CN100538594C - Electronic installation - Google Patents
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- CN100538594C CN100538594C CNB2006101520916A CN200610152091A CN100538594C CN 100538594 C CN100538594 C CN 100538594C CN B2006101520916 A CNB2006101520916 A CN B2006101520916A CN 200610152091 A CN200610152091 A CN 200610152091A CN 100538594 C CN100538594 C CN 100538594C
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Abstract
The invention relates to a kind of electronic installation, it comprises a first, a second portion and a circuit board.First has a first surface, and first surface has one first conduction region.Second portion has a second surface, and second surface has one second conduction region and one second non-conductive district, and wherein second conduction region and the second non-conductive district contact with first conduction region partly respectively.Circuit board then has a plurality of electronic components, and wherein circuit board is positioned at a side of first and second portion.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of notebook computer (Notebook PC) with Trackpad (Touch Pad).
Background technology
Along with the continuous progress of electronics technology, make electronic installation miscellaneous enter into our work and life, the particularly appearance of computer, very huge to our life influence especially.The type of at present common PC (PC) comprises desktop computer and portable computer, and the type of portable computer more comprises notebook computer, palmtop computer (Pocket PC) and panel computer (Tablet PC) etc.With regard to notebook computer, common instruction input method is by keyboard (Keyboard) input instruction.To the computer system input instruction, another kind of common input mode is that a Trackpad is set on notebook computer, to allow the user easily to the computer system input instruction for the convenience of the users.In addition, for the outward appearance that makes notebook computer has preferable metal-like, the partial component of notebook computer (for example being Trackpad) can be carried out electroplating process usually, makes notebook computer have preferable metal-like.
Yet, because human body more or less all has static, thus when the user when operating Trackpad, the user just is passed to Trackpad with entrained electrostatic charge via finger, causes static discharge (Electro-Static Discharge, phenomenon ESD).The electrostatic current that static discharge produced may conduct to the circuit board in the notebook computer by the coat of metal on Trackpad surface, and then causes the electronic component on the circuit board to suffer damage.On the other hand, when the part electronic component of notebook computer inside had the situation of electric leakage, leakage current can conduct to the metal surface of Trackpad, and then caused the user injured because of touching charged metal surface.
Summary of the invention
The objective of the invention is to, overcome the defective that existing electronic installation exists, and a kind of electronic installation of new structure is provided, cause the problem of user's electric shock when operating to solve electronic installation because of electric leakage, thereby be suitable for practicality more.
Another object of the present invention is to, a kind of electronic installation of new structure is provided, solving the problem that the user causes electronic installation to damage because of the static discharge phenomenon when the operating electronic devices, thereby be suitable for practicality more.
For reaching above-mentioned or other purposes, the present invention proposes a kind of electronic installation, and it comprises a first, a second portion and a circuit board.First has a first surface, and first surface has one first conduction region.Second portion has a second surface, and second surface has one second conduction region and one second non-conductive district, wherein second conduction region and the second non-conductive district contact with part first conduction region respectively, this second portion also has one four surface relative with this second surface, the 4th surface has one the 4th conduction region and one the 4th non-conductive district, and the 4th conduction region and this second conduction region electrically connect.Circuit board then has a plurality of electronic components, and wherein circuit board is positioned at a side of first and second portion.
In one embodiment of this invention, above-mentioned first has more one three surface relative with first surface, and the 3rd surface is non-conductive.
In one embodiment of this invention, the first above-mentioned conduction region, second conduction region and the 4th conduction region are a coat of metal, and the second non-conductive district and the 4th non-conductive district are thunder carving (laser engraving) district, and wherein thunder carving district is non-conductive.
In one embodiment of this invention, the above-mentioned second non-conductive district sets the set zone of zone less than the 4th non-conductive district.
In one embodiment of this invention, the above-mentioned second non-conductive district and the 4th non-conductive district are a closed ring zone.
In one embodiment of this invention, above-mentioned second portion is the object once electroplating processes.
In one embodiment of this invention, above-mentioned second portion is overlapped in first.
In one embodiment of this invention, above-mentioned first has more one the 5th non-conductive district, first surface has more one first non-conductive district, the 3rd surface has more one the 3rd conduction region and one the 3rd non-conductive district, and the 5th non-conductive district is connected with the 3rd non-conductive district and the first non-conductive district, and the first non-conductive district and the second non-conductive district overlap (overlap).
In one embodiment of this invention, the above-mentioned first non-conductive district sets the set zone of zone less than the second non-conductive district.
In one embodiment of this invention, the first above-mentioned conduction region, second conduction region, the 3rd conduction region and the 4th conduction region are a coat of metal, the first non-conductive district, the second non-conductive district, the 3rd non-conductive district, the 4th non-conductive district and the 5th non-conductive district are thunder carving district, and thunder carving district is non-conductive.
In one embodiment of this invention, the above-mentioned second non-conductive district sets the set zone of zone greater than the 4th non-conductive district.
In one embodiment of this invention, above-mentioned first and second portion are the object once electroplating processes.
In one embodiment of this invention, above-mentioned first is overlapped in second portion.
In electronic installation of the present invention, because first surface has one first conduction region, and second surface has one second conduction region and one second non-conductive district, and second conduction region and the second non-conductive district contact with part first conduction region respectively, therefore the electric current of first conduction region of flowing through can be subjected to the restriction in the second non-conductive district partly the time conducting to second, is not overlapped in second the member on partly and can not conduct to.On the other hand,, conduct to second the electrostatic current on partly and still can conduct to first conduction region, and then electrostatic current is passed to the earth terminal of electronic installation because of contact is overlapped in second partly the member when phenomenon of static discharge takes place as the user through second conduction region.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 illustrates the synoptic diagram into a kind of electronic installation of preferred embodiment of the present invention.
Fig. 2 illustrates the exploded view partly into first in the electronic installation of Fig. 1 and second.
Fig. 3 illustrate among Fig. 1 along the sectional view of I-I ' line.
Fig. 4 illustrates and is the connection diagram between casing among Fig. 3 and Trackpad support.
Fig. 5 A illustrates the vertical view into the Trackpad support of Fig. 2.
Fig. 5 B illustrates the upward view into the Trackpad support of Fig. 2.
Fig. 6 A illustrates the exploded view into Trackpad support and button.
Fig. 6 B illustrates the constitutional diagram into Trackpad support and button.
Fig. 7 illustrate among Fig. 6 B along the sectional view of II-II ' line.
100: 110: the first parts of electronic installation
110 ': casing 110 ": button
112: first surface 112a: first conduction region
112b: 114: the three surfaces, the first non-conductive district
114a: the 3rd conduction region 114b: the 3rd non-conductive district
116: the five non-conductive districts 120: second portion
120 ', 120 ": Trackpad support 122: second surface
122a: the second conduction region 122b: the second non-conductive district
124: the four surperficial 124a: the 4th conduction region
124b: the 4th non-conductive district 130: circuit board
132: electronic component 140: Trackpad
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of electronic installation, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Fig. 1 illustrates the synoptic diagram into a kind of electronic installation of preferred embodiment of the present invention, and Fig. 2 illustrates the exploded view partly into first in the electronic installation of Fig. 1 and second, and Fig. 3 illustrate among Fig. 1 along the sectional view of I-I ' line.Please consult Fig. 1, Fig. 2 and shown in Figure 3 simultaneously, the electronic installation 100 of present embodiment for example is a notebook computer, and it comprises one first part 110, one second portion 120 and a circuit board 130.Wherein, first part 110 for example is the casing 110 ' of notebook computer, second portion 120 for example is the Trackpad support (frame) 120 ' that is overlapped on the casing 110 ', and circuit board 130 is sides that are positioned at casing 110 ' and Trackpad support 120 ', and it has a plurality of electronic components 132.For instance, circuit board 130 for example is the sensor circuit plate that is disposed at the motherboard in the notebook computer or is disposed at the Trackpad below.
