CN100592842C - Electric connection structure of circuit board and the circuit board possessing the connection structure - Google Patents
Electric connection structure of circuit board and the circuit board possessing the connection structure Download PDFInfo
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- CN100592842C CN100592842C CN200710188130A CN200710188130A CN100592842C CN 100592842 C CN100592842 C CN 100592842C CN 200710188130 A CN200710188130 A CN 200710188130A CN 200710188130 A CN200710188130 A CN 200710188130A CN 100592842 C CN100592842 C CN 100592842C
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Abstract
The present invention discloses a electronic connection structure of circuit board and a circuit board thereof, which comprises the following procedures: connecting power contact and grounding contactof electronic component to power plane and ground plane of circuit board separately; electronic connection structure comprises the first conductive structure and the second conductive structure, oneend of both conductive structure is conductive contact segment, two conductive contact segments electronically connect with power contact and ground separately, the other end of each conductive structure extends from its conductive contact segment to form a plurality of dual segments, the two dual segments of the two conductive structure are pair configuration. The pairing dual segments of the twoconductive structures deploy in the way of interleaved array to form loop with two current in opposite direction. Magnetic flux is counteracted mutually to make situation that impedance of decouplingcapacitor in electronic circuit power supply system adds along with the rise of electronic component switching frequency eases up.
Description
Technical field
The present invention relates to a kind of electrical communication structure of circuit board, particularly relate to a kind of being arranged in the circuit board, be electrically connected to the bus plane of circuit board and the metal connectivity structure of ground plane in order to the contact with the electronic component on the circuit board, this circuit board more can be the circuit board that includes embedded capacitor.
Background technology
Upward (following is example with the circuit board for printed circuit board (PCB) (Printed Circuit Board) or ic substrate (IC substrate); but being not limited to circuit board) regular meeting is provided with electronic component; the specific contact of this electronic component is to be electrically connected to power plane (Power plane in the circuit board by the metal connectivity structure in this circuit board; also claim bus plane) and ground plane (Ground plane; also claim ground plane) so that the power supply that this electronic component is accepted from circuit board operates.
Demand along with market, the running speed that is arranged at the electronic component on the circuit board has more and more fast trend, its signal switch speed is also more and more fast, and feasible power supply from circuit board often can't provide power supply stably under so high switch speed, cause the electronic component running bad; In addition, the situation that also has power supply noise between electronic component and power supply/ground plane produces, be head it off, the dealer promptly is provided with decoupling capacitance (decoupl ing capacitor) or shunt capacitance (bypass capaci tor) in circuit board near power supply/ground plane place, this uncoupling/shunt capacitance can adopt SMD electric capacity or embedded multi-layer plane capacitance (embedded multilayer planar capacitor), the supply of the electric capacity thus electric energy that design can be in good time when electric energy under the high frequency running is not enough absorbs surging (glitch) to reach by this, reduce the effect of RF (Radio Frequency) noise and stabilized power supply.
This type of technology is found in United States Patent (USP) the 5th, 161, No. 086 " Capacitor laminate for usein capacitive printed circuit boards and methods of manufacture ", please refer to Fig. 1, can see among the figure that knowing circuit board 100 surfaces has electronic component 102 (surface mounteddevice), this electronic component is that mat power lead 104 is electrically connected to bus plane and the ground plane in the circuit board with earth lead 106, and be to be connected a plane capacitance 108 (planar capacitor) 106 of power lead 104 and earth leads, using provides surface mount electronic component power-supply system bypass (bypass) function.This kind structure, though can reach its purpose, yet when running, when frequency is higher, can form equivalent series inductance (EquivalentSeries Inductance between the metal connectivity structure (being its power lead 104 and earth lead 106), ESL), after making that this type of design is higher than the point of self-oscillation of parasitic capacitance in frequency of operation, the stray inductance value of capacity plate antenna and metal connectivity structure promptly can rise, its resistance value is fast rise (this part will be done an explanation in subsequent content) also, forms the obstruction of power supply supply under the high-frequency operation.
In order to reduce the effect of equivalent series inductance, United States Patent (USP) the 6th, 678, No. 145 " Wiringconnection structure of laminated capacitor and decoupl ing capacitor; and wiring board " proposes a method, see also Fig. 2, it provides one and has the capacity plate antenna 120 (planar capacitor) of low ESL value as the decoupling capacitance on chip 122 power supply circuits, this structure is communicated with lead 124 (ground via-hole) with a plurality of ground connection and a plurality of power supply connection lead 126 (power via-hole) (also claiming feedthrough conductors) is linked embedding electric capacity 120 ground floor inherent pole and second layer inherent pole respectively, and the power supply of linking the ground floor limit be communicated with lead 126 adjacent link second layer limit power supply be communicated with lead 126, by current opposite in direction, reach and suppress the magnetic field that power supply is communicated with the generation of lead 126 electric currents, and then reach the purpose that reduces equivalent series inductance (ESL).Though this patent can suitably reduce equivalent series inductance, 128 of equivalent series inductances that indicate metal connectivity structure place in the drawings can't effectively reduce.
