CN101115367A - Heat radiating device - Google Patents

Heat radiating device Download PDF

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Publication number
CN101115367A
CN101115367A CNA200610061864XA CN200610061864A CN101115367A CN 101115367 A CN101115367 A CN 101115367A CN A200610061864X A CNA200610061864X A CN A200610061864XA CN 200610061864 A CN200610061864 A CN 200610061864A CN 101115367 A CN101115367 A CN 101115367A
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CN
China
Prior art keywords
radiator
fin
section
heat abstractor
cooling blast
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA200610061864XA
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Chinese (zh)
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CN101115367B (en
Inventor
黄清白
孟劲功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200610061864A priority Critical patent/CN101115367B/en
Publication of CN101115367A publication Critical patent/CN101115367A/en
Application granted granted Critical
Publication of CN101115367B publication Critical patent/CN101115367B/en
Expired - Fee Related legal-status Critical Current
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A cooling device is used for cooling down the heat generated by electronic components, which comprises a cooling fan and a radiator, the fan is used for producing cooling airflow to mandatory cooling for the radiator, wherein, the radiator is a folding radiator, the radiator comprises a plurality of cooling pieces, the space size between the cooling pieces is inversely proportional to the intensity of the cooling airflow. The cooling device of the invention has the advantage of higher cooling efficiency.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applicable to heat-generating electronic elements.
Background technology
Current, along with developing rapidly of computer industry, the heat that heat-generating electronic elements such as little process chip produce is more and more many, for the heat that these are unnecessary effectively distributes, existing method is the radiator that is sticked on the surface of heat-generating electronic elements, forces to leave at the auxiliary heat that down heat-generating electronic elements is produced of radiator fan.Please refer to Fig. 6, it is depicted as a kind of existing heat abstractor 40, this heat abstractor 40 comprises a radiator fan 42 and a radiator 44, this radiator 44 have some fin that are arranged in parallel 442 and with a heat-generating electronic elements (figure do not show) thermo-contact, to absorb the heat that this heat-generating electronic elements produces, this radiator fan 42 comprises a housing 422, a stator (figure does not show) and a rotor 423, the housing 422 of this radiator fan 42 is formed with an air outlet 421, and this radiator 44 is positioned at this air outlet 421 places.When this radiator fan 42 turned round counterclockwise, rotor 423 produced 46 pairs of these radiators 44 of cooling blasts and carries out forced heat radiation.
As shown in Figure 6, because the fin 442 of this radiator 44 is arranged in parallel and spacing equates, and in the air outlet 421 everywhere the intensity of cooling blast 46 do not wait, and between the flow direction of the fin 442 of airflow downstream and cooling blast 46, there is certain angle, thereby cause the flow resistance of this radiator 44 higher, finally reduce the radiating efficiency of this heat abstractor 40.
Summary of the invention
In view of this, be necessary the heat abstractor that provides a kind of radiating efficiency higher.
This heat abstractor, be used to distribute the heat that electronic component produces, comprise a radiator fan and a radiator, this radiator fan is used to produce cooling blast this radiator is carried out forced heat radiation, wherein, this radiator is a collapsible radiator, and this radiator comprises some fin, and the spacing size between the described fin is to the setting that is inversely proportional to of intensity size that should cooling blast.
This heat abstractor comprises a centrifugal radiator fan and a radiator, this radiator fan has an air outlet, this radiator is arranged at this air outlet place, the cooling blast that this radiator fan produces blows to this radiator via this air outlet, wherein, this radiator is bent to form continuously by sheet metal, it comprises a fine and close section and a loose section, this densification section is located at the upstream of this cooling blast, the section of should loosening is positioned at the downstream of this cooling blast, and the spacing in this loose section between the fin is greater than the spacing of fin in this densification section.
