CN100573155C - 超小型加速度计 - Google Patents
超小型加速度计 Download PDFInfo
- Publication number
- CN100573155C CN100573155C CNB2005100260334A CN200510026033A CN100573155C CN 100573155 C CN100573155 C CN 100573155C CN B2005100260334 A CNB2005100260334 A CN B2005100260334A CN 200510026033 A CN200510026033 A CN 200510026033A CN 100573155 C CN100573155 C CN 100573155C
- Authority
- CN
- China
- Prior art keywords
- thermoelectric pile
- accelerometer
- signal
- cavity
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100260334A CN100573155C (zh) | 2005-05-20 | 2005-05-20 | 超小型加速度计 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100260334A CN100573155C (zh) | 2005-05-20 | 2005-05-20 | 超小型加速度计 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1866031A CN1866031A (zh) | 2006-11-22 |
CN100573155C true CN100573155C (zh) | 2009-12-23 |
Family
ID=37425105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100260334A Active CN100573155C (zh) | 2005-05-20 | 2005-05-20 | 超小型加速度计 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100573155C (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI375146B (en) | 2009-04-08 | 2012-10-21 | Wistron Corp | Electronic device |
CN101866203B (zh) * | 2009-04-14 | 2012-06-27 | 纬创资通股份有限公司 | 电子装置 |
CN101551403B (zh) * | 2009-05-22 | 2012-09-05 | 中国科学院上海微系统与信息技术研究所 | 一种测试加速度,压力和温度的集成硅芯片及制作方法 |
TWI452297B (zh) | 2011-09-26 | 2014-09-11 | Richwave Technology Corp | 電容式加速度計 |
CN103224216B (zh) * | 2012-01-31 | 2016-12-21 | 台湾积体电路制造股份有限公司 | 具有衬底通孔的微电子机械系统(mems)结构及其形成方法 |
CN103364584A (zh) * | 2012-03-31 | 2013-10-23 | 北京大学 | 一种含有硅通孔压阻式加速度传感器及其制造方法 |
JP5904910B2 (ja) * | 2012-08-31 | 2016-04-20 | ルネサスエレクトロニクス株式会社 | 加速度検出素子 |
CN103435000B (zh) * | 2013-09-11 | 2016-04-20 | 上海丽恒光微电子科技有限公司 | 集成mems器件的传感器的晶圆级封装方法 |
CN111060715B (zh) * | 2019-12-24 | 2022-02-08 | 中国航空工业集团公司北京长城航空测控技术研究所 | 一种基于热电堆的加速度传感器 |
-
2005
- 2005-05-20 CN CNB2005100260334A patent/CN100573155C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1866031A (zh) | 2006-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100573155C (zh) | 超小型加速度计 | |
US20060179940A1 (en) | Ultra-small Profile, Low Cost Chip Scale Accelerometers of Two and Three Axes Based on Wafer Level Packaging | |
Billat et al. | Micromachined inclinometer with high sensitivity and very good stability | |
CN102768290B (zh) | 一种mems加速度计及制造方法 | |
Chaehoi et al. | Experimental and finite-element study of convective accelerometer on CMOS | |
Chae et al. | Fabrication and characterization of a wafer-level MEMS vacuum package with vertical feedthroughs | |
US7069785B2 (en) | Thermal bubble type micro inertial sensor | |
CN101187673B (zh) | 单芯片三轴加速度传感器 | |
US6662659B2 (en) | Acceleration sensor | |
Dao et al. | Development of a dual-axis thermal convective gas gyroscope | |
CN108254106A (zh) | 一种硅硅玻璃硅四层结构谐振式mems压力传感器制备方法 | |
CN105911309A (zh) | 单锚点支撑式双轴硅微谐振式加速度计 | |
Zhao et al. | A bossed diaphragm piezoresistive pressure sensor with a peninsula–island structure for the ultra-low-pressure range with high sensitivity | |
Zhu et al. | Development of a self-packaged 2D MEMS thermal wind sensor for low power applications | |
CN107512698A (zh) | 一种中心支撑准悬浮式mems芯片封装结构的制作方法 | |
CN107512700A (zh) | 一种中心支撑式mems芯片封装结构的制作方法 | |
CN207265035U (zh) | 一种中心支撑准悬浮式mems芯片封装结构 | |
CN107445137A (zh) | 一种倒置装配的mems芯片封装结构制作方法 | |
Chen et al. | A novel two-axis CMOS accelerometer based on thermal convection | |
Goustouridis et al. | A silicon thermal accelerometer without solid proof mass using porous silicon thermal isolation | |
Dao et al. | A 2-DOF convective micro accelerometer with a low thermal stress sensing element | |
US20210088548A1 (en) | Micromechanical inertial sensor | |
CN206281871U (zh) | 一种双差分的全硅结构的微加速度计 | |
Li et al. | Study on linearization of silicon capacitive pressure sensors | |
Mailly et al. | CMOS implementation of a 3-axis thermal convective accelerometer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WUHAN FINE MEMS INC. Free format text: FORMER OWNER: FEIEN MICROELECTRONICS CO., LTD., SHANGHAI Effective date: 20130225 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 430074 WUHAN, HUBEI PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130225 Address after: 14 building, 7 building, Optics Valley Pioneer Street, East Lake Development Zone, Wuhan, Hubei, 430074 Patentee after: Wuhan FineMEMS Inc. Address before: 201203. B, Room 309, block 518, blue wave road, Zhangjiang, Shanghai Patentee before: Feien Microelectronics Co., Ltd., Shanghai |