In the power-supply system of electronic circuit, electric capacity pattern with uncoupling effect is except having the capacity plate antenna that embeds in the circuit board, the surface adhesion components of employing form (SMD is also arranged, Surface Mount Device) mode of electric capacity, but because the embedded flat capacity ratio is welded on the power supply and the ground connection pin of the more close electronic component of surface mount (SMD) electric capacity on printed circuit board (PCB) or IC support plate surface, the stray inductance value that the stray inductance value that the power delivery path of embedded capacitance is produced when making high frequency is produced than SMD electric capacity is low, that is the uncoupling effect that embeds capacity plate antenna is better, but plate condenser is the same with general capacitor, along with the electronic component switch speed constantly speeds, after frequency of operation is higher than the natural frequency of vibration point of electric capacity, along with frequency rises and the stray inductance effect of increase, will cause script to provide the decoupling capacitance of low impedance path filter away high frequency noise to lose the effect of uncoupling gradually with the rising of frequency.
Summary of the invention
The object of the present invention is to provide a kind of electrical communication structure of circuit board and circuit board with this structure, it can reduce the resistance value of decoupling capacitance after frequency is crossed point of self-oscillation, promote the Low ESR frequency range of decoupling capacitance, with effective inhibition along with the signal switch speed increases and serious day by day Switching Noise.
Because above-mentioned problem, the present invention proposes a kind of electrical communication structure of circuit board, this electrical communication structure is at least one power supply contact of respectively electric property coupling one an electronic component and at least one ground contact power plane and the ground plane to this circuit board, this electrical communication structure comprises at least one first conductive structure and at least one second conductive structure, one end of this first conductive structure is at least one first section of connecting, this first section of connecting is to be electrically connected at this power supply contact, the other end then is a plurality of first antithesis sections that electrically connect with this first section of connecting, wherein at least two described first antithesis sections are paired mode and dispose, and the described first antithesis section is to be electrically connected at this power plane; One end of this second conductive structure is at least one second section of connecting, this second section of connecting is to be electrically connected at this ground contact, the other end of second conductive structure then is a plurality of second antithesis sections that electrically connect with this second section of connecting, wherein at least two described second antithesis sections are paired mode and dispose, the described second antithesis section is to be electrically connected at this ground plane, and described second paired antithesis section and the described first paired antithesis section are to be staggered configured in array mode.
The present invention provides a circuit board with electrical communication structure in addition, be to dispose an electronic component on this circuit board, this electronic component has at least one power supply contact and at least one ground contact, this circuit board comprises a power plane, a ground plane, at least one first conductive structure, and at least one second conductive structure, first conductive structure, one end is at least one first section of connecting, this first section of connecting is to be electrically connected at this power supply contact, the other end of first conductive structure then is a plurality of first antithesis sections that electrically connect with this first section of connecting, wherein at least two described first antithesis sections are paired mode and dispose, and the described first antithesis section is to be electrically connected at this power plane; And second conductive structure, one end is at least one second section of connecting, this second section of connecting is to be electrically connected at this ground contact, the second conductive structure other end then is a plurality of second antithesis sections that electrically connect with this second section of connecting, wherein at least two described second antithesis sections are paired mode and dispose, the described second antithesis section is to be electrically connected at this ground plane, and described second paired antithesis section and the described first paired antithesis section are to be staggered configured in array mode.
By above-mentioned electrical communication structure, it between this first antithesis section that is staggered configured in array mode and the second antithesis section loop of the adjacent and current opposite in direction of two of formation, make the magnetic flux between this two loop to cancel out each other on the contrary mutually because of direction, make the high frequency stray inductance value of multi-layer planar electric capacity descend, being applied in PCB embeds on the capacity plate antenna element, can increase its uncoupling frequency range, to provide high-speed electronic component a stable power supply system.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the electrical communication structural representation for the available circuit plate;
Fig. 2 is the electrical communication structural representation for another available circuit plate;
Fig. 3 is the first experiment contrast group structural representation for the electrical communication structure of existing tool parasitic capacitance;
Fig. 4 is the second experiment contrast group structural representation for the electrical communication structure of existing tool parasitic capacitance;
Fig. 5 is the vertical view for electrical communication structure first embodiment of the present invention;
Fig. 6 is the schematic perspective view for electrical communication structure first embodiment of the present invention;
Fig. 7 is for electrical communication structure first embodiment of the present invention is disposed in the circuit board, with the profile of Fig. 5 (7-7) position;
Fig. 8 is the vertical view for electrical communication structure second embodiment of the present invention;
Fig. 9 is the vertical view for electrical communication structure the 3rd embodiment of the present invention;
Figure 10 is the vertical view for electrical communication structure the 4th embodiment of the present invention;
Figure 11 is the profile for electrical communication structure the 5th embodiment of the present invention, and it is to represent with the profile position that is equal to Fig. 7;
Figure 12 is the profile for electrical communication structure the 6th embodiment of the present invention, and it is to represent with the profile position that is equal to Fig. 7;
Figure 13 is the profile for electrical communication structure the 7th embodiment of the present invention, and it is to represent with the profile position that is equal to Fig. 7;
Figure 14 be for electrical communication structure applications of the present invention in the structure chart of the prior art figure of Fig. 3;
Figure 15 is the impedance simulation result figure for the structure of Fig. 3 and Figure 14;
Figure 16 be for electrical communication structure applications of the present invention in the structural representation of Fig. 4;
Figure 17 is the impedance simulation result figure for the structure of Fig. 4 and Figure 16.