Compared with prior art,, reduce the flow resistance of radiator, improve the radiating efficiency of fin, thereby make this heat abstractor have advantage of higher cooling efficiency by setting to the spacing between the fin.
Description of drawings
Be further described in conjunction with the embodiments with reference to the accompanying drawings:
Fig. 1 is the three-dimensional exploded view of heat abstractor first embodiment of the present invention.
Fig. 2 is the vertical view after heat abstractor shown in Figure 1 removes loam cake.
Fig. 3 is the three-dimensional combination figure of heat abstractor shown in Figure 1.
Fig. 4 is the three-dimensional exploded view of heat abstractor second embodiment of the present invention.
Fig. 5 is the vertical view after heat abstractor shown in Figure 4 removes loam cake.
Fig. 6 is the vertical view after an existing heat abstractor removes loam cake.
Embodiment
Figure 1 shows that the three-dimensional exploded view of heat abstractor first embodiment of the present invention, this heat abstractor 100 comprises a radiator 10 and a radiator fan 20.Wherein, this radiator 10 and a heat-generating electronic elements (figure does not show) hot link, this radiator 10 is collapsible radiators, by single sheet metal (as aluminum metal film) through being bent to form continuously, it has some fin 12, these fin 12 keep at a certain distance away and arrange in row mutually, and this radiator fan 20 is used for this radiator 10 is carried out forced heat radiation.
This radiator fan 20 is a centrifugal radiator fan, comprises a housing 22, a stator (figure does not show) and a rotor 24, and this stator and this rotor 24 are installed in this housing 22, and this rotor 24 comprises some flabellum 24a.
This housing 22 comprises a loam cake 222, a bottom 224 and a sidewall 226.This loam cake 222 is provided with a fresh air inlet 222a, and this bottom 224 is provided with some fresh air inlet 224a.This sidewall 226 is one " U " type structure, and forms a semi-closed structure with rectangle air outlet 221 with this bottom 224 and loam cake 222.Wherein, the height of these air outlet 221 place's sidewalls 226 is higher than the height of other local sidewalls 226, so that accommodate this radiator 10.
Please refer to Fig. 2, this stator and this rotor 24 are installed in this housing 22 prejudicially, the outermost end of these flabellums 24a and this sidewall 226 keep at a certain distance away and form a runner 223, for improving the flow velocity of the cooling blast 30 that rotor 24 produces, along counterclockwise direction promptly on the flow direction of this cooling blast 30, this runner 223 broadens gradually.At these runner 223 the widest part, the flabellum 24a of this rotor 24 and this sidewall 226 form first-class road outlet 223a, with the relative opposite side of this runner exit 223a, this sidewall 226 is in being provided with a tongue mouth 223b triangular in shape near the position of air outlet 221 to rotor 24 projections.
Please refer to Fig. 1 and Fig. 2, this radiator 10 is arranged at corresponding to this rotor 24 in the air outlet 221 of this housing 22, and this radiator 10 is the two-part structure, and it has a fine and close section 12a and a loose section 12b.This densification section 12a is to being provided with by runner exit 223a, and this loose section 12b is to being provided with by tongue mouth 223b.This radiator 10 aligns with the outermost end of the air outlet 221 of this housing 22 away from an end of this radiator fan 20, the fin 12 of this densification section 12a is longer and stretch in this runner exit 223a than the fin 12 of loose section 12b, and the spacing among this loose section 12b between the fin 12 is greater than the spacing between the fin 12 among this densification section 12a.
Please refer to Fig. 3, this radiator 10 is arranged in the air outlet 221 of this housing 22, and the loam cake 222 of this housing 22 and bottom 224 be close to the upper and lower end face of this radiator 10, cooperates with these fin 12 to form runner and pass through for cooling blast 30.
By above narration as can be known, because this runner 223 broadens in the counterclockwise direction gradually, make when rotor 24 rotates, runner exit 223a place is that the cooling blast 30 of upstream has maximum flow velocity, correspondingly, the fin 12 of the fine and close section 12a of this radiator 10 has maximum length and minimum spacing, and the flow direction of the cooling blast 30 of upstream is substantially parallel with the fin 12 among the corresponding densification section 12a, improves the radiating efficiency of this densification section 12a effectively.In addition, extremely be somebody's turn to do a loose section 12b from this densification section 12a, the length of these fin 12 reduces and spacing increases, the cooling blast 30 that makes close this tongue mouth 223b promptly be positioned at low flow velocity zone, downstream is easier to flow through, the cooling blast 30 that remedies the downstream is owing to existing angle to cause the defective that flow velocity descends with fin 12, reduce the flow resistance of low flow velocity zone radiator 10 effectively, promptly by with the spacing size between the fin 12 to the setting that is inversely proportional to of intensity size that should cooling blast 30, make the spacing of fine and close section 12a of the bigger upstream airflow correspondence of intensity less, and the spacing of the less pairing loose section 12b of downstream airflow of intensity is bigger, reduce the flow resistance of these radiator 10 integral body, improve the radiating efficiency of this heat abstractor 100.
Please refer to Fig. 4, it is depicted as the three-dimensional exploded view of heat abstractor second embodiment of the present invention, the difference of itself and first embodiment is: this sidewall 227 is an arcuate structure, and itself and this loam cake 225 and bottom 229 are formed a semi-closed structure with arc air outlet 221b.This radiator 10a is a collapsible radiator, and it has some fin 11, and this radiator 10a is to should the curved arrangement of air outlet 221b.Same, this radiator 10a comprises a loose section 11b who is positioned at the fine and close section 11a of cooling blast 30 upstreams and is positioned at cooling blast 30 downstreams and is connected with this densification section 11a.The spacing of the loose section of gap ratio between the fin 11 of this densification section 11a 11b is little, and length is longer than loose section 11b, and the fin 11 of this densification section 11a stretches in this runner exit 223a.
Please refer to Fig. 5, this radiator 10a is circular-arc inner edge 13 near the end formation one of this rotor 24, this inner edge 13 keeps roughly the same distance with the end of the flabellum 24a of this rotor 24, this radiator 10a forms two orthogonal outsides 15,17 away from an end of this rotor 24, passes through a breach 19 transition between this two outside 15,17.This radiator 10a is to should runner exit 223a place being that the spacing of fin 11a of current rate maximum is less, to improve the radiating efficiency of this place's fin 11.The fin 11 that is positioned at the fine and close section 11a of cooling blast 30 upstreams is arranged in parallel, the flow direction with corresponding cooling blast 30, the fin 11 that is positioned at the loose section 11b in cooling blast 30 downstreams then is provided with the angle of inclination, to cater to the flow direction of this downstream part cooling blast 30, make the flow direction setting of the corresponding cooling blast 30 of direction of each fin 11 of this radiator 10a, so that reduce the angle between the flow direction of fin 11 and cooling blast 30 as much as possible, thereby reduce the flow resistance of this radiator 10a, improve the radiating efficiency of this radiator 10a.Setting by this two outside 15,17 and this breach 19, make this radiator 10a to should runner exit 223a and the fin 11 at tongue mouth 223b place longer, remainder is shorter, promptly this radiator 10a is longer to fin 11 that should the higher part of cooling blast 30 wind speed, and wind speed is shorter than the fin 11 of lower part, thereby effectively reduce the flow resistance of this radiator 10a, improve the radiating efficiency of this radiator 10a.
In addition, because radiator 10 and radiator 10a among above-mentioned two embodiment are collapsible radiators, and collapsible radiator is for the radiator that piles up buckle-type radiator or other kinds, can more easily regulate angulation between length, the spacing between the fin and the fin of fin, thereby make this radiator 10 and radiator 10a have the advantage that is easy to make.Simultaneously, this collapsible radiator 10 and 10a can control and change the spacing between the fin flexibly in the processing and manufacturing process, and can be according to the shape and the length of computer volume inside structure and Flow Field Distribution situation design fin, can provide additional space to use such as the setting of breach 19 among above-mentioned second embodiment for associated uses such as installations.
In sum, setting by length, spacing and angle among this radiator 10 and the radiator 10a, reduce the flow resistance of this radiator 10 effectively, improve the area of dissipation of this radiator 10, thereby effectively improve the radiating efficiency of this heat abstractor 100, make this heat abstractor 100 have advantage of higher cooling efficiency.

Claims (12)

1. heat abstractor, be used to distribute the heat that electronic component produces, comprise a radiator fan and a radiator, this radiator fan is used to produce cooling blast this radiator is carried out forced heat radiation, it is characterized in that, this radiator is a collapsible radiator, and this radiator comprises some fin, and the spacing size between the described fin is to the setting that is inversely proportional to of intensity size that should cooling blast.
2. heat abstractor according to claim 1, it is characterized in that, this radiator fan is centrifugal fan and comprises a housing and be located at the interior some flabellums of this housing, this housing comprises a loam cake, a sidewall and a bottom, one of them is provided with an air inlet at least for this loam cake and this bottom, one side of this housing is provided with an air outlet, and this radiator is arranged in this air outlet.
3. heat abstractor according to claim 2 is characterized in that, forms a runner between described flabellum and this sidewall, and on the flow direction of cooling blast, this runner is widened gradually.
4. heat abstractor according to claim 2 is characterized in that, this radiator comprises a fine and close section and a loose section, is arranged at the upstream and downstream of cooling blast respectively, and the spacing in this loose section between the fin is greater than the spacing between the fin in this densification section.
5. heat abstractor according to claim 4 is characterized in that, this sidewall is U type structure, and the fin in this radiator is arranged in parallel.
6. heat abstractor according to claim 5 is characterized in that, the sidewall at this air outlet place is higher than the other parts of this sidewall, and on this housing the lid and lower cover be close on this radiator.
7. heat abstractor according to claim 4 is characterized in that, the length of fin is greater than the length of fin in this loose section in this densification section.
8. heat abstractor according to claim 4 is characterized in that, the curved structure of this sidewall, and this radiator integral is arcuation and arranges.
9. heat abstractor according to claim 8 is characterized in that, the fin in this loose section is obliquely installed corresponding to the direction of this cooling blast.
10. heat abstractor according to claim 9 is characterized in that, the fin in this densification section is arranged parallel to each other.
11. heat abstractor according to claim 8 is characterized in that, this radiator comprises an inner edge and two orthogonal outsides, and this inner edge is circular-arc, passes through a breach transition between this two outside.
12. heat abstractor, comprise a centrifugal radiator fan and a radiator, this radiator fan has an air outlet, this radiator is arranged at this air outlet place, the cooling blast that this radiator fan produces blows to this radiator via this air outlet, it is characterized in that, this radiator is bent to form continuously by sheet metal, it comprises a fine and close section and a loose section, this densification section is located at the upstream of this cooling blast, the section of should loosening is positioned at the downstream of this cooling blast, and the spacing in this loose section between the fin is greater than the spacing of fin in this densification section.
CN200610061864A 2006-07-28 2006-07-28 Heat radiating device Expired - Fee Related CN101115367B (en)

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Application Number Priority Date Filing Date Title
CN200610061864A CN101115367B (en) 2006-07-28 2006-07-28 Heat radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200610061864A CN101115367B (en) 2006-07-28 2006-07-28 Heat radiating device

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CN101115367A true CN101115367A (en) 2008-01-30
CN101115367B CN101115367B (en) 2010-05-26

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196712A (en) * 2010-03-17 2011-09-21 索尼计算机娱乐公司 Cooling device and electronic device including the same
CN108966585A (en) * 2017-05-26 2018-12-07 富瑞精密组件(昆山)有限公司 The heat dissipating method of radiator and heating module
CN110379785A (en) * 2019-07-25 2019-10-25 邢台职业技术学院 A kind of electronic heat sink
CN111741655A (en) * 2020-06-30 2020-10-02 联想(北京)有限公司 Heat dissipation device and electronic equipment
CN113923959A (en) * 2021-10-19 2022-01-11 邵阳市讯源电子科技有限公司 Efficient heat dissipation type LED driver and production method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2416535Y (en) * 2000-02-14 2001-01-24 双鸿科技股份有限公司 CPU cooler for computer
CN2530350Y (en) * 2001-10-30 2003-01-08 戴胜熙 Radiating modulus of CPU
CN2669374Y (en) * 2003-10-27 2005-01-05 广达电脑股份有限公司 Radiating device
JP4144037B2 (en) * 2004-11-16 2008-09-03 東芝ホームテクノ株式会社 Cooling system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196712A (en) * 2010-03-17 2011-09-21 索尼计算机娱乐公司 Cooling device and electronic device including the same
CN108966585A (en) * 2017-05-26 2018-12-07 富瑞精密组件(昆山)有限公司 The heat dissipating method of radiator and heating module
CN110379785A (en) * 2019-07-25 2019-10-25 邢台职业技术学院 A kind of electronic heat sink
CN111741655A (en) * 2020-06-30 2020-10-02 联想(北京)有限公司 Heat dissipation device and electronic equipment
CN111741655B (en) * 2020-06-30 2022-03-25 联想(北京)有限公司 Heat dissipation device and electronic equipment
CN113923959A (en) * 2021-10-19 2022-01-11 邵阳市讯源电子科技有限公司 Efficient heat dissipation type LED driver and production method thereof

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