CN100505172C - Polishing composition and its stock solution, and polishing method using same - Google Patents
Polishing composition and its stock solution, and polishing method using same Download PDFInfo
- Publication number
- CN100505172C CN100505172C CNB2004800244481A CN200480024448A CN100505172C CN 100505172 C CN100505172 C CN 100505172C CN B2004800244481 A CNB2004800244481 A CN B2004800244481A CN 200480024448 A CN200480024448 A CN 200480024448A CN 100505172 C CN100505172 C CN 100505172C
- Authority
- CN
- China
- Prior art keywords
- polishing
- composition
- particle
- silicon oxide
- abrasive particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 268
- 239000000203 mixture Substances 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims description 33
- 239000011550 stock solution Substances 0.000 title 1
- 239000002245 particle Substances 0.000 claims abstract description 221
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 165
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 116
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 112
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 26
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000001179 sorption measurement Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 6
- 239000008119 colloidal silica Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920005591 polysilicon Polymers 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 32
- 239000010410 layer Substances 0.000 description 25
- 239000000377 silicon dioxide Substances 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 230000000694 effects Effects 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000002955 isolation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 238000005299 abrasion Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 6
- 239000011856 silicon-based particle Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 208000019901 Anxiety disease Diseases 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 230000036506 anxiety Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000003670 easy-to-clean Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 229910005091 Si3N Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000002909 rare earth metal compounds Chemical class 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing composition is disclosed which contains a cerium oxide abrasive having an adsorption layer on the surface which layer is formed by adsorbing silicon oxide particles. This polishing composition is used for polishing an object which is composed of a multilayer body having a groove on the surface and a silicon oxide film formed on the multilayer body so as to remove such a part of the silicon oxide film that is formed on the outside of the groove. The multilayer body is composed of a semiconductor substrate of single-crystal silicon or polycrystalline silicon, and a silicon nitride film formed on the semiconductor substrate.
Description
Technical field
The present invention relates to be used in semiconductor device and form component isolation structure and composition for use in polishing that polishes and the finishing method that uses said composition.
Background technology
Component isolation structure in the semiconductor device was to form by the method (local oxidation of silicon (LOCOS) method) that the separated region outside the part that will become the element on the semiconductor substrates such as silicon wafer directly carries out oxidation selectively in the past.But,, require the surface more smooth in recent years along with the densification of distribution and the multiple stratification of wiring layer.For this reason, after etch is removed selectively with the separated region on the silicon wafer, form silicon oxide film with chemical vapour deposition technique (CVD method), the situation of selectively silicon oxide film on the element being removed by chemico-mechanical polishing (CMP) gets more and more again.To call this method in the following text is STI (shallow trench isolation, shallow-trench isolation)-CMP method.In this STI-CMP method, elimination initial stage jump and the diaphragm that is formed on the element in conduct are being very important with the silicon nitride film place termination polishing of polishing stopper film.In the STI-CMP method, used about 2～3 times the composition for use in polishing of the polishing velocity of silicon oxide film as the polishing velocity of silicon nitride film in the past, that is, use, silicon oxide film is had 2～3 times of composition for use in polishing that optionally polish ability with respect to silicon nitride film.
Known: useful CVD method forms interlayer dielectric on the wiring layer on the silicon wafer, polish the surface of this interlayer dielectric after, form wiring layer thereafter in the above, thus the method for stacked a plurality of wiring layers on silicon wafer.To call this method in the following text is ILD (inter layer dielectric)-CMP method.In the ILD-CMP method, used in the aqueous dispersions of pyrogenic silica the composition for use in polishing that adds ammonium or potassium hydroxide and obtain in the past.
When carrying out the polishing of STI-CMP method with used composition for use in polishing in the ILD-CMP method in the past, not only can't fully eliminate the initial stage jump, and can not stop polishing fully at the silicon nitride film place, silicon nitride film does not have the function of polishing stopper film.Its result, the thickness that the silicon oxide film of separated region can occur reduce selectively, be known as the phenomenon of " pit " or high density portion by excessive polishing selectively, be known as the phenomenon of " abrasion (erosion) ", can't form good component isolation structure.Present situation is, is head it off, have to before polishing, to implement to the silicon oxide film on the element carry out to a certain degree the selectivity etch eat-back operation, to relax the initial stage jump.
Recently, eat-back operation, also have and in the STI-CMP method, use, the selectivity of silicon oxide film is polished the situation of ability at the composition for use in polishing of the oxidation-containing cerium abrasive particle more than 10 times with respect to silicon nitride film in order to omit.But the proportion of cerium oxide abrasive particle is very big, sinking speed is fast.Therefore, the composition for use in polishing of oxidation-containing cerium abrasive particle is very easy to precipitation and solidifies, and uses operability poor.In addition, because the cerium oxide abrasive particle is very easy to be adsorbed on the silicon oxide film, therefore, the silicon wafer after the polishing is not easy to clean.Also have, the cerium oxide abrasive particle is compared with the silica abrasive particle, is easy to generate polishing scratch.Have, the cerium oxide abrasive particle is compared with silica abrasive particle in the past for the effect that relaxes the silicon wafer surface jump, does not have notable difference again, does not also have big effect to suppressing pit.
The composition for use in polishing that contains the cerium oxide abrasive particle is compared with the composition for use in polishing that contains the silica abrasive particle, has the big advantage of speed of polishing silicon oxide film.Therefore, as long as can address the above problem, still the composition for use in polishing that contains the cerium oxide abrasive particle can be used for the ILD-CMP method.
