CN100495268C - A process and apparatus for improving and controlling the curing of natural and synthetic moldable compounds - Google Patents

A process and apparatus for improving and controlling the curing of natural and synthetic moldable compounds Download PDF

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Publication number
CN100495268C
CN100495268C CNB2005800077267A CN200580007726A CN100495268C CN 100495268 C CN100495268 C CN 100495268C CN B2005800077267 A CNB2005800077267 A CN B2005800077267A CN 200580007726 A CN200580007726 A CN 200580007726A CN 100495268 C CN100495268 C CN 100495268C
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components
impedance
examples
sensor
parts
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CN1950768A (en
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斯科特·施奈德
理查德·马吉尔
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Ineos Composites IP LLC
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Signature Control Systems Inc
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Abstract

A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.

Description

Be used to improve and control method and apparatus natural and the curing moldable compounds that synthesizes
Technical field
The present invention relates to be used to monitor and control the curing of natural and synthetic moldable compounds and the method and apparatus that solidifies.The typical case of such moldable compounds is a polymkeric substance.
Background technology
Up to now, solidifying and/or solidificating period has caused to the method for the fixing technological parameter of the processed and applied of moldable polymer: owing to excessively reduced productive rate the set time of guarding; And owing to fixing technological parameter can't adapt to solidify and/or solidifying process in intrinsic changeability make the product homogeneity bad.
Attempted analyzing dielectric property to determine the solid state of hardening element.Particularly, this following list of references with its hereby incorporated by reference disclose may with analyze solid state and/or the relevant various technology of solidifying process:
American documentation literature
Submitted inventor Diehr, people such as II on August 6th, 4,344,142 1975
Submitted inventor Zsolnay on Dec 29th, 4,373,092 1980
Submitted people such as inventor Zsolnay on Dec 29th, 4,399,100 1980
Submitted people such as inventor Senturia on September 3rd, 4,423,371 1981
Submit people such as inventor Zsolnay 4,496,697 Augusts 24 nineteen eighty-two to
Submit people such as inventor Yamaguchi 4,510,103 September 19 nineteen eighty-three to
Submit people such as inventor Hinrichs 4,551,807 Augusts 17 nineteen eighty-three to
Submitted inventor Kranbuehl on May 1st, 4,723,908 1985
Submitted people such as inventor Day on June 27th, 4,777,431 1986
Submitted people such as inventor Harris on September 20th, 4,773,021 1988
Submitted people such as inventor Persson on September 19th, 4,868,769 1989
Submitted people such as inventor Lee on March 31st, 5,032,525 1988
Submitted people such as inventor Keller on November 12nd, 5,219,498 1991
Submitted inventor Kranbuehl on September 15th, 5,317,252 1992
Submitted people such as inventor Stone on Dec 29th, 5,486,319 1993
Submitted people such as inventor King on June 18th, 5,528,155 1996
Submitted inventor Hager, III on September 10th, 5,872,447 1997
Other publications
■A?comparative?study?of?step?curing?and?continuous?curingmethods，1994，D.Khastgir，Indian?Institute?of?Technology
■AC?Impedance?Spectroscopy?of?Carbon?Black-Moldablecomposites，1999，K.Rajeshwar，University?of?Texas?atArlington
■Anelastic?and?Dielectric?Effects?in?Polymeric?Solids，1967，N.G.McCrum，B.E.Read，and?G.Williams
Be used for the curing of manufacture component and solidification technology the curing of for example dielectric of polymer resin (being also referred to as " impedance " here) characteristic and this resin is provided and/or solidify between some relations.But, with the mouldable curing of polymerization and/or solidify relevant prior art and also do not solve fully in production technology, especially under the high friction of injection moulding or other molding types and hyperbaric environment, directly carry out aspect measurement actual of electric or impedance.In addition, prior art is not open satisfactorily for molding methods miscellaneous and condition, uses the electric data that obtains to realize for example curing of polymerization moldable compounds and/or the closed-loop control of solidifying process.Particularly, prior art is not provided at by reducing the solution or the disclosure of defectiveness parts during curing and/or the next molded big parts of solidified polymeric effectively.More specifically, prior art does not have public use from solidifying in the mould or/and the effective technology of electric (being impedance) data sample of solidifying process, wherein such data sample receives simultaneously from a plurality of mould inner sensors, and described sensor distributes as follows: the curing and/or the curdled appearance that make it possible to assess the different piece of big parts.
Prior art be not illustrated in yet solidify and/or solidifying process in how to compensate: (a) batch and batch in the variation of the mouldable curing compound of polymerization, and (b) difference of material thickness.In addition, prior art does not have compensation to be incorporated into supplementary variable in this technology by the thermal history of character, tool processes (tooling) and the mouldable curing compound of polymerization of equipment.
In addition, prior art is used dielectric or impedance measurement sensor, and it adopts has accurate area and spacing, relative and parallel electrode, and wherein said electrode directly contacts with moldable compounds.Although this electrode and sensor provide the means that are used in curing and/or solidificating period measurement impedance operator, their are used may be unpractiaca in the parts production environment.For example, a lot of mouldable assemblies are to use the parts molding technique to produce, this technology is born up to the pressure of 30000psi with up to the temperature of 425 ℉ this sensor, and will hold out against (for example, because moldable compounds flowing on sensor) in the environment of high friction.At last, such prior art sensor also must can hold out against by typical clean method such as CO 2The mould that impacts with plastic bead cleans.
Therefore, above-described defective is by hereinafter disclosed curing and system solve.In addition, owing to need the standard practices that intrinsic changeability causes in margin of safety set time (set time that promptly surpasses the expected time that it has been generally acknowledged that) and/or the curing process by moldable compounds to molded (plasticmolder), therefore need real-time feedback and solidify control system, it reduces the margin of safety of molded and prevents that simultaneously waste product from increasing and the production of interference parts.Hereinafter disclosed curing and system have also solved the demand of real-time feedback being solidified control system.
Definition and term
A large amount of technical terms and abbreviation have been used in the disclosure below.Therefore, for convenience's sake, many these terms and abbreviation have been described in this section.Therefore, suggestion saves to obtain the description of term used herein with reference to this.
Fiducial interval: numerical range, concrete several indication incidents or conditional possibility in it, for example, the probable range such as 0.8 to 1.0.
Solidify: use as following, this term is meant: (a) the crosslinked chemical change of polymkeric substance from softening structure to ridge (ridge) structure of experience, and the sclerosis of the polymkeric substance that (b) is ductile makes it be frozen into rigid structure and do not have chemical change.
The index range coefficient: by one group of raw data being carried out the range coefficient (A) that the optimum index match defines, wherein matched curve (y) is described by following equation:
Y=Ae -α t, wherein t is the time.
Exponential damping: by one group of raw data being carried out the attenuation coefficient (α) that the optimum index match defines, wherein matched curve (y) is described by following equation:
Y=Ae -α t, wherein t is the time.
Impedance data stream: for solidify and/or solidifying process during work so that detects each sensor of the impedance change in the hardening element, obtain the time series value at the parts setting up period, wherein the impedance measurement of the capacitor circuit (CC) of the correspondence that for example provides by sensor, part mold and moldable compounds wherein of these values indication.Especially, each capacitor circuit operationally is configured to moldable compounds is become the dielectric that is used for corresponding capacitor circuit.In addition, the impedance data mentioned here stream section is described in a U.S. Patent application No.10/800 who submitted on March 11st, 2004 more completely, in 079, at this with its hereby incorporated by reference.
The metal material of low CTE: a kind of material with low thermal coefficient of expansion.
Moldable compounds: this term is meant (a) polymerization moldable compounds, (b) styrene monomer compound (SMC), (c) phenolic materials and (d) for example phenolic aldehyde, urea, melamine, melamine-phenolic aldehyde, epoxy resin, unsaturated polyester (UP) of thermosetting plastics; Note, in this definition and term joint, described term " polymerization moldable compounds ", SMC and " phenolic materials ".
Phenolic materials: the mouldable plastic material that the reaction by formaldehyde [HCHO] and phenol [C6H5OH] forms, but can use almost any reactive phenol or aldehyde.This material can strengthen or " filling " in a large number with glass fibre or other materials.Phenolic aldehyde is because its high impact, excellent wearing character and the dimensional stability in the wide temperature range and well-known.Phenolic aldehyde can be a thermoset molding.Commercial used phenol is phenol, cresols [CH3C6H4OH], xylenols [(CH3) 2C6H3OH], p-t-butyl phenol [C4H9C6H4OH], p-phenyl phenol [C6H5C6H4OH], bis-phenol [(C6H4OH) 2] and resorcinol [C6H4 (OH) 2].Used aldehyde is formaldehyde and furfural [C4H3OCHO].Under uncured and semi-cured state, phenolics is as tackifier, casting resin, cast compound and laminated resin.As molding powder, phenolics can be used for electric purposes.
Process curve: flow the impedance data that (this described above term) derives from the impedance data of correspondence, value in the wherein said impedance data stream by " smoothly " (perhaps otherwise handling), makes and can more easily determine rate of curve and other mathematic curve characteristics.The example that is used for the operation of level and smooth impedance data stream is:
(a), determine linear least-square best fit and the slope of line (being the m among the equation y=mx+b) as a result on the section project for each section in one or more predetermined amount of time of impedance data stream.Then, process curve becomes the linking sequence of determined line;
(b) for each section in one or more predetermined amount of time of impedance data stream, determine the best-fit 3 rank polynomial expressions that the impedance data stream project in the section is carried out modeling; And
(c) for each section in one or more predetermined amount of time of impedance data stream, definite index best-fit that impedance data stream project in the section is carried out modeling, wherein be identified for the attenuation coefficient of this index best-fit at least, and determine decay and range coefficient in certain embodiments and (promptly determine following equation y=Ae -α xIn α and A).
Process curve becomes the connection for the curve that each produced in described one or more time periods then.Notice that process curve can derive from the single time period of whole set time of being essentially parts.But usually such time period can be restricted to the percentage of the set time in 10% to 35% the scope.
Certainly, other smoothing operators are also here in the scope of disclosed novel cure system, as SPL (for example, its shape can be controlled by " reference mark " of calculating from the value of impedance data stream).
R-square of (R 2): R-square (being also referred to as definite coefficient) is that the statistics that reduces of total variation of the dependent variable that causes owing to corresponding independent variable is measured.Approach the corresponding data model of 1.0 R-square value indication and explained nearly all changeability in each variable.
Moldable polymer (being equal to ground, " polymerization moldable compounds "): this term is meant:
(a) typical matrix moldable polymer
(b) phenolic compound and
(c) with the phenolic compound of other materials combination, described other materials includes, but is not limited to inorganics filled phenolic aldehyde, glass filled phenolic, usefulness (but being not limited to) cotton, PTFE (being teflon), wood powder and graphite-filled cellulose phenolic aldehyde.
In addition, one skilled in the art will appreciate that and be included in having in the term " moldable polymer ": ethylene-methacrylic acid copolymer, nylon, polycarbonate, polychlorotrifluoroethylene, ethylene-acrylic acid copolymer, polyetheretherketone, PEN, polyethylene terephthalate, polymethylmethacrylate, polyoxymethylene, Polyvinylchloride, polyvinylidene chloride, polyvinylidene fluoride, polyvinyl fluoride, styrene-acrylonitrile, tygon, acrylonitrile-butadiene-styrene (ABS), acrylic acid-styrene-acrylonitrile, polyamide-imides, polybutylene terephthalate, PC, polycarbonate/polybutylene terephthalate, polyetherimide, polyethersulfone, polyimide, polyphenylene oxide, polyphenylene sulfide, polysulfones, phenylethylene-maleic anhydride, thermoplastic elastomer, polypropylene, polystyrene, thermoplastic olefin, teflon and composition thereof; That is thermoplastic.
SMC: styrene monomer compound, the vibrin that for example contain the 35wt% styrene monomer of having an appointment usually, still can in about 0%-50% scope, change.
Tonnage (Tonnage): the force of compression of mold pressing device, represent with ton usually.
Tool steel: be applicable to the steel of making injection moulding and compression mould, as AISI type A2 tool steel.
The topological characteristic of impedance related data: in process curve, can discern and unique feature, as the rate of change of rate of curve, peak (for example local maximum), paddy (for example local minimum), flat (for example zero slope) basically, flex point, rate of curve etc.
Vacuum ports: in mould, design, be used for the pressure of mold cavity is reduced to subatmospheric port.
