CN101022708A - Temporary fixing structure for electronic parts - Google Patents
Temporary fixing structure for electronic parts Download PDFInfo
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- CN101022708A CN101022708A CN 200710007070 CN200710007070A CN101022708A CN 101022708 A CN101022708 A CN 101022708A CN 200710007070 CN200710007070 CN 200710007070 CN 200710007070 A CN200710007070 A CN 200710007070A CN 101022708 A CN101022708 A CN 101022708A
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Abstract
The invention provides an electronic component temporary fixed structure whic may fix the electronic component temporarily and reliablely on the printed circuit board and may prevent the warp on the electronic component and printed circuit board when assembling the electronic component on the printed circuit board subsequently by soft soldering. In length direction B of connector (12), in a other word, flexible assembly which can deform flexibly to the preset direction on the two ends (side wall 12a, 12b) of the connector in the direction influenced most by the expansion are integrated. The fixing hole for fixing the flexible assembly (20) is set on the printed circuit board. Moreover, the preset direction is parallel to the length direction of the connector.
Description
Technical field
The present invention relates to the temporary fixing structure of electronic component, in more detail, relate to electronic component is temporarily fixed at structure on the printed substrate.
Background technology
When being assembled into bigger electronic components such as connector on the printed substrate, generally being that electronic component is temporarily fixed on the printed substrate, and then carrying out solder and fix.Therefore, the various temporary fixing structures (for example, with reference to patent documentation 1) that electronic component are temporarily fixed at the electronic component on the printed substrate had been proposed in the past.
The technology of patent documentation 1 record is as follows: can bury underground on the lower surface that is fixed on electronic component to the elastomeric element of prescribed direction strain, exactly be embedded on the electronic component, be equipped with on the position that the installed surface of electronic component connects with printed substrate, by making elastomeric element and being located at connecting hole on the printed substrate and fastening electronic component is temporarily fixed on the printed substrate, and, lead terminal and elastomeric element to electronic component carry out solder jointly, thereby electronic component is fixed on the printed substrate.In addition, the afore mentioned rules direction of elastomeric element is arranged to vertical, exactly, is arranged to vertical with length direction on the electronic component with the position (fixed part) of printed substrate butt with the length direction of electronic component.
(patent documentation 1: the Japan Patent spy opens the 2004-39742 communique, and 0011～0013 section, Fig. 2,3 etc.)
In recent years, popularize the use no-lead soft soldering for the consideration of environmental protection.Compare with the eutectic brazing material that uses in the past, the melt temperature of no-lead soft soldering is generally higher, therefore, compares with the situation of using eutectic brazing material in the past, when using no-lead soft soldering to carry out solder, it is higher that the temperature of printed substrate and electronic component also can become.
So, because the difference of the deflection (swell increment) of electronic component that the difference of the coefficient of linear expansion of electronic component and printed substrate causes and printed substrate also becomes big.Specifically, the elastomeric element of electronic component can move the suitable distance of difference with the deflection of electronic component and printed substrate in the aperture of connecting hole, cause the relative position of elastomeric element and connecting hole to change thus.
In this state, be coated in after solder on the elastomeric element solidifies, therefore elastomeric element just has been fixed on the printed substrate,, even printed substrate and electronic component produce contraction when returning to room temperature, the relative position of elastomeric element and connecting hole can not change yet.Therefore, in cooling procedure, a side's of coefficient of linear expansion big (that is, amount of contraction is big) convergent force can make the opposing party be compressed the pressure of direction in electronic component and the printed substrate, so can produce warpage unfavorable conditions such as (deflections).
In addition, also considered and to have made it can move freely the countermeasure of eliminating above-mentioned unfavorable condition by elastomeric element not being carried out solder.But, elastomeric element for patent documentation 1 record, owing to the length direction of the electronic component of the afore mentioned rules direction being arranged to have the greatest impact with expanded by heating is vertical, therefore, when carrying out solder, elastomeric element might be in the aperture of connecting hole moves along its length, electronic component will take place like this can not be fixed on unfavorable condition on the printed substrate reliably.