Wherein, Reference numeral
100,300,350,64 circuit boards
102,90 electronic components
104 power leads
106 earth leads
108,120,44,45a, 45b, 642 capacity plate antennas
122 chips
124 ground connection are communicated with lead
126,63,66 power supplys are communicated with lead
128 equivalent series inductances
91 power supply contacts
92 ground contacts
302,354 power plane (bus plane)
304,355 ground planes (ground plane)
306,640 routing layers
308,641 core layers
200,250,20,30,63 electrical communication structures
220,251 first conductive structures
210,255 second conductive structures
222,252 first sections of connecting
224a, 224b, 253a, 253b, the 253c first antithesis section
212,256 second sections of connecting
214a, 214b, 257a, 257b, the 257c second antithesis section
230 first current circuits
232 first magnetic fluxs
234 second current circuits
236 second magnetic fluxs
310a, the 310b dead ring
307a, 307b, 307c cabling plane
226a, 226b, 34 first extensions
216a, 216b, 39 second extensions
21a, 21b, 21c, 21d, 31 first conductive structures
25a, 25b, 25c, 25d, 35 second conductive structures
22a, 22b, 22c, 22d first section of connecting
23a, 24a, 23b, 24b, 23c, 24c, 23d, the 24d first antithesis section
26a, 26b, 26c, 26d second section of connecting
27a, 28a, 27b, 28b, 27c, 28c, 27d, the 28d second antithesis section
309a, 309b, 46 dielectric material layers
32a, 32b, 32c, 32d first section of connecting
33a, 34a, 33b, 34b, 33c, 34c, 33d, the 34d first antithesis section
36a, 36b, 36c, 36d second section of connecting
37a, 38a, 37b, 38b, 37c, 38c, 37d, the 38d second antithesis section
41a, 660 first antithesis sections
42b, 661 second antithesis sections
351 first routing layers
352 second routing layers
353,641 core layers
43a, 43b embed free-standing electric capacity
60,61 surveys
643 multi-layer planar electric capacity
67,68,69,70 test result curves
670,680,690,700 natural frequency of vibration points
Embodiment
Please be simultaneously with reference to Fig. 5, Fig. 6 and Fig. 7, it is for the structural representation of electrical communication structure first embodiment of the present invention, wherein Fig. 6 is the three-dimensional structure diagram for first embodiment, Fig. 5 is the top view for Fig. 6, Fig. 7 then is the structure chart of the first embodiment actual disposition in circuit board 300, its expression mode is the profile for first embodiment 7-7 position in Fig. 5, and this section mode is to adopt the section of 90 degree and hatch region is turn 90 degrees dihedral to become the mode on a plane to express.
Please mainly read it with arrange in pairs or groups Fig. 5 and Fig. 6 of Fig. 7, can see that in figure the electrical communication structure 200 of knowing first embodiment is the power plane 302 and ground plane 304 that at least one power supply contact 91 of electronic component 90 and at least one ground contact 92 are electrically connected to this circuit board 300 respectively, electrical communication structure 200 has comprised first conductive structure 220 and second conductive structure 210, one end of first conductive structure 220 is first section of connecting 222, first section of connecting 222 is to be electrically coupled to power supply contact 91, the other end of first conductive structure 220 then is two first antithesis section 224a that electrically connect (extending to form) with first section of connecting 222,224b, this 2 first antithesis section 224a, 224b is paired mode to dispose, and the first antithesis section 224a, 224b is electrically connected at power plane 302; One end of aforementioned second conductive structure 210 is second section of connecting 212, second section of connecting 212 is to be electrically coupled to ground contact 92, the other end of second conductive structure 210 then is two second antithesis section 214a that electrically connect (extending to form) with second section of connecting 212,214b, this 2 second antithesis section 214a, 214b is paired mode to dispose, and the second antithesis section 214a, 214b is electrically connected at ground plane 304, aforementioned two second paired antithesis section 214a, 214b and aforementioned 2 first paired antithesis section 224a, 224b is staggered configured in array mode, as Fig. 5 and shown in Figure 6.
Aforesaid staggered configured in array mode means two first antithesis section 224a, 224b and two second antithesis section 214a, 214b is intersection mode (seeing it from depression angle) and arranges, and the first antithesis section 224a, the 224b and the second antithesis section 214a, 214b is the array mode to arrange, be 2 * 2 array as Fig. 5, so arrange and the mode that electrically connects, make the antithesis section 224a that wins, 224b has identical polarity, with first embodiment is example, belong to electric power polarity, that is it is anodal, the second antithesis section 214a, 214b has polarity of ground, and after staggered array configuration, the intersegmental distance of identical polar antithesis is promptly far away, the intersegmental distance of dissimilar polarities antithesis is then nearer, as first antithesis section 224a distance, the second antithesis section 214a, the distance of 214b is than the first antithesis section 224a, distance between the 224b is near, because can forming two adjacent leads, it has opposite sense of current loop, make the magnetic flux between this two loop to cancel out each other on the contrary mutually, make high frequency (being after frequency exceeds the resonance frequency of electric capacity) the stray inductance value of multi-layer planar electric capacity descend, be applied in PCB and embed on the capacity plate antenna element because of direction, can increase its uncoupling frequency range, to provide high-speed electronic component a stable power supply system.
