CN100475661C - Receiving base band of chip electronic element - Google Patents
Receiving base band of chip electronic element Download PDFInfo
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- CN100475661C CN100475661C CNB2006100576308A CN200610057630A CN100475661C CN 100475661 C CN100475661 C CN 100475661C CN B2006100576308 A CNB2006100576308 A CN B2006100576308A CN 200610057630 A CN200610057630 A CN 200610057630A CN 100475661 C CN100475661 C CN 100475661C
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
- Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics
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- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
Abstract
The invention relates to a paper band with several chambers for containing chip electronic elements. The invention is characterized in that: the surface of said band that closing the top sealing band of said chamber has a coat with fluff-prevent resin and selective soluble resin; said fluff-prevent resin contains at least one of phenylethene-maleic acid polymer resin, alkene-maleic acid polymer resin, acrylic ester-acrylic acid polymer resin and phenylethealkenene-alkene-acrylic polymer resin. Said inventive band has high adhesive strength, without fluff when removing the top sealing band.
Description
Technical field
The present invention relates to receiving base band of chip electronic element made of paper, specifically, the present invention relates to a kind of receiving base band of chip electronic element, the bond strength excellence of itself and closedtop band can prevent that strip is fluffed when peeling off the closedtop band.
Background technology
Receiving base band of chip electronic element is the carrier (being used to take in the material of maintenance) of chip-shaped electronic part, usually, as following strip is carried out processed with cardboard and makes.
(1) strip is cut into the band shape of the width of regulation with cardboard.
(2) hole, angle and the circular hole of formation prescribed level on the pressboard belt that obtains.The hole, angle is used to take in chip-shaped electronic part, and circular hole is used to make only the advance distance of regulation of strip in the element filling machine.
(3), form the bottom surface of hole, angle and circular hole at the back side (bottom side) of strip bonding underseal band.In addition, replace sometimes the hole, angle is penetrated, be formed with bottom outlet, in this case, omit this operation (3) and the horn shape embossing that strip is implemented prescribed level processed.When on strip, being bonded and sealed band, use so-called heat sealing method, that is, cover sealing band, above sealing band, apply the method for heat and pressure at the back side of strip.
(4) filled core sheet-type electronic element in the hole, angle in above-mentioned strip.
(5) utilize heat sealing method, in the surface (top side) of strip bonding closedtop band, closed angle hole.
(6) the chip receiving base band that obtains is rolled onto on the boxlike spool of prescribed level, dispatches from the factory with chip-shaped electronic part.
(7) last, the user peels off closedtop band slave plate belt surface, makes hole, angle opening, takes out the chip-shaped electronic part of wherein taking in.
From the angle of using as described above, require the quality that receiving base band had, what can be listed has, (1) the chip component of being filled is not produced harmful effect, (2) and have and to bear the intensity of the various processing of paper and then (3) closedtop band, fluffing etc. does not take place by bonding well and when peeling off the closedtop band in order to take out chip electronic element.
Up to now, the method for fluffing takes place when preventing to peel off the closedtop band, though known have, the exploitation (patent documentation 1) of the device that the not adhesive segment of band is detected; Not the not method of binding part that prevents of essence, but at the countermeasure (patent documentation 2,3,4) of the fracture of the goods that use plastic matrix material as basis material; It or not the performance that prevents of improving fluffing that peeling off of Paper carrier band caused, but utilize size press that the conifer of regulation proportioning and broad leaf tree and starch are applied on the two sides, prevent method (patent documentation 5) of fluffing etc. thus, but, do not find following known document, that is, clearly be conceived to improve receiving base band of chip electronic element made of paper fluffing prevent performance, and the known document of its actv. solution is disclosed.
[patent documentation 1] spy opens flat 9-315486 communique
[patent documentation 2] spy opens flat 11-105181 communique
[patent documentation 3] spy opens flat 9-156684 communique
[patent documentation 4] spy opens flat 8-258888 communique
[patent documentation 5] spy opens the 2000-175966 communique
Summary of the invention
The object of the present invention is to provide a kind of receiving base band of chip electronic element, it is a receiving base band of chip electronic element made of paper, with the cohesiveness excellence of closedtop band, and can prevent when peeling off the closedtop band, strip fluffs.