From the above, in order more to understand the bonding relation between Trackpad support 120 ' and casing 110 ', please then consult shown in Figure 4ly, it illustrates and is the connection diagram between casing 110 ' among Fig. 3 and Trackpad support 120 '.As shown in Figure 4, casing 110 ' has a relative first surface 112 and one the 3rd surface 114, and wherein first surface 112 has one first conduction region 112a, and the first conduction region 112a for example is a coat of metal.In addition, Trackpad support 120 ' has a relative second surface 122 and one the 4th surface 124, and second surface 122 has one second conduction region 122a and one second non-conductive district 122b, and for example there are one the 4th conduction region 124a and one the 4th non-conductive district 124b in the 4th surface 124, wherein the second conduction region 122a and the second non-conductive district 122b contact with the part first conduction region 112a respectively, and the 4th conduction region 124a electrically connects with the second conduction region 122a.In addition, in the present embodiment, the zone that sets of the second non-conductive district 122b for example is the zone that sets less than the 4th non-conductive 124b of district.In other words, the insulation impedance of the second non-conductive district 122b is less than the insulation impedance of the 4th non-conductive district 124b.
In the present embodiment, Trackpad support 120 ' for example is the object once electroplating processes.In other words, the 4th conduction region 124a on second conduction region 122a of second surface 122 and the 4th surface 124 is the coat of metal.In addition, the formation method of the second non-conductive district 122b for example is that the coat of metal on the second surface 122 is carried out laser engraving, to form non-conductive district on second surface 122.Similarly, the formation method of the 4th non-conductive district 124b for example is that the coat of metal on the 4th surface 124 is carried out laser engraving, to form non-conductive district on the 4th surface 124.See also shown in Fig. 5 A and Fig. 5 B, Fig. 5 A promptly illustrates the vertical view into the Trackpad support of Fig. 2, and Fig. 5 B illustrates the upward view into the Trackpad support of Fig. 2.By Fig. 5 A and Fig. 5 B as can be known, the second non-conductive district 122b and the 4th non-conductive district 124b for example are a closed ring zone, and this closed ring zone promptly is to form via above-mentioned laser-engraving technique.That is to say that the second non-conductive district 122b and the 4th non-conductive district 124b are nonconducting thunder carving district.In addition, the 3rd surface 114 for example is nonconducting surface.
What deserves to be mentioned is, in the present embodiment, because the second conduction region 122a of Trackpad support 120 ' and the second non-conductive district 122b contact with the part first conduction region 112a of casing 110 ' respectively (seeing also shown in Figure 4).Therefore, when as the electronic component on the circuit board 130 132 (seeing also shown in Figure 3) situation of electric leakage taking place, leakage current conducts to the first conduction region 112a because of electronic component 132 and contacting of first surface 112 easily.Wherein, the leakage current of the first conduction region 112a of flowing through can be subjected to the restriction of the second non-conductive district 122b and the 4th non-conductive 124b of district when conducting to Trackpad support 120 ', and can not conduct to the member (for example being the Trackpad 140 that Fig. 3 illustrated) that is overlapped in second part 120, and then allow the user can not touch charged member.
On the other hand, because the second non-conductive insulation impedance of distinguishing the insulation impedance of 122b less than the 4th non-conductive district 124b.Therefore, when the user in operational example in this way during the member of Trackpad 140 (seeing also shown in Figure 3), as the phenomenon of static discharge takes place in the operating process, electrostatic current on the Trackpad 140 second conduction region 122a that can flow through, and be passed to the first conduction region 112a via the second less non-conductive district 122b of insulation impedance, relend the earth terminal that electrostatic current is conducted to electronic installation 100 by the first conduction region 112a.In other words, above-mentioned electrostatic current can not conduct on the circuit board 130, causes electronic component 132 to suffer damage, and then has influence on the serviceable life of electronic installation.
