CN101028699A - Polishing head for trimming polished wafter evenness - Google Patents
Polishing head for trimming polished wafter evenness Download PDFInfo
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- CN101028699A CN101028699A CNA2006100114008A CN200610011400A CN101028699A CN 101028699 A CN101028699 A CN 101028699A CN A2006100114008 A CNA2006100114008 A CN A2006100114008A CN 200610011400 A CN200610011400 A CN 200610011400A CN 101028699 A CN101028699 A CN 101028699A
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Abstract
A polishing unit for trimming and polishing wafer to obtain high smoothness is composed of a wafer fixing disc, an upper polishing disc with reverse T-shaped cross-section, an inflatable air bag fixed to bottom surface of said upper polishing disc, and a polishing pad fixed to the bottom surface of said air bag.
Description
Technical field
The present invention has designed a kind of rubbing head that can trimming polished wafer leveling degree, is used for the finishing of wafer polishing or flatness.
Background technology
Wafer is in polishing processing, use resilient polishing pad, under certain pressure, cooperate the polishing soup to carry out chemically mechanical polishing, the pressure that makes wafer bear from the edge to the center owing to flexible reason progressively reduces, after polishing, the wafer global shape can become the center and heave, " bread " shape that progressively subsides to the edge, submarginal place subsides or is more serious, produce " limit of collapsing " phenomenon, be that the edge has significantly than other places and subsides, the flatness of entire wafer is had bigger influence.Produce after this geometrical defect, be difficult to solve by common chemical mechanical polishing method, again carry out mechanical lapping, because the finished product wafer thickness has certain limitation, do not allow again, the polishing cumulative time is long slightly just can to cause wafer because flatness is former thereby take place defectively, because the value of single-wafer is very high, just has been necessary so carry out the finishing of wafer leveling degree.
Summary of the invention
The objective of the invention is to, a kind of rubbing head that can trimming polished wafer leveling degree is provided, it can or use different elastomeric materials instead in order to adapt to the wafer leveling degree finishing of different size and different materials by adjustments of gas pressure.
A kind of rubbing head that can trimming polished wafer leveling degree of the present invention is characterized in that, comprising:
One wafer fixed disk;
Polishing disk on one, section of polishing disk is an inverted T-shaped on this;
One air bag, this air bag is fixed on the bottom surface of polishing disk, and this air bag can be inflated;
One polishing pad, this polishing pad is fixed on the bottom surface of air bag;
Desire with airbag aeration, is fixed on wafer above the wafer fixed disk during with wafer polishing, the rotation of polishing disk and the upper and lower displacement of going up polishing disk in the control, by polishing pad to wafer polishing.
Wherein air bag is a spherical air bag, and the pressure that produces when contacting with wafer progressively reduces to rim pressure from the air bag center.
Wherein the wafer fixed disk is the garden plate-like.
It is corresponding with the wafer fixed disk wherein to go up polishing disk, also is the garden plate-like.
Wherein air bag is the plane when non-inflated state, is close to the lower surface of polishing disk.
Rubbing head that can trimming polished wafer leveling degree of the present invention, it can or use different elastomeric materials instead in order to adapt to the wafer leveling degree finishing of different size and different materials by adjustments of gas pressure.
Description of drawings
For further specifying concrete technology contents of the present invention, below in conjunction with embodiment and accompanying drawing describes in detail as after, wherein:
Fig. 1 is a structural representation of the present invention; Wherein go up polishing disk 1: top fixation balloon, during unaerated air bag with its lower surface be adjacent to, air bag 2, polishing pad 3, processed wafer 4, wafer fixed disk 5;
Fig. 2 is air bag 2 inflated condition schematic diagrames among Fig. 1;
Fig. 3 is the schematic diagram that the present invention polishes wafer.