Present inventors find, receiving base band of chip electronic element made of paper, in order to prevent fluffing, by making the surface treating agent that is coated on the top layer be penetrated into the depths of ply of paper, and then, the surface treating agent of infiltration makes interfibrous combination firm, can prevent the generation of fluffing very effectively, thereby finish the present invention.
Receiving base band of chip electronic element of the present invention is to have a plurality of strips made of paper that are used to take in the cavity of chip-shaped electronic part, it is characterized in that, the strip surface that is used to seal the closedtop band of above-mentioned cavity at joint, be formed with the coating layer that contains fluffing preventing property resin, described preventing property of fluffing resin contains and is selected from least a in styrene-maleic acid copolymer resin, alkene-maleic acid copolymerized resin, acrylate-acrylic copolymer resin, the styrene-olefin-acrylic copolymer resin.
In receiving base band of chip electronic element of the present invention, the content of above-mentioned preventing property of the fluffing resin in the above-mentioned coating layer is preferably 0.0001～2.0g/m
2
In receiving base band of chip electronic element of the present invention, preferably in above-mentioned coating layer, except above-mentioned preventing property of fluffing resin, further contain water soluble resin, described water soluble resin contains at least a water-soluble high-molecular compound.
In receiving base band of chip electronic element of the present invention, above-mentioned water soluble resin preferably contains and is selected from least a in polyvinyl alcohol, starch and the polyacrylamide.
In receiving base band of chip electronic element of the present invention, the content of the above-mentioned water soluble resin in the above-mentioned coating layer is preferably, with respect to above-mentioned preventing property of the fluffing resin of 100 mass parts, in the scope of 100～10000 mass parts.
The fluffing of strip with the bond strength excellence of closedtop band, when peeling off the closedtop band, does not take place in fact in receiving base band of chip electronic element of the present invention.
The specific embodiment
In receiving base band of chip electronic element of the present invention, for cohesiveness that improves strip top layer and closedtop band and then the surface strength that improves strip, be formed with the coating layer that contains following preventing property of fluffing resin on the strip surface, described preventing property of fluffing resin contains and is selected from least a in styrene-maleic acid copolymer resin, alkene-maleic acid copolymerized resin, acrylate-acrylic copolymer resin and the styrene-olefin-acrylic copolymer resin.The styrene-maleic acid copolymer resin that in preventing property of fluffing resin, contains, alkene-maleic acid copolymerized resin, acrylate-acrylic copolymer resin and styrene-olefin-acrylic copolymer resin, in its copolymer molecule, all have hydrophobic group and hydrophilic radical, form coating layer by the coating fluid that contains such resin in the coating of strip surface, can realize the coverage effect on strip surface, and coating fluid is penetrated in the ply of paper, in the copolymer molecule of fluffing preventing property resin as the carboxyl of hydrophilic radical and the hydroxyl formation hydrogen bond of paper pulp fiber, form crosslinked state between fiber, increase substantially interfibrous combination.Utilize the raising of so interfibrous combination, peel strength that can the strengthening pulp fiber prevents coming off of the fiber that fluffs, and improves the peel resistance of the pulp resin when peeling off the closedtop band.
Preventing property of the fluffing resin that uses among the present invention preferably contains 0.0001～2.0g/m in coating layer
2, 0.001～1.5g/m more preferably
2, 0.01～1.0g/m more preferably
2
In addition, in receiving base band of chip electronic element of the present invention, following preventing property of fluffing resin is mixed coating with water-soluble high-molecular compound, to preventing fluffing is more effective, and described preventing property of fluffing resin contains and is selected from least a in styrene-maleic acid copolymer resin, alkene-maleic acid copolymerized resin, acrylate-acrylic copolymer resin, the styrene-olefin-acrylic copolymer resin.Promptly, by containing water-soluble high-molecular compound, make this water-soluble high-molecular compound work as following adhesive agent, prevent that effectively the generation of fluffing, described adhesive agent from being to carry out bonded assembly adhesive agent between the block to the cross-linked state that is formed by preventing property of fluffing resin that uses among the present invention and paper pulp fiber.And then preventing property of the fluffing resin that uses among the present invention is by coexisting with water-soluble high-molecular compound, can reduce the surface tension of water-soluble high-molecular compound, be evenly distributed on the surface of strip, and be penetrated into darker inside, improve the effect that prevents from the inner generation fluffing of ply of paper.
