CN101012052A - Micro and nano structure assembling method welded by energy beam - Google Patents
Micro and nano structure assembling method welded by energy beam Download PDFInfo
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- CN101012052A CN101012052A CN 200710026638 CN200710026638A CN101012052A CN 101012052 A CN101012052 A CN 101012052A CN 200710026638 CN200710026638 CN 200710026638 CN 200710026638 A CN200710026638 A CN 200710026638A CN 101012052 A CN101012052 A CN 101012052A
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- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000002086 nanomaterial Substances 0.000 title claims description 71
- 238000003466 welding Methods 0.000 claims abstract description 34
- 239000000084 colloidal system Substances 0.000 claims abstract description 8
- 230000001681 protective effect Effects 0.000 claims abstract description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 33
- 229910052721 tungsten Inorganic materials 0.000 claims description 33
- 239000010937 tungsten Substances 0.000 claims description 33
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 31
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 14
- 239000012298 atmosphere Substances 0.000 claims description 12
- 238000010894 electron beam technology Methods 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
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Abstract
The invention relates to a micro nanometer structure assembly method using energy beam welding, which monitors the assembly process through microscope tools, allowing close relationship of the welded micro nanometer structure A and B, using dispersion force, electrostatic attraction or colloid sticking and suction of nanometer A and B, forming contact with energy beam for welding assembly. It adds nitrogen protective device to isolate oxygen to avoid oxidization of welding point. It can realize micro nanometer structure welding assembly being able to precisely control nanometer structure welding assembly free from influencing conductivity of the contact part of the nanometer and hard stripping of nanometer in high temperature.
Description
Technical field
The present invention relates to the design and fabrication technology field of micro-nano device, relate in particular to a kind of micro and nano structure assembling method that adopts the energy beam welding.
Background technology
In the prior art, micro and nano structure assembling method has two kinds of direct growth method and colloid mounting methods.Direct growth method efficient is higher, but is difficult to accurately control diameter, length and the quantity of location of growing point and micro-nano structure; Therefore the direction of growth of micro-nano structure forms irregular a plurality of micro-nano structures at random easily.The colloid mounting method can accurately be controlled the assembling of micro-nano structure, but has introduced the colloidal substance of stickup effect in assembling, and this can influence the electric conductivity of micro-nano structure contact site, and when high temperature, micro-nano structure can come off because of the thawing of colloid.
Summary of the invention
The object of the present invention is to provide a kind of micro and nano structure assembling method that adopts the energy beam welding, in assembling process, can realize the accurately assembling of control micro nano structure, also can not influence the electric conductivity of micro-nano structure contact site, micro-nano structure can not come off yet, thereby realize the efficient, stable of micro-nano structure assembling process, also can under the situation of not introducing other materials, achieve the above object.
For realizing above-mentioned technical purpose, the invention provides the micro and nano structure assembling method that adopts the energy beam welding, in the process of assembling, by micro-instrument assembling process is monitored, after making soldered micro-nano structure A and micro-nano structure B close mutually, utilize Van der Waals for, electrostatic attraction or colloid object that micro-nano structure A and micro-nano structure B are adsorbed mutually, form contact, utilize energy beam to carry out welding assembly then.
Preferably, welding process is carried out under protective atmosphere, can successfully avoid pad oxidation because of high temperature.
Protective atmosphere can adopt as inert gas shielding atmosphere and nitrogen protection atmosphere such as helium atmosphere, neon atmosphere.
Implement the present invention, have following beneficial effect:
The micro and nano structure assembling method of employing energy beam welding provided by the invention, owing to adopted the method for energy beam welding, under the situation of not introducing other materials, by with soldered micro-nano structure A and micro-nano structure B mutually near and at Van der Waals for, under electrostatic attraction or the colloid stickup effect soldered micro-nano structure A is adsorbed mutually contacts with micro-nano structure B, utilize energy beam to carry out welding assembly at last, thereby realized under the situation of not introducing other materials, micro-nano structure A is welded on the micro-nano structure B, avoided simultaneously influencing the defective of the electric conductivity of micro-nano structure contact site because of introducing other materials, the defective that micro-nano structure when also having avoided high temperature comes off easily because the material of being introduced melts, thus realize the efficient of micro-nano structure assembling process, stable.Owing in assembling process of the present invention, adopted micro-instrument to monitor again, so can accurately control the position that contacts distance and assembling welding of micro-nano structure A and micro-nano structure B.
In a preferred embodiment of the invention, owing to welding process is carried out under protective atmosphere, so can successfully avoid pad oxidized.
Therefore, the present invention is not when introducing other materials, realize the welding assembly of micro-nano structure in the time of not only can be at the electric conductivity that does not influence the micro-nano structure contact site, at high temperature under the situation of micro-nano structure difficult drop-off, and can accurately control the welding assembly of micro-nano structure and avoid pad oxidized.
