CN101026936B - Printed circuit board button solder pad holing method and its button solder pad - Google Patents
Printed circuit board button solder pad holing method and its button solder pad Download PDFInfo
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- CN101026936B CN101026936B CN2006100637087A CN200610063708A CN101026936B CN 101026936 B CN101026936 B CN 101026936B CN 2006100637087 A CN2006100637087 A CN 2006100637087A CN 200610063708 A CN200610063708 A CN 200610063708A CN 101026936 B CN101026936 B CN 101026936B
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- button
- key
- pcb
- circuit board
- printed circuit
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 title 2
- 238000003466 welding Methods 0.000 claims description 20
- 239000011229 interlayer Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 230000007774 longterm Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 206010052849 Oblique presentation Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Push-Button Switches (AREA)
Abstract
The method includes steps: locating position of opening in middle hole of weld pad in push button key of printed circuit board (PCB); position of opening is selected outside stress contact area (SCA) between small pan piece and PCB. Thus, when key is pressed down, stress contact will not be generated between top of small pan piece and middle hole in disc so as to prevent hole copper from breaking or copper shell of hole ring from floating. The invention also shortens travel of key so as to raise sensitivity. The invention does not increase designing difficulty and cost of product, raises reliability of push button key. Moreover, the invention is easy to implement.
Description
Technical field
The invention belongs to PCB (printed circuit board (PCB)) technical field, relate in particular to the technology of PCB button PAD (pad) dish mesopore design.
Background technology
The user uses the chance of button more and more in daily life, and as the keyboard of portable terminal, the button of domestic electrical equipment remote controller, the user finishes various functions by these buttons.But in the use of reality, button is malfunctioning also to be the problem that often occurs.
As the portable terminal keyboard is the main tool that the user operates, the user in use dials called number, editing short message or the like by keyboard, therefore, the keyboard frequency of utilization of portable terminal is higher, and keyboard malfunctioning also be the problem that portable terminal often occurs, and the malfunctioning a big chunk of button is relevant with the PCB design.
Have the young sheet of pot between mobile terminal key and the pcb board, behind the button pressurized, distortion is delivered on the young sheet of pot, and circle in the recessed contact of the young sheet center projections part of the pot PCB button PAD is finished circuit turn-on.
In the existing manufacturing process, circle lead-in wire scheme has following two kinds in the button PAD:
1, as shown in Figure 1, button PAD cylindrical copper ring designs a gap, and interior round outlet is drawn from gap, and is round in the outside outlet in PCB top layer in the button PAD, utilizes welding resistance printing ink to cover the outlet of interior circle, to guarantee the direct and young sheet short circuit of metal pan of outlet.
This lead-in wire mode has increased the PCB number of leads, and the welding resistance printing ink that covers on the lead-in wire is under the situation that button is repeatedly pushed, exposed leads behind the young pad wear of easy lining metal pan thereon, cause originally being electrically connected the interior circle of button PAD and the outer shroud short circuit of isolation, therefore this design long-term reliability is poor.
2, the PAD cylindrical forms a closed-loop, in it circle outlet not smooth, realize the interlayer circuit turn-on by dish mesopore mode usually, existing dish mesopore generally is divided into two kinds of blind hole and through holes again.
Circle is gone up design dish mesopore in the button PAD, utilization dish mesopore goes between to the PCB internal layer, but dish mesopore placement location at random, during practical operation mainly according to inertia, to coil that mesopore is arranged in the button PAD circle center and near near the center of circle, among Fig. 2 in the PAD dot on the circle be the position that the dish mesopore is set.
The young sheet metallic elastic speciality of pot determines its and PCB keyboard to realize that at first the position that contacts is in pot son sheet central authorities, no matter be the young sheet of button type or plane formula pot, contacting reality with PCB all is a contact, and the actual button center that concentrates on, the circle center reaches near near the center of circle in the button PAD if the hole is arranged on, under button is pushed repeatedly, the young sheet of pot top contacts with the hole alternate stress, the result of some contact is exactly that local stress is very concentrated, float off phenomenon even be easy to take place the hole copper orifice ring copper sheet that ruptures around the corner, formation is opened circuit or is little disconnected, cause mobile phone to use a period of time after button insensitive and even malfunctioning, produce long-term reliability problems.If the young sheet salient point of pot just overlaps with the hole heart, must need to add big key and push the every trade journey on the hole just as unsettled when salient point presses down, salient point does not directly contact copper sheet simultaneously, and giving user's visual sense is exactly the button poor sensitivity.
Summary of the invention
The object of the present invention is to provide a kind of boring method and key-press welding plate thereof of printed circuit board (PCB) key-press welding plate dish mesopore, be intended to solve the not high and not enough problem of long-term reliability of the button sensitivity that exists in the prior art.
