CN100542385C - Metal contact LGA socket - Google Patents

Abstract

A kind of land grid array interconnect structure (2) comprises substrate (6) and a plurality of contact assembly (8).Described substrate has and a plurality ofly runs through it and be arranged in hole (90) in the array.Each described contact assembly comprises the insulating element (112) that keeps conductive contact (110), and each described insulating element is positioned in separately one of them described hole.Each described conductive contact is included in last contact portion (116) of extending on the described substrate and the following contact portion (118) of extending under described substrate.Described insulating element is with its conductive contact and insulation of described substrate separately.

Description

Metal contact lga socket

Technical field

The present invention relates to land grid array (Land Grid Array, LGA) socket and manufacture method thereof.

Background technology

Need with the computer industry of printed circuit board interconnect in have various encapsulation or device.These devices have contact or the soldered ball of placing with 1.0mm centreline spacing and following spacing.These devices are configured to 50 * 50 even bigger array.Consider a plurality of contacts, their center distance and consideration are applied to the power of each contact, can run into variety of issue when these devices are connected to printed circuit board (PCB).

Exist and be used for the socket of this device interconnection to printed circuit board (PCB).U.S. Patent No. 6,247 discloses a kind of such socket in 938, and wherein said socket comprises the housing with hole and is installed in contact in the described hole.Flexible dielectric encapsulating material remains in each hole around the part of each contact and with each contact.Though this socket is applicable to many application, must keep very hour at the socket height, especially under hot environment, socket will be because will there be some problems in unsteadiness and thermal expansion.Other sockets comprise the multiple row conducting polymer, to interconnect between permission device and the printed circuit board (PCB).Yet these devices also can run into some problems.For example, as time passes and after temperature exposure (temperatureexposure) and thermal cycle, conducting polymer may creep.Thereby their elasticity reduces, and the normal force that puts on contact interface also reduces.

Summary of the invention

The problem that solves is how for the land grid array device with high contact density provides interconnection, and it can resist the influence of thermal cycle and material aging.

This problem solves by the land grid array interconnect structure that comprises substrate and a plurality of contact assemblies.Described substrate has and a plurality ofly runs through it and be arranged in hole in the array.Each described contact assembly comprises the insulating element that keeps conductive contact, and each described insulating element is positioned in separately one of them described hole.Each described conductive contact is included in last contact portion of extending on the described substrate and the following contact portion of extending under described substrate.Described substrate is made of metal, and described insulating element is with its conductive contact and insulation of described substrate separately.

Description of drawings

Now with reference to the mode of accompanying drawing by example the present invention is described, wherein:

Fig. 1 is the vertical view of LGA interconnection of the present invention;

Fig. 2 is the end-view of the LGA interconnection shown in Fig. 1;

Fig. 3 is the lower plan view of the LGA interconnection of Fig. 1;

Fig. 4 is the zoomed-in view of specified portions among Fig. 3;

Fig. 5 is the sectional view along Fig. 1 line 5-5;

Fig. 6 is the vertical view of the Socket casing of Fig. 1;

Fig. 7 is the end-view of the Socket casing of Fig. 6;

Fig. 8 is the lower plan view of the Socket casing of Fig. 6 and 7;

Fig. 9 is the zoomed-in view of specified portions among Fig. 7;

Figure 10 is the last plane graph of contact of the present invention bearing substrate;

Figure 11 is the amplifier section of specified portions among Figure 10;

Figure 12 shows the amplifier section of specified portions among Figure 10;

Figure 13 is the end view of contact assembly of the present invention;

Figure 14 illustrates the front view of contact assembly shown in Figure 13;

Figure 15 A illustrates along the sectional view of Figure 13 line 15A-15A;

Figure 15 B illustrates along the sectional view of Figure 13 line 15B-15B;

Figure 16 is an extended view, shows substrate shown in Figure 10 with the local etching structure;

Figure 17 illustrates the expansion bar of terminal stamping parts, shows Overmolded contact before;

Figure 18 is the enlarged drawing of one of them expansion stamping parts;

Figure 19 is the view that is similar to Figure 20, shows the insulating element that is overmolded onto on the contact mid portion;

