CN101012052A - Micro and nano structure assembling method welded by energy beam - Google Patents

Micro and nano structure assembling method welded by energy beam Download PDF

Info

Publication number
CN101012052A
CN101012052A CN 200710026638 CN200710026638A CN101012052A CN 101012052 A CN101012052 A CN 101012052A CN 200710026638 CN200710026638 CN 200710026638 CN 200710026638 A CN200710026638 A CN 200710026638A CN 101012052 A CN101012052 A CN 101012052A
Authority
CN
China
Prior art keywords
micro
nano structure
energy beam
adopts
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200710026638
Other languages
Chinese (zh)
Inventor
许宁生
安帅
佘峻聪
邓少芝
陈军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Yat Sen University
Original Assignee
Sun Yat Sen University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Yat Sen University filed Critical Sun Yat Sen University
Priority to CN 200710026638 priority Critical patent/CN101012052A/en
Publication of CN101012052A publication Critical patent/CN101012052A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Micromachines (AREA)

Abstract

The invention relates to a micro nanometer structure assembly method using energy beam welding, which monitors the assembly process through microscope tools, allowing close relationship of the welded micro nanometer structure A and B, using dispersion force, electrostatic attraction or colloid sticking and suction of nanometer A and B, forming contact with energy beam for welding assembly. It adds nitrogen protective device to isolate oxygen to avoid oxidization of welding point. It can realize micro nanometer structure welding assembly being able to precisely control nanometer structure welding assembly free from influencing conductivity of the contact part of the nanometer and hard stripping of nanometer in high temperature.

