CN100475001C - Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus - Google Patents

Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus Download PDF

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CN100475001C
CN100475001C CN 200510106340 CN200510106340A CN100475001C CN 100475001 C CN100475001 C CN 100475001C CN 200510106340 CN200510106340 CN 200510106340 CN 200510106340 A CN200510106340 A CN 200510106340A CN 100475001 C CN100475001 C CN 100475001C
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China
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pattern
insulating
material
step
wiring
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CN 200510106340
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Chinese (zh)
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CN1756459A (en
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山田纯
新馆刚
樱田和昭
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精工爱普生株式会社
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Priority to JP2004-297213 priority
Priority to JP2005-220146 priority
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Abstract

本发明提供使用液滴喷出装置,形成具有通孔的多层构造。 The present invention provides a droplet ejection apparatus, a multilayer structure is formed having a through hole. 多层构造形成方法包括:喷出导电性材料液滴,在物体表面上形成导电性材料图案的步骤;烧成上述导电性材料图案,形成配线图案的步骤;喷出含有光固化性材料的第1绝缘材料液滴,在上述配线图案上,形成将通孔镶边的第1绝缘材料图案的步骤;使上述第1绝缘材料图案固化,形成将通孔镶边的第1绝缘图案的步骤;将上述物体表面进行亲液化的步骤;喷出含有光固化性材料的第2绝缘材料液滴,形成围绕上述第1绝缘图案的第2绝缘材料图案并覆盖住上述配线图案和亲液化的上述物体表面的步骤;使上述第2绝缘材料图案固化,形成围绕上述第1绝缘图案的第2绝缘图案的步骤。 Multilayer structure forming method comprising: discharging droplets of a conductive material, the step of forming a conductive material pattern on the object surface; baking the conductive material pattern, the wiring pattern forming step; discharging the photocurable material comprising the first insulating material droplets, on the wiring pattern, the step of forming the first insulating material pattern striped through hole; so that the first insulating material pattern is cured to form the through-hole of the first insulating striped pattern step; the step of the object surface lyophilic; a second insulating material discharged droplets contain a photocurable material, the second insulating material pattern is formed surrounding said first insulating pattern and covers the wiring pattern and the lyophilic the step of the object surface; causing the second insulating material pattern curing step of the second insulating pattern surrounding the first insulating pattern is formed.

Description

多层构造形成方法、配线基板和电子仪器的制造方法技术领域本发明是关于利用液滴喷出装置的多层构造形成方法,尤其是关于在配线基板制造和电子仪器制造中最适宜的多层构造形成方法。 Multilayer structure forming method TECHNICAL FIELD The wiring substrate and the electronic apparatus of the present invention relates to a multilayer structure using the droplet ejection apparatus forming methods, particularly with respect to the wiring substrate fabrication and electronic equipment manufacturing most suitable The method of forming a multilayer structure. 背景技术使用由印刷法形成的加成方法(additive process)制造配线基板和电路基板的方法广受注目。 BACKGROUND ART addition method (additive process) is formed by a printing method, a method of manufacturing the wiring board and the circuit board to high-profile. 这是因为(反复进行薄膜涂布法和光刻法)与制造配线基板和电路基板的方法相比,加成方法的成本低。 This is because (repeated film coating and photolithography) compared with the method of manufacturing the wiring board and the circuit board, the addition of low cost methods. 作为这种加成方法中利用的技术之一,已知有利用喷墨法形成导电性图案的技术(例如专利文献l)。 One such addition method in ART using the known techniques of forming a conductive pattern by using an ink jet method (e.g. Patent Document l). (专利文献1)特开2004—6578号公报用喷墨法形成配线图案时,通过对由液滴喷出装置配置的导电性材料图案进行烧成,得到配线图案。 When (Patent Document 1) Laid-Open Patent Publication No. 2004-6578 wiring pattern is formed by an ink jet method, by patterning a conductive material by a droplet discharge apparatus is arranged fired to obtain a wiring pattern. 由烧成形成的配线图案表面,对于丙烯树脂等液状绝缘材料具有疏液性。 A wiring pattern formed on the surface of the firing, a liquid acrylic resin for an insulating material having the liquid repellence. 由此在这种配线图案上,用喷墨法描绘规定通孔外形的绝缘图案,并不困难。 Thus in this wiring pattern, drawing a predetermined shape through-holes by an ink jet method insulation patterns, it is not difficult. 然而,在形成配线图案时,由于烧成,甚至配线以外部分的表面都呈现出疏液性。 However, when the wiring pattern is formed, since the firing, and even a surface portion other than the wiring lyophobic emerged. 具体讲,由于上述烧成,没有配线图案的部分,而显露出绝缘层的表面为疏液化。 Specifically, since the sintering is not part of the wiring pattern, and the exposed surface of the insulating layer is lyophobic. 由此,在靠近通孔以外的部分,使用喷墨法很难层叠厚度均匀的绝缘层。 Thereby, the portion near the through-hole other than the ink jet method is difficult to laminate a uniform thickness of the insulating layer. 另外,在使用喷墨法形成具有通孔或接触孔的绝缘层时,有时要求使用浓度较高的液体状材料。 Further, when forming the insulating layer having a through hole or a contact hole by an inkjet method, it may require the use of higher concentrations of liquid material. 这是由于若是这种浓度较高的液体状材料, 则在喷出后,伴随着溶剂的气化,直到失去流动性所需要的时间比较短, 成为通孔的开口部分很容易形成所要的外形。 This is because if a high concentration of this liquid-like material, after the discharge, with vaporization of the solvent, the loss of time until the desired flowability is relatively short, the opening portion of the through hole becomes easy to form the desired shape . 然而,这种液体状的材料弹落在物体表面上后,扩展润湿的面积很小。 However, such liquid-like material after the shell landed on the object surface, the small size of the extended wetted. 这样的液体状材料,就绝缘层中,形成通孔绝缘部分时,虽然适宜, 但形成远离通孔部分时,都产生了难度。 Such a liquid material on the insulating layer in the through hole when the insulating portion is formed, while desirable, it is away from the through-hole forming portion, have had difficulty. 发明内容本发明就是鉴于上述课题而进行的,使用液滴喷出装置,形成具有通孔的多层构造。 The present invention has been made in view of the above problems, using a droplet ejection apparatus, a multilayer structure is formed having a through hole. 本发明的多层构造形成方法中,使用了液滴喷出装置。 Forming a multilayer structure of the present invention method, a droplet discharging device. 这种多层构造形成方法包括如下步骤:步骤A,向物体表面上喷出第1导电性材料液滴,形成第1导电性材料图案;步骤B,对上述第1导电性材料图案进行烧成,形成配线图案; 步骤C,喷出含有第1光固化性材料的第1绝缘材料液滴,在上述配线图案上,形成将通孔镶边的第1绝缘材料图案;步骤D,使上述第1绝缘材料图案固化,形成将上述通孔镶边的第1绝缘图案;步骤E,使上述物体表面形成亲液化;步骤F,喷出含有第2光固化性材料的第2绝缘材料液滴,覆盖住上述配线图案和亲液化的上述物体表面,形成围绕上述第1绝缘图案的第2 绝缘材料图案;和步骤G,使上述第2绝缘材料图案固化,形成围绕上述第1绝缘图案的第2绝缘图案。 The method of forming such a multilayer structure comprising the following steps: Step A, first ejecting droplets of a conductive material onto the surface, forming a first conductive material pattern; procedure B, the above-described first conductive material pattern is fired , a wiring pattern; step C, and the first insulating material comprises a first liquid droplet discharged photocurable material on said wiring pattern, an insulating material forming the first edge of the through-hole pattern; Procedure D, so that patterning the first insulating material is cured, the through hole forming the first insulating striped pattern; step E, so that the object surface lyophilic; step F., the second insulating material comprises ejecting a second liquid photocurable material dropwise, covering the wiring pattern and the object surface lyophilic, forming the second insulating material pattern surrounding said first insulating pattern; and a step G, so that the second insulating material pattern is solidified, formed around the first insulating pattern a second insulating pattern. 上述第1导电性材料含有银(Ag)纳米粒子。 The first conductive material including silver (Ag) nanoparticles. 由上述构成获得的效果之一,使用液滴喷出装置,可形成具有通孔的多层构造。 One of the effects obtained by the above-described configuration, the droplet discharging means may be formed in a multilayer structure having a through hole. 上述多层构造形成方法,最好还包括:步骤H,向上述通孔喷出第2导电性材料液滴,用上述第2导电性材料填满上述通孔;步骤I,对填满上述通孔的上述第2导电性材料,形成导电端子。 The method of forming the above multilayer structure, preferably further comprising the steps of: H, ejecting droplets of a second conductive material to the through hole, the through hole filled with said second electrically conductive material; Step I, to fill the via hole of the second conductive material to form conductive terminals. 根据上述构成,使用液滴喷出装置,可形成具有导电端子的多层构造。 According to the above configuration, the droplet ejection apparatus, a multilayer structure may be formed with the conductive terminals. 根据本发明的某种形态,配线基板的制造方法包括上述多层构造形 According to a certain aspect of the present invention, a method for producing the multilayer wiring substrate comprising a shaped configuration

成方法。 As a method. 根据另一种形态,电子仪器的制造方法包括上述多层构造形成方法。 According to another aspect, a method of manufacturing an electronic apparatus comprising the above-described method of forming a multilayer structure. 根据这些,使用液滴喷出装置,可制造配线基板和电子仪器。 According to these, the droplet ejection apparatus can be manufactured wiring substrate and electronic instruments. 本发明的多层构造形成方法,使用液滴喷出装置。 Forming a multilayer structure of the present invention is a method using a droplet discharge device. 该多层构造形成方法,包括以下步骤:步骤A,将位于物体表面上的配线图案表面,形成疏液化;步骤B,向上述疏液化的配线图案表面,喷出含有第1光固化性材料的第1绝缘材料液滴,在上述配线图案上,形成将通孔镶边的第1绝缘材料图案;步骤C,使上述第1绝缘材料图案固化,形成将上述通孔镶边的第l 绝缘图案;步骤D,使上述的物体表面形成亲液化;步骤E,喷出含有第2光固化性材料的第2绝缘材料液滴,覆盖住上述配线图案和亲液化的上述物体表面,同时形成围绕上述第1绝缘图案的第2绝缘材料图案;和步骤F,使上述第2绝缘材料图案固化。 The method of forming the multilayer structure, comprising the following steps: Step A, the surface of the wiring pattern located on the surface to form a repellent liquefaction; procedure B, to the liquid repellent surface of a wiring pattern, containing a first ejection photocurable the first droplet material is an insulating material, on the wiring pattern, an insulating material forming the first edge of the through-hole pattern; Procedure C, so that the first insulating material pattern is cured to form the first edge of the through hole l insulating pattern; Procedure D, so that the object surface lyophilic; step E, a second insulating material comprises ejecting droplets of the second photo-curable material, and covering the wiring pattern of the object surface lyophilic, while the second insulating material pattern is formed surrounding said first insulating pattern; and a step F, so that the second insulating material pattern is cured. 由上述特征获得的效果之一是,即使不调整液体状材料(上述绝缘材料)的粘度,由于改变了在物体表面上的润湿扩展程度,所以使用液滴喷出装置,也能形成具有通孔的绝缘层(固化的第1绝缘材料图案和第2绝缘材料图案)。 One of the effects obtained by the feature that, even without adjusting the liquid-like material (the insulating material) has a viscosity, due to changes in the degree of wetting of the expansion on the object surface, the droplet ejection apparatus can be formed with through hole insulating layer (cured first insulating material pattern and the second insulating material pattern). 上述多层构造形成方法最好还含有:步骤G,喷出液体状的导电性材料液滴,用上述导电性材料填满上3iffi孑U禾口步骤H,对填满上述通孔的上述导电性材料进行烧成,形成导电端子。 The method of forming the multilayer structure preferably further comprises: step G, the conductive material of the liquid droplet ejection, the conductive material used to fill the opening Wo U larvae 3iffi step H, the conductive fill of the through hole material is formed by firing the conductive terminals. 根据上述特征,使用液滴喷出装置,可在通孔内设置导电端子。 According to the above feature, the droplet discharge apparatus may be provided in the through hole contacts. 上述导电性材料最好含有银(Ag)。 Preferably the conductive material containing silver (Ag). 根据上述特征,使用液滴喷出装置,容易形成导电端子。 According to the above feature, the droplet discharge means is easy to form conductive terminals. 除了多层构造形成方法外,本发明还可以以各种形态实现。 In addition to a method for forming a multilayer structure, the present invention may also be implemented in various forms. 例如, 本发明可以作为配线基板的制造方法实现,还可以作为电子仪器的制造方法实现。 For example, the present invention can be used as a method for producing a wiring board implementations, it may also be implemented as a method of manufacturing an electronic instrument. 附图说明图1是表示本实施方式1〜4的液滴喷出装置的模式图。 BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic diagram of an apparatus embodiment according to the present embodiment of the liquid droplet ejection ~ 4. 图2 (a)和(b)是表示液滴喷出装置中的喷头模式的图。 FIG 2 (a) and (b) is a diagram showing apparatus droplet discharge head pattern. 图3是液滴喷出装置中的控制部的功能方块图。 3 is a droplet ejection apparatus in a functional block diagram of the control unit. 图4 (a)〜(d)是说明实施方式l的配线基板制造方法的图。 FIG. 4 (a) ~ (d) is a diagram illustrating a method according to an embodiment of the wiring substrate manufacturing l. 图5 (a)〜(c)是说明实施方式l的配线基板制造方法的图。 FIG 5 (a) ~ (c) is a diagram illustrating a method according to an embodiment of the wiring substrate manufacturing l. 图6 (a)〜(d)是说明实施方式l的配线基板制造方法的图。 FIG 6 (a) ~ (d) is a diagram illustrating a method according to an embodiment of the wiring substrate manufacturing l. 图7 (a)〜(d)是说明实施方式1的配线基板制造方法的图。 FIG. 7 (a) ~ (d) is a diagram illustrating a method embodiment for manufacturing a wiring substrate. 图8 (a)和(b)是说明实施方式l的配线基板制造方法的图。 FIG 8 (a) and (b) is a diagram illustrating a method according to an embodiment of the wiring substrate manufacturing l. 图9 (a)和(b)是说明实施方式2的配线基板制造方法的图。 FIG. 9 (a) and (b) is a diagram showing a method of manufacturing a wiring board of the second embodiment. 图10 (a)〜(d)是说明实施方式3的配线基板制造方法的图。 FIG. 10 (a) ~ (d) is a diagram illustrating Embodiment 3 of a method of manufacturing the wiring board. 图ll (a)〜(d)是说明实施方式3的配线基板制造方法的图。 FIG. Ll (a) ~ (d) is a diagram illustrating Embodiment 3 of a method of manufacturing the wiring board. 图12 (a)〜(d)是说明实施方式3的配线基板制造方法的图。 FIG. 12 (a) ~ (d) is a diagram illustrating Embodiment 3 of a method of manufacturing the wiring board. 图13 (a)〜(c)是说明实施方式3的配线基板制造方法的图。 FIG 13 (a) ~ (c) is an explanatory view of Embodiment 3 of a method of manufacturing the wiring board. 图14 (a)〜(c)是说明实施方式4的配线基板制造方法的图。 FIG 14 (a) ~ (c) is a diagram showing a method of manufacturing a wiring board of the fourth embodiment. 图15是实施方式5的液晶显示装置的模式图。 FIG 15 is a schematic view of the liquid crystal device according to Embodiment 5 of the display. 图16是表示实施方式5的移动电话机的模式图。 FIG 16 is a schematic view showing Embodiment 5 of the mobile phone. 图17是表示实施方式5的个人计算机的模式图。 FIG 17 is a schematic view showing Embodiment 5 of the personal computer. 图中:1, 2, 3, 4, 5, 6…液滴喷出装置、7, 17…绝缘层、7A, 17A…绝缘材料、7B, 17B…绝缘材料层、9, 11…绝缘图案、9A, 11A…绝缘材料、9B, 11B…绝缘材料图案、8…导电层、8A, 15A…导电性材料、8B… 导电性材料层、10…配线基板、10A…基板、10B…基体、15B…导电性材料图案、15…配线图案、25…配线图案、26…半导体元件、32…液晶面板、34…液晶显示装置、•, 40B…通孔、41A, 41B…导电端子、104... 第l位置控制装置、106…台面、108…第2位置控制装置、112…控制部、114…喷头、118…喷嘴、140…光照射装置、500…移动电话机、520…电光学装置、600…个人计算机、620…电光学装置。 FIG.: 1, 2, 3, 4, 5, 6 ... liquid droplet ejection apparatus, 7, 17 ... insulating layer, 7A, 17A ... insulating materials, 7B, 17B ... insulating material layer, 9, 11 ... insulating pattern, 9A, 11A ... insulating materials, 9B, 11B ... insulating material pattern, 8 ... conductive layer, 8A, 15A ... conductive material, 8B ... conductive material layer, 10 ... wiring board, 1OA ... substrate, 10B ... substrate, 15B a conductive material pattern ..., 15 ... wiring pattern, the wiring pattern 25 ..., 26 ... semiconductor device, 32 ... liquid crystal panel, 34 ... liquid crystal display device, •, 40B ... through hole, 41A, 41B ... conductive terminals 104. l .. The first position control unit, 106 ... table, 108 ... the second position control means, the control unit 112 ..., ... nozzle, 118 ... nozzle, 140 ... light irradiation device, the mobile phone 500 ..., 520 ... electro-optical device 114 600 ... personal computer 620 ... electro-optical device.

