CN100472770C - Area array package with non-electrically connected solder balls - Google Patents
Area array package with non-electrically connected solder balls Download PDFInfo
- Publication number
- CN100472770C CN100472770C CN 200480002933 CN200480002933A CN100472770C CN 100472770 C CN100472770 C CN 100472770C CN 200480002933 CN200480002933 CN 200480002933 CN 200480002933 A CN200480002933 A CN 200480002933A CN 100472770 C CN100472770 C CN 100472770C
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- China
- Prior art keywords
- area array
- array package
- package part
- solder ball
- corner
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 57
- 238000003466 welding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 8
- 238000013461 design Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000012360 testing method Methods 0.000 abstract description 11
- 238000005452 bending Methods 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 21
- 238000005538 encapsulation Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 5
- 230000006353 environmental stress Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An area array package includes a plurality of solder balls not used as electrical connectors. These non-connected solder balls, or''dummy balls,'' provide protection to solder balls connected to live pins and therefore increase reliability of the area array package. The dummy balls may be placed in the corners, along the diagonals or in other high stress locations on the area array package. To further increase reliability, a continuous copper ball land pad may be used to connect each group of corner dummy balls. Continuous copper pads help to reduce stress on the dummy balls. For center-depopulated BGA packages, an array of dummy balls may be used in the center of the package to prevent substrate bending and improve drop test reliability.
Description
Related application
The application's case is advocated to file an application and name is called the right of the 60/443rd, No. 817 U.S. Provisional Patent Application case of " the area array package part that reliability of solder joints is improved (AREA ARRAY PACKAGE WITH IMPROVEDRELIABILITY OF SOLDER JOINTS) " on January 30th, 2003.
Technical field
The application's case relates to the area array package part, more specifically, relates to the reliability that improves welded contact in the area array package part that bears environmental stress.
Background technology
For making semiconductor integrated circuit chip carry out electric interaction, must connect semiconductor integrated circuit chip with the external world.Ball grid array (BGA) semiconductor die package uses a plurality of solder ball as outside terminal.The BGA encapsulation is because of realizing that on a finite region pin configuration more than is used widely.
Chip apparatus has the thermal coefficient of expansion (CTE) of an about 3ppm/C usually.These devices are rigidity relatively, and if because of overflexing is subjected to stress, brittle fracture may appear.One area array package part comprises a chip, a package substrate and optional molded item.The influence of each assembly during the CTE of area array package part can be encapsulated.
The CTE of expoxy glass printed circuit board (PCB) can be in about 16 to 21ppm/C scopes, this on glass cloth, resin system, and the content of copper decide.For obtaining a useful electrical connection, need between area array package part and printed circuit board (PCB), provide a physical connection.
The inconsistent meeting of existing CTE causes that hot driving stress also can influence the reliability of encapsulation by many kinds of modes between area array package part and the printed circuit board (PCB).By certain mode, this basic CTE is inconsistent can to influence the electron device package scheme that all relate to area array package part and printed circuit board (PCB).Measurement to ball grid array (BGA) type and the encapsulation of chip size (CSP) N-type semiconductor N finds that the welding point at close package corners place can bear especially high strain because of CTE is inconsistent.
Along with dwindling of pad weld pad spacing and size, the reliability of solder ball joint can reduce usually.The area array package part requires encapsulation scheme to form between this encapsulation and a printed circuit board (PCB) on the whole surface of device and keeps electrically contacting.Between area array package part and printed circuit board (PCB), can exist and the interdependent shear strain of temperature.The solder ball connection has very predictable limited fatigue life.In addition, the area array package part also can be subjected to the irrelevant mechanical stress with CTE.These stress comprise mechanical deflection and other environmental stresses.
The area array package part need be protected the solder ball that is electrically connected is provided with the stress between the printed circuit board (PCB) is feasible.Protection to solder ball that electrical connection is provided should provide sufficient stress to eliminate, and is reduced to acceptable degree with the strain that solder ball is connected, thereby realizes the raising of fatigue life.
Summary of the invention
A kind of area array package part comprises a plurality of solder ball that are not used as electric connector.Solder ball or " dummy balls " that these standing grain connect provide protection for the solder ball that is connected to live pins, therefore can improve the reliability of area array package part.Described dummy balls can be arranged in corner or be arranged in other high stress locations on the area array package part along diagonal.For further improving reliability, can use a continuous copper ball pad weld pad to connect each group corner dummy balls.Continuous copper pad helps to reduce the stress on the dummy balls.For the BGA encapsulation that the center ball reduces, can use an array of dummy balls to prevent the substrate bending and improve the reliability of the test of falling in the center of encapsulation.
