CN100546056C - The light-emitting component that has lens with and manufacture method - Google Patents
The light-emitting component that has lens with and manufacture method Download PDFInfo
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- CN100546056C CN100546056C CNB2004800179317A CN200480017931A CN100546056C CN 100546056 C CN100546056 C CN 100546056C CN B2004800179317 A CNB2004800179317 A CN B2004800179317A CN 200480017931 A CN200480017931 A CN 200480017931A CN 100546056 C CN100546056 C CN 100546056C
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- illuminating part
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Abstract
A kind of light-emitting device array that has lens that improves the light utilization ratio is provided.Illuminating part for the approximate U font of light-emitting component is provided with compound lens thereon.The position that connects the luminous intensity maximum of the illuminating part that is similar to the U font forms broken line.Setting is centered close to the part of 4 spherical lenses at each two ends of 3 line segments of this broken line, and part setting has the part of 3 cylindrical lenss of the axle parallel with 3 each line segments therebetween, and it is formed compound lens in abutting connection with configuration.Further, light-emitting component has the antireflection film that covers illuminating part, and compound lens is arranged on the antireflection film surface.
Description
Technical field
The invention relates to the light-emitting component that has lens, particularly help the light utilization ratio improvement the light-emitting component that has lens with and manufacture method.
Background technology
The optical system of the write head of optical printer is designed to picture imaging on photosensitive drums that the scioptics array makes the luminous point of each the LED element that constitutes led array.In the lens arra, use refractive index distribution type rod lens array mostly.
The representative structure example of employed led array, refractive index distribution type rod lens array, photosensitive drums as shown in Figure 1 in the optical printer in past.10 is LED, and 12 is rod type lens array, and 14 is photosensitive drums.
Angle, the effective aperture θ of lens arra 12 is 17～20 ° for as half-angle, and LED10 carries out luminous basically with Lan Baixun (Lambertian) distribution, and the light utilization ratio is extremely low.Distribute in luminous LED luminous with Lan Baixun, being situated between is communicated to the light quantity of photosensitive drums 14 by lens arra 12, have only about 3～5%.That is, there are 95～97% not utilizations of the luminous quantity of LED, the problem that the light utilization ratio is extremely low.
In order to improve the light utilization ratio, consider to narrow down by making the luminous directionality of LED as far as possible by above the LED illuminating part, disposing microlens array, be added to the light in the angular aperture that is mapped to lens arra.But, usually, the illuminating part of the employed led array of optical printer, as shown in Figure 2, electrode 20 is projected into the zone of illuminating part 22, blocked central near, its result, as shown in Figure 2, the shape that is shaped as approximate U font in the zone of illuminating part 22.When utilization general microlens array 18 as shown in Figure 3 comes its directionality of constriction, expectation utilizes with near the light the lens axis shown in the dotted line 24, but just in time corresponding near the optical axis of lens with the position of electrode 20, its result, existence can not fully improve the problem of light utilization ratio.
Led array with microlens array opens the spy that flat 9-109455 communique, spy are opened the 2000-347317 communique, the spy opens record to some extent in the 2001-36144 communique, but above problem points is not discussed, and therefore is not the document about lenticular shape.
Above problem not only is suitable for LED, also is suitable for other light-emitting component.
Summary of the invention
The objective of the invention is to: the light utilization ratio of the picture that improves the illuminating part utilize lens arra to make light-emitting device array light-emitting device array imaging, that use in the optical printer on photosensitive drums.
Other purposes of the present invention are, a kind of light-emitting component that has lens that the light utilization ratio is improved is provided.
Further other purpose of the present invention is, a kind of light-emitting device array that has lens that the light utilization ratio is improved is provided.
Further other purpose of the present invention is, the manufacture method of a kind of picture that has improved the illuminating part that utilizes lens arra to make light-emitting device array light-emitting component that has lens of the light utilization ratio of light-emitting device array imaging, that use in the optical printer on photosensitive drums is provided.
A kind of light-emitting component that has lens of the present invention, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, cover the antireflection film in described illuminating part zone, and the lens that on the described antireflection film surface on the described light-emitting component, are provided with, wherein, described lens are to have the compound lens that forms in abutting connection with configuration along the part of each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone.Antireflection film is a monofilm, and its refractive index has the refractive index in illuminating part zone and the value of the centre of the refractive index of the resin that constitutes described lens.
In addition, the invention provides a kind of light-emitting component that has lens, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, cover the antireflection film in described illuminating part zone, and the lens that on the described antireflection film surface on the described light-emitting component, are provided with, wherein, described lens are the parts that have along each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone, the compound lens that forms in abutting connection with configuration with a part that is centered close to the two ends that are connected the line segment of the position of luminous intensity maximum in the described illuminating part zone or each spherical lens near a plurality of spherical lenses it.
In addition, the invention provides a kind of light-emitting component that has lens, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, and be arranged on the described light-emitting component, by having the compound lens that forms in abutting connection with configuration along the part of each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone.
In addition, the invention provides a kind of light-emitting component that has lens, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, and be arranged on the described light-emitting component, by having along the part of each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone, the compound lens that forms in abutting connection with configuration with a part that is centered close to the two ends that are connected the line segment of the position of luminous intensity maximum in the described illuminating part zone or each spherical lens near a plurality of spherical lenses it.
