CN100555596C - Semiconductor wafer carrier container - Google Patents
Semiconductor wafer carrier container Download PDFInfo
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- CN100555596C CN100555596C CNB2004800369379A CN200480036937A CN100555596C CN 100555596 C CN100555596 C CN 100555596C CN B2004800369379 A CNB2004800369379 A CN B2004800369379A CN 200480036937 A CN200480036937 A CN 200480036937A CN 100555596 C CN100555596 C CN 100555596C
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- semiconductor wafer
- resin combination
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- vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Abstract
Be by the vessel (1) of mounting semiconductor wafer carrier and cover the semiconductor wafer carrier container that the lid (2) of this vessel (1) constitutes, formed by resin combination (A) molding that comprises thermoplastic resin (a1) and carbon fiber (a2) with above-mentioned vessel (1), the surface resistivity of this vessel (1) is 10
2～10
12Ω/, above-mentioned lid is by comprising thermoplastic resin (b1) and being that the resin combination (B) of the antistatic agent (b2) of organic compound carries out molding and forms, and the surface resistivity of this lid 2 is 10
3～10
13Ω/, and this lid (2) has the transparent semiconductor wafer carrier container of feature that is, according to this semiconductor wafer carrier container, can provide have excellent antistatic properties, contamination preventing is good, marresistance is good and internal visual is also good semiconductor wafer carrier container.
Description
Technical field
The invention relates to by the vessel of mounting semiconductor wafer carrier and cover the semiconductor wafer carrier container that the lid of this vessel constitutes.The semiconductor wafer carrier container that particularly has the transparency about good, the above-mentioned lid of said vesse body marresistance.
Background technology
In order to prevent the wafer contamination in the semiconductor fabrication, in the clean room, operate.At this moment, for efficient is operated well, use can be accommodated the chip carrier of several pieces of silicon chips simultaneously.This chip carrier is installed in the chip processing device, utilizes manipulator to take out wafer from chip processing device and supplies with processing.In addition, often processing such as directly clean with silicon chip the state on the chip carrier of being housed in.Therefore, the wafer that becomes mostly of chip carrier directly exposes such formation to the atmosphere in the clean room.Because this, in the keeping in the clean room or in carrying, the particle contamination for the wafer that prevents to be accommodated by chip carrier uses chip carrier all is housed in its inner semiconductor wafer carrier container.
As such chip carrier or accommodate the resin that the material of the container of chip carrier is used, various according to its objective is.For example use various resins such as polypropylene (PP), Merlon (PC), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polybutylene terephthalate (PBT) (PBT), polyether-ether-ketone (PEEK), polytetrafluoroethylene (PTFE) flexibly according to purposes.At this moment, in order to prevent adhering to of particulate effectively, preferred container has antistatic behaviour.As top listed resin all is insulator, thereby in order to give antistatic behaviour, needs to cooperate antistatic agent.As antistatic agent, cooperate the method for the carbon granules of conductivity or carbon fiber etc., or to cooperate the method for the antistatic agent that is made of the organic compound with polar group be known.
For example show in the 2002-531660 communique (patent documentation 1) record,, constitute by the resin combination of the carbon fiber that contains specific specific insulation as the semiconductor chip container of conductivity the spy.In the embodiment of this communique, also putting down in writing, in Merlon, cooperating the example of the chip carrier of carbon fiber and carbon granules.But when using carbon fiber to give antistatic behaviour, formed products becomes the forfeiture transparency, can not use in the purposes that requires inner visuality.
In addition, opening the semiconductor wafer of putting down in writing given shape in the flat 9-92714 communique (patent documentation 2) the spy accommodates and uses antistatic container.Putting down in writing ABS in the embodiment of this communique is that permanent anti-static resin, HIPS are that permanent anti-static resin, PP are carbon black resin etc., uses the example of the semiconductor wafer accepting container of various antistatic behaviour resins.Here Ji Zai container has good antistatic behaviour, and depends on its kind, and is also good in the transparency.For example the ABS of record is that the permanent anti-static resin is also good on the transparency among the embodiment 3.When using so transparent good resin, the situation of internal tank can be confirmed from the outside.
Open in the clear 62-119256 communique (patent documentation 3) the spy and to put down in writing, in the presence of rubber polymer, by (methyl) acrylate monomer with can carry out cooperating in the polymer of glycerol polymerization the thermoplastic resin composition of polyether ester amides with the copolymer mixture that other vinyl monomers of this monomer copolymerization constitute.It is good to put down in writing this resin combination and be permanent antistatic, resistance to impact and the transparency, can prevent from for example to use in the IC carrying case in the purposes of the fault that caused by static in hope.
The balance of the flatness on the dimensional accuracy the when resin of ABS resin or ABS-like resin is molding, moulded work surface, rigidity, resistance to impact etc. is good, and the lower-cost resins for universal use of resin.In addition, as mentioned above, it also is possible giving the permanent antistatic and the transparency.Therefore, give the ABS resin of antistatic behaviour,, can be described as suitable raw-material a kind of as the raw material of the container that is used to accommodate semiconductor wafer.But, in recent years, follow the miniaturization of semiconductor device, it is more strict that the managerial skills of the particulate in the clean room become, and present situation is, and the such a desired performance of semiconductor wafer carrier container also uprises continuing.Because this when the semiconductor wafer carrier container of chip carrier is accommodated in the ABS resin composition manufacturing of using antistatic behaviour, has problem to become obvious on marresistance.
Accommodate the chip carrier of a plurality of semiconductor wafers, follow the increase of wafer diameter in recent years, its weight is becoming big.In addition, be the quite high resin of hardness as the polyether-ether-ketone (PEEK) of the representational resin that in chip carrier, uses or polybutylene terephthalate (PBT) (PBT) etc.In such occasion, the inner surface of the wafer carrier container of mounting chip carrier has scar easily owing to the friction of the discrepancy of following carrier.In addition, maximized and carrier container itself that total weight increases is also many in change with the situation of Robot actions, but in this occasion, often the rub bottom surface of the carrier container of accommodating chip carrier of metallic member, scar be problem.Especially, transparent and resin combination with conductivity, hardness often reduces owing to cooperate the conductivity imparting agent, and the marresistance deficiency is a problem.
