CN100518448C - A manufacturing method of via-hole of circuit board - Google Patents
A manufacturing method of via-hole of circuit board Download PDFInfo
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- CN100518448C CN100518448C CNB2005101237335A CN200510123733A CN100518448C CN 100518448 C CN100518448 C CN 100518448C CN B2005101237335 A CNB2005101237335 A CN B2005101237335A CN 200510123733 A CN200510123733 A CN 200510123733A CN 100518448 C CN100518448 C CN 100518448C
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Abstract
This invention discloses one circuit board hole process method, which comprises the following steps: forming first and second conductive layers on one isolation baseboard together with first and second conductive layers to form hole; combining first light resistance layer and first protection layer onto first layer; injecting first solvent agent into hole to form first window; using light and exposure of first protection layer then removing first protection layer; orderly combining second light resistance layer and second protection layer onto second conductive layer; using same method to form one second window; using light to expose second light resistance layer by second protection layer then removing second protection layer and forming conductive layer.
Description
Technical field
The present invention relates to a kind of manufacture method of via-hole of circuit board, particularly a copper clad laminate utilize a through hole itself the position respectively at two the window's positions of two side explications, two photoresist layers electroplate so that carry out the via-hole of circuit board of follow-up this through hole of plating.
Background technology
Shown in Figure 1A to Fig. 1 F, it is an available circuit plate thru-hole electroplating method, and its step is as follows: (1), shown in Figure 1A, and its upper and lower surface at an insulated substrate 90 forms a conductive layer 91 respectively; (2), shown in Figure 1B, to this insulated substrate 90 and the boring of two conductive layers 91, forming a through hole 92, and the hole wall of this through hole 92 forms a coating (indicating); (3), shown in Fig. 1 C, pressing forms a photoresist layer 93 respectively on these two conductive layers, 91 surfaces, this photoresist layer 93 covers these through holes 92; (4), shown in Fig. 1 D, utilize light shield (not illustrating) to expose respectively corresponding to the position of this through hole 92 and utilize developer solution to develop at this two photoresist layer 93, and forming an exposure window 94, the aperture of this exposure window 94 is greater than the aperture of this through hole 92; (5), shown in Fig. 1 E, this through hole 92 is electroplated, be communicated with conductive layer 95 to form one, thereby form via structure; And (6), shown in Fig. 1 F, remove this photoresist layer 93, whereby this conductive layer 91, be communicated with the circuit layout on the upper and lower surface of this insulated substrate 90 of conductive layer 95 conductings.
Though foregoing circuit plate thru-hole electroplating method is a general industry electro-plating method commonly used, but in actual manufacture process, because foregoing circuit plate thru-hole electroplating method is to form this through hole 92 earlier, the later use light shield exposes to this photoresist layer 93 again, make its position exposure imaging form this window 94 corresponding to this through hole 92, therefore if the light shield location is incorrect, this window 94 will form bit errors (shown in Fig. 1 G easily with through hole 92, corresponding to Fig. 1 D), when serious even cause follow-up plating only to form this connections conductive layer 95 of not conducting, and then reduce circuit board manufacturing qualification rate and reliability relatively.In addition, shown in Fig. 1 D, industry is utilized the aperture size of the exposure window 94 that increases this photoresist layer 93 usually, to avoid producing the situation of above-mentioned bit errors.Yet shown in Fig. 1 F, after this was communicated with conductive layer 95 formation, the position that this connection conductive layer 95 extends this through hole 95 also increased relatively.Simultaneously, because this pliability that is communicated with conductive layer 95 is lower, therefore if this circuit board is selected from flexible circuit board, then this connection conductive layer 95 extends the then easy situation that embrittlement takes place because of the bending of this circuit board in position of this through hole 95.Therefore, it is necessary further to improve foregoing circuit plate thru-hole electroplating method really.