In the present invention, be used to the fluff styrene-maleic acid copolymer resin of preventing property resin, the glass transition temperature of alkene-maleic acid copolymerized resin is preferably 10～50 ℃.If glass transition temperature is lower than 10 ℃, the difference of the attaching temperature during then owing to the attaching sealing band, between paper pulp fiber, the styrene-propene acid copolymer resin that exists with cross-linked state and the combination of alkene-maleic acid copolymerized resin die down, and be therefore not preferred.In addition, if glass transition temperature surpasses 50 ℃, then the cross-linked structure with paper pulp fiber becomes really up to the mark, and the stress during owing to the peel seal band makes coating layer breakage, damaged portion that the danger that fluffing takes place be arranged.
Because same reason, the glass transition temperature of styrene-olefin-acrylic copolymer resin is preferably in 60～100 ℃ scope.
In addition, in receiving base band of chip electronic element of the present invention, if water-soluble high-molecular compound is selected from polyvinyl alcohol, starch, polyacrylamide, then can improve the surface strength of coating layer, and also can improve the coating comformability, therefore preferred.Water-soluble high-molecular compound with preventing property of the fluffing resin with respect to 100 quality %, is that the ratio of 100～10000 quality % cooperates preferably.
In receiving base band of chip electronic element of the present invention, when forming the coating layer that contains preventing property of the fluffing resin that uses among the present invention and water soluble resin as required on strip surface, for example can adopt, rod is coated with; Blade coating; Airblade coating; The scraper coating; The roller coat of horizontal roller coat, size press, rolling press coating etc.; Two-sided to the cutter coating; BEL-BAPA type coating etc.
To the kind of the raw material paper pulp that uses in the receiving base band of chip electronic element of the present invention, there is no particular limitation, for example can use chemical pulp (broad leaf tree, conifer), mechanical pulp, old paper paper pulp, non-wood-fiber paper pulp, synthetic paper-pulp etc.These paper pulp can be single kind, also can mix and use two kinds or more than it.For copy the slurry with in add chemical reagent, can use preventing property of the fluffing resin and the water soluble resin that use among the present invention, as required, for example can use the filler of the anti-hydrated agent of the sizing agent of rosin, styrene-maleic acid, alkenyl succinic anhydrides, alkyl ketene dimer etc., various paper power intensifier, filtration rate improving agent, polyamide polyamine chloropropylene oxide etc., defoamer, talcum etc., dyestuff etc.
To the manufacturing installation that is used to make receiving base band of chip electronic element made of paper of the present invention, create conditions, there is no particular limitation, can select separately manufacturing installation was fit to creates conditions, make goods of the present invention.For example, by using the incompatible paper of copying of copying of cylinder paper machine and fourdrinier paper machine, can make the strip with following top layer, described top layer is by Nei Jia or utilizes adding of coating machine to be added with the top layer of above-mentioned interpolation with chemical reagent.
In receiving base band of chip electronic element made of paper of the present invention, as required, can use to add chemical reagent in various.For example can use, natural and synthetic system paper such as rosin based sizing agent, styrene maleic acid copolymer, alkyl ketene dimer, alkenyl succinic anhydrides use in add filler, dyestuff of the anti-hydrated agent, defoamer, talcum etc. of sizing agent, various paper power intensifier, filtration rate improving agent, polyamide polyamine chloropropylene oxide etc. etc.
