CN100510882C - Light interference type display paneland making method thereof - Google Patents
Light interference type display paneland making method thereof Download PDFInfo
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- CN100510882C CN100510882C CNB031002943A CN03100294A CN100510882C CN 100510882 C CN100510882 C CN 100510882C CN B031002943 A CNB031002943 A CN B031002943A CN 03100294 A CN03100294 A CN 03100294A CN 100510882 C CN100510882 C CN 100510882C
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Abstract
The method for making light interference type display panel includes the following steps: forming patterned supporting layer on a transparent base plate, then successively forming first electrode layer and optical film on the transparent base plate and supporting layer, and forming sacrificial material layer on optical film, then using supporting layer as cover curtain to make back-surface exposure production process to pattern the sacrificial material layer, then removing partially-patterned sacrificial material layer to expose the optical film over the supporting layer to form sacrificial layer, then forming second electrode layer on the sacrificial layer and partial optical film between adjacent supporting layers, finally removing sacrificial layer.
Description
Technical field
The invention relates to a kind of flat-panel screens and manufacture method thereof, and particularly relevant for a kind of light interference type display panel (optical interference type panel) and manufacture method thereof.
Background technology
Have flat-panel screens in light weight, thin thickness at present, for example LCD (LCD), organic electro-luminescent display spare (OLED), plasma scope (PDP) etc. are widely used in the daily life.Wherein, LCD has become the main flow of display gradually, but LCD still has many problems, for example be that the visual angle is wide inadequately, response time is fast inadequately, need can full-colorization by colored filter, and needs use polaroid and make the light source utilization ratio not good, and then cause the more problem of power consumption or the like of backlight module.
Existing now a kind of light interference type display panel is developed, and it is made of the interference of light regulator (Optical Interference Modulator) that a plurality of arrays are arranged.Wherein, interference of light regulator mainly is made of a transparency electrode, a reflecting electrode and a supporting layer in order to the supporting reflex electrode.Support by supporting layer, can be at interval between reflecting electrode and the transparency electrode a specific clearance (Air Gap), light is advanced as after the interference of light regulator by the transparency electrode end, can and be incident on second electrode through the clearance, then reflect from the transparency electrode end by second electrode again.Because light can be subjected to interference (Interference) in various degree in different clearances, and then presents different color light, as ruddiness, green glow and blue light.In addition, reflecting electrode in the interference of light regulator must be in conjunction with MEMS (micro electro mechanical system) (Micro Electro Mechanical System, MEMS) design,, and then reach the purpose of demonstration so that interference of light regulator can switch between On/Off (on/off) two states.
The above-mentioned light interference type display panel that is made of interference of light regulator does not need framework color filter film and Polarizer can show suitable colour picture, can save and use the required cost of colored filter.In addition, the above-mentioned light interference type display panel that is made of interference of light regulator has the characteristic of low electric power power consumption, rapid answer time and bistable state (Bi-stable), therefore help the exploitation of low electric power energy-consuming product, and then be applied on the product of Portable (portable), for example be mobile phone (MobilePhone), PDA(Personal Digital Assistant), e-book (e-book) etc.
Figure 1A to Fig. 1 F illustrate is the flow process sectional view of the manufacture method of known a kind of light interference type display panel.At first, please refer to Figure 1A, form first electrode layer 102, the optical thin film 103 and sacrifice layer 104 of patterning on transparency carrier 100, wherein the material of sacrifice layer 104 is used the lighttight molybdenum or the alloy of molybdenum.Then, please refer to Figure 1B, on sacrifice layer 104, form the photoresist layer 108 of layer of support material 106 and minus in regular turn.Then, please refer to Fig. 1 C, serves as the cover curtain with lighttight sacrifice layer 104, carries out a back-exposure step 110 and development step, to form patterned light blockage layer 108a.Then, please refer to Fig. 1 D, is etch mask with photoresist layer 108a, removes not the layer of support material 106 that covered by photoresist layer 108a to form supporting layer 106a.Then, please refer to Fig. 1 E, remove photoresist layer 108a, on the sacrifice layer between supporting layer 106a 104, go up formation the second electrode lay 112 again with supporting layer 106a.Then, please refer to Fig. 1 F, carry out one and discharge manufacture craft (Release Process), with xenon difluoride (XeF
2) gas is etchant, makes sacrifice layer 104 be converted into gas and removed, and arranges the light interference type display panel that is constituted to form by a plurality of interference of light regulator arrays.