In patent documentation 1, disclose a kind of for improving use operability, cleaning and will polishing the object film and polish the composition for use in polishing that the speed of removing is improved, contain silica abrasive particle and cerium oxide abrasive particle.In patent documentation 2, disclose and a kind ofly will polish speed that the polishing of object film removes and the minimizing polishing scratch is improved, the composition for use in polishing that contains specific silica abrasive particle and specific cerium oxide abrasive particle for improving.But therefore these composition for use in polishing, cause pit and abrasion easily owing to the ability of polishing silicon oxide film with respect to silicon nitride film selectively is low, and dispersion stabilization is not good yet.
As having considered use in the STI-CMP method, the means that can address the above problem simultaneously, just like put down in writing in patent documentation 3, the patent documentation 4 etc., add to go in the composition for use in polishing method such as specific rare earth metal compound, organic high molecular compound or organic compound etc. with particular functional group as the 3rd composition.In these the 3rd compositions, also have and have the material that forms the effect of diaphragm selectively at the recess of silicon oxide film.Diaphragm that is formed by the effect of the 3rd composition and silicon oxide film have the function of polishing stopper film equally.Composition for use in polishing although it is so is actually used in the STI-CMP method, but increase, cleaning that the interpolation of the 3rd composition can bring the semiconductor device that caused by metal impurities, organic impurities to pollute descend the abrasive particle that causes residual, use degradation under the operability to make the new problem of the manufacturing decrease in efficiency of semiconductor device.In addition; the diaphragm that is formed by the effect of the 3rd composition can be used as the polishing condition that polishes stopper film and work and is restricted; under the polishing condition of the low-voltage high speed rotation that can effectively avoid pit, abrasion to take place, diaphragm can not play the effect of polishing stopper film.And, because the 3rd composition is sneaked in the polishing waste liquid, need do special the processing to waste liquid.
In order to address the above problem, also have a kind of with cerium oxide abrasive particle and the compound technical scheme of silica abrasive particle.For example, patent documentation 5 discloses a kind of polishing formed body that ceria oxide powder is mixed with silicon oxide powder and the shaping of gained mixed-powder is obtained.In addition, patent documentation 6 discloses a kind of containing ultrafine silica powder body, Ludox is joined in the solid solution of cerium oxide and silica, carries out repeatedly case of wet attrition and the composition for use in polishing of the abrasive particle that obtains.This composition for use in polishing is improved in order to improve surface roughness that comprises polishing scratch and the purpose that improves the ability of polishing silicon oxide film with respect to silicon nitride film selectively.
But even the technology of patent documentation 5 and patent documentation 6 records, because the cerium oxide abrasive particle is adsorbed on the silicon oxide film easily, therefore, the wafer after the polishing is not easy to clean.In addition, because the hard cause of cerium oxide abrasive particle, polishing scratch appears in wafer after the polishing easily.Also have, surperficial jump appears in the wafer after can't fully suppressing to polish.
Patent documentation 1: 8-No. 148455 communiques of Japanese kokai publication hei
Patent documentation 2: 2000-No. 336344 communiques of TOHKEMY
Patent documentation 3: 2001-No. 192647 communiques of TOHKEMY
Patent documentation 4: 2001-No. 323256 communiques of TOHKEMY
Patent documentation 5: 11-No. 216676 communiques of Japanese kokai publication hei
Patent documentation 6: 10-No. 298537 communiques of Japanese kokai publication hei
Summary of the invention
The objective of the invention is to, a kind of composition for use in polishing is provided and uses the finishing method of this composition for use in polishing, described composition for use in polishing is more suitable for being used to the polishing that forms component isolation structure and carry out in semiconductor device.
For achieving the above object, in an embodiment of the invention, provide following composition for use in polishing.This composition for use in polishing contains the cerium oxide abrasive particle that has the adsorption layer that is formed by the absorption of silicon oxide particle on the surface.This composition for use in polishing is used to the polishing of carrying out in order to remove the silicon oxide film part that is positioned in the following polishing object outside the surface groove, and described polishing object comprises: have the semiconductor substrate that is made of monocrystalline silicon or polysilicon and be located at silicon nitride film on this semiconductor substrate and the surface has the layered product of groove and is located at silicon oxide film on this layered product.
In yet another embodiment of the present invention, a kind of finishing method of the silicon oxide film part of using above-mentioned composition for use in polishing to remove to be positioned in the following polishing object outside the surface groove is provided, and described polishing object comprises: have the semiconductor substrate that is made of monocrystalline silicon or polysilicon and be located at silicon nitride film on this semiconductor substrate and the surface has the layered product of groove and is located at silicon oxide film on this layered product.
Description of drawings
Fig. 1 (a) is the sectional view that polishes preceding polishing object with the composition for use in polishing of the present invention's one example; Fig. 1 (b) is the sectional view of the polishing object after the composition for use in polishing with the present invention's one example polishes.
Fig. 2 is the curve chart that concerns between expression silicon oxide film conversion polished amount and the surperficial jump.
Embodiment
Below in conjunction with accompanying drawing, an example of the present invention is described.
The sectional view of preceding polishing object is polished in Fig. 1 (a) expression with the composition for use in polishing of present embodiment.Shown in Fig. 1 (a), this polishing object has as the silicon wafer 11 of the semiconductor substrate that is made of monocrystalline silicon or polysilicon, is located on this silicon wafer 11, rises and polish the silicon nitride (Si that stops membrane interaction
3N
4) film 12 and be located on this silicon nitride film 12, play the silica (SiO of dielectric film effect
2) film 14.Silicon nitride film 12 and silicon oxide film 14 are formed by the CVD method respectively.By the layered product that silicon wafer 11 and silicon nitride film 12 constitute, its surface has groove 13.Because the silicon oxide film 14 that forms by the CVD method is arranged on the layered product with groove 13, therefore, that part of silicon oxide film 14 corresponding with groove 13 subsides, and forms recess 15, and not corresponding with groove 13 14 protuberances of that part of silicon oxide film form protuberance 16.