In addition, receiving base band of chip electronic element made of paper of the present invention, for the effect that improves with the cohesiveness of underseal band and prevent to fluff, also can be at necessary chemical reagent such as the suitable pva coating in the back side of strip made of paper, starch, polyacrylamide, acrylic resin, styrene butadiene resinoid, styrene isoprene resinoid, polyester resin, ethane-acetic acid ethyenyl ester resinoid, vinyl acetate-vinyl alcohol resin, polyurethanes resin.And then, for coating process, can use rod to be coated with; Blade coating; Airblade coating; The scraper coating; The roller coat of horizontal roller coat, size press, rolling press coating etc.; Two-sided scraper coating; BEL-BAPA type coating etc.
Quantitative (grammage) of receiving base band of chip electronic element of the present invention by the size decision of the chip-shaped electronic part of wherein taking in, but is generally 200～1000g/m
2About.Because in so quantitative scope, so as copying paste-making method, the multilayer of the preferred quality of control is easily copied the slurry method.
Embodiment
Below, illustrate in greater detail the present invention by following embodiment, but the present invention is not subjected to the qualification of these embodiment.In addition, the numerical value of expression proportioning, concentration etc. is the numerical value of the quality criteria of solid constituent or effective constituent.In addition, to whole examples, implement pre-processing at foundation JIS P8111, to the paper that carried out manufacturing paper with pulp after, be used for peel strength and measure.The particular case of the condition determination of peel strength is as described below.
The measuring method of＜peel strength 〉
The strip of taking in chip-shaped electronic part is cut into the wide band shape of 8mm, as sealing band, use " No.318H-14A " (trade mark) [coextrusion laminate film of polyethylene terephthalate (PET) and ethylene vinyl acetate copolymer (EVA): wide 5.25mm of day eastern electrician (strain) system, thick 53 μ m] cover a lateral edges side of strip, then, use heat-sealing テ ス ダ one " TP701S " of テ ス ダ one industry (strain) system, 155 ℃ of heat-sealing temperatures, the suffered heat-sealing pressure of sample 1.5Mpa, under the condition of 0.2 second heat-sealing time, to rise the position of 0.5mm to the inside by the side that sealing band was covered, wide 0.4mm, the rail shape of interval 3.0mm, the sealing band is heat sealed on the strip face, then, after about 1 hour, (peeling rate is 300mm/min with the method for foundation JIS C 0806-3, minute is 12 seconds), repeatedly measure the peel strength of sealing band, obtain its aviation value.
＜fluffing 〉
With the visual heat-sealing portion (area of observing after peel strength is measured: 0.8cm
2), following judgement and souvenir fluffing degree of preventing.
7: not fluffing fully.
6: 1 fluffing is arranged.
5: 2 fluffings are arranged.
4: 3～5 fluffings are arranged.
3: 6～8 fluffings are arranged.
2: have 9～10 the part fluffing takes place.
1: all fluffings.
Embodiment 1
Paper pulp by is each other formed different top layers, middle level, bottom constituted three layers copy slurry and make chip-shaped electronic part and take in the paper cardboard.At this moment, the NBKP of mixed dissolution 30%, 70% LBKP, CSF (Canadian Standard Freeness) paper pulp of modulation 400ml is used for the top layer; The proportioning of the NBKP with 20%, 20% LBKP, 20% first-class old paper, 40% the old paper of newspaper, the paper pulp of the CSF of modulation 350ml is used for the middle level; The proportioning of the NBKP with 25%, 25% LBKP, 50% the old paper of newspaper, the paper pulp of the CSF of modulation 400ml is used for bottom.In pulp separately, add aluminium sulphate, its pH is adjusted into 6.0,, add 0.3% polyacrylamide (trade mark: Port リ ス ト ロ Application 1250, waste river chemical frbre industry system) as the interior paper power intensifier that adds.The pulp of above-mentioned condition copied for 3 layers at cylinder close in the pulp machine, to be respectively top layer 100g/m
2, middle level 200g/m
2, bottom 50g/m
2Copy and close, carry out the smoothing processing with the smoothing handler (calander) that is arranged in the paper machine, then, with 0.9g/m
2Coating weight, the glass transition temperature of measuring in top layer surface coating TMA method is that 18 ℃ styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) is used as fluffing and prevents to use inorganic agent, makes quantitative 350g/m
2, thick 0.42mm receiving base band of chip electronic element.Measurement result is shown in table 1.
