CN100547111C - A kind of chemical plating stannum solution - Google Patents
A kind of chemical plating stannum solution Download PDFInfo
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- CN100547111C CN100547111C CNB2008100544842A CN200810054484A CN100547111C CN 100547111 C CN100547111 C CN 100547111C CN B2008100544842 A CNB2008100544842 A CN B2008100544842A CN 200810054484 A CN200810054484 A CN 200810054484A CN 100547111 C CN100547111 C CN 100547111C
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- chemical plating
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- tin
- plating stannum
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Abstract
The invention provides a kind of chemical plating stannum solution, component comprise stannous sulfate or tin protochloride, the vitriol oil, inferior sodium phosphate, Pyrithioxine hydrochloride, 4,4 '-(2-pyridine methylene) biphenol, Schiff alkali, polyethylene glycol 6000, amidinothiourea etc.It is zinc-plated that this tin plating solution is used in iron and steel, copper or Cu alloy material surface replacement, and its working temperature is 20～65 ℃, and plating time is 30～90 seconds, thickness of coating 0.45～1.42 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Description
Technical field
The present invention relates to the chemical plating to metal material surface, specifically is a kind ofly to carry out the zinc-plated solution of chemical replacement at iron and steel, copper or copper alloy substrate surface.
Background technology
Zinc-platedly be a kind of good weldability and have the coating of certain anti-corrosion capability, widespread use in electronic industry.Yet the coating that obtains from the Sn electroplate liquid often is accompanied by the growth of coarse grained precipitation and tin palpus, and this tin must be one of main harm that causes electrical short-circuit, avoid this situation, and the thickness of coating of 5 μ m is necessary.And the chemical plating stannum difference can not produce stress, all very tiny densification of sedimentary particle, and can not produce pin hole, the thickness of coating of 0.45～1.2 μ m just can reach most customer requirements.So chemical plating stannum is specially adapted to the surface treatment of high-density, high precision, thin wire, narrow pad and closely spaced printed circuit board, has the certain development potentiality.
About chemical plating stannum, its chemical reaction type has replacement(metathesis)reaction and reduction reaction.With replacement(metathesis)reaction zinc-plated then depend on the electricity to φ (M
2+/ M) the relative value of standard potential.φ(Fe
2+/Fe)＝-0.4402V，φ(Sn
2+/Sn)＝-0.136V，φ(Cu
2+/Cu)＝+0.337V，φ(Cu
+/Cu)＝+0.521V。Therefore, zinc-plated at steel is feasible, zinc-plated on copper material, then must in solution, add can with the powerful coordinate coordination agent of Cu, can effectively reduce the copper electrode current potential, when the copper electrode current potential is reduced to the tin electrode current potential when following, Sn
2+Generating the immersion tin layer with copper generation replacement(metathesis)reaction, is feasible on thermodynamics.For example, when containing thiocarbamide in the solution, just following reaction can take place and immersion tin can be carried out.
Have in the chemical plating stannum solution of practical value except that containing complexing agent, also should contain and make Sn
2+Stable stablizer makes the brightening agent of coating light.
The domestic people of having studies chemical plating stannum (2007 the 1st phases of chemical tin plating liquor Study on Additive material protection such as Sun Wu); the tin plating electrolyte prescription that comprises stannous sulfate, the vitriol oil, coordination agent, inferior sodium phosphate etc. is provided; this tin plating electrolyte is shorter steady time; about the thickness of coating 0.5 μ m that obtains, can not satisfy most customer requirements.
Summary of the invention
The object of the present invention is to provide a kind of chemical plating stannum solution, this tin plating solution good stability, resulting thickness of coating can satisfy most customer requirements.
A kind of chemical plating stannum solution provided by the invention, its component and proportioning are:
Stannous sulfate 10～40g/L
The vitriol oil (content 98%) 20～70mL/L
West Buddhist alkali 0.1～3g/L
Polyethylene glycol 6000 0.005～0.015g/L
Inferior sodium phosphate (containing 1 crystal water) 0～80g/L
Amidinothiourea 0.02～0.08g/L
Pyrithioxine hydrochloride 0.01～0.06g/L
4,4 '-(2-pyridine methylene) biphenol 0.01-0.05g/L
Glucuronic acid 0.05～0.6g/L
All the other are deionized water or distilled water.
Described western Buddhist alkali is the salicylidene thiosemicarbazide.