Summary of the invention
Present disclosure relates to and is used for (this term also is described in above) and shaping mould member made are solidified in control by moldable compounds (this term is described in definition and term joint above) method and system.Especially, the moulding part that obtains by curing disclosed herein and system:
(a) can be fully moulding be again more completely crued (but not being over-curing);
(b) have consistent and characteristics of components repeatably, comprise that (or not having) of minimizing bubbled and/or hole;
(c) have desired characteristics as: compressive strength, with the cohesive of dissimilar material, dimensional uniformity etc.; And
(d) with average set time of the shortening of each parts and solidify (for example, can reach about 38%).
In addition, curing disclosed herein and system:
● in traditional parts production environment be robust and repeatably, for example in the environment of production large volume automobile with (automotive) SMC moulding part;
● when making consistent parts, automatically adjust set time with the compensating mold temperature fluctuation;
● use a plurality of impedance detection sensors in mould, provide that the influence (as described in hereinafter) of introducing and placing in the mould of moldable compounds the parts solidification rate is shown;
● be identified in the flow abnormalities of the moldable compounds of parts setting up period, and provide feedback to change the curing process variable effectively, to improve moulding technology; And
● the variation in the moldable compounds that identification is cured, and the mechanism of improving parts-moulding continuously is provided.
Curing disclosed herein and system comprise novel feature, and it is used for monitoring and controlling flowing of mould moldable compounds, and the polymerization of moldable compounds or crosslinked.In addition, such supervision and control can promptly be carried out during the curing (for example thermosetting) of parts in real time, the feasible quantity that can reduce the defectiveness parts of being produced.
In addition, curing disclosed herein and system can eliminate current be used to guarantee correct moulding of parts (particularly relative big parts) and curing set time margin of safety major part.
Present disclosure relates generally to a kind of curing and system of novelty, wherein has a plurality of sensors operationally to be distributed in the mould, is used for the state of detection part moulding and at the solid state of each spacer portion office of parts.Therefore, can be used to determine whether and/or when this mould is correctly filled moldable compounds from the output of a plurality of sensors, and and/or when whether these parts were both correctly solidified, and were in the solidification rate of homogeneous basically again in whole parts.
For each sensor in a plurality of sensors of during curing process, working, obtain the data stream (being expressed as " impedance data stream " here) of resistance value, wherein these values are provided by the impedance measurement that obtains from the corresponding capacitor circuit (CC) that is provided by sensor, part mold and moldable compounds wherein.Especially, each capacitor circuit operationally is configured to make moldable compounds to become the dielectric of corresponding capacitor circuit.For each impedance data stream, can there be corresponding " process curve " (as described in the definition and term joint above).In addition, such process curve can be expressed as the time series figure of the impedance measurement of corresponding impedance data stream.Attention: such process curve can but do not require it is the level and smooth fully expression of impedance data stream; But, one skilled in the art will appreciate that this process curve can be the connection (for example, continuous first order derivative) of level and smooth segment of curve.Such impedance data stream and corresponding process curve thereof provide indicating device how at indication or " signature " of its die for molding and curing.Especially, to be confirmed as be good moulding, the correct parts that solidify and the prediction of various component defects to the various geometric properties of process curve (for example slope, local maximum, local minimum, flex point etc.).Therefore, the correct and/or incorrect solid state of position in the mould is determined in method and system use disclosed herein from the characteristic (for example shape and/or geometrical curve characteristic such as slope and/or the area under this process curve) of the process curve acquisition of a plurality of sensors.Attention: this impedance data stream can be represented the one or more time series in the resistance value of following impedance type: impedance (Z) (promptly to the measuring of total resistance of the electric current in the alternating circuit, it is that Ohmage and reactance are formed by two components, and be expressed as Z=R+iX with complex representation usually, wherein R is that Ohmage and X are reactance), phasing degree (Φ), resistance (R), reactance (X), electricity are led (G) and/or electric capacity (C).
In addition, for each sensor, a plurality of impedance data streams (and their related process curve) that can produce to some extent.For example, for given sensor, this impedance data stream can be derived from the signal response exported by the corresponding capacitor circuit of excitation, and wherein this excitation is one the result who is input in a plurality of predetermined unlike signal frequency of capacitor circuit.Therefore, each process curve can be from the corresponding individual signals frequency that is input to the capacitor circuit with sensor and is obtained, and the correspondingly-shaped of process curve (or other estimated performances) can be used to monitor, control and/or predict the result of parts curing process as a result.
Among discloseder here embodiment, can handle various time series capacitor circuit output data components (for example, impedance (Z), phasing degree (Φ), resistance (R), reactance (X), electricity are led (G) or electric capacity (C)) respectively to monitor and the control assembly curing process.Therefore, the process curve that is produced by these different pieces of information components can provide unique shape (or other features), and its characteristic can be used for monitoring and the control curing process.For example, this characteristic can comprise process curve local maximum or local minimum, rate of curve, slope, the sign, flex point, process curve that have basically a process curve part of the zero slope area under partly etc.
Can be individually or in groups relatively or the process curve that obtains from a plurality of these mould inner sensors of assessment, with the variation of the solid state of the each several part of detection part (particularly big relatively parts such as fascia) and/or unusual.Therefore, the characteristic of the process curve that can derive from the output of proximity sense by assessment or by will such process curve characteristic the localization the detection part curing is unusual with comparing from the corresponding characteristic of the process curve of other sensors.About this relatively, can list relatively down:
(a) the specific elapsed time of solidifying for parts, the average gradient of the part of the process curve of a sensor of supervision parts curing and the average gradient of the counterpart of the process curve of another sensor that solidifies from the supervision parts;
(b) monitor the maximal value and maximal value of the process curve of the sensor that parts solidify from the process curve that monitors another sensor that parts solidify;
(c) when the parts demoulding, the value of the process curve of the sensor that the supervision parts solidify and value from the process curve that monitors another sensor that parts solidify.
This localization during parts solidify may be unusually since for example the moldable compounds that reduces to the part of mould flow and/or the solidification rate of the solidification rate of the part of hardening element and the remainder of these parts has deviation (for example, owing to component thickness variation, the interior uneven heat distribution of mould etc.).In addition, the more overall parts degree of consistency (or its deficiency) of solidifying between the corresponding process curve (for example, in identical impedance frequency) of a plurality of sensors that assessment also can be by for example assessing the output impedance data is determined.For example, when but this process curve has similar shape is offset each other in time, the different piece of this possibility indicating device may be to be in different solidification rates, and for example may need the each several part of mould is cured time adjustment and/or temperature adjustment, whole parts (or parts subsequently) are correct to be solidified so that make.
The initial portion that is to use the impedance data stream that is produced by a plurality of sensors (mould in) on the other hand of this curing and system (for example assigns to adjust the moulding part that is used for subsequently, from same mould) condition of cure, make the moldable compounds that before the beginning of solidifying, will solidify this mould of complete filling basically.Especially, can adjust mold pressing device tonnage and press off (press closure) speed, and more particularly, solidify the crosslinked beginning of essence in the moldable compounds with the modification solidification rate.
Among at least some embodiment of disclosed here curing and system, before the batch of the parts of specific component type solidifies, can test or sample phase, with each of the moldable compounds that is identified for these parts form or batch the curing characteristics of sample.For example, this sample can be cured: (a) arrange with the difference of the moldable compounds that provides in mould, (b) with different solidification temperatures, (c) continue time of different length, (d) with different mold pressing device tonnages.Can the assessment result test component and the process curve of their correspondences, to determine adjustment, to make for example can to prolong from set time of owing cured sample parts (and having specific introducing in mould) of the particular batch of moldable compounds and/or to improve mold temperature to curing process.Therefore, compare by the corresponding impedance data that obtains during the process curve that will derive from this test sample and the hardening element the production running (for example wherein can produce thousands of examples of components) of this unit type, the moulding that can determine parts and curing are correct or incorrect.In addition, if the curing of parts and/or moulding are incorrect, then can make adjustment to curing process, more may be acceptable so that make result feature.Especially, this adjustment may cause the subsequent section (from a plurality of sensors) of process curve to meet the process curve of the parts of moulding correctly and curing better.Therefore, although this process curve between the separate part may aspect the relative timing of amplitude and/or various curve characteristics be different (for example owing to component thickness, thermal history, mold temperature and rate of heat delivery, curing rank and various other factors cause), but for each separate part, the cluster degree of the degree of consistency of the shape of the process curve of parts and this curve can be used to predict whether this result feature will be by correct moulding and curing.
Present disclosure be on the other hand in each embodiment of this cure system and for some moldable compounds, the correspondingly-shaped of one or more above-described process curves may represent " maximal value " and/or " minimum value " in preset time, and it also can be used to infer and is monitoring, controlling and/or predicting correct parts Useful Information aspect set time.
Present disclosure be on the other hand, for some moldable compounds, provide one or more (being preferably a plurality of) " evaluator (evaluator) " (being also referred to as " program agency (programmatic agent) " or " condition " here) to be used to export the value relevant in each embodiment neutralization with the set time of parts.This evaluator can be corresponding slope or the integral area under one or more process curves for example.Can be associated with the set time of known moldable compounds sample from the output of one or more evaluators, thereby determine the predictive validity of evaluator.Represent the evaluator related with the physical measurement characteristic height of result feature can be used to infer monitor, Useful Information aspect correct set time of parts that control and/or prediction are solidified subsequently such as mass-produced parts.In at least one embodiment, combination (for example for linear combination) provides from two or more (for example four) and the output of the evaluator of the highest correlation degree of the curing characteristics measured, to produce even better to be used to predict the parts fallout predictor of set time.
This cure system and method be on the other hand, embodiment can comprise signal Processing and other software and hardware assemblies, be used to derive the corresponding characteristic (for example maximal value and/or minimum value) of process curve and this curve, and utilize this curve characteristic to be identified for the set time preferably of the batch parts produced in real time.Especially, for example utilize the independently expert system of intelligent agent, artificial neural network and counting system structure, and provide based on the decision-making of statistics and determine the hybrid computing system of system, as Salford Systems, 8880 Rio San Diego Dr., Ste.1045, San Diego, the CART of Calif.92108.
In addition, the one side of this cure system and method is, can determine parts set times with the minimizing that obtains desired characteristic in the hardening element as a result such as tensile strength, compressive strength, dynamic stiffness, dimensional uniformity, bubbling/hole and/or elimination and with the cohesive of dissimilar material.
The advantage of present disclosure, benefit and can obtain the other description of patent aspect will be from hereinafter accompanying drawing and description and become obvious.All novel aspect of present disclosure, no matter in this summary of the invention joint, whether clearly mention, individually or with combined ground, other aspects of present disclosure, all be considered to the theme of patent protection.Therefore, may from content of the present invention joint, omit or describe by halves, disclosed this novel aspect is incorporated into here by reference in content joint of the present invention fully hereinafter and/or in the accompanying drawing.Especially, all authority of claim joint hereinafter requires to be incorporated into here fully by reference in content joint of the present invention.
Description of drawings
Fig. 1 illustrates the assembly of an embodiment of parts curing disclosed herein and system.
Fig. 2 illustrates the more specific embodiment of impedance transducer circuit 62, this circuit: (i) supply with electric signal to sensor 17, (ii) determine the impedance measurement of indication in the impedance of the moldable compounds 16 of sensor 17 places or its vicinity.
Fig. 3 A illustrates the exploded view of an embodiment of one of a plurality of sensors of the impedance measurement that can be used to the moldable compounds 16 that obtains to solidify.
Fig. 3 B illustrates the additional views of the sensor 17 of Fig. 3 A.
Electric (impedance) sensor 17 that provides in the mould 18 is provided Fig. 4.
Fig. 5 illustrates another view of impedance transducer circuit 62.
Fig. 6 is the process flow diagram of the high-level steps carried out, and it is used for the initial solidification parameter of determining that the beginning parts solidify, and is used for determining to when the hardening element and/or be used to solidify adjustment with the cure parameter of back part.
Fig. 7 provides the process flow diagram of more detailed step of step 1014 of the process flow diagram of Fig. 6.
Fig. 8 is the process flow diagram that is illustrated in the embodiment that for example produces the high-level steps of carrying out during the running, wherein is contemplated to substantially the same a plurality of parts and is sequentially solidified one by one.
Fig. 9 illustrates the figure of the curve (and corresponding process curve) of typical SMC (polyester, styrene monomer) impedance data stream, wherein the time be illustrated in second on the x axle and relatively electricity lead and be illustrated on the y axle.What illustrate in addition is that each point of (or expection will take place) takes place the curing incident.
Figure 10 illustrates the data point (and corresponding process curve 1404) of the impedance data flow valuve of the curing that is used to solidify the parts of making from the SMC as moldable compounds 16.Especially, the percentage of x axle express time, wherein these parts are expected curing and are not used cure system 20.