具体实施方式(实施方式l)(A、液滴喷出装置的整体构成) 本实施方式的多层构造形成方法,利用图1的液滴喷出装置1〜6。 DETAILED DESCRIPTION (Embodiment l) (A, constituting the liquid droplet ejection apparatus as a whole) the multilayer structure of the present embodiment forming method using the droplet ejection apparatus 1 of FIG. 1~6. 液滴喷出装置1〜6是分别喷出绝缘材料7A (图1)、导电性材料8A、绝缘材料9A、绝缘材料11A、导电性材料15A、绝缘材料17A的装置。 1~6 respectively droplet ejection apparatus ejecting an insulating material 7A (FIG. 1), a conductive material. 8A, an insulating material. 9A, an insulating material. 11A, the conductive material. 15A, 17A of the insulating material means. 而且如下述,这些绝缘材料7A、导电性材料8A、绝缘材料9A、绝缘材料IIA、导电性材料15A、绝缘材料17A,都是液体状材料的一种。 Also as described below, these insulating materials. 7A, a conductive material. 8A, an insulating material. 9A, an insulating material IIA, electrically conductive material. 15A, an insulating material. 17A, is a liquid-like material. 图1所示的液滴喷出装置1,基本上是喷墨装置。 The droplet ejection apparatus 1 shown in FIG. 1, the ink jet apparatus substantially. 更具体讲,液滴喷出装置1备有:保持液体状材料111的容器101、管道110、底座GS、喷头部103、台面106、第1位置控制装置104、第2位置控制装置108、 控制部112、光照射装置140、支撑部分104a。 More specifically, the droplet ejection apparatus 1 includes: a liquid holding container 101 the material 111, the pipe 110, the base GS, the head portion 103, the table 106, the first position control device 104, second position control device 108, the control section 112, the light irradiation device 140, the support portion 104a. 其他5个液滴喷出装置2〜 6的构造和功能与液滴喷出装置1的构造和功能基本相同,因此,这5个液滴喷出装置2〜6的构造和功能省去说明。 Other droplet discharge device 5 is configured and functions of the droplet ejection apparatus 2 ~ 6 1 construction and function are substantially the same, so this droplet discharge device 5 2 ~ 6 described configuration and function is omitted. 喷头部103保持喷头114 (图2)。 The head portion 103 holds the head 114 (FIG. 2). 该喷头114根据来自控制部112 的信号,喷出液体状材料111的液滴。 The showerhead 114 according to the signal from the control unit 112, a liquid droplet discharge material 111. 而且,喷头部103中的喷头114 由管道110与容器101相连接,由此,液体状材料111从容器101供入喷头114。 Further, the head portion 103 of the head 114 is connected by a conduit 110 to the container 101, whereby the liquid-like material 111 from the container 101 is fed to the nozzle 114. 台面106提供为固定基板10A的平面。 A fixed table 106 provides a planar substrate 10A. 进而,台面106具有使用吸引力而固定基板10A位置的功能。 Further, the mesa 106 having a fixed position of the substrate 10A using attractive features. 因此,基板10A是由聚酰亚胺形成的弹性基板,其形状呈条状。 Thus, the substrate 10A is an elastic substrate formed of polyimide, which was strip shape. 这样,将基板10A的两端固定在未图示的一对巻盘上。 Thus, both ends of the substrate 10A is fixed to a pair of unillustrated Volume disc. 第1位置控制装置104,由支撑部分104a固定在距底座GS —定高度的位置上。 The first position control device 104, is fixed by the support portion 104a from the base GS - a predetermined height position. 这第1位置控制装置104具有的功能是根据来自控制部112 的信号,使喷头部103沿着X轴方向,和与X轴方向成直交的Z轴方向移动。 This function of the first position control device 104 in accordance with the signal from the control section 112 of the head portion 103, and the Z-axis direction orthogonal to the X-axis direction along the X-axis direction movement. 进而,第1位置控制装置104还具有以与Z轴平行的轴旋转,转动喷头部103的功能。 Further, the first position control device 104 also has an axis of rotation parallel to the Z axis, the head portion 103 of the rotation function. 本实施方式中,Z轴方向是与垂直方向(即重力加速度方向)平行的方向。 In the present embodiment, Z-axis direction is a direction parallel to the vertical direction (i.e. the direction of gravitational acceleration). 第2位置控制装置108根据来自控制部112的信号,使台面106在底座GS上,沿着Y轴方向移动。 The second position control device 108 in accordance with the signal from the control unit 112, so that the table 106, is moved along the Y-axis direction on the base GS. Y轴方向是与X轴方向和Z轴方向都 A Y-axis direction are X-axis direction and the Z-axis direction

成直交的方向。 A direction orthogonal. 具有上述功能的第1位置控制装置104的构成和第2位置控制装置10S的构成,使用利用了直线电动机或伺服电动机的公知的XY自动装置即可实现。 10S constituting the apparatus having the above-described first position control device 104 functions and the configuration of the second position control, using well-known use of a linear motor or servo motor XY robot can be realized. 为此,此处省去对它们作详细说明。 To this end, they are omitted here for detailed instructions. 另外,本说明书中,第l 位置控制装置104和第2位置控制装置108都记作"机械手"(robot)或"扫描部"。 In the present specification, the l-position control device 104 and the second position control device 108 are referred to as "robot" (Robot) or "scanning unit." 如上所述,通过第1位置控制装置104使喷头部103沿X轴方向移动。 As described above, by the first position control device 104 so that the head portion 103 moves in the X-axis direction. 同样,通过第2位置控制装置108使基板10A与台面106—起沿Y 轴方向移动。 Similarly, the control device 108 moves the substrate 10A from mesa 106- Y-axis direction by the second position. 这些结果,使喷头114改变了对基板10A的相对位置。 These results, so that the nozzle 114 changes the relative position of the substrate 10A. 更具体讲,通过这些动作,使喷头部103、喷头114、或喷嘴118 (图2), 相对基板10A, 一边与Z轴方向保持所定的距离, 一边沿X轴方向和Y 轴方向作相对移动,即进行相对扫描。 More specifically, by these actions, so that the nozzle portion 103, nozzle 114 or nozzles 118 (FIG. 2), the counter substrate 1OA, while maintaining a predetermined distance from the Z-axis direction, an edge of the X-axis direction and the Y-axis direction for relative movement , i.e. relative scanning. 所谓"相对移动"或"相对扫描", 是指喷出液体状材料111侧,和来自该侧喷出物的弹落侧(被喷出部)的至少一方相对于另一方作相对移动。 The so-called "relative movement" or "relative scanning" refers to a liquid material discharge side 111, and the side of the landing from the discharge side thereof (the discharge portion), at least one relatively moved relative to the other. 控制部112的构成为从外部信息处理装置,接受表示应喷出液体状材料111的液滴之相对位置的喷出数据。 The control unit 112 is configured from an external information processing apparatus, receives information indicating that data corresponding to the ejection position to eject a droplet of the liquid material 111. 控制部112将接受到的喷出数据存储在内部存储装置内,同时根据存储的喷出数据,控制第1位置控制装置104、第2位置控制装置108、和喷头114。 The control unit 112 will receive the discharge data stored in the internal storage device while storing the data in accordance with the ejection control means 104 controls the first position, the second position control device 108, and nozzle 114. 而且,所谓喷出数据是用于在基板10A上,以所定图案付与液体状材料111的数据,本实施方式中,喷出数据具有位标志数据的形态。 Further, the data for the so-called ejection on a substrate 1OA, at a predetermined data pattern pay liquid material 111, in this embodiment, ejection data has the form of flag data. 具有上述构成的液滴喷出装置1根据喷出数据,使喷头114的喷嘴118 (图2)相对于基板IOA作相对移动,同时从喷嘴118向被喷出部喷出液体状材料111。 Having a droplet ejection apparatus 1 configured according to the ejection data, the nozzle 118 (FIG. 2) of the head 114 relative to the substrate IOA relatively moved, while the liquid material is discharged from the discharge portion 111 of the nozzle 118. 由液滴喷出装置1的喷头114的相对移动和由喷头114 的液体状材料lll的喷出都可以记作"涂布扫描"或"喷出扫描"。 Relatively moving the droplet discharge head 114 of the apparatus 1 and by the discharge of the liquid material lll heads 114 are referred to as "coating scanning" or "ejection scanning." 本说明书中,将液体状材料lll的液滴弹落部分记作"被喷出部"。 The present specification, a liquid-like material portion of the landing droplet lll referred to as "the discharge portion." 弹落的液滴润湿扩展的部分记作"被涂布部"。 The extension of the landing droplet wets a portion referred to as "the coated portion." "被喷出部"和"被涂布部",任何一个都是通过对基底物体实施表面改质处理,而形成的部分, 以使液体状材料在该部分呈现出所要求的接触角。 "It is sprayed portion" and "coated portion" is any embodiment of the substrate by the surface modification treatment, partially formed, so that the liquid-like material exhibits a contact angle required in this portion. 但是,即使未进行表面改质处理,基底物体的表面也对液体状材料呈现出所要求的疏液性或亲液性(即,弹落的液体状材料在基底物体表面上呈现出所要的接触角) 时,基底物体的表面也可以是"被喷出部"或"被涂布部"。 However, even if the surface modification treatment is not performed, the surface of the substrate of the object but also the liquid-like material exhibits a lyophobic or lyophilic required (i.e., of the landing liquid-like material exhibits a contact angle desired on the substrate surface of the object ), the surface of the substrate of the object can be "ejected portion" or "coated portion." 本说明书中, 将"被喷出部"记作"靶子"或"接受部分"。 The present specification, the "ejected portion" referred to as "target" or "receiving portion." 再回到图1,光照射装置140是向基板10A上付与的液体状材料111 照射紫外光的装置。 1 again, the light irradiation means 140 is a means 111 to the liquid-like material by irradiating ultraviolet light on the substrate 10A and the pay. 光照射装置140的紫外光照射开关,由控制部112 控制。 Irradiating ultraviolet light irradiation switch means 140, controlled by the control unit 112. 所谓使用喷墨法形成层、膜、或图案是使用像液滴喷出装置1那样的装置,在所定的物体上形成层、膜、或图案。 A so-called ink jet method to form a layer, film, or like pattern liquid droplet ejection apparatus 1 using an apparatus such as a layer, film, or a predetermined pattern is formed on the object. (B、喷头)如图2 (a)和(b)所示,液滴喷出装置1中的喷头114是具有多个喷嘴118的喷墨头。 (B, head) FIG. 2 (a) and (b), the droplet discharge head 1 in the apparatus 114 is an ink jet head having a plurality of nozzles 118. 具体讲,喷头114备有:振动板126、贮液槽129、 多个隔壁122、多个内腔(cavity) 120、多个振动子124、规定多个喷嘴118的各自开口的喷嘴板128、供给口130、和孔131。 Specifically, the head 114 provided with: a vibration plate 126, a reservoir 129, a plurality of partition walls 122, a plurality of lumen (cavity) 120, a plurality of transducer 124, a predetermined plurality of openings of each nozzle plate 128 of nozzle 118, the supply port 130, and apertures 131. 贮液槽129位于振动板126和喷嘴板128之间,在该贮液槽129中,经常从未图示的外部容器,通过孔131供给填充液体状材料111。 Reservoir 129 and the vibration plate 126 positioned between the nozzle plate 128, the sump 129, it is often not shown outer container, filled with a liquid material supply holes through 111,131. 另外,多个隔壁122位于振动板126和喷嘴板128之间。 Further, the plurality of partition walls 122 positioned between the vibrating plate 128 and the nozzle plate 126. 这样,由振动板126、喷嘴板128、和一对隔壁122围绕的部分是内腔120。 Thus, the vibrating plate 126, nozzle plate 128, and a pair of partition wall portion 122 is about 120 lumen. 由于与喷嘴118相对应设置内腔120,所以内腔120的数和喷嘴118的数相同, 在内腔120中,通过位于一对隔壁122之间的供给口130,从IC液槽129 供给液体状材料lll。 Since the nozzle 118 is provided corresponding to the lumen 120, the same number of nozzles and the number of lumen 120 118, lumen 120, is supplied through the liquid supply port is located between one pair of partition walls 122 tank 130 from the IC 129 like material lll. 本实施方式中,喷嘴118的直径约为27(im。与各个模头120相对应,各个振动子124位于振动板126上。振动子124分别含有压电元件124C、和夹持压电元件124C的一对电极124A、 124B。控制部H2控制向这一对电极124A、 124B之间付与驱动电压, 从对应的喷嘴118喷出液体状的材料111的液滴D。从喷嘴118喷出的材料体积,在0P1以上42P1 (微微升)以下之间变动。调整喷嘴118的形状, 使液体状材料111的液滴D从喷嘴118沿Z轴方向喷出。本说明书中,将含有一个喷嘴118、与喷嘴118对应的内腔120、和与内腔120对应的振动子124的部分记作"喷出部127"。根据该记述, 一个喷头114具有和喷嘴118数相同数的喷出部127。喷出部127也可以有电热转换元件,以代替压电元件。即,喷出部127也可以具有利用由电热转换元件使材料热膨胀,进行喷出材料的结构。 The present embodiment, the diameter of the nozzle 118 is about 27 (im. 120 to each die corresponding to the respective transducer 124 positioned on the vibrating plate 126. The piezoelectric vibrator 124 each contain elements 124C, 124C, and the clamping piezoelectric element a pair of electrodes 124A, 124B. H2 controls the control unit to the pair of electrodes 124A, 124B and the driving voltage between the pay, liquid is ejected from the corresponding nozzles 118 of the droplet D. material 111 ejected from the nozzle 118 of material volume, in the above 42P1 0P1 (picoliters) varied between less. adjust the shape of the nozzle 118 of the liquid material droplets D 111 is discharged from the nozzle 118 in the Z axis direction. in the present specification, containing a nozzle 118, corresponding lumen 118 and nozzle 120, the vibrator 120 and a corresponding portion of the lumen 124 of the referred to as "discharge portion 127". according to the description, a head portion 114 having the same number of the ejection nozzle 118 and the number 127. ejection portion 127 may have electrothermal converting element, in place of the piezoelectric element. That is, the discharge unit 127 may be converted using a heating element having a thermal expansion so that, for discharging the material structure.