Figure 20 illustrates substrate, and wherein array of insulative members is loaded in the substrate aperture;

Figure 21 is the sectional view along Figure 20 line 21-21;

Figure 22 illustrates the view that is similar to Fig. 4, and it illustrates the mo(u)ld top half forging mould that is in the appropriate location;

Figure 23 illustrates by the outstanding insulating element figure in hole, and wherein the mo(u)ld bottom half forging mould is in the appropriate location;

Figure 24 illustrates the detailed view at contact assembly top after the cold forming;

Figure 25 illustrates the detailed view of contact assembly bottom after the cold forming;

Figure 26 illustrates along the sectional view of Figure 24 line 26-26;

Figure 27 illustrates along the sectional view of Figure 24 line 27-27;

Figure 28 illustrates the substrate of alternative, and wherein this substrate is configured to directly housing is overmolded in substrate;

Figure 29 illustrates directly Unitarily molded in the housing of substrate;

Figure 30 illustrates the another embodiment of substrate;

Figure 31 illustrates the details of appointment among Figure 30, and it illustrates another location and retaining hole;

Figure 32 illustrates the vertical view of the socket of Fig. 1, and wherein optionally cover spare connects thereon;

Figure 33 is the end view of assembly shown in Figure 32;

Figure 34 is the sectional view along Figure 32 line 34-34;

Figure 35 illustrates the embodiment of the connector with contact, described contact be configured to two groups relative, along center diagonal alignment contact;

Figure 36 illustrates the vertical view of the device of Figure 35;

Figure 37 illustrates along diagonal and is positioned center overstress stops on the substrate;

Figure 38 illustrates the socket that is similar to Figure 35, and it has the contact of being arranged to the relative contact of many groups along many diagonal;

Figure 39 illustrates a plurality of contacts that are molded in the public insulating element, has middle antioverloading parts to provide overload to adjacent contact in the middle of contact;

Figure 40 is one of them contact of Figure 39 and the zoomed-in view of insulating element;

Figure 41 illustrates another the removable insert as the chip stop component;

Figure 42 be depicted as with printed circuit board (PCB) on electroplating ventilating hole interconnection and the detailed view of the contact of design;

Figure 43 illustrates the contact of the Figure 42 that contacts with the single through hole of a plurality of through holes;

Figure 44 illustrates the last perspective view of another embodiment of LGA interconnection of the present invention;

Figure 45 illustrates the following perspective view of the embodiment of Figure 44;

Figure 46 illustrates the decomposition view of various elements of the embodiment of Figure 44;

Figure 47 illustrates the perspective view of first frame parts;

Figure 48 illustrates the following perspective view of present embodiment second frame parts;

Figure 49 illustrates the enlarged perspective of the cover piece of Figure 44 embodiment;

Figure 50 illustrates the perspective view of the substrate of this embodiment;

Figure 51 illustrates the part of the lead frame of punching press, and it illustrates Overmolded contact portion before;

Figure 52 is illustrated in insulating element Overmolded on the lead frame of Figure 51;

Figure 53 illustrates the end view of insulating element shown in Figure 52;

Figure 54 is the sectional view along Figure 53 line 54-54;

Figure 55 is the sectional view along Figure 53 line 55-55;

Figure 56 is the sectional view that is similar to Figure 26;

Figure 57 is the substrate of assembling and the perspective view of upper and lower frame parts;

Figure 58 is the view of observing from its opposition side that is similar to Figure 57 parts;

Figure 59 is the guide wire of alternative shape of the framework and the contact elements of appointment among Figure 58; And

Figure 60 illustrates the zoomed-in view of the core of the substrate of appointment among Figure 58.

Embodiment

The present invention relates to land grid array (LGA) interconnection and manufacture method thereof.When this used, term LGA meaned the many different interconnection of definition.For example, it can be interpreted as representing to be interconnected to the chip of printed circuit board (PCB).Yet it also can interconnect to plate by display plate.In this application, will the present invention be described by the mode that is interconnected to chip.

