CN101019068A - Backlight unit using thermal conductive resin for liquid crystal display - Google Patents
Backlight unit using thermal conductive resin for liquid crystal display Download PDFInfo
- Publication number
- CN101019068A CN101019068A CNA2006800008115A CN200680000811A CN101019068A CN 101019068 A CN101019068 A CN 101019068A CN A2006800008115 A CNA2006800008115 A CN A2006800008115A CN 200680000811 A CN200680000811 A CN 200680000811A CN 101019068 A CN101019068 A CN 101019068A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- crystal display
- backlight assembly
- display device
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133604—Direct backlight with lamps
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/02—Function characteristic reflective
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Optical Elements Other Than Lenses (AREA)
- Liquid Crystal (AREA)
Abstract
The present invention relates to a reflection plate for a backlight unit in a liquid crystal display device, and more particularly, to a reflection plate for a backlight unit in a liquid crystal display device, which is made of a thermoplastic thermal conductive resin composition having a thermal conductivity of at least 0.35 W/mK, thereby effectively solving the thermal problem of the backlight unit, and having excellent properties such as shock resistance, heat resistance, mechanical strength, and the like, as well as having excellent reflectivity, thereby improving the durability of the liquid crystal display device. Furthermore, the present invention relates to a backlight unit of a liquid crystal display device, comprising a reflection plate positioned at a lower portion of a lamp of the backlight unit for reflecting the light coming out of the lamp, a supporting rod for the lamp, and a lower plate functioning as a heat sink, wherein the reflection plate and the lower plate are made of the same material, thereby effectively solving the thermal problem of the backlight unit, and simplifying the manufacturing process.
Description
Technical field
The present invention relates to a kind of reflecting plate of backlight assembly and a kind of backlight assembly of liquid crystal display device of being used for, more particularly, the present invention relates to a kind of reflecting plate that in liquid crystal display device, is used for backlight assembly, this reflecting plate efficiently solves the heat problem of backlight assembly, and has an excellent performance, as resistance to impact, thermotolerance, physical strength etc., and have excellent reflectivity, thereby improved the permanance of liquid crystal display device; The invention still further relates to the backlight assembly of the liquid crystal display device that a kind of all parts make by identical materials, thereby efficiently solve the heat problem of backlight assembly, and simplified preparation technology.
Background technology
Different with cathode-ray tube (CRT), usually, liquid crystal display (LCD) device itself does not have lighting function, therefore needs luminescent device to keep uniform brightness on whole screen.
According to the method that light source is provided, LCD can be divided into the transmission-type that uses dispersed light and backlight assembly and use the reflection-type of ambient light as light source.In these methods, under the situation of reflection type LCD, backlight assembly and its power consumption are not lower owing to not needing, so it has been carried out many researchs.But, because when the luminance shortage of the light source that comes from the outside, its visibility is lower, so many so far application can't realize.On the other hand, under the situation of the transmission-type LCD that in recent years actively uses, key factor is to provide the light source with uniform luminance by backlight assembly.
Backlight assembly can be divided into the top-down approach system (top-down method system) of light source to illuminate the whole surface of substrate is set on the liquid crystal panel bottom surface, and light source is set and by light guide plate and the reflecting plate edge light system of diffused light (edge illumination system) equably on the both sides of this assembly.
Since brightness evenly and power consumption lower, this edge light system backlight unit is mainly used in small size LCD monitor or notebook, but explicitly calls for light guide plate diffused light equably from the side.
On the other hand, under the situation of top-down approach system backlight unit, because light source direct irradiation substrate, so light utilization efficiency is higher, and because to size without limits, so applicable to large-scale LCD TV or monitor.But, because light source is set at very near on the position of liquid crystal panel, and need a large amount of lamps so that light source to be provided, thereby cause the problem that heat increases.Under the hot too much situation that produces, this may be to produce the main cause of spot on screen, thereby has shortened the life-span of liquid crystal panel.In recent years, particularly when LCD had become bigger and thinner, the heat problem of backlight assembly had become the problem of seeking in every way to and will solve.