Summary of the invention
For overcoming above-mentioned defective, main purpose of the present invention provides a kind of manufacture method of via-hole of circuit board, the one copper clad laminate utilizes the position of a through hole itself to define two the window's positions of two photoresist layers respectively, form a connection conductive layer so that in this through hole, electroplate, make the present invention have the effect that promotes contraposition accuracy and manufacture process convenience.
Secondary objective of the present invention provides a kind of manufacture method of via-hole of circuit board; it forms a conductive layer respectively in an insulated substrate two sides; and this conductive layer is in regular turn in conjunction with a photoresist layer and a protective layer; and utilize a light by this protective layer; with this photoresist layer of light stiffening; keep the previous window shape that forms of this photoresist layer, make the present invention have the effect that promotes via shaping qualification rate.
The manufacture method of plate via in a circuit according to the invention, it comprises the following step: two sides at a circuit substrate form one first conductive layer and one second conductive layer respectively, and this insulated substrate, first conductive layer and second conductive layer run through jointly and form a through hole; One first photoresist layer and one first protective layer are incorporated on this first conductive layer in regular turn; One first solvent is injected this through hole,, and then form one first window with the position of this first photoresist layer of eccysis corresponding to this through hole; Utilize a light to pass through this first protective layer, remove this first protective layer again with this first photoresist layer of light stiffening; One second photoresist layer and one second protective layer are incorporated on this second conductive layer in regular turn; Utilize identical manufacture method to form one second window at this second photoresist layer; Utilize a light by this this second photoresist layer of second protective layer light stiffening, remove this second protective layer again; And, remove this first and second photoresist layer again at this electroplates in hole formation one connection conductive layer.
In addition, manufacture method according to another via-hole of circuit board of the present invention, it comprises step: one first side and one second side at an insulated substrate form one first conductive layer and one second conductive layer respectively, and this insulated substrate, first and second conductive layer run through jointly and form a through hole; One first barrier layer is incorporated on first conductive layer of this first side, and, removes the position of this first barrier layer, and then form one first window corresponding to this through hole via the through hole of second side of this insulated substrate; One second barrier layer is incorporated on second conductive layer of this second side, and, removes the position of this second barrier layer, and then form one second window corresponding to this through hole via the through hole of first side of this insulated substrate; And, remove this first and second barrier layer again at this electroplates in hole formation one connection conductive layer.
Adopt said method, this first, second window can conveniently be electroplated in this through hole and form a connection conductive layer.Owing to utilize the position of this through hole itself to define two the window's positions of two photoresist layers respectively, make qualification rate so the present invention can guarantee the contraposition accuracy of this first and second window and through hole and circuit board.In addition, because the position that this connection conductive layer extends this through hole has less relatively size, thereby can avoid the situation of this connection conductive layer generation embrittlement.
Description of drawings
Figure 1A to Fig. 1 F is the cutaway view that common circuit plate thru-hole electroplating method is made the via step.
Fig. 1 G is the cutaway view that common circuit plate thru-hole electroplating method produces bit errors.
Fig. 2 is the process block diagram of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention.
Fig. 3 A to Fig. 3 K makes the cutaway view of via step for the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention.
Embodiment
For above-mentioned and other purpose of the present invention, feature, advantage can be become apparent, preferred embodiment of the present invention cited below particularly, and cooperate appended graphicly, be described in detail below:
Shown in Fig. 3 A and Fig. 3 B, it is the first step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, it is that two sides at an insulated substrate 10 form one first conductive layer 11 and one second conductive layer 11 ' respectively, and this insulated substrate 10, first conductive layer 11 and second conductive layer 11 ' run through jointly and form a through hole 12.In more detail, this first and second conductive layer 11,11 ' preferable copper (Cu) conductive layer that is selected from, and this first and second conductive layer 11,11 ' is selected to be formed at this insulated substrate 10 surfaces in the mode of Copper Foil.The mode of these through hole 12 preferable optional self-excitation drill finish holes or machine drilling runs through this insulated substrate 10, first and second conductive layer 11,11 '.In addition, the hole wall of this through hole 12 (not indicating) can select to form a coating (not indicating).
