is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour, 180 ℃ * 1 hour, 260 ℃ * 1 hour.
The adhesive surface of above-mentioned used Copper Foil has carried out chemistry or physics roughened.
Major advantage of the present invention is:
Synthetic modified maleimide end-sealed type polyimide resin has good solubility, may be dissolved in the polar solvent of selecting for use, and solution is good stability at room temperature.Be used on the gum-free two-layer method flexibility coat copper plate, production cost is low, technology is simple.Its solidification value polyimide commonly used relatively precursor solution---polyamic acid is much lower, thereby in process of production the requirement of equipment and envrionment conditions is reduced greatly.Resin does not have the small molecules volatile matter when solidifying emits, thereby can obtain the almost gum-free two-layer method flexibility coat copper plate base material of imperforate excellent combination property.Can be widely used in high-technology fields such as high-speed computing machine, satellite communication device, mobile telephone.
Embodiment:
The present invention further specifies with following example, but the present invention is not limited to these examples.
Embodiment 1
With 3; 4 '-diaminodiphenyl oxide 24.03 restrains (0.12 mole), MALEIC ANHYDRIDE 3.92 restrains (0.04 mole) and 3; 3 '; 4; 4 '-BPDA 29.42 gram (0.10 mole) successively joins among the NMP (229 milliliters); under nitrogen protection; stir after 10 hours under the room temperature; add 153 milliliters of dewatering agent diacetyl oxide 0.24 mole (22.65 milliliters), dehydration catalyst triethylamine 0.24 mole (33.47 milliliters) and NMP; reacted 7 hours down in 50 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 47.16 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 30 grams and diallyl bisphenol 3 grams, after the two is mixed, be dissolved among the NMP (158 milliliters), fully stir into homogeneous phase solution.With this solution be coated to 35 micron thickness on the Copper Foil that the physics roughened is crossed; control liquid film thickness after solvent evaporates is 10 microns～30 microns; in high temperature oven; under nitrogen protection, carry out gradient increased temperature; temperature-rise period is: 80 ℃ * 1 hour; 120 ℃ * 1 hour, 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 2
With 4; 4 '-diaminodiphenyl oxide 50.06 restrains (0.25 mole), MALEIC ANHYDRIDE 9.81 restrains (0.10 mole) and 3; 3 '; 4; 4 '-phenyl ether tetracarboxylic dianhydride 62.13 gram (0.20 mole) successively joins among the DMAc (488 milliliters); under nitrogen protection; stir after 12 hours under the room temperature; add 325 milliliters of dewatering agent diacetyl oxide 0.75 mole (70.77 milliliters), dehydration catalyst triethylamine 0.50 mole (69.73 milliliters) and DMAc; reacted 4 hours down in 70 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 99.26 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 80 grams and diallyl bisphenol 13 grams, after the two is mixed, be dissolved among the DMAc (425 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 3
With 4; 4 '-diaminodiphenylsulfone(DDS) (4; 4 '-DDS) 86.90 restrain (0.35 mole); MALEIC ANHYDRIDE 9.81 grams (0.10 mole) and 2; 2 '-two (3; 4-two carboxyphenyls) HFC-236fa tetracarboxylic dianhydride 133.27 grams (0.30 mole) successively join among the DMF (920 milliliters); under nitrogen protection; stir after 16 hours under the room temperature; add 1.40 moles of diacetyl oxides of dewatering agent (132.10 milliliters); 613 milliliters of dehydration catalyst triethylamine 0.14 mole (19.52 milliliters) and DMF; reacted 6 hours down in 60 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 200.00 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 100 grams and diallyl bisphenol 6 grams, after the two is mixed, be dissolved among the DMF (460 milliliters), fully stir into homogeneous phase solution.With this solution be coated to 35 micron thickness on the Copper Foil that the physics roughened is crossed; control liquid film thickness after solvent evaporates is 10 microns～30 microns; in high temperature oven; under nitrogen protection, carry out gradient increased temperature; temperature-rise period is: 80 ℃ * 1 hour; 120 ℃ * 1 hour, 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 4
