CN100574571C - The circuit board of tool conductive structure and method for making thereof - Google Patents
The circuit board of tool conductive structure and method for making thereof Download PDFInfo
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- CN100574571C CN100574571C CNB2007100042767A CN200710004276A CN100574571C CN 100574571 C CN100574571 C CN 100574571C CN B2007100042767 A CNB2007100042767 A CN B2007100042767A CN 200710004276 A CN200710004276 A CN 200710004276A CN 100574571 C CN100574571 C CN 100574571C
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- metal level
- circuit board
- electric connection
- conductive structure
- connection pad
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 75
- 230000003139 buffering effect Effects 0.000 claims abstract description 62
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 14
- 239000010931 gold Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 230000007774 longterm Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005289 physical deposition Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001741 organic sulfur group Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
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- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
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Abstract
The invention discloses a kind of circuit board and method for making thereof of tool conductive structure, mainly be on the electric connection pad of the line layer of this circuit board, to be pre-formed a buffering metal level, also on this buffering metal level, form conductive structure afterwards and use formation conductive structure of the present invention to connect the circuit of different aspects on this circuit board, because this buffering metal level has high ductibility, increase bond strength between conductive structure of the present invention and the electric connection pad thereby can cushion metal level, to promote the long-term electrical properties amount and the stability of circuit board by this.
Description
Technical field
The present invention relates to a kind of circuit board and method for making thereof of tool conductive structure, particularly relate to a kind of conductive via structure and method for making thereof of circuit board.
Background technology
For reaching the user demand that electronic product downsizing and function increase, the line design of circuit board or base plate for packaging is more and more intensive.Therefore fine rule road, high-density multi-layer circuit boards become developing tendency in future, wherein, are one of the key factors that influences the electric connection quality of circuit board in order to electrically connect conductive structure between the line layer in the multilayer circuit board.
Be to electrically connect between the line layer of available circuit plate, shown in Figure 1A to Fig. 1 C by conductive via (via).At first see also Figure 1A, have on the circuit board 1 of line layer 11 in one and to be formed with a dielectric layer 12, and this line layer 11 has at least one electric connection pad 110, is formed with the perforate 120 with respect to this electric connection pad 110 in this dielectric layer 12, in order to expose this electric connection pad 110.Wherein, this electric connection pad 110 can be electrically conducted by the internal layer circuit (figure do not show) of conductive structure (figure does not show) with circuit board 1.
See also Figure 1B, in these dielectric layer 12 surfaces and perforate 120 thereof, be formed with a conductive layer 13, this conductive layer 13 and electric connection pad 110 are electrically connected.
See also Fig. 1 C, form a metal level by this conductive layer 13 to electroplate thereon, and in the perforate 120 of this dielectric layer 12, form conductive via 141, and the patterned processing procedure of this metal level and become another line layer 14 makes this line layer 14 electrically connect the line layer 11 of these circuit boards 1 by this conductive via 141.
So, when the aperture of above-mentioned existing perforate 120 is contracted to less than 60 μ m, because when these dielectric layer 12 thickness and perforate 120 are bigger, can make conductive via 141 in the perforate 120 that is formed at this dielectric layer 12 at subsequent conditioning circuit plate leadless process, and because of causing perforate 120 bottoms greatly, internal stress forms layering or fracture in the reliability-test of circuit board, thereby cause line broken circuit or little opening circuit, have a strong impact on the electric connection quality and the stability of circuit board thus.
In addition,, adopt little alligatoring mode in the prior art usually, utilize the microetch technology that line layer is done roughening treatment for increasing the adhesion intensity of conductive via and electric connection pad.And in the microetch process, because of the width of the thin electric connection pad of the live width of circuit is bigger, then wayward because of the speed of chemical corrosion, when making this electric connection pad reach suitable roughness, this circuit is disconnected by erosion; Or for avoiding the time of circuit excessive etching shortening chemical etching, the etching period deficiency that then easily causes this electric connection pad, cause the roughness deficiency on this electric connection pad surface, the associativity of this conductive via and electric connection pad is reduced, thereby cause easily aforesaid opening circuit or little situation about opening circuit.