Principle about aforementioned magnetic flux can be cancelled out each other mutually on the contrary because of direction is described as follows now:
By Ampere's law (Ampere ' s circuital Law,
Wherein
Be magnetic flux, C is a closed curve, μ
0Be the magnetic capacity in the vacuum (permeability) that the current density in the surperficial S that closed curve surrounds is
) as can be known, when time-dependent current (time-variantcurrent) is by a plain conductor loop in the time of one, can produce the magnetic flux (Magnetic Flux) of a direction by the Ampere's right-handed screw rule decision, and when two wire loops have the inverse current circulating direction, this two wire loop magnetic flux that produces out of the ordinary promptly can be cancelled out each other mutually on the contrary because of direction, see also Fig. 5, the first antithesis section 224a wherein, 224b is because of being connected to power plane 302, so electric current flows out (making a call to one with circle center represents) from paper, and the second antithesis section 214a, 214b is connected to ground plane 304, so current vertical flows into paper (plaing one * expression with circle center), because first antithesis section 224a distance, the second antithesis section 214a, the distance of 214b is than the first antithesis section 224a, distance between the 224b is near, so promptly form as shown in Figure 5 first current circuit 230 and first magnetic flux 232 between the first antithesis section 224a and the second antithesis section 214b, the flow direction of first magnetic flux 232 is towards the center of electrical communication structure 200, promptly towards the direction of first section of connecting 222; In like manner, the first antithesis section 224b and the second antithesis section 214a also form second current circuit 234 and second magnetic flux 236, the flow direction of second magnetic flux 236 is also towards the center of electrical communication structure 200, thus, first magnetic flux 232 is offset because of its flow direction between the two mutually on the contrary with the magnetic flux of second magnetic flux 236.
Because the self-induction value direct ratio magnetic flux that the electric current produced (L=φ/I thereon in plain conductor loop, wherein L is the self-induction value, I is an electric current, Φ is magnetic flux magnetic flux), therefore whole magnetic flux reduces because of the design of above-mentioned antithesis section, also make that the high frequency stray inductance value that embeds electric capacity reduces in the lump, again because the high-frequency resistance of capacity substrate is proportional to its stray inductance value (Z ≒ jwL), so can increase the Low ESR frequency range of embedded decoupling capacitance, and then provide high-speed electronic component 90 1 stable power supply systems.
Aforesaid first conductive structure 220 is to have comprised first section of connecting 222 and a plurality of first antithesis section 224a, 224b, this first antithesis section 224a, 224b electrically connects with this section of connecting 222, electric connection mode herein is in the following manner for it, even with practical application example shown in Figure 7, this circuit board 300 has comprised routing layer 306, core layer 308 and ground plane 304 and power plane 302, wherein this routing layer 306 is to have comprised a plurality of cablings plane, that is two or plural cabling plane, be with three cabling plane 307a only in the present embodiment, 307b, 307c is an example, and first section of connecting 222 and the first antithesis section 224a, 224b is arranged in the routing layer, and electrical connection between the two is the cabling plane 307a that just distinctly is arranged in routing layer, 307b, 307c, and in the plain conductor mode for it.
In addition, first section of connecting 222 and the first antithesis section 224a, the generation type of 224b is that multiple mode is arranged, only lift an industry example explanation commonly used at this, please refer to Fig. 7, circuit board 300 is to form power plane 302, ground plane 304 earlier, has dielectric material (dielectric layer) between the two, offer a hole in ground plane 304 appropriate locations afterwards and be filled with dielectric material and form a dead ring 310a (anti-ring), the size of this dead ring 310a is the diameter greater than the first antithesis section 224a; Similarly, when forming power plane 302, also has a dead ring 310b in the position of the corresponding second antithesis section 214b, the size of this dead ring 310b is the diameter greater than the first antithesis section 214b, so that the first antithesis section 224a and power plane 302 form electrically connect, and the second antithesis section 214b and ground plane 304 electrically connect.
On ground plane 304, make core layer 308 more afterwards with printed circuit board (PCB) processing procedure (as Layer increasing method Build-up etc.), and in core layer 308 top cabling plane 307c, make the second extension 216b, then form the perforation of the second antithesis section 214b with bore mode, form the second antithesis section 214b (also claiming ground-via, ground via-hole) to have electricity plating or electroless-plating mode to make again, make the second extension 216b and ground plane 304 electrically connect.
Again with printed circuit board (PCB) processing procedure make dielectric material layer 309a thereafter, cabling plane 307b above dielectric material layer 309a makes the first extension 226a, form the first antithesis section 224a with aforementioned method again and (also claim power-via, power via-hole), make win extension 226a and power plane 302 electric connections.Then again with the cabling plane 307a of preceding method above dielectric material layer 309b, form first section of connecting 222 and second section of connecting 212, therefore, first section of connecting 222 electrically connects with power plane 302 by the first extension 226a, the first antithesis section 224a, and second section of connecting 212 is the mat second extension 216b, the second antithesis section 214b and ground plane 304 electric connections then.
About first section of connecting 222 and the first antithesis section 224a, extension mode between 224b can be learnt from above-mentioned processing procedure, please be simultaneously with reference to Fig. 6 and Fig. 7, the first antithesis section 224a, 224b are a plurality of first extension 226a of mat, 226b and from first connection that the section of connecting 222 is extended, this first extension 226a, 226b is the cabling plane 307b that is positioned at circuit board 300, can have other required circuit of this PCB on the 307b of this cabling plane, not expression among Fig. 7.
