CN101121252A - Novel metal binding agent diamond tool and its preparation method - Google Patents
Novel metal binding agent diamond tool and its preparation method Download PDFInfo
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- CN101121252A CN101121252A CNA2006100375099A CN200610037509A CN101121252A CN 101121252 A CN101121252 A CN 101121252A CN A2006100375099 A CNA2006100375099 A CN A2006100375099A CN 200610037509 A CN200610037509 A CN 200610037509A CN 101121252 A CN101121252 A CN 101121252A
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Abstract
The present invention discloses a novel metal bond diamond tools; the diamond tool takes A1 as the basic component and consists of metal bond and diamond mill grain; the present invention is characterized in that the metal bond takes A1 as the basic component and comprises the following components (weight percent): A1: 20 to 90 percent; Sn: 7 to 30 percent. The present invention also provides the manufacturing process for the metal bond diamond tool mentioned above. The diamond tool mentioned above is characterized in that the grinding is sharp which can not be blocked and the noise is little; the four sides of the repaired ceramic tiles are level and smooth and the size retention is excellent which makes the side hard to bend; the service life is long which is more than 3 times longer than that of the resin diamond grinding tool of the same specifications; the production cost is low; the sintering temperature is low and energy can be saved; the production cycle is short and the manufacture is convenient.
Description
Technical field:
The present invention relates to metal binding agent diamond tool and manufacture method thereof, especially relate to the finishing that is applicable to relevant material and the aluminium based metal binding agent diamond tool of polishing.
Technical background:
Resinoid bond diamond tool and metal binding agent diamond tool are used for the surface of materials such as glass, pottery or the grinding and/or the grinding (general designation " grinding " later on) of end face always.
Though resinoid bond diamond tool grinding slickness is good, in preparation and use, can work the mischief to environment and operating personnel.And, wearing no resistance, service life is short, easily makes the grinding object produce crimp and causes waste product, needs diamond tool is frequently adjusted, and wastes time and energy.In addition, though the resinoid bond diamond tool is easy to prepare, regelate is time-consuming longer, makes the production cycle long.
Being used for grinding brittle materials such as glass, pottery has with the metallic bond of metal binding agent diamond tool is disclosed: Cu-Sn system, as [patent documentation 1] Japanese kokai publication sho 58-217271 communique, [patent documentation 2] Japanese kokai publication hei 2-76680 communique, [patent documentation 3] TOHKEMY 2001-246566 communique; Fe-Cu-Sn is (as a patent documentation 1), Co-Cu-Sn system (as patent documentation 1 and 3) and Ni-Cu-Sn system (as [patent documentation 4] Japanese kokai publication hei 10-230464 communique, [patent documentation 5] Chinese patent publication number CN1541808A); For Cu-Sn is metallic bond, be to improve the cutting performance of diamond tool, and general Sn composition is more in the bond, and it is shorter to make Cu-Sn bind life-span of mixture diamond tool; Fe-Cu-Sn is the increase of metallic bond with Fe content, the ILS of diamond tool, but after carrying out the wet type grinding, the bond of the diamond tool rust of looking unfamiliar, and it is transferred to and is ground on the material to begin the back in next grinding, produces dirty; Co-Cu-Sn is the metallic bond non-corrosive, but with the increase of Co addition, becomes the scleroma mixture, and cutting is reduced, and the increase of Co content also makes the cost of diamond tool increase greatly in addition.
For Ni-Cu-Sn is metallic bond, prolongs for making the diamond tool life-span, generally sets the Ni amount higher, but with the increasing of Ni content, sintering temperature is higher.For obtaining highdensity sintered body, need apply high pressure at sintering, as use and heat indeformable graphite jig, mould oxidation under HTHP, abrasion are significantly, need frequent updating, and be fit to high-pressure sinter and little heat-resisting alloy or the heat-resisting steels of die change frequency has the sintering temperature upper limit, and make that the content of Ni is restricted in the bond, influence the service life of instrument.
Patent documentation 5 is higher than 40% Ni-Cu-Sn at ni content and adds Ag in the metallic bond sintering temperature of bond is reduced between 650 ℃～850 ℃, can adopt heat-resisting alloy or heat-resisting steels mould to carry out sintering, made the emery wheel that long service life is applicable to grinding brittle materials such as glass, pottery, but that Ni-Cu-Sn-Ag is the metallic bond cost is very high.