Summary of the invention
Therefore, the objective of the invention is to address the above problem, a kind of temporary fixing structure of electronic component is provided, this structure can be temporarily fixed at electronic component on the printed substrate reliably, when carrying out solder subsequently and being assembled in electronic component on the printed substrate, can prevent from electronic component and printed substrate, warpage to take place.
In order to achieve the above object, the temporary fixing structure of technical solution of the present invention 1 described a kind of electronic component is used for electronic component is temporarily fixed at printed substrate, it is characterized in that: being formed with respectively on the both ends of the length direction of above-mentioned electronic component can be to the elastomeric element of prescribed direction strain, on above-mentioned printed substrate, be provided with connecting hole for above-mentioned elastomeric element engaging, and the afore mentioned rules direction is parallel with the length direction of above-mentioned electronic component.
The temporary fixing structure of technical scheme 2 described electronic components is in technical scheme 1, it is characterized in that: above-mentioned elastomeric element be by: can be to the 1st foot of prescribed direction strain; Be formed on the 1st claw in above-mentioned the 1st foot continuously; Form back-to-back with above-mentioned the 1st foot, and can be to the 2nd foot of prescribed direction strain; Be formed on continuously that the 2nd claw in above-mentioned the 2nd foot constitutes.
The temporary fixing structure of technical scheme 3 described electronic components is in technical scheme 2, it is characterized in that: above-mentioned the 1st claw and the 2nd claw have to be the inclined plane that mode that predetermined angular contacts with the regulation position of above-mentioned connecting hole is formed slopely.
The temporary fixing structure of technical scheme 4 described electronic components is in each of technical scheme 1～3, it is characterized in that: above-mentioned elastomeric element is formed on the arm, the outstanding both ends that are formed on the length direction of above-mentioned electronic component of above-mentioned arm, and above-mentioned arm is that hollow and wall thickness homogeneous strain portion that form, that strain can take place constitutes by inside.
The temporary fixing structure of technical scheme 5 described electronic components is in each of technical scheme 1～4, it is characterized in that: above-mentioned elastomeric element is positioned on the diagonal of above-mentioned electronic component when overlooking above-mentioned electronic component.
[effect of invention]
The temporary fixing structure of technical scheme 1 described electronic component, its structure is: on the length direction of electronic component, in other words, on the both ends of the direction that the expanded by heating on the electronic component has the greatest impact, being formed with respectively can be to the elastomeric element of prescribed direction strain, on printed substrate, be provided with connecting hole for the engaging of elasticity parts, and, the afore mentioned rules direction is parallel with the length direction of electronic component, can be temporarily fixed at electronic component on the printed substrate reliably by this structure, when being assembled in electronic component on the printed substrate by solder subsequently, can prevent from electronic component or printed substrate, warpage to take place.
Specifically, elastomeric element is formed in above-mentioned prescribed direction (flexible direction) mode parallel with the length direction of electronic component, and, when being assembled in electronic component on the printed substrate, be not soldered material weldering of elastomeric element is lived, thus, during expansion and the electronic component when shrinking and the thermal expansion amount of printed substrate and the difference of amount of contraction can be absorbed by the strain of elastomeric element (stretching), like this, just can prevent from electronic component or printed substrate, warpage to take place.In addition, owing to elastomeric element is formed on the both ends of the bigger length direction of the difference of thermal expansion amount on the electronic component or amount of contraction, therefore, because the difference of the deflection of electronic component that thermal expansion or contraction cause and printed substrate can be absorbed efficiently.
In the temporary fixing structure of technical scheme 2 described electronic components, elastomeric element is made of following part: can be to the 1st foot of prescribed direction strain; Be formed on the 1st claw in the 1st foot continuously; Form back-to-back with the 1st foot, can be to the 2nd foot of prescribed direction strain; Be formed on the 2nd claw in the 2nd foot continuously, promptly, this structure is that the 1st claw, the 2nd claw are fastened in the connecting hole on the printed substrate, and then electronic component is temporarily fixed on the printed substrate, therefore, decapacitation reaches beyond the above-mentioned effect, during expansion and the electronic component when shrinking and the thermal expansion amount of printed substrate and the difference of amount of contraction can be absorbed by the strain of the 1st foot, the 2nd foot, like this, can further prevent from electronic component or printed substrate, warpage to take place.
In the temporary fixing structure of technical scheme 3 described electronic components, the 1st claw and the 2nd claw have to be the inclined plane that mode that predetermined angular contacts with the regulation position of connecting hole is formed slopely, specifically, the inclined plane contacts with the specified part bit line with predetermined angular, that is, the wiring at inclined plane and regulation position is variable in the scope on inclined plane, therefore, except 2 effects that can reach of technical scheme, can allow the shaping error of connecting hole etc.
In the temporary fixing structure of technical scheme 4 described electronic components, elastomeric element is formed on the arm, the outstanding both ends that are formed on the length direction of electronic component of this arm, and, arm is made of inner hollow and the impartial strain portion that form, that strain can take place of wall thickness, therefore, except above-mentioned effect, even the difference in the amount of contraction of electronic component and printed substrate surpasses under the situation of the scope that is absorbed by the strain of elastomeric element, the strain that relies on arm (strain portion), this amount of contraction that exceeds part also can be absorbed.
In the temporary fixing structure of technical scheme 5 described electronic components, because elastomeric element is set on the diagonal of electronic component when overlooking electronic component, therefore, except that above-mentioned effect, even a plurality of electronic components are being set up in parallel under the situation on the printed substrate, can under elastomeric element has the situation of interference each other, not be configured yet, can improve the installation effectiveness of printed substrate like this.
Description of drawings
Fig. 1 possesses the electronic component of temporary fixing structure of the electronic component in the embodiment of the invention and the stereoscopic figure of printed substrate.
Fig. 2 is the electronic component among Fig. 1 and the partial top view of printed substrate.
Fig. 3 is the electronic component among Fig. 1 and the side elevation in partial section of printed substrate.
Fig. 4 is assembled in the local amplification view of the preceding state of printed substrate for connector in the presentation graphs 3.
Fig. 5 is that the elastomeric element of the connector in the presentation graphs 3 is inserted into interior local amplification view state, the same with Fig. 4 of connecting hole on the printed substrate.
Fig. 6 is the elastomeric element of the connector in the presentation graphs 3 local amplification view fastening state, the same with Fig. 4 after being inserted in the connecting hole on the printed substrate fully.
Fig. 7 is the connector and the printed substrate swelling state, the same with Fig. 3 side elevation in partial section in the presentation graphs 1.
Fig. 8 is the connector and the printed substrate contraction state, the same with Fig. 3 side elevation in partial section in the presentation graphs 1.
Fig. 9 is the expression local amplification view arm elastic deformation, the same with Fig. 6 shown in Figure 8.
Figure 10 is configured in a plurality of connectors shown in Figure 1 the partial top view of the state on the printed substrate side by side for expression.
Figure 11 is the schematic diagram that is used to illustrate the solder of printed substrate of the prior art and connector.
Embodiment
Below, describe based on the preferred forms of accompanying drawing the temporary fixing structure of electronic component of the present invention.
Fig. 1 is the electronic component of the temporary fixing structure with electronic component in the embodiment of the invention and the stereoscopic figure of printed substrate.Fig. 2 is the partial top view of electronic component and printed substrate, and Fig. 3 is the side elevation in partial section of electronic component and printed substrate.
In Fig. 1 to Fig. 3, symbol 10 expression printed substrates.Printed substrate 10 is made by general thermoplasticity organic resin, and coefficient of linear expansion is about 16 (ppm/ ℃).On the installed surface 10A of printed substrate 10, electronic component is installed, connector 12 is installed specifically.Connector 12 is made by PBT (polybutylene terephthalate (PBT)), and coefficient of linear expansion is about 55 (ppm/ ℃).Connector 12 and not shown external instrument are via machineries such as the connectors of the other side's one side and be electrically connected.In addition, omit other the diagram of electronic component such as the capacitor be installed on the printed substrate 10.
As shown in Figures 2 and 3, on the outer wall of connector 12, say exactly on the side walls 12a, the 12b that when the direction of arrow A (shown in Figure 2) is observed connector 12, become connector 12 sides to be formed with the arm 14 that roughly is cuboid respectively.That is, make arm 14 outstanding formation on the both ends of the length direction (arrow B among Fig. 2,3 is represented) of connector 12.