Description

A kind of micro and nano structure assembling method that adopts the energy beam welding
Technical field
The present invention relates to the design and fabrication technology field of micro-nano device, relate in particular to a kind of micro and nano structure assembling method that adopts the energy beam welding.
Background technology
In the prior art, micro and nano structure assembling method has two kinds of direct growth method and colloid mounting methods.Direct growth method efficient is higher, but is difficult to accurately control diameter, length and the quantity of location of growing point and micro-nano structure; Therefore the direction of growth of micro-nano structure forms irregular a plurality of micro-nano structures at random easily.The colloid mounting method can accurately be controlled the assembling of micro-nano structure, but has introduced the colloidal substance of stickup effect in assembling, and this can influence the electric conductivity of micro-nano structure contact site, and when high temperature, micro-nano structure can come off because of the thawing of colloid.
Summary of the invention
The object of the present invention is to provide a kind of micro and nano structure assembling method that adopts the energy beam welding, in assembling process, can realize the accurately assembling of control micro nano structure, also can not influence the electric conductivity of micro-nano structure contact site, micro-nano structure can not come off yet, thereby realize the efficient, stable of micro-nano structure assembling process, also can under the situation of not introducing other materials, achieve the above object.
For realizing above-mentioned technical purpose, the invention provides the micro and nano structure assembling method that adopts the energy beam welding, in the process of assembling, by micro-instrument assembling process is monitored, after making soldered micro-nano structure A and micro-nano structure B close mutually, utilize Van der Waals for, electrostatic attraction or colloid object that micro-nano structure A and micro-nano structure B are adsorbed mutually, form contact, utilize energy beam to carry out welding assembly then.
Preferably, welding process is carried out under protective atmosphere, can successfully avoid pad oxidation because of high temperature.
Protective atmosphere can adopt as inert gas shielding atmosphere and nitrogen protection atmosphere such as helium atmosphere, neon atmosphere.
Implement the present invention, have following beneficial effect:
The micro and nano structure assembling method of employing energy beam welding provided by the invention, owing to adopted the method for energy beam welding, under the situation of not introducing other materials, by with soldered micro-nano structure A and micro-nano structure B mutually near and at Van der Waals for, under electrostatic attraction or the colloid stickup effect soldered micro-nano structure A is adsorbed mutually contacts with micro-nano structure B, utilize energy beam to carry out welding assembly at last, thereby realized under the situation of not introducing other materials, micro-nano structure A is welded on the micro-nano structure B, avoided simultaneously influencing the defective of the electric conductivity of micro-nano structure contact site because of introducing other materials, the defective that micro-nano structure when also having avoided high temperature comes off easily because the material of being introduced melts, thus realize the efficient of micro-nano structure assembling process, stable.Owing in assembling process of the present invention, adopted micro-instrument to monitor again, so can accurately control the position that contacts distance and assembling welding of micro-nano structure A and micro-nano structure B.
In a preferred embodiment of the invention, owing to welding process is carried out under protective atmosphere, so can successfully avoid pad oxidized.
Therefore, the present invention is not when introducing other materials, realize the welding assembly of micro-nano structure in the time of not only can be at the electric conductivity that does not influence the micro-nano structure contact site, at high temperature under the situation of micro-nano structure difficult drop-off, and can accurately control the welding assembly of micro-nano structure and avoid pad oxidized.
Description of drawings
Fig. 1 is the process flow diagram that adopts the micro and nano structure assembling method of laser weld among the embodiment provided by the invention;
Figure 100 is the substrate that is dispersed with micro-nano structure tungsten oxide one-dimensional nanometer point among the embodiment provided by the invention;
Figure 110 is that the substrate that will be dispersed with micro-nano structure tungsten oxide one-dimensional nanometer point among the embodiment provided by the invention moves under the laser beam, and under the in good time observation of micro-instrument, move another micro-nano structure tungsten micro needlepoint, and make tungsten oxide one-dimensional nanometer point and tungsten micro needlepoint close mutually;
Figure 120 adds a voltage among the embodiment provided by the invention between two micro-nano structure tungsten oxide one-dimensional nanometer points and tungsten micro needlepoint, utilize electrostatic attraction that it is attracted each other, and forms contact;
Fig. 2 is that the SEM that among the embodiment provided by the invention a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint schemes;
Figure 20 1 is the low power SEM that among the embodiment provided by the invention a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint;
Figure 20 2 is SEM images of nanometer point and tungsten micro needlepoint pad among the embodiment provided by the invention;
Figure 20 3 is the pad SEM images that amplify;
Realize after the laser weld assembling between single tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint SEM figure of binding site fastness test among Fig. 3 embodiment provided by the invention;
Figure 30 1 shows be among the embodiment provided by the invention under SEM observes in good time, promote to be welded on tungsten oxide nanometer point on the tungsten micro needlepoint with a probe, the nanometer point crooked 7.4 is spent under thrust;
Figure 30 2 shows the further nanometer point that promotes among the embodiment provided by the invention, and its generation is departed from more greatly, about 16.9 degree of angle;
Figure 30 3 shows among the embodiment provided by the invention that more further promotion can allow nanometer point fracture rather than allow the nanometer point come off from pad;
Fig. 4 is the flow chart that adopts the micro and nano structure assembling method of laser weld among the embodiment provided by the invention.