Yet, in the manufacture method of above-mentioned light interference type display panel, the material of sacrifice layer 104 must adopt lighttight material, and must remove by discharging manufacture craft, so the material that can select is few, thereby need to adopt the molybdenum or the alloy of molybdenum, yet as above-mentioned a large amount of use molybdenums or the alloy of molybdenum in sacrifice layer 104, will make that required manufacturing cost is higher.
Summary of the invention
Therefore, purpose of the present invention is to provide a kind of light interference type display panel and manufacture method thereof exactly, can reduce the manufacturing cost of light interference type display panel.
A further object of the present invention is to provide a kind of light interference type display panel and manufacture method thereof exactly, can simplify the manufacture craft of light interference type display panel.
The present invention proposes a kind of manufacture method of light interference type display panel, and the method forms the supporting layer of patterning on transparency carrier, forms first electrode layer again on transparency carrier and supporting layer, and forms optical thin film again on first electrode layer.Then, form sacrifice layer on the optical thin film between the supporting layer, wherein formed sacrifice layer is lower than the optical thin film of supporting layer top.Then, in forming the second electrode lay on the sacrifice layer between adjacent supporting layer with on the optical thin film partly, remove sacrifice layer again.
And the present invention can also form a sacrificial material layer on optical thin film, remove again the partial sacrifice material layer to the optical thin film that exposes supporting layer top to form sacrifice layer, wherein sacrifice layer is lower than the optical thin film of supporting layer top.
Even the present invention can also be that the cover curtain carries out a back-exposure manufacture craft with the supporting layer, to expose the optical thin film of supporting layer top after forming sacrificial material layer.
The present invention proposes a kind of light interference type display panel, mainly is made of a transparency carrier, a patterning supporting layer, one first electrode, an optical thin film and one second electrode.Wherein, supporting layer is arranged on the transparency carrier, first electrode be arranged on the transparency carrier with supporting layer on, optical thin film is arranged on first electrode, and the edge of second electrode is arranged on the part optical thin film of adjacent supporting layer top.
By the invention described above preferred embodiment as can be known, because light interference type display panel of the present invention forms lighttight supporting layer earlier, form the printing opacity sacrifice layer of first electrode layer, optical thin film and resistance material more in regular turn, in addition, the material of sacrifice layer can select for use cost low and be applicable to the material that discharges manufacture craft, need not adopt the molybdenum or the alloy of molybdenum as sacrifice layer, thereby can reduce the manufacturing cost of light interference type display panel.
And, because light interference type display panel of the present invention directly uses resistance material to form sacrifice layer, therefore the present invention can avoid known and must be coated with the step of one deck photoresist layer again on supporting layer, and then can simplify the manufacture craft of light interference type display panel.
Moreover, sacrificial material layer of the present invention on being formed at optical thin film after, can omit the back-exposure step and the mode of taking directly to eat-back forming sacrifice layer, thereby can further simplify the manufacture craft of light interference type display panel.
Even the present invention more can directly form the sacrifice layer of the optical thin film that is lower than the supporting layer top on the optical thin film between the supporting layer, thereby enough manufacture crafts of further simplifying light interference type display panel again.
Description of drawings
Figure 1A to Fig. 1 F is the diagrammatic cross-section of the manufacturing process of known a kind of light interference type display panel.
Fig. 2 A to Fig. 2 F is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of a preferred embodiment of the present invention.
Fig. 3 A to Fig. 3 F is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of another preferred embodiment of the present invention.