Hold above-mentioned, second section of connecting 212 and the second antithesis section 214a, also have the second extension 216a between the 214b, 216b, it is positioned at cabling plane 307c, with the first extension 226a, the cabling plane 307b difference at 226b place, i.e. the first extension 226a, the 226b and the second extension 216a, 216b respective bits different cabling plane 307b in routing layer 306,307c last (i.e. different layers in routing layer 306 not in); The aforementioned first extension 226a, the 226b and the second extension 216a, 216b describes it with two element numbers in this manual, but can from above-mentioned processing procedure explanation, find out, the first extension 226a, the 226b and the second extension 216a, 216b are cablings when making distinctly, but not two elements.
The circuit board of aforementioned applications electrical communication structure 200 of the present invention is to can be general printed circuit board (PCB) (Printed Circuit Board) or integrated circuit (IC) substrate (Substrate), and it is distinctly to be electrically connected to the ground connection of embedding capacity cell and ground plane and the power plane in power supply contact or printed circuit board (PCB) or the IC substrate in order to ground contact and power supply contact with the electronic component on printed circuit board (PCB) or the IC substrate.
The continuous Fig. 8 that consults, it is to implement illustration for second of electrical communication structure, present in the vertical view mode, can see among the figure that knowing this electrical communication structure 250 as to comprise first conductive structure 251 and second conductive structure 255, first conductive structure 251 has one first section of connecting 252 and three first antithesis section 253a, 253b, 253c, and second conductive structure 255 has one second section of connecting 256 and three second antithesis section 257a, 257b, 257c, two first antithesis section 253a wherein, 253b adopts paired mode to dispose, and two second antithesis section 257a, 257b also is paired mode and disposes, and the first paired antithesis section 253a, 253b and the second paired antithesis section 257a, 257b is staggered configured in array mode, so can reach the effect that aforementioned magnetic flux is cancelled out each other, aforementioned first not paired antithesis section 253c and the arrangement mode of the second antithesis section 257c are the modes shown in Figure 8 that is not limited to, and the mode that can also adopt random connection for it.
Please refer to Fig. 9, implement illustration for the 3rd of electrical communication structure of the present invention, this embodiment is the electronic component that is applied to have four power supply contacts and four grounded contact, among the figure as can be seen electrical communication structure 20 be by four first conductive structure 21a, 21b, 21c, 21d and four second conductive structure 25a, 25b, 25c, 25d constitutes, each first conductive structure 21a, 21b, 21c, 21d distinctly have one first section of connecting 22a, 22b, 22c, 22d and two first antithesis section 23a, 24a, 23b, 24b, 23c, 24c, 23d, 24d, and each second connection lead structure 25a, 25b, 25c, 25d also distinctly has one second section of connecting 26a, 26b, 26c, 26d and two second antithesis section 27a, 28a, 27b, 28b, 27c, 28c, 27d, 28d, aforementioned four first conductive structure 21a, 21b, 21c, 21d and four second conductive structure 25a, 25b, 25c there is no electric connection between the 25d, though four first conductive structure 21a, 21b, 21c, 21d are electrically connected to the printed circuit board (PCB) or (IC) power plane of support plate in order to four power supply contacts with electronic component, and four second conductive structure 25a, 25b, 25c, 25d are electrically connected to the printed circuit board (PCB) or (IC) ground plane of substrate in order to the four grounded contact with electronic component, but among this embodiment, these four first conductive structure 21a, 21b, 21c, 21d and four second conductive structure 25a, 25b, 25c is no electrical connection between the 25d, and is electrically connected to power supply contact and ground contact or printed circuit board (PCB) or interior power plane and the ground plane of IC support plate that embeds capacity cell separately respectively.
Figure 10 is the vertical view for the 4th embodiment of electrical communication structure, implements illustration for the 4th of electrical communication structure of the present invention, and this embodiment also is applied to have the electronic component of four power supply contacts and four grounded contact, this point is identical with the applied electronic component of Fig. 9, only the structure of present embodiment and the 3rd embodiment are slightly variant, among the figure as can be seen electrical communication structure 30 constituted by one first conductive structure 31 and one second conductive structure 35, first conductive structure 31 has four first section of connecting 32a, 32b, 32c, 32d and eight first antithesis section 33a, 34a, 33b, 34b, 33c, 34c, 33d, 34d, and second conductive structure 35 also has four second section of connecting 36a, 36b, 36c, 36d and eight second antithesis section 37a, 38a, 37b, 38b, 37c, 38c, 37d, 38d, this the 4th embodiment is identical with the quantity of antithesis section with the section of connecting of the 3rd embodiment, but first section of the connecting 32a of the 4th embodiment, 32b, 32c, the 32d and the first antithesis section 33a, 34a, 33b, 34b, 33c, 34c, 33d, first extension, 34 parts between the 34d are to be electrically connected, just the same strip metal cabling of Dian Xinglianjieing; Similarly, second section of the connecting 36a, 36b, 36c, the 36d and the second antithesis section 37a, 38a, 37b, 38b, 37c, 38c, 37d, second extension, 39 parts between the 38d also are electrically connected, this structure also has a plurality of electric capacity effect in parallel except having reduction impedance effect of the present invention, and then makes the whole stray inductance value of embedded capacitance reduce more, in other words, the Low ESR frequency range of embedded capacitance will promote more.