Summary of the invention:
The objective of the invention is in order to overcome existing resinoid bond diamond tool short service life, and the shortcoming of disclosed metal binding agent diamond tool, a kind of to have a grinding sharp and provide, grinding skin flatness and slickness are good, long service life, sintering temperature is low, and cost is low, and the Al that has the feature of environmental protection concurrently is metal binding agent diamond tool and manufacture method thereof.
The present invention achieves the above object by following technical solution: novel metal binding agent diamond tool of the present invention is with the basic ingredient of Al as bond, combined with diamond abrasive grain and constituted by metallic bond, described metallic bond comprises following composition (percentage by weight):
Al：20～90％ Sn：7～30％
Part alternative as above-mentioned Al and Sn also can add (percentage by weight) in the above-mentioned metallic bond
Cu：0～40％ Ti：0～20％
Mg：10～20％ Zn：0～10％
Ni：0～20％ Co：0～20％。
Si：1～10％
One or more combination.Described metal is the alloy that adopts pure metal powder or comprise two above components.
As the part alternative of above-mentioned Al and Sn, also can add reinforcing material such as graphite, aluminium oxide etc. (percentage by weight) 0～6% in the above-mentioned metallic bond.
In addition, the invention provides the manufacture method of metal binding agent diamond tool, it, comprising the diamond abrasive grain combination with metallic bond:
(a) take by weighing each component of aequum by the bond chemical composition, obtain the bond mixture of powders, this bond mixture of powders is mixed with diamond abrasive grain;
(b) use mould, under 200～600 ℃ to the mixture sintering of described metal dust and diamond abrasive grain.
In above-mentioned manufacture method, the granularity of diamond abrasive grain, model, concentration are selected according to the material and the processing request of processing object.
Adopt the invention has the advantages that of above-mentioned prescription and technology:
The present invention has overcome the disadvantage of resinoid bond diamond tool and disclosed metal binding agent diamond tool; it is metal binding agent diamond tool and manufacture method thereof that the present invention develops Al; having adopted the Al that well also can firmly control the diamond abrasive grain associativity is metallic bond; the product grinding is sharp; long service life, sintering temperature is low, and cost is low; help adamantine protection against oxidation and energy savings, help reducing the mould loss.It is good to be ground surface smoothness and slickness simultaneously.
Metallic bond of the present invention, the thermal conductivity or the intensity of adding Cu, Ni, Co increase bond, the toughness of interpolation Sn, Mg, increase bonds such as Zn, Ti and bond are to durability of diamond.
Specific embodiment:
Embodiment 1:
Bond is formed: Al:30% Sn:7% Cu:30%
Ti：10％ Ni：14％ Mg：4％
All the other materials 5%
Diamond: granularity 140/170, concentration 60%
According to above-mentioned bond composition and the diamond abrasive tool specification corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby.
With the powder that the mixes mould of packing into, put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 350 ℃, is incubated 30 minutes, pressure is 150 tons:
After sintering was finished, the demoulding was welded to cutter head on the alloy matrix aluminum, promptly obtained the aluminium base diamond abrasive tool of multi-block type.Embodiment 2:
Bond is formed: Al72% Sn:14%
Ti：9％ Si：3％ Co：2％
Diamond: granularity 120/140, concentration: 45%
According to above-mentioned bond composition and the diamond abrasive tool specification corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby.
With the powder that mixes and the alloy matrix aluminum mould of packing into, put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 220 ℃, is incubated 30 minutes, pressure is 150 tons:
After sintering was finished, the demoulding promptly obtained the aluminium base diamond abrasive tool of monoblock type.
Embodiment 3:
Bond is formed: Al50% Sn:10% Cu:24%
Ni：3％ Mg：10％ C：3％
Diamond: granularity 120/140, concentration: 65%
According to above-mentioned bond composition and the diamond abrasive tool specification corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby.
With the powder that the mixes mould of packing into, put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 450 ℃, is incubated 30 minutes, pressure is 120 tons:
After sintering was finished, the demoulding was welded to cutter head on the alloy matrix aluminum, promptly obtained the aluminium base diamond abrasive tool of multi-block type.