After reading hereinafter described in detail and consults accompanying drawing, the use dummy balls improves the reliability of area array package part and the advantage of each embodiment will become more very clear.
Description of drawings
Fig. 1 shows that one is connected to the area array package part of a printed circuit board (PCB);
Fig. 2 shows the dummy ball configuration on this area array package part;
Fig. 3 shows that one is used for the optional center dummy balls structure of the area array package part of center element minimizing;
Fig. 4 is a flow chart, and how it show that preparation is connected with the raising reliability between area array package part and printed circuit board (PCB).
Embodiment
Fig. 1 shows an area array package part 100.This area array package part 100 comprises a substrate 105, a circuit small pieces 106, reaches optional molded item 108.Substrate 105 can be made of the different materials that comprises pottery, laminate or Kapton Tape.Circuit small pieces 106 is a silicon normally, and it is connected to substrate 105.But circuit small pieces 106 wire bonds or be fixed to substrate 105 in the flip-chip mode.Molded item 108 can be arranged in circuit small pieces 106 on every side with protective circuit small pieces 106.When circuit small pieces 106 is wire bonded to substrate 105, use molded item 108 usually, even but circuit small pieces 106 is to fix in the flip-chip mode, also can use molded item 108.
Area array package part 100 is installed on a printed circuit board (PCB) 110 or the similar assembly.Printed circuit board (PCB) 110 is a laminate normally.Area array package part 100 is connected to printed circuit board (PCB) 110 by a plurality of solder ball 115.Solder ball 115 can provide machinery and be electrically connected between area array package part 100 and printed circuit board (PCB) 100.
Fig. 2 viewing area array packaging member 100 is connected 115 with solder ball between the printed circuit board (PCB) 110.Solder ball connects 115 and is arranged in usually on the bottom of substrate 105 of area array package part 100.In the present invention, use two types solder ball to connect 115.First type solder ball connects 205 provides machinery and electric interface between area array package part 100 and printed circuit board (PCB) 110.Therefore, except with area array package part 100 physical fixation to printed circuit board (PCB) 110, solder ball connect 205 can also be between area array package part 100 and printed circuit board (PCB) 110 transmission of electric signals.It is that solder ball common in BGA uses connects that the solder ball of this type connects 205.It is dummy balls 210 that second type solder ball connects.Dummy balls 210 only provides mechanical connection between area array package part 100 and printed circuit board (PCB) 110.Dummy balls 210 also is not attached to any electrical signal line.
In one embodiment of this invention, area array package part 100 comprises solder ball pad 208.Each solder ball pad 208 all is suitable for admitting a solder ball.In Fig. 2, for clarity sake, only show a sample of solder ball pad 208, although being usually located at each, solder ball pad 208 is suitable for admitting on the position of a solder ball.Be positioned at each 215,220,225,230 place, corner of area array package part 100 and do not have and being electrically connected of area array package part 100 along the solder ball pad 208 of the diagonal 235,240 in each corner 215,220,225,230 of join domain array packaging member 100.These do not have the solder ball pad 208 that is electrically connected and are configured to use dummy balls 210.
The measurement that semiconductor packages is carried out is found that the welding point of close package corners bears especially high stress.By area array package part 100 being designed to 215,220,225,230 places and not having electrical connection, can use dummy balls 210 to replace the welding point of standard along the diagonal 235,240 in the corner 215,220,225,230 of join domain array packaging member 100 in the corner.Using dummy balls 210 to replace the standard welding point can make the high strain that is stood on these corners and diagonal be absorbed by dummy balls 210.Because dummy balls 210 do not comprise any electrical connection, thereby the strain that is applied to dummy balls 210 can not make responsive electrical connection fracture.In addition, design one does not have the area array package part 100 that is electrically connected along diagonal 235,240 also makes dummy balls 210 arrange along diagonal 235,240, thereby further absorbs stress and strain, and can not make any electrical connection fracture.
The experience test shows of using dummy balls 210 to implement, temperature cycling test and bending failure testing are in the two before inefficacy, and dummy balls 210 all lost efficacy before conventional solder ball.Because dummy balls 210 do not have electrical connection, thereby it lost efficacy and can not make the inefficacy that is connected between area array package part 100 and the printed circuit board (PCB) 110.By dummy balls 210 is positioned high stress locations, can improve the overall life of area array package part 100.Table 1 promptly shows this test.