Comparison of aforementioned the 3rd, four embodiment (Fig. 9 and Figure 10) as can be known, though both all are applied to have the electronic component of four power supply contacts and four grounded contact, but the 3rd embodiment is electrically connected to power plane and ground plane with a power supply contact and ground contact in the mode of aforementioned first embodiment respectively, the 4th embodiment then is with four first section of connecting 32a, 32b, 32c with these four power supply contacts, 32d after being electrically connected with first extension 34, is connected to the first antithesis section 33a after electrically connecting again again, 34a, 33b, 34b, 33c, 34c, 33d, 34d, this four grounded contact then is with four second section of connecting 36a, 36b, 36c, after 36d electrically connects, after being electrically connected with second extension 39 again, be connected to the second antithesis section 37a again, 38a, 37b, 38b, 37c, 38c, 37d, 38d.
Moreover, please refer to Figure 11, it is to implement illustration for the 5th of electrical communication structure of the present invention, the expression mode of this figure is same as the profile position of Fig. 7, can see among the figure to know and only draw out one first antithesis section 41a and one second antithesis section 42b, simultaneously the applied circuit board 350 of the 5th embodiment is and the circuit board 300 of Fig. 7 difference to some extent as can be seen, circuit board 350 is with first routing layer, 351 carrying electronic components 90, stacking successively below first routing layer 351 have a bus plane 354 (being aforesaid power plane), core layer (Core) 353, ground plane 355 (being aforesaid ground plane), second routing layer 352, aforementioned first routing layer 351 is identical with the routing layer 306 of Fig. 7 with second routing layer 352, constitutes by a plurality of cablings plane and the dielectric material layer between described cabling plane; The electrical communication structure then is disposed at first routing layer 351, runs through core layer 353 and out of the ordinary and bus plane 354 and ground plane 355 electric connections, distinctly is electrically connected to bus plane 354 and ground plane 355 with the power supply contact 91 with electronic component 90 with ground contact 92.
Be provided with stand alone type (discrete) electric capacity 43a who embeds ((this example for SMD pattern electric capacity or chip capacity chip capacitor but be embedded in the core layer (Core) 353) in the present embodiment between the first antithesis section 41a and the second antithesis section 42b, in addition, the first antithesis section in the present embodiment and second antithesis be intersegmental also to have another free-standing electric capacity, just this stand alone type electric capacity can't be represented to see in the mode in the section of present embodiment, (Figure 11) is because the relation of section among the figure, only can show a free-standing electric capacity 43a, so that can near bus plane 354 places with noise filtering, simultaneously, this free-standing electric capacity 43a can combine with the electrical communication structure, thereby increase the uncoupling frequency range of this free-standing electric capacity 43a, and the stable power system is provided.Free-standing electric capacity 43a in the present embodiment is (it is the 6th embodiment) as shown in figure 12 also, adopts embedded flat electric capacity, also has the effect of stabilized power supply system.
See also Figure 13 again, be to be electrical communication structure the 7th embodiment of the present invention, its main structure is identical with Figure 12, present embodiment is to have used two embedded flat electric capacity, comprising the first embedded flat electric capacity 45a and the second embedded flat electric capacity 45b, and at this two capacity plate antenna 45a, the block that is inserted and put between the 45b is a dielectric material layer 46, structurally also can form the structure of another electric capacity, so if the first antithesis section 41a and the first embedded flat electric capacity 45a are electrically connected, the second antithesis section 42b and the second embedded flat electric capacity 45b electrically connect, the electric capacity of these two different capacitances and structure of the present invention can obtain higher Low ESR frequency range in first section of connecting 222 and second section of connecting, 212 two ends (being the power pin and the ground connection pin place of electronic component) after electrically connecting; Though the mode that adopts one or two capacity plate antenna in the present embodiment for it, during actual embodiment, also can adopt more than two and capacitance capacity plate antenna inequality, decides on the needs of design.
About electrical communication structure of the present invention in conjunction with decoupling capacitance after, solved after the electronic component switching frequency is higher than the natural frequency of vibration point of electric capacity, along with frequency rises and the problem of the stray inductance effect that increases, be described as follows now:
Please consult Fig. 3 and Figure 14 simultaneously, Fig. 3 is the electrical communication structure 63 (claiming the metal connectivity structure again) for available circuit plate 64, circuit board 64 is made of routing layer 640 and core layer 641, and be to have one (embedded) capacity plate antenna 642 in the core layer, the probe (Probe) of test is then surveyed in estimating 60, the position of 61 arrow indications (promptly estimating the power supply contact and the ground contact part of soldering of electronic components), the distance that this 2 probe point is surveyed is 10 mils (Mil); Compared to Fig. 3, Figure 14 is except electrical communication structure 66 adopts design of the present invention, and all the other are all identical with Fig. 3, the invariant position of probe point survey, and the distance of 661 of the first antithesis section 660 and the second antithesis sections is 10 mils (mil), with corresponding with Fig. 3.