At first with reference to Fig. 1, it illustrates LGA interconnection 2 and comprises insulation shell 4, the substrate 6 that described insulation shell 4 keeps location also to be attached thereto, wherein substrate 6 shown in fixedly array in a plurality of contact assemblies 8 of supporting.Should be appreciated that by Fig. 1 housing 4 comprises a plurality of perisporiums 10,12,14 and 16, all perisporiums form the inside chip receiving channel, generally represent with Reference numeral 20 at this.Should further be understood that, housing 4 comprises corner standoffs (standoff) or leg 22-28, wherein insulator and contact assembly 8 are so definite, make the part of contact assembly 8 be lower than the plane extension of determining by leg 24,26, as shown in Figure 2, thus each liner on the contact print circuit board.Based on the general aspects of above-mentioned socket, below the details of each element and assembly thereof will be described in further detail.

At first, show the housing 4 that does not have substrate 6 with reference to Fig. 6.Should be appreciated that four sidewall 10-16 comprise each corner standoffs 22-28.Equally, as shown in Figure 6, each corner standoffs comprises Lock Part 30, and it is shown among Fig. 5 best.Locking piece has the top shoulder shown in inclined surface 32 and 34.Except corner standoffs 22-28, each sidewall also comprises insulator 40, and as shown in Figure 7, its mode with coplane is consistent with insulator 24,26.Just, all corner standoffs and all intermediate standoff are configured to be in the same level, so that housing entirely is supported on the plane, and printed circuit board (PCB) for example.Intermediate standoff 40 also comprises Lock Part 42, and this Lock Part has basically and the identical Lock Part of Lock Part 30 (Fig. 5), will illustrate in further detail it at this.At last, shown in Fig. 7-9, each sidewall 10-16 comprises a plurality of positioning salients 50, among Fig. 9 it has been carried out showing in further detail.With 16 lower limb identical protuberance is set along sidewall 12,14.Yet, it should be noted that wall 10 and 16 has the protuberance 50 of different arrangements, also will further specify it at this for polarization (polarize) purpose.

Referring now to accompanying drawing 10, it shows in detail substrate 6 more.As shown in the figure, substrate 6 generally includes side 60, and it is configured to lie on the wall 10; Side 62 lies on the wall 12; Side 64 lies on the wall 14; With side 66, lie on the wall 16.Be also to be noted that each side 60-66 comprises otch at 68 places, it has locking edge at 70 places.Substrate 6 also comprises a plurality of location holes 74, and Figure 11 shows in greater detail it.Location hole has the common bow-shaped structural of being determined by arcuate section 76 and the circular projection that forms as 78 places three positions, to aim at pin 50.Should be understood that equally the polarization mouth 80 that illustrates utilizes housing 4 polarization substrates 6.

As shown in figure 12, substrate 6 comprises overall at the aperture array shown in 90 places, and described opening has flute profile end wall 92, sidewall 94 and the inclined wall part 96 in the middle of it.Shown in the best among Figure 12, when measuring about the longitudinal center line that runs through opening, each opening is positioned in the substrate with angle Φ.Should be understood that when observing, this axis normal is in paper in Figure 12.Shown in the embodiment of Figure 12, Φ=45 °.At last, shown in the best among Figure 10, each turning of substrate 6 comprises the hypotenuse part shown in 100.

Referring now to accompanying drawing 13-15, will be described in more detail contact assembly 8.Shown in Figure 13 and 14, contact assembly 8 comprises the conductive contact 110 that is supported by insulating element 112.Preferably, this insulating element 112 is overmolded onto on the conductive contact 110.Contact 110 comprises mid portion 114, upper chip contact portion 116 and lower printed circuit board contact portion 118.Each contact portion 116 roughly becomes 30 ° of angles to extend with 118 from middle part 114 and horizontal plane, and comprises convex surface spherical contact portion 120,122 outwardly.

Referring now to accompanying drawing 13,15A and 15B, will be described in more detail insulating element 112.As shown in the figure, insulating element 112 has general arrangement and becomes the shank 128 be received in the opening 90.Insulating element has the end wall 130 that is configured to be received in the flute profile wall 92, is configured to be received in the sidewall 132 between the edge 94 (Figure 12) and is configured to be received in the interior skew wall 134 in edge 96 (Figure 12).As shown in figure 13, insulating element also comprises head 136, and its shank 128 with respect to the bottom is extended.