Description of drawings
Fig. 1 is the process flow diagram that adopts the micro and nano structure assembling method of laser weld among the embodiment provided by the invention;
Figure 100 is the substrate that is dispersed with micro-nano structure tungsten oxide one-dimensional nanometer point among the embodiment provided by the invention;
Figure 110 is that the substrate that will be dispersed with micro-nano structure tungsten oxide one-dimensional nanometer point among the embodiment provided by the invention moves under the laser beam, and under the in good time observation of micro-instrument, move another micro-nano structure tungsten micro needlepoint, and make tungsten oxide one-dimensional nanometer point and tungsten micro needlepoint close mutually;
Figure 120 adds a voltage among the embodiment provided by the invention between two micro-nano structure tungsten oxide one-dimensional nanometer points and tungsten micro needlepoint, utilize electrostatic attraction that it is attracted each other, and forms contact;
Fig. 2 is that the SEM that among the embodiment provided by the invention a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint schemes;
Figure 20 1 is the low power SEM that among the embodiment provided by the invention a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint;
Figure 20 2 is SEM images of nanometer point and tungsten micro needlepoint pad among the embodiment provided by the invention;
Figure 20 3 is the pad SEM images that amplify;
Realize after the laser weld assembling between single tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint SEM figure of binding site fastness test among Fig. 3 embodiment provided by the invention;
Figure 30 1 shows be among the embodiment provided by the invention under SEM observes in good time, promote to be welded on tungsten oxide nanometer point on the tungsten micro needlepoint with a probe, the nanometer point crooked 7.4 is spent under thrust;
Figure 30 2 shows the further nanometer point that promotes among the embodiment provided by the invention, and its generation is departed from more greatly, about 16.9 degree of angle;
Figure 30 3 shows among the embodiment provided by the invention that more further promotion can allow nanometer point fracture rather than allow the nanometer point come off from pad;
Fig. 4 is the flow chart that adopts the micro and nano structure assembling method of laser weld among the embodiment provided by the invention.
The specific embodiment
Below in conjunction with drawings and Examples to the present invention is described further.
With reference to figure 1, be the process flow diagram that adopts the micro and nano structure assembling method of laser weld in the present embodiment provided by the invention, Fig. 4 is the flow chart that adopts the micro and nano structure assembling method of laser weld in the present embodiment provided by the invention.In the present embodiment; to be welded on tungsten oxide one-dimensional nanometer point A on the tungsten micro needlepoint B; the process of welding is that tungsten oxide one-dimensional nanometer point A and tungsten micro needlepoint B is close; utilize the electrostatic attraction between tungsten oxide one-dimensional nanometer point A and the tungsten micro needlepoint B that it is in contact with one another then; under the nitrogen atmosphere protection; after the laser beam that utilizes laser instrument to penetrate carries out spot focusing, discharge laser and carry out welding assembly.This micro and nano structure assembling method method may further comprise the steps:
A, employing electrochemical etching method prepare tungsten micro needlepoint B.Shown among Fig. 4 401.
B, employing ultra-sonic dispersion method are dispersed in tungsten oxide one-dimensional nanometer point A in the ethanolic solution, drawing this hanging drop with dropper then is placed on the copper platform substrate 101, send in the baking oven subsequently and dry, allow tungsten oxide one-dimensional nanometer point A sparsely be dispersed on the copper platform substrate 101.Shown in Figure 100, shown in 402 among Fig. 4.
C, the copper platform substrate 101 that is dispersed with tungsten oxide one-dimensional nanometer point A that the b step is prepared are seated in the isolated chamber 113 of a quartzy oxygen, and but quartzy chamber is seated in micro-stepping advances on the mobile sample platform, the sample platform is fixed under the laser beam, allows the indication LASER SPECKLE of laser beam see through the central authorities that copper platform substrate 101 is dropped in quartzy chamber.Shown in Figure 110, shown in 403 among Fig. 4.
D, slowly charge into protection nitrogen, and drain oxygen in the cavity by the gas outlet from quartzy chamber one side.Shown in 404 among Fig. 4.
E, microscope 112 is fixed on the direction with 111 one-tenth miter angles of laser beam, regulate the sample platform, observing in good time and pick out pattern, size and orientation by microscope 112, suitable (orientation suitable finger tungsten oxide one-dimensional nanometer point is parallel with the tungsten micro needlepoint, and afterbody sensing tungsten micro needlepoint) nanometer point, mobile then tungsten micro needlepoint B is near nanometer point A.Shown in Figure 110, shown in 405 among Fig. 4.
F, add a 5V voltage between tungsten micro needlepoint B and sample substrate 101, under the electrostatic attraction effect, when the distance of tungsten micro needlepoint B and tungsten oxide one-dimensional nanometer point A enough closely the time, the latter will be adsorbed on the former.Shown in Figure 120, shown in 406 among Fig. 4.
G, after step f tungsten oxide one-dimensional nanometer point A is adsorbed on the tungsten micro needlepoint B, B moves apart substrate 101 gently with the tungsten micro needlepoint, and allows the redness indication laser point of laser spot welder accumulate on the tungsten filament apart from tungsten oxide one-dimensional nanometer point A and tungsten micro needlepoint B binding site a distance (typical range: 0.1mm).Shown in 407 among Fig. 4.