Embodiment 4:
Bond is formed: Al68% Sn:20%
Zn：8％ Ti：1％
Al
2O
3：5％
Diamond: granularity 120/140, concentration: 45%
According to above-mentioned bond composition and the diamond abrasive tool specification corresponding powder of weighing respectively, add the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby.
With the powder that mixes and the alloy matrix aluminum mould of packing into, put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 300 ℃, is incubated 10 minutes, pressure is 100 tons:
After sintering was finished, the demoulding promptly obtained the aluminium base diamond abrasive tool of monoblock type.
Embodiment 5:
Bond is formed: Al-22 Cu:74% Sn:10%
Ti：3％ Mg：10％ C：3％
Diamond: granularity 120/140, concentration: 65%
At first preparation contains the Al-Cu alloyed powder of 22%Cu, according to above-mentioned bond composition and the diamond abrasive tool specification corresponding powder of weighing respectively, adds the diamond that requires concentration amounts, add an amount of paraffin after, on batch mixer, fully mixed 24 hours, standby.
With the powder that the mixes mould of packing into, put into the sintering furnace hot pressed sintering of atmosphere protection, sintering temperature is 430 ℃, is incubated 20 minutes, pressure is 120 tons:
After sintering was finished, the demoulding was welded to cutter head on the alloy matrix aluminum, promptly obtained the aluminium base diamond abrasive tool of multi-block type.
The Al that has adopted formula range of the present invention is diamond abrasive tool, through experiment and prior art and low containing The Al base diamond grinding tool of amount is compared has significant performance advantage, and this also is that existing Al fund is firm The main cause that the stone mill tool can't be applied.
Claims (6)
1. novel metal binding agent diamond tool, with the basic ingredient of Al as bond, combine with diamond abrasive grain and constitute by metallic bond, it is characterized in that, this metallic bond is with the basic ingredient of Al as bond, and described metallic bond comprises following composition (percentage by weight):
Al：20～90％ Sn：7～30％。
2. according to the described metal binding agent diamond tool of claim 1, it is characterized in that,, also be added with the one or more combination (percentage by weight) of following composition in the above-mentioned metallic bond as the part alternative of above-mentioned Al and Sn
Cu：0～40％ Ti：0～20％
Mg：10～20％ Zn：0～10％
Ni：0～20％ Co：0～20％。
Si：1～10％
3. according to the described metal binding agent diamond tool of claim 2, it is characterized in that described metal is the alloy that adopts pure metal powder or comprise two above components.
4. according to the described metal binding agent diamond tool of claim 1, it is characterized in that,, also be added with reinforcing material 0～6% (percentage by weight) in the above-mentioned metallic bond as the part alternative of above-mentioned Al and Si.
5. a method of making each described novel metal binding agent diamond tool of claim 1-4 is characterized in that, it is with metallic bond diamond abrasive grain to be lower than 600 ℃ of combinations, comprises following processing step:
(a) take by weighing each component powders of aequum by described metallic bond chemical composition, obtain the bond mixture of powders, this bond mixture of powders is mixed with diamond abrasive grain;
(b) use mould, the mixture sintering to described metal dust and diamond abrasive grain under 200～600 ℃ gets final product.
6. as manufacture method as described in the claim 5, it is characterized in that the manufacture method of described novel metal binding agent diamond tool is first sintering cutter head, is welded on the matrix again, perhaps cold pressing powder and matrix back integral sintered, perhaps that powder and matrix direct heat is molded.