With 1; two (4-amino-benzene oxygen) benzene 58.47 grams (0.20 mole) of 4-, MALEIC ANHYDRIDE 19.61 grams (0.20 mole) and 3; 3 '; 4; 4 '-benzophenone tetracarboxylic dianhydride 32.27 gram (0.10 mole) successively joins among the DMSO (440 milliliters); under nitrogen protection; stir after 18 hours under the room temperature; add 295 milliliters of dewatering agent diacetyl oxide 0.50 mole (47.18 milliliters), dehydration catalyst triethylamine 0.10 mole (13.95 milliliters) and DMSO; reacted 5 hours down in 60 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 86.52 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 60 grams and diallyl bisphenol 18 grams, after the two is mixed, be dissolved among the DMSO (355 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 5
With 4; 4 '-diaminodiphenyl oxide 12.01 grams (0.06 mole); 1; two (the 4-amino-benzene oxygen methane)-1 of 3-; 1; 3; 3-tetramethyl disiloxane 22.60 grams (0.06 mole); MALEIC ANHYDRIDE 3.92 grams (0.04 mole) and 2; 2 '-it is two that [4-(3; 4-dicarboxyl phenoxy group) phenyl] propane tetracarboxylic dianhydride 52.05 gram (0.10 mole) successively joins among the NMP (362 milliliters); under nitrogen protection; stir after 8 hours under the room temperature; add 0.34 mole of diacetyl oxide of dewatering agent (32.08 milliliters); 242 milliliters of dehydration catalyst triethylamine 0.10 mole (13.95 milliliters) and NMP; reacted 4 hours down in 60 ℃, be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 77.93 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 50 grams and diallyl bisphenol 4 grams, after the two is mixed, be dissolved among the DMAc (270 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 6
With 4; 4 '-diaminodiphenylsulfone(DDS) 24.83 grams (0.10 mole); 1; two (the 4-amino-benzene oxygen methane)-1 of 3-; 1; 3; 3-tetramethyl disiloxane 47.08 grams (0.125 mole); MALEIC ANHYDRIDE 4.90 grams (0.05 mole) and 3; 3 ', 4,4 '-BPDA 58.84 gram (0.20 mole) successively joins among the DMF (542 milliliters); under nitrogen protection; stir under the room temperature after 4 hours, add 0.85 mole of diacetyl oxide of dewatering agent (80.21 milliliters); dehydration catalyst triethylamine 0.77 mole of (107.40 milliliters) and DMF362 milliliter reacted 4 hours down in 60 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 121.17 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 100 grams and diallyl bisphenol 5.80 grams, after the two is mixed, be dissolved among the DMF (505 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 7
With 4; 4 '-diaminodiphenyl oxide 28.03 grams (0.14 mole); 1; 6-hexanediamine 9.30 grams (0.08 mole); MALEIC ANHYDRIDE 3.92 grams (0.04 mole) and 3; 3 '; 4; 4 '-BPDA 29.42 grams (0.10 mole); 3; 3 ', 4,4 '-phenyl ether tetracarboxylic dianhydride 31.06 gram (0.10 mole) successively joins among the NMP (407 milliliters); under nitrogen protection; stir under the room temperature after 11 hours, add 0.79 mole of diacetyl oxide of dewatering agent (74.54 milliliters); 271 milliliters of dehydration catalyst triethylamine 0.63 mole (87.86 milliliters) and NMP are in 50 ℃ of reactions 8 hours down; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 85.21 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 50 grams and diallyl bisphenol 2.8 grams, after the two is mixed, be dissolved among the NMP (270 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 8