In addition, as shown in Figure 2, arm 14 is positioned on the diagonal of connector 12 when overlooking connector 12.Exactly, arm 14a be formed on sidewall 12a in Fig. 2 above near, arm 14b is formed near the below of sidewall 12b.
As shown in Figure 3, the inside with arm 14 forms hollow, the space 16 of portion's formation within it.And, the wall thickness (the symbol d among Fig. 3 represents) of arm 14 is formed equably.
Being formed with on the lower surface of arm 14 (exactly, being the face relative with printed substrate of arm 14) can be to the elastomeric element 20 of prescribed direction strain.Contents such as shape about this elastomeric element 20 describe in detail in the back.
On connector 12, be formed with a plurality of (specifically being formed with 2) should with the abutting part 22 of the installed surface 10A butt of printed substrate 10.In addition, with printed substrate 10 on the position corresponding to above-mentioned elastomeric element 20 on be provided with the connecting hole 24 that a plurality of (2) engage for elasticity parts 20.
Below, to the assembling with printed substrate 10 is elaborated as the shape of the elastomeric element 20 of characteristic of the present invention and the connector 12 that possesses elastomeric element 20.
Fig. 4 is the local amplification view that is illustrated in the state of connector 12 before being assembled on the printed substrate 10, and Fig. 5 is inserted into the elastomeric element 20 of connector 12 for expression the local amplification view of the state in the connecting hole 24 of printed substrate 10.Fig. 6 is the local amplification view of the fastening state in the connecting hole 24 that the elastomeric element 20 of connector 12 is inserted into fully printed substrate 10.
As shown in Figure 4, elastomeric element 20 is made of following part, that is, can be to the prescribed direction strain, the 1st 20a1 of foot of left and right direction strain that specifically can be in Fig. 4; Be formed on the 1st claw 20b1 on the 1st 20a1 of foot continuously; The distance of stipulating at interval with the right side of the 1st 20a1 of foot forms, in other words form back-to-back with the 1st 20a1 of foot exactly, can be to the 2nd 20a2 of foot of prescribed direction strain; Be formed on the 2nd claw 20b2 on the 2nd 20a2 of foot continuously.Like this, the direction that strain may take place (prescribed direction) of the 1st 20a1 of foot, the 2nd 20a2 of foot, in other words just the direction that strain may take place of elastomeric element 20 just forms with the length direction B of connector 12 (expression in Fig. 3 etc.) and is parallel to each other.
As shown in Figure 4, under free state, the overall dimension of the Width of elastomeric element 20 more particularly is exactly that the 1st claw 20b1 is bigger slightly than the aperture D of the connecting hole 24 of printed substrate 10 with the overall dimension W of the 2nd claw 20b2.
In addition, the direction of insertion that the face 20c with connecting hole 24 contacts at first on the 1st claw 20b1 and the 2nd claw 20b2 are formed with respect to printed substrate 10 becomes the roughly taper of miter angle degree, like this, when being inserted into elastomeric element 20 in the connecting hole 24, just can easily be inserted in the connecting hole 24.
And, when being temporarily fixed at connector 12 on the printed substrate 10, the elastomeric element 20 of connector 12 is positioned at the top position of the connecting hole 24 of printed substrate 10, and then elastomeric element 20 is inserted in the connecting hole 24.
As shown in Figure 5, the limit makes interval (gap) stenosis between each 20a1 of foot, 20a2 narrow, be that the limit makes the left and right direction generation strain of elastomeric element 20 (20a1 of foot, 20a2) to paper, the limit is inserted into the 1st claw 20b1, the 2nd claw 20b2 of elastomeric element 20 in the connecting hole 24.Then, as shown in Figure 6, make the 1st claw 20b1, the 2nd claw 20b2 move to the lower end 24a of connecting hole 24, owing to being stuck each foot that hole 24 restrictions narrow down it at interval, in other words, the elastic force that relies on elastomeric element 20 to have to each 20a1 of foot, 20a2 of the inboard strain of connecting hole 24 and for example extends shown in the figure like that, and subsequently, the 1st claw 20b1, the 2nd claw 20b2 just have been fastened on lower end (position of the regulation) 24a of connecting hole 24.Thus, connector 12 has been temporarily fixed on the printed substrate 10.
