CN100502623C - Method for preparing case seat of ceramic package for SMD parts - Google Patents
Method for preparing case seat of ceramic package for SMD parts Download PDFInfo
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- CN100502623C CN100502623C CNB2005100362094A CN200510036209A CN100502623C CN 100502623 C CN100502623 C CN 100502623C CN B2005100362094 A CNB2005100362094 A CN B2005100362094A CN 200510036209 A CN200510036209 A CN 200510036209A CN 100502623 C CN100502623 C CN 100502623C
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Abstract
The method includes steps: ingredient, discharging air bubble in vacuum, preparing film prepared from flow casting, slice up, forming substrate, printing by metal pulp, laminating, cutting chip, discharging glue in low temperature, and ceramics sintering. Step of cutting chip is use for splitting ceramics film from carrier film, and cutting ceramics film to needed size. Step of forming substrate is to form substrate of ceramics film by die of punch. Step of printing by metal pulp prints metal pulp on ceramics substrate. Laminating step piles up substrates for lower, middle and upper layers, discharges air between layers by proper compressing to integrate three layers of chips. Step of cutting chip punches out single part of chip and case seat of ceramics. The invention can produce ceramics chip in thickness 0.20 +/- 0.02 mm in batch quantity with stable quality.
Description
[technical field]
The present invention relates to a kind of ceramic packaging shell block preparation method, be meant a kind of SMD components and parts ceramic packaging shell block preparation method especially.
[background technology]
At present, along with electronic product develops towards weak point, thin, light, little direction, the SMD components and parts that wherein adopted need to have minimum overall dimension too, and correspondingly, the ceramic packaging shell block thickness of SMD components and parts is all thin in the extreme, the total thickness of the ceramic packaging shell block of some SMD components and parts is about 0.7 ± 0.05mm, and be divided into three layers, and it is thick that the upper and lower are 0.25 ± 0.02mm, and middle level 0.2 ± 0.02mm is thick, process upper strata, middle level and lower floor respectively, again pressing formation encapsulation in aggregates shell block.At this moment, ceramic membrane can be divided into two kinds of thickness, and a kind of thickness of ceramic membrane is 0.25 ± 0.02mm, and the thickness of another kind of ceramic membrane is 0.20 ± 0.02mm.Yet, from " new ceramic material workshop manual ", can find, the minimal thickness 〉=0.8mm of method processing is rolled in traditional rolling, and as seen, adopting traditional method of rolling of rolling is to process the ceramic membrane that reaches so little thickness requirement.
[summary of the invention]
Technical problem to be solved by this invention is: a kind of SMD components and parts ceramic packaging shell block preparation method is provided, and it can be produced in batches and process the ceramic packaging shell block with very small thickness, and constant product quality.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of SMD components and parts ceramic packaging shell block preparation method is provided, comprises the steps:
Batching step is according to formulated porcelain slurry, adhesive, plasticizer, metal paste and curtain coating agent;
Vacuum row bubble step is packed the porcelain slurry and adhesive, the plasticizer that prepare in the mixer-mill into, and mix grinding is after 40 ± 15 minutes, and vacuumizes and discharge the bubble of porcelain in starching;
System film step, produce the ceramic membrane that meets thickness requirement, slurry flow on the carrier film that moves forward from the hopper bottom of film-making machine, and embryophoric membrane enters touring hot wind drying room together with carrier film and dries, the film that drying chamber comes out, together spool is stand-by together with carrier film;
Slicing step separates ceramic membrane and carrier film, and ceramic membrane is cut into the required size of mould, and the carrier film that will take off ceramic membrane cleans up the back spool for recycling;
The substrate forming step is inserted the ceramic membrane after the section in the mould of pneumatic punching machine, molds substrates of different shape in flakes respectively;
The metal paste print steps with ready made seal net, is printed on metal paste the ceramic substrate of moulding on by the difference requirement with printing machine;
The lamination step, with the forming ceramic substrate after printing with unified benchmark, will descend, in, last three layers of substrate stack, pressurize in right amount with hydraulic press make down, in, last three layers of ceramic substrate closely are integrated;
Hack step, installing is unified the mould that hacks of benchmark with the upper, middle and lower mould on pneumatic punching machine, and in flakes ceramic substrate is hacked becomes single part, and goes out ceramic shell block;
Low temperature binder removal step, with the ceramic part individual layer not phase ground connection be emitted on the aluminium sheet, put into vacuum drying oven, adhesive, plasticizer in the ceramic part are all discharged;
The ceramic post sintering step, hydraulic drive is sent ceramic part into warm area control kiln, adopts the drum type brake circulating water to cool off at the discharging opening of kiln, and also all adopts nitrogen protection to carry out the anoxybiotic sintering at feed inlet and outlet.