Table 1
For further reducing the stress on the dummy balls 210, a continuous copper ball pad weld pad 250 can be set below dummy balls 210 in one or more corner 215,220,225,230.Copper pad 250 is arranged between dummy balls 210 and the substrate 105.Copper pad 250 provides a uniform welding disking area and further reduces stress on the corner dummy balls 210.The modeling data that uses copper pad 250 to implement shows that the number of temperature cycles before inefficacy increases.Table 2 promptly shows this test.
Table 2
Fig. 3 shows for the encapsulation that reduces for a center element, the alternative arrangement scheme that area array package part 100 is connected with solder ball between the printed circuit board (PCB) 110.In the present embodiment, an array of dummy balls 350 is arranged in the zone that area array package part 100 center elements reduce.The array of dummy balls 350 that is positioned at the center can prevent that the reliability of falling and testing from bending appearring and providing more welding point to improve in substrate during electric test.The array of dummy balls 350 that is positioned at the center also can with the combined reliability that strengthens of employed dummy balls on corner and diagonal.
Fig. 4 is a flow chart, and it shows how to prepare being connected with the raising reliability between area array package part 100 and the printed circuit board (PCB) 110.This process starts from START (beginning) piece 405.Proceed to piece 410 then, for area array package part 100 forms an encapsulation profile.This encapsulation profile comprises a plurality of solder ball 115, and described a plurality of solder ball 115 are more than the quantity of I/O (I/O) requirement of chip apparatus 106.By the solder ball 115 that comprises a high quantity, be not that each solder ball 115 all needs to connect as an I/O.This makes some solder ball 115 can be used as dummy balls 210.
Proceed to piece 415 then, identification is along the high stress locations that is connected between area array package part 100 and the printed circuit board (PCB) 110.Described high stress locations is those positions that might at first occur solder ball 115 failure phenomenons when being subjected to environmental stress or other stress.Can discern high stress locations by modeling data (Computer Simulation), experience test or other suitable technology.
Proceed to piece 420 then, for each high stress locations, the solder ball 115 of all selecting right quantity is as dummy balls 210.The quantity that connects according to target capabilities level and required I/O selects to intend the quantity of dummy balls 210 that each zone is used.As indicated above, high stress areas sees the corner of area array package part 100 and usually along the diagonal place.Therefore, dummy balls 210 is set as shown in Figure 2 in these zones.Structure among Fig. 2 only is exemplary, and can change the quantity of intending the dummy balls 210 of use in each high stress areas according to the quantity of target capabilities level and required I/O connection.When using the encapsulation of a center element minimizing, an array of dummy balls can be set if necessary in the center of area array package part 100.Center dummy balls both can be with also can not using with the dummy balls at corner and diagonal place.Can center dummy balls be set by rectangle or square layout, but also can use the layout of other types.
Proceed to piece 425 then, substrate is carried out circuit determine, so that the weld pad of circuit small pieces only is connected to the position of containing charged I/O solder ball.Between the weld pad of circuit small pieces and dummy balls, be not electrically connected.
Proceed to piece 430 then, can between the dummy balls of corner and area array package part 100, continuous copper pad or other weld pads be set.Continuous copper pad can improve the tolerance of corner dummy balls to environmental stress.The use of copper pad is optional.
After the design encapsulation and dummy balls being set, but implementation experience tests to determine whether this encapsulation satisfies target stress level.If discontented foot-eye level then can further be revised design.In case satisfy described target level, promptly in END (end) piece 435, stop this process.
Although in conjunction with the preferred embodiment of this device this device has been carried out full-time instruction with reference to the accompanying drawings, yet it should be noted that described those skilled in the art will easily know various changes and modification.These changes and modification should be considered as still belonging in the category by this device that claims defined of enclosing.
Claims (14)
1, a kind of conductor integrated circuit device, it comprises:
One printed circuit board (PCB);
One has the area array package part in corner;
One first group of solder ball, it is electrically connected to described printed circuit board (PCB) with described area array package part; And
One second group of solder ball, it provides physical connection but electrical connection is not provided, but described second group of solder ball with make at least one of the described corner of described area array package part and along the diagonal setting with respect to described corner of described area array package part.
2, conductor integrated circuit device as claimed in claim 1, wherein said second group of solder ball further comprises the solder ball of the center that is arranged at described area array package part.