For achieving the above object, the present invention adopts following technical scheme:
A kind of printed circuit board (PCB) key-press welding plate dish mesopore boring method, described method comprises the steps:
Position of opening to the dish mesopore of the realization interlayer circuit turn-on in the printed circuit board (PCB) key-press welding plate positions, and described position of opening is arranged on outside young sheet of pot and the described printed circuit board (PCB) stress contact area.
The position of described dish mesopore be diameter greater than the zone of R1 less than D3, wherein R1 is the diameter of young sheet of described pot and described printed circuit board (PCB) stress contact area, described D3 is described key-press welding plate outside diameter.
Described R1 is less than or equal to 0.8mm, and described D3 is greater than or equal to 2.0mm.
Described R1 comprises that also the young sheet of button pot pastes the diameter in zone partially.
Described button is portable terminal keyboard or remote controller keyboard button or game machine keyboard.
The invention also discloses a kind of printed circuit board (PCB) key-press welding plate, comprise that diameter is that interior circle and the diameter of D3 is the cylindrical of D4, circle is provided with the dish mesopore of realizing the interlayer circuit turn-on in described, and described dish mesopore is outside young sheet of button pot and described printed circuit board (PCB) stress contact area.
Described dish mesopore specifically at diameter greater than the zone of R1 less than D3, wherein R1 is the diameter of young sheet of described pot and described printed circuit board (PCB) stress contact area.
Described R1 is less than or equal to 0.8mm, and described D3 is greater than or equal to 2.0mm.
Described R1 comprises that also the young sheet of button pot pastes the diameter in zone partially.
Described button is portable terminal keyboard or remote controller keyboard button or game machine keyboard.
The present invention overcomes the deficiencies in the prior art, young sheet of pot and PAD stress contact area are avoided in employing when button PAD dish pore location is set, the position of dish mesopore is limited to the round position of keeping to the side in the PAD, when making button pressed the young sheet of pot top with coil mesopore and can not produce stress and contact, avoid hole copper fracture or orifice ring copper sheet to float off phenomenon, with the sensitivity of raising button and the technical scheme of long-term reliability, the present invention program is simple and easy to do, do not increase any design difficulty and product cost, only limit, can solve by key contacts poor sensitivity and long-term reliability problems by the position of button PAD being gone up the hole; Simultaneously, the position of dish mesopore is limited in the PAD circle keeps to the side also to have avoided pot a young sheet salient point and hollow overlapping after the position, the stroke when having shortened button pressed, feasible sensitivity by key contacts further improves.
Description of drawings
PAD is by cylindrical gap outlet schematic diagram in Fig. 1 prior art
Fig. 2 is that PAD passes through dish mesopore outlet schematic diagram in the prior art;
Fig. 3 is a disk pore location design diagram in the embodiment of the invention PAD;
Fig. 4 is a disk mesopore schematic diagram in the embodiment of the invention PAD.
Embodiment
The embodiment of the invention is avoided young sheet of pot and PAD stress contact area by button PAD dish pore location is set, the position of dish mesopore is limited to the round position of keeping to the side in the PAD, when making button pressed the young sheet of pot top with coil mesopore and can not produce stress and contact, avoid hole copper fracture or orifice ring copper sheet to float off phenomenon, to improve the sensitivity and the long-term reliability of button.
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Position to the dish mesopore in the embodiment of the invention specifically limits, and as shown in Figure 3, the round design attitude of going up the hole requires as follows in the PCB button PAD:
The hole is arranged in the annular region within as shown in Figure 3 the D3, outside the D2, wherein D1 is young sheet of button pot and PCB contact area diameter, D1≤0.8mm, when the position of dish mesopore outside the D1 zone time, can avoid contact, but a pot young sheet has certain deviation when sticking on the PCB with the stress at the young sheet of pot top, consider and paste the influence that oblique presentation is given birth to, therefore set an allowance 0.2mm again, the position of coiling mesopore is arranged on outside the D2 D2≤1.0mm; D3 is a button inner ring copper sheet diameter, usually D3 〉=2.0mm.From the practical design situation, D3-D2 〉=1.0mm, no matter through hole or blind hole, this space all is abundant, design window is enough big.From above-mentioned explanation as can be seen, only limit, can solve by key contacts poor sensitivity and long-term reliability problems by the position of button PAD being gone up the hole, simple and easy to do, do not increase any design difficulty and product cost; Simultaneously, the position of dish mesopore is limited in the PAD circle keeps to the side also to have avoided pot a young sheet salient point and hollow overlapping after the position, the stroke when having shortened button pressed, feasible sensitivity by key contacts further improves.
The described printed circuit board (PCB) key-press welding plate of the embodiment of the invention as shown in Figure 3 and Figure 4, key-press welding plate comprises that diameter is that interior circle and the diameter of D3 is the cylindrical of D4, interior circle is provided with the dish mesopore, the position of its mid-game mesopore all is arranged on the submarginal position of circle in the button PAD, the position of dish mesopore is within D3 as shown in Figure 3, in the annular region outside the D2, the zone that the young sheet of pot top contacts with PCB when having avoided button pressed fully, the young sheet of pot top can not produce stress with the dish mesopore and contact, avoid hole copper fracture or orifice ring copper sheet to float off phenomenon, improved the sensitivity and the long-term reliability of button.