(C、控制部)以下说明控制部112的构成。 (C, control unit) 112 described below of the configuration of the control unit. 如图3所示,控制部112备有:输入缓冲存储器200、存储装置202、处理部204、光源驱动部205、扫描驱动部206、和喷头驱动部208,输入缓冲存储器200和处理部204彼此可通讯连接。 3, the control unit 112 with: 200, 202, the processing unit 204, a light source driving unit 205, the scan driving unit 206, and the head driving unit 208, an input buffer memory 200 and the storage device processing unit input buffer memory 204 to each other communication can be connected. 处理部204、存储装置202、光源驱动部205、扫描驱动部206、 和喷头驱动部208,可利用未图示的母线彼此通讯连接着。 Processing unit 204, a storage device 202, a light source driving unit 205, the scan driving unit 206, and the head driving unit 208, a bus bar (not shown) may be connected to each other communications. 光源驱动部205与光照射装置140可通讯连接着。 The light source driving unit 205 is connected to the light irradiation device 140 can communicate with. 扫描驱动部206 与第1位置控制装置104和第2位置控制装置108彼此可通讯连接着。 Scan driving unit 206 and the first position control device 104 and the second position control 108 may be another apparatus connected to the communication. 同样,喷头驱动部208与喷头114彼此可通讯连接着。 Similarly, the head driving unit 208 and the head 114 may be communicatively connected to each other. 输入缓冲存储器200,由位于液滴喷出装置1外部的外部信息处理装置(未图示),接受用于喷出液体状材料lll之液滴的喷出数据。 Input buffer memory 200, a droplet ejection data for ejecting the liquid material lll by a droplet discharge device is located outside the external information processing apparatus (not shown), to accept. 输入缓冲存储器200将喷出数据供给处理部204,处理部204将喷出数据存储在存储装置202中,图3中,存储装置202是RAM。 The input buffer memory 200 is supplied to the ejection data processing unit 204, the processing unit 204 of the discharge data stored in the storage device 202, FIG. 3, the storage device 202 is a RAM. 处理部204根据存储装置202内的喷出数据,将表示喷嘴118对被喷出部的相对位置数据传送给扫描驱动部206。 The ejection data processing unit 204 in the storage device 202, 118 pairs are transmitted indicating the relative position of the ejection nozzle portion of the data unit 206 to the scan driver. 扫描驱动部206将根据该数据和喷出周期的台面驱动信号,传送给第1位置控制装置104和第2 位置控制装置108。 Scan driving unit 206 according to the driving signal to the data table and the discharge cycle, is transmitted to the first position control device 104 and the second position control device 108. 该结果可改变喷头部103对被喷出部的相对位置。 This result may be to change the relative position of the discharge portion 103 on the nozzle portion. 而处理部204根据存储装置202中存储的喷出数据,将喷出液体状材料111 所需要的喷出信号传送给喷头114。 And the processing unit 204 according to the ejection data stored in the storage means 202, the liquid material discharged from the discharge signal 111 is transmitted to the head 114 required. 其结果是从喷头114中对应的喷嘴118 喷出液体状材料111的液滴D。 As a result, the nozzle 118 is ejected liquid material 111 corresponding to the droplet from the nozzle 114 D. 另外,处理部204根据存储装置202内的喷出数据,使光照射装置140处于接通和断开的任一状态,具体讲,是处理部204将呈现接通或断开状态的各个信号传送给光源驱动部205。 Further, the processing unit 204 according to the ejection data in the storage device 202, the light irradiation device 140 is turned on and off according to any one state, specifically, each signal processing unit is rendered ON or OFF state transmission 204 a light source driving portion 205. 控制部112是含有CPU、 ROM、 RAM、母线的计算机。 A control unit 112 containing a CPU, ROM, RAM, bus computer. 因此,控制部112的上述功能,由计算机运行的软件程序实现。 Thus, the function control unit 112, the software program executed by a computer implemented. 当然,控制部112 也可由专用的电路(硬件)实现。 Of course, the control unit 112 may be a dedicated circuit (hardware). (D、液体状材料)上述的所谓"液体状材料111"是指从喷头114的喷嘴118,以液滴D喷出具有粘度的材料。 (D, liquid-like material) The so-called "liquid material 111" refers to a nozzle 114 from the nozzle 118 to eject liquid droplet D material having viscosity. 在此,液体状材料111不管是水性的还是油性的, 只要具有能从喷嘴118喷出的流动性(粘度)就足以,即使混入固体物质,作为整体是流动体即可。 Here, the liquid material 111, whether aqueous or oily, as long as it is ejected from the nozzle 118 flowability (viscosity) is sufficient, even if mixed with solid material, a flow body as a whole can. 液体状材料111的粘度最好为1 mpa.s以上50mpa.s以下。 Viscosity liquid-like material 111 is preferably less than 1 mpa.s 50mpa.s less. 粘度在lmpa.s以上时,喷出液体状材料111的液滴D时, 喷嘴118的周边部分难以被液体状材料111污染。 When the viscosity at lmpa.s above, liquid droplets D discharged material 111, 118 is the peripheral portion of the nozzle 111 is difficult to be contaminated material in liquid form. 而粘度在50mpa.s以下时,喷嘴118的堵塞频率很小,因此能实现圆满的液滴D的喷出。 When the viscosity 50mpa.s or less, the frequency of clogging of the nozzle 118 is small, it is possible to achieve successful discharge droplet D. 下述的导电性材料8A、 15A (图4 (d)、图7 (c))是上述液体状材料111的一种。 8A conductive material following, 15A (FIG. 4 (d), FIG. 7 (c)) is one of the foregoing liquid material 111. 本实施方式中的导电性材料8A、 15A,含有平均粒径为10nm的银粒子和分散剂。 The conductive material of the present embodiment 8A, 15A, containing silver particles and a dispersant to an average particle diameter of 10nm. 这样,在导电性材料8A、 15A中,银粒子稳定地分散在分散剂中。 Thus, the conductive material 8A, 15A, the silver particles are stably dispersed in the dispersant. 而且,银粒子最好用涂覆剂被覆。 Further, the silver particles are preferably coated with a coating agent. 该涂覆剂是可在银原子上配位的化合物。 The coating agent is a coordination compound in the silver atoms. 作为分散剂(或溶剂),只要能分散银粒子等导电性微粒子,而不产生凝聚的就可以,没有特殊限定。 The dispersant (or solvents), as long as the conductive particles can be dispersed silver particles and the like, can be agglomerated without producing, not particularly limited. 例如,除水外,示例有甲醇、乙醇、 丙醇、丁醇等醇类、正庚烷、正辛烷、癸烷、十二垸、十四烷、甲苯、 二甲苯、丙基甲苯、杜烯、茚、二戊烯、四氢萘、十氢萘、环己苯等烃类化合物;乙二醇二甲醚、乙二醇二乙醚、乙二醇甲基乙醚、二甘醇二甲醚、二甘醇二乙醚、二甘醇甲基乙醚、1,2-二甲氧基乙垸、二(2-甲氧基乙基)醚、P-二瞎烷等醚类化合物、进而有丙烯碳酸酯、Y-丁内酯、N-甲基-2-吡咯烷酮、二甲基甲酰胺,二甲基亚砜、环己酮等极性化合物。 For example, in addition to water, examples include methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, dodecane embankment, tetradecane, toluene, xylene, toluene, propyl, DU , indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexyl benzene hydrocarbons; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ether, diethylene glycol dimethyl ether , diethylene glycol diethyl ether, diethylene glycol methyl ether, 1,2-dimethoxyethane embankment, bis (2-methoxyethyl) ether, P- two blind and ethers such as dioxane, propylene and further polar compounds carbonate, Y- -butyrolactone, N- methyl-2-pyrrolidone, dimethyl formamide, dimethyl sulfoxide, and cyclohexanone. 这些中,就导电性微粒子的分散性和分散液的稳定性,对液滴喷出法适用的难易度而言,最好是水、醇类、烃类化合物、醚类化合物,更好的分散剂,有水,烃类化合物。 Among these, the conductive fine particles on the stability of dispersibility and dispersion, suitable for the ease of the liquid droplet discharging method, preferably water, alcohols, hydrocarbon compounds, ether compounds, better dispersing agents, water, hydrocarbons. 平均粒径为1〜100nm的粒子,记作"纳米粒子"。 The average particle diameter of the particle 1~100nm, referred to as "nanoparticles." 根据这种记述, 导电性材料8A、 15A含有银的纳米粒子。 According to this description, the conductive material 8A, 15A containing silver nanoparticles. 下述的绝缘材料7A、 9A、 IIA、 17A也都是液体状的材料111。 The following insulating materials 7A, 9A, IIA, 17A are also liquid material 111. 这样,绝缘材料7A、 9A、 IIA、 17A含有光固化性材料。 Thus, the insulating material 7A, 9A, IIA, 17A containing photocurable material. 具体讲,本实施方式的光固化性材料含有光聚合引发剂、丙烯酸单体和/或低聚物。 Specifically, the photocurable material of the present embodiment contains a photopolymerization initiator, an acrylic monomer and / or oligomer. 在本实施方式中,根据工艺要求,丙烯类感光性树脂记作"第1光固化性材料"、"第2光固化性材料"、和"第3光固化性材料"。 In the present embodiment, the process according to the requirements, the propylene-based photosensitive resin is referred to as a "first light-curable material", "second photocurable material" and "third photocurable material." 这样,本实施方式中,"第1光固化性材料"、"第2光固化性材料"、和"第3光固化性材料"是相同的。 Thus, in this embodiment, the "first photocurable material", "second photocurable material" and "third photocurable material" are the same. 一般讲,本发明的"光固化性材料"含有溶剂和溶解在溶剂中的树 Generally speaking, "photocurable material" of the present invention containing a solvent and dissolved in the solvent tree

脂。 fat. 在此,这种情况的"光固化性材料",也可以含有其自身感光而提高聚合度的树脂,或者,也可以含有树脂和引发该树脂固化的光聚合引发剂。 In this case the "photocurable material", itself may also contain a photosensitive resin to improve the degree of polymerization, or may contain a resin and curing the resin initiate photopolymerization initiator. 当然可以取代这种形态,本发明的"光固化性材料",也可以含有进行光聚合,可产生不溶的绝缘树脂的单体和引发该单体光聚合的光聚合引发剂。 Of course, this form can be substituted, "photocurable material" of the present invention may contain a photopolymerizable monomer insulating resin insoluble monomer may be generated and the photopolymerization initiator photopolymerization initiator. 但是,这种情况的"光固化性材料",其单体自身若含有光官能基时,也可不含有光聚合引发剂。 However, in this case "photocurable material" which contains a light monomer itself if the functional group may not contain a photopolymerization initiator. 以下对利用本实施方式多层构造形成方法的配线基板制造方法进行说明。 Hereinafter, the method of the wiring substrate manufacturing method of forming the multilayer structure of the present embodiment will be described. (E、制造方法)首先,用UV洗净基板10A的一个表面S。 (E, Manufacturing Method) First, the substrate 10A is cleaned with a UV surface S. 通过UV清洗,不仅洗净表面S,而且可使表面S对下述液体状绝缘材料7A呈现出适宜的亲液性。 By UV cleaning, cleaning not only the surface S, but also make the surface S of the following liquid insulating material 7A exhibits appropriate lyophilic. 由此,本实施方式中,UV清洗后的表面S成为上述的被喷出部和被涂布部。 Thus, in this embodiment, after the UV cleaning the surface S becomes above the discharge portion and the coated portion. 以下如图4 (a)所示,使用液滴喷出装置1在整个表面S上形成绝缘材料层7B。 The following FIG. 4 (a), the droplet ejection apparatus 1 is formed of insulating material on the entire surface of the layer 7B S. 具体是,首先,将基板10A在液滴喷出装置1中台面106 上定位。 Specifically, first, the substrate 10A in the liquid droplet ejection apparatus 1 of the mesa 106 is positioned. 这样一来,液滴喷出装置l,将喷嘴118对表面S的相对位置改二维地进行变化。 Thus, the droplet discharge device L, the nozzle 118 to change the relative position of the two-dimensional surface S varies. (即,X轴方向和Y轴方向)。 (I.e., X-axis direction and the Y-axis direction). 这样,液滴喷出装置1 根据第1喷出数据,以所定的周期,从喷嘴118向表面S喷出液体状绝缘材料7A的液滴D。 Thus, the discharge liquid droplet ejection apparatus 1 according to the first data to a predetermined period, the liquid droplet discharge 7A-shaped insulating material from the nozzle 118 toward the surface S D. 这样一来,在跨整个表面S上,多个液滴D以所定的间距弹落并湿润扩展。 Thus, the entire surface in a cross-S, a plurality of droplets at a predetermined pitch D of the landing and wet expansion. 弹落的多个液滴D湿润扩展时,得到覆盖S 表面的绝缘材料层7B。 A plurality of droplets D of the landing expanded when wet, to give an insulating material layer 7B to cover the surface S. 设定喷出绝缘材料7A的液滴D的体积和数量, 使下述固化工序后得到的绝缘层7 (图4 (c))厚度达到约10pm。 After setting 7A insulating material discharged droplet D volume and number, obtained by the following step of curing the insulating layer 7 (FIG. 4 (c)) a thickness of about 10pm. 另外,图4示出了基板10A的XY截面。 Further, FIG. 4 shows a cross section of XY substrate 10A. 本实施方式中,将基板10A 和基板IOA上一个以上的层概括起来记作"基板IOB"。 In the present embodiment, one or more layers on a substrate and the substrate 10A summed up IOA referred to as "substrate lOBs." 接着,如图4 (b)和(c)所示,使得到的绝缘材料层7B固化,形成绝缘层7。 Next, FIG. 4 (b) and (c), the insulating material layer was cured 7B, an insulating layer 7 is formed. 具体讲,向绝缘材料层7B,由光照射装置140向绝缘材料层7B照射约60秒钟(sec)具有属于紫外线区域的第1波长光,得到绝缘层7。 Specifically, a first light having a wavelength belonging to the ultraviolet region of the insulating material layer 7B, the light irradiation device 140 7B is irradiated to the insulating material layer for about 60 seconds (sec), the insulating layer 7 is obtained. 本实施方式中,向绝缘材料层7B照射的光波长为365nm。 In the present embodiment, the wavelength of light is irradiated to the insulating material layer 7B is 365nm. 在形成下述导电性材料层8B图案(图4 (d))之前,由于使成为其 Described below prior to forming the conductive material layer pattern 8B (FIG. 4 (d)), since the become