As shown in figure 13, head 136 has two surfaces 142 and 138, and wherein surface 142 is from surperficial 138 vertical shifts (bottom when observing Figure 13) " Y " size, wherein Y=0.038mm.Shown in Figure 15 B the best, this has determined two surfaces, i.e. the surface 142 of expansion and surface 138, and raise a little with respect to surface 142 on surface 138.To the purpose of this vertical shift be described at this.

Based on said elements, the manufacture method to element describes now.At first with reference to Figure 16, show a strip material 150, it can be used for making substrate 6.In a preferred embodiment of the invention, substrate 6 is made by stainless steel, to form rigid substrates.Yet, also can adopt other materials as alternative, for example pottery, plastic material or other enough hard materials.

As shown in figure 16, can make most of details of edge, opening 90 and location hole 74 by etch process, described etch process can provide the size with very compact tolerance.Should be understood that, utilize etching substrates shown in Figure 16 6, can further handle this strip material 150, can load contact thus, and substrate is swept away their carrier strip 150.Etch process also can produce a smooth material, and handles power without undergoing punching press.Should be understood that also etch process can be used for removing single substrate 6 from each bar 150.

Referring now to accompanying drawing 17, show the carrier strip of terminal with the preliminary treatment form, wherein handle forming a plurality of terminals 110 by progressive punching press.As shown in the figure, carrier strip 160 comprises contact strips side by side, and wherein the mid portion 114 of terminal is by open, shown in Figure 18 the best.Thereby as shown in figure 19, insulating element 112 can be overmolded on the mid portion 114, and terminal still is in carrier-strip form simultaneously, and is stamped subsequently to form final contact assembly 8.In described embodiment, plastic material is that 30% glass is filled the polyester PBT of (30% glass filed), is known as VALOX420, yet, can use other plastic materials that can realize said function.

Shown in Figure 20 and 21, contact assembly 8 is loaded in its each opening 90 now, thus shoulder surface 142 abuts substrate 6.At this moment, the shank 128 of insulating element 112 is shelved in the opening simply, only is supported on the substrate 6 by surface 142.As mentioned above, this just is provided with little gap between surface 138 and substrate 6.Now as shown in figure 22, U-shaped die assembly 170 is used for insulating element cold forming or " swaged forging (swage) " are connected for the rivet-like in the substrate 6.Die assembly 170 has mold 172 (Figure 22) and bed die 174 (Figure 23).As shown in figure 22, mold 172 is positioned at around the contact portion 116 and against the head 136 of insulating element 112.As shown in figure 23, the shank 128 of the insulating element 112 that illustrates stretches out by opening 90, and wherein mould part 174 is located immediately on this shank.

Should be understood that base portion 172a and 174a are positioned on the position at surperficial 142 places, that is, be positioned on the surface of abuts substrate 6.Thereby when two moulds were moved towards each other in the swaged forging mode, the swaged forging effect caused the insulating element vertical moving.Because surface 142 is elevated and flushes with substrate 6 fact of (and because gap Y), power against insulating element has prevented around the moment of insulating element and the distortion of insulating element or contact in opposite direction, and these moments or distortion will make contact assembly be tending towards dislocation or deflection.

With reference now to Figure 24-27,, with the back cold forming of explanation insulating element.Shown in Figure 25 and 26 the bests, insulating element comprises the swaged forging part 180 by surperficial 142 cold formings, and this part is positioned at the substrate opposite side.Shown in Figure 26 the best, the power on the insulating element 112 causes surface 142 and surface 138 with respect to substrate 6 coplanes.In other words, surface 142 by slightly compressed to eliminate size Y.With reference now to accompanying drawing 27,, the lower surface cold forming that the swaged forging of mould 170 causes part 130 in as downside shown in 182.These cold-worked parts 180,182 stably remain on the appropriate location with each independent contact assembly 8.