Further improvement in the technical proposal is: the total thickness of the SMD components and parts ceramic packaging shell block of being processed is 0.7 ± 0.05mm, and is divided into trilamellar membrane, and wherein, the thickness of the upper and lower is 0.25 ± 0.02mm, and the thickness in middle level is 0.2 ± 0.02mm.
Further improvement in the technical proposal is: in the low temperature binder removal step, the temperature of vacuum drying oven is progressively heated from 100 ℃～380 ℃, heated 50 ± 20 ℃ in per 15 minutes, be warmed to 380 ± 50 ℃ after constant temperature kept 12 ± 2 hours, and then progressively cooling, temperature-fall period needs 2-5 hour.
Further improvement in the technical proposal is: in the ceramic post sintering step, the highest sintering temperature is controlled at 1500 ℃～1820 ℃, and ceramic part is in 60 minutes from advancing stove to the sintering time of coming out of the stove.
Further improvement in the technical proposal is: also comprise the steps: after the ceramic post sintering step
Dark nickel step is plated in electrolysis, and it adopts traditional electrolysis to plate dark nickel method ceramic part is electroplated, so that the metal of printing slurry circuit electric conductivity is better;
Dress metal frame step is utilized graphite jig, and ceramic part and metal frame are fitted together;
The metallization sintering step pushes small-sized sintering furnace with the graphite film tool that installs ceramic part and metal frame, and sintering time is 10～20 minutes, and sintering temperature is 600 ℃～1200 ℃, also adopts nitrogen to protect and adopt the ammonia reduction during sintering;
Plating step, the bright nickel plating of ceramic part elder generation is gold-plated again, and all adopt electrolysis barrel plating method to carry out bright nickel plating and gold-plated.
Further improvement in the technical proposal is: hack between step and the low temperature binder removal step, dark nickel step is plated in electrolysis and dress metal frame step between and also respectively have one between metallization sintering step and the plating step and detect step, it adopts high-power microscope or automatic sorting machines to detect, and uses for next step with the qualified product that detect wherein.
Further improvement in the technical proposal is: the composition and the mass parts content of described porcelain slurry are:
95 aluminium oxide (MgO-Al
2O
3-SiO
2) the porcelain powder, 100 parts;
Distilled water, 600 parts;
Anti-flocculation agent, 3 parts;
Defrother, 5 parts;
Sintering aids, 2 parts.
Further improvement in the technical proposal is: the composition of described adhesive and mass parts content are respectively:
10～60 parts of polyvinyl alcohol;
20～50 parts of ethanol;
20～60 parts of distilled water.
Further improvement in the technical proposal is: each composition and the mass parts content of described plasticizer are:
95 black porcelain, 100～130 parts;
Glycerine, 0.15～1.0 part;
Distilled water, 300～450 parts.
Further improvement in the technical proposal is: in the ceramic post sintering step, the carrier of sintered ceramic part is the molybdenum pellet, and in the metallization sintering step, the sintering carrier of metal framework and ceramic part is a graphite jig.
The invention has the beneficial effects as follows: by adopting SMD components and parts ceramic packaging shell block preparation method of the present invention, can mass-produce thickness only 0.20 ± 0.05mm ceramic substrate and be processed into the encapsulation shell block, and constant product quality.
The present invention is described in further detail below in conjunction with accompanying drawing.
[description of drawings]
Fig. 1 is a SMD components and parts ceramic packaging shell block preparation method's of the present invention process chart.
[embodiment]
As shown in Figure 1, the invention provides a kind of SMD components and parts ceramic packaging shell block preparation method, it comprises following each step:
A, batching step
In the present invention, need use porcelain slurry for major ingredient and all ingredients as auxiliary material, auxiliary material mainly contains adhesive, plasticizer, metal paste, curtain coating agent etc., wherein, adhesive mainly plays adhesive effect in technology, plasticizer plays plasticising and overcomes temperature difference influence in technology, metal paste plays being connected and electric action of ceramic part and metalwork in technology, and the curtain coating agent then can make ceramic constriction coefficient unanimity in technology.
The prescription of above-mentioned porcelain slurry and each reagent when the concrete operations of preparation porcelain slurry, is poured each material composition of tabulating down in 1 in the mixer-mill 20～50 minutes standby getting final product of mix grinding respectively shown in following corresponding table 1～table 5; Correspondingly, standby behind good each auxiliary material of formulated according to following each reagent.