The sectional view of the polishing object after Fig. 1 (b) expression is polished with the composition for use in polishing of this example.Shown in Fig. 1 (b), the surface of the polishing object after the polishing is smooth.By being positioned at being removed of that part of silicon oxide film 14 outside the groove 13, the polishing object becomes state shown in Fig. 1 (b) from state shown in Fig. 1 (a), forms component isolation structure.Not polished removing and the function of 14 separated regions of that part of silicon oxide film in the groove that left behind 13.
As mentioned above, the composition for use in polishing of this example can be used for the STI-CMP method.The composition for use in polishing of this example is characterised in that, contains cerium oxide (CeO2) abrasive particle of one deck adsorption layer coating that is made of silicon oxide particle.This composition for use in polishing has preferably contained the water of decentralized medium effect.
Many composition for use in polishing that in the past used in ILD-CMP method and STI-CMP method contain the silica abrasive particle, and the achievement that the silica abrasive particle uses in the manufacturing process of semiconductor device is all higher than other any abrasive particle.Its reason can exemplify: because the composition of silica abrasive particle is identical with the composition of silicon wafer, therefore, can reduce the anxiety that xenogenesis impurity residues in the wafer surface after the polishing; In addition, the wafer surface after the polishing degree of polishing scratch and the dispersion stabilization of silica abrasive particle in aqueous dispersions occur in allowed band.On the other hand, the silica abrasive particle has the ability of rapid polishing silicon oxide film and with respect to silicon nitride film, and is very big to the ability of silicon oxide film selectivity polishing.That is, the silica abrasive particle has high polishing selectivity and the such feature of high polishing velocity.Comprised in the composition for use in polishing of this example, surface adsorption has the structure of the cerium oxide abrasive particle of silicon oxide particle to make the strong point of its strong point that has the silica abrasive particle concurrently and cerium oxide abrasive particle.
On sale on the cerium oxide abrasive particle market that the layer that is made of silicon oxide particle coats, but when this commercially available product is used as the abrasive particle of composition for use in polishing, only show the proterties of silica abrasive particle, and as the high polishing selectivity and the high polishing velocity of the feature of cerium oxide abrasive particle, then performance is not come out fully.This can think, because the layer that is made of silicon oxide particle on coating cerium oxide surface is very firm, makes the cerium oxide abrasive particle can't act on the polishing object when polishing.Producing solid surface reaction with the silicon oxide film surface as the high polishing selectivity of the feature of cerium oxide abrasive particle and high polishing velocity selectively by cerium oxide abrasive particle surface just brings into play.Make the polishing object surface after the polishing become smooth, importantly this solid surface reaction is tackled in protuberance 16, is compared to recess 15 and has more selectivity.In addition, improve the dispersion stabilization of composition for use in polishing and use operability, outside importantly at least when polishing during, silicon oxide particle must stably be adsorbed in cerium oxide abrasive particle surface.
Consider above-mentioned situation, coating cerium oxide abrasive particle surface by silicon oxide particle constitute the layer had better not be sacrifices consisting of an ox, a sheep and a pig solid.That is, be preferably, when polish pressure reaches setting when above, the surface of cerium oxide abrasive particle can be exposed, and acts on the polishing object; When polish pressure was lower than setting, the state that keeps the oxidized silicon particle of cerium oxide abrasive particle to coat did not make the cerium oxide surface expose.In addition, the ability of the silicon oxide particle on coating cerium oxide abrasive particle surface polishing silicon oxide film had better not be too high.The particle diameter of silicon oxide particle is more little, and the ability of polishing silicon oxide film is weak more.In addition, the particle diameter of silicon oxide particle is more little, can stably be adsorbed in the cerium oxide surface more.
The adsorption layer that contained cerium oxide abrasive particle is made of silicon oxide particle in the composition for use in polishing of this example coats.It is formed that this adsorption layer is that silicon oxide particle is adsorbed on the cerium oxide abrasive particle by surface potential, therefore, and less firm.In addition, because adsorption layer is made of silica, therefore, the composition for use in polishing that contains the cerium oxide abrasive particle that is adsorbed layer coating has and equal dispersion stabilization and the cleaning of slurries that in the past used in the ILD-CMP method.
The composition for use in polishing of this example is for example prepared by cerium oxide abrasive particle and silicon oxide particle are dispersed in the water.After being dispersed in cerium oxide abrasive particle and silicon oxide particle in the water, silicon oxide particle can be adsorbed in cerium oxide abrasive particle surface by nature, its result, and the cerium oxide abrasive particle is by the adsorption layer that is made of silicon oxide particle partly or integral coating.
The cerium oxide abrasive particle can be for example, the volume 1040cm that produces with central processing machine Co., Ltd.
3Nylon polishing jar and the zirconium polishing ball of diameter 2mm, the cerium oxide of the purity 3N of Shin-Etsu Chemial Co., Ltd's production carried out case of wet attrition and make.The cerium oxide abrasive particle that obtains like this carries out classification by natural subsidence, is adjusted to the granularity (for example, the particle diameter of being obtained by specific area is 60nm) of regulation.The cerium oxide abrasive particle that granularity is low helps to improve the stability of composition for use in polishing, but the ability of polishing polishing object is less strong.In addition, the cost for the cerium oxide abrasive particle that obtains low granularity is very high.The ability of the cerium oxide abrasive particle polishing polishing object that granularity is high is strong, and also has superiority on the cost, but can make the stability decreases of composition for use in polishing and cause that polishing scratch occurs.Therefore, the particle diameter that the cerium oxide abrasive particle is obtained by specific area is good with 10～200nm, and 30～100nm is good especially.