With 2; two [(4-amino-benzene oxygen) phenyl] propane 82.10 grams (0.20 mole) of 2-; 1; two (the 4-amino-benzene oxygen methane)-1 of 3-; 1; 3; 3-tetramethyl disiloxane 94.15 grams (0.25 mole); MALEIC ANHYDRIDE 9.81 grams (0.10 mole) and phenyl ether tetracarboxylic dianhydride 62.13 grams (0.20 mole); 3; 3 '; 4; 4 '-benzophenone tetracarboxylic dianhydride 64.53 gram (0.20 mole) successively joins among the DMSO (1250 milliliters); under nitrogen protection; stir under the room temperature after 16 hours, add 1.53 moles of diacetyl oxides of dewatering agent (144.37 milliliters); dehydration catalyst triethylamine 1.07 moles of (149.22 milliliters) and DMSO835 milliliters reacted 7 hours down in 70 ℃; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 278.2 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 250 grams and diallyl bisphenol 13.0 grams, after the two is mixed, be dissolved among the DMF (1120 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 9
With 1; two (3-aminopropane base) tetramethyl disiloxane 49.70 grams (0.20 mole) of 3-; 1; two (4-amino-benzene oxygen) benzene 29.23 grams (0.10 mole) of 4-; 2; two [(4-amino-benzene oxygen) phenyl] propane 20.52 grams (0.05 mole) of 2-; MALEIC ANHYDRIDE 9.81 grams (0.10 mole) and 3; 3 '; 4; 4 '-BPDA 29.42 grams (0.10 mole); 3; 3 '; 4; 4 '-benzophenone tetracarboxylic dianhydride 32.26 grams (0.10 mole); 3; 3 ', 4,4 '-phenyl ether tetracarboxylic dianhydride 31.06 gram (0.10 mole) successively joins among the DMAc (808 milliliters); under nitrogen protection; stir under the room temperature after 13 hours, add 1.05 mole 1 of diacetyl oxide of dewatering agent (99.08 milliliters); 538 milliliters of dehydration catalyst triethylamine 1.05 moles (146.43 milliliters) and DMAc are in 60 ℃ of reactions 7 hours down; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 147.52 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 120 grams and diallyl bisphenol 10 grams, after the two is mixed, be dissolved among the DMAc (520 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
Embodiment 10
With 1; 6-hexanediamine 11.62 grams (0.10 mole); 1; two (the 4-amino-benzene oxygen methane)-1 of 3-; 1; 3; 3-tetramethyl disiloxane 75.32 grams (0.20 mole); 4; 4 '-diaminodiphenyl oxide 12.01 grams (0.06 mole); two [4-(4-phenoxy group) phenyl] sulfone 32.03 grams (0.08 mole); MALEIC ANHYDRIDE 7.85 grams (0.08 mole) and 2; 2 '-it is two that [4-(3; 4-dicarboxyl phenoxy group) phenyl] propane tetracarboxylic dianhydride 52.05 grams (0.10 mole); 3,3 ', 4; 4 '-phenyl ether tetracarboxylic dianhydride 62.13 grams (0.20 mole); 3; 3 ', 4,4 '-benzophenone tetracarboxylic dianhydride 32.26 gram (0.10 mole) successively joins among the NMP (1140 milliliters); under nitrogen protection; stir under the room temperature after 15 hours, add 1.50 moles of diacetyl oxides of dewatering agent (141.54 milliliters); 761 milliliters of dehydration catalyst triethylamine 0.90 mole (125.51 milliliters) and NMP are in 60 ℃ of reactions 8 hours down; be poured in the dehydrated alcohol of a large amount of high-speed stirring, obtain throw out.After the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying got 255.66 gram maleimide end-sealed type polyimide resins.
Take by weighing above-mentioned maleimide end-sealed type polyimide resin 200 grams and diallyl bisphenol 9 grams, after the two is mixed, be dissolved among the DMAc (1040 milliliters), fully stir into homogeneous phase solution.This solution is coated on the Copper Foil of 35 micron thickness, control liquid film thickness after solvent evaporates is 10 microns～30 microns, in high temperature oven; carry out gradient increased temperature under nitrogen protection, temperature-rise period is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour; 180 ℃ * 1 hour, 260 ℃ * 1 hour.Slowly cool to room temperature and promptly get the gum-free two-layer method flexibility coat copper plate.
The test performance of the gum-free two-layer method flexibility coat copper plate of above-mentioned examples preparation is as shown in table 1.