Structure to typical top-down approach system backlight unit makes the following instructions.
In the top-down approach system backlight unit, it is near the light source that the support bar that will be used to support liquid crystal panel is arranged on lamp, and with diffusing panel, prism plate and two brightness enhancement film (dualbrightness enhancement film) (DBEF) plate be arranged in the top of lamp successively.In addition, will be used to prevent that reflecting plate, external support bar that light leaks and the lower plate that plays the heating radiator effect are arranged in the bottom of lamp.
The flat 04-239540 of Japanese publication number discloses the white polyester film that a kind of conduct is used for the reflection plate material of this backlight assembly composition; But problem is, because the heat that produces from light source can cause the reflecting plate flavescence, thereby makes tone reduction and brightness reduce.
Japanese publication number 2002-98811,2002-138150 and 2001-305321 disclose the adding multiple additives, and have the technology of structural change, and Japanese publication number 2002-50222 and 2002-40214 disclose and use white porous polyester film to improve the reflexive technology of reflectance coating with the white polyester film that improves reflectance, transmittance etc.In addition, Japanese publication number 2003-145657 and 2003-121616 disclose and have used the superfine foam polyester sheet to prepare the technology of reflecting plate.
U.S. Patent number 5,837,757, the flat 07-242781 of Japanese publication number peace 09-176471 discloses the reflectivity of white polycarbonate resin and the technology of resistance to impact, and Japanese publication number 1999-181267 discloses and uses the sheet polycarbonate resin to be equipped with the technology of reflecting plate.
Yet, in the technology of above-mentioned preparation reflecting plate,, do not have solution to the heat problem of backlight assembly though disclose the method for the reflectivity that is used to improve reflection plate material, thermotolerance, resistance to impact etc.Specifically, do not carry out by heat conductive resin composition being applied to reflection plate material to solve the trial of heat problem.
Korea S publication number 2004-0017718 discloses a kind of method of the lower plate that will be applied to backlight assembly as the high-termal conductivity metal material of aluminium to solve the heat problem of backlight assembly, but problem is, because reflecting plate is arranged between heater element and the lower plate, so hindered the solution of heat problem, and increased cost of products.
In order to solve the above-mentioned problems in the prior art, an object of the present invention is to provide a kind of reflecting plate that is used for the liquid crystal display device backlight assembly, this reflecting plate efficiently solves the heat problem of backlight assembly, and has excellent performance, as resistance to impact, thermotolerance, physical strength etc., and have excellent reflectivity, thereby improved the permanance of liquid crystal display device.
In addition, another object of the present invention provides a kind of heat problem of effective solution backlight assembly and simplifies the backlight assembly of preparation technology's liquid crystal display device.
Summary of the invention
Technical matters
In order to realize above-mentioned purpose of the present invention, a kind of reflecting plate that is used for the backlight assembly of liquid crystal display device is provided, it is characterized in that this reflecting plate is made by having at least the thermoplasticity thermally conductive resin of the thermal conductivity of 0.35W/mK.
In addition, according to the present invention, a kind of backlight assembly of liquid crystal display device is provided, it is characterized in that, this backlight assembly comprises reflecting plate, the support bar of lamp and the lower plate of heating radiator function of the bottom that is used to reflect light that sends from lamp and the lamp that is arranged on backlight assembly, and wherein this reflecting plate and lower plate are made by identical materials.
Hereinafter, will describe the present invention.
When the reflecting plate of backlight assembly is positioned at the very near position of illuminator, when the thermal conductivity of reflection plate material is higher, be effective to the solution of heat problem.The thermal conductivity of plastics is lower usually, generally is up to 0.2W/mK, even therefore it is used as the reflection plate material of backlight assembly, still has restriction to solving heat problem by heat conduction.So, have the metal material of high heat conductance or the radiating element of the special construction that helps dispelling the heat still is essential for use.