Therefore, how to provide a kind of bond strength of conductive via and electric connection pad of line layer, thereby to promote the electrical quality and the stability of circuit board, real problem for needing to be resolved hurrily at present.
Summary of the invention
In view of the defective of aforementioned prior art, main purpose of the present invention provides a kind of circuit board and method for making thereof of tool conductive structure, is avoided conductive structure bottom layering or fracture, uses the electric connection quality and the stability that promote circuit board.
Another object of the present invention provides a kind of circuit board and method for making thereof of tool conductive structure, the electric connection pad of the line layer that is increased and the conductive structure of another line layer and bond strength.
A further object of the present invention provides a kind of circuit board and method for making thereof of tool conductive structure, is promoted the electroplating quality and the reliability of conductive structure.
For reaching above-mentioned and other purpose, the invention provides a kind of method for making of circuit board of tool conductive structure, comprise a circuit board is provided that this circuit board has the line layer of at least one electric connection pad; Form a dielectric layer in this circuit board and line layer surface, and be formed with at least one perforate in this dielectric layer to expose outside this electric connection pad; Form a buffering metal level on the electric connection pad in this dielectric layer perforate; And formation one conductive structure on the buffering metal level in this perforate.
In the method for making of the circuit board of above-mentioned this tool conductive structure, also be formed with a conductive layer between this conductive structure and this buffering metal level, by this conductive layer to form this conductive structure.In the process that forms this conductive structure, also form another line layer again, and this line layer is electrically connected to the electric connection pad of the line layer of this circuit board by this conductive structure and this buffering metal level in this dielectric layer surface.
Above-mentioned buffering metal level is to be made by the material of electroplating or chemical plating (electroless plating) mode forms the tool high ductibility, for example one of them person of alloy of gold, silver, titanium, beryllium and aforementioned metal institute cohort group.Preferably, this buffering metal level forms the gold layer in the chemical plating mode.And this conductive structure is to be made by metallic copper, gold, silver, nickel or aluminium.
The present invention also provides a kind of circuit board of tool conductive structure, comprising: a circuit board, and its formation has the line layer of at least one electric connection pad; One dielectric layer, it is formed on this circuit board with line layer, and is formed with at least one perforate in this dielectric layer to expose outside this electric connection pad; The buffering metal level, it is formed at the electric connection pad surface in this dielectric layer perforate; And conductive structure, it is formed on this buffering metal level.
Also be formed with a conductive layer between above-mentioned buffering metal level and the conductive structure, and form in the process of this conductive structure and also form another line layer in this dielectric layer surface.
Above-mentioned buffering metal level is to be made by the material of electroplating or the chemical plating mode forms the tool high ductibility, for example one of them person of alloy of gold, silver, titanium, beryllium and aforementioned metal institute cohort group.Preferably, this buffering metal level forms the gold layer in the chemical plating mode.This conductive structure is to be made by metallic copper, gold, silver, nickel or aluminium.
Than prior art, the circuit board of tool conductive structure of the present invention and method for making thereof are to be pre-formed a buffering metal level on the electric connection pad of first line layer.Because the material of this buffering metal level has high bond strength, high ductibility, thereby easily combine with the conductive structure of this electric connection pad and follow-up formation, so increased the adhesion of conductive structure and electric connection pad, and also can effectively avoid conductive structure bottom layering or fracture and cause opening circuit or little situation about opening circuit of circuit, use the electric connection quality and the stability that promote circuit board.
In addition; the present invention also can protect the electric connection pad that covers under it by this buffering metal level; therefore; in the microetch process; the protection of the buffering metal level of this electric connection pad by covering its surface and can not be snapped erosion and destroy can promote the electroplating quality and the reliability of follow-up formation conductive projection thus.