The test performance of table 1 gum-free two-layer method flexibility coat copper plate
| Test event | Test condition | Unit | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 | Embodiment 9 | Embodiment 10 | Testing method |
| Thermal expansivity | 100-2 00℃ | ppm | 17 | 21 | 20 | 16 | 20 | 25 | 26 | 19 | 21 | 24 | TMA |
| Second-order transition temperature | A | ℃ | 276 | 282 | 278 | 283 | 281 | 274 | 278 | 276 | 288 | 283 | DSC |
| Flame resistivity | A | - | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL94 |
| Dimensional stability | MD | ％ | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | IPC-TM-65 0，NO.2.2.4 |
| TD | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | ＜0.05 | |||
| Anti-tin-welding | 300℃ /60s | - | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | IPC-TM-65 0，NO.2.4.13 |
| Anti-bending | MD | Inferior | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | JIS6471， (0.8R、 0.5kg) |
| TD | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | ＞4000 | |||
| Surface resistivity | A | Ω | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | IPC-TM-65 0，NO.2.5.17 |
| Volume resistance | A | Ωcm | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | ＞10 14 | IPC-TM-65 0，NO.2.5.17 |
| Water-intake rate | A | ％ | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | ＜1.0 | IPC-TM-65 0，NO.2.6.2 |
| Specific inductivity | A | - | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | ＜3.5 | IPC-TM-65 0， NO.2.5.5.3 |
| Tensile strength | A | Mpa | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | ＞400 | IPC-TM-65 0，NO.2.4.19 |
| Stripping strength | A | Kgf/c m | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | ＞1.0 | IPC-TM-65 0，NO.2.4.9 |
Claims (9)
1. modified maleimide end-sealed type polyimide resin, it is characterized in that: the composition of described modified maleimide end-sealed type polyimide resin and weight proportion are:
100 parts of maleimide end-sealed type polyimide resins
4～50 parts of allylic cpds
Described allylic cpd is a kind of or the two blend in diallyl bisphenol and the diallyl bisphenol S.
2. the preparation method of the described modified maleimide end-sealed type polyimide resin of claim 1, it is characterized in that, preparation process is: with diamine, MALEIC ANHYDRIDE and tetracarboxylic dianhydride are (n+1) by the amount of substance ratio: 2: n successively joins in the polar solvent, making its solid content is 25 ± 1% (grams per milliliters), under nitrogen protection, after stirring 8～24 hours under the room temperature, generate the intermediate polyamic acid, add dewatering agent diacetyl oxide and dehydration catalyst triethylamine and polar solvent immediately, make its solid content reduce to 15% (grams per milliliter), again in 30 ℃～80 ℃ following chemical imidization reactions 4～16 hours, reaction solution is poured in the dehydrated alcohol of high-speed stirring, obtain throw out, after the gained throw out was successively used dehydrated alcohol and anhydrous diethyl ether thorough washing, vacuum-drying promptly got the maleimide end-sealed type polyimide resin; Perhaps with the intermediate polyamic acid that generates under the effect of entrainer orthodichlorobenzene, chlorobenzene or toluene, carry out hot cyclodehydration and obtain the maleimide end-sealed type polyimide resin product, reaction process as the formula (1),
In the formula, n is the resin polymerization degree, 1≤n≤20; Tetracarboxylic dianhydride is O (CO)
2R
1(CO)
2Diamine is H
2N-R
2-NH
2
Used tetracarboxylic dianhydride is 3,3 ', 4,4 '-BPDA, 3,3 ', 4,4 '-benzophenone tetracarboxylic dianhydride, 3,3 ', 4,4 '-phenyl ether tetracarboxylic dianhydride, 2,2 '-two [4-(3,4-dicarboxyl phenoxy group) phenyl] propane tetracarboxylic dianhydride and 2,2 '-two (3,4-two carboxyphenyls) HFC-236fa tetracarboxylic dianhydride, five amount can not be zero simultaneously, and wherein any one amount of substance mark that accounts for the tetracarboxylic dianhydride blend is 0%～100%;
Used diamine is 1,6-hexanediamine, 1, two (the 3-aminopropane base) tetramethyl disiloxanes, 1 of 3-, two (the 4-amino-benzene oxygen methane)-1 of 3-, 1,3,3-tetramethyl disiloxane, 3,4 '-diaminodiphenyl oxide, 4,4,4,1, two (4-amino-benzene oxygen) benzene, 2 of 4-, two [(4-amino-benzene oxygen) phenyl] propane of 2-and two [4-(4-phenoxy group) phenyl] sulfone, nine amount can not be zero simultaneously, wherein any one amount of substance mark that accounts for the diamine blend is 0%～100%;
Reacting used polar solvent is N-N-methyl-2-2-pyrrolidone N-, N, N '-dimethyl formamide, N, a kind of or several mixtures in N '-N,N-DIMETHYLACETAMIDE, the dimethyl sulfoxide (DMSO);
Described dewatering agent diacetyl oxide consumption is 2～4 times of diamine amount of substance; Described dehydration catalyst triethylamine consumption is 0.2～1 times of diacetyl oxide amount of substance.