At this moment, as shown in Figure 6, for the 1st claw 20b1, the 2nd claw 20b2, angulation is a predetermined angular between face (inclined plane) 20d that contacts with the lower end 24a of connecting hole 24 and the solder surface 10B of printed substrate 10, be roughly 60 degree specifically, and be formed slopely and be taper.Like this, the 1st claw 20b1 and the 2nd claw 20b2 have to be the inclined plane 20d that mode that predetermined angular contacts with the regulation position 24a of connecting hole 24 is formed slopely.
The front is illustrated the elastomeric element 20 on the arm 14b that is formed on connector 12, because this left and right elastomeric element is symmetrical, so above-mentioned explanation also is applicable to the elastomeric element 20 that is formed on the arm 14a.
In addition, under connector 12 is temporarily fixed on state on the printed substrate 10, as shown in Figure 6, and the abutting part 22 of connector 12 and the installed surface 10A butt of printed substrate 10, therefore, it is temporary fixed that connector 12 can be stabilized ground.
Then, the lead terminal of connector 12 and printed substrate 10 being carried out solder fixes.About this part content, be elaborated with reference to the accompanying drawing of Fig. 7 back.
Fig. 7 represents that Fig. 7 is the side elevation in partial section same with Fig. 3 owing to lead terminal and printed substrate 10 to connector 12 carry out the state that solder is expanded connector 12 and printed substrate 10.After Fig. 8 represented that solder finishes, connector 12 and printed substrate 10 returned to the contraction state of room temperature, and Fig. 8 is the side elevation in partial section same with Fig. 3.
Before Fig. 7 and Fig. 8 are described,, with reference to Figure 11 the solder of in the prior art printed substrate and connector being carried out is described earlier for the ease of understanding.
Figure 11 is used for the schematic diagram that the solder to printed substrate of the prior art and connector describes.
At first shown in (a) among Figure 11, in the prior art, the elastomeric element 200 of connector 12 is inserted and is temporarily fixed on the printed substrate 10.Then, for example utilize no-lead soft soldering that the lead terminal (not shown) of connector 12 is carried out Reflow Soldering.At this moment, shown in Figure 11 (b), elastomeric element 200 has also been lived by no-lead soft soldering (symbol 30 expressions) weldering.Subsequently, no-lead soft soldering 30 solidifies, and elastomeric element 200 also is fixed thus and has been locked on the printed substrate 10.
As previously mentioned, the coefficient of linear expansion of connector 12 is than the coefficient of linear expansion big (specifically about three times) of printed substrate 10.Therefore, along with the carrying out of solder, printed substrate 10 is heated with connector 12, and the deflection of connector 12 (swell increment) is bigger than the swell increment of printed substrate 10.Especially under the situation of using the high no-lead soft soldering of ratio eutectic brazing material melt temperature in the past, the difference of deflection is more obvious.In addition, about the melt temperature of no-lead soft soldering, under the situation as the Sn-Ag-Cu ternary alloy three-partalloy scolder of main flow, be about 220 ℃ in recent years.
Therefore, shown in Figure 11 (b), the recruitment that is installed in a plurality of elastomeric elements 200 spacing distance each other on the connector 12 is greater than the recruitment of being located at a plurality of connecting holes 24 spacing distance each other on the printed substrate 10.That is, the elastomeric element 200 of connector 12 moves in the aperture of connecting hole 24, and therefore, elastomeric element 200 can change with the relative position of connecting hole 24.
Under this state, make printed substrate 10 and connector 12 cool to room temperature, promptly, the solder that is coated on the elastomeric element 200 is solidified, elastomeric element 200 is soldered thereupon and expects that 30 have been fastened on the printed substrate 10, therefore, even printed substrate 10 returns to room temperature with connector 12 and produces contraction, elastomeric element 200 can not change with the relative position of connecting hole 24 yet.Therefore, shown in Figure 11 (c), in cooling procedure, because the convergent force of the connector 12 of coefficient of linear expansion big (that is, amount of contraction is big), make printed substrate 10 be compressed the pressure of direction and produce warpage (deflection).In addition, owing on printed substrate 10, produce warpage, so warpage self also can take place in connector 12 fixed thereon.