The cerium oxide abrasive particle preferably has crystallinity.When the cerium oxide abrasive particle had crystallinity, crystallinity was the bigger the better.Along with crystallinity increases, the polishing ability of cerium oxide abrasive particle improves.The cerium oxide abrasive particle that crystallinity is low and do not have crystalline cerium oxide abrasive particle and become by appropriate roasting meeting and have high crystalline.For suppressing the metallic pollution of semiconductor device, it is desirable to, the purity of cerium oxide abrasive particle is high as much as possible.
Silicon oxide particle can be a colloidal silica, also can be pyrogenic silica.Colloidal silica for example is synthesized into by tetramethoxy-silicane by sol-gal process.The particle diameter of silicon oxide particle is advisable for a short time with the particle diameter than cerium oxide abrasive particle at least, is more preferably, in below 1/2 of cerium oxide abrasive particle particle diameter.If the particle diameter of silicon oxide particle surpasses 1/2 of cerium oxide abrasive particle particle diameter, then the adsorption layer that is made of silicon oxide particle is difficult for being formed at cerium oxide abrasive particle surface.The particle diameter of being obtained by specific area of silicon oxide particle should be 1～200nm below 300nm better, is preferably 1～100nm.Particle diameter is less than high and difficult manufacturing of manufacturing cost of the silicon oxide particle of 1nm.If the particle diameter of silicon oxide particle surpasses 200nm, then the adsorption layer that is made of silicon oxide particle is difficult for being formed at cerium oxide abrasive particle surface.In addition, the silicon oxide particle that particle diameter is too big, its polish silicon nitride film very capable is with respect to silicon nitride film, polishes the reason of the ability drop of silicon oxide film selectively.
The content of cerium oxide abrasive particle is preferably 0.1～10 quality % in the composition for use in polishing.Cerium oxide abrasive particle content is less than the composition for use in polishing of 0.1 quality %, and the ability of its polishing silicon oxide film is not too strong.And if the content of cerium oxide abrasive particle surpasses 10 quality %, then the surface of the polishing object after the polishing is prone to polishing scratch and surperficial jump.
The content of silicon oxide particle is advisable with 0.1～15 quality % in the composition for use in polishing.If the content of silicon oxide particle is less than 0.1 quality %, then the adsorption layer that is made of silicon oxide particle is difficult for being formed at cerium oxide abrasive particle surface.And if surpass 15 quality %, then because a large amount of silicon oxide particles is present in the composition for use in polishing with free state, the effect of cerium oxide abrasive particle can be suppressed, and its result has the polishing selectivity of composition for use in polishing and the anxiety of polishing velocity decline.
The gross mass of the silicon oxide particle that contains in the composition for use in polishing is good with respect to the ratio of the gross mass of the cerium oxide abrasive particle that contains in the composition for use in polishing with 0.1～10, and 0.5～5 is good especially, 1～3 the best.If this ratio is less than 0.1, then because the adsorption layer that is made of silicon oxide particle can't fully be formed at cerium oxide abrasive particle surface, the effect of silicon oxide particle just can't be given full play to.And if this ratio surpasses 10, then because a large amount of silicon oxide particles is present in the composition for use in polishing with free state, then the effect of cerium oxide abrasive particle can't be given full play to.
Be the cerium oxide abrasive particle of 60nm and be that the silicon oxide particle of 10nm is scattered in the ultra-pure water by the particle diameter that will obtain by specific area, be mixed with the composition for use in polishing of the silicon oxide particle of the cerium oxide abrasive particle that contains 1 quality % and 1 quality % by the particle diameter that specific area is obtained.Characteristic to this composition for use in polishing of containing cerium oxide abrasive particle and silicon oxide particle detects, found that, compare with the composition for use in polishing that in cerium oxide abrasive particle and silicon oxide particle, only contains the cerium oxide abrasive particle, its stability is very high, and it is also very high to relax the ability that occurs jump in the polishing object after polishing.The polishing velocity that contains the composition for use in polishing of cerium oxide abrasive particle and silicon oxide particle be only contain the cerium oxide abrasive particle composition for use in polishing polishing velocity 1/2nd to 1/3rd, but with the ILD-CMP method in the general commercially available pyrogenic silica that the uses polishing velocity that is composition for use in polishing on peer-level.
The above-mentioned composition for use in polishing that will contain cerium oxide abrasive particle and silicon oxide particle, the above-mentioned composition for use in polishing that promptly contains the Compostie abrasive particles of silica and cerium oxide is put into centrifugal separator, for several times make the precipitation piece that generates in the composition for use in polishing disperse so a succession of operation more repeatedly, confirm only to contain in the precipitation piece cerium oxide abrasive particle in cerium oxide abrasive particle and the silicon oxide particle and the oxygen-free silicon particle.When carrying out same operation with the commercially available composition for use in polishing that contains the cerium oxide abrasive particle that oxidized silicon particle applies, the precipitation piece contains silicon oxide particle and cerium oxide abrasive particle, and silicon oxide particle is identical with the ratio of cerium oxide abrasive particle in the ratio of the silicon oxide particle of precipitation in the piece and cerium oxide abrasive particle and the composition for use in polishing.The above results prompting, in the Compostie abrasive particles of this example, layer coating cerium oxide abrasive particle surface, that be made of silicon oxide particle does not have layer coating cerium oxide abrasive particle surface in the commercially available Compostie abrasive particles, that be made of silicon oxide particle firmly.In other words, its prompting, the silica of this example and the Compostie abrasive particles of cerium oxide are different fully with the proterties of commercially available Compostie abrasive particles.