3. the preparation method of modified maleimide end-sealed type polyimide resin according to claim 2 is characterized in that: described chemical imidization temperature of reaction is 50 ℃～70 ℃.
4. the preparation method of modified maleimide end-sealed type polyimide resin according to claim 2 is characterized in that: the described chemical imidization reaction times is 6～8 hours.
5. the application of the described modified maleimide end-sealed type polyimide resin of claim 1; it is characterized in that: be applied on the gum-free two-layer method flexibility coat copper plate; usage is that maleimide end-sealed type polyimide resin according to claim 1 and allylic cpd ratio of weight and number take by weighing raw material; after the two mixing; be dissolved in the polar solvent; fully stir; forming solid content is the homogeneous phase solution of 10%～50% (grams per milliliter); this solution is coated on the Copper Foil of 5 microns～35 micron thickness; control liquid film thickness after solvent evaporates is 10 microns～30 microns; in high temperature oven, under nitrogen protection, carry out gradient increased temperature and solidify promptly.
6. the application of modified maleimide end-sealed type polyimide resin according to claim 5, it is characterized in that: the polar solvent that is used for soluble modified maleimide end-sealed type polyimide resin is N-N-methyl-2-2-pyrrolidone N-, N, N '-dimethyl formamide, N, a kind of or several mixtures in N '-N,N-DIMETHYLACETAMIDE, the dimethyl sulfoxide (DMSO).
7. the application of modified maleimide end-sealed type polyimide resin according to claim 5 is characterized in that: the solid content of described modified maleimide end-sealed type polyimide resin homogeneous phase solution is 20%～30% (grams per milliliter).
8. the application of modified maleimide end-sealed type polyimide resin according to claim 5 is characterized in that: described gradient increased temperature curing process is: 80 ℃ * 1 hour, and 120 ℃ * 1 hour, 180 ℃ * 1 hour, 260 ℃ * 1 hour.
9. the application of modified maleimide end-sealed type polyimide resin according to claim 5 is characterized in that: the adhesive surface of used Copper Foil has carried out chemistry or physics roughened.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105153127A (en) * | 2015-10-13 | 2015-12-16 | 中国科学院兰州化学物理研究所 | Polyimide oligomer capable of quick photocuring and preparation method and application thereof |
| CN108003084A (en) * | 2017-12-21 | 2018-05-08 | 浦拉司科技（上海）有限责任公司 | A kind of synthetic method of maleimide |
| CN108586744A (en) * | 2018-05-08 | 2018-09-28 | 深圳飞世尔新材料股份有限公司 | A kind of transparent polyimide film and preparation method thereof |
| CN112911817A (en) * | 2021-01-20 | 2021-06-04 | 南昌欧菲显示科技有限公司 | Manufacturing method of flexible copper clad laminate |
-
2007
- 2007-09-06 CN CN200710053151A patent/CN100582143C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105153127A (en) * | 2015-10-13 | 2015-12-16 | 中国科学院兰州化学物理研究所 | Polyimide oligomer capable of quick photocuring and preparation method and application thereof |
| CN108003084A (en) * | 2017-12-21 | 2018-05-08 | 浦拉司科技（上海）有限责任公司 | A kind of synthetic method of maleimide |
| CN108586744A (en) * | 2018-05-08 | 2018-09-28 | 深圳飞世尔新材料股份有限公司 | A kind of transparent polyimide film and preparation method thereof |
| CN112911817A (en) * | 2021-01-20 | 2021-06-04 | 南昌欧菲显示科技有限公司 | Manufacturing method of flexible copper clad laminate |
| CN112911817B (en) * | 2021-01-20 | 2022-03-11 | 南昌欧菲显示科技有限公司 | Manufacturing method of flexible copper clad laminate |
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|---|---|
| CN100582143C (en) | 2010-01-20 |
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