基底的绝缘材料层7B固化,所以在导电性材料层8B的图案中不会产生断线。 7B insulating material layer is cured substrate, breakage is not generated in the conductive material layer pattern. 8B. 接着,如图4 (d)所示,使用液滴喷出装置2,在绝缘层7上形成导电性材料层8B的图案。 Next, as shown in FIG 4 (d), the liquid ejection apparatus 2, the conductive material layer 8B is formed on the insulating layer pattern 7. 具体讲,首先在液滴喷出装置2的台面106上将基板10A定位。 Specifically, first, the droplet 106 on a substrate table 10A positioning two discharge devices. 这样,液滴喷出装置2将喷嘴118对绝缘层7表面的相对位置二维地进行变化。 Thus, the droplet discharge unit 2 insulating layer 7 nozzles 118 a relative position of the two-dimensional ground surface changes. 这样,液滴喷出装置2根据第2喷出数据, 喷嘴118每次到达与导电性材料层8B图案相对应的位置时,从喷嘴118 向着绝缘层7的表面喷出液体状导电性材料8A的液滴D。 In this way, the droplet ejection apparatus according to the second ejection data, each nozzle 118 reaches the conductive material layer corresponding to the pattern position 8B, toward the surface of the insulating layer 7 of liquid discharged from the nozzle 8A conductive material 118 droplet D. 这样一来,弹落在绝缘层7上的多个液滴D进行湿润扩展。 Thus, a plurality of droplet D shell landed on the insulating layer 7 for wet expansion. 当弹落的多个液滴D进行湿润扩展时,在绝缘层7上形成导电性材料层8B的图案。 When a plurality of the landing liquid droplet D in wet expansion, the conductive material layer 8B is formed on the insulating layer pattern 7. 而且,设定喷出导电性材料8A的液滴D的体积和数量,使下述加热工序后得到的导电层8 (图5 (b))的厚度达到约4pm。 Moreover, setting the volume and number of droplets D discharged conductive material. 8A, the conductive layer having the following thickness obtained after the heating step (FIG. 5 (b)) of up to about 8 4pm. 本实施方式的液滴喷出装置2与本发明的"第1液滴喷出装置"相对应。 The droplet ejection apparatus of the present embodiment 2 and the embodiment of "the first droplet ejection apparatus 1" according to the present invention, respectively. 因此,绝缘层7的表面是本发明的"物体表面"的一例。 Thus, the surface of the insulating layer 7 is an example of "object surface" of the present invention. 接着,如图5 (a)所示,对导电性材料层8B的图案进行活化,形成图5 (b)所示的导电层8的图案。 Next, FIG. 5 (a), the conductive material layer pattern 8B is activated, is formed in FIG. 5 (b) patterning the conductive layer 8 shown in FIG. 具体是使用净化加热器,在15(TC下, 对导电性材料层8B的图案烧成(加热)30分钟(min)。这样,导电性材料层8B中的银粒子被烧结或融着,得到导电层8的图案。本实施方式中,将导电层8的图案记作"配线图案25 (或导电图案)"。图5 (a)和(b)中示出了基体10B的YZ截面。这样在本实施方式中,在设置覆盖绝缘层7和配线图案25的绝缘图案ll (下述)之前,预先烧成导电性材料层8B而形成导电层8。这样, 导电层8受到因绝缘材料图案9B固化收縮产生的应力影响,而变形的可能性会更低。这是因为绝缘层7和导电层8之间的密接力强于绝缘层7 和导电性材料层8B (活性化前的导电层8)之间的密接力。另外,配线图案25位于由丙烯树脂形成的绝缘层7上。由丙烯树脂形成的绝缘层7起到了将聚酰亚胺形成的基板10A和由银形成的配线图案25密接的功能,因此本实施方式中的配线图 Specific purified using a heater, in (the TC 15, the conductive material layer pattern 8B is fired (heated) for 30 minutes (min). Thus, the silver particles in the conductive material layer 8B are sintered or fused with, to give pattern of the conductive layer 8. in the present embodiment, the pattern of the conductive layer 8 is referred to as "25 (or conductive pattern) of the wiring pattern". FIG. 5 (a) and (b) shows a YZ cross section of the base 10B. Thus, in this embodiment, it is provided to cover the insulating pattern before LL (described below) of the insulating layer 7 and the wiring pattern 25, a pre-baked to form a conductive material layer 8B conductive layer 8. in this way, by insulating the conductive layer 8 is subjected to curing the pattern material 9B shrinkage stress impact, and the possibility of deformation will be lower. this is because the insulating layer 7 and the insulating layer 7 strong 8B (active material and the conductive layer before the adhesion between the conductive layer 8 adhesion between the conductive layer 8). Further, the wiring pattern 25 of the insulating layer is formed of an acrylic resin 7 on the insulating resin layer 7 made of a propylene played substrate 10A formed of polyimide and formed of silver the adhesion of the wiring pattern 25 functions, wiring diagram of the present embodiment described thus 案25难以剥离。如图5 (c)所示,配线图案25含有配线25A、配线25B、和配线25C。-配线25A、 25B、 25C任何一个的形状都呈条状。这些配线25A、 25B、 Case 25 is difficult to peel off. FIG. 5 (c), the wiring pattern 25 comprising lines 25A, 25B wiring, and the wiring 25C.- wirings 25A, 25B, 25C of any one stripe shape were tested. These wiring 25A, 25B,