The following describes the method that the composition for use in polishing that uses this example polishes.
As mentioned above, the composition for use in polishing of this example can be used for for example following polishing purposes: polish the polishing object shown in Fig. 1 (a) for removing silicon oxide film 14 parts that are positioned at outside the groove 13.When carrying out this polishing, composition for use in polishing is supplied with to polishing pad in the limit, and the object surface will be polished by being pressed on the polishing pad in the limit, and at least one side in polishing pad and the polishing object is slided with respect to the opposing party.The polishing pad that is pressed into polishing object surface only contacted with protuberance 16 in the protuberance 16 with polishing object surface voids 15 at the polishing initial stage, did not contact with recess 15.Therefore, in the polishing initial stage, act on the protuberance 16 than higher polish pressure.When polish pressure was very high, as mentioned above, the Compostie abrasive particles in the composition for use in polishing was dissociated into cerium oxide abrasive particle and silicon oxide particle, made cerium oxide abrasive particle surface expose.Thus, in the polishing initial stage, protuberance 16 obtains polishing with very high polishing velocity.
Along with the carrying out of polishing, soon, protuberance 16 disappears.After protuberance 16 disappeared, the surface area of the polishing object that contacts with polishing pad increased, and made that the polish pressure that acts on the polishing object is disperseed.Like this, polish pressure descends, and consequently, the oxidized again silicon particle of the cerium oxide abrasive particle in the composition for use in polishing coats.The oxidized silicon particle of cerium oxide abrasive particle coats and the Compostie abrasive particles that forms is compared with the cerium oxide abrasive particle, with respect to silicon nitride film 12, silicon oxide film 14 is had the ability of higher selectivity polishing.Thus, polishing scratch and the generation of surperficial jump and being suppressed of pit and abrasion in the polishing object surface after the polishing.In addition, compare with the cerium oxide abrasive particle, Compostie abrasive particles is little to the adsorptivity of silicon oxide film 14, and therefore, the abrasive particle attached on the polishing object after the polishing is easy to be removed by water cleaning polishing object.
This example has the following advantages.
The composition for use in polishing of this example contains the cerium oxide abrasive particle of the adsorption layer coating of oxidized silicon particle formation.Therefore, the operation with the polishing object shown in this composition for use in polishing polishing Fig. 1 (a) comprises: the polishing object since the effect of cerium oxide abrasive particle and polished initial stage and polishing object because the effect of silicon oxide particle and polished later stage.Therefore, the function of cerium oxide abrasive particle and silicon oxide particle is brought into play effectively based on polish pressure.So the composition for use in polishing of this example is useful for the polishing of carrying out for formation component isolation structure in semiconductor device.That is, facilitation and efficient activity that the composition for use in polishing of this example helps component isolation structure in the semiconductor device to form also help the raising of productivity ratio of semiconductor device and the decline of manufacturing cost.
The ratio of the gross mass of the cerium oxide abrasive particle that is contained in the gross mass of contained silicon oxide particle and the composition for use in polishing in the composition for use in polishing is 0.1～10 o'clock, the adsorption layer that is made of silicon oxide particle can be formed at cerium oxide abrasive particle surface aptly, can obtain useful especially Compostie abrasive particles.
The particle diameter of cerium oxide abrasive particle is that the particle diameter of 10～200nm, silicon oxide particle is when being 1～200nm in the composition for use in polishing, perhaps, the particle diameter of the size ratio cerium oxide abrasive particle of silicon oxide particle hour in the composition for use in polishing, the adsorption layer that is made of silicon oxide particle can be formed at cerium oxide abrasive particle surface aptly, can obtain useful especially Compostie abrasive particles.
Because the composition for use in polishing of present embodiment does not contain organic compound, therefore, does not need to be used to reduce the processing of chemical oxygen demand (COD) and biochemical oxygen demand (BOD) when discarded.Thus, its liquid waste processing is easy to.
Below by embodiment and comparative example the present invention is made more specific description.
The volume 1040cm that produces with central processing machine Co., Ltd.
3Nylon polishing jar and the zirconium polishing ball of diameter 2mm, the cerium oxide polishing of the purity 3N that Shin-Etsu Chemial Co., Ltd is produced is polished and is carried out case of wet attrition, obtains the cerium oxide abrasive particle.The cerium oxide abrasive particle that obtains is like this carried out classification by natural subsidence, adjust the granularity of cerium oxide abrasive particle, make its particle diameter of obtaining by specific area in the scope of 60～360nm.In addition, use sol-gal process by tetramethoxy-silicane synthesis of high purity colloidal silica.Adjust the granularity of synthetic colloidal silica, make its particle diameter of obtaining by specific area in the scope of 10～90nm.Above-mentioned cerium oxide abrasive particle and colloidal silica (silicon oxide particle) are mixed in the ultra-pure water composition for use in polishing of preparation embodiment 1～57 and comparative example 1～5.In addition, as a comparative example 6, will contain composition for use in polishing " PLANERLITE-4218 " that Fujimi Inc. of silica abrasive particle produces as a comparative example 6 composition for use in polishing prepare.Measure and estimate the performance of the composition for use in polishing of the foregoing description 1～57 and comparative example 1～5 with following method.
