CN100530472C - Super-thin plastic key modular and its manufacturing method - Google Patents

Super-thin plastic key modular and its manufacturing method Download PDF

Info

Publication number
CN100530472C
CN100530472C CNB2005100539268A CN200510053926A CN100530472C CN 100530472 C CN100530472 C CN 100530472C CN B2005100539268 A CNB2005100539268 A CN B2005100539268A CN 200510053926 A CN200510053926 A CN 200510053926A CN 100530472 C CN100530472 C CN 100530472C
Authority
CN
China
Prior art keywords
thin plate
super
manufacture method
thin
plastic key
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100539268A
Other languages
Chinese (zh)
Other versions
CN1835155A (en
Inventor
陈志鸿
黄益建
练玉燕
陈建佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XURONG ELECTRONIC (SHENZHEN) CO Ltd
Silitech Technology Corp
Original Assignee
XURONG ELECTRONIC (SHENZHEN) CO Ltd
HONGHUI INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XURONG ELECTRONIC (SHENZHEN) CO Ltd, HONGHUI INDUSTRY Co Ltd filed Critical XURONG ELECTRONIC (SHENZHEN) CO Ltd
Priority to CNB2005100539268A priority Critical patent/CN100530472C/en
Publication of CN1835155A publication Critical patent/CN1835155A/en
Application granted granted Critical
Publication of CN100530472C publication Critical patent/CN100530472C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The method includes following steps: first, supplying a sheet plate; next, positioning the sheet plate by an optical positioning module; then, fabricating the sheet plate to a prearranged shape by computer numerical control (CNC) equipment; setting up a elastic body at lower end of the sheet plate with prearranged shape so as to produce ultrathin key-press body. Advantages are: reducing thickness of module of key-press, not deforming object, or producing cutting raw edge etc. caused by limitation of machine or die designed.