3, conductor integrated circuit device as claimed in claim 1, at least one of described second group of solder ball that wherein is arranged in one of the described corner of described area array package part are positioned on the continuous ball pad.
4, conductor integrated circuit device as claimed in claim 3, wherein said continuous ball pad is a metal pad.
5, a kind of raising one has the area array package part in corner and the method for the reliability between the printed circuit board (PCB), and it comprises:
The first group of solder ball that is electrically connected that is not used between described area array package part and the described printed circuit board (PCB) is provided, but wherein said first group of solder ball with make at least one of the described corner of described area array package part and along the diagonal setting with respect to described corner of described area array package part; And
The second group of solder ball that is electrically connected described area array package part and described printed circuit board (PCB) is provided.
6, method as claimed in claim 5, it further provides the 3rd group of solder ball of the described center that is arranged at described area array package part.
7, method as claimed in claim 5, it further comprises the part in the described corner of being arranged at of described first group of solder ball is positioned on the continuous ball pad.
8, method as claimed in claim 7, wherein said continuous ball pad is a metal pad.
9, a kind of area array package part with corner, it comprises:
One first assembly welding tin ball pad, it is through being configured to that the signal of telecommunication is transferred to described area array package part; And
One second group of solder ball pad of not having electrical connection, the described second assembly welding tin ball pad is through being configured to only to provide the physical connection with described area array package part, but the described second assembly welding tin ball pad with make at least one of the described corner of described area array package part and along the diagonal setting with respect to described corner of described area array package part.
10, area array package part as claimed in claim 9, the wherein said second assembly welding tin ball pad further comprises the solder ball pad of the described center that is arranged at described area array package part.
11, area array package part as claimed in claim 9, at least one of the described second assembly welding tin ball pad that wherein is arranged in one of the described corner of described area array package part comprises a continuous ball pad.
12, area array package part as claimed in claim 11, wherein said continuous ball pad is a metal pad.
13, a kind of design one has the method for the area array package part in corner, and it comprises:
In at least one of the described corner of described area array package part and along the diagonal setting with respect to described corner of described area array package part, be not used in the first assembly welding tin ball pad that is electrically connected described area array package part; And
The second assembly welding tin ball pad that is suitable for allowing to be electrically connected to described area array package part is provided.
14, method as claimed in claim 13, it further provides the 3rd assembly welding tin ball pad that is not used in electrical connection of the described center that is arranged at described area array package part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44381703P | 2003-01-30 | 2003-01-30 | |
| US60/443,817 | 2003-01-30 | ||
| US10/393,666 | 2003-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1742371A CN1742371A (en) | 2006-03-01 |
| CN100472770C true CN100472770C (en) | 2009-03-25 |
Family
ID=36094017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480002933 Expired - Lifetime CN100472770C (en) | 2003-01-30 | 2004-01-30 | Area array package with non-electrically connected solder balls |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100472770C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7531899B2 (en) | 2006-04-17 | 2009-05-12 | Agilent Technologies, Inc. | Ball grid array package |
| JP2010010437A (en) * | 2008-06-27 | 2010-01-14 | Stanley Electric Co Ltd | Optical semiconductor device |
| CN101740542B (en) * | 2008-11-06 | 2011-09-28 | 微星科技股份有限公司 | Welded structure of surface mount technology for ball grid array |
| TWI342608B (en) | 2008-11-14 | 2011-05-21 | Micro Star Int Co Ltd | Surface mount technology structure for bga |
| JP5870303B2 (en) | 2010-08-06 | 2016-02-24 | パナソニックＩｐマネジメント株式会社 | Circuit board and manufacturing method thereof |
| US8659123B2 (en) * | 2011-09-28 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal pad structures in dies |
| CN103943585B (en) * | 2013-01-22 | 2017-02-08 | 联想(北京)有限公司 | Mainboard, chip packaging module and motherboard |
| JP6726309B2 (en) | 2017-01-05 | 2020-07-22 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Highly reliable electronic package structure, circuit board and device |
| CN107592733A (en) * | 2017-08-24 | 2018-01-16 | 深圳市华星光电半导体显示技术有限公司 | Printed circuit board (PCB) for mount ball-grid array encapsulation chip and preparation method thereof |
| CN112770477B (en) * | 2019-10-21 | 2022-09-23 | 华为技术有限公司 | Circuit board assembly and electronic equipment |
-
2004
- 2004-01-30 CN CN 200480002933 patent/CN100472770C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1742371A (en) | 2006-03-01 |
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