Description of drawings
Figure 1A to Fig. 1 C shows the cutaway view of the circuit board of existing tool conductive structure;
Fig. 2 A to Fig. 2 D shows the cutaway view of first embodiment of the circuit board of tool conductive structure of the present invention and method for making thereof;
Fig. 2 D ' is the cutaway view of another embodiment of Fig. 2 D;
Fig. 3 A to Fig. 3 C shows the cutaway view of second embodiment of the circuit board of tool conductive structure of the present invention and method for making thereof; And
Fig. 3 C ' is the cutaway view of another embodiment of Fig. 3 C.
The component symbol explanation
1,2 circuit boards
11,14,21,25 line layers
110,210 electric connection pads
12,22 dielectric layers
120,220 perforates
13,24 conductive layers
141 conductive vias
23 buffering metal levels
251 completely plate via hole
252 conductive vias
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different instantiation, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.Accompanying drawing of the present invention is not to describe according to actual size only for simple declaration, that is unreacted the go out be correlated with actual size of formation, give earlier chat bright.
First embodiment
Describe the method for making of the circuit board of tool conductive structure of the present invention in detail below in conjunction with Fig. 2 A to Fig. 2 D.
See also Fig. 2 A, at first, provide a circuit board 2, this circuit board 2 is formed with at least one line layer 21, and this line layer 21 has at least one electric connection pad 210; Form a dielectric layer 22 in this circuit board 2 and line layer 21 surfaces, and the electric connection pad 210 with respect to this line layer 21 is formed with perforate 220 in this dielectric layer 22, thereby to expose this electric connection pad 210.Wherein, this electric connection pad 210 can be electrically conducted by the internal layer circuit (figure do not show) of conductive structure (figure does not show) with circuit board 2.
See also Fig. 2 B, then, form a buffering metal level 23 on the electric connection pad 210 in the perforate 220 of this dielectric layer 22.In present embodiment, this buffering metal level 23 utilizes chemical plating modes such as for example chemical deposition or high vacuum physical deposition to form.And the material of this buffering metal level 23 has high bond strength, high ductibility and high conductivity, and its alloy that can be gold, silver, titanium, beryllium and aforementioned metal institute cohort group is one person wherein.Preferably, this buffering metal level 23 forms the surface that the gold layer is covered in this electric connection pad 210 in the chemical gilding mode.Because the material of this buffering metal level 23 has high bond strength and high ductibility and is different from the material of this electric connection pad 210; so the two can strong combination, also can cushion metal level 23 simultaneously and when carrying out microetch, protect the electric connection pad 210 that covers under it by this.
See also Fig. 2 C, on these dielectric layer 22 surfaces and this buffering metal level 23, form a conductive layer 24 then, and this conductive layer 24 can be made of metal, alloy or precipitation number layer metal level, as be selected from wherein one of group that copper, tin, nickel, chromium, titanium, copper-evanohm or tin-lead alloy etc. are constituted, for example maybe can use conducting polymer composites such as polyacetylene, polyaniline or organic sulfur polymer as this conductive layer 24.
See also Fig. 2 D and Fig. 2 D ', afterwards by the current conduction path of this conductive layer 24 as electroplating process, completely plate the conductive structure of via hole 251 (shown in Fig. 2 D) or conductive via 252 (shown in Fig. 2 D ') in this perforate 220, to form, and this conductive structure and buffering metal level 23 are electrically connected; And when being formed at this conductive structure, form a metal level in these dielectric layer 22 surfaces, and the patterned processing procedure of this metal level to be becoming another line layer 25, and this line layer 25 is electrically connected to the electric connection pad 210 of aforesaid line layer 21 by this conductive structure and this buffering metal level 23.Wherein this patterning process is ripe and existing technology, so no longer give unnecessary details for literary composition.