Figure 11 illustrates the part of the mold cavity 28 that is used to solidify the body of a motor car panelling, and wherein three sensors 17 (being sensor 17a, 17b and 17c) are illustrated in the sidewall of mold cavity.
Figure 12 illustrates below by in normal temperature (300 ℉), at 285 ℉ and the typical figure that solidifies the impedance data stream (one of sensor 17) that the body of a motor car panelling of Figure 11 produces at 315 ℉.
Figure 13 is illustrated in and uses before cure system 20 supervision and the adjustment component curing figure of the curve map (and their corresponding process curve) of the typical impedance data stream that SMC charging shown in Figure 11 is placed.
Figure 14 illustrates the body of a motor car panelling that solidifies in the mold cavity 28 of Figure 11, settles the figure (and their corresponding process curve) of the afterwards typical impedance data stream of SMC charging in mold cavity 28 again.
Embodiment
Fig. 1 illustrates the embodiment of cure system 20 disclosed herein, and wherein this cure system comprises following high-level component:
(A) curing apparatus 45, are used to solidify parts wherein;
(B) control system 39, are used for controlling curing apparatus 45 and adjust cure parameter to reduce the defective in the parts that mould 18 solidifies; And
(C) curing is provided with subsystem 104, is used to be identified for the initial solidification parameter sets of specific features and the adjustment that is used to determine to can be used for proofreading and correct the condition of cure that may produce the defectiveness parts.
Curing apparatus 45 comprises following high-level component:
(A.1) mould 18, and moldable compounds 16 is cured into the expectation parts within it, and this mould has mold cavity 24, are used to hold the moldable compounds 16 of waiting to be solidified into the expectation parts.The a plurality of sensors 17 (only illustrating one in Fig. 1) that distributed in the body of mould 18 are used to detect the impedance operator of its various piece when moldable compounds 16 solidifies;
(A.2) assembly of a plurality of capacitors 68 (one of them only is shown), wherein each capacitor 68 is formed by following: (i) be placed directly into adjacent with the moldable compounds that is cured 16 (and contacting usually) corresponding impedance transducer 17; And the (ii) capacitor plate 64 of ground connection, it is another part of mould 18 normally.Attention: moldable compounds 16 is capacitor dielectric of each such capacitor 68.
Control system 39 comprises computing system such as computing machine 34 (or network of computing machine), carries out on it to be used for the processing that control assembly solidifies.Especially, following assembly is provided (perhaps can be visited by for example communication network such as the Internet or LAN (Local Area Network) by computing machine 34) by computing machine 34:
(B.1) data collecting card 35, are used for
(i) produce the sinusoidal excitation voltage that is input to sensor measurement unit 60, wherein sensor measurement unit 60 provides this voltage to sensor 17, so that obtain the consequential signal of indication from the impedance data stream of sensor; And
(ii) read from the impedance signal of each sensor 17 (and more specifically, from amplifier 36 that hereinafter further describe, Fig. 2) output and with its digitizing.
(B.2) digital signal generator 41, are used for determining and output signal characteristics (for example frequency and voltage), and wherein this characteristics of signals is used for the signal output of control data capture card 35, and control the signal output to sensor measurement unit 60 particularly.
(B.3) the digital demodulation signal assembly 42, are used for demodulation by the impedance indicator signal of data collecting card 35 from sensor 17 and amplifier 36 receptions.
(B.4) the curing data acquisition database 23, be used to store the impedance data stream that obtains from sensor 17, and the information and being used for that this data stream and sign is used for the moldable compounds 16 of parts production obtains the parts that this impedance data flows from it various ambient cure parameters (for example solidification temperature, set time, mould tonnage etc.) are associated.
(B.5) solidify analyzing subsystem 26, be used to analyze output (this output obtains from curing data acquisition database 23) from the parts of current curing, and determine to reduce in parts, form defective, to any adjustment of curing process (for example adjustment component set time), perhaps determine can be used to solidify the adjustment of examples of components subsequently.Attention: solidify analyzing subsystem 26 and can control database from curing and 27 receive initial parts cure parameters and solidify and adjust parameter (for example, in the cure parameter adjustment of parts setting up period, as mould 18 temperature adjustment etc.).In addition, solidify analyzing subsystem 26 and can receive or derive data, be used for the parts curing process is made adjustment and/or discern and when will finish parts curing by particular characteristics sensor 17 outputs, sign impedance data stream.The process flow diagram of Fig. 8 and hereinafter its subsidiary explanation provide by solidifying the further open of operation that analyzing subsystem 26 carries out.In addition, solidify analyzing subsystem 26 and can comprise expert system and/or " intelligence " system architecture, be used to discern landform (for example shape) feature or the mathematical characteristic of process curve, and/or be present in the pattern in the process curve.Therefore, the embodiment that solidifies analyzing subsystem can comprise one or more in following: utilize for example autonomous intelligence agency, the expert system of fuzzy logic, one or more artificial neural network and counting system structure, and provide based on the decision-making of statistics and determine the hybrid computing system of system, as Salford Systems, 8880 Rio San Diego Dr., Ste.1045, San Diego, the CART of Calif.92108.The figured example of impedance data stream at Fig. 9,10 and 12 to shown in 14.
(B.6) solidify controller 43, be used for controlling the curing of curing apparatus 45 parts.Particularly, controller 43 communicate by letter with solidifying analyzing subsystem 26, is used for determining to the adjustment of the current curing (for example set time) of parts and/or is used to discern being used in the adjustment of same mould 18 curing with back part.When carrying out such adjustment, the order wire 28 that controller 43 passes through to output unit 38 will solidify order or instruct and output to curing apparatus 45.Correspondence order or instruction that device 38 can be carried out the assembly (for example mold pressing device and mold heating system) of this order or instruction translation (if necessary) one-tenth curing apparatus 45 again are provided to curing apparatus 45 by order or the instruction that line 44 will be translated so then.For example, Fan Yi order or instruction can be like this: (i) in mould 18, solidify with back part, near increase mould 18 a solidification temperatures specific sensor 17, (ii) reduce the tonnage that is applied to mould 18, (iii) prolong set time, and/or (iv) open mould 18 when forepiece.
(B.7) digital input unit 37, are used for receiving (by line 40) indication when cure cycle has started or when moldable compounds 16 is provided to mould 18.Digital input unit 37 outputs to the notice of correspondence by line 29 and solidifies controller 43.The example of this device 37 is known in the present technique field.
(B.8) the sensor measurement unit 60, are used to produce the electric signal that is input to sensor 17, and are used for receiving impedance indicator signal (being impedance data stream) from sensor 17.Note unique sensor measurement unit 60 being arranged for each sensor 17.
(B.9) amplifier 36 (each sensor measurement unit 60 at least one) is used to amplify real-time (promptly at parts setting up period) impedance data signal corresponding with the impedance of capacitor 68.
About curing subsystem 104 is set, this subsystem uses by solidifying the user, be used for alternatively being identified for solidifying the initial solidification parameter setting of serial parts subsequently, and in certain embodiments, determine may adjusting that the setting up period of these parts can be made in particular mold 18.Curing is provided with subsystem 104 and can carries out one or more following tasks:
(C.1) allow user capture to solidify news file 31 (Fig. 1), solidify information with the moldable compounds 16 relevant history that obtain and will be used for current curing process, this information for example is:
(i) be used for the typical solidification temperature (and scope) of this moldable compounds,
The typical curing process curve (and variation) that (ii) is used for this moldable compounds 16,
(iii) the solidification temperature according to the composition of moldable compounds 16 changes;
(C.2) allow the information of user capture about curing apparatus to be used 45, the preferred temperature setting that for example is used for curing apparatus 45 can typically be spent than another duplicate or the model high 1 of curing apparatus 45;
(C.3) allow user and subsystem 104 alternately to carry out Fig. 6 and 7 steps of hereinafter describing, wherein can use the appointment moldable compounds 16 of different batches to come the cured sample parts, and use different cure parameter (for example set time, mold temperature, tonnage etc.) to solidify them.Replacedly, if in archives 31, there is enough history to solidify information, then do not need to produce and the assessment sample components.Under any circumstance, solidify and subsystem 104 to be set initial solidification parameter as a result is provided with, will solidifies (any) that the parts setting up period is carried out and adjust set that (or the adjustment subsequently that is used to solidify optional feature) and parts solidify end condition and output to solidify and control database 27.Data acquisition and control hardware
Data acquisition and control hardware are (for example, the digital signal generator 41 of the embodiment of Fig. 1 and data collecting card 35) can produce a plurality of sinusoidal signals of one or more expected frequencies, it is transfused to (by one of sensor measurement unit 60) to each impedance transducer 17.Particularly, if be imported into each sensor 17 more than a signal frequency, then this signal frequency is multiplexed in each sensor serially, makes to compare set time with typical parts can almost side by side obtain from each incoming frequency sensor impedance response of (with at each sensor).One or more frequencies of input can be at 10Hz in the scope of 5GHz, and determines that from the sensor response corresponding electricity leads and/or capacitance measurement.Therefore, electricity is led and capacitive reading (being equal to ground, process curve) is specific for the moldable compounds 16 under solidifying, and reason is that it is specific dielectric response pattern that the two poles of the earth composition of compound will produce for moldable compounds.In addition, this electricity lead with capacitive reading may be specific for the curing apparatus 45 that uses.
Sensor 17
The embodiment of one of impedance transducer 17 illustrates in Fig. 2 in more detail.Particularly, each sensor 17 comprises central electrode 10, and it is as the capacitor plate of corresponding capacitor 68.Additional protection or guarded electrode 11 be around central electrode 10, and play shielding action, stops the too much fringing flux (fringing) of the electric field on adjacent mould 18 surfaces, in each sensor 17 typically imbed and be installed in the described surface.One skilled in the art will appreciate that in company with electrode 10 be energized together (according to from the sensor measurement unit 60 signals that receive) guard electrode 11 help to stop electric field to form fringing flux or become non-linear in central electrode 10 inductions of sensor 17.Electrode 10 and 11 separates with moldable compounds 16 as aluminium oxide ceramics or another stable dielectric insulator (being that dielectric is stable such as 300 ℉ on the curing process temperature range of 425 ℉ for example) by thin (for example about 0.001 to 0.05 inch) ceramic coat 13 (Fig. 2).Electrode 10 and 11 can be made up of low CTE metal material, for example is embedded in stainless steel, titanium in the ceramic circuit (not shown) of layering, is called Kovar Nickel-cobalt-ferroalloy (it is the trade mark that is had by CRS Holding Inc., the said firm is Wyomissing, the subsidiary company of the Carpenter Technology Corp. of Pa), nickel steel, tool steel, tungsten, superalloy (super alloy) and magnetically soft alloy etc.Can serve as the relative pole plate (being ground connection pole plate 64) of capacitor 68 with any other conductive surface (for example relative die surface) smooth or semi-flat that solidifies the moldable compounds contact, and as being used for and central electrode 10 capacitively coupled third electrodes.Be additionally noted that relative pole plate 64 is grounding to electrically 25 so that the global semaphore reference point to be provided.Therefore, because antipode plate earthing, when telegram in reply stream (complex current) (described in definition and term joint) is driven through resistor 19 (Fig. 2) to ground 25 the time, this electric current is by as the interior dielectric moldable compounds 16 of formed capacitor 68.Then, with the complex voltage (complex voltage) at high-precision amplifying 36 measurement resistor 19 two ends.Then, consequential signal is input to data collecting card 35 and be demodulated to the complex impedance component (for example electricity is led and electric capacity) of consequential signal subsequently by demodulation components 42.