Table 1, porcelain slurry formula
| Composition | Mass parts content |
| 95 aluminium oxide (MgO-Al 2O 3-SiO 2) the porcelain powder | 100 parts |
| Distilled water | 600 parts |
| Anti-flocculation agent | 3 parts |
| Defrother | 5 parts |
| Sintering aids | 2 parts |
Table 2, adhesive formula (mass parts content)
| Polyvinyl alcohol | Ethanol | Distilled water |
| 10～60 parts | 20～50 parts | 20～60 parts |
Table 3, plasticizer prescription (mass parts content)
| 95 black porcelain | Glycerine | Distilled water |
| 100～130 parts | 0.15～1.0 parts | 300～450 parts |
Table 4, metal paste prescription (mass parts content)
| Molybdenum powder | Manganese powder | 95 alumina ceramic powder | Granularity |
| 50～70 parts | 10～25 parts | 10～25 parts | ≤0.01um |
Table 5, curtain coating agent prescription (mass parts content)
| Sequence number | Polyvinyl alcohol | Ethanol | Distilled water | Butyral | Dibutyl is hydrochlorate too | C 17H 35SO 3Al 2O 3 |
| 1 | 10～16 | 48 | 39 | --- | --- | --- |
| 2 | --- | 36 | 44 | 11.5 | 3.8 | 4.7 |
| 3 | 3.0 | 15.3 | 43.7 | 8 | 3.9 | 26.1 |
Wherein, as shown in table 5, the curtain coating agent has multiple different prescription for you to choose, and the corresponding composition that contains is slightly different, but the effect that it played is basic identical.
B, vacuum row bubble step
The porcelain slurry for preparing and adhesive, plasticizer are packed in the mixer-mill, and mix grinding is after 40 ± 15 minutes, successively charging, and the vacuumizing and exhausting bubble, the material behind the exhaust bubble can constantly feed to film-making machine.
C, system film step
This system film step is to adopt film-making machine with casting film mode system film, the gross thickness of the SMD components and parts ceramic packaging shell block of being processed is 0.7 ± 0.05mm, and be divided into trilamellar membrane, wherein, the thickness of the upper and lower is 0.25 ± 0.02mm, middle level 0.2 ± 0.02mm is thick, film is divided into two kinds, a kind of film thickness is 0.25 ± 0.02mm, a kind of thickness is 0.20 ± 0.02mm, and it adopts film-making machine to make by the casting film mode respectively, when making, slurry flow on the carrier film that moves forward from the hopper bottom of film-making machine, and the thickness of base film is controlled by scraper.Embryophoric membrane together enters touring hot wind drying room together with carrier film and dries, and bake out temperature is controlled under the boiling point of slurry solvent, otherwise bubble, crackle can occur.The film that drying chamber comes out, together spool is stand-by together with carrier film.
D, slicing step
Ceramic membrane and carrier film are separated, and it is standby with large-scale printing paper cutting knife ceramic membrane to be cut into mould required size warehouse-in again, and the carrier film that will take off ceramic membrane recycles when cleaning up the back spool for the system film.
E, substrate forming step
Load onto lower floor, middle level, the various different moulds in upper strata respectively with pneumatic punching machine, the ceramic membrane after the section is inserted in the mould, mold substrates of different shape in flakes respectively, put in storage stand-by.
F, metal paste print steps
, metal paste is printed on the ceramic substrate of moulding ready made seal net with printing machine, with circuit requirement and the following needs that go on foot operation of shell block that guarantee that electronic devices and components are required by the difference requirement.
G, lamination step
Forming ceramic substrate after printing with unified benchmark, is stacked lower floor, middle level, upper strata substrate, again with an amount of pressurization of hydraulic press discharging the air between each adjacent laminates, and under making, in, last three layers of ceramic substrate can closely be integrated.
H, hack step
This step is in flakes ceramic substrate to be hacked become single part, and it installs the mould that hacks of unifying benchmark with the upper, middle and lower mould on pneumatic punching machine, to go out ceramic shell block.
Detect I, the first time step
In this detection step, adopt high-power microscope to detect the usefulness of qualified products in order to next procedure.
J, low temperature binder removal step
With the qualified ceramic part after the middle inspection, individual layer not phase ground connection is emitted on the aluminium sheet, put into vacuum drying oven, the temperature of vacuum drying oven is progressively heated from 100 ℃～380 ℃, it is heated and is controlled to be: heated 50 ± 20 ℃ in per 15 minutes, constant temperature kept 12 ± 2 hours after being warmed to 380 ± 50 ℃, and then progressively cooling.Temperature-fall period needs 2-5 hour, like this, materials such as adhesive in the ceramic part, plasticizer is all discharged, and the ceramic part of this moment can not be subjected to any vibration, need handle with care and use for next step operation at aluminium sheet.