The specific embodiment
Below in conjunction with drawings and Examples to the present invention is described further.
With reference to figure 1, be the process flow diagram that adopts the micro and nano structure assembling method of laser weld in the present embodiment provided by the invention, Fig. 4 is the flow chart that adopts the micro and nano structure assembling method of laser weld in the present embodiment provided by the invention.In the present embodiment; to be welded on tungsten oxide one-dimensional nanometer point A on the tungsten micro needlepoint B; the process of welding is that tungsten oxide one-dimensional nanometer point A and tungsten micro needlepoint B is close; utilize the electrostatic attraction between tungsten oxide one-dimensional nanometer point A and the tungsten micro needlepoint B that it is in contact with one another then; under the nitrogen atmosphere protection; after the laser beam that utilizes laser instrument to penetrate carries out spot focusing, discharge laser and carry out welding assembly.This micro and nano structure assembling method method may further comprise the steps:
A, employing electrochemical etching method prepare tungsten micro needlepoint B.Shown among Fig. 4 401.
B, employing ultra-sonic dispersion method are dispersed in tungsten oxide one-dimensional nanometer point A in the ethanolic solution, drawing this hanging drop with dropper then is placed on the copper platform substrate 101, send in the baking oven subsequently and dry, allow tungsten oxide one-dimensional nanometer point A sparsely be dispersed on the copper platform substrate 101.Shown in Figure 100, shown in 402 among Fig. 4.
C, the copper platform substrate 101 that is dispersed with tungsten oxide one-dimensional nanometer point A that the b step is prepared are seated in the isolated chamber 113 of a quartzy oxygen, and but quartzy chamber is seated in micro-stepping advances on the mobile sample platform, the sample platform is fixed under the laser beam, allows the indication LASER SPECKLE of laser beam see through the central authorities that copper platform substrate 101 is dropped in quartzy chamber.Shown in Figure 110, shown in 403 among Fig. 4.
D, slowly charge into protection nitrogen, and drain oxygen in the cavity by the gas outlet from quartzy chamber one side.Shown in 404 among Fig. 4.
E, microscope 112 is fixed on the direction with 111 one-tenth miter angles of laser beam, regulate the sample platform, observing in good time and pick out pattern, size and orientation by microscope 112, suitable (orientation suitable finger tungsten oxide one-dimensional nanometer point is parallel with the tungsten micro needlepoint, and afterbody sensing tungsten micro needlepoint) nanometer point, mobile then tungsten micro needlepoint B is near nanometer point A.Shown in Figure 110, shown in 405 among Fig. 4.
F, add a 5V voltage between tungsten micro needlepoint B and sample substrate 101, under the electrostatic attraction effect, when the distance of tungsten micro needlepoint B and tungsten oxide one-dimensional nanometer point A enough closely the time, the latter will be adsorbed on the former.Shown in Figure 120, shown in 406 among Fig. 4.
G, after step f tungsten oxide one-dimensional nanometer point A is adsorbed on the tungsten micro needlepoint B, B moves apart substrate 101 gently with the tungsten micro needlepoint, and allows the redness indication laser point of laser spot welder accumulate on the tungsten filament apart from tungsten oxide one-dimensional nanometer point A and tungsten micro needlepoint B binding site a distance (typical range: 0.1mm).Shown in 407 among Fig. 4.
H, release pulse laser 111 are absorbed photon temperature by bombarded point 121 tungsten filaments and raise, and under heat transfer process, the temperature of tungsten oxide one-dimensional nanometer point and tungsten dimension needle point binding site will raise.When temperature is elevated to the fusing point of tungsten oxide one-dimensional nanometer point, tungsten oxide one-dimensional nanometer point will be fused to and form welding on the tungsten micro needlepoint.Shown in 408 among Fig. 4.
The above-mentioned effect of utilizing the auxiliary electrostatic attraction method of electric field to realize tungsten oxide one-dimensional nanometer point is contacted with the tungsten micro needlepoint, can be replaced into the effect that utilizes Van der Waals for and realize the effect that contacts on tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint, the method that also can take colloid to paste realizes being in contact with one another of the sharp and tungsten micro needlepoint of tungsten oxide one-dimensional nanometer
The laser beam that present embodiment adopts can be replaced into electron beam, beam-plasma or other energy beams.
The nitrogen protection atmosphere that present embodiment adopts also can be inert gas shielding atmosphere such as helium atmosphere, neon atmosphere.
Utilize the effect of the assembling of the micro-nano structure that the micro and nano structure assembling method of employing laser weld provided by the invention obtains to analyze with SEM (SEM), as shown in Figure 2, be that the SEM that a tungsten oxide one-dimensional nanometer point is laser-welded on the tungsten micro needlepoint provided by the invention schemes, can see from the SEM picture of tungsten oxide one-dimensional nanometer point and tungsten micro needlepoint joint portion, both have realized good fusion, and this proof adopts method of laser welding successfully to realize the assembling of tungsten oxide one-dimensional nanometer point on the tungsten micro needlepoint.
Utilize the fastness of the micro-nano structure that the micro and nano structure assembling method of employing laser weld provided by the invention obtains to analyze with SEM (SEM), as shown in Figure 3, be after the laser weld assembling between realization provided by the invention single tungsten oxide one-dimensional nanometer point and the tungsten micro needlepoint, the SEM figure of binding site fastness test, show among the figure, under the promotion of a microprobe, tungsten oxide one-dimensional nanometer point does not separate from pad with the tungsten micro needlepoint, and further promotion can only make the fracture of tungsten oxide one-dimensional nanometer point, has proved that thus micro-nano structure welding assembly pad is very firm in conjunction with getting.
What more than disclose only is preferred embodiment of the present invention, can not limit interest field of the present invention with this, and the equivalent variations according to claim of the present invention is done still belongs to the scope that the present invention is contained.