Fig. 3 A and Fig. 3 B show the embodiment (wherein the rightmost of Fig. 3 B has partly been removed sensor shell 12) of sensor 17.This embodiment comprises the nested structure of A2 tool steel assembly, comprise sensor shell 12, central electrode 10 and guard electrode 11, wherein said electrode along the length direction of electrode 10 (i.e. the direction of axle 15) separately by cyanate ester Embedding Material coating 76, and (from axle 15) separates by thin insulating ceramics coating 13 and 13a such as aluminium oxide ceramics or other stable dielectric insulator diametrically.Ceramic coat 13 and 13a can be applied in thermojet technology (be detonation-gun, plasma or at a high speed ceramic (HVOF) spray technology, these are known for those skilled in the art).At the ceramic coat 13 at sensor surface place also: (a) will be delivered to sensor 17, and (b) electrode 10 and 11 be separated with the moldable compounds 16 that is cured by the compressive load that curing process produces.Concentric cable 80 is connected to sensor 17 by the MCX connector 14 that is screwed in the guard electrode 11, this connector such as MCX connector 14, part number 133-833-401, by being positioned at 299 Johnson Ave S.W., Suite 100, and the Johnson ' sComponents of Waseca MN 56093 makes.Center conductor 84 and pin pairing, this pin and electrode 10 are processed into integral body or press fit into electrode 10.In some embodiment of sensor 17, central electrode 10, guard electrode 11 and shell 12 and aluminium oxide ceramics surface 13 can merge, and with glass or be doped with the glass electrical separation of aluminium oxide ceramics.In addition, in some embodiment of sensor 17 (for example Fig. 3 A and 3B), central electrode 10, guard electrode 11 and shell 12 can scribble the diamond of 2 to 4 micron thickness or the material of similar diamond, as by Anatech Ltd of Springfield, the Casidium that VA supplies with, then it is press fit over together, make the coating of diamond or similar diamond that the electrical isolation between these three assemblies (being electrode 10,11 and shell 12) is provided, and the electrical isolation between the ceramic surface 13 (Fig. 3 A) of moldable compounds 16 and sensor 17 also is provided.
Fig. 4 illustrates and can be how the embodiment of sensor 17 be placed in the body of mould 18, makes shape and superficial makings that the parts of moulding therein are provided in the face of the ceramic surface 13 of mold cavity 24.Particularly, sensor 17 can be imbedded and be installed in the mould 18, make sensor with from molded electric contact of parts of moldable compounds 16.
Because a plurality of sensors 17 can be provided in mould 18, so will typically there be at least one impedance data to flow from each sensor 17.
Sensor measurement unit 60
Each sensor measurement unit 60 (Fig. 1,2 and 5) provides the circuit of non-bridge joint, and it comprises simple voltage divider (Fig. 2), and this voltage divider comprises resistor 19 again.Each sensor measurement unit 60 is operably connected to one of a plurality of capacitors 68 that formed by one of sensor 17 and moldable compounds 16, wherein the sensor measurement unit had both provided current to each this capacitor, detected the resistance value that obtains from the capacitor response to electric signal again.That notes sensor measurement unit 60 and each capacitor 68 is combined to form impedance transducer circuit 62.The electric current that is provided to each impedance transducer circuit 62 is driven (via above-described relative capacitor plate 64) by solidifying moldable compounds 16 to the correspondence of mould 18 electrically 25.For each sensor circuit 62, loading resistor 19 (typically has about 200 kilo-ohms of resistance, overrange can be from 1 kilo-ohm of any to several megaohms, for example 10 megaohms) be placed as with electric current and be flowing on the line to the sensor 17 of sensor circuit.Voltage by the V2 of voltage as a result measurement resistor 19 two ends on the circuitry lines 33 (Fig. 5) of amplifier 36 outputs.By measuring the voltage be applied to 21 places, position (this applies voltage and is also referred to as " driving voltage ", and be also referred to as " V0 ") simultaneously, determine by the mobile decay that causes of the telegram in reply stream by capacitor 68 and the quantity of phase shift.Fig. 5 illustrates an example of sensor measuring circuit 60, wherein 21 places, position applies the terminal place that (excitation) voltage (for example V0=sin ω t) is placed in amplifier 36, and this electromotive force drives telegram in reply stream I* by loading resistor 19 (R), then at last by the corresponding capacitor 68, the moldable compounds 16 that are formed by sensor 17 and be attached to electrically 25 of mould 18.
1 volt voltage amplitude is supposed in following description for the excitation V0 at circuit position 21 places.But if this voltage is inconsistent, all analyses subsequently keep identical because for inconsistent situation, below constant " k " in the equation be defined as the negative voltage (V1) at circuit position 22 places and the ratio of the positive voltage (V0) at circuit position 21 places.
The driving voltage at 21 places, position (V0=sin ω t) drives telegram in reply stream (I*) and arrives ground 25 by resistor 19.Particularly, voltage V0 is the sine wave that produces with digital form that is produced by high-speed data acquisition card 35, and described capture card is as by National lnstruments, Austin, the PCI-MIO-16E4 card that TX. makes.Data collecting card 35 produces the high quality sine signal that is in by the frequency that changes from 10Hz to 10kHz of for example operator or user's appointment.But other data collecting cards 35 also can be used to produce similarly or the frequency of different range, as by National lnstruments, and Austin, the PCI-MIO-16E1 data collecting card that TX. makes can produce and monitor the frequency from 10Hz to 1.25MHz.An embodiment of data collecting card 35 also can provide data sampling simultaneously, as become carefully to keep the card of interchannel phase relation by specialized designs, and for example by Nationallnstruments, Austin, the card that the PCI-6110 card that TX makes comes to this.
When circuit position 21 places apply driving voltage V0, voltage drop takes place in the two ends at loading resistor 19, stay decay at circuit position 22 places and signal phase shift (is V1=ksin (ω t+ θ)=k＜θ, wherein "＜" is used in reference to several utmost point of giving instructions in reply and represents, and the expression term " be in ... the phasing degree ").Sensor 17 and electrically the moldable compounds between 25 16 complex impedance of the amplitude Z that is in phasing degree Φ is provided, wherein phasing degree Φ is the characteristic of solidifying moldable compounds 16, and does not obscure mutually with the phasing degree θ that is defined as the phase angle difference between V0 and the V1.
Calculate Z and Φ by side by side catching pumping signal V0 (for example V0=sin (ω t)) and amplifier 36 output voltage V 2 on circuitry lines 33 is finished, wherein V2=sin (ω t)-ksin (ω t+ θ) with digital form.Replacedly, in another embodiment, identical data can be by catching directly that sinusoidal wave V0 (sin (ω t)) and V1 (ksin (ω t+ θ)) obtain rather than obtaining by catching V2 (sin (ω t)-ksin (ω t+ θ)).Attention: high-speed data acquisition card 35 can be used for the signal V2 digitizing with the signal V0 at 21 places, position and 22 places, position, thereby keeps the numeral of waveform so that carry out further digital signal processing.Attention: the value of 60 Z that obtain and Φ and will be called " impedance signal data " hereinafter from its each voltage (for example V0 and V2, or replacedly, V0, V1 and V2) of deriving the value of Z and Φ from the sensor measurement unit.
Subsequently, in case provide the digital holding signal of V0 and V2, the measurement of quantity k (decay) and θ (phase shift) is finished by the standard demodulation practice, and this is understood by those skilled in the art.
In case k and θ are measured, finish determining of Z and Φ by the circuit of describing in the following analysis chart 5.
i.I *＝(V0—V1)/R
ii.Z＝V1/I *
Iii. replace, because V1=k＜θ and V0=1
Iv. impedance (Z) *=R (k＜θ)/(1-k＜θ)=Z＜Φ
V. the equation above being close to can be seen, can easily derive amplitude Z and phasing degree from the value of known R, k and θ.
Vi. number of poles is converted to plural number and isolate real part and imaginary part, i.e. resistance in series and reactance.
Vii. series reactance (Xs)=Z sin Φ=1/wC, wherein w=2 π f
Viii. resistance in series (Rs)=Z cos Φ
Ix. series capacitance (Cs)=1/wXs
X. series electrical is led (Gs)=1/Rs
Xi. be not series model, impedance also can be modeled as the parallel connection combination of reactance (Xp) and resistance (Rp), and this is understood by those skilled in the art.
Xii. can be following from series reactance and resistance calculations shnt capacitor (Cp):
Cp＝-Xs/[w(Rs 2+Xs 2)]
Xiii. can following calculating parallel resistance (Rp): Rp=-Xs/wCp Rs
Xiv. can following calculating parallel reactance (Xp): Xp=-1/wC
Xv. shunt conductance (Gp)=1/Rp.
In each embodiment of cure system 20, the data of series are right any time: (Z and Φ), (Rp and Xp), (Gp and Cp), (Xs and Rs) or (Gs and Cs) can be used for ecbatic curing data (being also referred to as impedance data stream).
In this disclosure, no matter the type of the circuit model (for example above-described series connection model or parallel model) that uses all usually carries out electric capacity (C), electricity are led quoting of (G), reactance (X) or resistance (R).The impedance analysis of being carried out by cure system 20 is identical and irrelevant with which circuit model of use.That is, generally quoting of C, G, R and X is applied to parallel connection or tandem data with being equal to.
In addition, parts that also it should be noted that cure system 20 solidify supervision, control and adjustment capability generally not need sensor measurement unit 60 are non-bridgt circuits.Particularly, the cure system 20 that discloses in Fig. 6,7 and 8 and describe does not hereinafter need so non-bridgt circuit.On the contrary, sensor measurement unit 60 can be Wheatstone bridge or functional equivalent basically.
Be used to solidify the technology of moldable compounds 16
The high-level steps that Fig. 6,7 and 8 flowchart text are carried out for hardening element wherein has a plurality of sensors 17 to be distributed in the body of mould 18, is used to determine the solidification rate at the each several part of the parts of in-mold molding.Fig. 6 and 7 is process flow diagrams, is used for determining that for example preparation is used for the initial solidification value at the production period hardening element.Especially, Fig. 6 and 7 can be counted as such technology, and it is used for for given mould and will be provided to the type of moldable compounds 16 of mould and the calibrator unit curing process.In step 1002, user and curing are provided with subsystem 104 mutual (Fig. 1), treat the type of the parts produced by curing apparatus 45 with input.This input can comprise: (i) sign of the moldable compounds 16 in mould 18 to be supplied, the (ii) sign of component configuration (description such as the part dimension and/or the shapes of the sign of the part number of the sign of mould 18 for example to be used, the position of mould inner sensor 17, parts to be produced and/or parts to be produced).In one embodiment, this input can comprise the robot calculator aided design document, and it provides the parts to be solidified and/or the three-dimensional data model of mold cavity 24.Attention: when such three-dimensional data model is provided, might how flows to moldable compounds and carry out the moldable compounds flow analysis in the mould 18.In step 1004, (if not providing in the step 1002) determines a plurality of positions, and these positions are used for providing sensor 17 (or other capacitance detectors) in mould 18, makes this sensor to produce impedance data stream at the parts setting up period.This position generally is provided at a plurality of zoness of different basically place in the mold cavity 24.For example, this sensor 17 can be placed in the mould 18, make them: (a) separate the end (for example spaced apart at least parts maximum sized 2/3) that is in or is adjacent to mold cavity 24, (b) be placed on position in the mold cavity 24, be used for obtaining to have the impedance data of the component area of different-thickness (for example capacitor 68 dielectric thickness differ about 25% or more) basically, (c) be placed as the remarkable knee (for example greater than 30 knees of spending) that is adjacent in the mold cavity 24, (d) be placed on from moldable compounds 16 and (for example initially introduced (for example place or enter) part in the mold cavity 24 mold cavity 24 positions far away relatively, sensor 17 is placed on moldable compounds during curing and is introduced at least 2/3 distance of part must flow the mold cavity ultimate range from it), and/or (e) be placed on or be adjacent to wherein that mold cavity 24 is the position of bottleneck for the mobile of moldable compounds 16.In step 1008, a plurality of samples of moldable compounds 16 are cured at the mould 18 that is used for the moulding test component, and wherein this sample is cured with each cure parameter that is used to set up different curing environments.Then, the assessment test component is to determine the type and the degree of part quality and component defect (if the words that have).The variation of cure parameter can be as follows:
(a) variation of mould 18 tonnages; This variation can be used for the expection of mould 18 correct moulding and hardening element typical case tonnage ± 5% scope in.
(b) variation of mould 18 solidification temperatures; This variation can be used for the expection representative temperature of mould 18 correct moulding and hardening element ± 10% scope in.But notice that curing apparatus 45 can allow the different piece of mold cavity 24 to have different temperature.Therefore, this sample can solidify in the different piece of mold cavity 24 with different temperature.Attention: do not need to consider all theoretical combinations of temperature combination, because typically the Mould operation person changes with the solidification temperature that others skilled in the art will have enough professional knowledge to discern relative a small amount of to be tested.For example, mold cavity 24 on specific direction relative thin or narrow place (for example, on specific direction less than maximum mold cavity 24 sizes 20%), can specific predetermined solidification temperature-15% to this temperature+10% scope build-in test solidification temperature.Replacedly, for the thick relatively or wide part of mold cavity 24, can specific predetermined solidification temperature-5% to this temperature+15% scope build-in test solidification temperature.In addition, when moldable compounds 16 needs to flow with complete profiled part along the flow path that prolongs relatively, can specific predetermined solidification temperature-5% to this temperature+15% scope build-in test is along the medium temperature of one or more such flow paths.