The specific embodiment
See also shown in Figure 1ly, a kind of rubbing head that can trimming polished wafer leveling degree of the present invention is characterized in that, comprising:
One wafer fixed disk 5, this wafer fixed disk 5 is the garden plate-like;
One air bag 2, this air bag 2 is fixed on the bottom surface of polishing disk 1, and this air bag can be inflated, wherein air bag 2 is a spherical air bag, the pressure that produces when contacting with wafer progressively reduces to rim pressure from the air bag center, and this air bag 2 is the plane when non-inflated state, is close to the lower surface of polishing disk 1;
One polishing pad 3, this polishing pad 3 is fixed on the bottom surface of air bag 2;
Desire with air bag 2 inflations, is fixed on wafer above the wafer fixed disk 5 during with wafer polishing, and the upper and lower displacement of polishing disk 1 on the rotation of polishing disk 1 reaches control in is by 3 pairs of wafer polishings of polishing pad.
Wherein air bag 2 is a spherical air bag, and the pressure that produces when contacting with wafer progressively reduces to rim pressure from the air bag center.
Rubbing head that can trimming polished wafer leveling degree of the present invention, see Fig. 1, this device adopts a circular iron pan 1 that has passage, stick the resilient air bag 2 of one deck above, post polishing pad 3 below the air bag 2, this air bag expands after the inflation, forms a ball cross section (see figure 2), sticks polishing pad above and cooperates polishing fluid to carry out wafer is polished the correction flatness; Because heave at air bag 2 centers, when exerting pressure with wafer 4 contacts, pressure is from the center wafer to the edge, by greatly progressively diminishing, the removal amount of wafer also just progressively diminishes from the center to the edge accordingly, this process just in time remedies the limit defective of bringing with the method for normal polishing of collapsing, and may be used in the flatness finishing of wafer.Adjustments of gas pressure or use different elastomeric materials instead in order to adapt to the wafer leveling degree finishing of different size and different materials.
See also Fig. 3, use vacuum cup 5 to fix four inches wafers 4, adopt the polishing disk 1 of diameter 97mm, passage is left at the center.Planar air bag 2 is being wrapped polishing disk from the outside, compressed air feeds in the air bag by centre bore, reconciling gas pressure is that air bag is heaved general 2-3 millimeter, feed polishing fluid, fall rubbing head, polishing pad 3 is with the wafer contact, and both overlap substantially, polishing pad 3 is with the about 98-99 millimeter of wafer contact diameter, and the wafer of outmost turns 1 millimeter part is not done any processing in dressing process.Exert pressure rubbing head is closely contacted with wafer, rubbing head drive air bag and polishing pad begin rotation then, repair the concrete parameter of wafer as required and determine tonnage and time, add and generally select man-hour chip back surface, finishing through a few minutes, removed the material part that center wafer is heaved, the flatness of wafer generally can be returned in the 2-3 micron by 7 microns.
Claims (5)
1, a kind of rubbing head that can trimming polished wafer leveling degree is characterized in that, comprising:
One wafer fixed disk;
Polishing disk on one, section of polishing disk is an inverted T-shaped on this;
One air bag, this air bag is fixed on the bottom surface of polishing disk, and this air bag can be inflated;
One polishing pad, this polishing pad is fixed on the bottom surface of air bag;
Desire with airbag aeration, is fixed on wafer above the wafer fixed disk during with wafer polishing, the rotation of polishing disk and the upper and lower displacement of going up polishing disk in the control, by polishing pad to wafer polishing.
2, rubbing head that can trimming polished wafer leveling degree according to claim 1 is characterized in that wherein air bag is a spherical air bag, and the pressure that produces when contacting with wafer progressively reduces to rim pressure from the air bag center.
3, rubbing head that can trimming polished wafer leveling degree according to claim 1 is characterized in that wherein the wafer fixed disk is the garden plate-like.
4, rubbing head that can trimming polished wafer leveling degree according to claim 1 is characterized in that it is corresponding with the wafer fixed disk wherein to go up polishing disk, also is the garden plate-like.