In addition, in order effectively to distribute the heat that in heater element, produces as illuminator, higher when the thermal conductivity as the material of heat transfer medium, and the area of contact outside atmosphere is effective for the backlight assembly that comprises reflecting plate, support bar and lower plate usually when big.But reflecting plate, support bar and lower plate are respectively independently product, so it is made by different materials usually.Under the situation of reflecting plate and support bar, it mainly uses polyester or poly carbonate resin composition preparation, and under the situation of lower plate, because thermolysis is important, so it is mainly made by the metal material with thermal conductive resin.But, because various properties of materials differences, so even use reflecting plate, support bar and lower plate, effectively solve heat dissipation problem and be still difficulty by existing method preparation.
Technical scheme
In order to address the above problem, for reflecting plate by thermoplastic thermal conductive resin preparation with thermal conductivity of 0.35W/mK at least, the present inventor confirms, even when additionally not using radiating element, special construction or metal material, also can solve heat dissipation problem by self thermal conductivity.In addition, can confirm, comprise with the reflecting plate of identical thermoplasticity thermally conductive resin material preparation and the backlight assembly of lower plate having good thermal conductivity, and simplified preparation technology reducing cost, and therefore finished the present invention with effective solution heat dissipation problem.
Therefore, the invention is characterized in that reflecting plate is made by having at least the thermoplastic thermal conductive resin of the thermal conductivity of 0.35W/mK.
Feature of the present invention also is, backlight assembly comprises by identical having reflecting plate and a lower plate that the thermoplasticity thermally conductive resin material of the thermal conductivity of 0.35W/mK is at least made.
Thermoplastic thermal conductive resin comprises the thermoplastic resin of 10～95 weight % and the solid ceramic of 90～5 weight %.
To thermoplastic resin without limits, and can use the thermoplastic resin of all kinds.Preferred use separately or use polybutylene terephthalate by mixing, polyethylene terephthalate, aromatic poly amide, polyamide, polycarbonate, polystyrene, poly-to benzene sulphur, thermotropic liquid-crystalline polymer, polysulfones, polyethersulfone, polyetherimide, polyetheretherketone, polyarylate, polymethylmethacrylate, polyvinyl alcohol (PVA), polypropylene, tygon, polyacrylonitrile-butadiene-styrene copolymer, PolyTHF-1,4-butylene glycol multipolymer, comprise cinnamic multipolymer, resin based on fluorine, Polyvinylchloride, in the polyacrylonitrile etc. two or more.
The thermoplastic resin that in thermoplastic thermal conductive resin, preferably comprises 10～95 weight %.
Use solid ceramic at room temperature to have the thermoplastic thermal conductive resin of the thermal conductivity of 0.35W/mK at least, and can use separately or by mixing two or more that use in the boron nitride that at room temperature has the thermal conductivity of 300W/mK at least, silit, diamond, beryllia, boron phosphide, aluminium nitride, sulfuration beryllium, arsenic boron, silicon, gallium nitride, aluminum phosphate, the gallium phosphide etc. with preparation.
The solid ceramic that in thermoplastic thermal conductive resin, preferably comprises 5～90 weight %.
Thermoplastic thermal conductive resin can further comprise separately or comprise as two or more fillers in thin slice, glass fibre and halogen or the halogen-free flame-retardant by mixing.The filler that in thermoplastic thermal conductive resin, can preferably comprise 5～15 weight %.
For halogen or halogen-free flame-retardant, can use separately or by mix using carbonate oligomer, Sb based on bromine
2O
3, with based in the fire retardant of phosphorus or red phosphorus, cyanogen urea acid melamine ester, trimerization of nitriles ammonia, isocyanuric acid triphenylmethyl methacrylate, melamine phosphate ester, melamine pyrophosphate ester, APP, phosphoric acid alkylamine ester, melamine resin, the Firebrake ZB etc. two or more.
Thermoplastic thermal conductive resin can further comprise the white dielectric material that is used to improve the optical reflection coefficient.
This white dielectric material can be used separately or use BaSO by mixing
4, TiO
2, SiO
2, B
2O
3, Al
2O
3Deng in two or more, and in thermoplastic thermal conductive resin, can preferably comprise the white dielectric material of 5～40 weight %.
In the thermoplasticity thermally conductive resin, can preferably comprise solid ceramic and the white dielectric material that is less than 90 weight %.
In double screw extruder, can prepare thermoplastic thermal conductive resin by mixing and pushing mentioned component.At this moment, the bucket temperature of double screw extruder should remain on 250～340 ℃.
Beneficial effect
The thermal conductivity of thermoplastic thermal conductive resin is preferably 0.35W/mK at least.When this thermal conductivity is at least 0.35W/mK, thermal conduction rate by reflecting plate can not reduce, therefore solved the heat problem of backlight assembly effectively, and has an excellent performance, as processibility, reflectivity, physical strength etc., thereby provide the structure that reflecting plate and lower plate is combined and prepare.
Embodiment
Hereinafter, will describe in detail the preferred embodiments of the present invention with reference to the accompanying drawings.Though herein disclosed is preferred embodiment so that the understanding of the present invention, but the following examples only are of the present invention illustrating, and it should be appreciated by those skilled in the art, under the situation of the scope that does not break away from principle of the present invention and essence and appended claims and its equivalents, can carry out numerous modifications and variations to the present invention.
[embodiment]
Embodiment 1
The diameter that preparation is made by the thermoplastic thermal conductive resin that comprises 60 weight % pet resins (being made by LG Chemical Ltd.) and 40 weight % boron nitride is that 10mm and thickness are the sample of 0.3mm.
Embodiment 2
Preparation is by comprising 60 weight % pet resins (being made by LG Chemical Ltd.), 25 weight % boron nitride and 15 weight %TiO
2The diameter made of thermoplastic thermal conductive resin be that 10mm and thickness are the sample of 0.3mm.
Embodiment 3
Preparation is by comprising 60 weight % polycarbonate resins (being made by LG Chemical Ltd.), 20 weight % boron nitride and 20 weight %TiO
2The diameter made of thermoplastic thermal conductive resin be that 10mm and thickness are the sample of 0.3mm.
Embodiment 4
Preparation is by comprising 70 weight % polycarbonate resins (being made by LG Chemical Ltd.), 5 weight % boron nitride and 25 weight %TiO
2The diameter made of thermoplastic thermal conductive resin be that 10mm and thickness are the sample of 0.3mm.
Comparative Examples 1
Preparation is by comprising 90 weight % polycarbonate resins (being made by LG-DOW) and 10 weight %TiO
2The diameter made of resin combination be that 10mm and thickness are the sample of 0.3mm.
[test case]
Measure thermoplastic thermal conductive resin and the performance of the sample that in the foregoing description and Comparative Examples, prepares according to following method, and show the result in the table 1.
Heat deflection temperature: measure according to ASTM D648.
Bending modulus: measure according to ASTM D790.
Tensile elongation ratio: measure according to ASTM D638.
Thermal conductivity:, show to be less than 10% error based on three kinds of measuring methods as flat band method (LG Chemical Ltd., technique center), thermometal collimation method (Korea S's standard and research institute) and Hakke Thermofilxer.
Reflectivity: under the wavelength of 550nm, measure total reflectivity with spectrophotometer (Shimadzu UV-3101PC).
[table 1]
| Project | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Comparative Examples 1 |
| Heat deflection temperature (℃) | 90 | 130 | 130 | 120 | 120 |
| Bending modulus (kg/cm 2) | 50000 | 45000 | 50000 | 30000 | 26000 |
| Tensile elongation is than (%) | 5 | 4 | 4 | 70 | 130 |
| Thermal conductivity (W/mK) | 0.38 | 0.4 | 0.42 | 0.37 | 0.23 |
| Reflectivity (550nm) (%) | 93 | 92 | 95 | 98 | 85 |
As shown in table 1, can confirm, sample among the embodiment 1～3 of thermoplastic thermal conductive resin preparation used according to the invention is better than the sample in the Comparative Examples on physical strength such as heat deflection temperature, bending modulus and tensile elongation ratio and reflectivity, and has the thermal conductivity of 0.35W/mK at least.