Therefore, after the software emulation test, please refer to Figure 15, the trunnion axis of Figure 15 is the expression frequency range, from 0Hz to 1G Hz, the longitudinal axis is then represented impedance, from 0.01 ohm (Ω) to 100 ohm, the test result curve 67 that can see Fig. 3 from figure presents capacitive character in the preceding impedance of resonant frequency point 670, arrived natural frequency of vibration point 670, during about 0.15G Hz left and right sides, have minimum resistance value, crossed natural frequency of vibration point 670 after, its resistance value promptly increases along with the rising of frequency, be the described signal of background note when switching at a high speed,, and can't promptly provide stable power to give electronic component from power end or capacitance terminal because the impedance of power source path or decoupling capacitance is excessive.Otherwise, printed circuit board (PCB) with structure of the present invention please refer to Figure 14, its software emulation test result curve 68, its point of self-oscillation 680 positions move to right than Fig. 3, about about 0.25GHz, and its crossed after the point of self-oscillation the overall impedance value approximately than Fig. 3 low 2.4 ohm (Ω), in addition, when frequency equals 1G Hz, the structure of existing Fig. 3 has 3.72 ohm (Ω), and the structure of Figure 14 of the present invention only has 1.29 ohm (Ω), and it is about about 1/3 that impedance reduces, and this result proves that structure of the present invention has goodish effect to reducing the high-frequency resistance that embeds capacity cell.
Please consult Fig. 4 and Figure 16 more simultaneously, Fig. 4 is the electrical communication structure 63 (claiming the metal connectivity structure again) for available circuit plate 64, circuit board 64 is made of routing layer 640 and core layer 641, and be to have one to embed multi-layer planar electric capacity 643 in the core layer, wherein this capacity plate antenna is made up of metal polar plate and three layers of dielectric materials layer (between two neighbouring metal polar plates) that 4 areas equate, the probe (Probe) of test is then surveyed in estimating 60, the position of 61 arrow indications (promptly estimating the power supply contact and the ground contact part of soldering of electronic components), the distance that this 2 probe point is surveyed is 10 mils (Mil); Compared to Fig. 4, Figure 16 is except electrical communication structure 66 adopts design of the present invention, and all the other are all identical with Fig. 4, the invariant position of probe point survey, and the distance of 661 of the first antithesis section 660 and the second antithesis sections is 10 mils (mil), with corresponding with Fig. 4.
Therefore, after test, please refer to Figure 17, the trunnion axis of Figure 17 is the expression frequency range, from 0Hz to 1G Hz, the longitudinal axis is then represented impedance, to 4 ohm (Ω), can see that the test result curve 69 of Fig. 4 presents capacitive character in the preceding impedance of resonant frequency point 690 from 0.00 ohm (Ω) from figure, its impedance is risen along with frequency and is reduced, arrive natural frequency of vibration point 690, during about 0.09G Hz left and right sides, had minimum resistance value, be about 0.04 ohm (Ω), after having crossed natural frequency of vibration point 690, its resistance value promptly increases along with the rising of frequency, and the curve 69 among Figure 17 is as can be known as a result by software emulation, when 1G Hz frequency, its resistance value is about 3.67 ohm (Ω), and promptly the described capacitive element of background note transfers inductive element to, may cause electric capacity to lose uncoupling effect to the high-frequency circuit power-supply system.Otherwise, please refer to the test result curve 70 of Figure 17, its point of self-oscillation 700 positions move to right than Fig. 4, about about 0.19G Hz, and its overall impedance value of having crossed after the point of self-oscillation is low compared to the overall impedance value of Fig. 4, and when frequency equaled 1GHz, the overall impedance value only had about 1 ohm (Ω), compared to Fig. 4, lacked 2.67 ohm (Ω), in other words, when frequency equals 1GHz, the resistance value of Figure 17 has reduced the last 1/3 than the resistance value of Fig. 4, and effect is more obvious.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (20)
1. the electrical communication structure of a circuit board, this electrical communication structure is a power plane and a ground plane that at least one power supply contact of an electronic component and at least one ground contact is electrically connected to this circuit board respectively, it is characterized in that this electrical communication structure comprises:
At least one first conductive structure, the one end is at least one first section of connecting, this first section of connecting is to be electrically connected at this power supply contact, the other end of this first conductive structure then is a plurality of first antithesis sections that electrically connect with this first section of connecting, wherein at least two described first antithesis sections are paired mode and dispose, and the described first antithesis section is to be electrically connected at this power plane;
At least one second conductive structure, the one end is at least one second section of connecting, this second section of connecting is to be electrically connected at this ground contact, this second conductive structure other end is a plurality of second antithesis sections for electrically connecting with this second section of connecting, wherein at least two described second antithesis sections are paired mode and dispose, the described second antithesis section is to be electrically connected at this ground plane, and described second paired antithesis section and the described first paired antithesis section are to be staggered configured in array mode.
2. electrical communication structure as claimed in claim 1, it is characterized in that, wherein this electronic component is to have this power supply contact and this ground contact, this electrical communication structure then includes this first conductive structure and this second conductive structure, this first conductive structure has this first section of connecting and two these paired first antithesis sections, and this second conductive structure has this second section of connecting and two these paired second antithesis sections.
3. electrical communication structure as claimed in claim 1, it is characterized in that, wherein this electronic component is to have this power supply contact and this ground contact, this electrical communication structure then includes this first conductive structure and this second conductive structure, this first conductive structure have one this first connect Duan Yusan this first antithesis section, and this second conductive structure have one this second connect Duan Yusan this second antithesis section.
4. electrical communication structure as claimed in claim 1, it is characterized in that, wherein this electronic component is to have four these power supply contacts and four these ground contacts, this electrical communication structure then has four these first conductive structures and four these second conductive structures, each this first conductive structure has this first section of connecting and two these paired first antithesis sections, and each this second conductive structure has this second section of connecting and two these paired second antithesis sections.