The CMP device " EPO-113D " that uses ebara corporatlon Co., Ltd. to produce, at the flow that polishes load 34.5kPa (5.0psi), polish line speed 42m/ branch, composition for use in polishing is under the condition of 200mL/ branch, and polishing reaches the silicon wafer of having silicon nitride film with the silicon wafer of silicon oxide film respectively.At this moment, measure with the polishing velocity (SiO of each composition for use in polishing polishing with the silicon wafer of silicon oxide film
2Polishing velocity) and polishing with the polishing velocity (Si of the silicon wafer of silicon nitride film
3N
4Polishing velocity).In order to measure composition for use in polishing, polish the ability of silicon oxide film selectively, again with SiO with respect to silicon nitride film
2Polishing velocity is divided by Si3N
4Polishing velocity is calculated ratio between two (ratio is selected in polishing).
With scrubbing with polyvinyl alcohol (PVA) and carry out ultrasonic waves for cleaning after the polishing with ultra-pure water with the silicon wafer of silicon oxide film.Number with the defective of size more than 0.2 μ m on the wafer surface after " SURFSCAN SP1-TBI " mensuration cleaning of KLA-Tencor company production.According to the defective number that records, the cleaning performance of each composition for use in polishing is estimated by 4 grades: number of defects more than 500 for *, more than 150, less than 500 be △, more than 50, less than 150 be zero, less than 50 be ◎.
With after the above-mentioned cleaning with the silicon wafer of silicon oxide film with the rinsing 12 seconds again of 0.5 quality % hydrofluoric acid aqueous solution, measure the number (X1) of the defective of size more than 0.2 μ m on the wafer surface after the cleaning with " SURFSCAN SP1-TBI ".Then, the number (X2) of the defective of size more than 0.2 μ m on the wafer surface after cleaning is measured in the rinsing 200 seconds again of the silicon wafer that will have a silicon oxide film with hydrofluoric acid aqueous solution with " SURFSCANSP1-TBI ".At this moment, by calculating formula Y=(X2-X1)/200 calculate numerical value Y.Value according to the numerical value Y that calculates, situation occurred with polishing scratch in the wafer of 4 grade evaluations after with the polishing of each composition for use in polishing: numerical value Y more than 0.45 be *, 0.30 above, less than 0.45 be △, more than 0.15, less than 0.30 be zero, less than 0.15 be ◎.
Each composition for use in polishing that is filled in the 1000mL in the commercially available wide-mouth polyethylene bottle of capacity 1000mL is left standstill in 80 ℃ temperature atmosphere.After leaving standstill 6 hours,, isolate the first half (500mL) of composition for use in polishing in the polyethylene bottle by suction.The first half with this isolated composition for use in polishing is polished the silicon wafer of having silicon oxide film, measures the polished speed (SiO of this wafer
2Polishing velocity).With the SiO that records like this
2The SiO of polishing velocity and previously described composition for use in polishing
2Polishing velocity compares, with the sedimentation stability of 4 each composition for use in polishing of grade evaluation: below 50% be *, more than 50%, less than 70% be △, more than 70%, less than 90% be to be ◎ more than zero, 90%.
To there be the polyethylene bottle of the latter half (500mL) of composition for use in polishing to stand upside down quietly because of the first half of aspirating out composition for use in polishing is residual, measure the precipitation piece area at the bottom of remaining in bottle.Redispersibility with 4 each composition for use in polishing of grade evaluation: the precipitation piece area that records the bottle floor space more than 80% for *, more than 50%, less than 80% be △, more than 20%, less than 50% be zero, less than 20% be ◎.
The CMP device of producing with ebara corporatlon Co., Ltd. " EPO-113D " is the commercially available SEMATECHSKW3 patterned wafers (polishing object shown in Fig. 1 (a)) of polishing under the 200mL/ condition of dividing at the flow of polishing load 34.5kPa (5.0psi), polish line speed 42m/ branch, composition for use in polishing.The patterned wafers surface corresponding to the thickness of that part of silicon oxide film of protuberance was originally
, but this thickness is reduced by polishing, be decreased at thickness
In time, stop polishing.After the polishing, for 50 μ rm in the wafer wide componentry and the wide continuous part that repeats of insulated part of 50 μ m, " HRP-340 " that produce with KLA-Tencor company measures surperficial jump.With the surperficial jump that records and initial stage jump (
) compare, by 4 grades the jump retentivity of each composition for use in polishing is estimated: below 50% for *, more than 50%, less than 70% be △, more than 70%, less than 90% be to be ◎ more than zero, 90%.
Table 1
Table 2
As shown in Table 1 and Table 2, in embodiment 1～57, polishing selectivity is more than 5, demonstrates the numerical value higher than comparative example 6.In addition, in embodiment 1～57, cleaning, polishing scratch situation occurred and the anterethic evaluation of jump are all good.And in comparative example 1～5, the evaluation of above-mentioned each side is all not good.Aspect sedimentation stability, also have not goodly among the embodiment 1～57, but when disperseing, redispersibility is good again.And in comparative example 1～5, redispersibility is all not good.
Composition for use in polishing with embodiment 11, comparative example 2 and comparative example 6 divides several to polish DEMATECH SKW3 pattern silicon wafer.Each polishing all detects surperficial jump, observes the variation of the surperficial jump that is caused by polishing, obtains result shown in Figure 2.As shown in Figure 2, in comparative example 2, how the initial stage jump does not obtain relaxing, and in comparative example 6, after the removing of silicon oxide film finished, jump had the tendency that increases gradually.And in embodiment 11, the initial stage jump is relaxed well, and after the removing of silicon oxide film finished, how jump did not increase yet.That is, in the polishing composition of embodiment 11, silicon nitride film normally plays the function of polishing stopper film.This also is effective for the generation that suppresses pit.In addition, because the polishing selectivity of the composition for use in polishing of comparative example 6 is low, when continuing polishing again after the removing of silicon oxide film finished, silicon nitride film is ground off morely, consequently, abrasion occurs.And its polishing selectivity of the composition for use in polishing of embodiment 11 is more than 10, and the possibility that abrasion therefore occurs is less.