(c) variation of set time in the mould 18; For example, this variation can be used for the expection of mould 18 correct moulding and hardening element typical case's time ± 10% scope in.
(d) apply the rate variations of tonnage to mould 18; For example this variation can be used for the expection of mould 18 correct moulding and hardening element typical case tonnage rate of application ± 10% scope in.
Attention: expection can be determined by a lot of technology set time, comprise one or combination using in following: (i) curing operation person professional knowledge, (ii) the curing data of catching from the curing of like is (for example from identical or similar moldable compounds 16, in the mold cavity 24 of analogous shape and size, solidify, and use identical curing apparatus 45 assemblies for example the ton depressor, the parts that temperature sensor and regulator etc. solidify), the (iii) calculating of curing process simulation, (iv) " intelligence " system such as expert system, has the heuristic rule that is coded in wherein, wherein should rule represent to solidify expert's domain knowledge, and/or (v) trial and error.In addition, attention: if for example significantly curing apparatus 45 significantly differently hardening element is (for example with experience in the past, one or more curing apparatus assemblies may be replaced, thereby cause curing apparatus to show differently with former parts production running), during step 1008, can adjust or change this expection set time.
Except that the variation of curing environment, can also test the variation of moldable compounds 16.For example, can test sample from different batches (as used herein, term " batch " the expression some, produce the moldable compounds 16 of parts from it, wherein batch be assumed to be on the composition of moldable compounds homogeneous basically).Especially, can test sample different providers, that produce or use different facilities to produce in the different time.In addition, can test from have that known or unknown composition changes batch sample.
Therefore, for execution in step 1008, can determine that environment and moldable compounds 16 changes the matrix that may make up of (" batch "), and from this matrix, can select particular combinations to be used for the test of this step.In one embodiment, select handling can be in the following manner and robotization: (i) calculating of curing process simulation and/or (ii) " intelligence " system such as expert system, have the heuristic rule that is coded in wherein, wherein should rule represent to solidify expert's domain knowledge.
For each sample of test in the step 1008, a plurality of sensors 17 from mould 18 obtain impedance data stream, and store this data stream for use in the subsequent analysis of hereinafter describing.
In step 1010, each batch for the moldable compounds 16 of test in the step 1008, on statistics, analyze collected impedance data stream, (for example to determine one or more impedance data properties of flow, the slope value of the corresponding process curve of the particular portion office of cure cycle, or when identification reaches local maximum or local minimum, Deng), this characteristic: (i) related effectively, and/or (ii) related effectively with the non-desired character of bad moulding or defective parts with the feature of the parts of correct moulding and curing.Particularly, can in this analysis, carry out the following step:
(a) one or more impedance data properties of flow (for example slope) of the process curve located of the one or more times during the parts curing process (for example, when mould 18 is opened),
(b) if can measure expectation component feature (for example tensile strength) in the numerical value mode, between the two statistical correlation (for example linear regression) below then determining:
(1) this impedance process curve characteristic, for example, the slope that the one or more times during the parts curing process are located wherein should for example be opened mould 18 time before for being adjacent to the time, perhaps time of transformation place between the first slope value scope and the second slope value scope, and
(2) measurement of the component feature of result feature.
(c) the so related though statistically significant (R for example of supposition 20.6), then this impedance process curve characteristic can be used for determining whether the parts (for example Fu Jia test component) producing subsequently obtain desired character.
For example, if one of this expectation component feature has the pass criteria of relevant the passing through of parts therewith/not, if and one or more characteristics (slope value) of this process curve can be enrolled second group that has first group of first (slope) scope that indicating device passes through and have second (slope) scope that indicating device do not pass through, the at least a portion that then can run through the parts cure cycle monitors the characteristic (slope value) of process curve, is converted to first (slope) scope of passing through to determine when second (slope) scope that (or not) process curve slope of each sensor 17 never passes through.For example, suppose that the component feature that only needs is the parts of imporous complete moulding basically, and at the parts of predetermined maximum allocated in set time, when being converted to the predetermined suitably significant statistical correlation (linear or other modes) that takes place during by scope for this desired character from predetermined obstructed overrange from the process curve slope of all the sensors 17.Therefore, pass through (thus when the time of this maximum allocated, result feature can be identified as defectiveness), perhaps from the impedance data stream of all the sensors have in first scope slope (thus, result feature can be identified as and meet the requirements) time, solidifying controller 43 can be to curing apparatus 45 output signals (by line 28, Fig. 1) to open mould 18.
Turn back to the step of Fig. 6 now, and particularly turn back to step 1014, in case having determined should association, then these associations (for example can be used for deriving operation and/or condition, be embodied in program agency as background program (daemon) but and/or in the executable expressions), its again can be before producing the parts running and during accessed to monitor and to control curing process.Especially, but this program agency and/or executive condition can be:
(i) being used for typical case or " normally " that cure parameter is set to be used for unit type to be produced (for example for the moldable compounds 16 that will use, and for the desired character in the hardening element as a result) is worth;
(ii) be used for when parts are in its mould 18 assessment parts-moulding and curing, and adjust cure parameter (when detecting the non-desired characteristic of impedance data stream), make that parts more may zero defect; And
Be used for (iii) determining that parts solidify termination.
As mentioned below, can visit this condition and/or operation (for example their program stored agency of institute and/or condition) to monitor and/or influence parts curing process subsequently.In addition, this program agency and/or condition can be equation (for example equation of linear regression formula), iterative process or as " IF THEN " rules that can instantiation in the expert system rule storehouse of closing form.One skilled in the art will appreciate that in certain embodiments this agency may be implemented as background program.
Fig. 7 illustrates the more detailed description of the embodiment of step 1014.In the step 1104 of this figure,, determine that sign has first batch the information (this information is expressed as " B " here) of tested sample as step 1008 at Fig. 6.In step 1108, determine the information (this sample identification information here be expressed as " S ") of sign then from the first tested sample of batch B.In step 1112, determine whether sample S moulding and be solidified into the parts of suitable quality.If then (step 1116) determines condition of cure at least one mould relevant with the termination of sample S in its mould 18.Note, suitably the typical case of the parts that solidify to solidify end condition be that for example this prolongation continues to expect at least about 5% to 10% of set time for the process curve of each sensor 17 prolongation of zero slope (for example in-0.1 to+0.1 scope) basically at the end that approaches the parts cure cycle.Subsequently, in step 1120, determine whether to check another sample from batch B.If test another this sample, then once more execution in step 1108 with the information of next sample of obtaining (as S) sign batch B.
On the contrary, do not produce the parts of suitable quality, then in step 1124, determine between at least one defective of the characteristic of the impedance data stream of a plurality of sensors 17 and parts, whether have association if in the execution of step 1112, determine sample.The various technology that this determines that can be used to carry out are arranged.In a technology, by the technician of solidifying the field manually check result sample components and corresponding a plurality of impedance datas flow (or their corresponding process curve) so related to discern.Especially, the impedance correlation properties of the group of two or more sensors 17 can change be enough to manual identification it.In another technology, can by curing be provided with subsystem 104 the detection of identification component defective on the statistics and with process curve between variation related.For example, each test component can be evaluated and be identified as one or more in following: (i) zero defect parts, the defectiveness parts that (ii) have the space, (iii) defective have hole parts, (iv) owe the parts that solidify, (the v) parts of overcuring, (the vi) parts of non-good moulding, and/or (vii) owing to do not have defectiveness parts that desired characteristic causes, desired characteristic for example is one of following expected range: tensile strength, compressive strength, dynamic stiffness, dimensional uniformity.Subsequently, arrive (ii) for identification that (each vii) discerned, and can assess the process curve of each test component with this identification, to determine non-existent abnormal characteristic in being identified as flawless parts.Especially, defect type for each identification, and, can determine difference between the process curve (from different sensor 17) or variation (this characteristic is called " difference characteristic in the parts ") to these parts for each test component with this defect type.For example, the difference characteristic can be one or more in following in these parts: the difference of the process curve slope in the special time scope in (1) curing process (for example last 1/3rd of set time), (2) process curve maximum and/or minimum value is poor, and (3) corresponding process curve characteristic set time value poor (for example, the difference of maximum between the process curve of different sensors 17 and/or minimum value etc.).Subsequently, for each component defect type, in these parts in the difference characteristic one or combination can be fully and the component defect type association, make the interior difference characteristic of parts to be used for: (i) before parts production running, to change the parts curing environment, thereby reduce the component defect type of production period, and/or (ii) in generation part the parts setting up period of difference characteristic change cure parameter (for example shorten or prolong the time in the mould that is used for hardening element).Corresponding or be associated with shown in the example form A below of this variation between the impedance data stream (or their process curve) of different sensors 17 of component defect.
Form A
From changing in the unusual parts between the impedance data of different sensors The component defect that may be associated
The process curve of two or more sensors 17 is similar in shape, but is offset too much amount on set time each other, for example always expects at least 10% of set time; For example, at sensor P 0Each resistance value Z of one of process curve 0, exist at other sensors P iIn each counterpart impedance value Z i, Z wherein iBoth expecting that resistance value was from value Z 01% scope that changes of maximum in, appear at Z again 01 second in. Space in the parts
The process curve of two or more sensors 17 is similar in shape, but is offset too much amount on impedance amplitude each other, and for example maximal value at least 50% ground of a process curve is greater than the maximal value of another process curve. Space in the parts
For two or more sensors 17, its corresponding process curve differs above 25% at the maximum slope that solidifies between beginning and its maximal value Space in the parts
For two or more sensors 17, maximum slope differs and surpasses 25%, and wherein for each process curve, each maximum slope is the maximal value between the point of maximum rate of change of the maximal value of process curve and process curve. The regional area of parts may be owed to solidify, and for example, parts have hole, and promptly parts have such part, wherein in this parts part the gas that is trapped in a large amount of spileholes (bubble) is arranged.Replacedly/additionally, parts may form bubbling, promptly after the parts demoulding, form, at components list
The differential expansion on the face or the bubble of protuberance.
Be used for determining whether (in step 1124) exists among another related embodiment between at least one defective in the characteristic of the impedance data stream of a plurality of sensors 17 and the parts, the difference characteristic can be compared with difference characteristic in the parts that before obtained from different test sample (and/or parts production running) is collected in the parts, wherein, resulting sample components is molded by similar moldable compounds 16, and so resulting parts are similar on shape and size.Especially, the embodiment of curing disclosed herein and system can collect the impedance flow data and/or the interior difference characteristic of parts of big reserves in time.For example, for in a plurality of dissimilar parts of previous production (for example by previous test sample and/or parts production running) each, the collection that difference characteristic and/or impedance data in the parts of each parts of producing flow can be filed with the following information that is associated:
(i) unit type feature (for example employed moldable compounds 16 may comprise the consistance of compound composition or other indications of variation, component shape, part dimension variation, minimum and maximum parts scope and component sizes and/or volume),
(ii) be used to obtain the number of a plurality of sensors 17 of impedance data stream and relative position and (for example do not comprise the ultimate range around any sensor of another sensor, ultimate range between any two sensors, and/or whether sensor suitably is positioned at mould with the indication of evaluation means condition of cure effectively)
The cure parameter (for example, the cure parameter at each sensor place,, the tonnage speed that is applied, set time in the mould, employed curing apparatus 45, mould 18 heat transfer rates etc.) that (iii) is used for hardening element at the tonnage that the parts setting up period applies, and
(iv) resulting component feature (for example, detect component defect, strength of parts characteristic, parts rubber elastomer characteristics, the thermal conductance of parts etc.).
Therefore, the processing with intelligence of statistics can be used to the feature of new parts to be produced and has parts similar features, previous production make comparisons, so that the identification possible impedance data properties of flow that may be associated with various potential component defects not only is also to sensor 17 suitably is positioned to offer help in the mould 18.
Whether exist in another related technology between at least one defective in the parts that are used for determining (in step 1124) impedance data stream in difference characteristic and the parts, can carry out and calculate simulation or model determines whether analog version and the interior difference characteristic of corresponding components that impedance data flows can be associated with the component defect of reality acquisition from sample S.
There is related (for example about at least R of enough indications if in step 1124, determined with at least one component defect 20.6), then in step 1128, determine to reduce one or more curing process adjustment of the possibility that produces this defective.Such operation can be by the technician of solidifying the field by statistical study and/or by how influencing parts-moulding to specific operation and curing process is simulated or modeling is determined.Subsequently, in step 1132, the coding of determined adjustment is associated with the impedance data stream of sample S and is stored.Attention: also be associated with it and therewith the storage be the sign of moldable compounds 16 and batch sign of moldable compounds 16.Certainly, if between lising down, there is additional such association: (i) difference characteristic and (ii) certain defective in the parts in one or more additional parts, but then repeating step 1124 to 1132 up to no longer detecting such association.