25C各自的宽度约为50pm。 25C each width of about 50pm. 更具体讲,这些配线25A、 25B、 25C分别位于所谓"全膜"的绝缘层7的一部分上。 More specifically, these lines 25A, 25B, 25C are located on a portion of the so-called "full film" in the insulating layer 7. 即,这些配线25A、 25B、 25C 都位于大致相同水平的表面L1上。 That is, the wirings 25A, 25B, 25C are located on substantially the same level surface L1. 是,这些配线25A、 25B、 25C中, 任何2个配线在表面L1上彼此成物理分离。 These lines 25A, 25B, 25C, any two lines on the surface to be physically separated from each other L1. 另外,根据下述工序,配线25A和配线25B应是彼此电连接的配线。 Further, according to the following step, the wiring 25A and the wiring 25B electric wiring should be connected to each other. 另一方面,配线25C应是与配线25A和配线25B中任何一个成为绝缘的配线。 On the other hand, the wiring should be 25C and the wiring lines 25A 25B, any one of an insulating wiring. 图5 (c)中示出了基体10B的XY平面。 FIG. 5 (c) shows the XY plane of the substrate 10B. 本实施方式中,端子形成区域18A设定在配线25A上,端子形成区域18B设定在配线25B上。 The present embodiment, the terminal region is formed on the wiring 18A is set 25A, 18B is set terminal formed on the wiring region 25B. 端子形成区域18A、 18B是以后设置导电端子的位置。 Terminal formation regions 18A, 18B is provided after the conductive terminal position. 而且,基底区域19A位于以使围绕着端子形成区域18A,而基底区域19B位于以使围绕着端子形成区域18B。 Moreover, the base region 19A is located so as to form around the terminal regions 18A, 19B and positioned such that the base region surrounding the terminal forming region 18B. 接着,如图6 (a)所示,使用液滴喷出装置3,在基底区域19A、 19B上分别设置绝缘材料图案9B。 Next, FIG. 6 (a), the liquid ejection device 3, the insulating material pattern 9B are disposed on the base area 19A, 19B. 首先,将基板10A在液滴喷出装置3的台面106上定位。 First, the substrate 10A in the droplet discharge means 106 on the table 3 is positioned. 这样一来, 液滴喷出装置3,使喷嘴118对基体10B表面的相对位置变成了二维的。 Thus, the droplet discharge device 3, the nozzle 118 into a two-dimensional relative position of the surface of the substrate 10B. 这样,液滴喷出装置3根据第3喷出数据,在喷嘴118每次到达与基底区域19A、 19B相对应的位置时,从喷嘴118向基底区域19A、 19B喷出液体状绝缘材料9A的液滴。 Thus, the discharge liquid droplet ejection apparatus according to the third data 3, when the nozzle position 118 and the substrate region 19A, 19B each corresponding to the arrival of an insulating material liquid discharged from the nozzle 118 toward the substrate 9A region 19A, 19B of droplets. 这样,多个液滴D弹落在基底区域19A、 19B 上,并润湿扩展。 Thus, a plurality of base region falling droplets D latch. 19A, 19B on, and the wetting and spreading. 当弹落的多个液滴D润湿扩展时,分别在基底区域19A、 19B上形成绝缘材料图案9B。 When a plurality of the landing liquid droplet wets and spreads D, respectively, in the base region 19A, 9B formed on the insulating material pattern 19B. 本实施方式的液滴喷出装置3与本发明的"第2液滴喷出装置"相对应。 Droplet discharge apparatus of the present embodiment is 3 and "second droplet ejection apparatus" of the present invention, respectively. 在此,基底区域19A、 19B是银形成的配线图案25上的表面,基底区域19A、 19B对绝缘材料9A呈疏液性。 Here, the substrate region 19A, 19B on the surface 25 of the wiring pattern formed of silver, base region 19A, 19B of the insulating material 9A as a liquid-repellent. 为此,弹落在基底区域19A、 19B上的弹落绝缘材料9A的液滴D湿润扩展的程度很小。 For this purpose, the base shell landed area. 19A, the extent of the landing insulating material 9A wet droplet D on small extension 19B. 为此,基底区域19A、 19B适宜用喷墨法形成通孔的形状。 For this reason, the base region 19A, 19B is suitably shaped through hole is formed by an ink jet method. 接着,如图6 (b)和(c)所示,使2个绝缘材料图案9B固化,形成2个绝缘图案9。 Next, FIG. 6 (b) and (c), the two insulating material pattern 9B cured to form an insulating pattern 2 9. 具体讲,由光照射装置140向绝缘材料图案9B照射约60秒钟具有属于紫外区域的第1波长光,得到绝缘图案9。 Specifically, the irradiation light irradiating means 9B insulating material pattern 140 has a first wavelength of light belonging to the ultraviolet region of about 60 seconds to obtain a pattern of insulation 9. 本实施方式中,向绝缘材料图案9B照射的光波长为365nm。 In the present embodiment, the wavelength of light irradiating the insulating material pattern 9B is 365nm. 这样,2个绝缘图案9的内侧分别形成通孔40A、 40B。 Thus, two inner insulating pattern 9 are formed in the through holes 40A, 40B. 艮P, 2个绝缘图案9分别使通孔40A、 權镶边。 Gen P, 2 of insulating pattern 9 respectively through hole 40A, the right edge. 形成绝缘图案9后,如图6 (d)所示,将基底区域20形成亲液化。 After forming the insulating pattern 9, as shown in FIG 6 (d), a base region 20 formed in the lyophilic. 在处,所说的基底区域20是与基底区域19A、 19B连接,同时又围绕着基底区域19A、 19B的区域。 At said base region and the base region 20 is 19A, 19B are connected, while surrounding the base region. 19A, 19B of the region. 或者,基底区域20既不是基底区域19A、 19B,又不是端子形成区域18A、 18B的表面。 Alternatively, the base region 20 is neither a base region 19A, 19B, 18A region of the surface are not, 18B of the terminal is formed. 本实施方式中,基底区域20,由一部分配线图案25的表面和一部分绝缘层7的表面构成。 The present embodiment, the substrate region 20, composed of the surface portion of the surface of the wiring pattern 25 and a portion of the insulating layer 7. 在将基底区域20形成亲液化时,具体是向基底区域20的表面均匀照射约60秒与上述第1波长不同的第2波长光。 When the substrate 20 is formed lyophilic region, particularly to the uniform illumination of the surface area of ​​the substrate 20 the wavelength of light for about 60 seconds with the above-described first wavelength different from the first. 这样一来,基底区域20 的一部分,即绝缘层7的表面对下述液体状绝缘材料11A (图7 (a))呈现出亲液性。 Thus, a portion of the base region 20, i.e., on the surface of the insulating layer 7 of insulating material is a liquid below 11A (FIG. 7 (A)) exhibits lyophilic. 本实施方式中,第2波长为172nm。 In the present embodiment, the second wavelength is 172nm. 表示亲液性程度的指标之一是"接触角"。 It represents one of the indicators lyophilic degree is the "contact angle." 本实施方式中,绝缘材料11A的液滴D与亲液化的绝缘层7表面接触时,液滴D和绝缘层7的表面形成的接触角在20度以下。 In the present embodiment, when the insulating material 11A droplet D surface in contact with the lyophilic insulating layer 7, and the contact angle of the droplet D surface of the insulating layer 7 is formed at 20 degrees or less. 将绝缘层7的表面进行亲液化的理由如下:当经过为获得绝缘层7 的固化工序、为获得绝缘图案9的固化工序、或为获得配线图案25的烧成(加热)工序时,绝缘层7的表面对液体状的绝缘材料11A呈现出疏液性。 The surface of the insulating layer 7 lyophilic following reasons: When the elapsed curing step to obtain the insulating layer 7, a step to obtain a cured insulating pattern 9, or fired to obtain a wiring pattern 25 (heating) step, the insulating a surface insulating layer 7 of liquid material 11A exhibits liquid repellency. 在此,当物体表面呈现疏液性时,很难在宽阔的面积上形成均匀的层。 Here, when the surface is rendered liquid-repellent, it is difficult to form a uniform layer over a broad area. 与其相反,本实施方式中,烧成工序后,由于绝缘层7的表面亲液化,所以绝缘材料11A的液滴湿润扩展程度(亲液性的程度),在整个绝缘层7的表面上再次增大。 In contrast thereto, the present embodiment, after the firing step, since the surface of the insulating layer 7 is lyophilic, the liquid droplet wetting degree of extension 11A of the insulating material (lyophilic degree), the entire upper surface of the insulating layer 7 is increased again Big. 由此,在整个绝缘层7上,能形成表面平坦的绝缘图案ll。 Accordingly, the entire insulating layer 7, a flat surface can be formed of an insulating pattern ll. 接着,使用液滴喷出装置4,在基底区域20上形成绝缘材料图案11B。 Next, the liquid droplet ejection apparatus 4, the insulating material pattern 11B is formed on the base region 20. 具体讲,如图7 (a)所示,首先,确定基板10A在液滴喷出装置4的台面106上的位置。 Specifically, FIG. 7 (a), first, determine the location of the device 106 on the mesa of the substrate 4 in the droplet ejection 10A. 这样一来,液滴喷出装置4使喷嘴118对基底区域20 的相对位置二维地进行变化。 Thus, the droplet discharge device 4 positions the nozzle 118 relative to the base region 20 is two-dimensionally varied. 液滴喷出装置4根据第4喷出数据,在喷嘴118每次到达与绝缘材料图案11B相对应的位置时,由喷嘴118向绝缘层7的表面或配线图案25的表面喷出液体状绝缘材料11A的液滴D。 The droplet ejection apparatus 4 according to the fourth ejection data, each time when the position of the nozzle 118 reaches the insulating material pattern 11B corresponding to the ejection liquid to the surface or the surface of the insulating layer 25 of the wiring pattern 7 by the nozzle 118 the insulating material 11A droplet D. 这样一来,多个液滴D弹落在基底区域20上,并进行湿润扩展。 Thus, a plurality of droplets D projectile falls on the base region 20, and a wet expansion. 当弹落的多个液滴湿润扩展时,在绝缘层7上和配线图案25上形成绝缘材料图案11B。 When a plurality of droplets of the landing wetting expansion, the insulating material pattern 11B is formed on the insulating layer 7 and the wiring pattern 25. 即,得到围绕绝缘图案9的绝缘材料图案11B。 I.e., obtain a pattern of insulating material surrounding the insulating pattern 9 11B. 本实施方式的液滴喷出装置4与本发明的"第3液滴喷出装置"相对应。 The droplet ejection apparatus of the present embodiment 4 "of the droplet discharge device 3" according to the present invention, respectively. 如上所述,通过在前的亲液化工序,绝缘层7的表面对液体状的绝缘材料11A呈现出亲液性。 As described above, the first step of the lyophilic surface of the insulating layer 7 of insulating material 11A exhibits liquid lyophilic. 为此,弹落在绝缘层7的表面上的绝缘材料IIA的液滴D在这些表面上能均匀地湿润扩展。 To this end, the insulating material IIA shell landed droplet D on the surface of the insulating layer 7 can be uniformly spread over the wetting surface. 另外,在第4喷出数据中,设定喷出液滴D的体积和数量,以使绝缘材料图案11B能吸收绝缘层7与位于绝缘层7上的配线图案25形成的阶差(高度约4pm)。 Further, in the fourth ejection data, the set volume and the number of droplets D discharged to the insulating material pattern 11B absorbs the insulating layer 7 and the insulating layer step difference (height of the wiring pattern 725 is formed about 4pm). 由此, 下述的固化工序后得到的绝缘图案11,其表面的整个绝缘图案11上呈平坦状。 Thus, obtained following curing step after an insulating pattern 11, the entire surface of the insulating pattern 11 is flat. 接着,如图7 (b)和(c)所示,使绝缘材料图案11B固化,形成绝缘图案li。 Next, FIG. 7 (b) and (c), the insulating material pattern 11B is cured to form an insulating pattern li. 具体是由光照射装置140向绝缘材料图案11B照射约60秒钟具有属于紫外区域的第1波长的光,得到绝缘图案11。 11B is a particular irradiation light irradiating means to the insulating material pattern 140 has a light belonging to the ultraviolet region of the first wavelength of about 60 seconds to obtain an insulating pattern 11. 本实施方式中, 照射绝缘材科图案11B的光的波长为365nm。 The present embodiment, the wavelength of the light 11B is irradiated to the insulating material pattern Section 365nm. 由于基底区域19A、 19B与基底区域20相接,所以绝缘图案ll也与形成的绝缘图案9相接。 Since the base region 19A, 19B in contact with the base region 20, the insulating pattern ll be in contact with the insulating pattern 9 is formed. 另外,绝缘图案ll的厚度,在绝缘层7上约为l(Hmi,在配线图案25上约为6,。而且,设定液滴喷出装置4形成的液滴D的喷出扫描,以使绝缘图案9的表面和绝缘图案11的表面构成同等水平的表面L3。形成绝缘图案ll后,如图7 (c)所示,使用液滴喷出装置5,用导电性材料15A填满由绝缘图案9镶边的绝缘形的通孔40A、 40B。具体是,首先,液滴喷出装置5将喷嘴118对基体10B的相对位置二维地进行变化。这样,当喷嘴118到达与通孔40A、 40B相对应的位置时,液滴喷出装置5由喷嘴118喷出导电性材料15A的液滴D。喷出的导电性材料15A的液滴D弹落在由通孔40A、 40B露出的导电层8的图案(配线图案25)上。这样,通过填满通孔40A、 40B内足够数量的液滴D弹落在通孔40A、 40B内,如图7 (c)所示,通孔40A、 40B由导电性材料15A填满。本实施方式的液滴喷出装置5与本发明的"第4液滴喷出装置" Further, the thickness of the insulating pattern ll, the insulating layer is about 7 l (Hmi, the wiring pattern 25 is about 6 ,. Further, the scan setting droplet ejection apparatus ejecting droplets D 4 formed, after the pattern surface such that the surface of the insulating pattern 11 and the insulating surface 9 constituting the same level L3. insulating pattern is formed ll, FIG. 7 (c), the liquid ejection apparatus 5, filled with conductive material 15A an insulating shaped through hole 9 trim insulating pattern 40A, 40B. More specifically, first, the droplet discharge device 5 relative position of the nozzles 118 to a two-dimensional matrix 10B is changed. Thus, when the nozzle 118 reaches through droplets the droplet D latch holes 40A, 40B corresponding to the position when the droplet discharge device 5, a conductive material is ejected from the nozzle 15A discharging 118 D. conductive material 15A falls by the through hole 40A, 40B exposing a pattern on the conductive layer 8 (wiring pattern 25). Thus, by filling the through holes 40A, 40B in a sufficient number of falling droplets D projectile through holes 40A, 40B, FIG. 7 (c) shown in FIG. , through holes 40A, 40B is filled with a conductive material 15A. liquid droplet ejection apparatus according to the embodiment 5 of the present invention, "the fourth droplet ejection apparatus" 相对应。 接着,再次使用液滴喷出装置5喷出导电性材料15A的液滴D,在绝缘图案9、 11上形成将2个通孔40A、 40B连接的导电性材料图案15B。这样,将通孔40A、 40B内的导电性材料15A和导电性材料图案15B 进行活化。本实施方式中,如图7 (d)所示,付与热量Q进行加热,对导电性材料15A中的银的微粒子进行烧结或融着。具体是使用净化炉, 150度下,将基体10B加热30分钟。如此活性化的结果,如图8 (a)所示,得到位于这2个通孔40A、 40B内的导电端子41A、 41B,和与导电端子41A、 41B连接的配线图案15。由导电端子41A、 41B和配线图案15,作为配线图案25的一部分的配线25A和配线25B彼此电连接。而配线图案25的一部分的配线25C, 对于配线25A,或对于配线25B保持电绝缘。接着,将绝缘图案9、 11的表面和配线图案15的表面进行亲液化。 具体是向基体10B的表面均匀照射约60秒 , Respectively. Next, again using the 5 liquid droplet ejection apparatus ejecting droplets of the conductive material 15A is D, and the conductive material 2 through holes 40A, 40B connection pattern 15B is formed on the insulating pattern 9, 11. Thus, the through hole 40A, the conductive material 15A and 40B and the conductive material pattern 15B activated. in the present embodiment, as shown in FIG 7 (d), the heating heat Q imparted, the conductive material is silver. 15A sintering or melting the fine particles. in particular the use of purification furnace at 150 degrees and the base 10B heated for 30 minutes. the results of such activity, as shown in FIG 8 (a), the resulting 40A, 40B located in the two through-holes conductive terminals 41A, 41B, and conductive terminals 41A, 41B connected to the wiring pattern 15 by a conductive terminal 41A, 41B and the wiring pattern 15, the wiring 25A and the wiring portion of the wiring pattern 25 are electrically 25B connector while the wiring portion of the wiring pattern 25. 25C, the wiring 25A, or. Subsequently, 9, surfaces 15 and the wiring pattern of the insulating pattern 11 for wiring 25B lyophilic maintain electrical insulation. specific is uniformly irradiated surface of the base 10B is about 60 seconds 上述第2波长的光。这样一来,绝缘图案9、 11的表面和配线图案15的表面,对下述的液体状的绝缘材料17A呈现亲液性。如上述,第2波长为172nm。随后,虽然未图示,但通过使用液滴喷出装置6的喷出工序,形成覆盖绝缘图案9、 11和配线图案15的绝缘材料层。于是,将得到的绝缘材料层固化,形成绝缘层17。具体是由光照射装置140向上述绝缘材料层照射约60秒钟具有属于紫外区域的第1波长的光,得到绝缘层17。 Said second wavelength light. Thus, 9, surfaces 15 and the wiring pattern of the insulating pattern 11, 17A of the insulating material in liquid form exhibits lyophilic below. As described above, the second wavelength of 172 nm. subsequently, although not illustrated, but by using a step of discharging the droplet discharge device 6, and 9 are formed, and the insulating material 11 covering the insulating layer pattern wiring pattern 15. Thus, the insulating material layer was cured to form an insulating 17. the optical layer having a particular part of the first ultraviolet wavelength region by the irradiation light irradiating means to the insulating material layer 140 for about 60 seconds to obtain the insulating layer 17. 本实施方式中,第1波长为365nm,绝缘层17是所谓的满膜。 In the present embodiment, the first wavelength is 365nm, the insulating layer 17 is a so-called full film. 随后,再次用净化炉将基体10B加热,完全进行绝缘层7、绝缘图案9、 11、绝缘层17中的聚合物的聚合反应。 Then, again with purified substrate 10B heating furnace, completely 7, the insulating pattern 9, 11, 17 in the polymerization reaction of the polymer insulating layer insulating layer. 经过以上工序,由基体10B 得到图8 (b)所示的配线基板10。 Through the above steps, the resulting substrate 10B shown in FIG. 8 (b), the wiring board 10. (实施方式2)本实施方式的多层构造形成方法,除了绝缘图案ll的形成方法外, 其他和实施方式1的多层构造形成方法相同。 (Embodiment 2) of the present embodiment is a multilayer structure forming method in addition to the method of forming the insulating pattern ll, and other embodiments of the multilayer structure 1 is formed in the same manner. 为此,对于和实施方式1 的工序和构成相同的部分,为避免重复而省略说明。 For this reason, and embodiments for step 1 and the same parts of the configuration, and description thereof is omitted to avoid repetition. 首先,如实施方式l中说明的,在配线图案25上的基底区域19A、 19B上,分别设置绝缘图案9 (图6 (a)〜(c))。 First, as described in Embodiment l, the wiring pattern 19A on the base region 25, 19B, 9 are provided an insulating pattern (FIG. 6 (a) ~ (c)). 随后,向基底区域20 进行光照射,使绝缘层7的表面亲液化(图6 (d))。 Subsequently, the light irradiation area of ​​the substrate 20, the surface of the lyophilic insulating layer 7 (FIG. 6 (d)). 用于形成绝缘图案的喷出工序,像通常对平坦表面进行的那样,进行以下工序。 Discharging step for forming the insulating pattern, typically a flat surface as above, the following step. 如图9 (a)所示,通过喷出工序和固化工序,在部分绝缘层7上的没有配线图案25的部分内,设置绝缘图案51。 FIG 9 (a), by discharging step and the curing step, in the wiring pattern 25 is not part of the upper portion of the insulating layer 7, the insulating pattern 51 is provided. 设定绝缘图案51的厚度与配线图案25的厚度相同,所以不会由配线图案25产生阶差。 Setting the thickness of the insulating pattern 51 and the wiring pattern 25 of the same thickness, the difference in level is not generated by the wiring pattern 25. g卩,配线图案25和绝缘图案51大致形成同一个水平的表面L2。 g Jie, the wiring pattern 25 and the insulating pattern 51 is formed substantially the same surface level L2. 接着,虽然未图示,但向表面L2照射172nm的光,使表面L2亲液化。 Subsequently, although not shown, the light irradiating the surface of 172nm L2, L2 lyophilic surface. 同样利用喷出工序和固化工序,在表面L2中,没有绝缘图案9和通孔40A、 40B的部分上,设置绝缘图案52。 Also the use of the discharge step and the curing step, the surface L2, no insulating pattern 9 and the through holes 40A, 40B of the upper portion, the insulating pattern 52 is provided. 由此,得到如图9 (b)所示围绕绝缘图案9的绝缘图案52。 Thus, to obtain FIG. 9 (b) surrounding the insulating pattern 52 shown in FIG. 9, the insulating pattern. 设定绝缘图案52的厚度与绝缘图案9的厚度相同,所以绝缘图案52和绝缘图案9大致形成同一个水平的表面L3 。 Setting the thickness of the insulating pattern 52 is the same as the thickness of the insulating pattern 9, the insulating pattern 52 and the insulating pattern forming surface 9 is substantially the same level L3. 以后进行和实施例1 一样的工序,可形成配线基板10。 After the same procedure for Example 1 and the embodiment, the wiring substrate 10 may be formed. 本实施方式的绝缘图案51和绝缘图案52与实施方式1的绝缘图案ll相对应。 Insulating pattern of the present embodiment and the insulating pattern 52 and the insulating pattern embodiment corresponds ll 1 51. 如上述,本实施方式中,经过数次"喷出形成",形成相当于实施方式1的绝缘图案11部分。 As described above, according to the present embodiment, after several "forming discharge", forming part 11 corresponds to Embodiment 1 of the insulating pattern. 所谓"喷出形成"是指利用喷出工序形成材料图案和利用固化工序使材料图案固化。 The so-called "discharge formed" refers to the formation material discharge step, and patterned by using the patterned cured material so that curing step. 只要进行这样的工序,就能在平坦表面上设置绝缘图案。 As long as this step, an insulating pattern can be disposed on the flat surface. 由此,即使是配线图案25的厚度较厚的情况下,也能由绝缘图案很好地覆盖配线图案25的侧面。 Accordingly, even when the thickness of the wiring pattern 25 thicker, can be well covered by the side surface of the wiring pattern 25 of the insulating pattern. 上述工序中,用于形成绝缘图案52的喷出工序进行之前,也可对基底的绝缘图案51,利用光照射进行亲液化工序。 In the above step, before discharging the step for forming the insulating pattern 52 is performed, the pattern may be insulating substrate 51, lyophilic by light irradiation step. (实施方式3)以下对利用本实施方式的多层构造形成方法,制造配线基板的方法进行说明。 (Embodiment 3) The following method for forming a multilayer structure of the present embodiment, a method of manufacturing the wiring board will be described. 首先,准备设有如图10(a)和(b)所示的配线图案25P的基板10A。 First, with FIG. 10 (a) and (b) a wiring pattern of the substrate 10A 25P is shown. 在此,该配线图案25P具有在铜配线的表面上镀金(Au)的构造。 Here, the wiring pattern 25P having a gold plating on the surface of the copper wiring (Au) configuration. 当然, 也可以整个配线图案25P由金(Au)形成。 Of course, the entire wiring pattern 25P may be formed of gold (Au). 本实施方式中,这种配线图 In the present embodiment, the wiring pattern

案25P位于基板10A的表面上。 25P case 10A of the substrate surface. 这样,基板10A的表面是本发明的一例"物体表面"。 Thus, the surface of the substrate 10A is an example of the present invention, "surface of the object." 以下也将基板IOA和基板IOA上的一个以上层总括记作"基体IOB"。 The following will also be more than one layer on the substrate and the substrate IOA IOA collectively referred to as "matrix lOBs." 如图10 (b)所示,配线图案25P含有配线25PA、配线25PB、和配线25PC。 FIG 10 (b), the wiring pattern 25P wiring containing 25pA, wiring 25PB, and the wiring 25PC. 配线25PA、配线25PB、 25PC都具有条状(strip)形状。 Wiring 25PA, wiring 25PB, 25PC having a stripe (Strip) shape. 这些配线25PA、 25PB、 25PC各自的宽度约为50pm。 These lines 25PA, 25PB, each width of about 50pm 25PC. 更具体讲,这些配线25PA、 25PB、 25PC各自位于基板IOA的一部分上。 More specifically, these lines 25PA, 25PB, 25PC each located on a portion of the substrate IOA. 即,这些配线25PA、 25PB 、 25PC都以大致相同的水平位于某表面L1上。 That is, the wirings 25PA, 25PB, 25PC are positioned substantially on a same level surface L1. 但是,这些配线25PA 、 25PB、 25PC中任何2个配线,也在表面L1上彼此物理分离着。 However, these lines 25PA, 25PB, 25PC any two wirings L1 are physically separated from each other on the surface. 根据下述工序,配线25PA和配线25PB彼此是电连接的配线。 According to the following step, the wiring line 25PA and 25PB electric wiring is connected to each other. 另一方面,配线25PC是与配线25PA和配线25PB中任何一个应电绝缘的配线。 On the other hand, the wiring is wiring 25PC 25PA and 25PB any one of the wiring to be electrically insulated wiring. 而且,图10 (b)示出了基体10B的XY平面。 Further, FIG. 10 (b) shows the XY plane of the substrate 10B. 所谓XY平面是指上述X轴方向和Y轴方向的双方呈平行的平面。 The so-called XY-plane refers to both the X-axis direction and the Y-axis direction parallel to the planar. 接着,如图10 (c)和(d)所示,将基板10A的表面和配线图案25P 的表面进行疏液化。 Next, FIG. 10 (c) and (d), the surface of the substrate and the surface wiring pattern 10A 25P is lyophobic. 具体是在基板10A上形成氟烷基硅烷(以下记作FAS) 膜16。 Specifically fluoroalkylsilane is formed on the substrate 10A (hereinafter referred to as FAS) film 16. 更具体讲,将原料化合物(即FAS)的溶液和基体10B放入同一个密闭容器中,室温下放置2〜3天。 More specifically, the starting compound (i.e. FAS) and a solution of the substrate 10B into the same closed vessel, left at room temperature 2 to 3 days. 这样在基板10A表面上和配线图案25P表面上,由有机分子膜形成自组织化膜(即FAS膜16)。 Thus the upper surface of the substrate 10A and the wiring pattern on the surface 25P, self-assembled monolayer (i.e. FAS film 16) is formed of an organic molecular film. 本实施方式中,所述"疏液化的基板IOA表面"的记述,或"疏液化的配线图案25P表面"的记述,是指位于基板10A上或配线图案25P 上的FAS膜16的表面。 In the present embodiment, the description of "IOA lyophobic substrate surface", or "liquid-repellent surface 25P of the wiring pattern," the description, refers to a surface of the substrate 10A FAS film or the wiring pattern 25P 16 . 图10 (c)示出了基板10A的YZ截面。 FIG. 10 (c) shows a YZ cross section of the substrate 10A. 所谓YZ截面是在上述Y轴方向和Z轴方向上平行的面。 YZ section is a so-called parallel in the Y-axis direction and the Z-axis direction of the surface. 再回到图10 (b),本实施方式中,在疏液化的配线25PA的表面上设定有端子形成区域18A,在疏液化的配线25PB表面上设定有端子形成区域18B。 Again to Figure 10 (b), according to the present embodiment, in the liquid repellent surface of a wiring 25PA terminal formation region is set. 18A, set on the surface of the liquid-repellent 25PB a terminal wiring formation region 18B. 端子形成区域18A、 18B是以后设置导电端子的位置。 Terminal formation regions 18A, 18B is provided after the conductive terminal position. 另外, 以围绕着端子形成区域18A的方式、位于基底区域19A,以围绕着端子形成区域18B的方式、位于形成基底区域19B。 Further, around the terminal region 18A is formed, is located in the base region. 19A, in a region around the terminal 18B is formed, is located in the base region 19B are formed. 接着,如图11 (a)所示,使用液滴喷出装置3,分别在基底区域19A、 19B上设置绝缘材料图案9B。 Next, FIG. 11 (a), the liquid ejection apparatus 3, respectively, in the base region 19A is provided on the insulating material pattern 9B 19B. 具体是,首先,将基板10A定位在液滴喷出装置3的台面106上。 Specifically, first, the substrate 10A is positioned on the table 106 of the droplet discharge device 3. 这样一来,液滴喷出装置3将喷嘴118对基体10B表面的相对位置二维地进行变化。 Thus, the droplet discharge device 3 nozzles 118 are two-dimensionally relative position of the surface of the substrate 10B changes. 液滴喷出装置3在喷嘴118每次到达与基底区域19A、 19B 相对应的位置上,由喷嘴118向基底区域19A、 19B喷出液体状绝缘材料9A的液滴D。 In the droplet ejection apparatus 3 each nozzle 118 reaches the substrate area 19A, 19B corresponding to the position of the nozzle 118 to the base region. 19A, 19B discharge droplets of a liquid insulating material 9A D. 这样,在基底区域19A、 19B上弹落多个液滴D后湿润扩展。 Thus, the area on the substrate 19A, 19B of the landing liquid droplet D plurality wet expansion. 当弹落的多个液滴D湿润扩展时,在基底区域19A、 19B上形成绝缘材料图案9B。 When a plurality of droplets D of the landing wet expansion, the insulating material pattern 9B is formed on the base area 19A, 19B. 因此,基底区域19A、 19B是疏液化的配线图案25P的表面,基底区域19A、 19B对绝缘材料9A呈疏液性。 Thus, base region 19A, 19B is the liquid-repellent surface of a wiring pattern 25P, the base region 19A, 19B of the insulating material 9A as a liquid-repellent. 为此,弹落在基底区域19A、 19B上的绝缘材料9A的液滴D,其湿润扩展的程度很小。 For this purpose, the base shell landed area. 19A, an insulating material 9A to 19B on the droplet D, a small degree of moisture expansion. 因此,基底区域19A、 19B适宜用喷墨法形成通孔的形状。 Thus, base region 19A, 19B is suitably shaped through hole is formed by an inkjet method. 接着,如图11 (b)和(c)所示,将2个绝缘材料图案9B固化,形成2个绝缘图案9。 Next, FIG. 11 (b) and (c), the two insulating material pattern 9B cured to form an insulating pattern 2 9. 具体是由光照射装置140向绝缘材料图案9B照射约60秒钟属于紫外线区域的第1波长光,得到绝缘图案9。 Specifically, by a light irradiation means 140 to the wavelength of the light insulating material pattern 9B is irradiated for about 60 seconds in the ultraviolet region belonging to the first, to obtain insulating pattern 9. 本实施方式中, 第1波长为365nm。 In the present embodiment, the first wavelength is 365nm. 这样,2个绝缘图案9的内侧分别形成通孔40A、40B。 Thus, two inner insulating pattern 9 are formed in the through holes 40A, 40B. 即,2个绝缘图案9分别将通孔40A、 40B镶边。 That is, two insulating pattern 9 are through holes 40A, 40B trim. 形成绝缘图案9后,如图ll (d)所示,将基底区域20进行亲液化。 After forming the insulating pattern 9, as shown in FIG ll (d), the base region 20 will be lyophilic. 在此,所谓的基底区域20是与基底区域19A、 19B相接,同时围绕基底区域19A、 19B的区域。 Here, the area of ​​the substrate 20 is a base region 19A, 19B phase, while surrounding the base region. 19A, 19B of the region. 或者,基底区域20既不是基底区域19A、 19B 也不是端子形成区域18A、 18B的表面。 Alternatively, the base region 20 is neither a base region 19A, 19B nor the terminal forming region. 18A, 18B of the surface. 本实施方式中,基底区域20是由配线图案25P的部分表面和基板10A的部分表面构成。 The present embodiment, the substrate region 20 is composed of partial surfaces of the substrate 10A and the wiring pattern portion 25P. 将基底区域20进行亲液化时,具体是向基底区域20的表面均匀地照射约60秒钟属于紫外光区域的第2波长光。 When the substrate lyophilic region 20, specifically a wavelength of light is uniformly irradiated for about 60 seconds, the second belongs to the ultraviolet region of the surface of the base region 20. 这样一来,与基底区域20 对应部分的FAS膜进行分解。 Thus, decomposition and FAS film 20 corresponding to the portion of the base region. 其结果,基底区域20的表面(基板10A 的表面和配线图案25P的表面)露出。 As a result, the surface (the surface 10A of the substrate surface and the wiring pattern 25P) of the base region 20 is exposed. 露出的基底区域20的表面通过该光照射,对下述的绝缘材料11A (图12 (a))呈现出亲液性。 Surface of the base region 20 is exposed by the light irradiation, the insulating material 11A to the following (FIG. 12 (a)) exhibits lyophilic. 本实施方式中,上述第2波长为172nm。 In the present embodiment, the second wavelength is 172nm. 另外,表示亲液性程度的指标之一是"接触角"。 Further, one of the indexes showing the degree of the lyophilic "contact angle." 本实施方式中,绝缘材料11A的液滴D与亲液化的基板10A表面接触时,液滴D与基板10A表面形成的接触角在20度以下。 In the present embodiment, when the insulating material 11A 10A droplet D in contact with the substrate surface lyophilic, the contact angle of the droplet D and the substrate surface 10A formed at 20 degrees or less. 接着,如图12 (a)所示,使用液滴喷出装置4,在基底区域20上 Next, FIG. 12 (a), the liquid ejection apparatus 4, in the base region 20

形成绝缘材料图案11B。 Forming an insulating material pattern 11B. 具体是,首先,在液滴喷出装置4的台面106上定位基板IOA。 Specifically, first, in the droplet discharge device 4 of the mesa 106 is positioned on the substrate IOA. 这样,液滴喷出装置4将喷嘴118对基底区域20的相对位置二维地进行变化。 Thus, the droplet discharge device 4 positions the nozzle 118 relative to the base region 20 is two-dimensionally varied. 于是,液滴喷出装置4,当其喷嘴118每次到达与基底区域20相对应的位置时,由喷嘴向基底区域20 (亲液化的基板10A表面或亲液化的配线图案25P表面)喷出液体状的绝缘材料IIA液滴D。 Thus, the droplet discharge means 4, when its nozzle 118 and the substrate region 20 reaches a position corresponding to each spray from the nozzles 20 (lyophilic surface 25P of the substrate surface 10A of the wiring pattern or lyophilic) area of ​​the substrate the liquid droplet-like insulating material IIA D. 这样弹落在基底区域20上的多个液滴D进行湿润扩展。 Such shell landed droplets D on the substrate a plurality of areas 20 of wet expansion. 当弹落的多个液滴D湿润扩展时,在基板10A上和配线图案25P上形成绝缘材料图案IIB。 When a plurality of droplets D of the landing wet expansion, the insulating material pattern is formed on the substrate 10A and IIB on the wiring pattern 25P. 即,得到围绕绝缘图案9的绝缘材料图案IIB。 I.e., obtain a pattern of insulating material surrounding the insulating pattern 9 IIB. 如上述,基板10A的表面,事先通过上述的亲液化工序,形成对液体状的绝缘材料11A呈现出亲液性。 As described above, the surface of the substrate 10A, in advance by the above lyophilic step of forming the insulating liquid material 11A exhibits lyophilic. 为此,弹落在基板10A表面上的绝缘材料11A的液滴D,能在这些表面上均匀润湿扩展。 To this end, the insulating material 11A shell landed on the surface of the substrate 10A droplet D, can uniformly wet and spread on these surfaces. 喷出数据中设定喷出液滴D的体积和数量,以使绝缘材料图案11B能吸收基板10A与位于基板10A上的配线图案25P形成的阶差(高度约4pm)。 Ejection data set in the volume and number of droplets D discharged to the insulating material pattern 11B can absorb the step difference (a height of about 4pm) substrate positioned on the substrate 10A and 10A formed in the wiring pattern 25P. 为此,下述固化工序后得到的绝缘图案11表面,在整个绝缘图案11上呈平坦状。 To this end, the surface 11 obtained by the following step after curing insulating pattern, is flat insulating pattern 11 on the whole. 接着,如图12 (b)和(c)所示,将绝缘材料图案11B固化,形成绝缘图案U。 Next, FIG. 12 (b) and (c), the insulating material pattern 11B is cured to form an insulating pattern U. 具体是,由光照射装置140向绝缘材料图案11B照射约60 秒钟属于紫外线区域的第1波长光,得到绝缘图案ll。 Specifically, the light irradiation means 140 to a wavelength of light insulating material pattern 11B is irradiated for about 60 seconds in the ultraviolet region belonging to the first, to obtain insulating pattern ll. 本实施方式中, 第1波长为365nm。 In the present embodiment, the first wavelength is 365nm. 由于基底区域19A、 19B与基底区域20相接,所以绝缘图案ll与事先形成的绝缘图案9相接。 Since the base region 19A, 19B in contact with the base region 20, the insulating pattern and the insulating pattern ll 9 previously formed contact. 另外,绝缘图案ll的厚度,在基板10A上约为10pm,在配线图案25P上约为6pm。 Further, the thickness of the insulating pattern ll about 10pm on the substrate 1OA, approximately 6pm on the wiring pattern 25P. 而且,设定通过液滴喷出装置4 形成的液滴D喷出扫描,使绝缘图案9的表面和绝缘图案11的表面构成相同水平的表面L3。 Further, by setting the droplet discharge device 4 is formed droplets D discharged scan, the insulating pattern surfaces 9 and the insulating pattern 11 constituting the surface of the same level L3. 形成绝缘图案II后,如图12 (d)所示,使用液滴喷出装置5,用导电性材料15A填满由绝缘图案9镶边形成的通孔40A、 40B。 After forming the insulating pattern II, FIG. 12 (d), the liquid ejection apparatus 5, filling the through-hole 9 is formed of an insulating striped pattern with a conductive material 15A 40A, 40B. 具体是,首先,在液滴喷出装置5的台面106上定位基板IOA。 Specifically, first, in the droplet discharge device mesas 106 is positioned on substrate 5 IOA. 这样一来,液滴喷出装置5将喷嘴118对基体10B的相对位置二维地进行变化。 Thus, the droplet discharge device 5 nozzles 118 are two-dimensionally relative position of the substrate 10B is changed. 这样,当喷嘴118到达与通孔40A、 40B对应的位置时,液滴喷出装置5由喷嘴118喷出导电性材料15A的液滴D。 Thus, when the nozzle 118 reaches the position corresponding to the through holes 40A, 40B, the droplet of a conductive material 15A droplet discharge device 5 ejected from the nozzle 118 D. 喷出的导电性材料15A 15A discharged conductive material