Above-mentioned execution mode also can make the following changes.
The composition for use in polishing also water of 1～2 times of amount of available stoste dilutes stoste and is prepared.The content of the cerium oxide abrasive particle in the stoste is preferably 0.3～15 quality %.Like this, transportation and keeping just become easy.
The adsorption layer that is made of silicon oxide particle on coating cerium oxide abrasive particle surface can be a multilayer, also can be that single-layer portions and multi-layer portion mix.
Polish pressure in the time of can polishing by adjustment, appropriate change polish the object time polished owing to the effect of cerium oxide abrasive particle and polish object the ratio of the polished time owing to the effect of silicon oxide particle.
Claims (7)
1. composition for use in polishing, it is characterized in that, described composition for use in polishing is used for being positioned at the polishing that the silicon oxide film outside the surface groove partly carries out in order to remove the polishing object, described polishing object contains: have semiconductor substrate that is made of monocrystalline silicon or polysilicon and the silicon nitride film that is located on the described semiconductor substrate, and the surface has the layered product of groove and is located at silicon oxide film on the described layered product, described composition for use in polishing contains cerium oxide abrasive particle and silicon oxide particle, described silicon oxide particle forms adsorption layer by being adsorbed on cerium oxide abrasive particle surface colloidal silica constitutes, and the particle diameter of the size ratio cerium oxide abrasive particle of silicon oxide particle is little, in the described composition for use in polishing in the gross mass of contained silicon oxide particle and the described composition for use in polishing ratio of the gross mass of contained cerium oxide abrasive particle more than 0.1, below 10.
2. composition for use in polishing according to claim 1, wherein, the particle diameter of silicon oxide particle is below 1/2 of cerium oxide abrasive particle particle diameter.
3. composition for use in polishing according to claim 1 is characterized in that, in the described composition for use in polishing in the gross mass of contained silicon oxide particle and the described composition for use in polishing ratio of the gross mass of contained cerium oxide abrasive particle more than 1, below 3.
4. composition for use in polishing according to claim 1 is characterized in that, the particle diameter of described cerium oxide abrasive particle is 10～200nm.
5. composition for use in polishing according to claim 1 is characterized in that, described cerium oxide abrasive particle has crystallinity.
6. finishing method, it is characterized in that, use each described composition for use in polishing in the claim 1～5, polish for removing the silicon oxide film part that polishing is positioned in the object outside the surface groove, described polishing object contains: have the semiconductor substrate that is made of monocrystalline silicon or polysilicon and be located at silicon nitride film on the described semiconductor substrate and the surface has the layered product of groove and is located at silicon oxide film on the described layered product.
7. a composition for use in polishing stoste is characterized in that, described composition for use in polishing stoste is mixed with each described composition for use in polishing in the claim 1～5 by dilute with water.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003303694A JP4574140B2 (en) | 2003-08-27 | 2003-08-27 | Polishing composition and polishing method using the same |
| JP303694/2003 | 2003-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1842897A CN1842897A (en) | 2006-10-04 |
| CN100505172C true CN100505172C (en) | 2009-06-24 |
Family
ID=34269244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800244481A Expired - Fee Related CN100505172C (en) | 2003-08-27 | 2004-08-27 | Polishing composition and its stock solution, and polishing method using same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060258267A1 (en) |
| JP (1) | JP4574140B2 (en) |
| KR (1) | KR101070410B1 (en) |
| CN (1) | CN100505172C (en) |
| DE (1) | DE112004001568T5 (en) |
| TW (1) | TWI393769B (en) |
| WO (1) | WO2005022621A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007008232A1 (en) * | 2007-02-20 | 2008-08-21 | Evonik Degussa Gmbh | Dispersion containing ceria and colloidal silica |
| DE102007062572A1 (en) * | 2007-12-22 | 2009-06-25 | Evonik Degussa Gmbh | Cerium oxide and colloidal silica containing dispersion |
| WO2011081503A2 (en) * | 2009-12-31 | 2011-07-07 | Cheil Industries Inc. | Chemical mechanical polishing slurry compositions and polishing method using the same |
| KR101469258B1 (en) | 2009-12-31 | 2014-12-09 | 제일모직주식회사 | CMP slurry compositions and polishing method using the same |
| CN101844320B (en) * | 2010-06-07 | 2011-09-14 | 湖南大学 | Precise high-efficiency polishing method and device for curved surface parts |
| CN103992743B (en) * | 2014-05-09 | 2018-06-19 | 杰明纳微电子股份有限公司 | Polishing fluid and its preparation process containing cerium dioxide powder Yu colloidal silicon dioxide compound abrasive |
| CN104694017B (en) * | 2015-03-23 | 2017-04-19 | 济南大学 | Preparation method of polishing powder for polishing of silicon nitride ceramics |
| CN111599677B (en) * | 2019-02-21 | 2023-08-01 | 中芯国际集成电路制造(北京)有限公司 | Semiconductor structure and forming method thereof |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264010A (en) * | 1992-04-27 | 1993-11-23 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