Described stannous sulfate can substitute with tin protochloride.
The preparation method of chemical plating stannum solution of the present invention: at first the vitriol oil is slowly added (50%-70% of Total Water) in the deionized water, then successively with stannous sulfate, western Buddhist alkali, polyethylene glycol 6000, inferior sodium phosphate, amidinothiourea, Pyrithioxine hydrochloride, 4,4 '-(2-pyridine methylene) biphenol and glucuronic acid adding, fully be assigned to prescribed volume with the solution filtration and with deionized water after the dissolving.
It is zinc-plated that chemical plating stannum solution of the present invention is used in iron and steel, copper or Cu alloy material surface replacement, and its working temperature is 20～65 ℃, and plating time is 30～90 seconds, thickness of coating 0.45～1.42 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Advantage compared with prior art of the present invention and effect: contain complexing agent west Buddhist alkali and amidinothiourea in the tin plating solution, can effectively reduce the electropotential of copper, replacement(metathesis)reaction can be carried out; Pyrithioxine hydrochloride strengthens the coating luminance brightness; 4,4 '-use of (2-pyridine methylene) biphenol and glucuronic acid makes plating bath more stable, and plating bath can be stablized and preserves more than 90 days under the normal temperature.This tin plating solution technological process is easy to control, both can be on steel, and also can be zinc-plated at copper or Cu alloy material surface replacement.The thickness of coating wide ranges of using this tin plating solution to obtain can satisfy most customer requirements.
Embodiment
Embodiment 1: every liter of chemical plating stannum solution set of dispense ratio
Stannous sulfate (or tin protochloride) 10g/L
The vitriol oil (content 98%) 20mL/L
West Buddhist alkali 0.1g/L
Polyethylene glycol 6000 0.005g/L
Inferior sodium phosphate 0g/L
Amidinothiourea 0.02g/L
Pyrithioxine hydrochloride 0.01g/L
4,4 '-(2-pyridine methylene) biphenol 0.01/L
Glucuronic acid 0.2g/L
All the other are deionized water.
This tin plating solution is at the copper material electroplating surfaces with tin, and working temperature is 65 ℃, and plating time is 90 seconds, thickness of coating 1.01 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Embodiment 2: every liter of chemical plating stannum solution set of dispense ratio
Stannous sulfate (or tin protochloride) 40g/L
The vitriol oil (content 98%) 70mL/L
West Buddhist alkali 3g/L
Polyethylene glycol 6000 0.015g/L
Inferior sodium phosphate 80g/L
Amidinothiourea 0.08g/L
Pyrithioxine hydrochloride 0.06g/L
4,4 '-(2-pyridine methylene) biphenol 0.05g/L
Glucuronic acid 0.05g/L
All the other are deionized water.
This tin plating solution is at the copper material electroplating surfaces with tin, and working temperature is 20 ℃, and plating time is 30 seconds, thickness of coating 0.45 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Embodiment 3: every liter of chemical plating stannum solution set of dispense ratio
Stannous sulfate (or tin protochloride) 25g/L
The vitriol oil (content 98%) 35mL/L
West Buddhist alkali 2g/L
Polyethylene glycol 6000 0.01g/L
Inferior sodium phosphate 30g/L
Amidinothiourea 0.05g/L
Pyrithioxine hydrochloride 0.04g/L
4,4 '-(2-pyridine methylene) biphenol 0.03g/L
Glucuronic acid 0.3g/L
All the other are distilled water.
This tin plating solution is at the copper material electroplating surfaces with tin, and working temperature is 60 ℃, and plating time is 85 seconds, thickness of coating 1.42 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Embodiment 4: every liter of chemical plating stannum solution set of dispense ratio
Stannous sulfate (or tin protochloride) 30g/L
The vitriol oil (content 98%) 55mL/L
West Buddhist alkali 2.5g/L
Polyethylene glycol 6000 0.012g/L
Inferior sodium phosphate 45g/L
Amidinothiourea 0.07g/L
Pyrithioxine hydrochloride 0.05g/L
4,4 '-(2-pyridine methylene) biphenol 0.04g/L
Glucuronic acid 0.6g/L
All the other are distilled water.