Description

Super-thin plastic key modular and preparation method thereof
Technical field
The present invention relates to a kind of super-thin plastic key modular and preparation method thereof, especially refer to a kind of location, reach computer numerical control (Computer Numerical Control by the optical alignment module, CNC) processing of equipment, and make super-thin plastic key modular of ultra-thinization of key body and preparation method thereof.
Background technology
See also shown in Figure 1ly, it is the flow chart of the manufacture method of existing key-press module.By in the flow chart as can be known, the manufacture method of existing key-press module comprises: at first, offer a predetermined plastics mould (S100); Then, by this plastics mould, with the be shaped thin plate (S102) of desired thickness of ejection formation (Injection Molding) mode, wherein this thickness is general all greater than 1 millimeter; Then, provide anchor clamps (S104) that are used to locate this thin plate; Process the outward appearance (S106) of this thin plate, as picture and text, symbol are set in the front or the back side of thin plate; Next, this thin plate of punching press is with a plurality of key bodies (S108) that are shaped; At last, fit or a plurality of elastomers are set in these corresponding key body lower ends (S110), to finish the making of key-press module.
The molding mode of existing plastic key body all carries out with injection forming method, but the plastics ejection formation is when doing thickness and being lower than 1 millimeter object, because of restrictions such as machine, mold design often cause the object distortion, material is not enough and unusual generation such as die-cut burr.
In addition, following shortcoming is still arranged in existing the making:
1, during injection molding is made, need be at the different plastics mould of thin plate design of different-thickness;
2, when the thin plate of location, must use another positioning fixture to carry out outward appearance processing; And
3, during last drawing quality steel sheet, must use stamping machine again in addition and cooperate the use of punching press anchor clamps.
Be with, as from the foregoing, above-mentioned existing key-press module and using method thereof on reality is used, obviously have inconvenience and exist with disappearance, and can wait to be improved.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of super-thin plastic key modular and preparation method thereof, its location, and the processing of computer numerical control (CNC) equipment by the optical alignment module, and produce the key body of ultra-thinization.Not only make the thickness of key-press module integral body reduce, and do in the process in the ultra-thin key system, can be because of restrictions such as machine, mold designs, and cause the object distortion, material is not enough and unusual generation the such as die-cut burr.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of manufacture method of super-thin plastic key modular, its step comprises: at first, provide a thin plate; Then, by an optical alignment module to locate this thin plate; Then, by computer numerical control (CNC) equipment, become a predetermined shape to process this thin plate; At last, an elastomer is set and has the thin plate lower end of reservation shape in this.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of super-thin plastic key modular, it comprises: thin shape push button body and elastomer.This thin shape push button body is shaped by computer numerical control (CNC) apparatus processing, and this thin shape push button body has the thickness smaller or equal to 1 millimeter; And this elastomer is arranged at this thin shape push button body lower end.
For feature of the present invention and technology contents are described better, see also following about detailed description of the present invention and accompanying drawing, yet this accompanying drawing only provide with reference to and explanation usefulness, be not to be used for to the present invention's limitr in addition.
Description of drawings
Fig. 1 is the flow chart of the manufacture method of existing key-press module;
Fig. 2 is the flow chart of first embodiment of the manufacture method of super-thin plastic key modular of the present invention;
Fig. 3 is the flow chart of second embodiment of the manufacture method of super-thin plastic key modular of the present invention;
Fig. 4 is the flow chart of the 3rd embodiment of the manufacture method of super-thin plastic key modular of the present invention; And
Fig. 5 is the schematic diagram of super-thin plastic key modular of the present invention.
Wherein, Reference numeral:
10-thin shape push button body
The 20-elastomer
D-is less than 1 millimeter
Embodiment
See also shown in Figure 2ly, it is the flow chart of first embodiment of the manufacture method of super-thin plastic key modular of the present invention.By in the flow chart as can be known, the invention provides a kind of manufacture method of super-thin plastic key modular, its step comprises: at first, provide a thin plate (S200), wherein this thin plate is a plastic material, and this gauge of sheet is smaller or equal to 1 millimeter; Then, to locate this thin plate (S202), wherein this optical alignment module has the sensitization coupling element (CCD) or the complementary metal oxide semiconductors (CMOS) (CMOS) of a location usefulness by an optical alignment module; Then, (Computer Numerical Control, CNC) equipment become a predetermined shape (S204) to process this thin plate by computer numerical control.
Then, a plurality of picture and text or symbol are set have the back side (S206) of the thin plate of reservation shape in this, the method for this setting can be the mode of printing (coating) or coating (printing); At last, an elastomer is set and has the thin plate lower end (S208) of reservation shape in this.If this thin plate then must not pass through drawing for predetermined single group key body size,, then carry out punching press and make (must not change process equipment and jig) by this computer numerical control appliance if this thin plate is many group key bodies.
See also shown in Figure 3ly, it is the flow chart of second embodiment of the manufacture method of super-thin plastic key modular of the present invention.By in the flow chart as can be known, the step S300 to S304 of second embodiment and S308 are identical with step S200 to S204 and the S208 of first embodiment.And maximum difference is: comprise after the step S304: by a laser engraving equipment, this has the front of the thin plate of reservation shape with laser engraving, makes the front of this thin plate produce required picture and text or symbol (S306).
See also shown in Figure 4ly, it is the flow chart of the 3rd embodiment of the manufacture method of super-thin plastic key modular of the present invention.By in the flow chart as can be known, the step S400 to S404 of the 3rd embodiment is identical with the step S200 to S204 of first embodiment.And maximum difference is: comprise after the step S404: by a laser engraving equipment, this has the front of the thin plate of reservation shape with laser engraving, makes the front of this thin plate produce required picture and text or symbol (S406); Then, be coated with the front (S408) of the thin plate of defensive dura mater behind this laser engraving; One elastomer is set at last has the thin plate lower end (S410) of reservation shape in this.
In addition, this laser engraving equipment is to the laser engraving degree of depth control of this thin plate, by the laser output power size decision of this laser engraving equipment of adjustment.And this laser engraving equipment, is carved live width, line-spacing and line style to change, and is presented required pattern and texture by the laser output power of this laser engraving equipment of adjustment and the variation in path the weavy grain control in the front of this thin plate.
See also shown in Figure 5ly, it is for the schematic diagram of super-thin plastic key modular of the present invention.By among the figure as can be known, the invention provides a kind of super-thin plastic key modular, it comprises: a thin shape push button body 10 and is arranged at the elastomer 20 of these thin shape push button body 10 lower ends.Wherein this thin shape push button body 10 is shaped by computer numerical control (CNC) apparatus processing and forms, and this thin shape push button body 10 has the thickness smaller or equal to 1 millimeter (D).
In addition, this thin shape push button body 10 is a plastic material.And the back side of this thin shape push button body 10 is provided with a plurality of picture and text or symbol in the mode of printing or coating; The front of this thin shape push button body 10 is provided with a plurality of picture and text or symbol in the mode of laser engraving.
In sum, the location of the present invention by the optical alignment module, and the processing of computer numerical control (CNC) equipment, and produce the key body of ultra-thinization.Not only make the thickness of key-press module integral body reduce, and do in the process in the ultra-thin key system, can be because of restrictions such as machine, mold designs, and cause the object distortion, material is not enough and unusual generation the such as die-cut burr.
Above said content only is a preferable possible embodiments of the present invention, is not to be used to limit scope of patent protection of the present invention, so the equivalence techniques that uses specification of the present invention and accompanying drawing content to do such as changes, all in like manner all is contained in protection scope of the present invention.