Patent documentation 1: special table 2002-531660 communique
Patent documentation 2: the spy opens flat 9-92714 communique
Patent documentation 3: the spy opens clear 62-119256 communique
Summary of the invention
The present invention finishes in order to address the above problem, be have excellent antistatic properties to provide, contamination preventing is good, marresistance the is good and inner also good semiconductor wafer carrier container of visibility is purpose.
Above-mentioned problem solves by semiconductor wafer carrier container is provided, this semiconductor wafer carrier container is by the vessel of mounting semiconductor wafer carrier and cover the semiconductor wafer carrier container that the lid of this vessel is formed, the said vesse body carries out molding by the resin combination (A) that comprises thermoplastic resin (a1) and carbon fiber (a2) and forms, and the surface resistivity of this vessel is 10
2～10
12Ω/, above-mentioned lid forms by comprising thermoplastic resin (b1) and carrying out molding as the resin combination (B) of the antistatic agent (b2) of organic compound, and the surface resistivity of this lid is 10
3～10
13Ω/, and this lid has the transparency.
Resin combination (A) contains the thermoplastic resin (a1) of 60～99 weight % and the carbon fiber (a2) of 1～40 weight % is suitable.Thermoplastic resin (a1) is that amorphism thermoplastic resin, particularly carbonic ester are suitable.The Rockwell hardness of resin combination (A) is that 110～140 (unit: the R scale), the modulus of elasticity in static bending of resin combination (A) is that 4000～21000MPa is suitable.
Resin combination (B) contains the thermoplastic resin (b1) of 70～99 weight % and the antistatic agent (b2) of 1～30 weight % is suitable.Thermoplastic resin (b1) is that a kind of selecting from phenylethylene resin series, poly-(methyl) acrylate, polyacrylonitrile, Merlon is suitable, and antistatic agent (b2) is that macromolecular compound is suitable.Resin combination (B) is that to be less than or equal to 30% resin combination be suitable to the haze when forming the injection-molded object of thickness 3mm.In addition, the Rockwell hardness of resin combination (B) is 80～140 (units: be suitable the R scale).
Above-mentioned lid is resin combination (A) and the compound moulded work of resin combination (B), and it is suitable execution mode that the part that contacts with the said vesse body constitutes with resin combination (A).At this moment, preferably resin combination (A) and resin combination (B) are composited by embedding mould or double-colored molding.In addition, fixing elastic component and constituting on any of said vesse body or above-mentioned lid, with container when airtight, the above-mentioned elastic component of configuration between said vesse body and above-mentioned lid, it is suitable execution mode that the said vesse body does not contact mutually with above-mentioned lid.At this moment, the height of above-mentioned elastic component preferably is less than or equal to 1mm.
The periphery of above-mentioned lid cover the said vesse body the peristome upper limb the outside and airtight semiconductor wafer carrier container is suitable execution mode.At this moment, the said vesse body, has the inclined-plane from the outside skew back of this peristome upper limb below, the above-mentioned inner face that covers at its periphery has the inclined-plane, two inclined-planes are the opposed formations in mutual almost parallel ground, and the gap between two inclined-planes is that to be less than or equal to the opposed width of 1mm and two inclined-planes be that 5～50mm is more suitably.
The invention effect
Semiconductor wafer carrier container of the present invention has excellent antistatic properties, contamination preventing is good, marresistance is good and internal visual is also good, is adapted at requiring using in the semiconductor making method of high-cleanness, high.
Description of drawings
Fig. 1 is the plane graph of vessel.
Fig. 2 is the front elevation of vessel.
Fig. 3 is the left surface figure of vessel.
Fig. 4 is the plane graph of lid.
Fig. 5 is the front elevation of lid.
Fig. 6 is the right hand view of lid.
Fig. 7 is the A-A sectional view of the state of expression vessel and lid composition.
Symbol description
1 vessel
2 lids
3 peristome upper limbs
4 inclined-planes
5 inclined-planes
6 planar sections
Embodiment
Semiconductor wafer carrier container of the present invention is made up of the vessel of mounting semiconductor wafer carrier and the lid of this vessel of covering.
The said vesse body is to carry out the vessel that molding forms by the resin combination (A) that comprises thermoplastic resin (a1) and carbon fiber (a2).Be in order to prevent particulate to the adhering to of vessel, to cooperate carbon fiber (a2) to reduce the vessel of the surface resistivity of vessel.In addition, owing to cooperate carbon fiber (a2), the hardness of resin combination (A) rises, and the frictional resistance on surface reduces, and therefore is that the marresistance of vessel improves, the vessel that the dirt bits that can prevent to be caused by friction take place.Have, owing to cooperate carbon fiber (a2), the modulus of elasticity of resin combination (A) rises, and is making under large-sized moulded work situation again, and the dimensional stability when accommodating dead weight cargo improves.
Use is during as the carbon black of other representational electroconductive stuffing, and the rising of hardness is few, and the reduction of the frictional resistance on surface is also few, and the improvement of marresistance is inadequate, because contain particulate, is easy to generate the dirt bits so follow the generation of scar.In addition, when using the resin combination do not contain such filler, only to be made of thermoplastic resin (a1), hardness reduces, and the frictional resistance on surface is big, so marresistance is insufficient.And when cooperating the antistatic agent that is made of organic compound in thermoplastic resin (a1), its hardness more reduces usually, thereby the problem of marresistance is serious.
Thermoplastic resin (a1) has no particular limits, can be according to purpose from Merlon; Polyester such as polybutylene terephthalate (PBT) (PBT), PETG; Polyamide; Polyolefin such as polypropylene (PP) or cyclic olefin polymer; Polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitritrile-styrene resin (AS resin) or copolymer of methyl methacrylatestyrene styrenics such as (MS resins); Poly-(methyl) acrylate; Polyacrylonitrile (PAN); Polyether-ether-ketone (PEEK); Polyphenylene sulfide (PPS); Polyacetals; Select in the resins such as polysulfones.