In view of the above, the temporary fixing structure of connector 12 of the present invention, being formed with respectively at the both ends of the length direction B of connector 12 can be to the elastomeric element 20 of prescribed direction strain, and, the afore mentioned rules direction is parallel with the length direction B of connector 12, therefore, can prevent from printed substrate 10 or connector 12, warpage to take place.
Below, with reference to the accompanying drawing of Fig. 7 and back thereof the solder of carrying out on the lead terminal of connector 12 and printed substrate 10 is elaborated.
At first, as shown in Figure 7, use the lead terminal 32 of 30 pairs of connectors 12 of no-lead soft soldering to carry out Reflow Soldering.Specifically, be the lead terminal 32 of connector 12 to be carried out solder by local jet flow scolder.When carrying out this solder, can carry out suitable covering and handle so that the part of the connecting hole 24 of the elastomeric element 20 of connector 12 and printed substrate 10 is not soldered the material weldering and live.In addition, no-lead soft soldering 30 uses above-mentioned Sn-Ag-Cu ternary alloy three-partalloy scolder (melt temperature is 220 ℃).
By above-mentioned solder, printed substrate 10 is heated to high temperature with connector 12.Specifically, printed substrate 10 is heated to and about equally 220 ℃ of the melt temperature of no-lead soft soldering 30, and the temperature of connector 12 rises to about 160 ℃.
Therefore, also the deflection than printed substrate 10 is big than big 3 times the deflection (swell increment) of connector 12 nearly of printed substrate 10 for coefficient of linear expansion.Specifically, compare with the recruitment of 2 connecting holes 24 spacing distance each other on being located at printed substrate 10, the recruitment that is formed on 2 elastomeric elements 20 spacing distance each other on the connector 12 wants big.Like this, though printed substrate 10 expands with connector 12, but because elastomeric element 20 is not lived by weldering, so as shown in the figure, elastomeric element 20 is to the left and right direction generation of paper strain, specifically, the 1st 20a1 of foot, the 2nd 20a2 of foot respectively left, right generation strain and being fastened in the connecting hole 24, therefore, printed substrate 10 can be absorbed with the difference of the above-mentioned recruitment (swell increment) that connector 12 expands.
Next, as shown in Figure 8, printed substrate 10 is cooled to temperature required (room temperature with connector 12.For example 20 ℃), to compare with the reduction (amount of contraction) of 2 connecting holes 24 spacing distance each other on being located at printed substrate 10, the reduction that is formed on 2 elastomeric elements 20 spacing distance each other on the connector 12 wants big.Like this, the same during with above-mentioned expansion, because elastomeric element 20 is not soldered, so, as shown in the figure, elastomeric element 20 is to paper left and right direction generation strain and be fastened in the connecting hole 24, and therefore, printed substrate 10 can be absorbed with the difference of the above-mentioned reduction (amount of contraction) that connector 12 shrinks.
As mentioned above, though the difference of amount of contraction is absorbed by the strain of elastomeric element 20, but the amount of contraction of connector 12 is bigger than the amount of contraction of printed substrate 10, therefore, also considers and can take place only to rely on elastomeric element 20 to be not enough to absorb the unfavorable condition of above-mentioned amount of contraction.
But, as mentioned above, being formed with the arm 14 of elastomeric element 20, its inside is hollow, and the wall thickness equalization, therefore strain can take place.That is to say, as shown in Figure 9, transmit next stress to arm 14 from elastomeric element 20, make arm (strain portion) 14 that strain take place, or rather, the sidewall 14c of arm 14 is out of shape to be urged to the mode of paper top, therefore, can not just can be absorbed by the difference of the amount of contraction of above-mentioned elastomeric element 20 absorptions.