5, rubbing head that can trimming polished wafer leveling degree according to claim 1 is characterized in that wherein air bag is the plane, is close to the lower surface of polishing disk when non-inflated state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100114008A CN101028699A (en) | 2006-03-01 | 2006-03-01 | Polishing head for trimming polished wafter evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100114008A CN101028699A (en) | 2006-03-01 | 2006-03-01 | Polishing head for trimming polished wafter evenness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101028699A true CN101028699A (en) | 2007-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100114008A Pending CN101028699A (en) | 2006-03-01 | 2006-03-01 | Polishing head for trimming polished wafter evenness |
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| CN (1) | CN101028699A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342672B (en) * | 2008-08-21 | 2010-06-02 | 友达光电股份有限公司 | Grinding device and combination method thereof |
| CN102765012A (en) * | 2012-03-23 | 2012-11-07 | 中国科学院光电技术研究所 | Electrorheological fluid-based flexible controllable air sac polishing tool |
| CN103639887A (en) * | 2013-10-28 | 2014-03-19 | 中国计量学院 | Flexible pneumatic polishing disk for crystal substrate surface machining |
| US9073171B2 (en) | 2008-10-21 | 2015-07-07 | Lg Siltron Inc. | Polisher, pressure plate of the polisher and method of polishing |
| CN109514384A (en) * | 2018-11-07 | 2019-03-26 | 西安工业大学 | The polishing method and device of aspherical optical element |
| CN111496658A (en) * | 2020-03-13 | 2020-08-07 | 东莞市飞尧科技有限公司 | Light machine is swept to strong adaptability |
| CN112652683A (en) * | 2021-01-20 | 2021-04-13 | 上海安洁颜文化传媒有限公司 | Photovoltaic panel assembly stacking device capable of automatically detecting and correcting in transmission |
| CN113146465A (en) * | 2021-04-06 | 2021-07-23 | 安徽禾臣新材料有限公司 | Adsorption pad for double-sided grinding of thin wafer and production method |
| CN114074287A (en) * | 2020-08-11 | 2022-02-22 | 平坦标准技术有限公司 | Grinding equipment for display device substrate |
| CN114833715A (en) * | 2022-03-01 | 2022-08-02 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer polishing device and method |
-
2006
- 2006-03-01 CN CNA2006100114008A patent/CN101028699A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342672B (en) * | 2008-08-21 | 2010-06-02 | 友达光电股份有限公司 | Grinding device and combination method thereof |
| US9073171B2 (en) | 2008-10-21 | 2015-07-07 | Lg Siltron Inc. | Polisher, pressure plate of the polisher and method of polishing |
| CN102765012A (en) * | 2012-03-23 | 2012-11-07 | 中国科学院光电技术研究所 | Electrorheological fluid-based flexible controllable air sac polishing tool |
| CN102765012B (en) * | 2012-03-23 | 2014-06-25 | 中国科学院光电技术研究所 | Electrorheological fluid-based flexible controllable air sac polishing tool |
| CN103639887A (en) * | 2013-10-28 | 2014-03-19 | 中国计量学院 | Flexible pneumatic polishing disk for crystal substrate surface machining |
| CN109514384A (en) * | 2018-11-07 | 2019-03-26 | 西安工业大学 | The polishing method and device of aspherical optical element |
| CN111496658A (en) * | 2020-03-13 | 2020-08-07 | 东莞市飞尧科技有限公司 | Light machine is swept to strong adaptability |
| CN114074287A (en) * | 2020-08-11 | 2022-02-22 | 平坦标准技术有限公司 | Grinding equipment for display device substrate |
| CN112652683A (en) * | 2021-01-20 | 2021-04-13 | 上海安洁颜文化传媒有限公司 | Photovoltaic panel assembly stacking device capable of automatically detecting and correcting in transmission |
| CN113146465A (en) * | 2021-04-06 | 2021-07-23 | 安徽禾臣新材料有限公司 | Adsorption pad for double-sided grinding of thin wafer and production method |
| CN113146465B (en) * | 2021-04-06 | 2023-03-21 | 安徽禾臣新材料有限公司 | Adsorption pad for double-sided grinding of thin wafer and production method |
| CN114833715A (en) * | 2022-03-01 | 2022-08-02 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer polishing device and method |
| CN114833715B (en) * | 2022-03-01 | 2024-04-16 | 浙江富芯微电子科技有限公司 | Silicon carbide wafer chemical polishing device and method |
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