Among these,, preferably use the amorphism thermoplastic resin as thermoplastic resin (a1).Amorphous resin is compared with crystalline resin, and the shrinkage during molding is little, therefore can access the good moulded work of dimensional accuracy.When the resin combination that will contain carbon fiber (a2) was injection-molded, the carbon fiber in the moulded work (a2) was orientated easily.At this moment, because use crystalline resin, so because the orientation of carbon fiber (a2) orientation of crystallization also takes place easily, so warpage or contraction etc. take place easily, dimensional accuracy reduces.Reduce in dimensional accuracy, under the situation that the space between vessel and the lid becomes wide, the sealing property of case reduces, and it is big that the danger that particulate is invaded becomes.On the contrary, under the space between vessel and the lid became narrow situation, friction took place and is easy to generate scar in vessel and lid when opening and closing.The good amorphism thermoplastic resin of dimensional accuracy when therefore preferably using molding.In addition, in general, by the moulded work that non-crystalline resin constitutes, compare with the moulded work that crystalline resin constitutes, the surface is level and smooth, and therefore the frictional resistance on moulded work surface becomes big sometimes, has because friction surface has the tendency of scar easily.Resin combination of the present invention (A) can lower the frictional resistance on moulded work surface by cooperating carbon fiber (a2), therefore as thermoplastic resin (a1) even use the amorphism thermoplastic resin, marresistance is also good.At this, so-called amorphous resin for example comprises that as ABS resin, even become the alloy that is made of the various kinds of resin composition, but its main component is still non-crystalline resin.
Preferably 60～200 ℃ of glass transition temperatures when thermoplastic resin (a1) is the amorphism thermoplastic resin.During less than 60 ℃, thermal endurance is not enough, is more preferably to be greater than or equal to 100 ℃ at glass transition temperature.On the other hand, when glass transition temperature surpassed 200 ℃, it is difficult that melt molding becomes easily, is more preferably and is less than or equal to 160 ℃.Glass transition temperature is measured by the position of the flex point of DSC (differential calorimetric analysis) test.For example the glass transition temperature of the Merlon that uses in an embodiment of the present invention all is 140～150 ℃ usually.
The carbon fiber (a2) that cooperates in thermoplastic resin (a1) is restriction especially, can use that polyacrylonitrile (PAN) is, various carbon fibers such as pitch system, cellulose-based, Lignins.If consider the cooperation easness of melt kneading, then preferably cooperate short fiber.
Resin combination (A) preferably contains the resin combination of 60～99 weight % thermoplastic resins (a1) and 1～40 weight % carbon fiber (a2).During less than 1 weight %, it is insufficient that antistatic behaviour becomes easily at the content of carbon fiber (a2).In addition, it is big that the hardness step-down of moulded work and frictional resistance become, thereby marresistance becomes insufficient easily, and modulus of elasticity reduces and the form retentivity becomes insufficient easily.The content of carbon fiber (a2) more suitably is more than or equal to 2 weight %, most suitably is more than or equal to 5 weight %.At this moment, the content of thermoplastic resin (a1) is respectively to be less than or equal to 98 weight %, to be less than or equal to 95 weight %.On the other hand, when the content of carbon fiber (a2) surpassed 40 weight %, in the melt molding reduction, the mechanics rerum natura of vessel also reduced easily.The content of carbon fiber (a2) more suitably is to be less than or equal to 30 weight %, most suitably is to be less than or equal to 20 weight %.At this moment, the content of thermoplastic resin (a1) is respectively more than or equal to 70 weight %, more than or equal to 80 weight %.Even and also have no relations with carbon fiber (a2) filler in addition, if but consider it is to avoid the purposes polluted, except micro constitutent, preferably in fact only by the resin combination of thermoplastic resin (a1) and carbon fiber (a2) formation.
The method of mixed thermoplastic resin (a1) and carbon fiber (a2) is restriction especially not, usually both melt kneading is mixed.It also is possible mixing simultaneously when melt molding, but the pellet supply melt molding of the common resin combination (A) that preferably will carry out the pre-fusion kneading and obtain.
In addition, the Rockwell hardness of resin combination (A) 110～140 (units: the R scale) preferably.Owing to have high rigidity, just can access the good vessel of marresistance like this.More suitably being more than or equal to 115, most suitably is more than or equal to 120.On the other hand, when hardness is too high, the melt molding reduction, or the situation that mechanical strength reduces is many.More suitably being to be less than or equal to 135, most suitably is to be less than or equal to 130.Here, the Rockwell hardness among the present invention is in 23 ℃ of values according to ASTM D-785 standard test (R scale).
The modulus of elasticity in static bending of resin combination (A) is 4000～21000MPa preferably.Owing to have the high modulus of elasticity in static bending, the form retentivity of vessel becomes good like this.Especially, in recent years, follow the big footpathization of wafer diameter, the weight of accommodating the chip carrier of several semiconductor wafers also increases, and the level that requires of form retentivity of therefore accommodating the vessel of chip carrier is uprising.In the modulus of elasticity in static bending during less than 4000MPa, the form retentivity of the vessel inadequate worry that becomes is arranged, more suitably be more than or equal to 5000MPa, most suitably be more than or equal to 5500MPa.On the other hand, when the modulus of elasticity in static bending surpassed 21000MPa, the worry that has vessel to become fragile more suitably was to be less than or equal to 15000MPa, most suitably is to be less than or equal to 10000MPa.Here, the modulus of elasticity in static bending among the present invention is 23 ℃ of values according to ASTM D-790 standard test.The above-mentioned Rockwell hardness or the modulus of elasticity in static bending are to obtain by the sample of mensuration by the melt molding product formation of resin combination (A).
Resin combination (A) melt molding is made vessel, and in the present invention, the surface resistivity of this vessel is 10
2～10
12Ω/ is important.In surface resistivity less than 10
12During Ω/, as the surface resistivity for antistatic requirement, becoming has superfluous conductivity, and in the case, the carbon fiber use level becomes too much, and the characteristic of mechanics is also insufficient.Surface resistivity is suitably more than or equal to 10
3Ω/.On the other hand, surpass 10 in surface resistivity
12During Ω/, it is insufficient that antistatic behaviour becomes, and can not prevent fully adhering to of particulate.Surface resistivity suitably 10
11Ω/ or following.Here, the surface resistivity among the present invention is the value of measuring at 23 ℃, humidity 50%RH.
The lid that constitutes semiconductor wafer carrier container of the present invention is that resin combination (B) molding of the antistatic agent (b2) that will comprise thermoplastic resin (b1) and be made of organic compound forms.In order to prevent particulate, cooperate antistatic agent (b2) that the surface resistivity of lid is reduced as organic compound to adhering to of covering.Owing to replacing cooperating electroconductive stuffing to be combined with organic compounds,, guarantee the visibility of internal tank as moulded work with transparency.