Like this, temporary fixing structure for the electronic component in the present embodiment, on the length direction B of connector 12, in other words being formed with respectively on the both ends on the direction that the expanded by heating on the connector 12 has the greatest impact can be to the elastomeric element 20 of prescribed direction strain, on printed substrate 10, be provided with connecting hole 24 for 20 engagings of elasticity parts, and, the afore mentioned rules direction is parallel with the length direction B of connector 12, therefore, connector 12 can be temporarily fixed on the printed substrate 10 reliably, when being assembled in connector 12 on the printed substrate 10 by solder subsequently, can prevent from connector 12 or printed substrate 10, warpage to take place.
Specifically, above-mentioned elastomeric element 20 is formed in above-mentioned prescribed direction (flexible direction) mode parallel with the length direction B of connector 12, and, when being assembled in connector 12 on the printed substrate 10, the material weldering is not lived because elastomeric element 20 can not be soldered, therefore, the strain (stretching) that relies on elastomeric element 20, when expanding and when shrinking, connector 12 can be absorbed with the thermal expansion amount of printed substrate 10 and the difference of amount of contraction, therefore, can prevent from connector 12 or printed substrate 10, to produce warpage.In addition, owing to elastomeric element 20 is formed on the both ends of the bigger length direction B of difference on the connector 12, thermal expansion amount or amount of contraction, therefore, since the difference of the connector 12 that thermal expansion or contraction cause and the deflection of printed substrate 10 can be absorbed efficiently.
In addition, elastomeric element 20 is made of following part: can be to the 1st 20a1 of foot of prescribed direction strain; Be formed on the 1st claw 20b1 on the 1st 20a1 of foot continuously; Form back-to-back with the 1st 20a1 of foot, can be to the 2nd 20a2 of foot of prescribed direction strain; Be formed on the 2nd claw 20b2 on the 2nd 20a2 of foot continuously, promptly, the 1st claw 20b1, the 2nd claw 20b2 are fastened in the connecting hole 24 on the printed substrate 10, and then connector 12 is temporarily fixed on the printed substrate 10, like this, during expansion and the connector 12 when shrinking and the thermal expansion amount of printed substrate 10 and the difference of amount of contraction can rely on the strain of the 1st 20a1 of foot, the 2nd 20a2 of foot to be absorbed, therefore, can further prevent from the connector 12 or on the printed substrate 10 warpage is taking place.
In addition, the 1st claw 20b1 and the 2nd claw 20b2 have to be the inclined plane 20d that mode that predetermined angular (specifically be about 60 degree) contacts with the regulation position 24a of connecting hole 24 is formed slopely, specifically, inclined plane 20d becomes the predetermined angular doubling to contact with the position 24a of regulation, that is, the tangent line of inclined plane 20d and regulation position 24d is variable in the scope of inclined plane 20d, therefore, even produce on the aperture of connecting hole 24 D etc. under the situation of shaping error, this error also is can be absorbed.
In addition, elastomeric element 20 is formed on the arm 14, the arm 14 outstanding both ends that are formed on the length direction B of connector 12, and, arm 14 is made of inner hollow and the impartial strain portion that form, that strain can take place of wall thickness d, therefore, even the difference of connector 12 and the amount of contraction of printed substrate 10 surpass can be by the situation of the scope that strain absorbed of elastomeric element 20 under, the strain that relies on arm (strain portion) 14, this amount of contraction that exceeds part also can be absorbed.
In addition, because elastomeric element 20 is set on the diagonal of connector 12 when overlooking connector 12, therefore, as shown in figure 10, even a plurality of connectors 12 are being set up in parallel under the situation on the printed substrate 10, the arm 14 that is formed with elastomeric element 20 can not had each other the configuration of the ground of interference yet, therefore, can improve the installation effectiveness of printed substrate 10.In addition, even under situation an about only connector 12 being configured on the printed substrate 10,, therefore can stably carry out temporary fixed because elastomeric element 20 is configured on the above-below direction.