的液滴D弹落在由通孔40A、 40B露出的配线图案25P上。 Shell landed droplet D, 40B of the wiring pattern is exposed by the through hole 40A 25P. 这样,填满通孔40A、 40B内的足够数量的液滴D弹落在通孔40A、 40B内,如图12 (d)所述,通孔40A、 40B由导电性材料15A填满。 Thus, filling the through-holes 40A, 40B in a sufficient number of falling droplets D projectile through holes 40A, 40B within, FIG. 12 (d) of the through-holes 40A, 40B is filled with a conductive material 15A. 接着,再次用液滴喷出装置5喷出导电性材料15A的液滴D,在绝缘图案9、 11上,形成将2个通孔40A、 40B连接的导电性材料图案15B。 Subsequently, a droplet discharge device 5 again with a conductive material 15A discharged droplet D, on the insulating pattern 9, 11, to form two through-holes 40A, 40B connected to the conductive material pattern 15B. 同样,对通孔40A、40B内的导电性材料15A和导电性材料图案15B 进行活化。 Similarly, the through holes 40A, 15A and the conductive material in the conductive material pattern 40B 15B activation. 本实施方式中,如图13 (a)所示,付与热量Q进行加热,对导电性材料15A中的银的纳米粒子进行烧结或融着。 In the present embodiment, FIG. 13 (a), the payment is heated with heat Q, nanoparticles of a conductive material 15A silver sintering or fusion with. 具体是使用净化炉, 在150度下将基体10B加热30分钟。 Specific purified using a furnace at 150 degrees to the base 10B heated for 30 minutes. 这样活化的结果,如图13 (b)所示,得到位于2个通孔40A、 40B各自内的导电端子41A、 41B和与导电端子41A、 41B连接的配线图案15。 Such activation results in FIG. 13 (b), the two through-holes positioned to give 40A, 40B of the respective conductive contacts 41A, 41B and the conductive terminals 41A, 41B connected to the wiring pattern 15. 通过导电端子41A、 41B和配线图案15,将配线图案25P的一部分配线25PA和配线25PB彼此电连接。 Through the conductive terminals 41A, 41B and the wiring pattern 15, the wiring part of the wiring pattern of 25P 25PA and 25PB wirings electrically connected to each other. 而作为配线图案25P的一部分的配线25PC ,既对配线25PA又对配线25PB保持电绝缘。 As part of the wiring of the wiring pattern 25P 25PC, both wiring and electrically insulated wiring 25PB 25PA. 以下,虽然未图示,但将绝缘图案9、 11的表面和配线图案15的表面进行亲液化。 The following, although not shown, the surfaces 15 and the wiring pattern 9 of the insulating pattern 11 is lyophilic. 具体是向基体10B的表面均匀照射约60秒钟属于紫外区域的第2波长光。 In particular to the group belonging to the second wavelength of light for about 60 seconds in the ultraviolet region of uniform illumination of the surface 10B thereof. 这样,绝缘图案9、 11的表面和配线图案15的表面, 对下述的液体状绝缘材料17A呈现亲液性。 Thus, the insulating pattern 9, the wiring pattern 15, and surfaces 11, 17A of the liquid insulating material is presented below lyophilic. 上述第2波长为172nm。 Said second wavelength is 172nm. 随后,虽然未图示,但通过利用液滴喷出装置6进行液体状绝缘材料17A的喷出工序,形成覆盖绝缘图案9、 11和配线图案15的绝缘材料层。 Subsequently, although not shown, a droplet discharge device 6 by using the liquid discharging step-shaped insulating material 17A, and 9 is formed, and the insulating material layer 11 covers the wiring pattern 15 of the insulating pattern. 同样,使得到的绝缘材料层固化,形成绝缘层17。 Also, the insulating layer is cured material obtained, an insulating layer 17 is formed. 具体是,由光照射装置140向上述绝缘材料层照射约60秒种属于紫外线区域的第1波长光,得到绝缘层。 Specifically, the first wavelength belonging to the ultraviolet light for about 60 seconds region illuminated by the light irradiation means to the insulating material layer 140, insulating layer was obtained. 本实施方式中,第l波长为365nm。 In the present embodiment, the first wavelength l of 365nm. 绝缘层17是所谓的满膜。 Insulating layer 17 is a so-called full film. 随后,再次使用净化炉加热基体IOB,完全进行绝缘图案9、 11、绝缘层17中的聚合物的聚合反应。 Subsequently, purified again using a furnace heating the substrate lOBs, completely insulated patterns 9, 11, 17 in the polymerization reaction of the polymer insulating layer. 经过以上工序,由基体10B得到图13 (c)所示的配线基板10。 Through the above steps, the resulting substrate 10B shown in FIG. 13 (c), the wiring board 10. (实施方式4) 形成方法,除了绝缘图案ll的形成方法外, 其他和实施方式3的多层构造形成方法基本相同。 (Embodiment 4) forming method, in addition to the method of forming the insulating pattern of ll, and other embodiments of the method for forming a multilayer structure 3 is substantially the same. 为此,对于和实施方式3中工序和构成一样的部分,为避免重复省去说明。 For this reason, and for the third embodiment and the step portion constituting the same, description is omitted to avoid repetition. 首先,如实施方式3中说明的那样,在位于疏液化配线图案25P表面上的基底区域19A、 19B上分别设置绝缘图案9 (图ll (a)〜(c))。 First, as explained in the embodiment 3 embodiment, the base region 19A is located on the liquid repellent surface of a wiring pattern 25P, 9 are provided (FIG. Ll (a) ~ (c)) on the insulating pattern 19B. 随后,向基底区域20进行光照射,使基板10A的表面和配线图案25P的表面进行亲液化(图ll (d))。 Subsequently, the light irradiation area of ​​the substrate 20, the surface of the surface and the wiring pattern 25P lyophilic substrate 10A (FIG. Ll (d)). 为形成绝缘图案的喷出工序,像通常对待平坦表面那样,进行以下工序。 Discharging step to form an insulating pattern, as is usually treated as a flat surface, the following step. 如图14 (a)所示,通过喷出工序和固化工序,在亲液化的部分基板10A表面中没有配线图案25P的部分上,设置绝缘图案51。 FIG 14 (a), by discharging step and the curing step, no portion of the wiring pattern 25P, the insulating pattern 51 is provided in a portion 10A of the substrate surface lyophilic. 由于设定绝缘图案51的厚度与配线图案25P的厚度相同,所以不会由配线图案25P 产生阶差。 Since setting the thickness of the insulating pattern is the same as the thickness of the wiring pattern 51 of 25P, the step difference is not generated by the wiring pattern 25P. 即,配线图案25P和绝缘图案51大致形成同一水平的表面L2。 That is, the wiring pattern and the insulating pattern 25P surface 51 is formed substantially the same level L2. 接着,如图14 (b)所示,向基体10B的表面照射约60秒钟172nm 的光,使基体10B的表面进行亲液化。 Next, FIG. 14 (b), the surface of the light 10B is irradiated for about 60 seconds 172nm substrate, the surface of the substrate lyophilic 10B. 同样,通过喷出工序和固化工序,在亲液化表面L2中,既没有绝缘图案9也没有通孔40A、 40B部分上,设置绝缘图案52。 Also, by discharging step and the curing step, the lyophilic surface L2, the insulating pattern 9 neither on nor 40A, 40B of the via hole, the insulating pattern 52 is provided. 这样,如图14 (c)所示,得到围绕绝缘图案9的绝缘图案52。 Thus, FIG. 14 (c), the insulating pattern obtained around the insulating pattern 9 52. 由于绝缘图案52的厚度设定为与绝缘图案9的厚度相同,所以绝缘图案52和绝缘图案9大致形成同一水平的表面L3。 Since the thickness of the insulating pattern 52 is set to the same thickness of the insulating pattern 9, the insulating pattern 52 and the insulating pattern forming surface 9 is substantially the same level L3. 以后通过进行和实施方式3 —样的工序,可形成配线基板10。 After 3 and embodiments by - step-like wiring substrate 10 may be formed. 本实施方式的绝缘图案51和绝缘图案52与实施方式3的绝缘图案ll相对应。 Insulating pattern of the present embodiment and the insulating pattern 52 and the insulating pattern ll 3 embodiment corresponds to 51. 这样,本实施方式中,经过多次"喷出形成",形成相当于实施方式3的绝缘图案11的部分。 Thus, in this embodiment, after several "forming discharge", a portion corresponding to Embodiment 3 of the insulation pattern 11 is formed. 所谓"喷出形成"是指通过喷出工序形成材料图案和通过固化工序使材料图案固化的组合。 The so-called "discharge form" means a material formed by patterning step and the discharging step by curing curable composition of the material pattern. 只要进行这样的工序,就能在平坦的表面上设置绝缘图案。 As long as this step, an insulating pattern can be disposed on a flat surface. 为此, 即使配线图案25P的厚度较厚,仍能很好地利用绝缘图案被覆配线图案25P的侧面。 For this reason, even if the thicker wiring pattern 25P, can still make good use of the insulating pattern coated side of the wiring pattern 25P. (实施方式5)接着,如图15所示,将液晶面板32和半导体元件26安装在实施方式1〜4中任一个配线基板10上。 (Embodiment 5) Next, as shown in FIG. 15, the liquid crystal panel 32 and the semiconductor element 26 is mounted on any of the embodiments 1 ~ 4 embodiment a wiring substrate 10. 具体讲,在配线基板10的一部分上形成导电层8的图案部分,既不覆盖绝缘图案9、 11也不覆盖绝缘层17。 Specifically, the pattern portions of the conductive layer 8 is formed on a part of the wiring substrate 10, neither the pattern of the insulating cover 9, 11 does not cover the insulating layer 17. 同样,将液晶面板32的对应的焊盘(pad)或半导体元件26的对应的焊盘与露出的导电层8图案适当接合。 Similarly, the liquid crystal panel corresponding to the corresponding pad (pad) 32, or semiconductor element 26 and the pad conductive layer 8 exposed pattern proper engagement. 这样就得到液晶显示装置34。 Thus obtained liquid crystal display device 34. 如上所述,本实施方式的制造方法可适用于液晶显示装置34的制造。 As described above, the manufacturing method of the present embodiment is applicable to liquid crystal display manufacturing apparatus 34. 本实施方式中,半导体元件26是液晶驱动电路。 The present embodiment, the semiconductor element 26 is a liquid crystal driving circuit. 进而,本实施方式的制造方法不仅适用于液晶显示装置34的制造, 也适用于各种电光学装置的制造。 Further, the manufacturing method of the present embodiment is applicable not only to liquid crystal display manufacturing apparatus 34 is also suitable for producing a variety of electro-optical devices. 此处所说的"电光学装置",意思是并不只限定于利用双折射性变化、旋光性变化、光散射性变化等光学特性变化(所谓电光效应)的装置,也包括根据施加的电压信号,发射、发光、透过、或反射光的所有装置。 Herein, the term "electro-optical device", is meant not only limited to the use of the birefringence changes, changes in optical rotation, change in the light scattering properties of the optical apparatus changes like (a so-called electro-optical effect), but also according to the voltage signal applied, emission, light emission, through, or all of means for reflecting light. 具体讲,所谓的电光学装置用语包括液晶显示装置、电致发光显示装置、等离子体显示装置、使用表面传导型电子发射元件的显示面板(SED: Surface-Conduction Electron-Emitter Display)、电场发射显示面板(FED:进而,本实施方式的多层构造形成方法,可适用于各种电子仪器的制造方法。例如,如图16所示,具有电光学装置520的移动电话机500 的制造方法,和如图17所示,具有电光学装置620的个人计算机600的制造方法,也适用本实施方式的制造方法。(变形例1)根据上述实施方式,6个不同的液滴喷出装置1, 2, 3, 4, 5, 6分别喷出绝缘材料7A、导电性材料8A、绝缘材料9A、绝缘材料11A、导电性材料15A、绝缘材料17A。也可以取代这样的构成,由1个液滴喷出装置(例如液滴喷出装置l)喷出所有这些液体状材料。这时,这些液体状材料可从液滴喷出装置1中的各个喷嘴118喷 Specifically, the so-called electro-optical device includes a liquid crystal display device of terms, an electroluminescent display device, plasma display device, a display panel using surface conduction type electron emitting element (SED: Surface-Conduction Electron-Emitter Display), field emission display panel (FED:. Further manufacturing method of a mobile phone, a multilayer structure forming method according to the present embodiment, various methods can be applied to electronic instruments such as shown in Figure 16, having an electro-optical device 520 500, and 17, a method of manufacturing a personal computer 620 having the electro-optical device 600, the manufacturing method of the present embodiment is also applicable. (modification Example 1) according to the embodiment, six different droplet ejection apparatus 1, 2 , 3, 4, 5, 6 are discharged. 7A insulating material, a conductive material. 8A, an insulating material. 9A, an insulating material. 11A, a conductive material. 15A, an insulating material 17A. such a configuration may be substituted, a spray of droplets an apparatus (e.g., droplet ejection apparatus l) all of the discharge liquid materials. in this case, each of these liquid materials can be discharged from the nozzle in a droplet ejection device 118 。这6种液体状材料从1个喷嘴118喷出时,切换液体状材料之际,最好追加洗涤容器101 到喷嘴路径的工序。在此,从1个喷嘴喷出这6种液体状材料时,本发明的"第1液滴喷出装置"、"第2液滴喷出装置"、"第3液滴喷出装置"、和"第4液滴一 This six kinds of material in liquid form is ejected from a nozzle 118, a liquid material, on the occasion of handover, washing vessel 101 is preferably added to step a nozzle path. Here, the nozzle from a material in liquid form the six when, according to the present invention, "the first droplet ejection apparatus 1", "second droplet ejection apparatus", "the third droplet ejection device", and "a fourth droplet