In addition, the invention provides a kind of optical system, via compound lens and rod type lens array, the light quantity distribution of the pixel picture in the illuminating part zone of formation light-emitting component on photosensitive drums, it is characterized in that, being shaped as of described illuminating part zone is similar to the U font, and the light quantity distribution of the light quantity distribution of the pixel picture that on described photosensitive drums, forms when not having described compound lens, the part that the light quantity of pixel inconocenter part is low disappears, wherein, the line that connects the position of luminous intensity maximum in the described illuminating part zone is during for the approximate U font that is made of 3 line segments, described compound lens the serve as reasons two ends that are centered close to each line segment or the part of each spherical lens near 4 spherical lenses it, has the compound lens that the part of each cylindrical lens in 3 cylindrical lenss of the axle that is parallel to described line segment forms in abutting connection with configuration with pars intermedia at each line segment.
In addition, the invention provides a kind of optical system, via compound lens and rod type lens array, the light quantity distribution of the pixel picture in the illuminating part zone of formation light-emitting component on photosensitive drums, it is characterized in that, being shaped as of described illuminating part zone is similar to the U font, and the light quantity distribution of the light quantity distribution of the pixel picture that on described photosensitive drums, forms when not having described compound lens, the part that the light quantity of pixel inconocenter part is low disappears, wherein, the line that connects the position of luminous intensity maximum in the described illuminating part zone is during for the approximate U font that is made of 3 line segments, the described compound lens compound lens that the part of each spherical lens near the centre position that is centered close to each line segment 3 spherical lenses forms in abutting connection with configuration of serving as reasons.
In addition, the invention provides a kind of light-emitting component that has lens, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, cover the antireflection film in described illuminating part zone, and the lens that on the described antireflection film surface on the described light-emitting component, are provided with, wherein, the line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments, described lens are compound lenses that the part of each spherical lens near 3 spherical lenses that are centered close to the centre position of each line segment forms in abutting connection with configuration.
In addition, the invention provides a kind of light-emitting component that has lens, it is characterized in that, have: the light-emitting component that on Semiconductor substrate, has the illuminating part zone, and be arranged on lens on the described light-emitting component, wherein, the line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments, described lens are compound lenses that the part of each spherical lens near 3 spherical lenses that are centered close to the centre position of each line segment forms in abutting connection with configuration.
In addition, if use the bigger resin of refractive index to form lens, also can on illuminating part, directly form lens and use.
The lens that have the light-emitting component of lens of the present invention are not single spherical lenses, but make up the compound lens of a plurality of spherical lenses or a plurality of spherical lens and cylindrical lens.
The design of this compound lens is following carrying out.
(1) on the curve of the position that is centered close to the luminous intensity maximum that connects light-emitting component of lens or the broken line or with this line adjoining position on the part of a plurality of spherical lenses in abutting connection with the compound lens of configuration, perhaps have along the compound lens of the part of the curve-like of the axle of this line or the cylindrical lens of polyline shaped, the perhaps compound lens of the part of the part of combinatorial sphere lens and cylindrical lens in abutting connection with configuration.
(2) curve of the position of the luminous intensity maximum of connection light-emitting component or broken line are when being similar to the U font, at each two ends of 3 line segments of approximate U font or the part of spherical lens is set near it, part is provided with cylindrical lens therebetween, with its compound lens that forms in abutting connection with configuration.
In addition, at this so-called approximate U font, just the curve of the position of the luminous intensity maximum of expression connection light-emitting component or broken line integral body form approximate U font.
(3) during the light-emitting component identical, near the part of 3 spherical lenses the centre position that is centered close to 3 line segments that constitute approximate U word shape is set, with its compound lens that forms in abutting connection with configuration with above-mentioned (2).
Therefore, the light-emitting component that has lens of the present invention, it is characterized in that, have: light-emitting component with illuminating part zone, and, be arranged on the described light-emitting component, connect by being centered close to of lens on the line of position of luminous intensity maximum in described illuminating part zone or with this line adjoining position on a plurality of spherical lenses a part in abutting connection with configuration or by having compound lens along the part of a plurality of cylindrical lenss of the axle of described line in abutting connection with configuration or that form in abutting connection with configuration by the part of the part of described spherical lens and cylindrical lens.
The line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments, described compound lens has for the part of the two ends that are centered close to each line segment or near 4 spherical lenses it, with pars intermedia at each line segment that the part of 3 cylindrical lenss of the axle that is parallel to described line forms in abutting connection with configuration.
In addition, connect the line of the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that is made of 3 line segments, described compound lens is near the part of 3 spherical lenses the centre position that is centered close to each line segment forms in abutting connection with configuration.
In addition, the 1st form of the manufacture method of the light-emitting component that has lens of the present invention is characterized in that, comprising:
(a) operation of preparation light-emitting device array substrate,
(b) operation of preparation glass substrate,
(c) operation of formation etching block film on described glass substrate,
(d) operation of formation aperture array on described etching block film,
(e) by the liquid phase etching, on the described glass substrate of the bottom of described aperture array, form the operation of recess array,
(f) remove the etching block film of the part of described recess array, make the operation of finishing die,
(g) operation of coating light-cured resin at least one surface of the recess array of described finishing die and light-emitting device array substrate,
(h) the described light-cured resin of clamping makes described finishing die and described light-emitting device array substrate contacts, and pressurization launches the operation of described light-cured resin,
(i) from the described light-cured resin irradiates light of described finishing die side direction, make the operation of the light-cured resin curing of the part of having removed described etching block film,
(j) peel off the operation of described finishing die and described light-emitting device array substrate, and,
(k) clean the operation of removing the uncured light-cured resin on the described light-emitting device array substrate.
The 2nd form of the manufacture method of the light-emitting component that has lens of the present invention is characterized in that, comprising:
(a) prepare to have carried out the operation of the light-emitting device array substrate sheltered with adhesive tape para-linkage pad portion,
(b) operation of preparation glass substrate,
(c) operation of formation etching block film on described glass substrate,
(d) operation of formation aperture array on described etching block film,
(e) by the liquid phase etching, on the described glass substrate of the bottom of described aperture array, form the operation of recess array,
(f) remove described etching block film, make the operation of finishing die,
(g) at least one surface of the recess array of described finishing die and light-emitting device array substrate, the operation of coating light-cured resin,
(h) the described light-cured resin of clamping makes described finishing die and described light-emitting device array substrate contacts, and pressurization launches the operation of described light-cured resin,
(i) from the described light-cured resin irradiates light of described finishing die side direction, the operation that described light-cured resin is solidified,
(j) peel off the operation of described finishing die and described light-emitting device array substrate, and,
(k) time from the described adhesive tape of described light-emitting device array strippable substrate, remove adhesive tape top curing the operation of light-cured resin.
Described lens, the array of spherical lens or non-spherical lens normally is more preferably about compound lens of the present invention sometimes according to the shape in illuminating part zone.
Description of drawings
Fig. 1 is the figure of the exemplary configuration example of employed led array, refractive index distribution type rod lens array, photosensitive drums in the expression optical printer in the past.
Fig. 2 is the figure of the shape in expression illuminating part zone.
Fig. 3 be expression use in the past have the led array of lens the time towards the figure of the state of the light of photosensitive drums.
Fig. 4 A is the figure of the corresponding relation of the illuminating part of approximate U font of the LED among the embodiment of the expression light-emitting component that has lens of the present invention and compound lens.
Fig. 4 B is the plane graph of the structure of expression compound lens.
Fig. 5 is that the led array that has lens of the present invention, the figure of the situation of irradiates light on photosensitive drums are used in expression.
Fig. 6 A is the figure of expression light quantity distribution of the pixel picture of LED when compound lens is arranged.
Fig. 6 B is the figure of expression light quantity distribution of the pixel picture of LED when not having compound lens.
Fig. 7 is other the figure of execution mode of the expression light-emitting component that has lens of the present invention.
Fig. 8 is the profile that expression has formed the light-emitting component that has lens of antireflection film.
Fig. 9 is the figure of the equivalent circuit of expression self-scanning light-emitting element array.
Figure 10 is the figure of the chip of expression self-scanning light-emitting element array.
Figure 11 is a part of enlarged drawing that expression is provided with the illuminating thyristor array of compound lens array.
Figure 12 is the side view of expression Figure 11.
Figure 13 is the figure of the operation of the expression luminous thyristor array that has lens of making self-scanning light-emitting element array.
Figure 14 is that expression has the plane graph of quartz glass substrate that pattern has formed the Cr film of aperture array.
Figure 15 is the figure of situation of the cutting of expression wafer.
Figure 16 is the figure of operation that makes the luminous thyristor array that has lens of self-scanning light-emitting element array.
Figure 17 is the figure that expression is provided with the chip of jointing tape.
Figure 18 is that expression has the plane graph of quartz glass substrate that pattern has formed the Cr film of aperture array.
Embodiment
Below, be elaborated for the execution mode that has the light-emitting component of lens of the present invention with reference to the accompanying drawings.
＜execution mode 1 〉
The light-emitting component that has lens of the present invention, shown in Fig. 4 A, the illuminating part 22 for the approximate U font of LED is provided with compound lens 30 thereon.
The position that links the luminous intensity maximum of the illuminating part that is similar to the U font forms broken line 32.Setting is centered close to the two ends of each section of 3 line segments of this broken line 32 or near the part of 4 spherical lenses it, and the intermediate portion is set has a part with 3 cylindrical lenss of the parallel respectively axle of 3 sections lines, they form compound lens 30 in abutting connection with configuration.
The material of this compound lens has used epoxies or propylene resin.
Fig. 4 B is the plane graph of the structure of expression compound lens 30.Among the figure, point 33,34,35,36,3 line segment 32a, 32b of the approximate U font broken line 32 shown in the presentation graphs 4A, the two ends separately of 32c.Compound lens 30 comprises: 33 be the part 43 of the spherical lens at center to put, 34 be the part 44 of the spherical lens at center to put, 35 be the part 45 of the spherical lens at center to put, be the part 46 of the spherical lens at center to put 36.Compound lens 30 further comprises: have the cylindrical lens 48 of parallel with line segment 32a axle a part, have the cylindrical lens 50 of the axle parallel with line segment 32b a part, have the part of the cylindrical lens 52 of the axle parallel with line segment 32c.The part of the part of these 4 spherical lenses and 3 cylindrical lenss, adjacent as shown in the figure configuration.
Among Fig. 4 B,, also show X-X ' line profile and Y-Y ' line profile for the ease of understanding the shape of compound lens.
So, compound lens 30 is to make the axle of the optical axis center of spherical lens or cylindrical lens consistent with the each several part of approximate U font illuminating part 22, the lens of the part of compound this spherical lens and the special shape of cylindrical lens.
By utilizing the consistent compound lens of illuminating part shape of this and approximate U font, can use the each several part of compound lens for the each several part of approximate U font illuminating part respectively, make light-emitting line to optical axis direction, be the direction refraction of rod-shaped lens, the luminous directionality of constriction also becomes possibility on the direction of rod-shaped lens.Represented its situation among Fig. 5.
Utilize the compound lens 30 of present embodiment, the light quantity distribution of the pixel picture of the LED that on photosensitive drums 14, forms by rod type lens array 12 of being situated between, as shown in Figure 6A.Light quantity distribution (Fig. 6 B) when not having compound lens, the part that the light quantity of pixel center part is low disappears, and becomes good distribution.Measure the light quantity of this moment, then compare when not having compound lens, become 1.7 times lightness.
More than, according to the embodiment of the present invention, confirmed that the light utilization ratio that has the light-emitting component of lens of the present invention improves effect.
In addition, compound lens of the present invention for example is, as shown in Figure 7, be centered close to separately approximate U font illuminating part 22 on the part of 3 spherical lenses, be combined into the shape of " clover " shape, also can obtain same effect.
This compound lens, following design.The position that links the luminous intensity maximum of the LED illuminating part that is similar to the U font forms broken line 32.Near the part of 3 spherical lenses 63,64,66 the centre position of 3 line segments that center 53,54,56 is positioned at this broken line 32 is set, and with it in abutting connection with configuration.
Usually, the refractive index of the illuminating part that is made of semiconductor is 3.2～3.7, and particularly the refractive index of the GaAs based semiconductor of the LED that uses in the LED printer is 3.3～3.6.The light that sends from this semiconductor directly enters into air, then since with the reflection at the interface of air, the taking-up efficient of light significantly reduces.In addition, because the refractive index of the resin of compound lens is also little than semi-conductive refractive index usually, so reflect at the interface of semiconductor and resin.
In the present invention, be provided with resin lens for the utilization ratio that improves light, thereby because the reflection at interface, the taking-up efficient of light reduces, and its effect has also just been lost.Therefore, be necessary to consider the refractive index of resin lens, take to prevent the measure of the taking-up inefficiency of light.Among the present invention,, on the illuminating part surface, be provided with the antireflection film that constitutes by transparent dielectric in order to reduce reflection at the interface at illuminating part and resin lens.
Fig. 8 represents to be provided with the section of execution mode of the light-emitting component that has lens of this antireflection film.LED is on GaAs substrate 90, and growth n-AlGaAs layer 91 and p-AlGaAs layer 92 form p lateral electrode 93, n lateral electrode 94 and constitute.On the illuminating part surface of LED, form the SiN film 95 of 1 layer of refractive index 1.8～2.1, and then form resin lens 96 as antireflection film.
The refractive index of the AlGaAs illuminating part of Shi Yonging is 3.5～3.6 in the present embodiment, and the refractive index of SiN film is 1.8～2.1, and the refractive index of resin lens is 1.47～1.7.
The refractive index of AlGaAs illuminating part is 3.5～3.6 o'clock, is 96～99nm (perhaps 470～490nm) with thickness for the corresponding SiN film of the conditioned reflex of emission wavelength 780nm.By the formation of this SiN film, can obtain the light transmission rate more than 93%.Measure the light quantity of this moment, then compare when not having lens, obtain 2.2 times lightness.
In the above-described embodiment, used the SiN film as antireflection film, but be not limited to this.Can use so long as have the transparent material of refractive index of median of the refractive index of the refractive index of illuminating part and resin lens.In addition, antireflection film is not limited to monofilm, also can be to be made of a plurality of stack membranes.
In addition, if utilize the bigger resin of refractive index to form lens, compare with the luminous situation of directly taking out self-luminescent part from air, the reflection on semiconductor surface diminishes.Therefore, also can antireflection film be set, on illuminating part, directly form lens and use.
(execution mode 2)
In execution mode 1, for being illustrated with the situation of led array as light-emitting device array.
In the present embodiment, as light-emitting device array, used so-called " self-scanning light-emitting element array ".At this moment, confirmed that also light utilization ratio same as described above improves effect.
Self-scanning light-emitting element array, use has the inscape of the luminous thyristor of pnpn structure as light-emitting device array, and formation can realize that the element of the self-scanning of light-emitting component opens flat 1-238962 communique, spy the spy and open that flat 2-14584 communique, spy are opened flat 2-92650 communique, the spy opens flat 2-92651 communique has disclosed.In addition, open the self-scanning light-emitting element array that discloses the structure that the transmission element arrays is separated as displaced portions, with light-emitting device array as illuminating part in the flat 2-263668 communique the spy.
The equivalent circuit diagram of the self-scanning light-emitting element array of expression divergence type among Fig. 9.This self-scanning light-emitting element array is by transmission thyristor T
1, T
2, T
3... and write with luminous thyristor L
1, L
2, L
3... constitute.The structure of displaced portions has been utilized the diode connection.V
GKBe power supply (being generally 5V), from from power line 72 via each load resistance R
LBe connected to the gate electrode G of each transmission with thyristor
1, G
2, G
3....In addition, the transmission gate electrode G of thyristor
1, G
2, G
3..., also be connected on the gate electrode that writes with luminous thyristor.At transmission thyristor T
1Gate electrode on apply start pulse Φ
S, on passing on, alternately apply transmission clock pulse Φ with the positive electrode of thyristor
1, Φ
2These clock pulse are supplied with via clock pulse line 74,76.Write on the positive electrode with luminous thyristor, be applied in write signal Φ via holding wire 78
I
Figure 10 represents the chip 80 of this self-scanning light-emitting element array.At the chip two ends bonding welding pad 82 is set, arranges the illuminating part (approximate U font) of illuminating thyristor along the edge part linearity ground of chip.In addition, for transmission thyristor array, omit diagram.
The present invention can be used in the illuminating thyristor array of self-scanning light-emitting element array as above.Represented to be provided with a part of enlarged drawing of the illuminating thyristor array of compound lens array among Figure 11.This amplifier section is equivalent to the part that centers on dotted line among Figure 11.Figure 12 has represented the side of Figure 11.
From Figure 11 and Figure 12 as can be known: on the array of the illuminating part 84 of the approximate U font of illuminating thyristor, be provided with the illustrated array that constitutes by compound lens 30 in the execution mode 1.
Then, the above-mentioned manufacture method that has the light-emitting device array of lens is described.
Below, an example in the method that is used for forming on the self-scanning light-emitting element array of optical printer lens is described.
Among Figure 13, the operation of the luminous thyristor array that has lens of self-scanning light-emitting element array is made in expression.In addition, lens are to form compound lens illustrated among Fig. 4 A and Fig. 4 B.
At first, shown in the operation (A) of Figure 13, coating Cr film 102 is followed the array that forms opening 104 by photoetching technique on the Cr film on quartz glass substrate 100.The spacing of opening 104, corresponding with printer exploring degree 600DPI (dots per inch), be 42.3 μ m.
Figure 14 represents to have formed with pattern the plane graph of quartz glass substrate of the Cr film of this aperture array.The shape of each opening 104 as shown is approximate U font, the length of 1 line segment be 16 μ m, wide be 2 μ m.This opening, the position basically identical of the light quantity maximum of the approximate U font light-emitting zone of its position and illuminating thyristor.Under the situation of general spherical lens, opening can be simple small round opening (opening directly is about 1～5 μ m).
Then, utilize fluoric acid that the quartz glass substrate 100 with the Cr film is carried out the liquid phase etching, make the recess 106 shown in the operation (B) of Figure 13.The shape of recess, the shape that disposes the compound lens that forms with spherical lens that illustrates among Fig. 4 A and Fig. 4 B and cylindrical lens fluid-tight engagement is corresponding.
Now, in Figure 14, establish the end of approximate U font opening 104 and bight and be as shown in the figure a, b, c, d.
Glass substrate is by the isotropically etching of fluoric acid quilt.Therefore, end a, d and bight b, the c from opening 104 is etched into hemispherical.In addition, the pars intermedia from pars intermedia, bight c and the end d of pars intermedia, bight b and the bight c of end a and bight b is etched into cylindric.Therefore, formed shape corresponding concave part shape with the compound lens shown in Fig. 4 A and Fig. 4 B.
Thereafter, for etched and Cr film 102 that float, paste bonding film (not shown) after, by giving as security elastomeric substrate it is broken, divest bonding film, remove the Cr film of etched part.In the operation of Figure 13 (C), represented its state.This as pressing mold (shaping mould) 108, is used for following operation.
After release agent application on the surface of pressing mold 108, shown in the operation (D) of Figure 13,, drip, adhere to the non-involvement bubble light (ultraviolet ray) cured resin 110 by distributor.Light-cured resin adopts the resin with following characteristic.
Cure shrinkage: smaller or equal to 6%
Viscosity: 100～2000cP (25 ℃)
Solidify back hardness: H～5H
Adhesive strength: more than or equal to 5kg/mm Φ
As kind, epoxies or propylene class are arranged, can use any.In addition, in order to solidify in semiconductor component surfaces as described later, do not wish to make the heat reactive resin that needs heating.
Then, shown in the operation (E) of Figure 13, on resin 110, load the light-emitting device array wafer 112 of the formation operation of having finished luminous thyristor.Be formed with a plurality of self-scanned light-emitting device array chips on the wafer 112.The two ends of chip are provided with bonding welding pad 82, and the illuminating part of illuminating thyristor (approximate U font) 84 arranged along the edge part linearity ground of chip.Owing to must form compound lens with shape (the approximate U font) aligned position of the illuminating part of luminous thyristor, so need carry out accurate position alignment to wafer 112 and pressing mold 108.For this reason, wafer 112 and pressing mold 108 are provided with the position alignment mark respectively, utilize it to carry out position alignment.At this moment, remaining Cr film 102, opposed with the bonding welding pad 82 of chip.
After contact light-cured resin 110 and the wafer 112, the expansion resin of exerting pressure.In addition, luminous thyristor face and the distance above the lens are by selecting to obtain resin coating amount, plus-pressure, pressing time optimization.
For resin 110 is solidified, see through pressing mold 108 illumination wavelength 300～400nm, energy 14000mJ/cm
2 Ultraviolet ray 114, make resin solidification.Ultraviolet energy is according to the resin that uses and its optimal value difference.The typical value of using is 5000～20000mJ/cm
2About.
Ultraviolet ray collimates to the ultraviolet ray that the ejecting end from fiber bundle penetrates by utilizing quartz lens, becomes the light of almost parallel, and its ground, the back side that is approximately perpendicular to pressing mold 108 is shone.
Shown in the operation (F) of Figure 13, make the pressing mold demoulding after, remove uncured resin (beyond the Cr of lens component film is removed part) with solvent clean owing to shading has been carried out in ultraviolet ray, so not curing of resin with the Cr film.Its result is shown in the operation (G) of Figure 13.As can be known, formed compound lens 30 on the illuminating part 84 of luminous thyristor, bonding welding pad 82 exposes.
As shown in figure 15, cut off the as above wafer 120 of made, can make the self-scanned light-emitting device array chip 122 of the compound lens array that a part with spherical lens as shown in figure 12 and cylindrical lens be composited.
In above-mentioned example to pressing mold drip, application of resin, also can be in light-emitting device array wafer side application of resin.Perhaps, also can be on pressing mold and light-emitting device array wafer application of resin.Also can be according to the character of resin, consider the lubricant nature of being stained with of glass or Semiconductor substrate, the method for selecting the generation of bubble etc. less, can equally applying.In addition, having used ultraviolet ray in above-mentioned example, also can be visible light.At this moment, should adopt resin by visible-light curing.
Then, other example in the method that is used for forming on the self-scanning light-emitting element array of optical printer lens is described.
Figure 16 represents to make the operation of the luminous thyristor array that has lens of self-scanning light-emitting element array.In addition, lens are for forming the lens of the compound lens that illustrates among Fig. 4 A and Fig. 4 B.Among Figure 16, to the inscape identical with Figure 13, additional identical Ref. No. is represented.
At first, shown in the operation (A) of Figure 16, coating Cr film 102 is followed the array that forms opening 104 by photoetching technique on the Cr film on quartz glass substrate 100.Figure 14 is the plane graph of quartz glass substrate that has formed the Cr film of this aperture array with pattern.
Then, utilize fluoric acid that the quartz glass substrate 100 with the Cr film is carried out the liquid phase etching, make the recess 106 shown in the operation (B) of Figure 16.The shape of recess, the shape that disposes the compound lens that forms with spherical lens that illustrates among Fig. 4 A and Fig. 4 B and cylindrical lens fluid-tight engagement is corresponding.
Remove whole Cr film 102 thereafter.In the operation of Figure 16 (C), represented its state.This as pressing mold (shaping mould) 130, is used for following operation.In addition, also can after removing the Cr film, carry out etching once more, enlarge recess 106.
On the other hand, shown in the operation (D) of Figure 16, the surface of luminous thyristor array chip 112 for the part that comprises bonding welding pad 82, utilizes resinous splicing tape 132 to apply the mask of wire.In addition, show in the present embodiment liner part with splicing tape 132 wire apply the example of mask, but need not have in other linear parts etc. of exposing the part of electric conductor or cutting off the separation unit element from wafer to apply mask with splicing tape similarly under the situation in zone of resin.Just, behind the resin solidification, in order to peel off this splicing tape, the end of splicing tape 132 need be stretched out outside resin bed.
For precision well adhesive tape joining to a plurality of assigned positions of wafer surface, can adopt following method.At first, prepare quartz glass substrate, by printing or mint-mark etc. mask pattern is shown in its surface, and the mark that is used for carrying out with wafer position alignment is shown simultaneously.As this splicing tape, adopt the adhesive tape that on the resin two sides, has adhesives.Just, the adhesives on face is for promptly losing the material of cementability by ultraviolet irradiation.To lose a side of cementability in this two sides adhesive resin band by ultraviolet irradiation, paste the front of paying at above-mentioned glass substrate.Thereafter, the mask pattern shown on the glass substrate cuts adhesive tape, removes the unwanted part of not using as mask.
This glass substrate and luminous thyristor array chip are carried out aligned in position, utilize the bonding force of tape surface to be fitted on the wafer surface.Then,, lose, remove glass substrate by making the bonding force between glass substrate and the adhesive tape from glass substrate side irradiation ultraviolet radiation.
Figure 17 represents to be bonded with the luminous thyristor array chip 112 of adhesive tape 132.Comprising the part that engages liner 82 with 132 pairs of splicing tapes shelters.
Applied on the luminous thyristor array chip 112 of mask at this, behind the coating ultraviolet curable resin 110, shown in the operation (E) of Figure 16, the surface is pushed the pressing mold 130 that has applied release agent, pressurization launches resin, makes resin solidification from die-side irradiation ultraviolet radiation 114.
At last, shown in the operation (F) of Figure 16, after making pressing mold 130 demouldings, by splicing tape 132 to being applied to luminous thyristor array chip 112, peel off by the every block of resin that solidifies on it, shown in the operation (G) of Figure 16, made lens arra at assigned position, removed resin from bonding welding pad 82.
In addition, the bonding welding pad of peeling off behind the splicing tape 132 82 has kept conductivity, does not particularly have uncured resin, does not need to remove by cleaning etc.
In addition, luminous thyristor face and the distance above the lens, optimization by adjusting resin coating amount, plus-pressure, pressing time, splicing tape thickness.
In the execution mode of 2 kinds of above manufacture methods, be to be illustrated for the lens arra that does not have antireflection film at the interface at illuminating part and resin lens.Be provided with under the situation of antireflection film, in the formation operation of luminous thyristor, also comprising the formation of antireflection film.
More than in the making of Shuo Ming the luminous thyristor array that has lens, the lens of the shape shown in Fig. 4 A and Fig. 4 B have been formed, as compound lens.Under the situation of the compound lens that has formed shape shown in Figure 7, in Figure 13 or operation shown in Figure 16, used the quartz glass substrate 124 that has formed the Cr film of aperture array as shown in figure 18 with pattern.Opening 126 is made of three that are positioned at vertex of a triangle small circular open 126a, 126b, 126c, and arranges equally spacedly.The position of small circular open, corresponding with point 53,54,56 shown in Figure 7.
Utilize fluoric acid that subsidiary quartz glass substrate with Cr film of this aperture array is carried out etching, then isotropically carry out etching from each minute opening.Therefore, carry out etching hemispherically, form shape corresponding concave part shape with compound lens shown in Figure 7 from each small circular open.
Can easily understand and to be formed as described above pressing mold,, make the self-scanned light-emitting device array chip that has compound lens through operation same as described above.
According to the light-emitting component that has lens of the present invention,, can improve utilization ratio with the luminous light of Lan Baixun distribution carrying out by lens shaped is become compound lens.
In addition, manufacturing method according to the invention can form the light-emitting device array that has compound lens.By utilizing this light-emitting device array that has compound lens, can guide to rod-shaped lens to light-emitting line effectively, can improve the light utilization ratio significantly.
Claims (27)
1. light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone,
Cover the antireflection film in described illuminating part zone, and
The lens that on the described antireflection film surface on the described light-emitting component, are provided with,
Wherein,
Described lens are to have the compound lens that forms in abutting connection with configuration along the part of each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone.
2. light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone,
Cover the antireflection film in described illuminating part zone, and
The lens that on the described antireflection film surface on the described light-emitting component, are provided with,
Wherein,
Described lens are the compound lenses that have a part along each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment that connects the position of luminous intensity maximum in the described illuminating part zone, form in abutting connection with configuration with a part that is centered close to the two ends that are connected the line segment of the position of luminous intensity maximum in the described illuminating part zone or each spherical lens near its a plurality of spherical lenses.
3. the light-emitting component that has lens according to claim 2, wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments,
Described compound lens, for the part of each cylindrical lens in the part of the two ends that are centered close to each line segment or each spherical lens near 4 spherical lenses it and 3 cylindrical lenss forms in abutting connection with configuration, each cylindrical lens in described 3 cylindrical lenss has the axle that is parallel to described line segment at the pars intermedia of described each line segment.
4. according to each described light-emitting component that has lens of claim 1～3, wherein,
Described compound lens is made of resin.
5. the light-emitting component that has lens according to claim 4, wherein, described antireflection film is a monofilm, its refractive index has the refractive index in described illuminating part zone and the value of the centre of the refractive index of the resin that constitutes described lens.
6. the light-emitting component that has lens according to claim 5, wherein, described antireflection film is made of silicon nitride.
7. light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone, and
Be arranged on the described light-emitting component, by having the compound lens that forms in abutting connection with configuration along the part of each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment of the position of luminous intensity maximum in the described illuminating part of the connection zone.
8. light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone, and
Be arranged on the described light-emitting component, by the compound lens that has a part, forms in abutting connection with configuration with a part that is centered close to the two ends that are connected the line segment of the position of luminous intensity maximum in the described illuminating part zone or each spherical lens near a plurality of spherical lenses it along each cylindrical lens in a plurality of cylindrical lenss of the axle of the line segment that connects the position of luminous intensity maximum in the described illuminating part zone.
9. the light-emitting component that has lens according to claim 8, wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments,
Described compound lens, for the part of each cylindrical lens in the part of the two ends that are centered close to each line segment or each spherical lens near 4 spherical lenses it and 3 cylindrical lenss forms in abutting connection with configuration, each cylindrical lens in described 3 cylindrical lenss has the axle that is parallel to described line segment at the pars intermedia of described each line segment.
10. according to each described light-emitting component that has lens of claim 7～9, wherein, described compound lens is made of resin.
11. a light-emitting device array that has lens is characterized in that, the described light-emitting component that has lens of a plurality of claims 7 shape that is arranged in a straight line is formed.
12. the light-emitting device array that has lens according to claim 11, wherein, described light-emitting component is a light-emitting diode.
13. the light-emitting device array that has lens according to claim 11, wherein, described light-emitting component is luminous thyristor.