Claims (14)

1, a kind of manufacture method of super-thin plastic key modular is characterized in that, comprises the steps:
One thin plate is provided, and its thickness is smaller or equal to 1 millimeter;
Locate described thin plate, it is by an optical alignment module;
Processing described thin plate becomes a predetermined shape, and it is by a computer numerical control appliance; And
One elastomer is set in described thin plate lower end with reservation shape.
2, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, described optical alignment module has the sensitization coupling element of a location usefulness.
3, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, described optical alignment module has a complementary metal oxide semiconductors (CMOS) that is used to locate.
4, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, after the described procedure of processing, further comprises: a plurality of picture and text or symbol are set in the described back side with thin plate of reservation shape.
5, the manufacture method of super-thin plastic key modular according to claim 4 is characterized in that, described picture and text or symbol are arranged at the described back side with thin plate of reservation shape in the mode of printing or coating.
6, the manufacture method of super-thin plastic key modular according to claim 1, it is characterized in that, after the described procedure of processing, further comprise: by a laser engraving equipment, with the described front of laser engraving, make the front of described thin plate produce required picture and text or symbol with thin plate of reservation shape.
7, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, after the described procedure of processing, further comprises:
By a laser engraving equipment,, make the front of described thin plate produce required picture and text or symbol with the described front of laser engraving with thin plate of reservation shape; And
Be coated with the front of the thin plate of defensive dura mater behind described laser engraving.
8, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, described thin plate is a plastic material.
9, the manufacture method of super-thin plastic key modular according to claim 1 is characterized in that, a kind of super-thin plastic key modular according to this method obtains comprises:
One thin plate that shapes by the computer numerical control appliance, described thin plate has the thickness smaller or equal to 1 millimeter; And
One elastomer, it is arranged at described thin plate lower end.
10, the manufacture method of super-thin plastic key modular according to claim 9 is characterized in that, described thin plate is a plastic material.
11, the manufacture method of super-thin plastic key modular according to claim 9 is characterized in that, the back side of described thin plate is provided with a plurality of picture and text or symbol.
12, the manufacture method of super-thin plastic key modular according to claim 11 is characterized in that, described picture and text or symbol are arranged at the back side of described thin plate in the mode of printing or coating.
13, the manufacture method of super-thin plastic key modular according to claim 9 is characterized in that, the front of described thin plate is provided with a plurality of picture and text or symbol.
14, the manufacture method of super-thin plastic key modular according to claim 13 is characterized in that, described picture and text or symbol are arranged at the front of described thin plate in the mode of laser engraving.
CNB2005100539268A 2005-03-14 2005-03-14 Super-thin plastic key modular and its manufacturing method Expired - Fee Related CN100530472C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005100539268A CN100530472C (en) 2005-03-14 2005-03-14 Super-thin plastic key modular and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100539268A CN100530472C (en) 2005-03-14 2005-03-14 Super-thin plastic key modular and its manufacturing method