Based on the above-mentioned substrate of finishing, substrate can be embedded the appropriate location in the housing now, as shown in Figure 3.Should be understood that substrate diagonal 100 adjacent edge 26A (Fig. 5) cooperate, be stuck on the Lock Part 30 bottom then, as shown in Figure 5 with abuts with wall 14.Should be understood that edge 70 (Figure 10) is stuck in (Fig. 6) on the Lock Part 42, so that substrate is remained on the housing with locking.This just provides the LGA interconnection 2 shown in Fig. 1 and 3.

Above illustrated embodiment has many prior aries and designs unshowned advantage.Insulating element not only is used as holding member, and is used as the insulator of substrate 6.Simultaneously, the use of stainless steel substrate realizes the real counterweight balance between nonplanar surface as the midplane (floating midplane) that floats.In addition, the notion of substrate is as built-in strain relief (built-in strain relief), and it just can be not crooked by any frictional force, thereby reduced the power that is absorbed by the Lock Part that is arranged on plate/socket usually.

As the alternative that substrate 6 is locked in housing 4, shown in Figure 28 and 29, a kind of alternate substrate 206 is shown, it has around a plurality of openings 208 of substrate 206 peripheries, thereby housing parts 204A-204H can be overmolded to the periphery of substrate 206, and wherein the plastic body of this part is around periphery parcel opening 208.This provides the accurate location of the surface of housing parts 204A-204H with respect to substrate 206.

As another alternative, shown in Figure 30 and 31, though the structure in hole 274 is similar to hole 74 (Figure 11), it comprises elongated open 276, make contact portion 278 be formed on the deflectable spring beam 280, thereby admit pin 50 in placed in the middle but not relocatable mode.

At last, 32-34 with reference to the accompanying drawings, cover spare 300 can be used for socket, as mentioned above.This cover piece comprises the top 302 in order to the expansion that forms smooth clamping surface, around the sidewall 304 and the lower limb 304 of socket with the finger spare 306 that extends under the socket, thus the shoulder on the lock arm 308 engagement housings, as shown in figure 28.Lock arm 310 is used to remove this cover piece.

With reference now to Figure 35-37,, show embodiment according to the LGA interconnection of above-mentioned principle, wherein this socket is designed to a large amount of contact positions.For example, as shown in figure 35, the LGA interconnection is designed to high density arrays, for example, and the position of 2500+.

This connector generally illustrates with 402, and it comprises housing 404, substrate 406 and a plurality of contact assembly 408.Should be understood that because chip inserts and the rubbing action of the contact of socket when being positioned printed circuit board (PCB), big cross force acts on substrate and the housing.Thereby in this embodiment, contact assembly 408 is located along diagonal 420 in relative mode.Thus, owing to act on the opposite characteristic of the power on the contact assembly, the cross force of transmitting by housing is eliminated.

Shown in Figure 36 and 37, can be along diagonal 420 Unitarily molded stop components 422, and a plurality of vertical column 424 is positioned in the middle of the contact, forming maximum chip insertion position, thereby and prevented that contact component is stressed excessive.

With reference now to Figure 38,, show substrate 506, it is used for even bigger array, i.e. the position of 5100+, wherein substrate 506 with relative mode along four diagonal 520a, 520b, 520c and 520d positioning contact assembly 508.

Figure 39 and 40 illustrates, and a plurality of contacts 110 can be molded on the single slender bodies 612, and this slender bodies has head 636 and a plurality of shank 628.Antioverloading parts 640 in the middle of each head 636 comprises are to be that contact provides overload features in the row in front, as shown in figure 39.Contact assembly 608 can pass through from the head 636 of the alternate row of the particular side extension of substrate 606 and the form positioned alternate of shank 628.

Figure 41 illustrates the alternative of housing 704, and wherein insulator 724 and 726 is the independently discrete elements that can be received in respectively in socket 725 and 727, thereby insert 724 and 726 is made up of the material harder than case material.For example, metal, pottery or any other material can be used as this insert, to use and to prevent during thermal cycle creep and distortion at socket.

Referring now to Figure 42 and 43, a kind of alternative contact assembly 808 is shown, it has molded body 812, middle contact site 814, contact portion has the contact portion 816 and 818 of extending from it in the middle of described, wherein contact portion 822 is formed with wide foot, and the wide foot of formation is used for striding across the through hole 832 of printed circuit board (PCB) contact pad designed 830, as shown in figure 43.