Industrial applicibility
According to the present invention, prepared the reflecting plate for the liquid crystal display device backlight assembly, this reflecting plate efficiently solves the heat problem of backlight assembly, and has an excellent performance, such as resistance to impact, heat resistance, mechanical strength, and have excellent reflectivity, therefore improved the durability of liquid crystal display device.
In addition, provide a kind of backlight assembly of liquid crystal display device, wherein reflecting plate is made by identical material with lower plate, thereby efficiently solves the heat problem of backlight assembly, and has simplified preparation technology.
Claims (17)
1, a kind of reflecting plate that is used for the backlight assembly of liquid crystal display device is characterized in that, described reflecting plate is made by having at least the thermoplasticity heat-conductive resin composition of the thermal conductivity of 0.35W/mK.
2, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 1 is characterized in that, described thermoplasticity heat-conductive resin composition comprises the thermoplastic resin of 10～95 weight % and the solid ceramic of 90～5 weight %.
3, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 2, it is characterized in that, described thermoplastic resin comprises polybutylene terephthalate for being selected from, polyethylene terephthalate, aromatic poly amide, polyamide, polycarbonate, polystyrene, poly-to benzene sulphur, thermotropic liquid-crystalline polymer, polysulfones, polyethersulfone, polyetherimide, polyetheretherketone, polyarylate, polymethylmethacrylate, polyvinyl alcohol (PVA), polypropylene, tygon, polyacrylonitrile-butadiene-styrene copolymer, PolyTHF-1,4-butylene glycol multipolymer, comprise cinnamic multipolymer, resin based on fluorine, one or more of the group of Polyvinylchloride and polyacrylonitrile.
4, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 2 is characterized in that, described solid ceramic thermal conductivity at room temperature is at least 0.35W/mK.
5, according to claim 2 or the 4 described reflecting plates that are used for the backlight assembly of liquid crystal display device, it is characterized in that described solid ceramic is to be selected from one or more of the group that comprises boron nitride, silit, diamond, beryllia, boron phosphide, aluminium nitride, sulfuration beryllium, arsenic boron, silicon, gallium nitride, aluminum phosphate and gallium phosphide.
6, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 1, it is characterized in that, described thermoplasticity heat-conductive resin composition further comprises the filler of 5～15 weight %, and this filler is to be selected from one or more of the group that comprises thin slice, glass fibre and halogen or halogen-free flame-retardant.
7, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 1 is characterized in that, described thermoplasticity heat-conductive resin composition further comprises the white dielectric material of 5～40 weight %, and this white dielectric material comprises BaSO for being selected from
4, TiO
2, SiO
2, B
2O
3And Al
2O
3One or more of group.
8, the reflecting plate that is used for the backlight assembly of liquid crystal display device according to claim 1 is characterized in that, described thermoplasticity heat-conductive resin composition is by mixing and the extruding preparation in double screw extruder.
9, a kind of backlight assembly of liquid crystal display device, it is characterized in that, described backlight assembly comprises reflecting plate, the support bar of lamp and the lower plate of heating radiator function of the bottom that is used to reflect light that sends from lamp and the lamp that is arranged on backlight assembly, and wherein said reflecting plate and lower plate are made by identical materials.
10, the backlight assembly of liquid crystal display device according to claim 9 is characterized in that, described backlight assembly is to have the thermoplasticity heat-conductive resin composition of the thermal conductivity of 0.35W/mK at least.
11, the backlight assembly of liquid crystal display device according to claim 10 is characterized in that, described thermoplastic thermal conductive resin comprises the thermoplastic resin of 10～95 weight % and the solid ceramic of 90～5 weight %.