Thermoplastic resin (b1), if itself be the resin with transparency, just not restriction especially can be according to purpose from Merlon; Polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitritrile-styrene resin (AS resin) or copolymer of methyl methacrylatestyrene styrenics such as (MS resins); Polyolefin such as polypropylene (PP) or cyclic olefin polymer; Poly-(methyl) acrylate; Select in the resins such as polyacrylonitrile.
Among these,, preferably use the amorphism thermoplastic resin as thermoplastic resin (b1).Non-crystalline resin is transparent often good, compares with crystalline resin, and the shrinkage during molding is little, therefore can access the good moulded work of dimensional accuracy.The occasion that dimensional accuracy is low unfavorable is as having put down in writing when the explanation of thermoplastic resin (a1).About thermoplastic resin (b1) is the suitable glass transition temperature of amorphism thermoplastic resin occasion, is identical with the thermoplastic resin composition's who has illustrated (a1) occasion.
As thermoplastic resin (b1), the object lesson of appropriate resin can example illustrate styrenic, poly-(methyl) acrylate, polyacrylonitrile, Merlon.Among these, phenylethylene resin series is suitable, is particularly suitable for using the resin of the diene series rubber particle that disperses to make the diene monomers copolymerization in the matrix resin that the copolymer by styrene monomer and other monomers that can copolymerization constitutes and form.Other monomers that can copolymerization used herein, and if the styrene monomer copolymerization be possible, just have no particular limits, can example illustrating with (methyl) acrylonitrile such as acrylonitrile, methacrylonitriles be the vinyl cyanide monomer of representative; With (methyl) acrylate monomers such as methyl acrylate, ethyl acrylate, methyl methacrylate, EMAs is the unsaturated carboxylic acid alkyl ester monomer of representative; Unsaturated carboxylic acid or unsaturated dicarboxylic anhydride monomers such as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, citraconic anhydride; Maleimides such as maleimide, methyl maleimide, ethyl maleimide, N-phenylmaleimide, O-chloro-N-phenylmaleimide are monomer etc.Among these, above-mentioned other monomers that can copolymerization are that what to select from vinyl cyanide monomer and unsaturated carboxylic acid alkyl ester monomer is suitable more than or equal to a kind.By making vinyl cyanide monomer carry out copolymerization, thermal endurance, resistance to chemical reagents, rigidity and dimensional stability improve, and the resin of this occasion is often referred to ABS resin (acrylonitrile-butadiene-styrene copolymer).In addition, good in order to make the transparency, preferably make the unsaturated carboxylic acid alkyl ester monomer carry out copolymerization.Among these, make vinyl cyanide monomer and unsaturated carboxylic acid alkyl ester monomer both to carry out copolymerization be specially suitable.
The antistatic agent (b2) that cooperates in thermoplastic resin (b1) is the antistatic agent that is made of organic compound.During the filler of the conductivity of cooperation as carbon fiber or carbon black, the transparency of lid is compromised, and becoming can not visual inside, and it is important therefore cooperating the antistatic agent (b2) that is made of organic compound.Antistatic agent (b2) is a macromolecular compound, is difficult for oozing out and being difficult to become pollutant sources to the surface, and be preferred therefore.In addition, keeping continuously for a long time, stable antistatic property also becomes possibility.The macromolecular compound that uses in antistatic agent is the macromolecular compound with polar group, can polyalkylene oxide, polyether ester amides, polyester esteramides, polyester, polyamide, polyurethane etc. be shown example.Especially polyalkylene oxide, polyether ester amides, polyester esteramides are suitable, and polyether ester amides is specially suitable.
Resin combination (B) preferably contains 70～99 weight % thermoplastic resins (b1) and 1～30 weight % antistatic agent (b2).During less than 1 weight %, surface resistivity reduces deficiently at the content of antistatic agent (b2), and it is insufficient that antistatic behaviour becomes easily.The content of antistatic agent (b2) more suitably is more than or equal to 2 weight %, most suitably is more than or equal to 5 weight %.At this moment, the content of thermoplastic resin (b1) is respectively to be less than or equal to 98 weight %, is less than or equal to 95 weight %.On the other hand, when the content of antistatic agent (b2) surpassed 30 weight %, the hardness of resin combination (B) reduced, and when marresistance reduced, modulus of elasticity reduced, and the form retentivity also reduces.The content of antistatic agent (b2) more suitably is to be less than or equal to 25 weight %, most suitably is to be less than or equal to 20 weight %.At this moment, the content of thermoplastic resin (b1) is respectively more than or equal to 75 weight %, more than or equal to 80 weight %.
The method of mixed thermoplastic resin (b1) and antistatic agent (b2) is restriction especially not, usually by both melt kneading are mixed.It also is possible mediating when melt molding, but the pellet supply melt molding of the resin combination (B) that preferably the pre-fusion kneading is obtained usually.
For situation that can visual internal tank, lid must have the transparency.Specifically, constituting the resin combination (B) of lid, better is that the haze when forming the injection-molded object of thickness 3mm is less than or equal to 30% resin combination, is more preferably to be less than or equal to 20%, is preferably less than or equals 10%.Here, the haze among the present invention is 23 ℃ of values according to ASTM D-1003 standard test to the thick sample of 3mm.
In addition, the Rockwell hardness of resin combination (B) 80～140 (units: the R scale) preferably.Lid not necessarily requires high rigidity as resin combination (A) because chip carrier directly mounting thereon, the bottom surface is contacting metal member etc. not.But vessel that is made of resin combination (A) and the lid that is made of resin combination (B) are in contact with one another manyly, and what suppress the scar that caused by friction this moment is important.As mentioned above, resin combination of the present invention (A) is the low resin combination of frictional resistance, however, the particulate managerial skills become strict now, need strictly to suppress to derive from the dirt bits of the mutual friction mutually of vessel and lid.Usually, contain side's hardness height of the resin combination (A) of carbon fiber (a2), thus the hardness of resin combination (B) be certain more than, see it is suitable from the viewpoint of marresistance.The Rockwell hardness of resin combination (B) more suitably is more than or equal to 90, most suitably is more than or equal to 95.On the other hand, when hardness was too high, antistatic property was also often insufficient, thereby more suitably was to be less than or equal to 130, most suitably was to be less than or equal to 120.