In addition, the first 110 (casing 110 ') that Fig. 4 illustrated not is the unique embodiment of the present invention with the bonding relation of second part 120 (Trackpad supports 120 '), hereinafter will do explanation at other embodiments of the present invention, and for convenience of description, explanation hereinafter will indicate components identical with identical label.
In another preferred embodiment, second portion 120 can be a Trackpad support 120 ", and first 110 can be to be overlapped in Trackpad support 120 partly " on button 110 ".Fig. 6 A promptly illustrates the exploded view into Trackpad support and button, and Fig. 6 B illustrates the constitutional diagram into Trackpad support and button, and Fig. 7 illustrate among Fig. 6 B along the sectional view of II-II ' line.Please consult Fig. 6 A, Fig. 6 B and Fig. 7 simultaneously, the button 110 of present embodiment " have a relative first surface 112 and one the 3rd surface 114; and wherein first surface 112 has one first conduction region 112a and one first non-conductive district 112b, and the 3rd surface 114 has one the 3rd conduction region 114a and one the 3rd non-conductive district 114b.In the present embodiment, button 110 " have more the 5th a non-conductive district 116 that is connected with the 3rd non-conductive district 114b and the first non-conductive district 112b, the both sides of the non-conductive district 112b that wins are electrically insulated.Wherein, button 110 " for example be through the object after the electroplating processes.In other words, the 3rd conduction region 114a on first conduction region 112a of first surface 112 and the 3rd surface 114 is the coat of metal.In addition, the first non-conductive district 112b, the 3rd non-conductive district 114b and the 5th non-conductive district 116 for example are nonconducting thunder carving districts mentioned above.
In addition, the Trackpad support 120 of present embodiment " identical with the Trackpad support 120 ' of the foregoing description, so do not repeat them here.In addition, 130 of circuit boards are to be positioned at button 110 " with Trackpad support 120 " a side, and have a plurality of electronic components 132.Hereinafter will describe the Trackpad support 120 of present embodiment in detail " and button 110 " between bonding relation.
See also shown in Figure 7, Trackpad support 120 " the second conduction region 122a and the second non-conductive district 122b respectively with button 110 " the part first conduction region 112a contact, and the first non-conductive district 112b and the second non-conductive district 122b are overlapped, wherein the first non-conductive regional zone that sets less than the second non-conductive district 122b of setting of 112b of distinguishing.Thus, when the leakage current of circuit board 130 (seeing also Fig. 3) conducts to Trackpad support 120 " time; because Trackpad support 120 " its second surface 122 has the second non-conductive district 122b, and button 110 " its first surface 112 has and the second non-conductive district 122b is the partly overlapping first non-conductive district 112b; therefore above-mentioned leakage current can not conduct to the button 110 that the user pushes " surface, and make that the user can be because of not touching charged button 110 " surperficial injured.
On the other hand, when the user in pressing keys 110 " time as the phenomenon of static discharge takes place; button 110 " on the electrostatic current first conduction region 112a that can flow through, and be passed to the second conduction region 122a that partly contacts with the first conduction region 112a via the first less non-conductive district 112b of insulation impedance, relend the earth terminal that electrostatic current is conducted to electronic installation 100 by the second conduction region 122a.In other words, above-mentioned electrostatic current can not conduct on the circuit board 130 (seeing also shown in Figure 3), causes electronic component 132 to suffer damage, and then has influence on the serviceable life of electronic installation.