Embodiment 2
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, on the surface on top layer, formation contains following preventing property of fluffing resin and prevents coating layer with inorganic agent as fluffing, and described preventing property of fluffing resin is that alkene-maleic acid copolymerized resin (trade mark: PM482, waste river chemical frbre industry system) of 60 ℃ constitutes by glass transition temperature.
Measurement result is as shown in table 1.
Embodiment 3
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyacrylamide (trade mark: PS117, waste river chemical frbre industry system) of 100 mass parts, the styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 4
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyvinyl alcohol (trade mark: PVA117, Network ラ レ system) of 100 mass parts, the styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 5
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, the glass transition temperature that mixes polyacrylamide (trade mark: PS117, waste river chemical frbre industry system), 2.0 mass parts of 100 mass parts is 24 ℃ a styrene-maleic acid copolymer resin (trade mark: PM385, waste river chemical frbre industry system), comes the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 6
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the oxidized starch (trade mark: エ one ス A, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 7
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the cationic starch (trade mark: エ one ス K250, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 8
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the urea organic phosphate starch (trade mark: エ one ス P230, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-maleic acid copolymer resin (trade mark: PM382, waste river chemical frbre industry system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 9
Receiving base band of chip electronic element is made in operation similarly to Example 1.But the use glass transition temperature is acrylate-acrylic copolymer resin (trade mark: SS2560, starlight PMC system) of 110 ℃, and the fluffing that is used as the surface, top layer prevents to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 10
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyacrylamide (trade mark: PS117, waste river chemical frbre industry system) of 100 mass parts, the acrylate-acrylic copolymer resin (trade mark: SS2560, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 11
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyvinyl alcohol (trade mark: PVA117, Network ラ レ system) of 100 mass parts, the acrylate-acrylic copolymer resin (trade mark: SS2560, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 12
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the oxidized starch (trade mark: エ one ス A, prince コ Application ス ダ one チ system) of 100 mass parts, the acrylate-acrylic copolymer resin (trade mark: SS2560, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 13
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the cationic starch (trade mark: エ one ス K-250, prince コ Application ス ダ one チ system) of 100 mass parts, the acrylate-acrylic copolymer resin (trade mark: SS2560, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 14
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the urea organic phosphate starch (trade mark: エ one ス P230, prince コ Application ス ダ one チ system) of 100 mass parts, the acrylate-acrylic copolymer resin (trade mark SS2560, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 15
Receiving base band of chip electronic element is made in operation similarly to Example 1.But the use glass transition temperature is styrene-olefin-acrylic copolymer resin (trade mark: SS2910, starlight PMC system) of 100 ℃, and the fluffing that is used as the surface, top layer prevents to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 16
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyacrylamide (trade mark: PS117, waste river chemical frbre industry system) of 100 mass parts, the styrene-olefin-acrylic copolymer resin (trade mark: SS2910, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 17
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the polyvinyl alcohol (trade mark: PVA117, Network ラ レ system) of 100 mass parts, the styrene-olefin-acrylic copolymer resin (trade mark: SS2910, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 18
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the oxidized starch (trade mark: エ one ス A, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-olefin-acrylic copolymer resin (trade mark: SS2910, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 19
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the cationic starch (trade mark: エ one ス K-250, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-olefin-acrylic copolymer resin (trade mark: SS2910, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Embodiment 20
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, mix the urea organic phosphate starch (trade mark: エ one ス P230, prince コ Application ス ダ one チ system) of 100 mass parts, the styrene-olefin-acrylic copolymer resin (trade mark SS2910, starlight PMC system) of 2.0 mass parts, come the fluffing of modulometer laminar surface to prevent to use inorganic agent.
Measurement result is as shown in table 1.