In addition, the weight of chip carrier is not applied directly to and covers, so the modulus of elasticity in static bending of resin combination (B) also can be lower than the modulus of elasticity of resin combination (A), normally about 1000～4000MPa.
Resin combination (B) melt molding is made lid, and in the present invention, the surface resistivity of this lid is 10
3～10
13Ω/ is important.In surface resistivity less than 10
3During Ω/, the use level of antistatic agent becomes too much, and the hardness of lid reduces, and modulus of elasticity also reduces.Surface resistivity is suitably more than or equal to 10
5Ω/ more suitably is more than or equal to 10
8Ω/.On the other hand, surpass 10 in surface resistivity
13During Ω/, it is insufficient that antistatic behaviour becomes, and can not bring into play fully to prevent the particulate adhesion property.Surface resistivity is less than or equal to 10 suitably
12Ω/ more suitably is to be less than or equal to 10
11Ω/.
Use resin combination (A) the mold container body of above explanation, use resin combination (B) to be molded as lid.When carrying out molding,, be fit to adopt injection-molded from the viewpoint of dimensional accuracy.Usually, the general resin that uses identical type of vessel and lid, but the present invention is characterised in that and dares to select different materials.Therefore, lid and vessel, because the condition of moulding that is fit to is also different, molding shrinkage is also different, so the design of metal pattern also needs to adjust according to material separately.
The strictness of particulate managerial skills now, the marresistance that improves the friction between vessel and the lid is important.As mentioned above, countermeasure by the hardness that improves resin combination (B), also can improve marresistance, but when requiring better marresistance, above-mentioned lid is made resin combination (A) and the compound moulded work of resin combination (B), preferably constitute the part that contacts with the said vesse body with resin combination (A).In this occasion, the resin combination (A) that what be in contact with one another is the hardness height, frictional resistance is little each other, so scar be suppressed in Min..Constitute the resin combination (A) of a part of covering and the resin combination (A) that in vessel, uses, even identical resin combination also has no relations, even different resin combinations also has no relations.In this occasion, height is not good more like that more for the hardness of resin combination (B), usually, is 60～140 (units: the R scale) by Rockwell hardness.
In compound like this lid, resin combination (A) can constitute the part that contacts with vessel.In addition, resin combination (B) can use in the scope of guaranteeing inner visibility.From making the good such viewpoint of internal visual, it is suitable that resin combination (A) only is configured to banded form at the lid periphery.
Make the not restriction especially of resin combination (A) and resin combination (B) composite methods.Behind the moulded work of making the moulded work that constitutes by resin combination (A) in advance and constituting by resin combination (B), again the two is compoundly also had no relations.For example, can both be fitted, also both can be assembled with adhesive, can also be with both heat fuseds.But, when using adhesive, be easy to generate polluter, when assembling, the danger that produces the gap is arranged, when carrying out heat fused, the danger of the distortion that generation causes by heat is arranged.Therefore, preferably utilize embedding mould or double-colored molding to carry out resin combination (A) and resin combination (B) is compound.Adopt compoundly like this, just can obtain that dimensional accuracy is good, the moulded work of cleaning.
So-called embedding mould is to use the either party of resin combination (A) or resin combination (B), after the moulded work that pre-molding is become is put into metal pattern, and the method that another resin combination is injection-molded.In addition, so-called double-colored molding is to use same metal pattern, uses the either party of resin combination (A) or resin combination (B), carry out preform injection after, then with the method for another resin combination injection.
The form of the semiconductor wafer carrier container of the present invention that obtains like this is restriction especially not, can be made of the vessel of mounting semiconductor wafer carrier and the lid of this vessel of covering.If the enough lid coverings of energy, even being flat board, vessel also has no relations.For example can be the container that uses as in the tote box system that is called SMIF (Standard Mechanical Interface), mounting chip carrier on smooth tabular moulding bodies will cover the such execution mode of transparency cover on it.In addition, also can be the execution mode that has peristome in the container front that is called FOUP (Front OpeningUnified Pod) or FOSB (Front Opening Shipping Box).
In addition, vessel and lid also can adopt uses hinged formation, is easily on opening and closing, but in this occasion, because the slip at hinge place, scar takes place the danger that causes that the dirt bits take place, thereby often improper according to the purposes difference.Therefore do not have hinge to constitute, only the container with the formation of the peristome that covers the covering container body is suitable.
In addition, invade internal tank in order to prevent particulate, the periphery of preferred above-mentioned lid covers the also outside of the peristome upper limb of closed container body.Adopting such measure, is to invade because particulate must revolt gravity.At this moment, vessel has the inclined-plane at its peristome upper limb to outer skew back, and the above-mentioned inner face that covers at its periphery has the inclined-plane, and two inclined-planes are the opposed formation in mutual almost parallel ground preferably.At this moment, the gap between two inclined-planes is to be less than or equal to 1mm, and the width on above-mentioned inclined-plane 5～50mm preferably.Whereby, little gap is advanced upward, just can prevent the intrusion of particulate effectively.And owing to dispose the inclined-plane obliquely, it is possible covering smoothly when Jiang Gaigai is on vessel.This moment, vessel neither contact by force with lid, therefore also can suppress the dirt bits and take place.As mentioned above, semiconductor wafer carrier container of the present invention, selected material as can preventing vessel and the dirt bits of lid when contact take place, thereby can be more and prevent the generation of dirt bits effectively.
In addition, the peristome upper limb of preferred container body contacts up and down opposed to each other with the inner face of above-mentioned lid.That is the form of preferably relative peristome upper limb mounting lid.At this moment, opposed gap between the two is preferably less than or equals 1mm.Not being the contact position to be arranged and the place of floating, but setting the gap equably, can prevent the intrusion of particulate, is suitable.In addition, the width of the mutual opposed part of inner face of the peristome upper limb of vessel and lid 3～25mm preferably.Because the width with regulation, particulate is invaded this gap also becomes difficulty, or by making contact area become big, also can prevent concentrated wear.