| JPH08148455A (en) * | 1994-08-18 | 1996-06-07 | Sumitomo Metal Ind Ltd | Surface flattening method for thin film |
| JP3311203B2 (en) * | 1995-06-13 | 2002-08-05 | 株式会社東芝 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus, and chemical mechanical polishing method for semiconductor wafer |
| KR100336598B1 (en) * | 1996-02-07 | 2002-05-16 | 이사오 우치가사키 | A Cerium Oxide Particle for the Preparation of a Cerium Oxide Abrasive |
| EP0939431B1 (en) * | 1996-09-30 | 2009-05-20 | Hitachi Chemical Co., Ltd. | Cerium oxide abrasive and method of abrading substrates |
| US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
| JP3359535B2 (en) * | 1997-04-25 | 2002-12-24 | 三井金属鉱業株式会社 | Method for manufacturing semiconductor device |
| JP3672493B2 (en) * | 1998-02-24 | 2005-07-20 | 昭和電工株式会社 | Abrasive composition for polishing semiconductor device and method for manufacturing semiconductor device using the same |
| US6299659B1 (en) * | 1998-08-05 | 2001-10-09 | Showa Denko K.K. | Polishing material composition and polishing method for polishing LSI devices |
| KR100797218B1 (en) * | 1998-12-25 | 2008-01-23 | 히다치 가세고교 가부시끼가이샤 | Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate |
| US6887566B1 (en) * | 1999-11-17 | 2005-05-03 | Cabot Corporation | Ceria composition and process for preparing same |
| JP3492279B2 (en) * | 2000-03-21 | 2004-02-03 | Ｎｅｃエレクトロニクス株式会社 | Method of forming element isolation region |
| US6733553B2 (en) * | 2000-04-13 | 2004-05-11 | Showa Denko Kabushiki Kaisha | Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same |
| JP4562274B2 (en) * | 2000-11-09 | 2010-10-13 | Ｈｏｙａ株式会社 | Manufacturing method of glass substrate for information recording medium and manufacturing method of information recording medium |
| JP3945745B2 (en) * | 2001-03-09 | 2007-07-18 | 三井金属鉱業株式会社 | Cerium-based abrasive and abrasive slurry and method for producing cerium-based abrasive |
| JP3895949B2 (en) * | 2001-07-18 | 2007-03-22 | 株式会社東芝 | CMP slurry and method for manufacturing semiconductor device using the same |
| US20030211747A1 (en) * | 2001-09-13 | 2003-11-13 | Nyacol Nano Technologies, Inc | Shallow trench isolation polishing using mixed abrasive slurries |
| JP2003158101A (en) * | 2001-11-20 | 2003-05-30 | Hitachi Chem Co Ltd | Cmp abrasive and manufacturing method therefor |
| JP2003193039A (en) * | 2001-12-28 | 2003-07-09 | Nippon Aerosil Co Ltd | Polishing particle and polishing slurry |
-
2003
- 2003-08-27 JP JP2003303694A patent/JP4574140B2/en not_active Expired - Lifetime
-
2004
- 2004-08-27 CN CNB2004800244481A patent/CN100505172C/en not_active Expired - Fee Related
- 2004-08-27 US US10/569,906 patent/US20060258267A1/en not_active Abandoned
- 2004-08-27 TW TW093125762A patent/TWI393769B/en not_active IP Right Cessation
- 2004-08-27 DE DE112004001568T patent/DE112004001568T5/en not_active Withdrawn
- 2004-08-27 WO PCT/JP2004/012347 patent/WO2005022621A1/en active Application Filing
-
2006
- 2006-02-25 KR KR1020067003917A patent/KR101070410B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1842897A (en) | 2006-10-04 |
| DE112004001568T5 (en) | 2006-07-06 |
| US20060258267A1 (en) | 2006-11-16 |
| JP4574140B2 (en) | 2010-11-04 |
| KR20060069474A (en) | 2006-06-21 |
| WO2005022621A1 (en) | 2005-03-10 |
| TWI393769B (en) | 2013-04-21 |
| TW200508378A (en) | 2005-03-01 |
| JP2005072499A (en) | 2005-03-17 |
| KR101070410B1 (en) | 2011-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100481651B1 (en) | Slurry for chemical mechanical polishing and method for manufacturing semiconductor device | |
| JP4253141B2 (en) | Chemical mechanical polishing slurry and semiconductor device manufacturing method | |
| TWI452124B (en) | Polishing liquid for CMP and grinding method using same | |
| CN102482555B (en) | Cmp compositions and methods for suppressing polysilicon removal rates | |
| TWI500750B (en) | Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride | |
| TWI508154B (en) | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride | |
| KR101672809B1 (en) | Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal | |
| KR101070410B1 (en) | Polishing composition and polishing method using same | |
| US6858540B2 (en) | Selective removal of tantalum-containing barrier layer during metal CMP | |
| CN111334193A (en) | Polishing composition and method of use thereof | |
| CN111334194A (en) | Polishing composition and method of use thereof | |
| JP4719204B2 (en) | Chemical mechanical polishing slurry and semiconductor device manufacturing method | |
| JP2004214667A (en) | Cmp slurry for nitride and cmp method using it | |
| KR101672816B1 (en) | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride | |
| CN1872900B (en) | Ceria slurry composition with enhanced polishing uniformity | |
| US7297632B2 (en) | Scratch reduction for chemical mechanical polishing | |
| KR20200132756A (en) | Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment | |
| Tateyama et al. | Study on ceria-based slurry for STI planarization | |
| CN111378367A (en) | Chemical mechanical polishing solution | |
| CN115247027B (en) | Polishing composition with enhanced defect suppression and method of polishing a substrate | |
| CN111378372B (en) | Application of acetic acid in STI polishing | |
| TW200908128A (en) | Chemical-mechanical polishing compositions containing aspartame and methods of making and using the same | |
| JP2012151273A (en) | Cleaning solution for cmp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090624 Termination date: 20180827 |