Fig. 4 A to Fig. 4 E is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of another preferred embodiment of the present invention.
Fig. 5 figure is according to the section of structure of the light interference type display panel of a preferred embodiment of the present invention.Indicate explanation:
100,200,300,400,500: transparency carrier
102,204,304,404,504: the first electrode layers
103,205,305,405: optical thin film
104,206b, 306a, 406: sacrifice layer
106: layer of support material
106a, 202,302,402,502: supporting layer
108,108a: photoresist layer
110,208: the back-exposure manufacture craft
112,210,308,408,506: the second electrode lay
206,206a, 306: sacrificial material layer
508: the clearance
Embodiment
Fig. 2 A to Fig. 2 F illustrate is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of a preferred embodiment of the present invention.
At first, please refer to Fig. 2 A, on transparency carrier 200, form the supporting layer 202 of patterning.Wherein the material of transparency carrier 200 for example is glass or transparent material, and the material of supporting layer 202 is made of lighttight material, and this lighttight material can be insulating material or macromolecule resin etc.The method that forms the supporting layer 202 of patterning for example is to use the lithography method.
Then, please refer to Fig. 2 B, on transparency carrier 200 and supporting layer 202, form the first conformal electrode layer 204 and optical thin film 305 in regular turn, this first electrode layer 204 conductor material that for example is printing opacity wherein, and the conductor material of this printing opacity for example is an indium tin oxide, and optical thin film 305 for example is the mutual stack layer of multilayer high dielectric constant material layer and low dielectric constant material layer.
Then, please refer to Fig. 2 C, form one deck sacrificial material layer 206 on optical thin film 305, wherein to can be the material of printing opacity for example be the minus photoresistance to the material of this sacrificial material layer 206, and the method that forms this sacrificial material layer 206 for example is to use method of spin coating (spin on coating).
Then, please refer to Fig. 2 D, serves as that the cover curtain carries out a back-exposure manufacture craft 208 with supporting layer 202, so that the sacrificial material layer 206 of supported layer 202 shaded portions does not produce photochemical reaction (Photochemistry).And then develop, solidify manufacture craft and have the sacrificial material layer 206a of opening with formation, and the opening of this sacrificial material layer 206a exposes the optical thin film 305 of supporting layer 202 tops.
Then, please refer to Fig. 2 E, the sacrificial material layer 206a that removes part is to form sacrifice layer 206b, the method of wherein removing partial sacrifice material layer 206a for example is to use etching method, be preferably the anisotropic etching method of using, and formed sacrifice layer 206b is preferably the optical thin film 305 that is lower than supporting layer 202 tops, so that sacrifice layer 206b is formed on the optical thin film 305 between the supporting layer 202.And then form the second electrode lay 210 on the optical thin film 305 of and part supporting layer 202 tops last in the sacrifice layer 206b of 202 of supporting layers.Wherein the second electrode lay 210 is preferable for example is by material light tight and good ductility of tool and mechanical property, for example is that metal constitutes.It should be noted that because the second electrode lay 210 is formed on the optical thin film 305, and optical thin film 305 be insulator herein, thus the second electrode lay 210 can't with 204 electric connections of first electrode layer, and can keep the normal operation of device.
Then, please refer to Fig. 2 F, remove all sacrifice layer 206b to form the light interference type display panel that is made of interference of light regulator, the method for wherein removing sacrifice layer 206b for example is to adopt to discharge manufacture craft.
The present invention still has other manufacture method except above-mentioned manufacture method.Fig. 3 A to Fig. 3 F illustrate is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of another preferred embodiment of the present invention.
At first, please refer to Fig. 3 A, on transparency carrier 300, form the supporting layer 302 of patterning.Wherein the material of transparency carrier 300 for example is glass or transparent resin, and the material of supporting layer 302 is made of lighttight material, and this lighttight material for example is insulating material or macromolecule resin etc.The method that forms the supporting layer 302 of patterning for example is to use the lithography method.
