CN101026195B

CN101026195B - Solar cell package structure

Info

Publication number: CN101026195B
Application number: CN 200610055041
Authority: CN
Inventors: 赖利弘; 赖利温; 黄堃芳; 谢文升; 林佳宏; 石立傑
Original assignee: HIGHERWAY ELECTRONIC CO Ltd; MILLENNIUM COMMUNICATION CO Ltd
Current assignee: Higherway Electronic Co., Ltd.; HLJ Technology Co., Ltd.
Priority date: 2006-02-24
Filing date: 2006-02-24
Publication date: 2010-07-14
Anticipated expiration: 2026-02-24
Also published as: CN101026195A

Abstract

This invention relates to a package structure of a high efficient light collection solar cell including a loading base for placing solar chips, a pair of positive and negative conduction frames and a package body, which can be used in light collection and has a function of anti-reflection light to increase the collecting efficiency of sun's rays and increase the receiving volume of solar chips.

Description

The encapsulating structure of solar cell

Technical field

But the present invention is a kind of encapsulating structure of solar cell of optically focused, particularly a kind of encapsulating structure that is fit to the solar cell of any array assembling application.

Background technology

Solar cell utilizes photovoltaic effect to make conversion of solar energy become electric energy, as shown in Figure 1, organigram for known solar cell 105, it has a n type semiconductor layer 110, a p type semiconductor layer 112, an anti-reflecting layer and two

electrodes

114 and 116, when photon strikes solar cell 105 surfaces, n type semiconductor layer 110 has electrons spread with the composition surface of p type semiconductor layer 112, and two

electrodes

114 and 116 at two ends were drawn utilization with electric current about electric current can utilize.Generally speaking, solar cell 105 should have bigger light-receiving area raising the efficiency, or utilizes beam condensing unit, and for example lens arrangement reaches the effect of collected light.Yet the assembling of making large-area collective optics and arbitrary dimension is not a nothing the matter, and the difficult raising of yield, and then causes the increase of cost.Therefore, the easy concentrating solar battery of making and assembling of development is one of important topic.

Summary of the invention

In order to address the above problem, one of the object of the invention is to provide a kind of encapsulating structure of concentrating solar battery, can utilize the encapsulation procedure of existing light-emitting component to make, and simplifies the encapsulation of concentrating solar battery.Another object of the present invention is to provide a kind of encapsulating structure of solar cell, utilize the guide bracket and the epoxy encapsulation structure of existing light-emitting component to encapsulate solar cell, the assembleability of adjusting the virtually any size size with the simplification that increases the solar module encapsulation and prodigiosin.

In order to achieve the above object, embodiments of the invention provide a kind of high concentrating solar chip-packaging structure, comprise: a solar chip; One base carries this solar chip; Several conduction connecting structures electrically connect this solar chip; Several power pins electrically connect described conduction connecting structure and pass this base to this base; And an epoxy resin enclosed body, seal this solar chip, this base and those conduction connecting structures, but wherein this epoxy resin enclosed body focusing sunlight and comprise an anti-reflection structure with the reception sunlight.

Description of drawings

Figure 1 shows that the organigram of known solar cell.

Fig. 2 A and 2B are depicted as the encapsulating structure schematic diagram according to the solar chip of one embodiment of the invention.

Fig. 3 A and 3B are depicted as the encapsulating structure schematic diagram of solar chip according to another embodiment of the present invention.

Fig. 4 A and 4B are depicted as the encapsulating structure schematic diagram of solar chip according to another embodiment of the present invention.

Symbol description among the figure:

110 n type semiconductor layer

105 solar cells

112 p type semiconductor layer

114 electrodes

116 electrodes

10 solar chip pinned encapsulating structures

14 bases

12 solar chips

18 encapsulated members

16 conduction connecting structures

Pin in 13

11 outer pins

15 outer pins

Pin in 19

20 solar chip surface mounting structures

30 solar chip TO-Cans encapsulating structures

14 TO bases

17 conductive junction points

Embodiment

Fig. 2 A is depicted as the encapsulating structure schematic diagram according to the solar chip of one embodiment of the invention.A kind of solar chip pinned encapsulating structure 10 has a base 14, a solar chip 12, an encapsulated member 18 and several conduction connecting structures 16.In an embodiment, base 14 is in order to carrying solar chip 12, and its material can be the conducting metal of copper or iron.Secondly, solar chip 12, for example monocrystalline silicon, GaAs solar chip, polycrystalline silicon solar chip, non-crystal silicon solar energy chip or GaAs solar chip, be fixed in by rights on the surface of base 14, for example utilize the fixing mode of adhesion coating (not showing on the figure), but the present invention is not limited to this.Solar chip 12 itself comprises a n type semiconductor layer (one layer or more), a p type semiconductor layer (one layer or more), an absorbed layer and two conductive electrodes, wherein two conductive electrodes are electrically connected to different conduction connecting structure 16 respectively, in this embodiment, positive and negative two conductive electrodes are positioned at the different both sides of solar chip 12, in another embodiment, positive and negative two conductive electrodes are positioned at the same side of solar chip 12, shown in Fig. 2 B.Be noted that solar chip 12 can more comprise other structure, for example glass substrate, barrier layer (barrier) etc. and be not limited to above-mentioned.Moreover

interior pin

13 and 19 is in order to electrically connect conductive electrode to

outer pin

15 and 11,

outer pin

11 and 15 in order to fixing, assembling, be electrically connected to an external structure (not showing on the figure), and can be used as power pins, it can be distributed in suitable position on the geometry of whole solar chip pinned encapsulating structure 10, for example distribute with respect to the side or the below of solar chip 12, but the present invention is not limited to this.