By aforesaid method for making, can form the circuit board of tool conductive structure of the present invention, shown in Fig. 2 D and Fig. 2 D ', comprise a circuit board 2, this circuit board 2 forms the line layer 21 with at least one electric connection pad 210; One dielectric layer 22, it is formed at this 2 surfaces of circuit board with line layer 21, and is formed with at least one perforate 220 in this dielectric layer 22 to expose outside this electric connection pad 210; Buffering metal level 23, it is formed at electric connection pad 210 surfaces in these dielectric layer 22 perforates 220; And a conductive structure, it is formed on this buffering metal level 23.In addition, comprise that also one is formed at the conductive layer 24 between this buffering metal level 23 and the conductive structure.Wherein, this buffering metal level is to be made by the material that the chemical plating mode forms the tool high ductibility, and preferably, this buffering metal level forms a gold medal (Au) layer in the chemical plating mode.
Second embodiment
See also Fig. 3 A figure to Fig. 3 C, be another embodiment of the method for making of the circuit board of tool conductive structure of the present invention.In the perforate of dielectric layer, form conductive layer earlier with different being in of last embodiment, form buffering metal level and conductive structure in this conductive layer surface more afterwards.
See also Fig. 3 A, be formed with at least one line layer 21, and this line layer 21 has at least one electric connection pad 210 in this circuit board 2; Form a dielectric layer 22 in this circuit board 2 and line layer 21 surfaces, and the electric connection pad 210 with respect to this line layer 21 is formed with perforate 220 in this dielectric layer 22, thereby to expose this electric connection pad 210.In these dielectric layer 22 surfaces and perforate 220 thereof, form a conductive layer 24 then, this conductive layer 24 and electric connection pad 210 are electrically connected.
See also Fig. 3 B, then, form a resistance layer 26 in the surface of this dielectric layer 22, and form perforate 260 in this resistance layer 26 with perforate 220 with respect to this dielectric layer 22, the aperture size of this resistance layer perforate 260 is greater than this dielectric layer perforate 220 again, thereby to expose the dielectric layer 22 lip-deep conductive layers 24 in this resistance layer perforate 260; Electric connection pad 210 in this dielectric layer perforate 220 and the conductive layer 24 in the resistance layer perforate 260 form a buffering metal level 23 with chemical plating mode such as chemical deposition or high vacuum physical deposition or plating mode afterwards, make that this buffering metal level 23 is formed on the electric connection pad 210 in the dielectric layer perforate 260, the hole wall and dielectric layer 26 upper surface adjacent openings 220 peripheries of dielectric layer perforate 220.
See also Fig. 3 C and Fig. 3 C ', afterwards by the current conduction path of this conductive layer 24 as electroplating process, completely plate the conductive structure of via hole 251 (shown in Fig. 3 C) or conductive via 252 (shown in Fig. 3 C ') with the 23 surface formation of the buffering metal level in the perforate 220 of this dielectric layer 22, and this conductive structure and buffering metal level 23 are electrically connected; And when being formed at this conductive structure, form a metal level in these dielectric layer 22 surfaces, and the patterned processing procedure of this metal level to be becoming another line layer 25, and this line layer 25 is electrically connected to the electric connection pad 210 of aforesaid line layer 21 by this conductive structure and this buffering metal level 23.Wherein this patterning process is ripe and existing technology, so no longer give unnecessary details for literary composition.
By aforesaid method for making, can form the circuit board of tool conductive structure of the present invention, shown in Fig. 3 C and Fig. 3 C ', it comprises a circuit board 2, this circuit board 2 forms the line layer 21 with at least one electric connection pad 210; One dielectric layer 22, it is formed at this 2 surfaces of circuit board with line layer 21, and is formed with at least one perforate 220 in this dielectric layer 22 to expose outside this electric connection pad 210; Buffering metal level 23, it is formed at electric connection pad 210 surfaces in these dielectric layer 22 perforates 220, the hole wall and the dielectric layer upper surface adjacent openings periphery of dielectric layer perforate; And one for completely plating the conductive structure of via hole 251 or conductive via 252, and it is formed on this buffering metal level 23.In addition, comprise that also one is formed at the conductive layer 24 between this electric connection pad 210 and the buffering metal level 23.
