CN101132013A - Optical transducer packaging structure and optical sensing module - Google Patents
Optical transducer packaging structure and optical sensing module Download PDFInfo
- Publication number
- CN101132013A CN101132013A CNA2006101113549A CN200610111354A CN101132013A CN 101132013 A CN101132013 A CN 101132013A CN A2006101113549 A CNA2006101113549 A CN A2006101113549A CN 200610111354 A CN200610111354 A CN 200610111354A CN 101132013 A CN101132013 A CN 101132013A
- Authority
- CN
- China
- Prior art keywords
- optical sensing
- framework
- substrate
- sensing chip
- photic zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Microscoopes, Condenser (AREA)
Abstract
The present invention is an optic-sensor package and an optic-sensing module. The optic-sensing chip is packed by substrate, frames and optic-transparent layer: the frame is set on the substrate and around the optic-sensing chip, and top of the frame extends to the optic-sensing chip and out of a fixing structure of which profile is 'L' type; bending part of the fixing structure forms a container space which can contain and locate the optic-transparent layer. The package has simple structure, is easy to be shaped, and is good for point colloid and sealing. In addition, when the optic-sensor package and lens group are combined into optic-sensing module, smaller size of lens substrate can be used to reduce package area.
Description
Technical field
The present invention relates to a kind of encapsulation structure of optical sensor, relate in particular to a kind of encapsulation structure of optical sensor and optical sensing module that reduces package area.
Background technology
As shown in Figure 1, traditional CMOS optical sensor (CMOS image sensor) encapsulating structure, comprise substrate 10, framework 20, optical sensing chip 30 and transparent glass 40, substrate 10 surfaces have several metal lines 11, framework 20 is attached on the substrate 10, its adhesion is first colloid layer 12,30 of optical sensing chips are attached on the substrate 10, and optical sensing chip 30 has optical sensing area 31, optical sensing chip 30 is to connect (Wire bonding) mode with routing, use metal wire 32 to be connected to the metal line 11 on substrate 10 surfaces, make optical sensing chip 30 do electrically to link up with substrate 10, transparent glass 40 is covered on the substrate 10, and its adhesion is second colloid layer 13, this encapsulating structure can completely cut off external contaminant, makes the CMOS optical sensor external environment of sensing really.
Yet the package area of above-mentioned encapsulating structure and volume are subjected to many restrictions, and are unfavorable for being applied on the portable product; At first, optical sensing chip 30 and substrate 10 are when doing the metal routing, because optical sensing chip 30 counterpart substrates 10 have a height fall, therefore must correspondence go out a routing apart from the S1 requirement.Moreover, because traditional encapsulation procedure is that framework is attached to earlier on the substrate, touch framework 20 for avoiding routing head (Capillary), must keep a segment distance S2 between the metal line 11 on framework 20 and the substrate 10.And, because encapsulating structure had a clean contaminants action before doing involution (Seal) transparent glass 40, to avoid its inside to have pollutant (Particle) to exist, so optical sensing chip 30 and framework 20 can not be very little apart from S2, easy-clear is unclean otherwise can cause pollutant between optical sensing chip 30 and the framework 20.
Afterwards, then develop and the optical sensor packaged type that some can reduce encapsulation volume.For example, a kind of encapsulation procedure is to utilize earlier optical sensing chip to be installed on after the substrate, just framework is adhered on the substrate, saves structure dress size; When assembling with general lens set, be still and directly microscope base be installed in the framework outside, its relative volume still can't be dwindled.Perhaps, it is to be respectively equipped with groove in the medial and lateral of frame roof that a kind of packaging structure is arranged, and so that transparent glass and microscope base to be installed, but the structure of its framework is in injection molding manufacture procedure and be not easy to make, and, also waste the dimensional space of unnecessary framework periphery in order to hold microscope base.
Another encapsulating structure, then be that frame roof is extended out toward the optical sensing chip horizontal direction, its partial design that extends out has two road grooves, bear in interior for microscope base and transparent glass respectively, the size of the lens set assembling of this encapsulating structure can be less than frame size, but its encapsulation precision requires high, need comparatively accurate production board, in addition, because the optical sensing area of the very close optical sensing chip in the position that its transparent glass and frame groove are followed, in a glue processing procedure, have the doubt that the glue material flows to the optical sensing chip surface easily, and yield and quality are produced in influence.
Summary of the invention
Main purpose of the present invention is to provide a kind of encapsulation structure of optical sensor and optical sensing module, its framework top is toward the optical sensing chip direction and up to extend section be L shaped fastening part, the formed shallow storage space in the corner of this fastening part can be in order to ccontaining and location photic zone, and the lens set of the reduced size of can arranging in pairs or groups assembling, use and dwindle package area, can satisfy the package requirements of optical sensor miniaturization.