Secondly, encapsulated member 18, epoxy resin for example, it seals solar chip 12 and interior pin 13 with the protection said structure and can be used as the focusing of sunlight.In a preferred embodiment, encapsulated member 18 itself can be used as anti-reflecting layer and enters solar chip pinned encapsulating structure 10 to increase sunlight.Moreover encapsulated member 18 can form geometry miscellaneous because of the character that forms material, so the sunlight that can accept to inject from all directions.According to above-mentioned, solar chip pinned encapsulating structure 10 can be positioned on the position of a stationary fixing can receive the sunlight of injecting from all directions, solve after the assembling of known solar chip becomes solar panel, need to change and change its position to increase the problem of incident sunlight amount with position of sun.Secondly, the making of solar chip pinned encapsulating structure 10 can utilize general LED package processing procedure to carry out, and need not increase extra mould processing procedure and board.Moreover the assembling of solar chip pinned encapsulating structure 10 also can utilize the mode of light-emitting diode assembling, therefore can optionally be assembled into suitably or the solar cell system of large tracts of land, any geometry.

Fig. 3 A and Fig. 3 B are depicted as the encapsulating structure schematic diagram of solar chip according to another embodiment of the present invention.Similar with solar chip pinned encapsulating structure, solar chip surface mounting structure 20 (Surface Mount Diode, SMD) have a base 14, a solar chip 12, an encapsulated member and several conduction connecting structures 16, different conduction connecting structure 16 can with the same side of solar chip 12 or not the positive and negative conductive electrode of homonymy be connected.Different is that

outer pin

11 and 15 sides to solar chip 12 extend makes solar chip surface mounting structure 20 have a flat geometric shape.Understandable,

outer pin

11 and 15 expose contact and can utilize surface-pasted mode to be fixed on the outer member.Next, encapsulated member also can be one and has antireflecting transparent material to increase the amount that sunlight enters solar chip surface mounting structure 20.

Fig. 4 A and Fig. 4 B are depicted as the encapsulating structure schematic diagram of solar chip according to another embodiment of the present invention.One solar chip TO (Transistor Outline, TO)-Cans encapsulating structure 30 comprises a TO base 14 (TO header), a solar chip 12, a TO encapsulated member 18 (TO-body).In an embodiment, solar chip 12 is fixed on the TO base 14 and is electrically connected to interior pin 13 and conductive junction point 17 on the TO base 14, wherein in pin 13 and conductive junction point 17 can pass TO base 14 to the outside is exposed become outside pin 15 and 11.Secondly; TO encapsulated member 18 can be in order to protection solar chip 12 and as a sunlight that can focus on from all directions; therefore the material of TO encapsulated member 18 can sunlight penetrates or antireflecting material gets final product in order to be fit to; and the shape of TO encapsulated member 18 is not limited to cylindric, can also be for having the curved surface of spotlight effect.Moreover, do not limit on the TO base 14 one or more solar chip 12 is set, also can comprise the chip or the element of other function according to design.

Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing according to this, when not limiting claim of the present invention with this, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.

Claims

1. a concentrating solar chip-packaging structure is characterized in that, comprises:

One solar chip;

One base carries this solar chip;

Several conduction connecting structures electrically connect this solar chip;

Several power pins electrically connect described conduction connecting structure and pass this base to this base; And

One epoxy resin enclosed body is sealed this solar chip, this base and those conduction connecting structures, but this epoxy resin enclosed body focusing sunlight and comprise an anti-reflection structure wherein to receive sunlight.

2. concentrating solar chip-packaging structure as claimed in claim 1, wherein this epoxy resin enclosed body is a plastics ejection formation made.

3. concentrating solar chip-packaging structure as claimed in claim 1, wherein this epoxy resin enclosed body is for irritating mould mode made.

4. solar chip encapsulating structure as claimed in claim 1 comprises a pinned encapsulating structure.

5. solar chip encapsulating structure as claimed in claim 1 comprises the direct insertion encapsulating structure of a biserial.

6. solar chip encapsulating structure as claimed in claim 1 comprises a surface mount encapsulating structure.

7. solar chip encapsulating structure as claimed in claim 1 comprises a TO-Cans encapsulating structure.

8. solar chip encapsulating structure as claimed in claim 1, wherein this epoxy resin enclosed body is transparent cover body.

9. solar chip encapsulating structure as claimed in claim 1 wherein is hollow between this epoxy resin enclosed body and this base.

10. solar chip encapsulating structure as claimed in claim 1, wherein this solar chip is the mono-crystalline silicon solar chip.

11. solar chip encapsulating structure as claimed in claim 1, wherein this solar chip is the polycrystalline silicon solar chip.

12. solar chip encapsulating structure as claimed in claim 1, wherein this solar chip is the non-crystal silicon solar energy chip.

13. solar chip encapsulating structure as claimed in claim 1, wherein this solar chip is the GaAs solar chip.

14. solar chip encapsulating structure as claimed in claim 1, wherein this solar chip is for absorbing the chip of sunlight.

15. solar chip encapsulating structure as claimed in claim 1, wherein the positive and negative electrode of this solar chip is positioned at the same side of this solar chip.

16. solar chip encapsulating structure as claimed in claim 1, wherein the positive and negative electrode of this solar chip is positioned at the different both sides of this solar chip.

17. solar chip encapsulating structure as claimed in claim 1 manufactures array way with its pin.

18. solar chip encapsulating structure as claimed in claim 1 manufactures array way with its encapsulated member.