In sum, two-phase connecting elements of the present invention (first and second partly) is after the process electroplating processes, can be by at least one non-conductive district that is arranged on the first or second part, make the leakage current in the first be subjected to the restriction in non-conductive district, and then avoid the user the injured situation of getting an electric shock partly to take place because of touching second.On the other hand, the electrostatic current that the user causes on second part can be passed to first via non-conductive district, and electrostatic current is conducted to earth terminal.Particularly, the outward appearance of electronic installation of the present invention has preferable metal-like, and the user can not cause electronic installation to damage when operating electronic devices because of above-mentioned static discharge phenomenon, or the situation that causes the user to get an electric shock injured because of the inner electric leakage of electronic installation takes place.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (13)
1, a kind of electronic installation is characterized in that it comprises:
One first have a first surface, and this first surface has one first conduction region;
One second portion, this second portion has a second surface, this second surface has one second conduction region and one second non-conductive district, wherein second conduction region and this second non-conductive district contact with this first conduction region of part respectively, this second portion also has one four surface relative with this second surface, the 4th surface has one the 4th conduction region and one the 4th non-conductive district, and the 4th conduction region and this second conduction region electrically connect; And
One circuit board has a plurality of electronic components, and wherein this circuit board is positioned at a side of this first and this second portion.
2, electronic installation according to claim 1 is characterized in that wherein said first has more one three surface relative with this first surface, and the 3rd surface is non-conductive.
3, electronic installation according to claim 1, it is characterized in that wherein said first conduction region, this second conduction region and the 4th conduction region are a coat of metal, this second non-conductive district and the 4th non-conductive district are thunder carving district, and this thunder carving district is non-conductive.
4, electronic installation according to claim 1 is characterized in that the regional zone that sets less than the 4th non-conductive district of setting of the wherein said second non-conductive district.
5, electronic installation according to claim 1 is characterized in that the wherein said second non-conductive district and the 4th non-conductive district are a closed ring zone.
6, electronic installation according to claim 1 is characterized in that wherein said second portion is the object once electroplating processes.
7, electronic installation according to claim 1 is characterized in that wherein said second portion is overlapped in this first.
8, electronic installation according to claim 2, it is characterized in that wherein said first has more one the 5th non-conductive district, this first surface has more one first non-conductive district, the 3rd surface has more one the 3rd conduction region and one the 3rd non-conductive district, and the 5th non-conductive district is connected with the 3rd non-conductive district and this first non-conductive district, and overlaps in this first non-conductive district and this second non-conductive district.
9, electronic installation according to claim 8 is characterized in that the regional zone that sets less than this second non-conductive district of setting of the wherein said first non-conductive district.
10, electronic installation according to claim 8, it is characterized in that wherein said first conduction region, this second conduction region, the 3rd conduction region and the 4th conduction region are a coat of metal, this first non-conductive district, this second non-conductive district, the 3rd non-conductive district, the 4th non-conductive district and the 5th non-conductive district are thunder carving district, and this thunder carving district is non-conductive.
11, electronic installation according to claim 8 is characterized in that the regional zone that sets greater than the 4th non-conductive district of setting of the wherein said second non-conductive district.
12, electronic installation according to claim 8 is characterized in that wherein said first and this second portion are the object once electroplating processes.
13, electronic installation according to claim 8 is characterized in that wherein said first is overlapped in this second portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101520916A CN100538594C (en) | 2006-09-11 | 2006-09-11 | Electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101520916A CN100538594C (en) | 2006-09-11 | 2006-09-11 | Electronic installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101145072A CN101145072A (en) | 2008-03-19 |
| CN100538594C true CN100538594C (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101520916A Active CN100538594C (en) | 2006-09-11 | 2006-09-11 | Electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100538594C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0822541A2 (en) | 2008-07-25 | 2015-06-23 | Hewlett Packard Development Co | Computing device, laptop, and leakage current dissipating device for use with a laptop |
| JP5486860B2 (en) * | 2009-07-09 | 2014-05-07 | アルプス電気株式会社 | Input device |
| CN102043429B (en) * | 2009-10-26 | 2013-04-10 | 英业达股份有限公司 | Electrostatic discharge structure of notebook computer |
-
2006
- 2006-09-11 CN CNB2006101520916A patent/CN100538594C/en active Active
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| Publication number | Publication date |
|---|---|
| CN101145072A (en) | 2008-03-19 |
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