12, the backlight assembly of liquid crystal display device according to claim 11, it is characterized in that, described thermoplastic resin comprises polybutylene terephthalate for being selected from, polyethylene terephthalate, aromatic poly amide, polyamide, polycarbonate, polystyrene, poly-to benzene sulphur, thermotropic liquid-crystalline polymer, polysulfones, polyethersulfone, polyetherimide, polyetheretherketone, polyarylate, polymethylmethacrylate, polyvinyl alcohol (PVA), polypropylene, tygon, polyacrylonitrile-butadiene-styrene copolymer, PolyTHF-1,4-butylene glycol multipolymer, comprise cinnamic multipolymer, resin based on fluorine, one or more of the group of Polyvinylchloride and polyacrylonitrile.
13, the backlight assembly of liquid crystal display device according to claim 11 is characterized in that, described solid ceramic thermal conductivity at room temperature is 0.35W/mK at least.
14, according to the backlight assembly of claim 11 or 13 described liquid crystal display devices, it is characterized in that described solid ceramic is to be selected from one or more of the group that comprises boron nitride, silit, diamond, beryllia, boron phosphide, aluminium nitride, sulfuration beryllium, arsenic boron, silicon, gallium nitride, aluminum phosphate and gallium phosphide.
15, the backlight assembly of liquid crystal display device according to claim 10, it is characterized in that, described thermoplasticity heat-conductive resin composition further comprises the filler of 5～15 weight %, and this filler is to be selected from one or more of the group that comprises thin slice, glass fibre and halogen or halogen-free flame-retardant.
16, the backlight assembly of liquid crystal display device according to claim 10 is characterized in that, described thermoplasticity heat-conductive resin composition further comprises the white dielectric material of 5～40 weight %, and this white dielectric material comprises BaSO for being selected from
4, TiO
2, SiO
2, B
2O
3And Al
2O
3One or more of group.
17, the backlight assembly of liquid crystal display device according to claim 10 is characterized in that, described thermoplasticity heat-conductive resin composition is by mixing and the extruding preparation in double screw extruder.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050080739 | 2005-08-31 | ||
| KR1020050080739A KR100805621B1 (en) | 2005-08-31 | 2005-08-31 | Reflection plate having good thermal conductivity for backlight unit |
| KR1020050080738 | 2005-08-31 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100629467A Division CN102155688B (en) | 2005-08-31 | 2006-08-28 | Reflection plate for backlight unit and backlight unit of liquid crystal display having good thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101019068A true CN101019068A (en) | 2007-08-15 |
Family
ID=38099335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800008115A Pending CN101019068A (en) | 2005-08-31 | 2006-08-28 | Backlight unit using thermal conductive resin for liquid crystal display |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100805621B1 (en) |
| CN (1) | CN101019068A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7852428B2 (en) | 2007-12-07 | 2010-12-14 | Samsung Electronics Co., Ltd | Liquid crystal display |
| CN102829399A (en) * | 2012-09-04 | 2012-12-19 | 京东方科技集团股份有限公司 | Backplate, backlight module and display device |
| CN107083163A (en) * | 2017-05-05 | 2017-08-22 | 孝感双华应用科技开发有限公司 | A kind of preparation method of heat-conducting type reflectance coating |
| WO2020093900A1 (en) * | 2018-11-05 | 2020-05-14 | 深圳Tcl新技术有限公司 | Display module and display device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100870905B1 (en) * | 2007-11-05 | 2008-11-28 | 주식회사 동부하이텍 | Styrenic resin composition for mold frame |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041160A (en) * | 1983-08-15 | 1985-03-04 | Hitachi Ltd | Control system of computer system |
| JPH09288993A (en) * | 1996-04-19 | 1997-11-04 | Sharp Corp | Lighting system, and display device utilizing it |