In sum, the present invention mainly is in being pre-formed a buffering metal level on the electric connection pad of putting conductive structure in order to connect.Because the material of this buffering metal level has high bond strength, high ductibility, thereby easily combine with the conductive structure of this electric connection pad and follow-up formation, thereby by this buffering metal level to increase the bond strength of this conductive structure and electric connection pad, and also can effectively avoid conductive structure bottom layering or fracture and opening circuit or little opening circuit of causing, so can promote the electric connection quality and the stability of circuit board.In addition; because this buffering metal level is covered in the electric connection pad surface, therefore, in the microetch process; the protection of the buffering metal level of this electric connection pad by covering its surface and can not destroying by over etching, and can promote the electroplating quality and the reliability of follow-up formation conductive structure.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention should be a foundation with claims of the present invention.
Claims (14)
1. the method for making of the circuit board of a tool conductive structure comprises:
One circuit board is provided, and this circuit board has the line layer of at least one electric connection pad;
Form a dielectric layer in this circuit board and line layer surface, and be formed with at least one perforate in this dielectric layer to expose outside this electric connection pad;
Form a buffering metal level on the electric connection pad in this dielectric layer perforate; And
Form a conductive structure on the buffering metal level in this perforate.
2. method for making according to claim 1 also is included in and forms a conductive layer between this buffering metal level and this conductive structure.
3. method for making according to claim 2, wherein, this buffering metal level is to be formed by the chemical plating mode.
4. method for making according to claim 1 also is included between this electric connection pad and the buffering metal level and forms a conductive layer.
5. method for making according to claim 4, wherein, this buffering metal level is wherein one to be formed by chemical plating and plating mode.
6. method for making according to claim 5, wherein, this buffering metal level also is formed at the hole wall and the dielectric layer upper surface adjacent openings periphery of dielectric layer perforate.
7. method for making according to claim 1, wherein, this buffering metal level is the gold layer.
8. the circuit board of a tool conductive structure comprises:
One circuit board, its formation has the line layer of at least one electric connection pad;
One dielectric layer, it is formed at this circuit board surface with line layer, and is formed with at least one perforate in this dielectric layer to expose outside this electric connection pad;
One buffering metal level, it is formed at the electric connection pad surface in this dielectric layer perforate; And
One conductive structure, it is formed on this buffering metal level.
9. circuit board according to claim 8 wherein, also has a conductive layer between this buffering metal level and this conductive structure.
10. circuit board according to claim 9, wherein, this buffering metal level is to be formed by the chemical plating mode.
11. circuit board according to claim 8 wherein, also has a conductive layer between this electric connection pad and the buffering metal level.
12. circuit board according to claim 11, wherein, this buffering metal level is wherein one to be formed by chemical plating and plating mode.
13. circuit board according to claim 12, wherein, this buffering metal level also is formed at the hole wall and the dielectric layer upper surface adjacent openings periphery of dielectric layer perforate.
14. circuit board according to claim 8, wherein, this buffering metal level is the gold layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100042767A CN100574571C (en) | 2007-01-19 | 2007-01-19 | The circuit board of tool conductive structure and method for making thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100042767A CN100574571C (en) | 2007-01-19 | 2007-01-19 | The circuit board of tool conductive structure and method for making thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101227803A CN101227803A (en) | 2008-07-23 |
| CN100574571C true CN100574571C (en) | 2009-12-23 |
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| CN102858081B (en) * | 2012-06-29 | 2015-07-01 | 广州杰赛科技股份有限公司 | PCB (Printed Circuit Board) capable of preventing metalized blind groove bottom plating layer from being separated from substrate and manufacturing method thereof |
| CN112020239B (en) * | 2019-05-29 | 2021-07-27 | 北京梦之墨科技有限公司 | Electronic circuit and electronic circuit manufacturing method |
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Granted publication date: 20091223 |