Then, please refer to Fig. 3 B, on transparency carrier 300 and supporting layer 302, form the first conformal electrode layer 304 and optical thin film 305, wherein this first electrode layer 304 for example is that conductor material by printing opacity is constituted, and the conductor material of printing opacity for example is an indium tin oxide, and optical thin film 305 for example is the mutual stack layer of multilayer high dielectric constant material layer and low dielectric constant material layer.
Then, please refer to Fig. 3 C, on optical thin film 305, form one deck sacrificial material layer 306, and then this sacrificial material layer 306 is solidified through the overcuring manufacture craft.Wherein to can be transparent material for example be photoresistance to the material of this sacrificial material layer 306, and its method that forms this sacrificial material layer 306 for example is to use method of spin coating.
Then, please refer to Fig. 3 D, the sacrificial material layer 306 of removing part is to form sacrifice layer 306a, this sacrifice layer 306a exposes the optical thin film 305 of supporting layer 302 tops, and sacrifice layer 306a is lower than the optical thin film 305 of supporting layer 302 tops, so that sacrifice layer 306a is formed on the optical thin film 305 between the supporting layer 302.The method of wherein removing partial sacrifice material layer 306a for example is to use etch-back (etch back) method.And then form the second electrode lay 308 on the optical thin film 305 of and part supporting layer 302 tops last in the sacrifice layer 306a of 302 of supporting layers.Wherein the second electrode lay 308 is preferable for example is by material light tight and good ductility of tool and mechanical property, for example is that metal constitutes.Same, because the second electrode lay 308 is formed on the optical thin film 305 of first electrode layer 304, so the second electrode lay 308 can't electrically connect with first electrode layer 304, and can keep the normal operation of device.
Then, please refer to Fig. 3 F, remove all sacrifice layer 306a to form the light interference type display panel that is made of interference of light regulator, the method for wherein removing sacrifice layer 306a for example is to adopt to discharge manufacture craft.
Even the present invention also has other manufacture method.Fig. 4 A to Fig. 4 E illustrate is the diagrammatic cross-section according to the manufacturing process of the light interference type display panel of another preferred embodiment of the present invention.
At first, please refer to Fig. 4 A, on transparency carrier 400, form the supporting layer 402 of patterning.Wherein the material of transparency carrier 400 for example is glass or transparent resin, and the material of supporting layer 402 is made of lighttight material, and this lighttight material for example is insulating material or macromolecule resin etc.The method that forms the supporting layer 402 of patterning for example is to use the lithography method.
Then, please refer to Fig. 4 B, on transparency carrier 400 and supporting layer 402, form the first conformal electrode layer 404 and optical thin film 405, wherein this first electrode layer 404 for example is that conductor material by printing opacity is constituted, and the conductor material of printing opacity for example is an indium tin oxide, and optical thin film 405 for example is the mutual stack layer of multilayer high dielectric constant material layer and low dielectric constant material layer.
Then, please refer to Fig. 4 C, on optical thin film 405, form one deck sacrifice layer 406, and then this sacrifice layer 406 is solidified through the overcuring manufacture craft, wherein this sacrifice layer 406 exposes the optical thin film 305 of supporting layer 402 tops, and sacrifice layer 406a be lower than supporting layer 402 tops optical thin film 405 so that sacrifice layer 406 be formed on the optical thin film 405 between the supporting layer 402.Wherein to can be transparent material for example be photoresistance to the material of this sacrificial material layer 406, and its method that forms this sacrificial material layer 406 for example is to use method of spin coating and planarization, and directly the thickness with sacrificial material layer 406 forms the optical thin film 405 that is lower than supporting layer 402 tops.Then, carry out an oxygen plasma surface treatment (slightly O
2Plasma etch for surface treatment) will residue on the optical thin film 405 of supporting layer 402 tops as thin as a wafer or the sacrificial layer material of seldom being permitted removed, and obtain structure shown in Fig. 4 C.
Then, please refer to Fig. 4 D, in forming the second electrode lay 408 on the sacrifice layer 406 of 402 of supporting layers with on the optical thin film 405 of part supporting layer 402 tops.Wherein the second electrode lay 408 is preferable for example is by material light tight and good ductility of tool and mechanical property, for example is that metal constitutes.Same, because the second electrode lay 408 is formed on the optical thin film 405 of first electrode layer 404, so the second electrode lay 408 can't electrically connect with first electrode layer 404, and can keep the normal operation of device.
Then, please refer to Fig. 4 E, remove all sacrifice layers 406 to form the light interference type display panel that is made of interference of light regulator, the method for wherein removing sacrifice layer 406 for example is to adopt to discharge manufacture craft.
With regard to using the angle that discharges manufacture craft, photoresist quite is applicable to the release manufacture craft, can use other various suitable materials in addition, for example be public dielectric material etc., so can the alternative costs low material of the present invention is to form sacrifice layer.
Fig. 5 illustrate is the section of structure according to the light interference type display panel of preferred embodiment of the present invention.Generally speaking, a light interference type display panel is array by the interference of light trim of majority and is disposed at transparency carrier and forms, yet for asking for simplicity, only illustrates an interference of light trim in Fig. 5.Please refer to Fig. 5, the light interference type trim in the light interference type display panel of the present invention mainly is made of transparency carrier 500, supporting layer 502, first electrode 504, optical thin film 505 and second electrode 506.
Supporting layer 502 is arranged on the transparency carrier 500, and wherein supporting layer 502 for example is that institutes such as insulating material or macromolecule resin constitute by lighttight material.
Optical thin film 505 is arranged on first electrode 504 and is slightly conformal in first electrode 504, and optical thin film 505 for example is the mutual stack layer by multilayer high dielectric constant material layer and low dielectric constant material layer.
The edge of second electrode 506 is arranged at individually on the optical thin film 505 of supporting layer 502 tops, and forms a clearance 508 between second electrode 506 and optical thin film 505.Wherein the second electrode lay 506 is preferable is made of material light tight and good ductility of tool and mechanical property.
The type of drive of above-mentioned light interference type display panel is in known identical, that is be in light interference type display panel, be subjected to driving with the pixel (light interference type trim) of delegation with first electrode of delegation, and the pixel of same row is subjected to the driving of second electrode of same row, when that is to say the specific pixel in driving array of pixels, drive first electrode of this pixel institute corresponding row, and drive second electrode of this pixel institute respective column.
In sum, the present invention has following advantage at least:
1. because light interference type display panel of the present invention forms lighttight supporting layer earlier, form the printing opacity sacrifice layer of first electrode layer, optical thin film and resistance material more in regular turn, and, the material of sacrifice layer can select for use cost low and be applicable to the material that discharges manufacture craft, need not adopt the molybdenum or the alloy of molybdenum as sacrifice layer, therefore can reduce the manufacturing cost of light interference type display panel.
2. because light interference type display panel of the present invention directly uses resistance material to form sacrifice layer, therefore, the present invention can avoid must forming the step of one deck photoresist layer again as known on supporting layer, and then can simplify the manufacture craft of light interference type display panel.
Moreover, sacrificial material layer of the present invention on being formed at optical thin film after, can omit the step of back-exposure and the mode of taking directly to eat-back forming sacrifice layer, thereby can further simplify the manufacture craft of light interference type display panel.
4. even, the present invention more can directly form the sacrifice layer of the optical thin film that is lower than the supporting layer top on the optical thin film between the supporting layer, thereby enough manufacture crafts of further simplifying light interference type display panel again.
Though the present invention with preferred embodiment openly as above; right its is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (20)
1, a kind of manufacture method of light interference type display panel is characterized in that: this method comprises the following steps:
On a transparency carrier, form a supporting layer of patterning;
On this transparency carrier and this supporting layer, form one first electrode layer;
On this first electrode layer, form an optical thin film;
On this optical thin film between this supporting layer, form a sacrifice layer;
In forming a second electrode lay on this sacrifice layer between this adjacent supporting layer with on relative this optical thin film of part; And
Remove this sacrifice layer.
2, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the material of this supporting layer comprises lighttight material.
3, the manufacture method of light interference type display panel as claimed in claim 2 is characterized in that: this lighttight material comprises insulating material or macromolecule resin.
4, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the material of this sacrifice layer comprises photoresist.
5, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the method that forms this sacrifice layer comprises method of spin coating.
6, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: this sacrifice layer is lower than this optical thin film of this supporting layer top.
7, the manufacture method of light interference type display panel as claimed in claim 6, it is characterized in that: after forming a sacrifice layer on this optical thin film between this supporting layer, also comprise this sacrifice layer and this optical thin film are carried out an oxygen plasma treatment manufacture craft, be attached to this sacrifice layer on this optical thin film of this supporting layer top with removal.
8, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the material of this first electrode layer comprises the material of printing opacity.
9, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: this optical thin film is formed by the mutual storehouse of multilayer high dielectric constant material layer and low dielectric constant material layer institute.
10, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the method that forms this sacrifice layer comprises the following steps:
On this optical thin film, form a sacrificial material layer; And
Remove this sacrificial material layer of part to this optical thin film that exposes this supporting layer top to form this sacrifice layer, wherein this sacrifice layer is lower than this optical thin film of this supporting layer top.
11, the manufacture method of light interference type display panel as claimed in claim 10 is characterized in that: remove this sacrificial material layer to this optical thin film that exposes those supporting layer tops and comprise etching method with the method that forms this sacrifice layer.
12, the manufacture method of light interference type display panel as claimed in claim 11, it is characterized in that: on this optical thin film, form after the sacrificial material layer, remove this sacrificial material layer of part to this optical thin film that exposes this supporting layer top to form before this sacrifice layer, also comprise with this supporting layer serving as that the cover curtain carries out a back-exposure manufacture craft, with this sacrificial material layer of patterning.
13, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the material of this second electrode lay comprises metal.
14, the manufacture method of light interference type display panel as claimed in claim 1 is characterized in that: the method for removing this sacrifice layer comprises the release manufacture craft.
15, a kind of light interference type display panel is characterized in that: comprising:
One transparency carrier;
One supporting layer is arranged on this transparency carrier;
One first electrode, be arranged on this transparency carrier with those supporting layers on;
One optical thin film is arranged on this first electrode; And
One second electrode, wherein the edge of this second electrode is arranged on this optical thin film of part of this adjacent supporting layer top.
16, light interference type display panel as claimed in claim 15 is characterized in that: the material of this supporting layer comprises lighttight material.
17, light interference type display panel as claimed in claim 15 is characterized in that: this lighttight material comprise group that insulating material or macromolecule resin organize one of them.
18, light interference type display panel as claimed in claim 15 is characterized in that: the material of this first electrode comprises the material of printing opacity.
19, light interference type display panel as claimed in claim 15 is characterized in that: this optical thin film is formed by the mutual storehouse of multilayer high dielectric constant material layer and low dielectric constant material layer institute.
20, light interference type display panel as claimed in claim 15 is characterized in that: the material of this second electrode lay comprises metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031002943A CN100510882C (en) | 2003-01-09 | 2003-01-09 | Light interference type display paneland making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031002943A CN100510882C (en) | 2003-01-09 | 2003-01-09 | Light interference type display paneland making method thereof |
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| Publication Number | Publication Date |
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| CN1515932A CN1515932A (en) | 2004-07-28 |
| CN100510882C true CN100510882C (en) | 2009-07-08 |
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| CNB031002943A Expired - Fee Related CN100510882C (en) | 2003-01-09 | 2003-01-09 | Light interference type display paneland making method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TW200951597A (en) | 2008-06-10 | 2009-12-16 | Ind Tech Res Inst | Functional device array with self-aligned electrode structures and fabrication methods thereof |
| TWI613488B (en) * | 2017-06-19 | 2018-02-01 | 友達光電股份有限公司 | Display panel and method for forming tether |
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