As mentioned above, for temporary fixing structure in the embodiment of the invention, that be used for electronic component (connector 12) is temporarily fixed at the electronic component on the printed substrate 10, being formed with respectively on the both ends ( sidewall 12a, 12b) of the zero length direction B of above-mentioned electronics can be to the elastomeric element 20 of prescribed direction strain, to be located on the above-mentioned printed substrate for the connecting hole 24 of above-mentioned elastomeric element engaging, and the afore mentioned rules direction is parallel with the length direction of above-mentioned electronic component.
In addition, elastomeric element 20 be by: can be to the 1st 20a1 of foot of above-mentioned prescribed direction strain; Be formed on the 1st claw 20b1 on above-mentioned the 1st 20a1 of foot continuously; Form back-to-back with above-mentioned the 1st 20a1 of foot, can be to the 2nd 20a2 of foot of above-mentioned prescribed direction strain; Be formed on continuously that the 2nd claw 20b2 of above-mentioned the 2nd 20a2 of foot constitutes.
In addition, above-mentioned the 1st claw 20b1 and the 2nd claw 20b2 have to be the inclined plane 20d that mode that predetermined angular contacts with the regulation position 24a of above-mentioned connecting hole 24 is formed slopely.
In addition, above-mentioned elastomeric element 20 is formed on the arm 14, the arm 14 outstanding both ends that are formed on the length direction of above-mentioned electronic component, and above-mentioned arm is made of inner hollow and the impartial strain portion that form, that strain can take place of wall thickness d.
In addition, above-mentioned elastomeric element 20 is configured on the diagonal of above-mentioned electronic component when overlooking above-mentioned electronic component.
In addition, 2 elastomeric elements 20 that are formed on the connector 12 are set in the above-described embodiment, also can be provided with more than 3.
In addition, though represented the concrete numerical value such as coefficient of linear expansion of printed substrate 10 or connector 12, those only are examples, are not limited to this numerical value.
Claims (5)
1. the temporary fixing structure of an electronic component, be used for electronic component is temporarily fixed at printed substrate, it is characterized in that: being formed with respectively on the both ends of the length direction of described electronic component can be to the elastomeric element of prescribed direction strain, on described printed substrate, be provided with connecting hole for described elastomeric element engaging, and described prescribed direction is parallel with the length direction of described electronic component.
2. the temporary fixing structure of electronic component as claimed in claim 1 is characterized in that: described elastomeric element be by: can be to the 1st foot of prescribed direction strain; Be formed on the 1st claw in described the 1st foot continuously; Form back-to-back with described the 1st foot, and can be to the 2nd foot of prescribed direction strain; Be formed on continuously that the 2nd claw in described the 2nd foot constitutes.
3. the temporary fixing structure of electronic component as claimed in claim 2 is characterized in that: described the 1st claw and the 2nd claw have to be the inclined plane that mode that predetermined angular contacts with the regulation position of described connecting hole is formed slopely.
4. as the temporary fixing structure of each described electronic component of claim 1～3, it is characterized in that: described elastomeric element is formed on the arm, the outstanding both ends that are formed on the length direction of described electronic component of described arm, and described arm is that hollow and wall thickness homogeneous strain that form, elastically deformable portion constitute by inside.
5. as the temporary fixing structure of each described electronic component of claim 1～4, it is characterized in that: described elastomeric element is positioned on the diagonal of described electronic component when overlooking described electronic component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006035013A JP4459913B2 (en) | 2006-02-13 | 2006-02-13 | Connector temporary fixing structure |
| JP035013/2006 | 2006-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101022708A true CN101022708A (en) | 2007-08-22 |
Family
ID=38492624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710007070 Pending CN101022708A (en) | 2006-02-13 | 2007-02-08 | Temporary fixing structure for electronic parts |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4459913B2 (en) |
| CN (1) | CN101022708A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104094680A (en) * | 2012-02-06 | 2014-10-08 | 萱场工业株式会社 | Bus bar |
-
2006
- 2006-02-13 JP JP2006035013A patent/JP4459913B2/en active Active
-
2007
- 2007-02-08 CN CN 200710007070 patent/CN101022708A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104094680A (en) * | 2012-02-06 | 2014-10-08 | 萱场工业株式会社 | Bus bar |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007214486A (en) | 2007-08-23 |
| JP4459913B2 (en) | 2010-04-28 |
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