K, ceramic post sintering step
Hydraulic drive is sent ceramic part into warm area control kiln.Discharging opening at kiln adopts 1.5 meters oval cartridge type circulating waters to cool off, and also all adopts nitrogen protection to carry out the anoxybiotic sintering at feed inlet and outlet.During sintering, the highest sintering temperature is controlled at 1500 ℃～1820 ℃.Ceramic part is in 60 minutes from advancing stove to the sintering time of coming out of the stove, and the carrier of sintered ceramic part is the molybdenum pellet.
Dark nickel step is plated in L, electrolysis
After sintering is finished, adopt traditional electrolysis to plate dark nickel method again ceramic part is electroplated, so that the metal of printing slurry circuit electric conductivity is better, like this, ceramic part is better with being connected of metalwork.
Detect M, the second time step
After plating is finished, utilize automatic sorting machines again, detect the wherein ceramic part of electric conductivity and profile defective item, and qualified product are used for next step.
N, dress metal frame step
Utilize graphite jig, fit together detecting qualified ceramic part and metal frame.
O, metallization sintering step
The purpose of this step is that ceramic part and metal frame are integrated.During sintering, adopt small-sized sintering furnace to get final product.The graphite film tool that installs ceramic part and metal frame is pushed small-sized sintering furnace, and sintering time is 10～20 minutes, and sintering temperature is 600 ℃～1200 ℃.Also adopt nitrogen to protect and adopt the ammonia reduction during sintering.The sintering carrier of metal framework and ceramic part is a graphite jig.
P, detect step for the third time
After the metallization sintering step, also need detect for the third time, it utilizes an automatic sorting machines to carry out go-on-go, to detect qualified products wherein.
Q, plating step
The qualified products elder generation bright nickel plating that detects is gold-plated again, and all adopt electrolysis barrel plating method to carry out bright nickel plating and gold-plated.
After having carried out above steps, also need carry out final detection, detecting qualified products wherein, and then pack, put in storage and can deliver.
By adopting above steps, can mass-produce thickness only 0.20 ± 0.02mm ceramic substrate and be processed into the encapsulation shell block, and constant product quality.
Claims (10)
1, a kind of SMD components and parts ceramic packaging shell block preparation method comprises the steps:
Batching step is according to formulated porcelain slurry, adhesive, plasticizer, metal paste and curtain coating agent;
Vacuum row bubble step is packed the porcelain slurry and adhesive, the plasticizer that prepare in the mixer-mill into, and mix grinding is after 40 ± 15 minutes, and vacuumizes and discharge the bubble of porcelain in starching;
System film step, produce the ceramic membrane that meets thickness requirement, slurry flow on the carrier film that moves forward from the hopper bottom of film-making machine, and embryophoric membrane enters touring hot wind drying room together with carrier film and dries, the film that drying chamber comes out, together spool is stand-by together with carrier film;
Slicing step separates ceramic membrane and carrier film, and ceramic membrane is cut into the required size of mould, and the carrier film that will take off ceramic membrane cleans up the back spool for recycling;
The substrate forming step is loaded onto lower floor, middle level, the various different moulds in upper strata respectively with pneumatic punching machine, and the ceramic membrane after the section is inserted in the mould, molds substrates of different shape in flakes respectively;
The metal paste print steps with ready made seal net, is printed on metal paste the ceramic substrate of moulding on by the difference requirement with printing machine;
The lamination step, with the forming ceramic substrate after printing with unified benchmark, will descend, in, last three layers of substrate stack, pressurize in right amount with hydraulic press make down, in, last three layers of ceramic substrate closely are integrated;
Hack step, installing is unified the mould that hacks of benchmark with the upper, middle and lower mould on pneumatic punching machine, and in flakes ceramic substrate is hacked becomes single part, and goes out ceramic shell block;
Low temperature binder removal step, with the ceramic part individual layer not phase ground connection be emitted on the aluminium sheet, put into vacuum drying oven, adhesive, plasticizer in the ceramic part are all discharged;
The ceramic post sintering step, hydraulic drive is sent ceramic part into warm area control kiln, adopts the drum type brake circulating water to cool off at the discharging opening of kiln, and also all adopts nitrogen protection to carry out the anoxybiotic sintering at feed inlet and outlet.
2, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1, it is characterized in that: the total thickness of the SMD components and parts ceramic packaging shell block of being processed is 0.7 ± 0.05mm, and be divided into trilamellar membrane, wherein, the thickness of the upper and lower is 0.25 ± 0.02mm, and the thickness in middle level is 0.2 ± 0.02mm.
3, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1, it is characterized in that: in the low temperature binder removal step, the temperature of vacuum drying oven is progressively heated from 100 ℃～380 ℃, heated 50 ± 20 ℃ in per 15 minutes, constant temperature kept 12 ± 2 hours after being warmed to 380 ± 50 ℃, and then progressively cooling, temperature-fall period needs 2-5 hour.
4, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1, it is characterized in that: in the ceramic post sintering step, the highest sintering temperature is controlled at 1500 ℃～1820 ℃, and ceramic part is in 60 minutes from advancing stove to the sintering time of coming out of the stove.
5, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1 is characterized in that: also comprise the steps: after the ceramic post sintering step
Dark nickel step is plated in electrolysis, and it adopts traditional electrolysis to plate dark nickel method ceramic part is electroplated, so that the metal of printing slurry circuit electric conductivity is better;
Dress metal frame step is utilized graphite jig, and ceramic part and metal frame are fitted together;
The metallization sintering step pushes small-sized sintering furnace with the graphite film tool that installs ceramic part and metal frame, and sintering time is 10～20 minutes, and sintering temperature is 600 ℃～1200 ℃, also adopts nitrogen to protect and adopt the ammonia reduction during sintering;
Plating step, the bright nickel plating of ceramic part elder generation is gold-plated again, and all adopt electrolysis barrel plating method to carry out bright nickel plating and gold-plated.
6, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 5, it is characterized in that: hack between step and the low temperature binder removal step, dark nickel step is plated in electrolysis and dress metal frame step between and also respectively have one between metallization sintering step and the plating step and detect step, it adopts high-power microscope or automatic sorting machines to detect, and uses for next step with the qualified product that detect wherein.
7, as claim 1,2,3,4 or 5 described SMD components and parts ceramic packaging shell block preparation methods, it is characterized in that: the composition and the mass parts content of described porcelain slurry are:
95 aluminium oxide MgO-Al
2O
3-SiO
2The porcelain powder, 100 parts;
Distilled water, 600 parts;
Anti-flocculation agent, 3 parts;
Defrother, 5 parts;
Sintering aids, 2 parts.
8, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1 or 2, it is characterized in that: the composition of described adhesive and mass parts content are respectively:
10～60 parts of polyvinyl alcohol;
20～50 parts of ethanol;
20～60 parts of distilled water.
9, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 1, it is characterized in that: each composition and the mass parts content of described plasticizer are:
95 black porcelain, 100～130 parts;
Glycerine, 0.15～1.0 part;
Distilled water, 300～450 parts.
10, SMD components and parts ceramic packaging shell block preparation method as claimed in claim 5, it is characterized in that: in the ceramic post sintering step, the carrier of sintered ceramic part is the molybdenum pellet; In the metallization sintering step, the sintering carrier of metal framework and ceramic part is a graphite jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100362094A CN100502623C (en) | 2005-07-26 | 2005-07-26 | Method for preparing case seat of ceramic package for SMD parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100362094A CN100502623C (en) | 2005-07-26 | 2005-07-26 | Method for preparing case seat of ceramic package for SMD parts |
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| Publication Number | Publication Date |
|---|---|
| CN1728926A CN1728926A (en) | 2006-02-01 |
| CN100502623C true CN100502623C (en) | 2009-06-17 |
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|---|---|---|---|
| CNB2005100362094A Expired - Fee Related CN100502623C (en) | 2005-07-26 | 2005-07-26 | Method for preparing case seat of ceramic package for SMD parts |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102786324B (en) * | 2012-07-27 | 2014-06-11 | 宜宾红星电子有限公司 | Method for preparing metallic ceramic refrigeration substrate through superposition sintering |
| CN104030663B (en) * | 2014-06-18 | 2016-09-14 | 广州硅能照明有限公司 | COB ceramic substrate preparation method and COB light source |
| CN106209005A (en) * | 2016-08-01 | 2016-12-07 | 安徽贝莱电子科技有限公司 | A kind of production technology of quartz-crystal resonator base of ceramic |
| CN109585162B (en) * | 2018-12-29 | 2020-11-17 | 广东芯晟电子科技有限公司 | Low-stress single-layer chip capacitor and preparation method thereof |
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