As in order to improve the countermeasure of marresistance to the friction between vessel and lid, fixing elastic component on any of said vesse body or above-mentioned lid, when closed container, the above-mentioned elastic component of configuration accomplishes that it also is suitable execution mode that said vesse body and above-mentioned lid are not in contact with one another between said vesse body and above-mentioned lid.The material of hard is directly contact mutually, thereby the generation of the scar that caused by friction be difficult for to take place.But elastic component self often becomes pollutant sources, thereby will note according to purposes.The kind of elastic component is restriction especially not, can use various rubber or flexibility resin.In this occasion, height is not good more like that more for the hardness of resin combination (B), usually, is 60～140 (units: the R scale) by Rockwell hardness.
Even above-mentioned elastic component be configured in vessel and the lid between whole periphery on also have no relations, even partly the configuration also have no relations.At this moment, the height of preferred above-mentioned elastic component is to be less than or equal to 1mm.This highly is meant the vessel that is fixed from elastic component or the height of surface to elastic component of lid.Because this highly is to be less than or equal to 1mm, can makes the gap between vessel and lid narrow and small, thereby can suppress the intrusion of particulate.Elastic component can be fitted with adhesive, also can assemble, and can also by hot melt.In addition, use thermoplastic elastomer (TPE) as elastic component, it also is possible utilizing embedding mould or double color mould mold to be moulded one.
The size of the semiconductor wafer carrier of being accommodated has no particular limits, preferably the carrier of using more than or equal to 4 inches semiconductor wafer.But the weight of chip carrier is big more, adopts the benefit of formation of the present invention just big more, thereby is more preferably the semiconductor wafer usefulness more than or equal to 6 inches, most preferably is to use more than or equal to 8 inches semiconductor wafer.
Embodiment
Below, use embodiment to illustrate in greater detail the present invention.In an embodiment, various evaluations have been carried out according to following method.
(1) ocular estimate
The vessel of the injection-molded container that obtains and lid after normal temperature is placed 24 hours, are estimated apparent condition separately respectively.Scoring is according to following benchmark.
A: do not see warpage or contraction, distortion, between body and lid, almost do not produce the gap.
B: see warpage or contraction, distortion a little, between body and lid, produce the gap a little.
C: see warpage or contraction, distortion significantly, between body and lid, produce significant gap.
(2) visibility evaluation
Be housed in 8 inches chip carriers of surperficial attachment labels at internal tank, the visibility of the literal put down in writing on the label is estimated.Scoring is according to following benchmark.
A: outside container, clearly read.
B: also can read though blur.
C: can not read fully.
(3) sheet resistance value evaluation
The injection-molded moulded work that obtains carries out more than or equal to state adjustment in 6 hours at 23 ℃, humidity 50%RH after room temperature was placed 24 hours.For the moulded work after the status adjustment, use East Asia electric wave Industrial Co., Ltd system ohmer " SUPER MEGOHMMETER SM-21E ", the applied voltage that gives 100V is measured the surface resistivity (Ω/) at Fig. 3 and 5 positions shown in Figure 6.At this moment, between the terminal and moulded work surface of positive pole and negative pole, configuration thickness all is the square conducting rubber of 2mm, 10mm, and these conducting rubbers are mutual is spaced apart 10mm.The resistance value of conducting rubber is more much smaller than the moulded work of estimating as used herein, thereby to ignore the resistance value derive from conducting rubber be possible.
(4) the marresistance evaluation above the vessel
In the vessel of the injection-molded container that obtains, carbonaceous powder polyether-ether-ketone (PEEK) the system carrier of 25 pieces of 8 inches silicon chips is housed, came in and went out 15 minutes with 30 times/minute speed, carry out this test.The apparent condition of the vessel after visual valuation should be tested.Scoring is according to following benchmark.
A: have scar a little, but do not produce abrasion dust.
B: have scar, but the generation of abrasion dust is few.
C: have scar consumingly, abrasion dust produces many.
(5) the marresistance evaluation of vessel bottom surface
In the vessel of the injection-molded container that obtains, place carbonaceous powder polyether-ether-ketone (PEEK) the system carrier that 25 pieces of 8 inches silicon chips are housed, having on the corrosion resistant plate of punching, with come and go for 30 times/minute speed carry out sliding sliding distance 30cm in 15 minutes.After this test, the apparent condition of the skimming wear face of visual valuation vessel.Scoring is according to following benchmark.
A: have scar a little, but do not produce abrasion dust.
B: have scar, but the generation of abrasion dust is few.
C: have scar tempestuously, abrasion dust produces many.
(6) by the mutual fricative marresistance evaluation of vessel and lid
Use injection-molded vessel that obtains and lid, carry out 60 minutes switching test with 30 times/minute speed.The apparent condition of the vessel after visual valuation should be tested and the mutual friction portion of lid.Scoring is according to following benchmark.
A: have scar a little at friction portion, but do not have abrasion dust to adhere to.
B: have scar at friction portion, only have trickle abrasion dust to adhere to a little.
C: have scar at friction portion, have trickle abrasion dust to adhere to, big abrasion dust is adhered to a little.
D: have scar at friction portion, both adhered to many fine abrasion dust and also adhered to and permitted great abrasion dust.
The form of the semiconductor wafer carrier container that is molded as in following embodiment and Comparative Examples is shown among Fig. 1～Fig. 7.This container is the container of accommodating the carrier that the semiconductor wafer of 8 inches of diameters uses, and is made of vessel 1 and lid 2.Fig. 1 is the plane graph of vessel 1, and Fig. 2 is the front elevation of vessel 1, and Fig. 3 is the left surface figure of vessel 1.Vessel 1, at the whole peripheral plane peristome upper limb 3 that forms the about 15mm of width of its peristome, the mounting lid 2 thereon.Have inclined-plane 4 below peristome upper limb 3 outside skew backs, the inclined-plane 5 of the inner face of this inclined-plane and lid 2 is opposed.Fig. 4 covers 2 plane graph, and Fig. 5 covers 2 front elevation, and Fig. 6 covers 2 right hand view.Making turns upside down covers lid 2 on vessel 1.At the inner face of lid 2, on the whole periphery around it, form the planar section 6 of the about 15mm of width, the peristome upper limb 3 of this planar section and said vesse body 1 is relative.The outside at planar section 6 also has inclined-plane 5, and the inclined-plane 4 of this inclined-plane 5 and said vesse body 1 is relative.
The sectional drawing of the state when Fig. 7 is lid 2 combination of record in the vessel 1 of record in the presentation graphs 1～3 and Fig. 4～6 is also illustrated in the sectional drawing of the A-A position among Fig. 1.In face side (carrier discrepancy side), inclined- plane 4 and 5 mutual almost parallel ground, inclined-plane are opposed, and the gap between two inclined-planes in this opposed part is to be less than or equal to 1mm, and the opposed width on two inclined-planes is about 10mm.In addition, in a positive side, the peristome upper limb 3 of vessel 1 contacts with the gap that is less than or equal to 1mm with the planar section 6 of the inner face of lid 2, and the width of mutual opposed part is about 10mm.In the rear side (with the opposite side of carrier discrepancy), inclined- plane 4 and 5 mutual almost parallel ground, inclined-plane are opposed, and the gap between two inclined-planes in this opposed part is to be less than or equal to 1mm, and the opposed width on two inclined-planes is about 15mm.In addition, side overleaf, the peristome upper limb 3 of vessel 1 contacts with the planar section 6 of lid 2 in fact very close to each otherly, and the width of mutual opposed part is about 15mm.
As resin combination (A), use the conductive polycarbonate resin combination (Sumitomo ダ ウ Co., Ltd. system " SD POLYCA CF5101V ") that contains carbon fiber.This resin combination is the resin combination that cooperates the short fiber of 10 weight % carbon fibers in Merlon.Use this resin combination, utilize Corporation Japan Steel Works's system injection molding machine " J450E-C5 ", make the vessel shown in Fig. 1～3.The screw diameter of this injection molding machine is 76mm.In addition, condition of moulding is as follows.
Barrel design temperature: 290 ℃
Metal pattern design temperature: 50 ℃
The injection setting speed of screw rod: 45mm/s
(the injection speed of resin combination: 204ml/s)
Injection setting pressure: 200MPa
Using ABS is permanent transparent antistatic resin combination (Japanese エ イ ア Application De エ Le Co., Ltd.'s system " テ Network ニ エ-ス TE-2200 ").This resin combination is the resin combination as the polyether ester amides of hydrophilic polymer that cooperates 15 weight % in ABS resin as antistatic agent.This ABS resin is to contain the resin that disperses the butadiene particle in the matrix that the terpolymer of methyl methacrylate copolymer composition constitutes except that styrene and acrylonitrile, is by making methyl methacrylate copolymer, improving the resin of the transparency.The sample of used thickness 3mm, the haze value of utilizing the dye technology institute system reflection and transmission rate meter HR-100 of Murakami K. K. to measure is 7%.Use this resin combination, utilize Corporation Japan Steel Works's system injection molding machine " J450E-C5 ", make the lid shown in Fig. 4～6.The screw diameter of this injection molding machine is 76mm.In addition, condition of moulding is as follows.
Barrel design temperature: 200 ℃
Metal pattern design temperature: 40 ℃
The injection setting speed of screw rod: 45mm/s
(the injection speed of resin combination: 204ml/s)
Injection setting pressure: 200MPa
For the moulded work that obtains,, carry out the various evaluations of ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance evaluation according to above-mentioned method.Its result compiles and is shown in Table 1.
As resin combination (A), using carbon fiber is conductive polypropylene resin (Osaka ガ ス ケ ミ カ Le Co., Ltd.'s system " LRP410C ").This resin combination is the resin combination that cooperates the short fiber of about 10 weight % carbon fibers in polypropylene.Use this resin combination, utilize Corporation Japan Steel Works's system injection molding machine " J450E-C5 ", make the vessel shown in Fig. 1～3.The screw diameter of this injection molding machine is 76mm.In addition, condition of moulding is as follows.
Barrel design temperature: 230 ℃
Metal pattern design temperature: 60 ℃
The injection setting speed of screw rod: 45mm/s
(the injection speed of resin combination: 204ml/s)
Injection setting pressure: 200MPa
In addition, use and identical Japanese エ イ ア Application De エ Le Co., Ltd.'s system " テ Network ニ エ-ス TE-2200 " of embodiment 1 use, under the condition of moulding identical, make the lid shown in Fig. 4～6 with embodiment 1.For the moulded work that obtains, carry out the various evaluations of ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance evaluation similarly to Example 1.Its result compiles and is shown in Table 1.
Comparative Examples 1
Vessel all uses identical Japanese エ イ ア Application De エ Le Co., Ltd.'s system " テ Network ニ エ-ス TE-2200 " and the embodiment 1 that use with embodiment 1 to carry out molding in the same manner with lid.For condition of moulding, vessel and lid are identical during also with the molding of the lid of embodiment 1.Carry out the various evaluations that ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance are estimated in the same manner for the moulded work that obtains and embodiment 1.Its result compiles and is shown in Table 1.
Comparative Examples 2
Use biaxial extruder (the プ ラ ス チ of Co., Ltd. Star Network engineering institute system, screw diameter 32mm is L/D=33) with 85 weight portions east レ Co., Ltd. system polybutylene terephthalate (PBT) resin particle " ト レ コ Application 1401-X06 " and black " the ケ Star チ エ Application Block ラ Star Network EC " melt kneading of the system ケ of 15 weight portion ラ イ オ Application Co., Ltd. Star チ エ Application.It is black that operating weight formula feeder adds ケ Star チ エ Application from exhaust outlet, melt extrudes and obtain wire rod at 230 ℃.Cut this wire rod with comminutor, obtain resin composition pellet.The resin composition pellet that use obtains utilizes Corporation Japan Steel Works's system injection molding machine " J450E-C5 ", makes the vessel shown in Fig. 1～3.The diameter of the screw rod of this injection (mo(u)lding) machine is 76mm.In addition, condition of moulding is as follows.
Barrel design temperature: 280 ℃
Metal pattern design temperature: 80 ℃
The injection setting speed of screw rod: 45mm/s
(the injection speed of resin combination: 204ml/s)
Injection setting pressure: 200MPa
In addition, use and identical Japanese エ イ ア Application De エ Le Co., Ltd.'s system " テ Network ニ エ-ス TE-2200 " of embodiment 1 use, under the condition of moulding identical, make the lid shown in Fig. 4～6 with embodiment 1.Carry out the various evaluations that ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance are estimated in the same manner for the moulded work that obtains and embodiment 1.Its result compiles and is shown in Table 1.
Comparative Examples 3
Use and make the vessel shown in Fig. 1～3 in the same manner with embodiment 1 identical polycarbonate resin " SD POLYCA CF5101V " and embodiment 1.