Comparative example 1
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, with 0.9g/m
2Coating weight be coated with as top layer surface polyvinyl alcohol (trade mark: PVA117, Network ラ レ system) with inorganic agent.
Measurement result is as shown in table 1.
Comparative example 2
Receiving base band of chip electronic element is made in operation similarly to Example 1.But, with 0.3g/m
2Coating weight be coated with as top layer surface polyvinyl alcohol (trade mark: PVA117, Network ラ レ system) with inorganic agent.
Measurement result is as shown in table 1.
The peel strength aviation value of embodiment 1～20, comparative example 1,2 is as shown in table 1.As the embodiment 1～20 of receiving base band of chip electronic element of the present invention, to compare with comparative example 1,2, its peel strength is big, and the generation of fluffing is also significantly less.
The industry utilizability
The receiving base band of chip electronic element that the present invention relates to, big with the adhesion strength of closedtop band, During from its top layer sur-face peeling closedtop band, the fluffing by strip does not take place, perhaps considerably less, have excellent The different practicality as receiving base band of chip electronic element.
Claims (4)
1. receiving base band of chip electronic element, be to have a plurality of strips made of paper that are used to take in the cavity of chip-shaped electronic part, it is characterized in that, the strip surface that is used to seal the closedtop band of above-mentioned cavity at joint, be formed with the coating layer that contains preventing property of fluffing resin, described preventing property of fluffing resin contains and is selected from the styrene-maleic acid copolymer resin, alkene-maleic acid copolymerized resin, at least a in acrylate-acrylic copolymer resin and styrene-olefin-acrylic copolymer resin, the content of above-mentioned preventing property of the fluffing resin in the above-mentioned coating layer is 0.0001～2.0g/m
2, form crosslinked combination between the paper pulp fiber of above-mentioned preventing property of fluffing resin in above-mentioned strip made of paper.
2. receiving base band of chip electronic element as claimed in claim 1 is characterized in that, in above-mentioned coating layer, except above-mentioned preventing property of fluffing resin, also contains water soluble resin, and described water soluble resin contains at least a water-soluble high-molecular compound.
3. receiving base band of chip electronic element as claimed in claim 2 is characterized in that, above-mentioned water soluble resin contains and is selected from least a in polyvinyl alcohol, starch and the polyacrylamide.
4. receiving base band of chip electronic element as claimed in claim 2 is characterized in that, the content of the above-mentioned water soluble resin in the above-mentioned coating layer is, with respect to above-mentioned preventing property of the fluffing resin of 100 mass parts, in the scope of 100～10000 mass parts.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005044903A JP4650877B2 (en) | 2005-02-22 | 2005-02-22 | Chip-type electronic component storage mount |
| JP044903/2005 | 2005-02-22 | ||
| JP181342/2005 | 2005-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1824585A CN1824585A (en) | 2006-08-30 |
| CN100475661C true CN100475661C (en) | 2009-04-08 |
Family
ID=36935459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100576308A Active CN100475661C (en) | 2005-02-22 | 2006-02-22 | Receiving base band of chip electronic element |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4650877B2 (en) |
| CN (1) | CN100475661C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4844571B2 (en) * | 2007-01-31 | 2011-12-28 | 王子製紙株式会社 | Chip-type electronic component storage mount |
| CN104088199B (en) * | 2014-06-26 | 2016-05-25 | 江西弘泰电子信息材料有限公司 | A kind of carrier band encapsulation paper using and preparation method |
| CN106758541B (en) * | 2016-11-28 | 2018-05-11 | 浙江洁美电子信息材料有限公司 | Back cover is with the manufacture method of body paper, back cover with body paper and back cover band |
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2005
- 2005-02-22 JP JP2005044903A patent/JP4650877B2/en active Active
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2006
- 2006-02-22 CN CNB2006100576308A patent/CN100475661C/en active Active
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| Publication number | Publication date |
|---|---|
| JP2006232277A (en) | 2006-09-07 |
| JP4650877B2 (en) | 2011-03-16 |
| CN1824585A (en) | 2006-08-30 |
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