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| CNA2006100375099A CN101121252A (en) | 2006-09-06 | 2006-09-06 | Novel metal binding agent diamond tool and its preparation method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152250A (en) * | 2010-12-29 | 2011-08-17 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
| CN102240992A (en) * | 2011-06-14 | 2011-11-16 | 北京华特科园超硬材料有限公司 | Diamond grinding wheel for grinding glass, and preparation method of diamond grinding wheel |
| CN103639915A (en) * | 2013-12-27 | 2014-03-19 | 云南光电辅料有限公司 | Method of for producing sintered grinding apparatus by metallic binding agent |
| CN103692371A (en) * | 2013-12-30 | 2014-04-02 | 长沙市萨普新材料有限公司 | Metal-ceramic bond diamond grinding wheel and production method thereof |
| CN103737006A (en) * | 2013-06-28 | 2014-04-23 | 长春阿尔玛斯科技有限公司 | Method for preparing titanium-silver material |
| CN103741081A (en) * | 2013-06-28 | 2014-04-23 | 长春阿尔玛斯科技有限公司 | Preparation method of titanium-tin alloy material |
| CN105364064A (en) * | 2015-10-28 | 2016-03-02 | 武汉万邦激光金刚石工具股份有限公司 | Metallic bond diamond block steel mold heating and molding method |
| CN107598782A (en) * | 2016-07-11 | 2018-01-19 | 上海淳和投资中心（有限合伙） | A kind of metallic bond, preparation method and skive |
| CN107598787A (en) * | 2016-07-11 | 2018-01-19 | 上海淳和投资中心（有限合伙） | A kind of skive and its manufacture method |
| CN108796331A (en) * | 2017-05-05 | 2018-11-13 | 江苏锋泰工具有限公司 | The preparation method of granite saw blade tip |
| CN114516001A (en) * | 2022-01-25 | 2022-05-20 | 长沙市萨普新材料有限公司 | Diamond grinding wheel disk for thinning silicon carbide and preparation method thereof |
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2006
- 2006-09-06 CN CNA2006100375099A patent/CN101121252A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152250B (en) * | 2010-12-29 | 2015-01-21 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
| CN102152250A (en) * | 2010-12-29 | 2011-08-17 | 华侨大学 | Method for manufacturing grinding tool of abrasive particles by connection of active alloy in full-liquid state |
| CN102240992A (en) * | 2011-06-14 | 2011-11-16 | 北京华特科园超硬材料有限公司 | Diamond grinding wheel for grinding glass, and preparation method of diamond grinding wheel |
| CN103737006B (en) * | 2013-06-28 | 2015-10-07 | 长春阿尔玛斯科技有限公司 | A kind of preparation method of titanium silver alloy |
| CN103741081A (en) * | 2013-06-28 | 2014-04-23 | 长春阿尔玛斯科技有限公司 | Preparation method of titanium-tin alloy material |
| CN103737006A (en) * | 2013-06-28 | 2014-04-23 | 长春阿尔玛斯科技有限公司 | Method for preparing titanium-silver material |
| CN103741081B (en) * | 2013-06-28 | 2015-08-05 | 长春阿尔玛斯科技有限公司 | A kind of preparation method of titanium-tin alloy material |
| CN103639915A (en) * | 2013-12-27 | 2014-03-19 | 云南光电辅料有限公司 | Method of for producing sintered grinding apparatus by metallic binding agent |
| CN103692371B (en) * | 2013-12-30 | 2016-04-20 | 长沙市萨普新材料有限公司 | A kind of cermet anchoring agent diamond grinding wheel and preparation method thereof |
| CN103692371A (en) * | 2013-12-30 | 2014-04-02 | 长沙市萨普新材料有限公司 | Metal-ceramic bond diamond grinding wheel and production method thereof |
| CN105364064A (en) * | 2015-10-28 | 2016-03-02 | 武汉万邦激光金刚石工具股份有限公司 | Metallic bond diamond block steel mold heating and molding method |
| CN107598782A (en) * | 2016-07-11 | 2018-01-19 | 上海淳和投资中心（有限合伙） | A kind of metallic bond, preparation method and skive |
| CN107598787A (en) * | 2016-07-11 | 2018-01-19 | 上海淳和投资中心（有限合伙） | A kind of skive and its manufacture method |
| CN107598782B (en) * | 2016-07-11 | 2019-11-22 | 上海淳和投资中心（有限合伙） | A kind of metallic bond, preparation method and skive |
| CN107598787B (en) * | 2016-07-11 | 2019-11-26 | 上海淳和投资中心（有限合伙） | A kind of skive and its manufacturing method |
| CN108796331A (en) * | 2017-05-05 | 2018-11-13 | 江苏锋泰工具有限公司 | The preparation method of granite saw blade tip |
| CN114516001A (en) * | 2022-01-25 | 2022-05-20 | 长沙市萨普新材料有限公司 | Diamond grinding wheel disk for thinning silicon carbide and preparation method thereof |
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Open date: 20080213 |