H, release pulse laser 111 are absorbed photon temperature by bombarded point 121 tungsten filaments and raise, and under heat transfer process, the temperature of tungsten oxide one-dimensional nanometer point and tungsten dimension needle point binding site will raise.When temperature is elevated to the fusing point of tungsten oxide one-dimensional nanometer point, tungsten oxide one-dimensional nanometer point will be fused to and form welding on the tungsten micro needlepoint.Shown in 408 among Fig. 4.
The above-mentioned effect of utilizing the auxiliary electrostatic attraction method of electric field to realize tungsten oxide one-dimensional nanometer point is contacted with the tungsten micro needlepoint, can be replaced into the effect that utilizes Van der Waals for and realize the effect that contacts on tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint, the method that also can take colloid to paste realizes being in contact with one another of the sharp and tungsten micro needlepoint of tungsten oxide one-dimensional nanometer
The laser beam that present embodiment adopts can be replaced into electron beam, beam-plasma or other energy beams.
The nitrogen protection atmosphere that present embodiment adopts also can be inert gas shielding atmosphere such as helium atmosphere, neon atmosphere.
Utilize the effect of the assembling of the micro-nano structure that the micro and nano structure assembling method of employing laser weld provided by the invention obtains to analyze with SEM (SEM), as shown in Figure 2, be that the SEM that a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint provided by the invention schemes, can see from the SEM picture of tungsten oxide one-dimensional nanometer point and tungsten micro needlepoint joint portion, both have realized good fusion, and this proof adopts method of laser welding successfully to realize the assembling of tungsten oxide one-dimensional nanometer point on the tungsten micro needlepoint.
Utilize the fastness of the micro-nano structure that the micro and nano structure assembling method of employing laser weld provided by the invention obtains to analyze with SEM (SEM), as shown in Figure 3, be after the laser weld assembling between realization provided by the invention single tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint, the SEM figure of binding site fastness test, show among the figure, under the promotion of a microprobe, tungsten oxide one-dimensional nanometer point does not separate from pad with the tungsten micro needlepoint, and further promotion can only make the fracture of tungsten oxide one-dimensional nanometer point, has proved that thus micro-nano structure welding assembly pad is very firm in conjunction with getting.
What more than disclose only is preferred embodiment of the present invention, can not limit interest field of the present invention with this, and the equivalent variations according to claim of the present invention is done still belongs to the scope that the present invention is contained.
Claims (9)
1, a kind of micro and nano structure assembling method that adopts the energy beam welding, it is characterized in that: in the process of assembling, by micro-instrument assembling process is monitored, after making soldered micro-nano structure A and micro-nano structure B close mutually, utilizing Van der Waals for, electrostatic attraction or colloid to paste adsorbs micro-nano structure A and micro-nano structure B mutually, form contact, utilize energy beam to carry out welding assembly then.
2, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: welding process is carried out under protective atmosphere.
3, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-nano structure A is dispersed on the substrate, but this substrate is placed on the sample platform that stepping moves, described micro-nano structure B is fixed on the step-by-step operation platform, regulate described sample platform and described step-by-step operation platform, make micro-nano structure A and micro-nano structure B close.
4, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-instrument is fixed on described energy beam to become on the direction of miter angle.
5, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 3, it is characterized in that: the energy beam focal position is on described micro-nano structure A or on described substrate.
6. a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described energy beam is laser beam, electron beam, beam-plasma.
7, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 3 is characterized in that: apply voltage between described micro-nano material B and described substrate.
8, as claim 3 or 7 described a kind of micro and nano structure assembling methods that adopt the energy beam welding, it is characterized in that: described substrate is the conductive substrates that is fit to apply voltage.
9, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-nano structure A is a tungsten oxide one-dimensional nanometer point, and described micro-nano structure B is the tungsten micro needlepoint.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710026638 CN101012052A (en) | 2007-01-30 | 2007-01-30 | Micro and nano structure assembling method welded by energy beam |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710026638 CN101012052A (en) | 2007-01-30 | 2007-01-30 | Micro and nano structure assembling method welded by energy beam |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624388A (en) * | 2013-11-13 | 2014-03-12 | 中国科学院合肥物质科学研究院 | One-dimensional nanomaterial welding method based on electrically-induced heating effect |
| CN104439956A (en) * | 2014-11-18 | 2015-03-25 | 清华大学 | Method for connecting materials difficult to connect through ultrafast lasers |
-
2007
- 2007-01-30 CN CN 200710026638 patent/CN101012052A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624388A (en) * | 2013-11-13 | 2014-03-12 | 中国科学院合肥物质科学研究院 | One-dimensional nanomaterial welding method based on electrically-induced heating effect |
| CN103624388B (en) * | 2013-11-13 | 2015-09-30 | 中国科学院合肥物质科学研究院 | A kind of welding method of the monodimension nanometer material based on electroluminescent heating effect |
| CN104439956A (en) * | 2014-11-18 | 2015-03-25 | 清华大学 | Method for connecting materials difficult to connect through ultrafast lasers |
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Open date: 20070808 |