| JP2002296568A (en) | 2001-03-29 | 2002-10-09 | Victor Co Of Japan Ltd | Reflection type liquid crystal display element and manufacturing method therefor |
| EP1421595B1 (en) * | 2001-08-31 | 2012-03-14 | Cool Options, Inc. | Thermally conductive lamp reflector |
| AU2003269793A1 (en) | 2002-10-21 | 2004-05-04 | Hella Lux Slovenia Proizvodnja Svetlobne Opreme Za Motorna In Druga Vozila D.D.O. | Headlamp reflector made of a polymer composite and to be used in a vehicle |
| KR20040037297A (en) * | 2002-10-28 | 2004-05-07 | 비오이 하이디스 테크놀로지 주식회사 | Liquid Crystal Display |
| JP5124988B2 (en) * | 2005-05-30 | 2013-01-23 | Ｊｆｅスチール株式会社 | High-tensile steel plate with excellent delayed fracture resistance and tensile strength of 900 MPa or more and method for producing the same |
-
2005
- 2005-08-31 KR KR1020050080739A patent/KR100805621B1/en active IP Right Grant
-
2006
- 2006-08-28 CN CNA2006800008115A patent/CN101019068A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7852428B2 (en) | 2007-12-07 | 2010-12-14 | Samsung Electronics Co., Ltd | Liquid crystal display |
| CN102829399A (en) * | 2012-09-04 | 2012-12-19 | 京东方科技集团股份有限公司 | Backplate, backlight module and display device |
| CN107083163A (en) * | 2017-05-05 | 2017-08-22 | 孝感双华应用科技开发有限公司 | A kind of preparation method of heat-conducting type reflectance coating |
| WO2020093900A1 (en) * | 2018-11-05 | 2020-05-14 | 深圳Tcl新技术有限公司 | Display module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070025018A (en) | 2007-03-08 |
| KR100805621B1 (en) | 2008-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102155688B (en) | Reflection plate for backlight unit and backlight unit of liquid crystal display having good thermal conductivity | |
| TWI324166B (en) | Backlight unit having heat dissipating layer, display device having heat dissipating layer, and method for manufacturing heat dissipating layer | |
| KR100620943B1 (en) | Optical material, optical element, illuminator and display device | |
| US20090122216A1 (en) | Housing structure for lighting equipment and process for producing the same, and backlight device using said structure | |
| US8979330B2 (en) | Anisotropic light-diffusing film, anisotropic light-diffusing laminate, anisotropic light-reflecting laminate, and use thereof | |
| CN101019068A (en) | Backlight unit using thermal conductive resin for liquid crystal display | |
| US20070189011A1 (en) | Light-generating module, backlight assembly and display device having the same, and method thereof | |
| KR20090023395A (en) | Beam reflecting multilayer sheet, refractor using the sheet, illuminating device, and liquid crystal display device | |
| WO2008038754A1 (en) | Surface light source and liquid crystal display device using the same | |
| CN101118293A (en) | Hybrid diffusion plate, backlight assembly having hybrid diffusion plate, and liquid crystal display having backlight assembly | |
| WO2007055115A1 (en) | Directly-below type backlight device | |
| US20090147516A1 (en) | Solid illumination device | |
| KR101392734B1 (en) | Backlight assembly, display device having the backlight assembly and method of manufacturing the same | |
| WO2008100057A1 (en) | Cover sheet for prism and backlight unit assembly | |
| KR100767956B1 (en) | Backlight unit using thermal conductive resin for liquid crystal display | |
| KR101797593B1 (en) | Backlight unit and display device including the same | |
| TW200924627A (en) | Backlight module for liquid crystal displays | |
| CN102606958A (en) | Backlight module | |
| CN1916721A (en) | Backlight module | |
| KR20090002995A (en) | Method for manufacturing reflector used in backlight unit of liquid crystal display | |
| KR101700791B1 (en) | Display device | |
| KR20110108146A (en) | Diffuser plate and backlight unit assembly comprising the same | |
| KR20040017718A (en) | Backlight for liquid crystal display device | |
| KR101705218B1 (en) | Heat-dissipative reflection sheet and preparation method thereof | |
| KR101189161B1 (en) | Backlight unit and display device including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20070815 |