The application of technical solution of the present invention is not limited to the portable terminal keyboard, other keyboard, the position that all can adopt technical scheme positioning disk mesopore of the present invention as remote controller keyboard button or game machine keyboard etc.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a printed circuit board (PCB) key-press welding plate dish mesopore boring method is characterized in that described method comprises the steps:
Position of opening to the dish mesopore of the realization interlayer circuit turn-on in the printed circuit board (PCB) key-press welding plate positions, and described position of opening is arranged on outside young sheet of pot and the described printed circuit board (PCB) stress contact area.
2. method according to claim 1, it is characterized in that, the position of described dish mesopore be diameter greater than the zone of R1 less than D3, wherein R1 is the young sheet of described pot and the diameter of described printed circuit board (PCB) stress contact area, described D3 is the interior circular diameter of described key-press welding plate.
3. method according to claim 2 is characterized in that described R1 is less than or equal to 0.8mm, and described D3 is greater than or equal to 2.0mm.
4. method according to claim 2 is characterized in that, described R1 comprises that also the young sheet of button pot pastes the diameter in zone partially.
5. method according to claim 1 is characterized in that, described button is portable terminal keyboard or remote controller keyboard button or game machine keyboard.
6. printed circuit board (PCB) key-press welding plate, comprise that diameter is that interior circle and the diameter of D3 is the cylindrical of D4, described diameter is that the interior circle of D3 is provided with the dish mesopore of realizing the interlayer circuit turn-on, it is characterized in that described dish mesopore is outside young sheet of button pot and described printed circuit board (PCB) stress contact area.
7. key-press welding plate according to claim 6 is characterized in that, described dish mesopore specifically at diameter greater than the zone of R1 less than D3, wherein R1 is the diameter of young sheet of described pot and described printed circuit board (PCB) stress contact area.
8. key-press welding plate according to claim 6 is characterized in that described R1 is less than or equal to 0.8mm, and described D3 is greater than or equal to 2.0mm.
9. key-press welding plate according to claim 6 is characterized in that, described R1 comprises that also the young sheet of button pot pastes the diameter in zone partially.
10. key-press welding plate according to claim 6 is characterized in that, described button is portable terminal keyboard or remote controller keyboard button or game machine keyboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100637087A CN101026936B (en) | 2006-12-30 | 2006-12-30 | Printed circuit board button solder pad holing method and its button solder pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100637087A CN101026936B (en) | 2006-12-30 | 2006-12-30 | Printed circuit board button solder pad holing method and its button solder pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101026936A CN101026936A (en) | 2007-08-29 |
| CN101026936B true CN101026936B (en) | 2011-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100637087A Expired - Fee Related CN101026936B (en) | 2006-12-30 | 2006-12-30 | Printed circuit board button solder pad holing method and its button solder pad |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044808B (en) * | 2009-10-14 | 2013-03-06 | 厦门宏远达电器有限公司 | Power socket with power indication |
| CN102984880A (en) * | 2012-10-22 | 2013-03-20 | 广东欧珀移动通信有限公司 | Metal dome packing pad structure, printed circuit board (PCB) and manufacturing method of the PCB |
| CN103607840B (en) * | 2013-11-26 | 2016-04-27 | 福建联迪商用设备有限公司 | The young sheet golden finger of a kind of pot and press-key structure and the young technique on chip of pot |
| CN109820415B (en) * | 2018-12-29 | 2021-07-06 | 九阳股份有限公司 | Electric kettle |
| CN111698825B (en) * | 2020-06-12 | 2023-03-31 | 浪潮电子信息产业股份有限公司 | PCB and PCB routing structure manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6130593A (en) * | 1995-06-02 | 2000-10-10 | Duraswitch Industries Inc. | Switch panel having a magnetically-retained overlay |
| US6844504B2 (en) * | 2002-06-27 | 2005-01-18 | Ppg Industries Ohio, Inc. | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
-
2006
- 2006-12-30 CN CN2006100637087A patent/CN101026936B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6130593A (en) * | 1995-06-02 | 2000-10-10 | Duraswitch Industries Inc. | Switch panel having a magnetically-retained overlay |
| US6844504B2 (en) * | 2002-06-27 | 2005-01-18 | Ppg Industries Ohio, Inc. | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
Non-Patent Citations (4)
| Title |
|---|
| JP特开2006-269118A 2006.10.05 |
| JP特开平10-283096A 1998.10.23 |
| JP特开平10-302572A 1998.11.13 |
| 全文. |
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| CN101026936A (en) | 2007-08-29 |
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Granted publication date: 20110316 |