14. a self-scanning light-emitting element array is characterized in that, comprises the described light-emitting device array that has lens of claim 13.
15. a write head has the described light-emitting device array that has lens of claim 11.
16. an optical printer has the described write head of claim 15.
17. an optical system, via compound lens and rod type lens array, the light quantity distribution of the pixel picture in the illuminating part zone of formation light-emitting component is characterized in that on photosensitive drums,
Being shaped as of described illuminating part zone is similar to the U font, and
The light quantity distribution of the light quantity distribution of the pixel picture that on described photosensitive drums, forms when not having described compound lens, the part that the light quantity of pixel inconocenter part is low disappears, wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone is during for the approximate U font that is made of 3 line segments, the serve as reasons part of the two ends that are centered close to each line segment or each spherical lens near 4 spherical lenses it and have the compound lens that the part of each cylindrical lens in 3 cylindrical lenss of the axle that is parallel to described line segment forms in abutting connection with configuration at the pars intermedia of each line segment of described compound lens.
18. an optical system, via compound lens and rod type lens array, the light quantity distribution of the pixel picture in the illuminating part zone of formation light-emitting component is characterized in that on photosensitive drums,
Being shaped as of described illuminating part zone is similar to the U font, and
The light quantity distribution of the light quantity distribution of the pixel picture that on described photosensitive drums, forms when not having described compound lens, the part that the light quantity of pixel inconocenter part is low disappears, wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone is during for the approximate U font that is made of 3 line segments, the described compound lens compound lens that the part of each spherical lens near the centre position that is centered close to each line segment 3 spherical lenses forms in abutting connection with configuration of serving as reasons.
19. as claim 17 or 18 described optical systems, wherein,
Described compound lens is formed on the described light-emitting component.
20. as claim 17 or 18 described optical systems, wherein,
Described light-emitting component is a light-emitting diode.
21. as claim 17 or 18 described optical systems, wherein,
Described light-emitting component is luminous thyristor.
22. as claim 17 or 18 described optical systems, wherein,
Described light-emitting component is a light emitting diode matrix.
23. as claim 17 or 18 described optical systems, wherein,
Described light-emitting component is luminous thyristor array.
24. a write head has claim 22 or 23 described optical systems.
25. an optical printer has the described write head of claim 24.
26. a light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone,
Cover the antireflection film in described illuminating part zone, and
The lens that on the described antireflection film surface on the described light-emitting component, are provided with,
Wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments,
Described lens are compound lenses that the part of each spherical lens near 3 spherical lenses that are centered close to the centre position of each line segment forms in abutting connection with configuration.
27. a light-emitting component that has lens is characterized in that having:
The light-emitting component that on Semiconductor substrate, has the illuminating part zone, and
Be arranged on the lens on the described light-emitting component,
Wherein,
The line that connects the position of luminous intensity maximum in the described illuminating part zone, during for the approximate U font that constitutes by 3 line segments,
Described lens are compound lenses that the part of each spherical lens near 3 spherical lenses that are centered close to the centre position of each line segment forms in abutting connection with configuration.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP182604/2003 | 2003-06-26 | ||
| JP2003182604 | 2003-06-26 | ||
| JP182610/2003 | 2003-06-26 | ||
| JP084182/2004 | 2004-03-23 | ||
| JP088330/2004 | 2004-03-25 | ||
| JP166560/2004 | 2004-06-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1813358A CN1813358A (en) | 2006-08-02 |
| CN100546056C true CN100546056C (en) | 2009-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800179317A Expired - Fee Related CN100546056C (en) | 2003-06-26 | 2004-06-24 | The light-emitting component that has lens with and manufacture method |
Country Status (1)
| Country | Link |
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| CN (1) | CN100546056C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4703219A (en) * | 1983-11-04 | 1987-10-27 | Thomson-Csf | Optical device for concentrating the light radiation emitted by a light emitting diode, and a light emitting diode comprising a device of this nature |
| US5633527A (en) * | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
| CN1073511C (en) * | 1994-10-05 | 2001-10-24 | 罗姆股份有限公司 | LED printing head |
| EP1191608A2 (en) * | 2000-09-12 | 2002-03-27 | LumiLeds Lighting U.S., LLC | Light emitting diodes with improved light extraction efficiency |
| CN1103275C (en) * | 1997-12-26 | 2003-03-19 | 日本板硝子株式会社 | Ererting life-size resin array and method of manufacturing it |
-
2004
- 2004-06-24 CN CNB2004800179317A patent/CN100546056C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4703219A (en) * | 1983-11-04 | 1987-10-27 | Thomson-Csf | Optical device for concentrating the light radiation emitted by a light emitting diode, and a light emitting diode comprising a device of this nature |
| CN1073511C (en) * | 1994-10-05 | 2001-10-24 | 罗姆股份有限公司 | LED printing head |
| US5633527A (en) * | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
| CN1103275C (en) * | 1997-12-26 | 2003-03-19 | 日本板硝子株式会社 | Ererting life-size resin array and method of manufacturing it |
| EP1191608A2 (en) * | 2000-09-12 | 2002-03-27 | LumiLeds Lighting U.S., LLC | Light emitting diodes with improved light extraction efficiency |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1813358A (en) | 2006-08-02 |
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