喷出装置"与1个相同的液滴喷出装置相对应。 (变形例2)上述实施方式中,在由聚酰亚胺构成的基板IOA上设置多层构造。 然而,也可以利用陶瓷基板、玻璃基板、环氧基板、玻璃环氧基板、或硅基板等代替这种基板IOA,可获得和上述实施方式中说明效果相同的效果。(变形例3)上述实施方式的导电性材料8A、 15A中,含有银纳米粒子。然而, 也可以使用其他纳米级金属粒子代替银的纳米粒子。作为其他的金属, 例如可利用金、铂、铜、钯、铑、锇、钌、铟、铁、锡、锌、钴、镍、 铬、钛、钽、钨、铟中任何1种,或者,任何2种以上的组合合金。若是银,由于在较低温度下能还原,处理容易,就此点,利用液滴喷出装置时,最好使用含有银纳米粒子的导电性材料8A、 15A。另外,导电性材料8A、 15A也可以含有有机金属化合物,取代金属的纳米粒子。此处所 Discharging means "the same as a corresponding droplet discharge device. (Modification 2) In the above embodiment, a multilayer structure is provided on a substrate made of polyimide IOA However, the ceramic substrate may also be used , a glass substrate, an epoxy substrate, a glass epoxy substrate, a silicon substrate, or the like instead of such a substrate IOAs, and the above-described embodiment can be obtained the same effect as described. (modification Example 3) a conductive material 8A above embodiment, in. 15A, containing silver nanoparticles. However, also other nanoscale metal particles instead of silver nanoparticles. as another metal, for example of gold, platinum, copper, palladium, rhodium, osmium, ruthenium, indium, iron, tin, zinc, cobalt, nickel, chromium, titanium, tantalum, tungsten, indium any one type or any combination of two or more alloys. if the silver, since the reduction can be at lower temperatures, easy to handle, on this point, when using a liquid droplet ejection apparatus, it is preferable to use a conductive material containing silver nanoparticles 8A,. 15A. Further, the conductive material 8A,. 15A may contain an organic metal compound, the metal nanoparticles substituted. as used herein, 的有机金属化合物是通过加热分解析出金属的化合物。这种有机金属化合物中,有氯三乙基膦金(1)、氯三甲基膦金(1)、 氯三苯基膦金(1)、银(I) 2,4-二戊硫代硫酸盐配位化合物(pentanedionato complex)、三甲基膦(六氟乙酰乙酸酯)银(I)配位化合物、铜(I)六氟戊二硫代硫酸盐环辛二烯配位化合物(hexafluoropentanedionato cyclooctadiene complex)等。如上述,液体状导电性材料8A、 15A中所含金属的形态,可以是以纳米粒子为代表的粒子形态,也可以是有机金属化合物一类的化合物形态。进而,导电性材料8A、 15A也可以以含有聚苯胺、聚噻吩、聚苯撑等高分子系可溶性材料来代替金属。 (变形例4)如实施方式l中所述,导电性材料8A、 15A中的银的纳米粒子,可以用有机物等涂敷剂被覆。作为这样的涂敷剂,已知有氨、醇、硫醇等。 更具体讲,作为涂敷剂,有2-甲 The organometallic compound is a metal compound deposited by thermal decomposition. Such an organic metal compound, the chlorine triethylphosphine gold (1), chloro trimethyl phosphine gold (1), triphenylphosphine gold chloride (1 ), silver (I) 2,4 diamyl thiosulfate complex (pentanedionato complex), trimethylphosphine (hexafluoroacetylacetonate acetate) silver (I) complex, copper (I) hexafluorophosphate glutaric thiosulfate cyclooctadiene complex (hexafluoropentanedionato cyclooctadiene complex) and the like. as described above, the conductive liquid material 8A, 15A in the form of the metal contained in the nanoparticles may be in the form of particles as represented, also the organometallic compound may be a form of a class. Furthermore, the conductive material 8A, 15A may be polyaniline, polythiophene, polyphenylene and other soluble polymeric material containing a metal instead. (modification Example 4) as embodiment the l, the conductive material. 8A, 15A, the silver nanoparticles may be coated with the organic coating agent and the like. Examples of the coating agent, known ammonia, alcohol, thiol, etc. more specifically, as coating agent, there are 2- 基乙醇、二乙醇胺、二乙基甲胺、2-二甲氨基乙醇、甲基二乙醇胺等胺化合物,烷基胺类,乙烯二胺、烷基 Group, diethanolamine, diethylmethylamine, 2-dimethylaminoethanol, methyldiethanolamine and the like amine compounds, alkyl amines, ethylene diamine, alkyl

醇类、乙二醇、丙二醇、垸基硫醇类,乙垸二硫醇等。 Alcohols, ethylene glycol, propylene glycol, alkyl with thiols, B embankment dithiol. 用涂敷剂被覆的银的纳米粒子,在分散剂中会得到稳定的分散。 Coating agent coated with silver nanoparticles, the dispersant will be in a stable dispersion. (变形例5)实施方式1中,绝缘层7和绝缘图案9、 11都由相同材料构成。 (Modification 5) In Embodiment 1, the insulating layer 7 and the insulating pattern 9, 11 by the same material. 绝缘层7、绝缘图案9、和绝缘图案11也可由不同的材料构成。 The insulating layer 7, the insulating pattern 9, and the insulating pattern 11 may also be made of different materials. 例如,绝缘层7和绝缘图案11是丙烯树脂的,绝缘图案9是聚酰亚胺树脂的。 For example, the insulating layer 7 and the insulating pattern 11 is acrylic resin, the insulating pattern 9 is polyimide resin. 这种情况下,绝缘材料7A、 9A是含有感光性丙烯树脂单体或低聚物的液体状材料,绝缘材料IIA最好是含有感光性的聚酰亚胺前体的液体状材料。 In this case, the insulating material 7A, 9A is a photosensitive material comprising a liquid acrylic resin monomer or oligomer, the insulating material preferably contains IIA photosensitive material in liquid form the polyimide precursor. 即,这种情况下,本发明的"第1光固化材料"和"第2光固化性材料" 互为不同。 That is, in this case, the "first light-curable material" of the present invention and the "second photocurable material" different from each other. (变形例6)根据上述实施方式,照射紫外线区域的波长光,将绝缘层7的表面和绝缘图案9、 11的表面进行了亲液化。 (Modification 6) In the above embodiment, the wavelength of the ultraviolet light irradiation region, and the surface of the surface insulating layer 7 of insulating pattern 9, 11 were lyophilic. 然而,也可代替这种亲液化, 在大气环境中,将氧作为处理气体,实施等离子体02处理,也可以使绝缘层7的表面和绝缘图案9、 ll的表面进行亲液化。 However, this can be lyophilic in place, in the atmosphere, oxygen as a processing gas, a plasma treatment 02, the surface of the insulating layer may be an insulating pattern 7 and 9, the surface of the lyophilic ll. 等离子体02处理是对基板10A (基体10B),由未图示的等离子体放电电极照射等离子体状态氧的处理。 02 is a plasma processing substrate 10A (base 10B), processed by the plasma discharge electrode (not shown) is irradiated with oxygen plasma state. 等离子体02的处理条件,等离子体功率为50〜1000W、氧气流量为50〜100mL /分钟、基体10B对等离子体放电电极的相对移动速度为0.5〜10mm /秒,基体温度最好为70〜90°C。 Processing conditions of the plasma 02, plasma power 50~1000W, flow rate of oxygen 50~100mL / min, the substrate 10B to the plasma discharge electrode of the relative movement speed 0.5~10mm / sec, substrate temperature is preferably 70~90 ° C. (变形例7)根据上述实施方式,绝缘层7可用喷墨法形成。 (Modification 7) In the above embodiment, the insulating layer 7 is formed an ink jet method can be used. 具体是利用液滴喷出装置形成绝缘材料层7B。 Specifically liquid droplet discharging apparatus forming an insulating material layer 7B. 然而,绝缘层7也可用其他的层形成方法形成,取代喷墨法。 However, the insulating layer 7 may also be other layer forming method, a substituted inkjet method. 例如,可利用筛网印刷法和凹版印刷法等印刷法形成。 For example, it may be formed using a screen printing method and gravure printing method and the like.

Claims (10)

1. 一种使用液滴喷出装置的多层构造形成方法,其特征在于,包括:步骤A,喷出第1导电性材料液滴,在物体表面上形成第1导电性材料图案;步骤B,烧成所述第1导电性材料图案形成配线图案;步骤C,喷出含有第1光固化性材料的第1绝缘材料液滴,在所述配线图案上形成将通孔镶边的第1绝缘材料图案;步骤D,将所述第1绝缘材料图案进行固化,形成将所述通孔镶边的第1绝缘图案;步骤E,将所述物体表面进行亲液化;步骤F,喷出含有第2光固化性材料的第2绝缘材料液滴,形成覆盖所述配线图案和亲液化的所述物体表面,同时围绕所述第1绝缘图案的第2绝缘材料图案;和步骤G,使所述第2绝缘材料图案固化,形成围绕所述第1绝缘图案的第2绝缘图案。 A multilayer structure using a droplet ejection apparatus forming method comprising: step A, first ejecting droplets of a conductive material, a conductive material forming a first pattern on an object surface; Step B of firing the patterned first conductive material forming the wiring pattern; step C, and the first insulating material comprises ejecting droplets of a first photocurable material is formed on the through-hole trim the wiring pattern patterning the first insulating material; step D, and patterning said first insulating material is cured, the through hole is formed in the first insulating striped pattern; step E, the object surface lyophilic; step F., spray a second insulating material droplets containing the second photocurable material, is formed to cover the wiring pattern and the object surface lyophilic, while surrounding the second insulating material pattern of the first insulating pattern; and a step G, the second insulating material pattern is cured, the second insulating pattern is formed around said first insulating pattern.
2. 根据权利要求1所述的多层构造形成方法,其特征在于, 所述第1导电性材料含有银纳米粒子。 2. The multilayer structure according to claim 1 is formed, characterized in that said first conductive material contains silver nanoparticles.
3. 根据权利要求1或2所述的多层构造形成方法,其特征在于,还包括:步骤H,喷出第2导电性材料液滴,用所述第2导电性材料填满所述通孑L;和步骤I,对填满所述通孔的第2导电性材料进行烧成,形成导电端子。 The multilayer structure of claim 1 or claim 2 forming method, wherein, further comprising the steps of: H, ejecting droplets of a second conductive material, with said second conductive material fills the through- L larvae; step I, the first conductive material filling the through-holes are formed by firing the conductive terminals.
4. 一种配线基板的制造方法,其特征在于,包括: 权利要求1〜3的任一项中所述的多层构造形成方法。 4. A method of manufacturing a wiring substrate, characterized by comprising: a multilayer structure of any one of claim 1~3 forming method as claimed in claim.
5. —种电子仪器的制造方法,其特征在于,包括: 权利要求1〜3的任一项中所述的多层构造形成方法。 5. - A method of fabricating an electronic instrument, characterized by comprising: a multilayer structure of any one of claim 1~3 forming method as claimed in claim.
6. —种使用液滴喷出装置的多层构造形成方法,其特征在于,包括: 步骤A,将位于物体表面上的配线图案表面形成疏液化; 步骤B,向所述疏液化配线图案的表面喷出含有第1光固化性材料的第1绝缘材料液滴,在所述配线图案上形成将通孔镶边的第1绝缘材料图案;步骤C,使所述第1绝缘材料图案固化,形成将所述通孔镶边的第l 绝缘图案;步骤D,使所述物体表面形成亲液化;步骤E,喷出含有第2光固化性材料的第2绝缘材料液滴,形成覆盖所述配线图案和亲液化的所述物体表面,同时围绕所述第1绝缘图案的第2绝缘材料图案;和步骤F,将所述第2绝缘材料图案进行固化。 6. - kind of a multilayer structure using a droplet ejection apparatus forming method comprising: a step A, the surface of the wiring pattern located on the surface to form a repellent liquefaction; procedure B, to the wiring lyophobic discharging the first surface pattern comprises a first light curable material droplets insulating material, the insulating material forming the first through-hole pattern on the edge of the wiring pattern; step C, and the first insulating material curing the pattern forming the through hole in the l trim insulating pattern; procedure D, the object surface lyophilic; step E, a second insulating material comprises ejecting a second droplet of the photocurable material, is formed and covering the wiring pattern of the object surface lyophilic, while surrounding the second insulating material pattern of the first insulating pattern; step F., the second insulating material pattern is cured.
7. 根据权利要求6所述的多层构造形成方法,其特征在于,还包括: 步骤G,喷出液体状的导电性材料液滴,用所述导电性材料填满所述通孔;和步骤H,将填满所述通孔的所述导电性材料进行烧成,形成导电端子。 The multilayer structure forming method according to claim 6, characterized in that, further comprising the steps of: G, discharging liquid droplets of a conductive material, and filling the through hole with the conductive material; and step H, fills the through hole conductive material are formed by firing the conductive terminals.
8. 根据权利要求7所述的多层构造形成方法,其特征在于, 所述导电性材料含有银。 8. The multilayer structure forming method of claim 7, wherein the conductive material comprises silver.
9. 一种配线基板的制造方法,其特征在于,包括: 权利要求6〜8的任一项中所述的多层构造形成方法。 9. A method of manufacturing a wiring substrate, characterized by comprising: a multilayer structure of any one of 6 ~ 8 are formed in the method as claimed in claim.
10. —种电子仪器的制造方法,其特征在于,包括: 权利要求6〜8的任一项中所述的多层构造形成方法。 10. - A method of fabricating an electronic instrument, characterized by comprising: a multilayer structure of any one of 6 ~ 8 are formed in the method as claimed in claim.
CN 200510106340 2004-09-27 2005-09-23 Multilayer structure forming method, method of manufacturing wiring board, and method for manufacturing electronic apparatus CN100475001C (en)

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CN1452451A (en) 2002-04-16 2003-10-29 精工爱普生株式会社 Multilayer wiring substrate, method for mfg. same, electronic device and electronic machine
CN1503338A (en) 2002-11-19 2004-06-09 精工爱普生株式会社 Multi-layer distribution board and mfg method, electronic device and electronic apparatus
EP1352548B1 (en) 2000-12-09 2006-04-12 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements

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EP1352548B1 (en) 2000-12-09 2006-04-12 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements
CN1452451A (en) 2002-04-16 2003-10-29 精工爱普生株式会社 Multilayer wiring substrate, method for mfg. same, electronic device and electronic machine
CN1503338A (en) 2002-11-19 2004-06-09 精工爱普生株式会社 Multi-layer distribution board and mfg method, electronic device and electronic apparatus

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