This tin plating solution is at the copper material electroplating surfaces with tin, and working temperature is 25 ℃, and plating time is 75 seconds, thickness of coating 0.92 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Embodiment 5: every liter of chemical plating stannum solution set of dispense ratio
Stannous sulfate (or tin protochloride) 35g/L
The vitriol oil (content 98%) 60mL/L
West Buddhist alkali 3g/L
Polyethylene glycol 6000 0.013g/L
Inferior sodium phosphate 50g/L
Amidinothiourea 0.08g/L,
Pyrithioxine hydrochloride 0.02g/L,
4,4 '-(2-pyridine methylene) biphenol 0.05g/L,
Glucuronic acid 0.4g/L
All the other are deionized water.
This tin plating solution is zinc-plated at steel surface, and working temperature is 20 ℃, and plating time is 70 seconds, thickness of coating 0.86 μ m, and plating bath can be stablized preservation more than 90 days under the normal temperature.
Claims (4)
1, a kind of chemical plating stannum solution is characterized in that, its component and proportioning are:
Stannous sulfate 10～40g/L
98% vitriol oil, 20～70mL/L
West Buddhist alkali 0.1～3g/L
Polyethylene glycol 6000 0.005～0.015g/L
Inferior sodium phosphate 0～80g/L
Amidinothiourea 0.02～0.08g/L
Pyrithioxine hydrochloride 0.01～0.06g/L
4,4 '-(2-pyridine methylene) biphenol 0.01-0.05g/L
Glucuronic acid 0.05～0.6g/L
All the other are deionized water or distilled water.
2, chemical plating stannum solution as claimed in claim 1 is characterized in that, described western Buddhist alkali is the salicylidene thiosemicarbazide.
3, chemical plating stannum solution as claimed in claim 1 is characterized in that, described stannous sulfate can substitute with tin protochloride.
4, the preparation method of chemical plating stannum solution as claimed in claim 1, it is characterized in that comprising the steps: at first the vitriol oil slowly being added in part deionized water or the distilled water, then successively with stannous sulfate, western Buddhist alkali, polyethylene glycol 6000, inferior sodium phosphate, amidinothiourea, Pyrithioxine hydrochloride, 4,4 '-(2-pyridine methylene) biphenol and glucuronic acid adding, fully be assigned to prescribed volume with the solution filtration and with deionized water or distilled water after the dissolving.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100544842A CN100547111C (en) | 2008-01-25 | 2008-01-25 | A kind of chemical plating stannum solution |
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|---|---|---|---|
| CNB2008100544842A CN100547111C (en) | 2008-01-25 | 2008-01-25 | A kind of chemical plating stannum solution |
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| CN101220472A CN101220472A (en) | 2008-07-16 |
| CN100547111C true CN100547111C (en) | 2009-10-07 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101760730B (en) * | 2010-02-21 | 2011-04-20 | 太原师范学院 | Low-temperature chemical tinning solution and tinning method |
| CN103938191B (en) * | 2014-05-13 | 2016-06-01 | 山西宇达集团有限公司 | The rich tin method on bronze sculpture surface |
| CN105483777A (en) * | 2016-02-19 | 2016-04-13 | 苏州市华婷特种电镀有限公司 | Electroplating liquid for obtaining platinum plating |
| TWI728217B (en) * | 2016-12-28 | 2021-05-21 | 德商德國艾托特克公司 | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
| CN107099825B (en) * | 2017-05-04 | 2018-09-28 | 蓬莱联泰电子材料有限公司 | The electroplate liquid formulation and lead tin plating technique of electronic component lead tin plating technique |
| CN109055921A (en) * | 2018-08-27 | 2018-12-21 | 重庆立道新材料科技有限公司 | A kind of electroless plated tin liquor and preparation method thereof |
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2008
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Non-Patent Citations (6)
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| 化学镀技术. 伍学高等，217-220，四川科学技术出版社. 1985 |
| 化学镀技术. 伍学高等，217-220，四川科学技术出版社. 1985 * |
| 酸性化学镀锡工艺及应用研究. 徐瑞东.中国优秀博硕士学位论文全文数据库（硕士），第工程材料I辑卷第2期. 2002 |
| 酸性化学镀锡工艺及应用研究. 徐瑞东.中国优秀博硕士学位论文全文数据库(硕士)，第工程材料I辑卷第2期. 2002 * |
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Assignee: Kaiping Xinmingguang Hardware Products Co., Ltd. Assignor: Taiyuan Normal College Contract record no.: 2010440000521 Denomination of invention: Chemical tin plating solution Granted publication date: 20091007 License type: Exclusive License Open date: 20080716 Record date: 20100520 |
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