CN101104352A - Hole-sealing technology in producing thermal CTP plate material - Google Patents
Hole-sealing technology in producing thermal CTP plate material Download PDFInfo
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- CN101104352A CN101104352A CNA2007100255227A CN200710025522A CN101104352A CN 101104352 A CN101104352 A CN 101104352A CN A2007100255227 A CNA2007100255227 A CN A2007100255227A CN 200710025522 A CN200710025522 A CN 200710025522A CN 101104352 A CN101104352 A CN 101104352A
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- plate material
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- sealing technology
- aluminium plate
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Abstract
The invention discloses plugging technique in the process of making heat-sensitive CTP printing plate material, pertaining to the technical field of making method of CTP printing plate material. The plugging technique is that: soak oxidated aluminium plate material in acid solution which is zirconium fluoride kalium solution with a weight concentration of 10 to 20 percent and a PH of 4 to 5; heat the solution to 40 to 60 DEG C and soak the aluminium plate material in the solution for 20 to 30 seconds; get the aluminium plate material out and wash the aluminium plate material with hot water. The technique is reasonable, standard and is easy to operate, thereby the invention is suitable for industrial production. After holes are plugged, the printing plate material is improved in stain resistance and corrosion resistance and pressrun is increased from 80 to 100 thousand/piece to 200 to 300 thousand/piece; water retention capacity is improved, so water and ink can balance when printing, avoiding dirting a presswork; with good service effect, the technique can reduce energy consumption, therefore the invention is environment-friendly.
Description
Technical field
The present invention relates to the hole-sealing technology in a kind of production method that is used for the thermal CTP plate material of printing industry, particularly this production method.
Background technology
Usually the CTP (Computer to plate) that says is meant from computer directly to forme, i.e. " off line is directly made a plate ", and this Study on Technology is the once great technological revolution of contemporary printing industry with application.Growing along with the CTP technology, the insider recognizes that the CTP plate is the core of this technology, compares with tradition plate-making process, the processing of CTP plate is comparatively loaded down with trivial details.The CTP plate can be divided into metal plate (mainly referring to the aluminium plate material) and polyester plate by the division of version base usually, divides by coating to be divided into temperature-sensitive version and photosensitive resin version.At present; with the aluminium plate material serves as that the basic heat-sensitive CTP plate of version is mainly through surface clean; electrolysis; ash disposal; polarization; anodic oxidation; sealing of hole; make finished product after the steps such as coating; wherein hole-sealing technology generally is to form aluminium plate material impregnation process in acid solution of anode oxide film; but existing treatment process is immature; lack of standardization; be difficult to operation; be not suitable for suitability for industrialized production; the sealing of hole effect is difficult to guarantee; the corrosion resistance that causes plate; low contamination resistance; water retention property is bad; be difficult for reaching ink-water balance in the printing process, and used solution is nickeliferous often; the salting liquid of heavy metal ion such as chromium, unfavorable to environmental protection.
Summary of the invention
The technical problem to be solved in the present invention is to overcome weak point of the prior art, provide a kind of and can improve plate corrosion resistance, stain resistance, strengthen water retention property, hole-sealing technology during the thermal CTP plate material that reaches ink-water balance in the printing process is easily produced, this technological operation standard is fit to suitability for industrialized production.
Technical scheme of the present invention is: be the version base of CTP plate with the aluminium plate material, to in acid solution, carry out impregnation process through the aluminium plate material after the oxidation processes, improvements are that described acid solution is a potassium zirconium fluoride solution, weight percent concentration is 10%～20%, pH value is 4～5, be heated to 40 ℃～60 ℃, the aluminium plate material was flooded 20～30 seconds, clean through hot water again after the taking-up.
Further scheme is: it is that hot water with 60 ℃～80 ℃ sprays the aluminium plate material that described hot water cleans; Add a small amount of grey agent and surfactant of pressing down in the described acid solution; But described grey agent is a macromolecular organic compound, as poly-phosphinocarboxylic acid, thiacyclohexane one hexacarboxylic acid; Described surfactant is a lithium dodecyl sulfate.
Adopt above technical scheme, hole-sealing technology reasonable standard of the present invention, easy operating, be fit to suitability for industrialized production, the sealing of hole quality is guaranteed, the corrosion resistance of plate, stain resistance improve, and pressrun rises to 20～300,000/sheet by 8 original～100,000/sheet, avoids the last dirty phenomenon in the printing process; The water retention property of plate obviously strengthens, and reaches ink-water balance during printing easily, and result of use is good.Hole-sealing technology of the present invention belongs to warm sealing of hole in a kind of no nickel, for reducing energy consumption, protecting environment that tangible positive effect is also arranged.
The specific embodiment
With the aluminium plate material is the version base of CTP plate, after surface clean, electrolysis, ash disposal, polarization, anodic oxidation etc. are handled, carries out following sealing of hole and handles:
Example 1: preparation potassium zirconium fluoride solution, concentration is 10% (weight), pH value is 4.0, press the amount of 1.5g/L and adds poly-phosphinocarboxylic acid and lithium dodecyl sulfate, is heated to 40 ℃, with aluminium plate material dipping 30 seconds, after taking out with 60 ℃ heat water-spraying.
Example 2: preparation potassium zirconium fluoride solution, concentration is 15% (weight), pH value is 5.0, press the amount of 2.0g/L and adds cyclohexane one hexacarboxylic acid and lithium dodecyl sulfate, is heated to 45 ℃, with aluminium plate material dipping 25 seconds, after taking out with 70 ℃ of heat water-sprayings.
Example 3: preparation potassium zirconium fluoride solution, concentration is 20% (weight), pH value is 4.5, press the amount of 2.5g/L and adds poly-phosphinocarboxylic acid and lithium dodecyl sulfate, is heated to 50 ℃, with aluminium plate material dipping 25 seconds, after taking out with 80 ℃ of heat water-sprayings.
Example 4: preparation potassium zirconium fluoride solution, concentration is 20% (weight), pH value is 4.2, is heated to 55 ℃, and the aluminium plate material was flooded 30 seconds, takes out back with 75 ℃ of heat water-sprayings.
Claims (5)
1. the hole-sealing technology during a thermal CTP plate material is produced, will be through the aluminium plate material impregnation process in acid solution after the oxidation processes, it is characterized in that described acid solution is a potassium zirconium fluoride solution, weight percent concentration is 10%～20%, pH value is 4～5, be heated to 40 ℃～60 ℃, the aluminium plate material was flooded 20～30 seconds, clean through hot water again after the taking-up.
2. the hole-sealing technology in producing by the described thermal CTP plate material of claim 1 is characterized in that: it is that hot water with 60 ℃～80 ℃ sprays the aluminium plate material that described hot water cleans.
3. the hole-sealing technology in producing by the described thermal CTP plate material of claim 1 is characterized in that: add a small amount of grey agent and surfactant of pressing down in the described acid solution.
4. the hole-sealing technology in producing by the described thermal CTP plate material of claim 3, it is characterized in that: but described grey agent is a macromolecular organic compound.
5. the hole-sealing technology in producing by the described thermal CTP plate material of claim 3, it is characterized in that: described surfactant is a lithium dodecyl sulfate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100255227A CN100567021C (en) | 2007-08-03 | 2007-08-03 | Hole-sealing technology during thermal CTP plate material is produced |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100255227A CN100567021C (en) | 2007-08-03 | 2007-08-03 | Hole-sealing technology during thermal CTP plate material is produced |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101104352A true CN101104352A (en) | 2008-01-16 |
| CN100567021C CN100567021C (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100255227A Expired - Fee Related CN100567021C (en) | 2007-08-03 | 2007-08-03 | Hole-sealing technology during thermal CTP plate material is produced |
Country Status (1)
| Country | Link |
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| CN (1) | CN100567021C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101863174A (en) * | 2010-06-22 | 2010-10-20 | 刘华礼 | Hole sealing process for use in thermal-sensitive computer-to-plate (CTP) plate production |
| CN102658711A (en) * | 2012-04-28 | 2012-09-12 | 黄山金瑞泰科技有限公司 | Spray device |
| CN103625145A (en) * | 2012-08-23 | 2014-03-12 | 温州市华彩印刷器材有限公司 | Treatment technology for thermosensitive positive CTP plate manufacturing substrate |
| CN103660665A (en) * | 2013-12-05 | 2014-03-26 | 泰州市东方印刷版材有限公司 | Hole sealing technology for printing plate making |
| CN107538947A (en) * | 2016-06-28 | 2018-01-05 | 北京中科纳新印刷技术有限公司 | A kind of flushing-free aluminium plate material of direct plate making of ink-jet printing and preparation method thereof |
-
2007
- 2007-08-03 CN CNB2007100255227A patent/CN100567021C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101863174A (en) * | 2010-06-22 | 2010-10-20 | 刘华礼 | Hole sealing process for use in thermal-sensitive computer-to-plate (CTP) plate production |
| CN102658711A (en) * | 2012-04-28 | 2012-09-12 | 黄山金瑞泰科技有限公司 | Spray device |
| CN103625145A (en) * | 2012-08-23 | 2014-03-12 | 温州市华彩印刷器材有限公司 | Treatment technology for thermosensitive positive CTP plate manufacturing substrate |
| CN103660665A (en) * | 2013-12-05 | 2014-03-26 | 泰州市东方印刷版材有限公司 | Hole sealing technology for printing plate making |
| CN107538947A (en) * | 2016-06-28 | 2018-01-05 | 北京中科纳新印刷技术有限公司 | A kind of flushing-free aluminium plate material of direct plate making of ink-jet printing and preparation method thereof |
| CN107538947B (en) * | 2016-06-28 | 2019-07-12 | 北京中科纳新印刷技术有限公司 | A kind of flushing-free aluminium plate material of direct plate making of ink-jet printing and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100567021C (en) | 2009-12-09 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20120803 |