Result regardless of step 1124, all want execution in step 1136, wherein determine whether to exist single-sensor 17 (hereinafter being called " sensor that is identified "), its impedance data stream has at least one characteristic that is associated with the possibility of generation defective in parts effectively, and wherein this association is confined to the output of single-sensor since then (promptly can not detect in this detected association) basically in step 1124.If in step 1136, discerned association, then (in step 1140) determines that intention reduces one or more curing process adjustment of defective possibility occurrence, wherein such adjustment preferably basically only influence near the limited range of the hardening element of the sensor 17 that is identified (for example, such influence preferably is confined to not change basically the parts scope of the cure parameter at any other sensor 17 places).The example of limited influence like this is only to change mold cavity 24 temperature in the zone that comprises the sensor 17 that is identified.Another example of limited influence like this can occur in the following situation: moldable compounds 16 is injected near the sensor that identified 17 the mould 18, and the sensor 17 that is identified provides unusual impedance data; That is, can provide and be in or near by the increase of the injection pressure of the sensor 17 that identified.
Subsequently, in step 1144, the coding of the adjustment of determining in step 1040 is associated with from the impedance data stream of sample S and is stored.Attention: also be associated with it and therewith the storage be the sign of moldable compounds 16 and batch sign of moldable compounds 16.Certainly, if there is additional such association (for sample S) between lising down: (i) impedance data from another sensor that is identified 17 flows, the (ii) defective in these parts, but then repeating step 1136 to 1144 up to no longer detecting such association.
Be right after step 1144, run into step 1120, it is used to determine whether to exist another sample from current batch of B to be analyzed.The positive result of this step will cause that step 1108 is carried out once more.Yet, if there is no from the more multisample of batch B, item below in step 1148, determining:
(i) be ready to use in the one group of initial solidification parameter that begins from moldable compounds 16 hardening elements, this moldable compounds 16 has similar in appearance to (or being same as) impedance operator from the sample of batch B;
(ii) at least one parts solidifies terminator agency and/or condition (for example such agency or condition can be " after 340 degree solidify 4 minutes, opening mould 18 "); And
(iii) one group of one or more programs agency and/or condition, it is used for proofreading and correct the unusual impedance measurement (for example, prolonging or shorten set time in the mould) that obtains from the parts of mould 18 solidify.
Step 1148 can be counted as such step: will be combined or comprehensive from step 1128 and 1140 results that obtain, and make such adjustment and curing stop criterion based on a plurality of samples from batch B.Yet note: in alternative embodiment, step 1128 and 1140 can only be discerned unusual resistance value (or process curve characteristic), and uncertain cure parameter adjustment.In this embodiment after, step 1148 is for example determined the cure parameter setting by following steps: at first each unusual impedance data properties of flow is classified, wherein each class identifies single unusual condition of cure, (i) determines one group of one or more combination process curve at each such class then, (ii) determine the initial solidification parameter then, and one or more program agencies and/or condition (for example the solidification temperature of being scheduled to changes or change predetermined set time), so that use the combination process curve to stop or adjustment component curing.Attention: following is the representative illustration of program agency and/or condition, and it can determine also to use subsequently with the impedance data stream (or process curve) of assessment from a plurality of sensors 17 by solidifying analyzing subsystem 26:
(a) in the one or more predetermined sections in the process curve each, determine the maximum impedance value;
(b), determine the time of maximum impedance value at each section in the one or more predetermined sections in the process curve;
(c) at each section in the one or more predetermined sections in the process curve, determine the minimum impedance value;
(d), determine the time of minimum impedance value at each section in the one or more predetermined sections in the process curve; And
(e) at each section in the one or more predetermined sections in the process curve, the integral area under the figure of definite section resistance value and time relation.
Yet, attention: also can consider other impedance measurement of correlations, to be used for each embodiment of curing disclosed herein and system, such as: the set time and/or the resistance value of one or more process curve points that (1) is discerned by various differentiate condition (for example flex point etc.), (2) to one or more coefficients of the fitting of a polynomial of the section of impedance data stream, (3) barycenter in the zone under the figure of process curve section (or its coordinate), and/or (4) are to one or more coefficients of the higher derivative of the process curve match of impedance data stream section.In addition, in the scope of disclosed cure system and method, also comprise program agency and/or the condition on how much, described of being not easy here, such as by artificial neural network, fuzzy logic system or based on expectation set time of didactic evaluator output.
Subsequently, in step 1152, determine whether to exist another such batch, sample wherein is tested, and wherein at the counterpart impedance data stream (or process curve) of having checked these samples with the related of component defect.If there be other such batch, then execution in step 1104 and step subsequently once more.Yet if there is no so other batch, the process flow diagram of Fig. 7 finishes.
Attention: when the step of execution graph 7, if sample moldable compounds 16 can't help batch to distinguish, then all samples can be considered to from single batch.Thereby the result of single execution in step 1148 is compound collections of the cure parameter of each parts will be used for made by curing apparatus 45 and moldable compounds 16.
For moldable compounds 16 disclosed herein, following form shows the representative illustration of various impedance datas stream (or process curve) characteristics, these characteristics can be confirmed as indication and/or be associated with the certain components feature, and when such characteristic indication (is for example operated, these parts or just by the termination of the curing of the defectiveness parts of moulding) time, rightmost row indication should be carried out any operation, so that:
(i) adjustment and continuation (ii) stop the curing when forepiece, and/or (iii) discern the adjustment of carrying out with the initial solidification parameter of back part when the curing of forepiece.
Form B
Impedance data stream/process curve characteristic and definite The possible cause of curve characteristic Resulting component feature or parts production feature Adjust or solidify and stop
For all detected prolongation of each process curve " smooth " part, (for example, prolonged expection set time at least about 5% to 10% flat); Such flat can by generate the last 20 seconds impedance data that solidifies is carried out modeling best-fit 3 rank polynomial expressions (or more generally, best-fit n rank polynomial expression, n 〉=3) determine, and this polynomial first order derivative (promptly Material is cured Completely crued parts Termination member is solidified
Slope) near the end of cure cycle, produces the slope (for example-0.1 in+0.1 scope) that is substantially zero.
Unexpected prolongation " smooth " part of one of process curve, (for example, prolonged expection parts set times at least about 5% to 10% flat); Such flat can by generate the initial approximately 20 seconds impedance data that solidifies is carried out modeling best-fit 3 rank polynomial expressions (or more generally, best-fit n rank polynomial expression, n 〉=3) determine, and the polynomial first order derivative that is generated (being slope) produces the slope (for example-0.1 in+0.1 scope) that is substantially zero. After complete tonnage, moldable compounds 16 flows Space in the parts Increase tonnage, and/or increase the time quantum that is in " tonnage fully " before solidifying timer starting, and/or for subsequently parts, reduction mould closing velocity
The impedance of process curve In at least one biography Sky in the parts Increase tonnage or notes
Value does not increase at least 10% from the value that curing begins, in the end the best-fit 3 rank polynomial expressions of 20 seconds impedance data are (or more generally then, best-fit n rank polynomial expression, n 〉=3) derivative reaches the slope (for example-0.1 in+0.1 scope) that is substantially zero and reduces (promptly not being elevated to peak value) before Near the sensor 17, moldable compounds does not enter solidifying phase The crack Go into pressure, and/or reduce mold temperature, and/or (if possible, perhaps for subsequently parts) add curing inhibitors in moldable compounds 16.If the process curve characteristic continues, then termination member is solidified.
The fluctuation of at least one process curve in time of one of the junior three branch that is contemplated to parts set times, wherein such fluctuation produces the right of a plurality of local maximums of being followed by local minimum in the process curve, and each is to having the maximum of process curve (or corresponding impedance data stream) between its member After complete tonnage, moldable compounds 16 flows Space in the parts Increase tonnage, and/or, increase the time quantum that is in " complete tonnage " before solidifying timer starting, and/or, reduce the mould closing speed for subsequently parts
Change at least 5% difference.For example, the best-fit 3 rank polynomial expressions of impedance data and last 20 seconds impedance data (or more generally, best-fit n rank polynomial expression, n 〉=3) square error between is greater than predetermined resistance value.
In the fluctuation (such fluctuation for example as mentioned above) that is contemplated at least one process curve in time of last 1/3rd of parts set times, for example, the best-fit 3 rank polynomial expressions of impedance data and last 20 seconds impedance data (or more generally, best-fit n rank polynomial expression, n 〉=3) square error between is greater than predetermined resistance value. The accumulation of the gas by-product in the mold cavity 24 Space in the parts and/or hole By mould 18 increase ventilations, exhaust (for example venting) are come to discharge gas by-products from mold cavity 24.
Near one of process curve prolonging its peak value Too many inhibitor adds to mouldable The parts demoulding is increased before Increasing mould 18 temperature (is being at least
Long " smooth " be (for example, the flat at least about 5 % that has prolonged expection set time) partly; Such flat can be definite like this, its by generate to the peak value be about 20 seconds impedance data at center carry out modeling best-fit 3 rank polynomial expressions (or more generally, best-fit n rank polynomial expression, n 〉=3), determine then this polynomial first order derivative (being slope) process curve greater than for example producing the slope (for example-0.1 in+0.1 scope) that is substantially zero in 5 seconds. In the compound 16 Set time Or the part of the mold cavity 24 of close sensor 17, wherein this sensor 17 provides the process curve with prolongation " smooth " part, and/or (if possible, perhaps for subsequently parts) reduce the curing inhibitors in the moldable compounds 16.
According to generating for example best-fit 3 rank polynomial expressions (or more generally, the best-fit n rank of last 20 seconds impedance data being carried out modeling Zones of different on the parts is finished its curing with the different time Make the set time that increases before the parts demoulding Increase the temperature of regional area, and/or (if possible, perhaps for subsequently parts) change moldable compounds 16 quilts
Polynomial expression, n 〉=3), and this polynomial first order derivative (being slope) was measured the slope (for example-0.1 in 0.1 scope) that is substantially zero at least 15 seconds, at least one process curve from one of sensor 17 is planarization, and do not reach the slope that is substantially zero from the process curve of at least one other sensor 17 (or more accurately, the n rank polynomial expression that is generated). Be incorporated into the mode in the mold cavity 24
From one of sensor 17s 1At least one process curve be planarization at least 15 seconds, and from least one other sensors 17s 2Process curve be not planarization (expect that promptly set time is in last 1/3 of this time Not spreading all over parts simultaneously basically solidifies. Make the set time (for example increasing the interior time of mould) that increases before the parts demoulding, and/or the space in the parts has higher mould up to all process curve planarizations Increase the temperature of regional area, and/or (if possible, perhaps for subsequently parts) change the introducing of moldable compounds 16 in the mold cavity 24
In 1/4, and at s 2Process curve similarly before the planarization at least 15 seconds, from s 1Process curve obtained slope in-0.1 to 0.1 scope. Temperature
In the example that provides in the example joint, the example of at least some corresponding relations among the table B has been described below.
As mentioned above, Fig. 6 and 7 step can be carried out by the collaborative interactive that curing is provided with between subsystem 104 (Fig. 1) and the one or more curing operation person (or other solidify experts).
Producing running curing during parts
Fig. 8 is when hardening element, particularly at a large amount of production periods of parts, and the process flow diagram of an embodiment of the step of carrying out by cure system 20.Typically after the process flow diagram of having carried out Fig. 6 and 7, carry out the step of this figure.Thereby, suppose to solidify 27 data of suitably having been filled the setting of indication initial solidification parameter, having solidified adjustment and solidifying end condition of controlling database.In step 1204 (if necessary), curing operation person and operator interface 32 (Fig. 1) are mutual, so that treat the type of the parts produced from curing apparatus 45 to control system 39 (and particularly, to solidifying controller 43) input.Such input can comprise: (i) sign of the moldable compounds 16 in mould 18 to be supplied, (ii) the sign of component configuration (for example, the sign of mould 18 to be used, the position of this mould inner sensor 17, the sign of the part number of parts to be produced, and/or the description of parts to be produced, as part dimension and/or shape).In one embodiment, the form of such input can provide the robot calculator aided design document of the three-dimensional data model of parts to be solidified and/or mold cavity 24.In step 1208, determine whether cure parameter can be set according to a moldable compounds batch sign.If not, then in step 1212, the initial solidification parameter be set to as with reference to the step 1148 among the figure 7 in compound setting discussed above.Replacedly, if the initial solidification parameter can be according to batch setting, then in step 1216, batch (B) selected, wherein the test sample of batch (B) (for example, according to Fig. 6 and 7) has or has probably similar in appearance to the impedance data properties of flow of current batch impedance data properties of flow treating therefrom to produce parts.Attention: the execution of step 1216 can be passed through: solidify (in curing apparatus 45) from current batch a small amount of parts, and the impedance process curve that drawn solidified the corresponding process curve (at each previous test lot of moldable compounds) of controlling database in 27 and compare with being stored in, so that determine immediate coupling.Additionally or replacedly, such coupling can be carried out by current batch composition is compared with the composition of previous test lot.Thereby in case selected a batch B, then in step 1220, the initial solidification parameter that is used for batch B is set to the initial solidification parameter that is used for current batch.Yet, it should be noted that from the initial solidification parameter of a plurality of previous test lot such initial solidification parameter carried out interpolation (or otherwise combination) that this is also in the scope of this curing and system.For example, batch B of Pretesting in the ban 1And B 2All show in the time of may being the candidate who selects, can be from this initial solidification parameter value of two batches by for example obtaining from a batch B 1And B 2Mean value, intermediate value or the weighted sum (wherein weight can according to each and current batch the degree of approach in these batches of being discovered) of corresponding initial solidification parameter value make up.
Regardless of the result of determination step 1208, all execution in step 1224, wherein receive the signal that indicating device is being solidified by curing apparatus 45 by solidifying controller 43.Subsequently, in step 1228, sensor measurement unit 60 (for example each sensor is 17 1) begin and will partly offer computing machine 34 (Fig. 1) from each the initial impedance data stream of at least one impedance data stream in a plurality of sensors 17.More specifically, each sensor 17 offers its corresponding sensor measuring unit 60 with impedance signal, sensor measurement unit 60 offers data collecting card 35 with the impedance signal of correspondence again, data collecting card 35 offers demodulation components 42 with the output of its correspondence, demodulation components 42 outputs to curing data acquisition database 23 with the resulting impedance data stream of correspondence again, in addition, there is impedance data stream to be assessed (or more accurately, its part) in demodulation components 42 to solidifying controller 43 notices.Subsequently, solidify controller 43 and have impedance data stream (its part) to be assessed to solidifying analyzing subsystem 26 notices.Then, solidify analyzing subsystem 26 and from curing data acquisition database 23, retrieve impedance data stream, each impedance data stream (its part) is carried out the data smooth operation, to obtain to be used for the data of corresponding process curve.Subsequently, solidify the process curve data that analyzing subsystem 23 assessments are used for the state of definite parts curing process.Solidifying analyzing subsystem 26 can use as the process curve of front but a plurality of programs agencies that identify among form A and the B and/or various executive condition are assessed, so that determine when hardening element: (1) is moulding and curing suitably, (2) good moulding and full solidification, and (3) detect the process curve data of not indicating good moulding, the correct parts that solidify.Therefore, solidifying analyzing subsystem 26 will finally make an announcement to solidifying controller 43: the parts expection that (i) is cured is with good moulding and correct curing, or replacedly, (ii) at least one that has detected in the process curve is unusual, and it may indicating device moulding and/or curing improperly.
Thereby, in step 1232, in case receive such state notifying from solidifying analyzing subsystem 26, curing controller 43 just determines that these notices are to indicate to have produced good moulding and the correct parts that solidify, or indicating device moulding and/or curing improperly improperly.Therefore, if determined parts moulding correctly and curing, then in step 1236, solidify controller 43 outputs and be used to instruct curing apparatus 45 to open order or instruction (by line 28) that mould 18 also discharges parts wherein.Subsequently, in step 1240, the new parts of curing controller 43 wait indications just are being cured in mould 18 or are indicating the current more parts input to be solidified (by line 29) that do not have.Therefore, in case receive such input, solidify controller 43 and just determine that (step 1244) is the curing process (being execution in step 1248) that stops in the computing machine 34, still owing to receive on online 29 and indicate the input to be solidified of another parts to continue curing process.Attention: in back of these two alternative schemes, step 1208 and step are subsequently carried out once more.
Replacedly, if in step 1232, determined parts moulding and/or curing improperly, then in step 1252, curing controller 43 is worked as forepiece by operator interface 32 to curing operation person warning and is had defective.Subsequently, in step 1256, solidify controller 43 and determine whether to discern at least one operation, so that reduce detected unusual from the impedance data that a plurality of sensors 17 receive.Attention: can use the input of self-curing analyzing subsystem 26 to carry out by such determining that curing controller 43 carries out.Especially, together with come self-curing analyzing subsystem 26, indication is when the forepiece notice of moulding and/or curing improperly, this curings analyzing subsystem also can provide sign that one or more corrections adjust to carry out working as the curing of forepiece.The representative illustration that top form B provides more executable corrections to adjust.If solidify the sign that analyzing subsystem 26 provides one or more such corrections to adjust, then in step 1260, solidifying controller 43 selects order of (or more generally, discerning) one or more correspondences or instruction to proofread and correct adjustment to send to curing apparatus 45 (by line 28 and at least one input media 37) so that carry out.Attention: at least some embodiment, solidify controller 43 and can select to be used for order or instruction by all such adjustment of solidifying analyzing subsystem 26 identifications.Yet, in the scope of the embodiment of cure system 20 be, solidify the ordering that analyzing subsystem 26 can provide such correction to adjust, make and solidify such order or the instruction of order issue that controller 43 can be specific.Subsequently, in step 1264, curing apparatus 45 is carried out order or the instruction that being used to of being received adjust cure parameter (for example to set time adjustment), and then runs into step 1128.
In at least some embodiment of cure system 20, solidify analyzing subsystem 26 and can have executable a plurality of possible correction adjustment alternative scheme.In addition, indicate the impedance data of incorrect parts-moulding and/or curing to be localized to be in or near the particular range of one or more (but non-all) sensor 17.For example, for three sensors 17 that are installed in the mould 18, if all three sensor 17 indicating devices be in its cure cycle last 1/3rd in, and specific one demonstrates its process curve fluctuation is arranged in this sensor, then this condition can be at this particular sensor place or its vicinity is trapped in the indication of the gas by-product in the parts, and this may finally cause near the hole in the parts part of this particular sensor.Thereby, adjust alternative scheme (or to its ordering) in order to select such correction, curing analyzing subsystem 26 can preferentially be selected the alternative scheme to hardening element entire effect minimum.In some curing environment at least, this means that preferential selection only influences the correction adjustment of parts basically in the vicinity of one or more sensors of output abnormality impedance data.For example, in the above-mentioned example of the unit exception (gas by-product that promptly is absorbed in) of having discerned localization, compare with other alternative schemes, corresponding localization is proofreaied and correct and is adjusted below can preferentially selecting: (i) reduce gas by-product partly by any obturator in the clean vacuum port, or (ii) (for parts production subsequently) produces additional vacuum ports near this particular sensor.Particularly, proofreading and correct adjustment with the parts of following more wide region compares, can preferentially select top these alternative schemes: reduce gas by-product globally by entire die 18 is ventilated and work as forepiece to proofread and correct, perhaps (for parts production subsequently) near the beginning of cure cycle, entire die is ventilated, this will increase the parts cure cycle time.
Example and case study
Fig. 9 shows typical SMC (polyester, styrene monomer) impedance data stream, and wherein the time to be illustrating on the x axle second, and electricity is led on the y axle and illustrated relatively.What also illustrate is (or expection takes place) to take place solidify each point of incident.Fig. 9 shows the data point (with the level and smooth process curve 1404 of correspondence) of the impedance data flow valuve of the curing that is used for the parts made by the SMC as moldable compounds 16.Particularly, the x axle is represented to expect hardening element and is not used the percentage of the time of cure system 20.Attention: along with (i) mold pressing device closing molding 18, (ii) SMC comes in contact with the sensor 17 that therefrom obtains impedance data stream, and (iii) this sensor and corresponding ground capacitor pole plate 64 electrical couplings, and process curve is rising initially the time.Along with moldable compounds 16 begins to soften, ion in this moldable compounds and molecular entity can move in the electric field of sensor more thus, and process curve 1404 continues to rise.Along with moldable compounds 16 reaches the solidifying point time of high cross-linked speed (promptly), " peak " (greatly about point 1408) appears in process curve 1404.After peak 1408, along with the reaction of polyester and styrene and crosslinkedly limited ion and molecular entity moving in the electric field of sensor, resistance value descends rapidly.Then, along with remaining styrene-styrene reaction takes place, process curve 1404 " ending " is in flat line condition (greatly about point 1412).Thereby, suppose to solidify analyzing subsystem 26 and promptly identify such flat line condition relatively, and each the corresponding process curve that detects in a plurality of sensors 17 enters such flat line condition basically simultaneously, then can save for about 20% set time by using cure system 20.In order to carry out this analysis of process curve 1404, solidify the peak 1408 that analyzing subsystem 26 can at first be discerned each process curve.In case discerned this point, solidify the slope that analyzing subsystem 26 just repeatedly calculates the continuous part of each process curve 1404 then, up to a series of slope value (such slope indication has detected the transformation to the flat line condition) of having determined at each process curve near zero.Attention: can or observe one or more resulting component features and determine suitable slope (or sequenced collection of slope) by assessment in order to the curing that finishes specific features according to experience.For example, the foaming behind the parts before or after the baking (post-bake) is usually used in the SMC parts to discern the point of enough curing, and this will be understood by those skilled in the art.
Figure 10 shows the figure of the typical impedance data stream (and corresponding process curve 1504) of the instrument panel that is used for the light truck made by SMC, and wherein the x axle time is represented as the percentage that uses the solidification rate before the cure system 20.Impedance data flow graph among Figure 10 is different slightly with the impedance data flow graph among Fig. 9, and this is (promptly be illustrated as start from a little 1508) because at about 30% place of the road of parts expections set time, and the pressure clamp pressure on the mould 18 changes.Configuration cure system 20 make to solidify analyzing subsystem 26 and identifies smooth linearize such in process curve 1504 slopes, and no matter start from some the increase of 1508 resistance value.By analyzing samples test component (for example), definite according to experience in order to finish the suitable slope that parts solidify by the time that identification begins to bubble according to the step among Fig. 6.Use the program agency of this suitable slope setting to be provided for curing analyzing subsystem 26, to be used for determining that the more Zao parts curing than before having used stops.Solidify analyzing subsystem 26 uses and generally open the mold pressing device at 1512 process curve point.By more than bimestrial continuous basically operation, in this way the embodiment decreased average of Pei Zhi cure system 20 18% parts set time.
Figure 11 shows the part of the mold cavity 24 that is used to solidify the body of a motor car panelling, and wherein three sensors 17 (being sensor 17a, 17b and 17c) are illustrated in the sidewall of mold cavity.Also showing wherein provides multilayer SMC (as moldable compounds 16) so that be solidified into the position of charging (charge) general layout of body of a motor car panelling parts in mold cavity 24.Being used for the lower part 1604 (promptly big zone below dotted line) that the normal solidification temperature (before using curing disclosed herein and system) of these parts is known as for mould is 300 degrees Fahrenheits, and is 310 degrees Fahrenheits for the top 1608 of mould (promptly the zone more than dotted line) greatly.Normal set time, (before using curing disclosed herein and system) was each parts 105 seconds.For determine to cause by mold cavity 28 temperature variation, to influence from the impedance data stream of sensor 17a-17c, wittingly temperature is changed ± 15 degrees Fahrenheits from normal 300 degrees Fahrenheits.Under a plurality of temperature in 285 to 315 degrees Fahrenheit scopes, solidify at parts repeatedly and to collect impedance data stream.Below Figure 12 show the typical figure of the impedance data stream that obtains from the curing of normal temperature (300 degrees Fahrenheit), 285 degrees Fahrenheits and 315 degrees Fahrenheits.The assessment of subsequently test component shows and has located to reach the enough curing under the rated condition at about 65 seconds.In addition, Figure 12 shows impedance data stream and moves to right along with the reduction of solidification temperature.This skew has reflected as expected fusing and reaction rate slower when temperature reduces.Yet for each temperature, when parts (or its part) were suitably solidified, the slope of corresponding process curve was near zero.Thereby, can be by this information is merged to by in program agency of solidifying analyzing subsystem 26 visits and/or the condition, the embodiment of cure system 20 can reduce to 64 seconds with averaging section set time.