Claims (9)

1, a kind of micro and nano structure assembling method that adopts the energy beam welding, it is characterized in that: in the process of assembling, by micro-instrument assembling process is monitored, after making soldered micro-nano structure A and micro-nano structure B close mutually, utilizing Van der Waals for, electrostatic attraction or colloid to paste adsorbs micro-nano structure A and micro-nano structure B mutually, form contact, utilize energy beam to carry out welding assembly then.
2, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: welding process is carried out under protective atmosphere.
3, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-nano structure A is dispersed on the substrate, but this substrate is placed on the sample platform that stepping moves, described micro-nano structure B is fixed on the step-by-step operation platform, regulate described sample platform and described step-by-step operation platform, make micro-nano structure A and micro-nano structure B close.
4, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-instrument is fixed on described energy beam to become on the direction of miter angle.
5, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 3, it is characterized in that: the energy beam focal position is on described micro-nano structure A or on described substrate.
6. a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described energy beam is laser beam, electron beam, beam-plasma.
7, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 3 is characterized in that: apply voltage between described micro-nano material B and described substrate.
8, as claim 3 or 7 described a kind of micro and nano structure assembling methods that adopt the energy beam welding, it is characterized in that: described substrate is the conductive substrates that is fit to apply voltage.
9, a kind of micro and nano structure assembling method that adopts the energy beam welding as claimed in claim 1, it is characterized in that: described micro-nano structure A is a tungsten oxide one-dimensional nanometer point, and described micro-nano structure B is the tungsten micro needlepoint.
CN 200710026638 2007-01-30 2007-01-30 Micro and nano structure assembling method welded by energy beam Pending CN101012052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710026638 CN101012052A (en) 2007-01-30 2007-01-30 Micro and nano structure assembling method welded by energy beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710026638 CN101012052A (en) 2007-01-30 2007-01-30 Micro and nano structure assembling method welded by energy beam

Publications (1)

Publication Number Publication Date
CN101012052A true CN101012052A (en) 2007-08-08

Family

ID=38699799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200710026638 Pending CN101012052A (en) 2007-01-30 2007-01-30 Micro and nano structure assembling method welded by energy beam

Country Status (1)

Country Link
CN (1) CN101012052A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624388A (en) * 2013-11-13 2014-03-12 中国科学院合肥物质科学研究院 One-dimensional nanomaterial welding method based on electrically-induced heating effect
CN104439956A (en) * 2014-11-18 2015-03-25 清华大学 Method for connecting materials difficult to connect through ultrafast lasers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624388A (en) * 2013-11-13 2014-03-12 中国科学院合肥物质科学研究院 One-dimensional nanomaterial welding method based on electrically-induced heating effect
CN103624388B (en) * 2013-11-13 2015-09-30 中国科学院合肥物质科学研究院 A kind of welding method of the monodimension nanometer material based on electroluminescent heating effect
CN104439956A (en) * 2014-11-18 2015-03-25 清华大学 Method for connecting materials difficult to connect through ultrafast lasers

Similar Documents

Publication Publication Date Title
TWI275565B (en) Emission source having carbon nanotube, electron microscope using this emission source, and electron beam drawing device
US6858851B2 (en) Apparatus for specimen fabrication and method for specimen fabrication
JP2015518245A5 (en)
JP2000223004A (en) Device including carbon nano-tube, device including field emission structure, and its manufacture
CN103295854B (en) Micro-sharp structure of carbon nano-tube and preparation method thereof
CN107342200B (en) A kind of preparation method of rare-earth hexboride compound field emission array
JP2001325910A (en) Electron gun and its method of use
CN101012052A (en) Micro and nano structure assembling method welded by energy beam
CN101049906B (en) Method for fabricating Nano pointed cone
CN103693634A (en) Method for preparing carbon nano tube through electron beam induced deposition
CN103449359B (en) Welding method for micron/nano scale conducting materials
CN103624388B (en) A kind of welding method of the monodimension nanometer material based on electroluminescent heating effect
US8819926B2 (en) Methods and apparatuses of using metal needle arrays for specimen lift-out and circuit edit
Wang et al. Development of a thermoelectric nanowire characterization platform (TNCP) for structural and thermoelectric investigation of single nanowires
JP2009146705A (en) Electron emission element, electron source, electron beam device, and manufacturing method for electron emission element
CN113990729A (en) Quasi-macroscopic cold field emission electron gun and manufacturing method thereof
CN103288033B (en) The preparation method of the micro-sharp structure of CNT
US20140338076A1 (en) Methods and Apparatuses for Specimen Lift-Out and Circuit Edit Using Needle Arrays
WO2021130837A1 (en) Electron source, electron beam device, and method for manufacturing electron source
CN116553475B (en) Laser-based single-particle microelectrode preparation method
CN116460425B (en) Single-particle microelectrode preparation device based on laser
CN116443807B (en) Single-particle microelectrode preparation method based on electrostatic adsorption
CN111261473B (en) Method for manufacturing single one-dimensional nano-structure field emission cold cathode
CN116565160B (en) Single particle electrode
CN111333054B (en) Laser etching-based vertical carbon nanotube array transfer method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20070808