CN101063897A - Machine frame server and module clip used in same - Google Patents
Machine frame server and module clip used in same Download PDFInfo
- Publication number
- CN101063897A CN101063897A CN 200610035254 CN200610035254A CN101063897A CN 101063897 A CN101063897 A CN 101063897A CN 200610035254 CN200610035254 CN 200610035254 CN 200610035254 A CN200610035254 A CN 200610035254A CN 101063897 A CN101063897 A CN 101063897A
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- module card
- rack server
- motherboard
- casing
- module
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Abstract
This invention discloses one rack servo, which comprises one shell, one host board inside shell, one memory module, one power supply and two module cards, wherein the host boar is set with one first module card tank, one second tank and one chip set; the power supply device is to provide power for host board and memory module; two module cards are separately inserted into first and second tanks each composed of one circuit baseboard, one central process unit on the circuit baseboard and several plug buffer array memory modules and its plug tanks.
Description
Technical field
The present invention is relevant for a kind of rack server, particularly about a kind of rack server of 2U specification.
Background technology
The normal framework server can be 1U, 2U, 4U and 5U according to the size distinction of its casing generally.With the 2U specification, the high reference dimension of its casing length and width is about 651X480X88.4 (unit: mm), and at present the central processing unit of 2U rack server and internal memory are still and directly are arranged on the motherboard, and size for fear of motherboard, the outfit of general 2U specification can only be provided with 2 central processing units usually, its memory bank that can be provided with is also limited, in addition, because its casing height of server of 2U specification is 88.4mm only, so based on internal memory and Memory Controller Hub (Memory Controller) transmitted in mode arranged side by side in the past, for fear of its length of transmission line, and CPU (central processing unit) and internal memory can't be inserted on the motherboard in the mode of module card and be contained in the casing, so with present normalized 2U rack server, its degree that can expand is also limited.
Summary of the invention
Therefore, the present invention's purpose promptly is integrated into the module card pattern with CPU (central processing unit) and internal memory providing a kind of, and can be for the module card that is inserted in the 2U rack server.
Another object of the present invention is to provide a kind of 2U rack server that possesses high extendibility.
So, the module card of rack server of the present invention is in order to be inserted in a motherboard of a rack server, this module card comprises a circuit substrate and is located at a CPU (central processing unit) on this circuit substrate and at least two memory banks, and each memory bank can be for the internal memory that plugs a full buffer biserial memory modules specification.
Rack server of the present invention is to comprise a casing, is installed in a motherboard, an access module, a power supply unit and two module card in the casing.This motherboard is provided with one first module card slot, one second module card slot and a chipset; Power supply unit is in order to provide this motherboard and the required electric power of this access module.And two module card are inserted in this first, second module card slot respectively, and respectively this module card comprises that a circuit substrate, is located at the CPU (central processing unit) on this circuit substrate, and some for the memory bank that plugs full buffer biserial memory modules specification internal memory.
Description of drawings
Fig. 1 is the inner plane arrangement plan of rack server one preferred embodiment of the present invention;
Fig. 2 is a motherboard and the module card in this preferred embodiment; And
Fig. 3 is inserted with an expansion board on this motherboard.
Embodiment
About addressing other technology contents, characteristics and effect before the present invention, in the following detailed description that cooperates with reference to one of a graphic preferred embodiment, can clearly present.
Consult Fig. 1, the casing 11, that the preferred embodiment of rack server of the present invention comprises a 2U dimensions is installed in this casing 11 interior motherboard 12, a power supply unit 13, some radiator fans 14 and an access module 17.
The casing canonical reference size of general 2U rack server is about 651X480X88.4 (unit: mm), the inner space 100 of this casing 11 by a median septum 10 separate into about one first block 101 and one second block 102, access module 17 (such as hard disk, floppy drive and CD-ROM drive) is arranged in first block 101, the access module 17 of present embodiment indication comprises that motherboard 12 and power supply unit 13 then are to be arranged in second block 102 such as data access equipment such as hard disk, floppy drive and CD-ROM drives.
Consult Fig. 1, Fig. 2, Fig. 3, motherboard 12 is provided with two control chip group 121, and be arranged before and after first, second, the 3rd, the 4th totally four module card slots 122 that meet the bus of super transmission (Hyper Transport) specification, altogether can be for plugging four module card 15 (only showing among the figure), each module card 15 comprises a circuit substrate 150, one be located on the circuit substrate 150 among Central Processing Unit 151, and at least two memory banks of being located on the circuit substrate 150 152, each memory bank 152 can be for plugging a slice full buffer biserial memory modules (Fully Buffered-DIMM, hereinafter to be referred as FB-DIMM) internal memory 154 of specification, and each module card 15 of present embodiment is provided with eight memory banks 152, so can be for plugging eight FB-DIMM internal memories 154.Be noted that especially, circuit substrate 150 with this module card 15, because FB-DIMM internal memory 154 is to transmit with point-to-point serial mode, internal memory different from the past is to transmit in mode arranged side by side, therefore significantly reduced and CPU (central processing unit) 151 between signal wire length, cooperate the module card slot 122 of the bus of Hyper Transport specification to be provided with again, and make that the coiling of circuit substrate 150 is more succinct, and then just can directly dwindle its size, in the present embodiment, this circuit substrate 150 highly only have 7 centimeters, so when module card 15 is inserted on the motherboard 12, just can be contained in the 2U casing of 88.4mm highly only.