Figure 13 showed before using cure system 20 to monitor to solidify with adjustment component, the figure of the typical impedance data stream (and corresponding process curve) of shown in Figure 11 three sensor 17a, 17b and 17c, and wherein the SMC charging is arranged as shown in figure 11.Attention: the different piece of parts is in different basically time place's full solidification, and this different time is as being reached indicated near the different time of zero process curve slope by each process curve.In fact, test has indicated moldable compounds 16 (SMC) more promptly to solidify near sensor 17c.Thereby, during the step in execution graph 6, carried out additional step: attempt to provide and will make the solidification rate initial solidification condition closer proximity to each other of the different piece of parts.Particularly, the charging among Figure 11 is rearranged, make these the charging at least some more close sensor 17c (promptly more close about 6 inches).Figure 14 shows the figure of the afterwards typical impedance data stream of reorientation SMC material (and corresponding process curve) in mold cavity 28.In addition, can also see in Figure 14 that for these three sensors, solidifying point is more close each other.
Although describe each embodiment of the present invention in detail, be apparent that for those skilled in the art, can make amendment and adapt these embodiment.Yet, it should be clearly understood that and revise and adapt in the scope of the present invention as illustrated in claims.

Claims (30)

1. method that is used for a plurality of examples of hardening element comprises:
Provide a plurality of sensors at the mould that is used for solidifying described examples of components, wherein each sensor is used for generating the relevant signal of impedance in the current examples of components with the described examples of components of solidifying in described mould;
For each sensor, when described current examples of components is being solidified, receive the corresponding time series of the impedance measurement be used to measure the described signal that generates by described sensor;
For in the described sensor first, determine the first impedance related data that obtains from the corresponding time series of described impedance measurement;
For second in the described sensor, determine the second impedance related data from the corresponding time series of described impedance measurement;
Discern the association between following: (a) at the relation between the described first and second impedance related datas of described current examples of components, with the status information of at least one characteristic of the described current examples of components of (b) indication;
When described status information is indicated defective in the described current examples of components, obtain curing data, its pointer is at least one correct operation of one of the examples of components subsequently in described current examples of components or the described examples of components; And
At least one instruction that will obtain from described curing data is sent to the curing apparatus assembly that is used for solidifying at described mould described examples of components, and described transmission causes described curing apparatus assembly to change condition of cure according to described correct operation.
2. the method for claim 1, wherein said first sensor provides first impedance data for the first of described examples of components, and described second sensor provides second impedance data for the second portion of described examples of components, and wherein: (a) described first and described second portion differ 25% or bigger on thickness; (b) at least one in described first and second sensors is adjacent to the knee in the described examples of components, (c) to each examples of components, described first and second sensors spaced apart under the situation of each direction of considering to stride examples of components described examples of components maximum sized 2/3, and (d) the spaced apart moldable compounds of described first and second sensors during curing is introduced in 2/3 of part must flow the described mould ultimate range from it.
3. the method for claim 1, at least one in wherein said first and second sensors comprises two electrodes insulated from each other, and in described two electrodes one is around another electrode.
4. the method for claim 1, the corresponding time series of the described impedance measurement of wherein said first and second sensors uses at least one non-bridgt circuit to determine.
5. the method for claim 1, the corresponding time series of the described impedance measurement of wherein said first and second sensors uses at least one bridgt circuit to determine.
6. the method for claim 1, it is one of following that the wherein said first impedance related data packets is drawn together: the sign that (a) has the part of the slope that is substantially zero in the time series of the described impedance measurement of described first sensor, (b) whether increase at least 10% relevant information with the value of the time series of the described impedance measurement of described first sensor from the value that is in basically when beginning to solidify described current examples of components, and at least 5% the relevant information of a plurality of fluctuations of maximum variation that (c) whether produces the time series of described impedance measurement with the value of the time series of described impedance measurement.
7. method as claimed in claim 6, the wherein said second impedance related data packets contains from the variation of the described first impedance related data, and wherein said variation is associated with defective in the described current examples of components.
8. the method for claim 1 is wherein determined described related according to predetermined relevant between each a plurality of impedance measurement time serieses in the example of the sign of described defective and a plurality of prior cured of at least one unit type.
9. the method for claim 1, wherein said status information comprise the sign as one of following described at least one characteristic:
(i) one of following expected range: tensile strength, compressive strength, dynamic stiffness, dimensional uniformity, and
(ii) one or more indications of owing condition of cure.
10. the method for claim 1, wherein said defective is designated described current examples of components one of following: the defectiveness parts that (i) have the space, (ii) defective have hole parts, (iii) owe the parts that solidify, the (iv) parts of overcuring, (the v) parts of non-good moulding, and (vi) owing to not having the defectiveness parts that desired characteristic causes.
11. the method for claim 1, wherein correct operation comprises one of following: the set time that (a) changes one of the examples of components subsequently in described current examples of components or the described examples of components, (b) solidification temperature of one of the examples of components subsequently in described current examples of components of change or the described examples of components, (c) tonnage of one of the examples of components subsequently in described current examples of components of change or the described examples of components, (d) obturator in the clean vacuum port, and (e) add one or more vacuum ports.
Generate described at least one instruction 12. the method for claim 1, wherein said transfer step are included in the computing machine, wherein said computing machine is carried out the step of determining the preferential selection between described at least one correct operation and the different correct operation.
13. method as claimed in claim 12, wherein said preferential selection depend on the scope by the described parts of each influence in described at least one correct operation and the described different correct operation.
14. it is one of following that the method for claim 1, wherein said impedance measurement comprise: (i) impedance (Z), it is measuring total resistance of the electric current in the alternating circuit, (ii) phasing degree, (iii) resistance, (iv) reactance, (v) electricity is led and (vi) electric capacity.
15. the method for claim 1, wherein said examples of components is solidified by one of following: (a) polymerization moldable compounds, (b) styrene monomer compound, (c) phenolic materials and (d) thermosetting plastics.
16. the method for claim 1, the described relation between the wherein said first and second impedance related datas comprises the time migration between the counterpart impedance correlation.
17. method as claimed in claim 16, wherein said skew are to expect at least 10% of set time at the total of described current examples of components.
18. the method for claim 1, the described relation between the wherein said first and second impedance related datas comprise the impedance magnitude skew between the counterpart impedance correlation.
19. method as claimed in claim 18, wherein said skew is for big by 50% at least.
20. the method for claim 1 also comprises the described relation between the described first and second impedance related datas is defined as the slope value difference.
21. method as claimed in claim 20, the described step of wherein determining described relation comprises according in the described first and second impedance related datas each, determine maximum slope between following: (a) curing of described current examples of components begins and (b) determines according to it corresponding maximum impedance value of the described first or second impedance relevant data value of described maximum slope.
22. comprising more described maximum slope, method as claimed in claim 21, the described step of wherein determining described relation determine poor greater than scheduled volume.
23. comprising according in the described first and second impedance related datas each, method as claimed in claim 20, the described step of wherein determining described relation determine that maximum slope is poor;
Wherein determine each maximum slope between following: (a) be used for determining described maximum slope the described first or second impedance relevant data value corresponding maximum impedance value and (b) be used for determining the corresponding point of maximum rate of change of described first or the second impedance relevant data value of described maximum slope.
24. method as claimed in claim 10, wherein said desired characteristic comprise one of following expected range: tensile strength, compressive strength, dynamic stiffness, dimensional uniformity.
25. equipment that is used at a plurality of examples of mould hardening element, wherein said mould has a plurality of sensors, each sensor is used for generating the relevant signal of impedance with the current examples of components of the described examples of components of solidifying in described mould, comprising:
For each sensor, the corresponding sensor measuring unit is used for one or more electric signals are offered described sensor, and is used for obtaining corresponding impedance related data from described sensor when described current examples of components is being solidified;
First group of one or more assembly is used to determine:
(a) from from the first impedance related data that obtains in first the counterpart impedance related data the described sensor; And
(b) from the second impedance related data of second counterpart impedance related data in the described sensor;
Each all is the result of predetermined computation for wherein said first and second impedance datas, and described calculating comprises at least one that determine in following: slope, local maximum and local minimum, be essentially smooth curve ranges, area, the rate of change of slope, flex point;
Second group of one or more assembly, be used to discern the association between following: (a) at the difference between the described first and second impedance related datas of described current examples of components, with the status information of at least one characteristic of the curing of the described current examples of components of (b) indication;
Controller, be used to obtain to indicate the information of at least one correct operation, described correct operation is used for proofreading and correct the defective in one of examples of components subsequently of described current examples of components or described examples of components, and wherein said information changes along with the variation of described status information; And
The 3rd group of one or more assemblies, be used for and be communicated to the curing apparatus assembly that is used for solidifying described examples of components by at least one instruction of described controller issue at described mould, described reception and registration causes described curing apparatus assembly to change condition of cure according to described correct operation, and wherein said at least one instruction uses the information of described at least one correct operation of indication to obtain.
26. equipment as claimed in claim 25, wherein said second group of one or more assembly comprise the data repository of storing a plurality of associations, described association is used for being associated following: (a) from the difference between the impedance related data of each sensor of the group of two or more described sensors, with the status information of at least one characteristic of the previous examples of components of using at least one in described mould and the described curing apparatus assembly and solidifying of (b) indication.
27. a method that is used for a plurality of examples of hardening element comprises:
Provide a plurality of sensors at the mould that is used for solidifying described examples of components, wherein each sensor is used for generating the relevant signal of impedance in the current examples of components with the described examples of components of solidifying in described mould;
For each sensor, when described current examples of components is being solidified, receive the corresponding time series of the impedance measurement be used to measure the described signal that generates by described sensor;
For in the described sensor first, determine the first impedance related data that obtains from the corresponding time series of described impedance measurement;
For second in the described sensor, determine the second impedance related data from the corresponding time series of described impedance measurement;
Discern the association between following: (a) at the relation between the described first and second impedance related datas of described current examples of components, with the status information of at least one characteristic of the described current examples of components of (b) indication;
When described status information is indicated defective in the described current examples of components, obtain curing data, its pointer is at least one correct operation of one of the examples of components subsequently in described current examples of components or the described examples of components; And
At least one instruction that will obtain from described curing data is sent to the curing apparatus assembly that is used for solidifying at described mould described examples of components, and described transmission causes described curing apparatus assembly to change condition of cure according to described correct operation,
Wherein said first sensor provides first impedance data for the first of described examples of components, and described second sensor provides second impedance data for the second portion of described examples of components, and wherein: (a) described first and described second portion differ 25% or bigger on thickness; (b) at least one in described first and second sensors is adjacent to the knee in the described examples of components, (c) to each examples of components, described first and second sensors spaced apart under the situation of each direction of considering to stride examples of components described examples of components maximum sized 2/3, and (d) the spaced apart moldable compounds of described first and second sensors during curing is introduced in 2/3 of part must flow the described mould ultimate range from it.
28. method as claimed in claim 27, wherein said defective is designated described current examples of components one of following: the defectiveness parts that (i) have the space, (ii) defective have hole parts, (iii) owe the parts that solidify, the (iv) parts of overcuring, (the v) parts of non-good moulding, and (vi) owing to not having the defectiveness parts that desired characteristic causes.
29. method as claimed in claim 28, wherein said desired characteristic comprise one of following expected range: tensile strength, compressive strength, dynamic stiffness, dimensional uniformity.
30. equipment that is used at a plurality of examples of mould hardening element, wherein said mould has a plurality of sensors, each sensor is used for generating the relevant signal of impedance with the current examples of components of the described examples of components of solidifying in described mould, comprising:
For each sensor, the corresponding sensor measuring unit is used for one or more electric signals are offered described sensor, and is used for obtaining corresponding impedance related data from described sensor when described current examples of components is being solidified;
First group of one or more assembly is used to determine:
(a) from from the first impedance related data that obtains in first the counterpart impedance related data the described sensor; And
(b) from the second impedance related data of second counterpart impedance related data in the described sensor;
Each all is the result of predetermined computation for wherein said first and second impedance datas, and described calculating comprises at least one that determine in following: slope, local maximum and local minimum, be essentially smooth curve ranges, area, the rate of change of slope, flex point;
Second group of one or more assembly, be used to discern the association between following: (a) at the comparative result between the described first and second impedance related datas of described current examples of components, with the status information of at least one characteristic of the curing of the described current examples of components of (b) indication;
Controller, be used to obtain to indicate the information of at least one correct operation, described correct operation is used for proofreading and correct the defective in one of examples of components subsequently of described current examples of components or described examples of components, and wherein said information changes along with the variation of described status information; And
The 3rd group of one or more assemblies, be used for and be communicated to the curing apparatus assembly that is used for solidifying described examples of components by at least one instruction of described controller issue at described mould, described reception and registration causes described curing apparatus assembly to change condition of cure according to described correct operation, and wherein said at least one instruction uses the information of described at least one correct operation of indication to obtain.
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