Use ABS resin (Japanese エ イ ア Application De エ Le Co., Ltd.'s system " サ Application Star Network UT-61 "), utilize Corporation Japan Steel Works's system injection molding machine " J450E-C5 ", make the lid shown in Fig. 4～6.This ABS resin does not contain antistatic agent, and is copolymerization methyl methacrylate not.The haze value of measuring in the same manner with embodiment 1 surpasses 30%.The screw diameter of this injection molding machine is 76mm.In addition, condition of moulding is as follows.
Barrel design temperature: 200 ℃
Metal pattern design temperature: 40 ℃
The injection setting speed of screw rod: 45mm/s
(the injection speed of resin combination: 204ml/s)
Injection setting pressure: 200MPa
Carry out the various evaluations that ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance are estimated in the same manner for the moulded work that obtains and embodiment 1.Its result compiles and is shown in Table 1.
Reference example 1
Vessel all uses with embodiment 1 with lid and uses identical Sumitomo ダ ウ Co., Ltd. system polycarbonate resin " SD POLYCA CF5101V " and embodiment 1 molding in the same manner.For condition of moulding, vessel and lid are identical during all with the molding of the body of embodiment 1.Carry out the various evaluations that ocular estimate, visibility evaluation, sheet resistance value evaluation, marresistance are estimated in the same manner for the moulded work that obtains and embodiment 1.Its result compiles and is shown in Table 1.
As shown in table 1, the vessel of the embodiment 1 that constitutes by the poly carbonate resin composition that cooperates carbon fiber, consistency and elasticity modulus height, marresistance is good.Relative therewith, when using the transparent antistatic ABS resin composition shown in Comparative Examples 1 in vessel, marresistance reduces greatly.In addition, shown in Comparative Examples 2, when using the PBT resin combination that cooperates carbon black, when marresistance reduces, be easy to generate the dirt bits.The vessel of the embodiment 2 that constitutes by the polypropylene resin composite that cooperates carbon fiber, though marresistance is good, polypropylene is crystalline, thereby when molding warpage and contraction takes place, dimensional accuracy reduces, and therefore uses often difficulty according to purposes.
In addition, embodiment 1 and 2 lid, sheet resistance value is low, and the transparency is also good, and as Comparative Examples 3, uses not contain antistatic agent, when not containing the ABS resin of methyl methacrylate composition, the sheet resistance value height, the transparency is not good yet.Known in addition, as reference example 1, when vessel all used the poly carbonate resin composition that cooperates carbon fiber with lid, marresistance was extremely good.This expression is a resin combination (A) with the compound moulded work of resin combination (B) at lid, constitute under the situation of the part that contacts with the said vesse body with resin combination (A), can provide visibility well, container that marresistance is extremely good.
Claims (7)
1. semiconductor wafer carrier container, it is by the vessel of mounting semiconductor wafer carrier and covers the semiconductor wafer carrier container that the lid of this vessel constitutes, it is characterized in that, the said vesse body is formed by resin combination (A) molding of the carbon fiber (a2) of amorphism thermoplastic resin (a1) that comprises 60～98 weight % and 2～40 weight %, wherein the modulus of elasticity in static bending of this resin combination (A) is 4000～21000MPa
The surface resistivity of this vessel is 10
2～10
12Ω/,
Above-mentioned lid is formed by resin combination (B) molding of the antistatic agent as organic high molecular compound (b2) of thermoplastic resin that comprises 70～99 weight % (b1) and 1～30 weight %, wherein this resin combination (B) is that haze when forming the injection-molded object of thickness 3mm is less than or equal to 30% resin combination, its modulus of elasticity in static bending is 1000～4000MPa
The surface resistivity of this lid is 10
3～10
13Ω/, and this lid has the transparency.
2. semiconductor wafer carrier container according to claim 1, wherein, amorphism thermoplastic resin (a1) is a Merlon.
3. semiconductor wafer carrier container according to claim 1 and 2, wherein, the Rockwell hardness of resin combination (A) is 110～140, unit is the R scale.
4. semiconductor wafer carrier container according to claim 1 and 2, wherein, thermoplastic resin (b1) is a kind that selects from styrenic, poly-(methyl) acrylate, polyacrylonitrile, Merlon.
5. semiconductor wafer carrier container according to claim 1 and 2, wherein, the Rockwell hardness of resin combination (B) is 80～140, unit is the R scale.
6. semiconductor wafer carrier container according to claim 1 and 2, wherein, the periphery of above-mentioned lid cover the said vesse body the peristome upper limb the outside and be closed.
7. semiconductor wafer carrier container according to claim 6, wherein, the said vesse body has the inclined-plane below the outside skew back of its peristome upper limb, the above-mentioned inner face that covers at its periphery has the inclined-plane, two inclined-planes are the opposed formations in mutual almost parallel ground, gap between two inclined-planes is to be less than or equal to 1mm, and the opposed width in two inclined-planes is 5～50mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP411715/2003 | 2003-12-10 | ||
| JP2003411715 | 2003-12-10 |
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| JP (1) | JPWO2005057649A1 (en) |
| CN (1) | CN100555596C (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008030756A (en) * | 2006-07-26 | 2008-02-14 | Jsp Corp | Glass substrate conveyance box and glass substrate conveyance package |
| JP2014154592A (en) * | 2013-02-05 | 2014-08-25 | Toppan Printing Co Ltd | Housing container and method of manufacturing housing container |
| JP7355838B2 (en) * | 2019-09-30 | 2023-10-03 | 旭化成株式会社 | Containers, storage devices, electrical parts storage bodies |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124969A (en) * | 1978-03-22 | 1979-09-28 | Daicel Ltd | Semiconductor wafer container |
| JPS61195059U (en) * | 1985-05-28 | 1986-12-04 | ||
| JPH057680U (en) * | 1991-02-19 | 1993-02-02 | 新亜産業株式会社 | Wafer storage container |
| JPH10245066A (en) * | 1997-03-06 | 1998-09-14 | Komatsu Kasei Kk | Sealing structure of synthetic resin container and sealing gasket |
| JP3916342B2 (en) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | Substrate storage container |
| JP2002305239A (en) * | 2001-04-06 | 2002-10-18 | Shin Etsu Polymer Co Ltd | Wafer storage container and production method therefor |
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| TWI336677B (en) | 2011-02-01 |
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