Shown in Fig. 3 C figure, it is second step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, and it is that one first photoresist layer 13 (first barrier layer) and one first protective layer 14 are incorporated on this first conductive layer 11 in regular turn.In more detail, a side of this first photoresist layer 13 can be selected to be incorporated on this first conductive layer 11 in the mode of pressing.This first protective layer 14 is incorporated into the opposite side of this first photoresist layer 13; so that being established, these first photoresist layer, 13 folders are fixed between this first conductive layer 11 and first protective layer 14; this first photoresist layer 13 of 14 overfill protections of this first protective layer, and then avoid these first photoresist layer, 13 unexpected peeling off in the subsequent manufacturing processes.These first protective layer, 14 preferable optional autopolyester film transparent materials such as (polyester) pass through for light.
Shown in Fig. 3 D, it is the third step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, it is that one first solvent (not indicating) is injected this through hole 12, with the position of this first photoresist layer 13 of eccysis corresponding to this through hole 12, and then forms one first window 131.In more detail, this first solvent can be selected appropriate solvent according to the material of this first photoresist layer 13.This first solvent is to be injected in this through hole 12 by a side of this through hole 12 (also promptly away from a side of this first photoresist layer 13), and this this first photoresist layer 13 of first solvent eccysis is corresponding to the position of this through hole 12 and peripheral region thereof, to form this first window 131.The preferable aperture that is controlled to relative greater than this through hole 12 of the bore of this first window 131.Except this first solvent being injected the method in this through hole 12, preferred embodiment of the present invention also can be selected this circuit board is dipped in this first solvent fully, and it can reach the exposure portion of eccysis corresponding to this first photoresist layer 13 of this through hole 12 equally.
Shown in Fig. 3 E and Fig. 3 F figure, it is the 4th step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, and it is to utilize a light to pass through this first protective layer 14 with this first photoresist layer 13 of light stiffening, removes this first protective layer 14 again.In more detail, after step of exposure, make this first photoresist layer 13 obtain enough structural strengths, this first window 131 forms open shape simultaneously.
Shown in Fig. 3 F to Fig. 3 I, it is the 5th to seven step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, and it is that one second photoresist layer 13 ' (second barrier layer) and one second protective layer 14 ' are incorporated on this second conductive layer 11 ' in regular turn; Utilize identical manufacture method to form one second window 131 ' at this second photoresist layer 13 '; Utilize a light by this this second photoresist layer 13 ' of second protective layer, 14 ' light stiffening, remove this second protective layer 14 ' again.In more detail, the present invention utilizes this first solvent (not indicating) to be injected in this through hole 12, to form this second window 131 ' by this first window 131.Like this, this through hole 12, first and second window 131,131 ' run through this insulated substrate 10, first and second conductive layer 11,11 ', first and second photoresist layer 13,13 ' jointly.
Shown in 3J and 3K figure, the 8th step of the manufacture method of the via-hole of circuit board of preferred embodiment of the present invention, it is electroplated at this via 12 and forms a connection conductive layer 15, removes this first and second photoresist layer 13,13 ' again.In more detail, these connection conductive layer 15 preferable selections are formed at this through hole 12 in the mode of electro-coppering, so promptly form via structure.This connection conductive layer 15 is these first and second conductive layers 11,11 ' that electrically conduct, for this first and second conductive layer 11 of electrically conducting, 11 ' circuit layout.
As mentioned above, common circuit plate thru-hole electroplating method compared to Fig. 1 G forms this through hole 92 earlier, later use light shield exposure again, the mode of developing liquid developing forms this window 94, cause this window 94 that shortcomings such as serious bit errors take place with through hole 92 easily because of the light shield relative positioning is not good, the present invention of Fig. 2 utilizes these through hole 12 positions own to define this first and second photoresist layer 13 in two sides respectively, first and second window 131 of 13 ', 131 ' position, so that follow-up plating forms the connection conductive layer 15 of this through hole 12, it can promote contraposition accuracy and circuit board really relatively and make qualification rate.
Though the present invention has utilized above-mentioned preferred embodiment to disclose; right its is not in order to limit the present invention; any those skilled in the art; do not breaking away within the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention is as the criterion when looking the scope that claim of the present invention defines.
Claims (5)
1, a kind of manufacture method of via-hole of circuit board, it comprises step:
Two sides at an insulated substrate form one first conductive layer and one second conductive layer respectively, and this insulated substrate, first and second conductive layer run through jointly and form a through hole;
One first photoresist layer and one first protective layer are incorporated on this first conductive layer in regular turn;
One first solvent is injected this through hole,, and then form one first window with the position of this first photoresist layer of eccysis corresponding to this through hole;
Utilize a light to pass through this first protective layer, remove this first protective layer again with this first photoresist layer of light stiffening;
One second photoresist layer and one second protective layer are incorporated on this second conductive layer in regular turn, and utilize identical manufacture method to form one second window at this second photoresist layer;
Utilize a light to pass through this second protective layer, remove this second protective layer again with this second photoresist layer of light stiffening; And
Form one at this electroplates in hole and be communicated with conductive layer, remove this first and second photoresist layer again.
2, the manufacture method of via-hole of circuit board as claimed in claim 1 is characterized in that: this connection conductive layer, first and second conductive layer are the copper conductive layer.
3, the manufacture method of via-hole of circuit board as claimed in claim 1 is characterized in that: this first and second protective layer is a transparent material.
4, the manufacture method of via-hole of circuit board as claimed in claim 1 is characterized in that: this first and second protective layer is a polyester film.
5, the manufacture method of via-hole of circuit board as claimed in claim 1 is characterized in that: the bore of this first and second window is relatively greater than the aperture of this through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101237335A CN100518448C (en) | 2005-11-22 | 2005-11-22 | A manufacturing method of via-hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101237335A CN100518448C (en) | 2005-11-22 | 2005-11-22 | A manufacturing method of via-hole of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1972569A CN1972569A (en) | 2007-05-30 |
| CN100518448C true CN100518448C (en) | 2009-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101237335A Active CN100518448C (en) | 2005-11-22 | 2005-11-22 | A manufacturing method of via-hole of circuit board |
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| CN (1) | CN100518448C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1338497A (en) * | 1970-11-11 | 1973-11-21 | Nippon Telegraph & Telephone | Photochemical method for forming a metal image |
| US4671854A (en) * | 1985-04-24 | 1987-06-09 | Nippon Paint Co., Ltd. | Method for preparing a printed circuit board with solder plated circuit and through-holes |
| US5218761A (en) * | 1991-04-08 | 1993-06-15 | Nec Corporation | Process for manufacturing printed wiring boards |
| CN1309527A (en) * | 1999-12-16 | 2001-08-22 | 松下电器产业株式会社 | Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
-
2005
- 2005-11-22 CN CNB2005101237335A patent/CN100518448C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1338497A (en) * | 1970-11-11 | 1973-11-21 | Nippon Telegraph & Telephone | Photochemical method for forming a metal image |
| US4671854A (en) * | 1985-04-24 | 1987-06-09 | Nippon Paint Co., Ltd. | Method for preparing a printed circuit board with solder plated circuit and through-holes |
| US5218761A (en) * | 1991-04-08 | 1993-06-15 | Nec Corporation | Process for manufacturing printed wiring boards |
| CN1309527A (en) * | 1999-12-16 | 2001-08-22 | 松下电器产业株式会社 | Removeable film, substrate with film, method for forming said film and circuit board mfg. method |
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| Publication number | Publication date |
|---|---|
| CN1972569A (en) | 2007-05-30 |
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