Another object of the present invention is to provide a kind of encapsulation structure of optical sensor and optical sensing module, it is L shaped fastening part that its framework top has section, the then position of photic zone and framework can be limited in the formed shallow storage space in fastening part corner, therefore help a glue operation, can reduce the situation that the glue material flows to the optical sensing chip surface, make and produce yield and steady quality.
Another object of the present invention is to provide a kind of encapsulation structure of optical sensor and optical sensing module, it is L shaped fastening part that its framework top has section, its simple in structure, easy making, and the easy contraposition of packaging operation process, do not need too accurate production board, can save production cost.
For reaching above-mentioned purpose, the disclosed encapsulation structure of optical sensor of the present invention includes substrate, optical sensing chip, photic zone and framework.Substrate surface has several metal lines, optical sensing chip is installed on the substrate, and electrically connect by the metal line of a described metal wire and substrate surface, photic zone is positioned at the top of optical sensing chip, framework then is installed on the substrate and is positioned at the periphery of optical sensing chip, and the framework top is toward the optical sensing chip direction and up to extend a section be L shaped fastening part, and has formed a shallow storage space in the corner of fastening part, in order to ccontaining and location photic zone; Because fastening part is positioned at the framework inboard, can avoid unnecessary frame size waste.
In addition, the present invention can cooperate the lens set of reduced size to be assembled into optical sensing module, in the embodiment for example provided by the present invention, the outside, bottom of the microscope base of lens set has a short slot, can be fastened in the inboard of the fastening part of framework, the area and the volume of overall package structure are reduced, and then reach the encapsulation of optical sensor miniaturization.
Compared with prior art, the present invention has the following advantages:
At first, the present invention is ccontaining and be positioned in the formed shallow storage space in corner of fastening part with photic zone, and the lens set of the reduced size of can arranging in pairs or groups is assembled into optical sensing module, can dwindle package area, satisfies the package requirements of optical sensor miniaturization.
Secondly, the present invention is limited to the then position of photic zone and framework in the formed shallow storage space in fastening part corner, helps carrying out of glue operation.
Once more, the present invention can further avoid the glue material to overflow to the situation on optical sensing chip surface by the height of framework top upper limb is brought up to the height that is higher than the photic zone upper limb, makes and produces yield and steady quality.
For making purpose of the present invention, structural feature and function thereof are had further understanding, existing conjunction with figs. is described in detail as follows:
Description of drawings
Fig. 1 is the schematic diagram of traditional CMOS packaging structure of light-sensing chip;
Fig. 2 is the schematic diagram of the packaging structure of light-sensing chip that provides of the embodiment of the invention;
Fig. 3 is the schematic diagram that the packaging structure of light-sensing chip that provides of the embodiment of the invention and lens set are assembled into optical sensing module.
Among the figure,
10 substrates, 11 metal lines
12 first colloid layers, 13 second colloid layers
20 frameworks, 30 optical sensing chips
31 optical sensing areas, 32 metal wires
40 transparent glass, 50 substrates
51 metal lines 52 are electroplated perforation
54 adhesion layers, 55 colloid layers
60 optical sensing chips, 62 optical sensing areas
63 metal wires, 70 photic zones
80 frameworks, 81 fastening parts
82 shallow storage space, 90 microscope bases
91 lens barrels, 92 short slots
93 eyeglasses, 94 open-works
Embodiment
As shown in Figure 2, be the schematic diagram of the encapsulation structure of optical sensor that embodiments of the invention provided.This encapsulation structure of optical sensor is made of with photic zone 70 substrate 50, optical sensing chip 60, framework 80.
Wherein, the material of substrate 50 can be BT (Bismaleimide Triazine) resin, FR5 resin or ceramic material, the surface all is provided with several metal lines 51 with lower surface on the substrate 50, and these metal lines 51 are that the plating perforation 52 that passes substrate 50 is electrical connected.60 of optical sensing chips see through adhesion layer 54 and are attached to substrate 50 upper surfaces, and its surface has an optical sensing area 62, and see through the mode that routing engages, and use metal wire 72 connection metal lines 51 and substrate 50 to electrically connect.And photic zone 70 is to be arranged at optical sensing chip 60 tops by the support of framework 80, and this photic zone 70 can be transparent glass or in order to filter the eyeglass of specific optical wavelength range light source, as far infrared filtering eyeglass, to filter far-infrared light.
The framework 80 of present embodiment has special structural design; Framework 80 is installed on the substrate 50 and is positioned at optical sensing chip 60 peripheries; itself and photic zone 70 form the structure of protection optical sensing chip 60; in order to prevent that optical sensing chip 60 is subjected to the pollution of external granulometric impurity; and framework 80 tops are toward optical sensing chip 60 directions and up to extend a section be L shaped fastening part 81; and the corner of this fastening part 81 has formed a shallow storage space 82, can be in order to ccontaining and location photic zone 70.At this, photic zone 70 can see through colloid layer (Glue Layer) 55 and is attached in the above-mentioned fastening part 81 formed shallow storage space 82, and colloid layer 55 can be UV glue or thermmohardening glue.
In the present embodiment, fastening part 81 is the inboards that are positioned at framework 80, so can not cause the waste of unnecessary framework 80 sizes, and owing to the then position of photic zone 70 with framework 80 is limited in the formed shallow storage space 82 in fastening part 81 corners, to help carrying out of a glue operation, more avoid the overflow of glue material to optical sensing chip 60 surfaces, and in order further to reduce the generation probability of this glue material flooded conditions, present embodiment is brought up to the height that is higher than photic zone 70 upper limbs with the height of framework 80 top upper limbs, produces the stable of yield and quality to keep.
In addition, present embodiment have a framework 80 that section is L shaped fastening part 81, only be the simple geometric structure, not only do not need complicated production process and accurate production board, and also as easy as rolling off a logly in the packaging operation of optical sensor carry out contraposition, can save down many processing procedure costs.
Moreover encapsulation structure of optical sensor of the present invention can cooperate the lens set assembling of reduced size, can reduce the volume and the area of overall optical sensing module, with the demand of the miniaturization encapsulation of satisfying optical sensor.
As shown in Figure 3, the schematic diagram that is combined as optical sensing module for encapsulation structure of optical sensor that embodiments of the invention provided and lens set.The lens set of present embodiment includes microscope base 90 and lens barrel 91, wherein microscope base 90 is the saturating empty ducted bodies in two ends, its outside, bottom is provided with short slot 92, can be fastened in the inboard of the fastening part 81 of aforesaid frame 80, and the length of this microscope base 90 and wide size can be less than or equal to the length and the wide size of framework 80; And lens barrel 91 comprises eyeglass 93 and open-work 94; after eyeglass 93 can receive light source by open-work 94; with light-resource fousing and be sent to optical sensing chip 60; and lens barrel 91 is to be sheathed in the microscope base 90 in mobilizable mode; use and lens barrel 91 is protected and can guides or supplemental pilot lens barrel 91 is done relative displacement; adjust the relative distance of lens barrel 91, and then change the light-resource fousing imaging effect for optical sensing chip 60.
In sum, be preferred embodiment of the present invention only, be not in order to limit the present invention.Without departing from the spirit and scope of the present invention, institute does and changes and retouching, all belongs to scope of patent protection of the present invention.
Claims (14)
1. an encapsulation structure of optical sensor is characterized in that, comprises:
One substrate, surface have a plurality of metal lines;
One optical sensing chip is installed on the described substrate, and does electric connection with the described metal line on the described substrate;
One photic zone is positioned at described optical sensing chip top;
One framework, be installed on the described substrate and be positioned at described optical sensing chip periphery, and described framework top is toward described optical sensing chip direction and up to extend a section be L shaped fastening part, and forms a shallow storage space in the corner of described fastening part, in order to ccontaining and locate described photic zone.
2. encapsulation structure of optical sensor according to claim 1 is characterized in that the height of described framework top upper limb is higher than the height of described photic zone upper limb.
3. encapsulation structure of optical sensor according to claim 1 is characterized in that, described optical sensing chip uses a metal wire to be electrically connected to described metal line on the described substrate.
4. encapsulation structure of optical sensor according to claim 1 is characterized in that, described photic zone is transparent glass or filters the filtering eyeglass of specific wavelength of light.
5. encapsulation structure of optical sensor according to claim 1 is characterized in that, also comprises the colloid layer, is arranged between the described fastening part of described photic zone and described framework, in order to cohere and described photic zone of involution and described framework.
6. encapsulation structure of optical sensor according to claim 1 is characterized in that the material of described substrate is selected from BT resin, FR5 resin or ceramic material.
7. an optical sensing module is characterized in that, comprises:
One substrate, surface have a plurality of metal lines;
One optical sensing chip is installed on the described substrate, and does electric connection with the described metal line on the described substrate;
One photic zone is positioned at described optical sensing chip top;
One framework, be installed on the described substrate and be positioned at described optical sensing chip periphery, and described framework top is toward described optical sensing chip direction and up to extend a section be L shaped fastening part, and forms a shallow storage space in the corner of described fastening part, in order to ccontaining and locate described photic zone;
One microscope base is arranged on the described framework;
One lens barrel is sheathed in the described microscope base movably, to do relative displacement with respect to described optical sensing chip.