5. electrical communication structure as claimed in claim 1, it is characterized in that, wherein this electronic component is to have four these power supply contacts and four these ground contacts, this electrical communication structure then has this first conductive structure and this second conductive structure, this first conductive structure has four these first sections of connecting and eight these paired first antithesis sections, and this second conductive structure has four these second sections of connecting and eight these paired second antithesis sections.
6. electrical communication structure as claimed in claim 1, it is characterized in that, the wherein said first antithesis section is a plurality of first extensions of mat and electrically connecting with this first section of connecting, and the wherein said second antithesis section is a plurality of second extensions of mat and electrically connecting with this second section of connecting.
7. electrical communication structure as claimed in claim 6 is characterized in that, wherein said first extension and described second extension are on the different cabling plane that lays respectively in the routing layer of this circuit board.
8. electrical communication structure as claimed in claim 1 is characterized in that, wherein said first antithesis section and described second antithesis are intersegmental to be electrically connected with at least one embedded capacitance respectively.
9. electrical communication structure as claimed in claim 8 is characterized in that, wherein this embedded capacitance is to be a surface mount pattern electric capacity, a chip capacity or a capacity plate antenna.
10. electrical communication structure as claimed in claim 8 is characterized in that, wherein said first antithesis section and described second antithesis are intersegmental to be electrically connected with two or two the above embedded capacitances respectively, and described embedded capacitance is to be a capacity plate antenna.
11. the circuit board with electrical communication structure is to dispose an electronic component on this circuit board, this electronic component has at least one power supply contact and at least one ground contact, it is characterized in that, this circuit board comprises:
One power plane;
One ground plane;
At least one first conductive structure, the one end is at least one first section of connecting, this first section of connecting is to be electrically connected at this power supply contact, the other end of this first conductive structure is a plurality of first antithesis sections for electrically connecting with this first section of connecting, wherein at least two described first antithesis sections are paired mode and dispose, and the described first antithesis section is to be electrically connected at this power plane;
At least one second conductive structure, the one end is at least one second section of connecting, this second section of connecting is to be electrically connected at this ground contact, the other end of this second conductive structure then is a plurality of second antithesis sections that electrically connect with this second section of connecting, wherein at least two described second antithesis sections are paired mode and dispose, the described second antithesis section is to be electrically connected at this ground plane, and described second paired antithesis section and the described first paired antithesis section are to be staggered configured in array mode.
12. circuit board as claimed in claim 11, it is characterized in that, wherein this electronic component is to have this power supply contact and this ground contact, this electrical communication structure then includes this first conductive structure and this second conductive structure, this first conductive structure has this first section of connecting and two these paired first antithesis sections, and this second conductive structure has this second section of connecting and two these paired second antithesis sections.
13. circuit board as claimed in claim 11, it is characterized in that, the wherein said first antithesis section is a plurality of first extensions of mat and electrically connecting with this first section of connecting, the wherein said second antithesis section be a plurality of second extensions of mat and with this second section of connecting electric connection.
14. circuit board as claimed in claim 13 is characterized in that, wherein said first extension and described second extension are on the different cabling plane that lays respectively in the routing layer of this circuit board.
15. circuit board as claimed in claim 11, it is characterized in that, wherein this electronic component is to have this power supply contact and this ground contact, this electrical communication structure then includes this first conductive structure and this second conductive structure, this first conductive structure have one this first connect Duan Yusan this first antithesis section, and this second conductive structure have one this second connect Duan Yusan this second antithesis section.
16. circuit board as claimed in claim 11, it is characterized in that, wherein this electronic component is to have four these power supply contacts and four these ground contacts, this electrical communication structure then has four these first conductive structures and four these second conductive structures, each this first conductive structure has this first section of connecting and two these paired first antithesis sections, and each this second conductive structure has this second section of connecting and two these paired second antithesis sections.
17. circuit board as claimed in claim 11, it is characterized in that, wherein this electronic component is to have four these power supply contacts and four these ground contacts, this electrical communication structure then has this first conductive structure and this second conductive structure, this first conductive structure has four these first sections of connecting and eight these paired first antithesis sections, and this second conductive structure has four these second sections of connecting and eight these paired second antithesis sections.
18. circuit board as claimed in claim 11 is characterized in that, wherein said first antithesis section and described second antithesis are intersegmental to be electrically connected with at least one embedded capacitance respectively.
19. circuit board as claimed in claim 18 is characterized in that, wherein this embedded capacitance is to be a surface mount electric capacity, a chip capacity or a capacity plate antenna.
20. circuit board as claimed in claim 18 is characterized in that, wherein said first antithesis section and described second antithesis are intersegmental to be electrically connected with two or two the above embedded capacitances respectively, and described embedded capacitance is to be a capacity plate antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710188130A CN100592842C (en) | 2007-11-09 | 2007-11-09 | Electric connection structure of circuit board and the circuit board possessing the connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710188130A CN100592842C (en) | 2007-11-09 | 2007-11-09 | Electric connection structure of circuit board and the circuit board possessing the connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101431859A CN101431859A (en) | 2009-05-13 |
| CN100592842C true CN100592842C (en) | 2010-02-24 |
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| CN200710188130A Active CN100592842C (en) | 2007-11-09 | 2007-11-09 | Electric connection structure of circuit board and the circuit board possessing the connection structure |
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| CN (1) | CN100592842C (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5601376B2 (en) * | 2010-12-01 | 2014-10-08 | 株式会社安川電機 | Power converter |
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| CN101431859A (en) | 2009-05-13 |
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