Referring now to Figure 44-60, further embodiment of this invention will be described.Shown in Figure 44-46, this embodiment illustrates with 902 and comprises frame case 904, and it is made up of the first and second frame parts 904A and 904B (Figure 46), cover piece 905 and carry the substrate 906 of a plurality of contact assemblies 908.With reference now to Figure 47,, frame case part 904A will be described in further detail.

Frame case part 904A comprises frame side wall part 910A, 912A, 914A and 916A.Frame case part 904A also comprises the extension ear 918A that extends from the diametrical corners with pin receiving opening 920A, will further specify at this.In other diametrical corners, frame case part 904A comprises edge 922A.Alignment pin 924 is cylindrical from frame case 904A extension downwards and cross section substantially.At last, frame support member 926A is being cross on extension and the structure between the relative side of frame case 904A, and it has the first parts 928A and the second parts 930A that forms quadrant betwixt.

With reference now to Figure 48,, frame case part 904B will be described in further detail.Should be understood that frame case part 904B and frame case part 904A are complementary and be designed to clamping substrate element 906 betwixt.With reference to Figure 48, frame case part 904B comprises lateral section 910B, 912B, 914B and 916B.With with the similar mode of frame case part 904A, frame case part 904B comprises the extension ear 918B that extends from the diametrical corners with hole 920B.Other turnings comprise edge 922B.Frame case part 904B also comprises frame support member 926B, and it has support component 928B and 930B.At last, as shown in figure 48, frame case part 904B comprises a plurality of hex-shaped openings 932, its be in housing parts 904A on the array that is complementary of pin 924 arrays in.

With reference now to Figure 49,, cover piece 905 will be described in further detail.As shown in figure 49, in basiscopic perspective view, cover piece 905 comprises sidewall 934 and forms the roof 936 of closure member (enclosure) 938 therein.Should be understood that cover piece 905 is configured to be received within on the combination of frame case part 904A, 904B and substrate 906.Thereby,, be provided with extension 940 and this extension 940 and be configured to be received within on extension ear 918A and the 918B at each turning of cover piece 905.As Figure 49 the best illustrated, these extensions comprised and being used for directly and the hole 942 of base plate alignment, will further specify it at this.In relative corner, be provided with Lock Part 946 with lock arm 948, shown in Figure 45 and 49 the bests, will further specify it at this.

With reference now to accompanying drawing 50,, will describe substrate element 906.As shown in figure 50, substrate 906 is structurally rectangular basically.In fact, as shown in figure 50, the cross section of substrate 906 is square substantially, thereby forms the quadrant of four equalizations, will be described at this.Substrate 906 comprises side 960,962,964 and 966.The turning at diagonal angle comprises the extension 970 with hole 972.Hole 972 comprises receiving opening 974 and location hole 976.Hole 972 and submit to when operating in the assignee, more fully illustrated in the U.S. Patent Application Serial Number 10/788,874 simultaneously co-pending, its theme is by with reference to being incorporated into this.

As shown in figure 50, substrate 906 also comprises a plurality of holes 990, thereby forms described hole in the quadrant intersection in row's quadrant, and each contact is usually towards substrate center.As shown in figure 50, each hole 990 comprises end edge 992, side 994 and the side 996 that becomes the angle.These holes are substantially similar to above those holes with reference to Figure 12 explanation, and are configured to admit contact assembly 908 therein.Still with reference to Figure 50, be provided with hole 998, it is aimed at cylindrical pin 924, but its diameter is greater than pin 924.Substrate 906 also comprises side 1000 in the corner at its diagonal angle, will further specify it at this.