8. as optical sensing module as described in the claim 7, it is characterized in that the height of described framework top upper limb is higher than the height of described photic zone upper limb.
9. as optical sensing module as described in the claim 7, it is characterized in that described optical sensing chip uses a metal wire to be electrically connected to described metal line on the described substrate.
10. as optical sensing module as described in the claim 7, it is characterized in that described photic zone is transparent glass or filters the filtering eyeglass of specific wavelength of light.
11., it is characterized in that as optical sensing module as described in the claim 7, also comprise the colloid layer, be arranged between the described fastening part of described photic zone and described framework, in order to cohere and described photic zone of involution and described framework.
12., it is characterized in that the outside, bottom of described microscope base has a short slot, in order to be fastened in the described fastening part of described framework as optical sensing module as described in the claim 7.
13., it is characterized in that the length of described microscope base and wide size are less than or equal to the length and the wide size of described framework respectively as optical sensing module as described in the claim 7.
14., it is characterized in that the material of described substrate is selected from BT resin, FR5 resin or ceramic material as optical sensing module as described in the claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101113549A CN101132013A (en) | 2006-08-24 | 2006-08-24 | Optical transducer packaging structure and optical sensing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101113549A CN101132013A (en) | 2006-08-24 | 2006-08-24 | Optical transducer packaging structure and optical sensing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101132013A true CN101132013A (en) | 2008-02-27 |
Family
ID=39129192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101113549A Pending CN101132013A (en) | 2006-08-24 | 2006-08-24 | Optical transducer packaging structure and optical sensing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101132013A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231382A (en) * | 2011-06-17 | 2011-11-02 | 瑞声声学科技(深圳)有限公司 | Ceramic package for image sensor and package method |
| WO2017088151A1 (en) * | 2015-11-26 | 2017-06-01 | 华为技术有限公司 | Liquid crystal display device |
| CN108155197A (en) * | 2016-11-28 | 2018-06-12 | 豪威科技股份有限公司 | System in package imaging sensor |
-
2006
- 2006-08-24 CN CNA2006101113549A patent/CN101132013A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231382A (en) * | 2011-06-17 | 2011-11-02 | 瑞声声学科技(深圳)有限公司 | Ceramic package for image sensor and package method |
| WO2017088151A1 (en) * | 2015-11-26 | 2017-06-01 | 华为技术有限公司 | Liquid crystal display device |
| CN108292054A (en) * | 2015-11-26 | 2018-07-17 | 华为技术有限公司 | A kind of liquid crystal display device |
| CN108155197A (en) * | 2016-11-28 | 2018-06-12 | 豪威科技股份有限公司 | System in package imaging sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7297918B1 (en) | Image sensor package structure and image sensing module | |
| CN100561736C (en) | The imaging modules of encapsulation structure for image sensor and application thereof | |
| CN101950751A (en) | Image sensor and encapsulating method thereof | |
| CN101303444A (en) | Camera module group and assembling method thereof | |
| EP3985962A2 (en) | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | |
| CN1175497C (en) | Optical semiconductor device and optical semiconductor module assemblied using same | |
| CN103996684A (en) | Image sensor structure and packaging method thereof | |
| CN101285921A (en) | Image-forming module group | |
| CN101286520A (en) | Image sensing wafer packaging structure and encapsulation method thereof | |
| EP3477352A1 (en) | Fixed-focus camera module and manufacturing method therefor | |
| US20120249822A1 (en) | Solid-state imaging unit, method of manufacturing solid-state imaging unit, and electronic apparatus | |
| CN1248130A (en) | Camera assembly | |
| JP2012222546A (en) | Solid-state imaging device, method for manufacturing the same, and electronic apparatus | |
| CN100483725C (en) | Image sensing device packaging digital camera module group using the same | |
| CN101281284A (en) | Camera module group | |
| CN101958598B (en) | Voice coil motor assembly | |
| CN206807579U (en) | Split type array camera module | |
| CN101436603A (en) | Imaging die set | |
| CN101132013A (en) | Optical transducer packaging structure and optical sensing module | |
| US7342215B2 (en) | Digital camera module package fabrication method | |
| US20070194439A1 (en) | Solid-state imaging device, fabrication method of the same, and camera module | |
| CN1921125A (en) | Packaging structure for optical sensing assembly and method of manufacture | |
| CN209982562U (en) | Photosensitive assembly, camera module and electronic equipment with camera module | |
| CN103091808A (en) | Focusing-free optical camera module | |
| US20070034784A1 (en) | Photosensitive device that easily achieves a required photosensitive response |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |