CN101097404A - Homocercal chromatic radiation sensitive resin combination - Google Patents
Homocercal chromatic radiation sensitive resin combination Download PDFInfo
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- CN101097404A CN101097404A CNA2007101292914A CN200710129291A CN101097404A CN 101097404 A CN101097404 A CN 101097404A CN A2007101292914 A CNA2007101292914 A CN A2007101292914A CN 200710129291 A CN200710129291 A CN 200710129291A CN 101097404 A CN101097404 A CN 101097404A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Abstract
A positive coloring photosensitive resin composition comprises (A) alkali soluble curable resin, (B) quinondiazide compound and (C) coloring agent, wherein (A) alkali soluble curable resin is co-polymer containing (a1) derived from a structure unit without carboxylic and (a2) derived from unsaturated compound structure unit with oxacyclobutyl except unsaturated carboxylic acid.
Description
Technical field
The present invention relates to Homocercal chromatic radiation sensitive resin combination.
Background technology
Use comprises by epoxy compound and other component, 1, and it is known (patent documentation 1) that the radiation-sensitive resin composition of the multipolymer that 2-quinone diazide and black colorant copolymerization obtain forms black matix.
For improving contrast, on black matix, be formed for the light spacer of color filter, also be known (for example patent documentation 2) thereby cause blackening.
[patent documentation 1] JP-A No.2004-343743, embodiment 1
[patent documentation 2] JP-A No.2002-174817
Yet for improving the brightness of liquid crystal panel, the light spacer that requires to be used for color filter has meticulousr structure.
Summary of the invention
An object of the present invention is to provide a kind of Homocercal chromatic radiation sensitive resin combination, it can provide the resin pattern of high-resolution painted sclerosis.
For addressing the above problem, the inventor studies, and find that a kind of radiation-sensitive resin composition that contains multipolymer provides the resin pattern of high-resolution painted sclerosis, described multipolymer comprises (a2) structural unit derived from the unsaturated compound with oxa-cyclobutyl.
That is, the invention provides following [1]-[9];
[1]. a kind of Homocercal chromatic radiation sensitive resin combination, it comprises (A) alkali solubility curable resin, (B) quinone di-azido compound and (C) colorant; Wherein (A) alkali solubility curable resin is for comprising (a1) derived from the structural unit of unsaturated carboxylic acid with (a2) derived from the multipolymer of the structural unit of the unsaturated compound with oxa-cyclobutyl except that unsaturated carboxylic acid.
[2]. according to the resin combination of [1], wherein (A) alkali solubility curable resin further comprises (a3)) at least a being selected from (a31) derived from the structural unit of carboxylate, (a32) with carbon-to-carbon unsaturated bond derived from the structural unit of the structural unit of aromatics, (a33) derived from propylene nitrile compound, (a34) with carbon-to-carbon unsaturated bond derived from the structural unit that randomly has the maleimide compound that the N position replaces with (a35) derived from the structural unit of the structural unit of epoxide with carbon-to-carbon unsaturated bond.
[3]. according to the resin combination of [1] or [2], wherein colorant (C) is at least a pigment that is selected from organic pigment and black inorganic pigment.
[4]. according to any one resin combination in [1]-[3], further comprise (D) organic solvent.
[5]. a kind of resin pattern of painted sclerosis, it uses according to any one resin combination in [1]-[4] and forms.
[6]. a kind of method of producing the resin pattern of painted sclerosis, be included in and apply any one resin combination in basis [1]-[4] on the base material, remove and desolvate, shine this resin combination through mask with ray, implement to develop with alkaline aqueous solution then, form pattern.
[7]. the method according to the resin pattern of the painted sclerosis of production of [6], wherein after pattern forms, further heat this pattern.
[8]. a kind of method of producing the resin pattern of painted sclerosis, be included in and apply on the base material according to any one Homocercal chromatic radiation sensitive resin combination in [1]-[4], remove and desolvate, shine this resin combination with ray through mask, implement to develop to form given pattern and to use all or part of surface of pattern on the radiation exposure base material then with alkaline aqueous solution.
[9] according to the method for the resin pattern of the painted sclerosis of production of [8], wherein use all or part of surface of pattern on the radiation exposure base material after, further heat this pattern.
Embodiment
(A) alkali solubility curable resin among the present invention is a kind of multipolymer, and it comprises (a1) derived from the structural unit of unsaturated carboxylic acid with (a2) derived from the structural unit of the unsaturated compound with oxa-cyclobutyl.Here, the unsaturated compound of deriving to structural unit (a2) is not a unsaturated carboxylic acid.
Be the unsaturated carboxylic acid of structural unit (a1) as above-mentioned deriving, for example can mention the unsaturated carboxylic acid that in molecule, has one and a plurality of carboxyls etc.
The object lesson of unsaturated carboxylic acid comprises acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, citric acid, mesaconic acid etc.
In instructions of the present invention; statement (methyl) acrylic acid represents to be selected from least a of acrylic acid and methacrylic acid; statement (methyl) acrylate represents to be selected from least a of acrylate and methacrylate; statement (methyl) acryloyl group represents to be selected from least a of acryloyl group and methacryl, and statement (methyl) acryloyl-oxy basis representation is selected from least a of acryloxy and methacryloxy.
Above-mentioned example of deriving to the unsaturated compound with oxa-cyclobutyl of structural unit (a2) comprises 3-(methyl) acryloyl-oxy ylmethyl oxetanes, 3-methyl-3-(methyl) acryloyl-oxy ylmethyl oxetanes, 3-ethyl-3-(methyl) acryloyl-oxy ylmethyl oxetanes, 3-methyl-3-[1-(methyl) acryloxy] the methyl oxetanes, 3-ethyl-3-[1-(methyl) acryloxy] the methyl oxetanes, 3-methyl-3-[1-(methyl) acryloxy] the ethyl oxetanes, 3-ethyl-3-[1-(methyl) acryloxy] the ethyl oxetanes, 2-phenyl-3-(methyl) acryloyl-oxy ylmethyl oxetanes, 2-trifluoromethyl-3-(methyl) acryloyl-oxy ylmethyl oxetanes, 2-pentafluoroethyl group-3-(methyl) acryloyl-oxy ylmethyl oxetanes, 3-methyl-3-(methyl) acryloxy ethyl oxetanes, 3-ethyl-3-(methyl) acryloxy ethyl oxetanes, 2-phenyl-3-(methyl) acryloxy ethyl oxetanes, 2-trifluoromethyl-3-(methyl) acryloxy ethyl oxetanes, 2-pentafluoroethyl group-3-(methyl) acryloxy ethyl oxetanes, 3-methacryloxy oxetanes etc.What preferably mention is 3-ethyl-3-methacryloxy methyl oxetanes, 3-methyl-3-methacryloxy methyl oxetanes, 3-methyl-3-(1-methacryloxy) ethyl oxetanes and 3-methacryloxy oxetanes.Wherein, preferably use 3-ethyl-3-methacryloxy methyl oxetanes and 3-methyl-3-methacryloxy oxetanes.
The alkali soluble resins that comprises derived from the structural unit (a2) of the unsaturated compound with oxa-cyclobutyl in use prepares in the Homocercal chromatic radiation sensitive resin combination, the alkali soluble resins that comprises the unsaturated compound with epoxy radicals with respect to use prepares Homocercal chromatic radiation sensitive resin combination, has the favourable trend of the better storage stability of this Homocercal chromatic radiation sensitive resin combination.
In the multipolymer that only comprises structural unit (a1) and structural unit (a2), the content of structural unit (a1) is preferably 5-50mol%, and more preferably 15-40mol% is with the molar ratio computing based on all structural units in the multipolymer.The content of structural unit (a2) is preferably 95-50mol%, and more preferably 85-60mol% is with the molar ratio computing based on all structural units in the multipolymer.
From rate of dissolution and high hardening viewpoint suitable developer solution, the content of structural unit in the multipolymer (a1) and structural unit (a2) is preferably in above-mentioned scope.
(A) alkali solubility curable resin can comprise further that (a3) is at least a to be selected from (a31) structural unit derived from the carboxylate with carbon-to-carbon unsaturated bond among the present invention, (a32) derived from the structural unit of aromatics with carbon-to-carbon unsaturated bond, (a33) structural unit of derived from propylene nitrile compound, (a34) derived from the structural unit that randomly has the maleimide that the N position replaces and (a35) derived from the structural unit of the structural unit of epoxy compound with carbon-to-carbon unsaturated bond as the copolymerization component.
The example of deriving to the carboxylate with carbon-to-carbon unsaturated bond of structural unit (a31) comprises esters of unsaturated carboxylic acids, for example (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) butyl acrylate, (methyl) acrylic acid 2-hydroxy methacrylate, (methyl) acrylic acid benzene methyl, (methyl) cyclohexyl acrylate, (methyl) isobornyl acrylate, (methyl) acrylic acid two ring pentyl esters, (methyl) phenyl acrylate, diethyl maleate, DEF, diethyl itaconate etc.; Unsaturated carboxylic acid aminoalkyl ester, for example (methyl) acrylic-amino ethyl ester etc.; Vinyl carboxylates, for example vinyl acetate, propionate etc.
The example of deriving to the aromatics with carbon-to-carbon unsaturated bond of structural unit (a32) comprises aromatic ethenyl compound.The example of aromatic ethenyl compound comprises styrene, α-Jia Jibenyixi, vinyltoluene etc.
The example of deriving to the acrylonitrile compound of structural unit (a33) comprises vinyl cyanide, methacrylonitrile, alpha-chloro (methyl) vinyl cyanide etc.
The example that randomly has the maleimide compound that the N position replaces of deriving to structural unit (a34) comprises maleimide; N-methyl maleimide; the N-ethyl maleimide; the N-butyl maleimide; N-cyclohexyl maleimide; N-benzyl maleimide; N-phenylmaleimide; N-(4-acetylphenyl) maleimide; N-(2; 6-diethyl phenyl) maleimide; N-(4-dimethylamino-3,5-dinitrophenyl) maleimide; N-succinimido-3-maleimide benzoic ether; N-succinimido-3-maleimide propionic ester; N-succinimido-4-maleimide butyric ester; N-succinimido-6-maleimide capronate; N-(1-anilino-naphthyl-4)-maleimide; N-[4-(2-benzoxazol base) phenyl] maleimide; N-(9-acryloyl two bases (acrydinyl)) maleimide etc.
The example of deriving to the epoxide with carbon-to-carbon unsaturated bond of structural unit (a35) comprises (methyl) glycidyl acrylate, (methyl) acrylic acid Beta-methyl ethylene oxidic ester, (methyl) propenoic acid beta-ethyl ethylene oxidic ester, (methyl) acrylic acid 3-methyl-3,4-epoxy butyl ester, (methyl) acrylic acid 3-ethyl-3,4-epoxy butyl ester, (methyl) acrylic acid 4-methyl 4,5-epoxy pentyl ester, (methyl) acrylic acid 2,3-epoxycyclohexyl methyl esters, (methyl) acrylic acid 3,4-epoxycyclohexyl methyl esters, adjacent vinyl benzyl glycidol ether, between the vinyl benzyl glycidol ether, to vinyl benzyl glycidol ether etc.
As structural unit (a1), (a2), (a31), (a32), (a33), (a34) and (a35), can use unit derived from one or more above-mentioned example compound.
Alkali soluble resins (A) also can comprise structural unit (a3) except that structure unit (a1) and structural unit (a2).Also comprising under the situation of structural unit (a3) except that structure unit (a1) and structural unit (a2), the content of structural unit (a1) is preferably 5-60mol%, and more preferably 15-50mol% is with the molar ratio computing based on all structural units in the multipolymer.The content of structural unit (a2) is preferably 90-5mol%, and more preferably 75-10mol% is with the molar ratio computing based on all structural units in the multipolymer.The content of structural unit (a3) is preferably 85-5mol%, and more preferably 75-10mol% is with the molar ratio computing based on all structural units in the multipolymer.
The multipolymer example that comprises structural unit (a1) and structural unit (a2) comprises 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid benzene methyl/methacrylic acid copolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid benzene methyl/methacrylic acid/styrol copolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/styrol copolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/cyclohexyl methacrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/methylmethacrylate copolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/methyl methacrylate/styrol copolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/metering system tert-butyl acrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/isobornyl methacrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/acrylic acid benzene methyl multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/cyclohexyl acrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/isobornyl acrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/methacrylic acid two ring pentyl ester multipolymers, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/tert-butyl acrylate multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/phenyl maleimide multipolymer, 3-ethyl-3-methacryloxy methyl oxetanes/methacrylic acid/cyclohexyl maleimide copolymer etc.
For example, to derive to the compound of structural unit (a1) and will derive and be the compound of structural unit (a2), if necessary will derive and exist or do not exist under the solvent situation for the compound of structural unit (a3), in inert gas atmosphere or air atmosphere, reach to exist or do not exist under the catalyzer and mix, and heat this potpourri and make it reaction 30-200 ℃ of thermal insulation usually, and from the reactant liquor that generates, separate alkali soluble resins (A) and the if necessary purification of using among the present invention.
As standard, the weight-average molecular weight of the multipolymer that comprises structural unit (a1) and structural unit (a2) by gel permeation chromatography measurement is preferably 2000-100000 with polystyrene, more preferably 2000-50000, further preferred 3000-20000.Weight-average molecular weight preferably in above-mentioned scope, is kept film thus and is kept in the ratio in development, have the trend that obtains high developing rate.
The content that comprises the multipolymer of structural unit (a1) and structural unit (a2) among the present invention is preferably 50-90wt%, and 60-90wt% more preferably is based on the solid content of radiation-sensitive resin composition.
Here, solid content is meant from colored photosensitive resin composition except that the remainder after desolvate (D).
The example that is used for quinone di-azido compound of the present invention (B) comprises 1,2-benzene quinone di-azide sulfonic acid ester, 1,2-naphthalene quinone di-azide sulfonic acid ester, 1,2-benzoquinones two nitrine sulfonamide, 1,2-naphthoquinones two nitrine sulfonamide etc.
The object lesson of quinone di-azido compound (B) comprises 1 of trihydroxybenzophenone, 2-naphthalene quinone di-azide sulfonic acid ester, for example 2,3,4-trihydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,4,6-trihydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester etc.; 1 of tetrahydroxybenzophenone, 2-naphthalene quinone di-azide sulfonic acid ester, for example 2,2 ', 4,4 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,2 ', 4,4 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,2 ', 4,3 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,2 ', 4,3 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,3,4,4 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,3,4,4 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,3,4,2 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,3,4,2 '-tetrahydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,3,4,4 '-tetrahydroxy-3 '-methoxy benzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,3,4,4 '-tetrahydroxy-3 '-methoxy benzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester etc.; 1 of pentahydroxybenzophenone, 2-naphthalene quinone di-azide sulfonic acid ester, for example 2,3,4,2 ', 6 '-pentahydroxybenzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,3,4,2 ', 6 '-pentahydroxybenzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester etc.; 1 of hexahydroxy benzophenone, 2-naphthalene quinone di-azide sulfonic acid ester, for example 2,4,6,3 ', 4 ', 5 '-hexahydroxy benzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,4,6,3 ', 4 ', 5 '-hexahydroxy benzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 3,4,5,3 ', 4 ', 5 '-hexahydroxy benzophenone-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 3,4,5,3 ', 4 ', 5 '-hexahydroxy benzophenone-1,2-naphthoquinones two nitrine-5-sulphonic acid ester etc.; 1 of (polyhydroxy phenyl) alkane, 2-naphthalene quinone di-azide sulfonic acid ester, for example two (2, the 4-dihydroxy phenyl) methane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, two (2, the 4-dihydroxy phenyl) methane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, two (p-hydroxybenzene) methane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, two (p-hydroxybenzene) methane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 1,1,1-three (p-hydroxybenzene) ethane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 1,1,1-three (p-hydroxybenzene) ethane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, two (2,3,4-trihydroxy phenyl) methane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, two (2,3,4-trihydroxy phenyl) methane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,2 '-two (2,3,4-trihydroxy phenyl) propane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,2 '-two (2,3,4-trihydroxy phenyl) propane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 1,1,3-three (2,5-dimethyl-4-hydroxy phenyl)-3-phenyl-propane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 1,1,3-three (2,5-dimethyl-4-hydroxy phenyl)-3-phenyl-propane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 4,4 '-[1-[4-[1-[4-hydroxy phenyl]-1-Methylethyl] phenyl] ethylidene] bis-phenol-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 4,4 '-[1-[4-[1-[4-hydroxy phenyl]-1-Methylethyl] phenyl] ethylidene] bis-phenol-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, two (2,5-dimethyl-4-hydroxy phenyl)-2-hydroxy phenyl methane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, two (2,5-dimethyl-4-hydroxy phenyl)-2-hydroxy phenyl methane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 3,3,3 ', 3 '-tetramethyl-1,1 '-volution indenes-5,6,7,5 ', 6 ', 7 '-hexanol-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 3,3,3 ', 3 '-tetramethyl-1,1 '-volution indenes-5,6,7,5 ', 6 ', 7 '-hexanol-1,2-naphthoquinones two nitrine-5-sulphonic acid ester, 2,2,4-trimethyl-7,2 ', 4 '-trihydroxy fravane-1,2-naphthoquinones two nitrine-4-sulphonic acid ester, 2,2,4-trimethyl-7,2 ', 4 '-trihydroxy fravane-1,2-naphthoquinones two nitrine-5-sulphonic acid ester etc.
Above-mentioned quinone di-azido compound (B) can use separately or be used in combination with two or more.The content of quinone di-azido compound among the present invention (B) is preferably 2-50wt%, and more preferably 5-40wt% is based on the radiation-sensitive resin composition solid content.The content of quinone di-azido compound preferably in above-mentioned scope, has increased the differential dissolution rate between non-exposed portion and the exposed portion thus, thereby the film that is tending towards keeping higher in development keeps ratio.
As being used for colorant of the present invention (C), what mention is dyestuff and pigment, and it can be used alone or as a mixture.
Pigment can be inorganic pigment or organic pigment, and it can be used alone or as a mixture.
Particularly, preferably comprise and be selected from least a of organic pigment and black inorganic pigment.As pigment, preferably show the pigment of high luminance relay colour display screen shadow and high-fire resistance, more preferably show the pigment of high heat-resisting decomposability, and the combination of preferred especially carbon black and two or more organic pigments.
The absorption spectrum that depends on requirement can use two or more to be selected from the combination of carbon black and organic pigment.More specifically, preferably use the combination of carbon black and one or more organic pigments, or the combination of two or more organic pigments.
As carbon black, what mention is C.I. pigment black 6, C.I. pigment black 7 etc.
What specifically exemplify is furnace black, for example SAF, SAF-HS, ISAF, ISAF-LS, ISAF-HS, HAF, HAF-LS, HAF-HS, NAF, FEF, FEF-HS, SRF, SRF-LM, SRF-LS, GPF, ECF, N-339, N-351 etc.; Thermal black, for example FT, MT etc.; Acetylene carbon black etc.These carbon blacks can use separately or two or more mix use.
The example of the inorganic pigment among the present invention except carbon black comprises metal oxide, and for example titanium is black, Cu-Fe-Mn oxide, synthetic iron oxide black etc.These inorganic pigments can use separately or two or more mix use.
The example of organic pigment is included in " Colour Index " (C.I. among the present invention; Dyers and colourist association (The Society ofDyers and Colourists) publication) classify as the compound of pigment in, particularly, it has Colour Index numerical value (C.I.) as described below.
C.I. pigment Yellow 12, C.I. pigment yellow 13, C.I. pigment Yellow 14, C.I. pigment yellow 17, C.I. pigment yellow 20, C.I. pigment yellow 24, C.I. pigment yellow 31, C.I. pigment yellow 55, C.I. pigment yellow 83, C.I. pigment yellow 93, C.I. pigment yellow 109, C.I. pigment yellow 110, C.I. pigment yellow 13 8, C.I. pigment yellow 13 9, C.I. pigment yellow 150, C.I. pigment yellow 153, C.I. pigment yellow 154, C.I. pigment yellow 155, C.I. pigment yellow 166, C.I. pigment yellow 168;
C.I. pigment orange 36, C.I. pigment orange 43, C.I. pigment orange 51, C.I. pigment orange 61, C.I. pigment orange 71;
C.I. Pigment Red 9, C.I. Pigment Red 97, C.I. pigment red 122, C.I. pigment red 123, C.I. pigment red 149, C.I. paratonere 168, C.I. paratonere 176, C.I. paratonere 177, C.I. paratonere 180, C.I. paratonere 209, C.I. pigment red 21 5, C.I. paratonere 224, C.I. paratonere 242, C.I. paratonere 254;
C.I. pigment violet 19, C.I. pigment Violet 23, C.I. pigment violet 29;
C.I. pigment blue 15, C.I. pigment blue 60, C.I. pigment blue 15: 3, C.I. pigment blue 15: 4, C.I. pigment blue 15: 6;
C.I. pigment Green 7, C.I. pigment green 36;
C.I. pigment brown 23, C.I. pigment brown 25;
C.I. pigment black 1.
Can suitably select and use these organic pigments to obtain the color of expectation.Above-mentioned pigment and body pigment can be used jointly according to circumstances.The example of body pigment comprises that barium sulphate, barium carbonate, lime carbonate, silicon dioxide, basic magnesium carbonate, alumina white, gloss white, satan are white, hydrotalcite etc.These body pigments can use separately or two or more mix use.Preferred 100 weight portions of the consumption of body pigment or still less, more preferably 50 weight portions or still less, further preferred 40 weight portions or still less are based on 100 weight portion black pigments.
Preferred Homocercal chromatic radiation sensitive resin combination of the present invention further comprises (D) organic solvent.
The example of organic solvent (D) comprises ethylene glycol monoalkyl ether, for example glycol monoethyl ether, ethylene glycol monoethyl ether, ethylene glycol ether, ethylene glycol monobutyl ether etc.; Diglycol dialkyl ether, for example diethylene glycol dimethyl ether, diethyl carbitol, diglycol dipropyl ether, diethylene glycol dibutyl ether, diglycol ethyl methyl ether, diglycol methyl isopropyl ether etc.; Ethylene glycol alkyl ether acetic acid esters, for example methylcellosolve acetate, ethyl cellosolve acetate etc.; Propylene glycol alkyl ether acetic acid ester, for example propylene glycol methyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetic acid esters etc.; Aromatic hydrocarbon, for example benzene,toluene,xylene etc.; Ketone, for example MEK, acetone, methylpentanone, methylisobutylketone, cyclohexanone etc.; Alcohol, for example ethanol, propyl alcohol, butanols, hexanol, cyclohexanol, ethylene glycol, glycerine etc.; Ester, for example 3-ethoxyl ethyl propionate, 3-methoxypropionic acid methyl esters, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 2-hydroxy-methyl isobutyl acid, butyl acetate, pentyl acetate, isoamyl acetate, methyl pyruvate etc.; Cyclic ester, for example gamma-butyrolacton etc.
As organic solvent (D), two or more organic solvents can be mixed and use.
The example of preferred organic (D) combination comprises diethylene glycol dimethyl ether and butyl lactate, diglycol B ether and butyl lactate, propylene glycol methyl ether acetate and diethylene glycol dimethyl ether, propylene glycol methyl ether acetate and butyl lactate, 3-ethoxyl ethyl propionate and butyl lactate, 3-ethoxyl ethyl propionate and propylene glycol methyl ether acetate, diglycol ethyl methyl ether and 3-ethoxyl ethyl propionate, diglycol ethyl methyl ether and butyl acetate, diglycol ethyl methyl ether and 3-ethoxyl ethyl propionate and butyl lactate, the combination of 3-ethoxyl ethyl propionate and butyl acetate and butyl lactate etc.
The content of organic solvent (D) is preferably 50-95wt%, and more preferably 65-90wt% is in based on the Homocercal chromatic radiation sensitive resin combination weight fraction.Preferably in above-mentioned scope, there is the trend that can form excellent planarity film in the content of organic solvent (D) thus.
Homocercal chromatic radiation sensitive resin combination of the present invention also can comprise polymerization initiator (E), multivalence phenolic compounds (F), crosslinking chemical (G) and polymerizable compound (H) except that alkali soluble resins (A), quinone di-azido compound (B), colorant (C) and organic solvent (D).
As above-mentioned polymerization initiator (E), what mention is salt as cationic polymerization initiators.Above-mentioned salt is by the kation and be derived from lewis acidic negative ion and constitute.
The cationic object lesson of above-mentioned comprises diphenyl iodine , two (p-methylphenyl) iodine , two (to tert-butyl-phenyl) iodine , two (to octyl phenyl) sumptuous , two (to the octadecyl phenyl) iodine , two (to octyloxyphenyl) iodine , two (to the octadecyl phenyl) sumptuous , phenyl (to octadecane oxygen base phenyl) iodine , the sumptuous of (p-methylphenyl) (p-isopropyl phenyl), triphenylsulfonium, three (p-methylphenyl) sulfonium, three (p-isopropyl phenyl) sulfonium, three (2, the 6-3,5-dimethylphenyl) sulfonium, three (to tert-butyl-phenyl) sulfonium, three (to cyano-phenyl) sulfonium, three (rubigan) sulfonium, dimethyl (methoxyphenyl) sulfonium, dimethyl (ethoxyl phenenyl) sulfonium, dimethyl (propoxyl group phenyl) sulfonium, dimethyl (butoxy phenyl) sulfonium, dimethyl (octyloxyphenyl) sulfonium, dimethyl (octadecane oxygen base phenyl) sulfonium, dimethyl (isopropyl phenyl) sulfonium, dimethyl (tert-butoxy phenyl) blunderbuss, dimethyl (cyclopentyloxy phenyl) sulfonium, dimethyl (cyclohexyloxy phenyl) sulfonium, dimethyl (fluorine methoxyphenyl) sulfonium, dimethyl (2-chloroethoxy phenyl) sulfonium, dimethyl (3-bromine propoxyl group phenyl) sulfonium, dimethyl (4-cyano group butoxy phenyl) sulfonium, dimethyl (8-nitro octyloxyphenyl) sulfonium, dimethyl (18-trifluoromethyl octadecane oxygen base phenyl) sulfonium, dimethyl (2-hydroxyl isopropyl phenyl) sulfonium, dimethyl (three (trichloromethyl) methyl) sulfonium etc.
What mention as preferred kation is two (p-methylphenyl) iodine , (p-methylphenyl) (p-isopropyl phenyl) iodine , two (to tert-butyl-phenyl) iodine , triphenylsulfonium, three (to tert-butyl-phenyl) sulfonium etc.
Above-mentionedly be derived from lewis acidic anionic object lesson and comprise hexafluorophosphate, hexafluoro arsenate, hexafluoro antimonate, four (pentafluorophenyl group) borate etc.From lewis acidic negative ion, what can mention is hexafluoro antimonate and four (pentafluorophenyl group) borate as preferred source.
But above-mentioned kation and be derived from lewis acidic negative ion combination in any.
The object lesson of cationic polymerization initiators (E) comprises diphenyl iodine hexafluorophosphate, two (p-methylphenyl) iodine hexafluorophosphate, two (to tert-butyl-phenyl) iodine hexafluorophosphate, two (to octyl phenyl) iodine hexafluorophosphate, two (to the octadecyl phenyl) iodine hexafluorophosphate, two (to octyloxyphenyl) iodine hexafluorophosphate, two (octadecane oxygen base phenyl) iodine hexafluorophosphate, phenyl (to octadecane oxygen base phenyl) iodine hexafluorophosphate, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluorophosphate, first naphthalene iodide hexafluorophosphate, second naphthalene iodide hexafluorophosphate, the triphenylsulfonium hexafluorophosphate, three (p-methylphenyl) sulfonium hexafluorophosphate, three (p-isopropyl phenyl) sulfonium hexafluorophosphate, three (2, the 6-3,5-dimethylphenyl) sulfonium hexafluorophosphate, three (to tert-butyl-phenyl) sulfonium hexafluorophosphate, three (to cyano-phenyl) sulfonium hexafluorophosphate, three (rubigan) sulfonium hexafluorophosphate, diformazan naphthyl sulfonium hexafluorophosphate, diethyl naphthyl sulfonium hexafluorophosphate, dimethyl (methoxyphenyl) sulfonium hexafluorophosphate, dimethyl (ethoxyl phenenyl) sulfonium hexafluorophosphate, dimethyl (propoxyl group phenyl) sulfonium hexafluorophosphate, dimethyl (butoxy phenyl) sulfonium hexafluorophosphate, dimethyl (octyloxyphenyl) sulfonium hexafluorophosphate, dimethyl (octadecane oxygen base phenyl) sulfonium hexafluorophosphate, dimethyl (isopropyl phenyl) sulfonium hexafluorophosphate, dimethyl (tert-butoxy phenyl) sulfonium hexafluorophosphate, dimethyl (cyclopentyloxy phenyl) sulfonium hexafluorophosphate, dimethyl (cyclohexyloxy phenyl) sulfonium hexafluorophosphate, dimethyl (fluorine methoxyl) sulfonium hexafluorophosphate, dimethyl (2-chloroethoxy phenyl) sulfonium hexafluorophosphate, dimethyl (3-bromine propoxyl group phenyl) sulfonium hexafluorophosphate, dimethyl (4-cyano group butoxy phenyl) sulfonium hexafluorophosphate, dimethyl (8-nitro octyloxyphenyl) sulfonium hexafluorophosphate, dimethyl (18-trifluoromethyl octadecane oxygen base phenyl) sulfonium hexafluorophosphate, dimethyl (2-hydroxyl isopropyl phenyl) sulfonium hexafluorophosphate, dimethyl (three (trichloromethyl) methyl) sulfonium hexafluorophosphate;
Diphenyl iodine hexafluoro arsenate, two (p-methylphenyl) iodine hexafluoro arsenate, two (to tert-butyl-phenyl) iodine hexafluoro arsenate, two (to octyl phenyl) iodine hexafluoro arsenate, two (to the octadecyl phenyl) iodine hexafluoro arsenate, two (to octyloxyphenyl) iodine hexafluoro arsenate, two (to octadecane oxygen base phenyl) iodine hexafluoro arsenate, phenyl (to octadecane oxygen base phenyl) iodine hexafluoro arsenate, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluoro arsenate, first naphthalene iodide hexafluoro arsenate, second naphthalene iodide hexafluoro arsenate, the triphenylsulfonium hexafluoro arsenate, three (p-methylphenyl) sulfonium hexafluoro arsenate, three (isopropyl phenyl) sulfonium hexafluoro arsenate, three (2, the 6-3,5-dimethylphenyl) sulfonium hexafluoro arsenate, three (to tert-butyl-phenyl) sulfonium hexafluoro arsenate, three (to cyano-phenyl) sulfonium hexafluoro arsenate, three (rubigan) sulfonium hexafluoro arsenate, diformazan naphthyl sulfonium hexafluoro arsenate, diethyl naphthyl sulfonium hexafluoro arsenate, dimethyl (methoxyphenyl) sulfonium hexafluoro arsenate, dimethyl (ethoxyl phenenyl) sulfonium hexafluoro arsenate, dimethyl (propoxyl group phenyl) sulfonium hexafluoro arsenate, dimethyl (butoxy phenyl) sulfonium hexafluoro arsenate, dimethyl (octyloxyphenyl) sulfonium hexafluoro arsenate, dimethyl (octadecane oxygen base phenyl) sulfonium hexafluoro arsenate, dimethyl (isopropyl phenyl) sulfonium hexafluoro arsenate, dimethyl (tert-butoxy phenyl) sulfonium hexafluoro arsenate, dimethyl (cyclopentyloxy phenyl) sulfonium hexafluoro arsenate, dimethyl (cyclohexyloxy phenyl) sulfonium hexafluoro arsenate, dimethyl (fluorine methoxyphenyl) sulfonium hexafluoro arsenate, dimethyl (2-chloroethoxy phenyl) sulfonium hexafluoro arsenate, dimethyl (3-bromine propoxyl group phenyl) sulfonium hexafluoro arsenate, dimethyl (4-cyano group butoxy phenyl) sulfonium hexafluoro arsenate, dimethyl (8-nitro octyloxyphenyl) sulfonium hexafluoro arsenate, dimethyl (18-trifluoromethyl octadecane oxygen base phenyl) sulfonium hexafluoro arsenate, dimethyl (2-hydroxyl isopropyl phenyl) sulfonium hexafluoro arsenate, dimethyl (three (trichloromethyl) methyl) sulfonium hexafluoro arsenate;
Diphenyl iodine hexafluoro antimonate, two (p-methylphenyl) iodine hexafluoro antimonate, two (to tert-butyl-phenyl) iodine hexafluoro antimonate, two (to octyl phenyl) iodine hexafluoro antimonate, two (to the octadecyl phenyl) iodine hexafluoro antimonate, two (to octyloxyphenyl) iodine hexafluoro antimonate, two (to octadecane oxygen base phenyl) iodine hexafluoro antimonate, phenyl (to octadecane oxygen base phenyl) iodine hexafluoro antimonate, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluoro antimonate, first naphthalene iodide hexafluoro antimonate, second naphthalene iodide hexafluoro antimonate, the triphenylsulfonium hexafluoro antimonate, three (p-methylphenyl) sulfonium hexafluoro antimonate, three (p-isopropyl phenyl) sulfonium hexafluoro antimonate, three (2, the 6-3,5-dimethylphenyl) sulfonium hexafluoro antimonate, three (to tert-butyl-phenyl) sulfonium hexafluoro antimonate, three (to cyano-phenyl) sulfonium hexafluoro antimonate, three (rubigan) sulfonium hexafluoro antimonate, diformazan naphthyl sulfonium hexafluoro antimonate, diethyl naphthyl sulfonium hexafluoro antimonate, dimethyl (methoxyphenyl) sulfonium hexafluoro antimonate, dimethyl (ethoxyl phenenyl) sulfonium hexafluoro antimonate, dimethyl (propoxyl group phenyl) sulfonium hexafluoro antimonate, dimethyl (butoxy phenyl) sulfonium hexafluoro antimonate, dimethyl (octyloxyphenyl) sulfonium hexafluoro antimonate, dimethyl (octadecane oxygen base phenyl) sulfonium hexafluoro antimonate, dimethyl (isopropyl phenyl) sulfonium hexafluoro antimonate, dimethyl (tert-butoxy phenyl) sulfonium hexafluoro antimonate, dimethyl (cyclopentyloxy phenyl) sulfonium hexafluoro antimonate, dimethyl (cyclohexyloxy phenyl) sulfonium hexafluoro antimonate, dimethyl (fluorine methoxyphenyl) sulfonium hexafluoro antimonate, dimethyl (2-chloroethoxy phenyl) sulfonium hexafluoro antimonate, dimethyl (3-bromine propoxyl group phenyl) sulfonium hexafluoro antimonate, dimethyl (4-cyano group butoxy phenyl) sulfonium hexafluoro antimonate, dimethyl (8-nitro octyloxyphenyl) sulfonium hexafluoro antimonate, dimethyl (18-trifluoromethyl octadecane oxygen base phenyl) sulfonium hexafluoro antimonate, dimethyl (2-hydroxyl isopropyl phenyl) sulfonium hexafluoro antimonate, dimethyl (three (trichloromethyl) methyl) sulfonium hexafluoro antimonate;
Diphenyl iodine four (pentafluorophenyl group) borate, two (p-methylphenyl) iodine four (pentafluorophenyl group) borate, two (to tert-butyl-phenyl) iodine four (pentafluorophenyl group) borate, two (to octyl phenyl) iodine four (pentafluorophenyl group) borate, two (to the octadecyl phenyl) iodine four (pentafluorophenyl group) borate, two (to octyloxyphenyl) iodine four (pentafluorophenyl group) borate, two (to octadecane oxygen base phenyl) iodine four (pentafluorophenyl group) borate, phenyl (to octadecane oxygen base phenyl) iodine four (pentafluorophenyl group) borate, (p-methylphenyl) (p-isopropyl phenyl) iodine four (pentafluorophenyl group) borate, first naphthalene iodide four (pentafluorophenyl group) borate, second naphthalene iodide four (pentafluorophenyl group) borate, triphenylsulfonium four (pentafluorophenyl group) borate, three (p-methylphenyl) sulfonium four (pentafluorophenyl group) borate, three (p-isopropyl phenyl) sulfonium four (pentafluorophenyl group) borates, three (2, the 6-3,5-dimethylphenyl) sulfonium four (pentafluorophenyl group) borate, three (to tert-butyl-phenyl) sulfonium four (pentafluorophenyl group) borate, three (to cyano-phenyl) sulfonium four (pentafluorophenyl group) borate, three (rubigan) sulfonium four (pentafluorophenyl group) borate, diformazan naphthyl sulfonium four (pentafluorophenyl group) sulfonium hydrochlorate, diethyl naphthyl sulfonium four (pentafluorophenyl group) borate, dimethyl (methoxyphenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (ethoxyl phenenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (propoxyl group phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (butoxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (octyloxyphenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (octadecane oxygen base phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (isopropyl phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (tert-butoxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (cyclopentyloxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (cyclohexyloxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (fluorine methoxyphenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (2-chloroethoxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (3-bromine propoxyl group phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (4-cyano group butoxy phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (8-nitro octyloxyphenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (18-trifluoromethyl octadecane oxygen base phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (2-hydroxyl isopropyl phenyl) sulfonium four (pentafluorophenyl group) borate, dimethyl (three (trichloromethyl) methyl) sulfonium four (pentafluorophenyl group) sulfonium hydrochlorate etc.
Wherein, preferred two (p-methylphenyl) iodine hexafluorophosphate, the sumptuous hexafluorophosphate of (p-methylphenyl) (p-isopropyl phenyl), two (to tert-butyl-phenyl) iodine hexafluorophosphate, the triphenylsulfonium hexafluorophosphate, three (to tert-butyl-phenyl) sulfonium hexafluorophosphate, two (p-methylphenyl) iodine hexafluoro arsenate, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluoro arsenate, two (to tert-butyl-phenyl) iodine hexafluoro arsenate, the triphenylsulfonium hexafluoro arsenate, three (to tert-butyl-phenyl) sulfonium hexafluoro arsenate, two (p-methylphenyl) iodine hexafluoro antimonate, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluoro antimonate, two (tert-butyl-phenyl) iodine hexafluoro antimonate, the triphenylsulfonium hexafluoro antimonate, three (to tert-butyl-phenyl) sulfonium hexafluoro antimonate, two (p-methylphenyl) iodine four (pentafluorophenyl group) borate, (p-methylphenyl) (p-isopropyl phenyl) iodine four (pentafluorophenyl group) borate, two (to tert-butyl-phenyl) iodine , triphenylsulfonium four (pentafluorophenyl group) borate and three (to tert-butyl-phenyl) sulfonium four (pentafluorophenyl group) borate, more preferably two (p-methylphenyl) iodine hexafluoro antimonates, (p-methylphenyl) (p-isopropyl phenyl) iodine hexafluoro antimonate, two (to tert-butyl-phenyl) iodine hexafluoro antimonate, the triphenylsulfonium hexafluoro antimonate, three (to tert-butyl-phenyl) sulfonium hexafluoro antimonate, two (p-methylphenyl) iodine four (pentafluorophenyl group) borate, (p-methylphenyl) (p-isopropyl phenyl) iodine four (pentafluorophenyl group) borate, two (to tert-butyl-phenyl) iodine four (pentafluorophenyl group) borate, triphenylsulfonium four (pentafluorophenyl group) borate and three (to tert-butyl-phenyl) sulfonium four (pentafluorophenyl group) borate.
When containing polymerization initiator (E), its content is preferably 0.01-10wt%, and more preferably 0.1-5wt% is in the weight fraction based on the Homocercal chromatic radiation sensitive resin combination solid content.Preferably in above-mentioned scope, the hardening rate in the thermmohardening is enhanced the content of polymerization initiator (E) thus, thereby has suppressed the decline at the thermmohardening intermediate-resolution, and in addition, the solvent resistance of hardening film is tending towards improving.
Above-mentioned multivalence phenolic compounds (F) is included in the compound that has two or more phenolic hydroxyl groups in the molecule, by using polymkeric substance that hydroxy styrenes at least obtains as starting monomer and phenolics etc.
The above-mentioned example that in molecule, has the compound of two or more phenolic hydroxyl groups comprise trihydroxybenzophenone, tetrahydroxybenzophenone, pentahydroxybenzophenone, hexahydroxy benzophenone, (polyhydroxy phenyl) alkane and in quinone di-azido compound is described, enumerate those.
Comprise the resin that obtains by the polymerization hydroxy styrenes by the object lesson that uses the polymkeric substance that hydroxy styrenes at least obtains as starting monomer, for example polycarboxylated styrene, hydroxystyrene/methyl methacrylate multipolymer, hydroxy styrenes/cyclohexyl methacrylate multipolymer, hydroxy styrenes/styrol copolymer, hydroxy styrenes/alkoxystyrene multipolymer etc.
As the above-mentioned phenolics of mentioning, for example can mention being selected from the compound of phenol, cresols and catechol and the resin that one or more compound polycondensations that is selected from aldehyde and ketone obtain by one or more.
When containing above-mentioned multivalence phenolic compounds (F), its content is preferably 0.1-40wt%, and more preferably 0.1-25wt% is in the weight fraction based on the Homocercal chromatic radiation sensitive resin combination solid content.
As above-mentioned crosslinking chemical (G), what mention is methylol compound etc.
As above-mentioned methylol compound, what mention is the amino resins of alkoxy methylization, for example alkoxy methyl melamine resin, alkoxy methyl carbamide resin etc.The example of alkoxy methyl melamine resin comprises methoxy melamine resin, ethoxyl methyl melamine resin, propoxyl group methylated melamine resin, butoxymethyl melamine resin etc.The example of alkoxy methyl carbamide resin comprises methoxy carbamide resin, ethoxyl methyl carbamide resin, propoxyl group methylate carbamide resin, butoxymethyl carbamide resin etc.Above-mentioned crosslinking chemical (G) can use separately or be used in combination with two or more.
When containing crosslinking chemical (G), the preferred 0.1-15wt% of its content is in the weight fraction based on the Homocercal chromatic radiation sensitive resin combination solid content.When the content of crosslinking chemical was preferably in above-mentioned scope, the performance of hardening resin pattern improved thus.
As above-mentioned polymerizable compound (H), what mention is the polymerizable compound that for example can carry out free radical polymerization by heating, or the polymerizable compound of cationically polymerizable etc.As preferred polymerizable compound (H), what mention is the polymerizable compound of cationically polymerizable.
As the polymerizable compound of above-mentioned free redical polymerization, what mention is compound that for example has the polymerizable carbon-to-carbon unsaturated bond etc.Compound with polymerizable carbon-to-carbon unsaturated bond can be simple function polymerizable compound, difunctionality polymerizable compound or multifunctional (three or more multifunctional) polymerizable compound.
The example of simple function polymerizable compound comprises acrylic acid nonyl phenyl carbitol ester, methacrylic acid nonyl phenyl carbitol ester, acrylic acid 2-hydroxyl 3-phenoxy group propyl ester, methacrylic acid 2-hydroxyl-3-phenoxy group propyl ester, acrylic acid 2-ethylhexyl carbitol ester, methacrylic acid 2-ethylhexyl carbitol ester, acrylic acid 2-hydroxy methacrylate, 2-hydroxyethyl methacrylate, N-vinyl pyrrolidone etc.
The example of difunctionality polymerizable compound comprises diacrylate 1,6-hexanediol ester, dimethacrylate 1, two (acryloxy ethyl) ethers of 6-hexanediol ester, ethylene glycol diacrylate, Ethylene glycol dimethacrylate, diacrylic acid pentyl diol ester, dimethacrylate DOPCP, diacrylate triethyleneglycol ester, dimethacrylate triethyleneglycol ester, bisphenol-A, diacrylate 3-methyl pentanediol ester, dimethacrylate 3-methyl pentanediol ester etc.
The example of multifunctional polymerizable compound comprises trimethyol propane triacrylate, trihydroxy methyl propane trimethyl acrylate, pentaerythritol triacrylate, trimethyl acrylic acid pentaerythritol ester, pentaerythritol tetracrylate, pentaerythritol tetramethacrylate, five acrylic acid pentaerythritol esters, pentamethyl acrylic acid pentaerythritol ester, six acrylic acid dipentaerythritol ester, hexamethyl acrylic acid dipentaerythritol ester etc.
In the above-mentioned compound with the unsaturated carbon-carbon bond of polymerizable, preferably use difunctionality or multifunctional polymerizable compound.Particularly, preferably use pentaerythritol tetracrylate, six acrylic acid dipentaerythritol ester etc., more preferably use six acrylic acid dipentaerythritol ester.Difunctionality or multifunctional polymerizable compound can be used in combination with the simple function polymerizable compound.
As the polymerizable compound of cationically polymerizable, what mention is the compound that for example has cationically polymerizable functional group, and this cationically polymerizable functional group for example is vinyl ether, propylene ether, epoxy radicals, oxetanyl etc.
The above-mentioned example that contains the vinyl ether compound comprises triethylene glycol divinyl ether, 1,4 cyclohexane dimethanol divinyl ether, 4-hydroxyl butyl vinyl ether, dodecyl vinethene etc.
The above-mentioned example that contains the compound of propylene ether group comprises 4-(1-propenyloxy group methyl)-1,3-dioxolanes-2-ketone etc.
The above-mentioned example that contains the compound of epoxide group comprises bisphenol A type epoxy resin, phenol phenolic resin type epoxy resin, cresol novolac resin type epoxy resin, cyclic aliphatic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, heterocyclic ring epoxy resins etc.These resins have preferred 2000 or lower weight-average molecular weight, and more preferably 1500 or lower.
The example of the compound of above-mentioned oxygen heterocycle butyl comprises two { 3-(3-ethyl oxa-cyclobutyl) methyl } ethers, 1, two { 3-(the 3-ethyl oxa-cyclobutyl) methoxyl } benzene, 1 of 4-, two { 3-(the 3-ethyl oxa-cyclobutyl) methoxyl } methylbenzene, 1 of 4-, two { 3-(the 3-ethyl oxa-cyclobutyl) methoxyl } cyclohexanes, 1 of 4-, two { 3-(the 3-ethyl oxa-cyclobutyl) methoxyl } methylcyclohexanes of 4-, 3-(3-ethyl oxetanes) methylation phenolic resin etc.The resin of these oxygen heterocycle butyl has preferred 2000 or lower weight-average molecular weight, and more preferably 1500 or lower.
Above-mentioned polymerizable compound (H) can use separately or two or more are used in combination.
When containing polymerizable compound (H), its content is preferably 0.1-20wt%, in the weight fraction based on Homocercal chromatic radiation sensitive resin combination.
If necessary, Homocercal chromatic radiation sensitive resin combination of the present invention also can further comprise other component, for example various adjuvants are as surfactant, antioxidant, dissolution inhibitor, emulsion, ultraviolet light absorber, light stabilizer, bonding improver, electron donor etc.
Homocercal chromatic radiation sensitive resin combination of the present invention can or disperse above-mentioned alkali soluble resins (A), quinone di-azido compound (3) and colorant (C) and it is mixed with by dissolving in organic solvent (D).Also preferably above-mentioned alkali soluble resins (A), quinone di-azido compound (B) and colorant (C) are dissolved in respectively in the organic solvent (D) in advance, and the method that the solution that obtains is mixed.Organic solvent (D) can also add after preparation and and liquid mixing.The organic solvent (D) that is used for above-mentioned alkali soluble resins (A), quinone di-azido compound (B) and colorant (C) can be same to each other or different to each other.Can use multiple organic solvent (D), as long as it is a solvent compatible with each other.
In addition, preferably after solution is mixed, by the solids removed by filtration material.Above-mentioned filtration preferably uses the filtrator with 3 μ m or littler (preferably about 0.1-2 μ m) aperture to implement.
Homocercal chromatic radiation sensitive resin combination of the present invention is an eurymeric, and therefore with respect to minus, expectation has higher resolution.
When using the resin pattern of Homocercal chromatic radiation sensitive resin combination formation sclerosis of the present invention, for example on base material, form the layer that constitutes by above-mentioned Homocercal chromatic radiation sensitive resin combination, and expose through the mask irradiation with ray, it is favourable developing then.
As base material, what mention is transparency glass plate etc. for example.On above-mentioned base material, can form circuit such as TFT, CCD or color filter etc.
The layer that is made of Homocercal chromatic radiation sensitive resin combination can form by method and other method that for example applies Homocercal chromatic radiation sensitive resin combination on base material.Coating waits and implements by for example spin coating, the casting cladding process that flows, rolling method, slit spin coating, slot coated method.After the coating, carry out heated drying (prebake) or under reduced pressure carry out drying, for example evaporating volatile constituent such as solvent, thereby form the Homocercal chromatic radiation sensitive resin combination layer by heating.Here, heating-up temperature is generally 70-200 ℃, preferred 80-130 ℃.This Homocercal chromatic radiation sensitive resin combination layer contains volatile constituent hardly.The thickness of above-mentioned radiation-sensitive resin composition layer is about 1.5-5 μ m.
Then, this Homocercal chromatic radiation sensitive resin combination layer is shone through mask with ray.Mask pattern resin pattern shape is as required suitably selected.As ray, for example use as beams such as g line, i lines.The irradiation of ray is for example preferably used mask aligner, steeper to wait and is implemented, so that the useful to irradiation of rays bundle is parallel on all or part of surface of Homocercal chromatic radiation sensitive resin combination.By aforesaid radiation exposure, mask and Homocercal chromatic radiation sensitive resin combination layer to will definitely correctly implementing.
After above-mentioned exposure, implement to develop.Development can expose after for example stir method (paddle method), infusion process (immersion method), gunite enforcements such as (showermethod) by making the Homocercal chromatic radiation sensitive resin combination layer.As developer, use alkaline aqueous solution usually.As alkaline aqueous solution, use the aqueous solution of alkali cpd, and alkali cpd can be inorganic alkali compound and organo-alkali compound.
The example of inorganic alkali compound comprises NaOH, potassium hydroxide, sodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate (ADP), potassium dihydrogen phosphate, dipotassium hydrogen phosphate, sodium silicate, potassium silicate, sodium carbonate, sal tartari, sodium bicarbonate, saleratus, sodium borate, potassium borate, ammonia etc.
The example of organo-alkali compound comprises tetramethylammonium hydroxide, hydroxide 2-hydroxyethyl trimethylammonium, single methylamine, dimethylamine, trimethylamine, mono aminoethane, diethylamine, triethylamine, single isopropylamine, diisopropylamine, monoethanolamine etc.
Above-mentioned alkali cpd can use separately or two or more are used in combination.The content of alkali cpd is preferably 0.01-10wt% in the developer, and 0.1-5wt% more preferably is in the weight fraction based on developer.
Developer can comprise surfactant.The example of surfactant comprises non-ionic surfactant, cationic surfactant, anionic surfactant etc.
The example of non-ionic surfactant comprises polyethylene oxide derivatives, for example polyethylene oxide alkyl ethers, polyoxyethylene aryl ether, polyoxyethylene alkyl aromatic ether etc.; Ethylene oxide/propylene oxide segmented copolymer, sorbitan esters of fatty acids, polyoxyethylene sorbitan esters of fatty acids, polyoxyethylene fatty acid sorbitol ester, fatty glyceride, polyoxyethylene fatty acid esters, polyoxyethylene alkyl amine etc.
The example of cationic surfactant comprises amine salt, for example hydrochloric acid octadecylamine etc.; Quaternary ammonium salt, for example chlorination lauryl trimethylammonium etc.
Examples of anionic surfactants comprises sulfuric acid high alcohol ester salt, for example sulfuric acid bay alcohol ester sodium, sulfuric acid oleyl alcohol ester sodium etc.;
Alkyl sulfate, for example lauryl sodium sulfate, ammonium lauryl sulfate etc.;
Alkyl aryl sulfonate, for example neopelex, dodecyl sodium naphthalene sulfonate etc.
These surfactants can use separately or two or more are used in combination.
Developer can comprise organic solvent.As above-mentioned organic solvent, what mention is water-miscible organic solvent for example, as methyl alcohol, ethanol etc.
By developing, in front in the exposure of Homocercal chromatic radiation sensitive resin combination layer, be dissolved in the developer with the zone of radiation exposure, kept being not dissolved in developer by the zone of radiation exposure, and the formation resin pattern.
Because Homocercal chromatic radiation sensitive resin combination of the present invention comprises quinone di-azido compound (B), even therefore this Homocercal chromatic radiation sensitive resin combination layer is very short with the duration of contact of developer, irradiation area also is easy to dissolve and remove.In addition owing to comprise quinone di-azido compound (B), even therefore the duration of contact of this Homocercal chromatic radiation sensitive resin combination layer and developer longer, non-irradiation area can not dissolve in developer and can not disappear yet.
After the alkaline development, wash usually and drying.When requiring higher photostability, further use all or part of surface of radiation exposure gained resin pattern after the preferred drying.Here be used for irradiated ray and be preferably ultraviolet ray or far ultraviolet, and the exposure of unit area preferably is higher than the exposure in the aforementioned exposure.
Therefore from the thermotolerance of the resin pattern that improves final available painted sclerosis and the viewpoint of solvent resistance, preferably the resin pattern that forms is further implemented thermal treatment (afterwards curing).Heating is implemented by the method for using firing equipment heated substrates such as heating plate for example, clean baking oven.Heating-up temperature is generally 150 ℃-250 ℃, and preferred about 180 ℃-240 ℃, and be generally 5 minutes heat time heating time-120 minutes, preferred 15 minutes-90 minutes.By heating, make the pattern sclerosis to form the resin pattern of painted sclerosis.
The hardening resin pattern of Xing Chenging is for by the pattern that obtains of sclerosis Homocercal chromatic radiation sensitive resin combination of the present invention thus, and the resin pattern that can be used as painted sclerosis is formed the projection, black matix of light spacer, the liquid crystal aligning control of liquid crystal panel for example etc.
The Homocercal chromatic radiation sensitive composition of the application of the invention can form good painted hardening resin pattern.
Embodiment
The present invention will set forth in more detail based on following examples, but need not explanation, the invention is not restricted to these embodiment.
Synthesis example 1
In the 200ml four neck flasks that stirrer, condenser pipe and thermometer are housed, add following raw material.This four necks flask is flowed down in the immersion oil bath at nitrogen, and when temperature is 85-95 ℃ in keeping flask, stir the mixture 3 hours to obtain Resin A 1.This Resin A 1 has and is calibrated to 8000 weight-average molecular weight based on polystyrene.
Methacrylic acid 7.9g
N-cyclohexyl maleimide 14.5g
3-ethyl-3-methacryloxy methyl oxetanes 21.4g
Diglycol ethyl methyl ether 90.7g
Azoisobutyronitrile 1.1g
This Resin A 1 is measured under the following conditions based on the weight-average molecular weight of polystyrene calibration.
Equipment: HLC-8120GPC (manufacturing of Tosoh company)
Post; TSK-GELG2000HXL, TSK-GELG4000HXL series
Column temperature: 40 ℃
Mobile phase solvent: tetrahydrofuran
Flow rate: 1.0ml/min
Injection rate IR: 50 μ L
Detecting device: RI
Measuring samples concentration: 0.6wt% (solvent: tetrahydrofuran)
The standard substance that is used to calibrate: TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, A-500 (manufacturing of Tosoh company)
Embodiment 1
Compound (30 weight portion), KBM-303 (Shin-EstuSilicones manufacturing with Resin A 1 (100 weight portion), following formula (1), 3 weight portions), (Dow Coming Toray Co.Ltd. makes for diglycol ethyl methyl ether (3 weight portion), butyl lactate (16 weight portion), SH8400,0.03 weight portion) and black colorant (obtain by mixing 19wt% black pigment, 5wt% spreading agent, 76wt% propylene glycol methyl ether acetate, 10 weight portions) mix, to obtain Homocercal chromatic radiation sensitive resin combination 1.
At clear glass substrate (#1737, Coming Co. makes) on, the above Homocercal chromatic radiation sensitive resin combination 1 that obtains of spin coating, and use clean baking oven 100 ℃ of heating (prebake) 3 minutes, have the radiation-sensitive resin composition layer of 3 μ m thickness with formation.This film thickness is measured (DEKTAK3 by thin-film thickness meter; ULVAC K.K. makes).
After this, the Homocercal chromatic radiation sensitive resin combination that obtains is by using contact float device (M-2Li; MIKASK K.K. makes) with ray (at 365nm standard wavelength's intensity: 150mJ/cm
2) shine through mask and to expose.The mask that uses in this operation comprises row/spacing (line/space)=30 μ m/30 μ m, 20 μ m/20 μ m, 10 μ m/10 μ m, 9 μ m/9 μ m, 8 μ m/8 μ m, 7 μ m/7 μ m, 6 μ m/6 μ m, 5 μ m/5 μ m.
After the exposure, this layer immersed in 23 ℃ of developers (comprising weight fraction concentration is the potassium hydroxide of 0.1wt% and the aqueous solution that comprises non-ionic surfactant) developed in 150 seconds, with the ultrapure water washing, drying is cured 30 minutes subsequently to obtain resin pattern after 220 ℃ of enforcement then.The resin pattern that uses scanning electron microscope observation to obtain, the result confirms to form the resin pattern of 6 μ m/6 μ m or higher row/spacing pattern.
Comparative Examples 1
Multipolymer with resin B 1[formula (2), structural unit ratio: a/b/c/d=10/54/21/15, weight-average molecular weight based on the polystyrene calibration: 15000, here measure under the condition identical based on the weight-average molecular weight of polystyrene calibration with Resin A 1] (50 weight portion), photopolymerization compound K AYARADDPHA (Nippon Kayaku Co.Ltd. manufacturing) (50 weight portion), light trigger Irgacure 369 (CibaSpeciality Chemicals manufacturing) (3 weight portion), light-initiated auxiliary agent EAB-F (Hodogaya ChemicalCo., Ltd. make) (1 weight portion), propylene glycol methyl ether acetate (113 weight portion), propionic acid 3-ethoxy ethyl ester (24 weight portion) and black colorant are (by mixing the 19wt% black pigment, 5wt% spreading agent and 76wt% propylene glycol methyl ether acetate obtain) mix, to obtain Homocercal chromatic radiation sensitive resin combination 2.
Adopt the mode identical to form the radiation-sensitive resin composition layer by this Homocercal chromatic radiation sensitive resin combination 2 with embodiment 1.Further, the Homocercal chromatic radiation sensitive resin combination layer that the same way as exposure obtains among employing and the embodiment 1.
After the exposure, this layer immersed in 23 ℃ of developers (comprising weight fraction concentration is the potassium hydroxide of 0.05wt% and the aqueous solution that comprises non-ionic surfactant) developed in 120 seconds, with the ultrapure water washing, drying is cured 30 minutes subsequently to obtain resin pattern after 220 ℃ of enforcement then.The resin pattern that uses scanning electron microscope observation to obtain, the result confirms to form the resin pattern of 20 μ m/20 μ m or higher row/spacing pattern.Yet 10 μ m/10 μ m or lower pattern show that the existence part is remaining.
Claims (9)
1. Homocercal chromatic radiation sensitive resin combination, comprise (A) alkali solubility curable resin, (B) quinone di-azido compound and (C) colorant, wherein (A) alkali solubility curable resin is to comprise (a1) derived from the structural unit of unsaturated carboxylic acid with (a2) derived from the multipolymer of the unsaturated compound structural unit with oxa-cyclobutyl except that unsaturated carboxylic acid.
2. according to the resin combination of claim 1, wherein (A) alkali solubility curable resin comprise further that (a3) is at least a and be selected from (a31) derived from the structural unit of carboxylate, (a32) with carbon-to-carbon unsaturated bond derived from the structural unit of the structural unit of aromatics, (a33) derived from propylene nitrile compound, (a34) with carbon-to-carbon unsaturated bond derived from the structural unit that randomly has the maleimide compound that the N position replaces with (a35) derived from the structural unit of the structural unit of epoxide with carbon-to-carbon unsaturated bond.
3. according to the resin combination of claim 1 or 2, wherein colorant (C) is at least a pigment that is selected from organic pigment and black inorganic pigment.
4. the resin combination any according to claim 1-3 further comprises (D) organic solvent.
5. the resin pattern of a painted sclerosis, it uses according to resin combination any among the claim 1-4 and forms.
6. method of producing the resin pattern of painted sclerosis, be included on the base material and apply, remove and desolvate, shine this resin combination through mask with ray according to resin combination any among the claim 1-4, implement to develop with alkaline aqueous solution then, to form pattern.
7. according to the method for the resin pattern of the painted sclerosis of production of claim 6, wherein after pattern forms, further heat this pattern.
8. method of producing the resin pattern of painted sclerosis, be included in the coating Homocercal chromatic radiation sensitive resin combination any on the base material according to claim 1-4, remove and desolvate, shine this resin combination with ray through mask, implement to develop to form specific pattern and to use all or part of surface of pattern on the radiation exposure base material then with alkaline aqueous solution.
9. the method for production color solidification resin combination according to Claim 8 wherein behind all or part of surface of using pattern on the radiation exposure base material, further heats this pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006179272 | 2006-06-29 | ||
| JP2006179272A JP2008009121A (en) | 2006-06-29 | 2006-06-29 | Colored positive radiation-sensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101097404A true CN101097404A (en) | 2008-01-02 |
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ID=39011301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101292914A Pending CN101097404A (en) | 2006-06-29 | 2007-06-27 | Homocercal chromatic radiation sensitive resin combination |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008009121A (en) |
| KR (1) | KR20080001629A (en) |
| CN (1) | CN101097404A (en) |
| TW (1) | TW200809412A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736416A (en) * | 2011-04-15 | 2012-10-17 | 住友化学株式会社 | Dyeing photosensory resin composition |
| CN104181771A (en) * | 2013-05-24 | 2014-12-03 | 奇美实业股份有限公司 | blue photosensitive resin composition for color filter and color filter |
| CN105301900A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition and method for forming photolithographic pattern |
| CN105301903A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5029836B2 (en) * | 2008-03-19 | 2012-09-19 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof |
| JP5343664B2 (en) * | 2009-03-30 | 2013-11-13 | Ｊｓｒ株式会社 | Radiation-sensitive resin composition, organic EL display element partition and insulating film, and method for forming the same |
| CN103782237B (en) * | 2011-08-30 | 2017-02-15 | 旭硝子株式会社 | Negative photosensitive resin composition, partition wall, black matrix and optical element |
| KR102115817B1 (en) * | 2013-01-16 | 2020-05-27 | 제이에스알 가부시끼가이샤 | Thermosetting resin composition for forming cured film, negative radiation-sensitive resin composition, positive radiation-sensitive resin composition, cured film, method for forming the same, semiconductor device and display device |
| JP6333946B2 (en) * | 2014-02-20 | 2018-05-30 | 富士フイルム株式会社 | Photosensitive resin composition, cured product and manufacturing method thereof, resin pattern manufacturing method, cured film, liquid crystal display device, organic EL display device, infrared cut filter, and solid-state imaging device |
| JP6333947B2 (en) * | 2014-02-20 | 2018-05-30 | 富士フイルム株式会社 | Photosensitive resin composition, cured product and manufacturing method thereof, resin pattern manufacturing method, cured film, liquid crystal display device, organic EL display device, infrared cut filter, and solid-state imaging device |
| TWI683182B (en) * | 2017-04-07 | 2020-01-21 | 日商昭和電工股份有限公司 | Photosensitive resin composition and method for manufacturing radiation lithography structure |
| CN111458978A (en) * | 2020-04-17 | 2020-07-28 | 北京北旭电子材料有限公司 | Photoresist composition |
-
2006
- 2006-06-29 JP JP2006179272A patent/JP2008009121A/en active Pending
-
2007
- 2007-06-22 TW TW096122428A patent/TW200809412A/en unknown
- 2007-06-26 KR KR1020070063046A patent/KR20080001629A/en not_active Application Discontinuation
- 2007-06-27 CN CNA2007101292914A patent/CN101097404A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736416A (en) * | 2011-04-15 | 2012-10-17 | 住友化学株式会社 | Dyeing photosensory resin composition |
| CN108845481A (en) * | 2011-04-15 | 2018-11-20 | 住友化学株式会社 | Photosensitive composition |
| CN104181771A (en) * | 2013-05-24 | 2014-12-03 | 奇美实业股份有限公司 | blue photosensitive resin composition for color filter and color filter |
| CN105301900A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition and method for forming photolithographic pattern |
| CN105301903A (en) * | 2015-11-16 | 2016-02-03 | 北京中科紫鑫科技有限责任公司 | Photoresist composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008009121A (en) | 2008-01-17 |
| TW200809412A (en) | 2008-02-16 |
| KR20080001629A (en) | 2008-01-03 |
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