With reference now to Figure 51-55,, contact assembly 1008 will be described in further detail.Shown in Figure 52, contact assembly 1008 comprises the terminal part 1010 of punching press, and it has Overmolded insulating element 1012 thereon.Shown in Figure 51, the terminal 1010 of punching press comprises the core 1014 with elongated hole 1015, and contact portion 1016 and 1018 is extended from its opposite side, forms contact area 1020 and 1022.With reference now to Figure 53,, the insulating element 1012 that illustrates is overmolded on the terminal part 1010.Should be understood that insulating element 1012 is substantially similar to above insulating element with reference to figure 13-15B explanation.That is to say that insulating element 1012 comprises shank 1028, end 1030, head 1036 and protuberance 1040.Yet in addition, insulating element 1012 comprises slit 1044, shown in Figure 53 and 54, in its local extension to the end 1030.Slit 1044 forms facing surfaces 1046 and 1048.

Refer again to Figure 50, this embodiment also comprises alignment pin 1050, and this alignment pin has cylindrical part 1052 and the reduced part 1056 that has groove at 1054 places.As mentioned above, base openings 972 and having in the latch-up structure of alignment pin 1050 U.S. Patent Application Serial Number 10/788,874 co-pending at the same time is described more specifically, and it is by with reference to being incorporated into this.Utilize above-mentioned parts, will describe assembly and application thereof now.

Substrate 906 forms in the mode that is similar to foregoing, and wherein substrate is formed with feature shown in Figure 50.Though substrate can be made by many different materials, for example polyester film, pottery, plastic material or metal, this embodiment adopts stainless steel substrate, wherein concrete feature, for example the details of hole 990 and hole 998 and 972 forms by etch process.Yet, will be appreciated that, can provide some embodiment by Sheet Metal Forming Technology.No matter under which kind of situation, in this embodiment, hole 990 is formed on about in the substrate all quadrants, as mentioned above.

With reference now to Figure 51,, provides terminal by the technology that is used to form with the similar lead frame of lead frame shown in Figure 51.Contact by the rubber-like metal for example beryllium copper form, and be depicted as and be stamped and be shaped to form its characteristic.Yet, also should be understood that, when contact density increases, also can provide tight tolerance in conjunction with etch process.

Now, the insulating element 1012 shown in Figure 52 is overmolded in around the contact center part 1014, thereby uses the sprue gate of elongated hole 1015 as molten plastic material, to guarantee moulding part completely.Hole 1015 also can be provided as along the terminal length maintaining body of insulating element longitudinally.Now, contact assembly 1008 is inserted in its passage 990 separately, and should be understood that the slit 1044 shown in Figure 53 and 54 will be engaged in each hole 990, be received in wherein with the edge with hole 990.Now, above according to being similar to reference to Figure 22 and 23 described mode swaged forging insulating elements, thus the deformation of plasticity insulating element is to the position shown in Figure 56.The insulating element lateral displacement is positioned in the slit 1044 with the edge with hole 990, and the opposite edges of the jut 1080 clamping substrates 906 of surface 1042 and swaged forging.Now, alignment pin 1050 is locked in the bore portion 976 of location hole 972, and it can be permanently connected and locate alignment pin 1050 with respect to substrate 906.

In this stage, all contact assemblies are inserted into substrate 906, and alignment pin 1050 is fixedly secured on the substrate 906.Now, frame case parts 904A and 904B can utilize each hole 920A, 920B to be positioned on the alignment pin 1050, and this is with frame support member 928A, 930A; 928B, 930B (Figure 47 and 48) are positioned in the middle of the quadrant of contact assembly, shown in Figure 57 and 58 the bests.Because being an interference fit between cylindrical pin and the hex hole between cylindrical pin 924 (Figure 47) and their receiving openings 932 (Fig. 8) separately provides interference engagement, thereby two frame case parts 904A and 904B are press-fitted in together, shown in the best in the exploded view of Figure 59.

Shown in Figure 60 the best, contact assembly 908 is assemblied in the quadrant about support component 928B and 930B, forms the contact that a row is used for being interconnected to other electronic components.Also should be understood that support component 928A, 930A; 928B, 930B are used for simultaneously curing substrates 906 and provide spacing stop position for the electronic component that applies LGA interconnection 902 on it.In other words, if LGA interconnection 902 is put in the middle of two printed circuit board, then these two circuit boards can be assembled into this interconnection 902, and such two printed circuit board can be contacted support component 928A, 930A by drawn together to circuit board; The position of 928B, 930B.

Referring again to Figure 57 and 58, should be understood that edge 922B separately is overlapping for edge 922A and they, thereby form lock-in edge.Under the situation that upper device is located against frame case part 904A now, cover piece 905 can be positioned on the assembly of frame case 904 and substrate 905, and locking piece 946 (Figure 49) can be locked on the overlapping edge 922A, shown in Figure 45 the best, and meanwhile, cylindrical pin part 1052 (Figure 50) can be received in its receiving opening 942 (Figure 49) of cover piece 905.Figure 45 shows this embodiment at the basiscopic perspective view in when assembling, wherein sells 1050 remainder and reduced part 1056 and stretches out from frame case part 904B, with further aligning and be connected to other electronic devices.

Thereby, in the embodiment of Figure 44-60, contact assembly 908 promoted the confining force to its substrate 906 by means of the slit 1044 (Figure 52 and 53) against location, the edge in its each hole 990 (Figure 56), this confining force that 990 both sides provide for insulating element 1012 against each surface 994 (Figure 50) in the hole.In addition, support component 928A, 928B; 930A, 930B allow electronic component suitably to locate with respect to interconnection 902, and enough contact forces are provided, but prevent the contact assembly overload.In addition, shown in Figure 60 the best, contact is arranged in the quadrant, thereby all component of friction of power cancel each other out, thereby has prevented any cross force from transferring to the element of interconnection and the electrical connection that causes is aging.

Claims (14)

1. land grid array interconnect structure, comprise substrate and a plurality of contact assembly, described substrate has and a plurality ofly runs through it and be arranged in hole in the array, each described contact assembly comprises the insulating element that keeps conductive contact, each described insulating element is positioned in separately one of them described hole, each described conductive contact is included in last contact portion of extending on the described substrate and the following contact portion of extending under described substrate, it is characterized in that:

Described substrate is made of metal, and each described insulating element is with its described conductive contact and insulation of described substrate separately.

2. land grid array interconnect structure as claimed in claim 1, wherein said insulating element is overmolded onto on the described conductive contact.

3. land grid array interconnect structure as claimed in claim 1, wherein said conductive contact comprises the intermediate base part, the described contact portion that goes up is stretched out from base part in opposite direction with following contact portion.

4. land grid array interconnect structure as claimed in claim 3, wherein said insulating element have the head and the shank that is configured to be received within the described hole greater than described hole.

5. land grid array interconnect structure as claimed in claim 4, wherein said shank comprise the slit that is configured to admit the described substrate edges that is close to described hole.

6. land grid array interconnect structure as claimed in claim 5, wherein said shank is by swaged forging, the described edge of described slit and described substrate is in the lap position, and described shank remains on described Overmolded insulating element and described conductive contact in the described hole against described base plate deformation.

7. land grid array interconnect structure as claimed in claim 1 wherein saidly goes up contact portion and following contact portion extends into cantilever beam, and described contact assembly is arranged in two arrays at least, and described cantilever beam extends relatively.

8. land grid array interconnect structure as claimed in claim 7, wherein said contact assembly is arranged in the quadrant, and all described cantilever beams are outstanding towards the geometric center of described substrate.

9. land grid array interconnect structure as claimed in claim 1, wherein at least some described insulating elements keep a plurality of conductive contacts.

10. land grid array interconnect structure as claimed in claim 9, wherein at least some described insulating elements have central stops in the middle of their described conductive contact, think that other the described conductive contacts in other described insulating elements provide retainer.

11. land grid array interconnect structure as claimed in claim 1 also comprises the insulation shell parts that extend around described substrate periphery.

12. land grid array interconnect structure as claimed in claim 11, wherein said insulation shell parts are overmolded onto on the part of described substrate.

Admit the surface 13. land grid array interconnect structure as claimed in claim 12, wherein said insulation shell parts have substrate, this substrate admits the surface to have a plurality of stretching pins, and described substrate has the location hole that is fastened on the as much on the described pin.

14. land grid array interconnect structure as claimed in claim 13, wherein each described location hole by split ring around, thereby form the elastic edge of resilience at described location hole place.

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