Publications (2)

Publication Number Publication Date
CN1835155A CN1835155A (en) 2006-09-20
CN100530472C true CN100530472C (en) 2009-08-19

Family

ID=37002853

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100539268A Expired - Fee Related CN100530472C (en) 2005-03-14 2005-03-14 Super-thin plastic key modular and its manufacturing method

Country Status (1)

Country Link
CN (1) CN100530472C (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276699B (en) * 2007-03-30 2010-05-26 毅嘉科技股份有限公司 Method for preparing thin type press key panel
CN103963331A (en) * 2014-04-09 2014-08-06 格林精密部件(惠州)有限公司 Processing method for ultrathin plastic piece
CN110549071B (en) * 2019-09-06 2022-02-11 珠海菲高科技股份有限公司 Method for processing ultra-miniature part

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5807002A (en) * 1997-08-26 1998-09-15 Silitek Corporation Super-thin plastic key
US6153844A (en) * 1997-03-27 2000-11-28 Mitsubishi Denki Kabushiki Kaisha Integrated key top assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153844A (en) * 1997-03-27 2000-11-28 Mitsubishi Denki Kabushiki Kaisha Integrated key top assembly
US5807002A (en) * 1997-08-26 1998-09-15 Silitek Corporation Super-thin plastic key

Also Published As

Publication number Publication date
CN1835155A (en) 2006-09-20

Similar Documents

Publication Publication Date Title
CN101010997B (en) Small electronic casing and method for producing the same
CN100530472C (en) Super-thin plastic key modular and its manufacturing method
CN101664996B (en) Flat plate bending process for plastic blanks
AU2001250323A1 (en) Method for making a fuel tank in plastic material
CN101284294A (en) Silicon steel sheet punching die blade blocks and processing technique
CN101380801A (en) Shell injection molding die and die combination and manufacture method thereof
CN201049508Y (en) Die cutting and forming integrated die
CN106851995A (en) The high-accuracy multi-joint removable processing method for filling unit printed board
CN104203447A (en) Incremental forming method
CN100513194C (en) Gold-stamping common concave-convex forming process
CN106001579A (en) Technology for manufacturing panel of golf club
CN106695255B (en) Key production technology
KR20060129848A (en) Wireless mobile terminal and its cover member and method for manufacturing the cover member
US6635210B2 (en) Method for manufacturing a shell element for an electronic device
EP0787567A3 (en) Method for making optical preforms and optical elements by press molding
US20090098238A1 (en) Injection mold and method of using the same
KR20010093446A (en) Press dies manufacturing method
CN103934944A (en) Appearance decoration effect processing method for carbon fibers and product thereof
CN108327181A (en) Nanometer texture transfer injection mold and its method in a kind of mould
CN112140472A (en) Modular 3D printing mold and manufacturing method thereof
CN215750464U (en) Secondary injection molding mold for automobile ornaments
CN218111558U (en) Quick remodeling mould based on module combination
CN219999909U (en) Shielding cover and preparation equipment
CN101648238B (en) Punching mould edge block of silicone steel sheet
CN106608018B (en) Product injection molding method and device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SILITECH CORP.; APPLICANT

Free format text: FORMER OWNER: SILITECH CORP.

Effective date: 20080509

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20080509

Address after: Taipei County of Taiwan Province

Applicant after: SILITECH TECHNOLOGY CORP.

Co-applicant after: XURONG ELECTRONIC (SHENZHEN) Co.,Ltd.

Address before: Taipei County of Taiwan Province

Applicant before: SILITECH TECHNOLOGY CORP.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090819