In addition, the plate edge of motherboard 12 contiguous top remaining spaces, more be provided with a long card expansion slot 123 and can be for plugging an expansion board 16, and expansion board 16 is provided with the slot 16 1 of four adapters, and can be for plugging four adapters as PCI-E, PCI, HTX or PCI-X specification.
In addition, for solving the heat dissipation problem that numerous CPU (central processing unit) 151 and internal memory 154 are produced, numerous fans 14 of present embodiment are along between median septum 10 and motherboard 12, the power supply unit 13 and vertically arrange, that is make the wind direction of each fan 14 parallel (shown in Fig. 3 arrow 141) with the plate face direction of module card 15, mode with side feeding is dispelled the heat, and can take away the heat energy between motherboard 12 and the module card 15 rapidly.
In sum, in the preferred embodiment of rack server of the present invention, utilize and deposit 154 and the signal transmission form of super transmission (Hyper Transport) specification bus within the FB-DIMM specification, be able to the length of reduction circuit plate wiring, when using it for the rack server of 2U specification, just can realize CPU (central processing unit) and internal memory are implemented in the mode of module card, and be inserted in the motherboard 12, be contained in casing 11 more highly only in the 2U specification server of 88.4mm, with general 2U rack server now in comparison, not only can dwindle the area of motherboard, save baseplate material, also can improve the expandability of this server by the modularization of CPU (central processing unit) and internal memory, and the setting by these radiator fans, then can solve numerous CPU (central processing unit) and heat dissipation problem that internal memory produced.
Claims (10)
1. the module card of a rack server is applicable to the rack server of 2U specification, and this server comprises that a casing and is arranged at the motherboard in this casing, and this module card is in order to be inserted on this motherboard, and this module card comprises:
One circuit substrate;
One CPU (central processing unit) is arranged on this circuit substrate; And
At least two memory banks are arranged on this circuit substrate, to supply to plug the internal memory of two full buffer biserial memory modules specifications respectively.
2. according to the module card of the described rack server of claim 1, it is characterized in that: described module card more comprises the voltage adjuster of being located on the foregoing circuit substrate.
3. according to the module card of the described rack server of claim 1, it is characterized in that: described module card is to carry out data transmission with super bus and the above-mentioned motherboard that transmits (Hyper Transport) specification.
4. rack server comprises:
One casing;
One motherboard is arranged in this casing, and is provided with one first module card slot, one second module card slot and a chipset;
One access module is placed in this casing;
One power supply unit is placed in this casing, supplies this motherboard and the required electric power of this access module; And
Two module card are inserted in this first, second module card slot respectively, and respectively this module card comprises that a circuit substrate, is located at the CPU (central processing unit) on this circuit substrate, and some for the memory bank that plugs full buffer biserial memory modules specification internal memory.
5. according to the described rack server of claim 4, it is characterized in that: described rack server more comprises some radiator fans of being located in the said machine casing.
6. according to the described rack server of claim 5, it is characterized in that: described fan is to be provided with these module card with its wind direction with paralleling, and can dispel the heat to these module card.
7. according to the described rack server of claim 4, it is characterized in that: described motherboard more is provided with a long card expansion slot, and this rack server more comprise one can be for being inserted in the expansion board of this expansion card slot, and this expansion board is provided with some slots for the adapter that plugs PCI-E, PCI, HTX or PCI-X specification.
8. according to the described rack server of claim 4, it is characterized in that: described motherboard and above-mentioned module card are to carry out data transmission with the bus of super transmission (Hyper Transport) specification.
9. according to the described rack server of claim 4, it is characterized in that: more comprise the voltage adjuster of being located at the foregoing circuit substrate on the described module card.
10. according to the described rack server of claim 4, it is characterized in that: the high dimensions of the length and width of described casing is 651mm * 480mm * 88.4mm, is the specification of standard 2U rack server.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610035254 CN101063897A (en) | 2006-04-28 | 2006-04-28 | Machine frame server and module clip used in same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610035254 CN101063897A (en) | 2006-04-28 | 2006-04-28 | Machine frame server and module clip used in same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101063897A true CN101063897A (en) | 2007-10-31 |
Family
ID=38964946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610035254 Pending CN101063897A (en) | 2006-04-28 | 2006-04-28 | Machine frame server and module clip used in same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101063897A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640984B (en) * | 2008-07-30 | 2011-06-15 | 天津天地伟业数码科技有限公司 | Monitoring machine case |
| CN102081432B (en) * | 2009-11-30 | 2012-08-15 | 英业达股份有限公司 | Server system |
| CN104656844A (en) * | 2015-02-25 | 2015-05-27 | 浪潮电子信息产业股份有限公司 | 2U (two-rack-unit) system in high-density flexible expansion |
-
2006
- 2006-04-28 CN CN 200610035254 patent/CN101063897A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101640984B (en) * | 2008-07-30 | 2011-06-15 | 天津天地伟业数码科技有限公司 | Monitoring machine case |
| CN102081432B (en) * | 2009-11-30 | 2012-08-15 | 英业达股份有限公司 | Server system |
| CN104656844A (en) * | 2015-02-25 | 2015-05-27 | 浪潮电子信息产业股份有限公司 | 2U (two-rack-unit) system in high-density flexible expansion |
| CN104656844B (en) * | 2015-02-25 | 2018-04-24 | 浪潮电子信息产业股份有限公司 | A kind of 2U systems of high density flexible expansion |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |