CN100470722C - Exposure apparatus, exposure method and device manufacturing method - Google Patents

Exposure apparatus, exposure method and device manufacturing method Download PDF

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Publication number
CN100470722C
CN100470722C CNB2004800235779A CN200480023577A CN100470722C CN 100470722 C CN100470722 C CN 100470722C CN B2004800235779 A CNB2004800235779 A CN B2004800235779A CN 200480023577 A CN200480023577 A CN 200480023577A CN 100470722 C CN100470722 C CN 100470722C
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liquid
substrate
exposure
supply
optical system
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CN1836312A (en
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长坂博之
石井勇树
牧野内进
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Nikon Corp
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Nikon Corp
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Abstract

An exposure apparatus exposes a substrate by irradiating exposure light on the substrate placed on the image surface side of a projection optical system, the irradiation being performed through a projection optical system and a liquid. The exposure apparatus has a liquid feeding mechanism for feeding the liquid on the substrate and a liquid recovery mechanism for recovering the liquid fed on the substrate. When the exposure light is being irradiated on the image surface side of the projection optical system, the liquid recovery mechanism does not recover the liquid.

Description

Exposure sources, exposure method and device making method
Requirement is in the priority of Japanese patent application No.2003-297507 (submission on August 21st, 2003) and 2004-38411 (submission on February 16th, 2004), and the content of these two patent applications is being hereby incorporated by reference.
Technical field
The present invention relates to exposure sources and device making method, wherein substrate is exposed rayed and is exposed.
Background technology
Semiconductor device and liquid crystal display device are manufactured by so-called photoetching technique, and by this technology, the pattern that is formed on the mask is transferred to photosensitive substrate by photoetching technique.The exposure sources that uses in photoetching process has the mask platform of support mask and the chip bench of support substrate, when adjoining land moves mask platform and chip bench, via projection optical system mask pattern is transferred to substrate.In recent years, in order to handle the device pattern of much higher integrated horizontal, require to have the projection optical system of higher resolution.When the exposure wavelength that uses is more in short-term, the resolution of projection optical system becomes higher.When the numerical aperture of projection optical system was bigger, the resolution of projection optical system became higher.Therefore, the exposure wavelength that uses in exposure sources shortens year by year, and the numerical aperture of projection optical system also increases.And current main flow exposure wavelength is that 248nm KrF swashs base laser, also introduces to the market but shorter wavelength 193nm ArF swashs base laser.In addition, when carrying out exposure, except resolution, depth of focus (DOF) also is important.Resolution R and depth of focus δ are respectively by following formulate:
R＝k 1·λ/NA， (1)
δ＝±k 2·λ/NA 2， (2)
Wherein λ is an exposure wavelength, and NA is the numerical aperture of projection optical system, and k 1And k 2Be to handle coefficient.Can see that if do shortlyer and numerical aperture λ is done more in order to strengthen resolution R, then depth of focus δ becomes narrower to wavelength X from formula (1) and (2).
When depth of focus δ becomes too narrow, be difficult to make substrate surface to do consistently, so focus on the not enough possibility of surplus during appearing at exposing operation with the image surface of projection optical system.In order to address this problem, disclosed liquid leaching method is suggested as making the in fact shorter and wider method of depth of focus of exposure wavelength in PCT international publication number No.WO99/49504 for example.The liquid leaching method is designed to, by being used for liquid, for example water or organic solvent, be filled in the lower surface of projection optical system and the space between the substrate face, form the 1/n (n is a liquid refractive index, is about 1.2 to 1.6 usually) that liquid soaks the zone and therefore becomes airborne wavelength by utilization exposure light wavelength in liquid, improve resolution, strengthen the about n of depth of focus simultaneously doubly.
By the way, in above-mentioned prior art, by carry out the supply and the recovery of liquid by liquid supplying apparatus and liquid withdrawal system, liquid soaks the zone and is formed on the substrate, when liquid is recovered, sound and/or vibrations might occur, the sound of appearance and/or vibrations may influence exposure accuracy and various certainty of measurement.
Importantly, worsen in order to keep exposure accuracy and various certainty of measurement and/or to prevent to be formed on on-chip pattern, suitably withdrawal liquid.When liquid can not be recovered fully, also bring shortcoming, for example, when on-chip remaining liq is dry, stay bonding agent vestige (watermark) thereon, or remaining liquid dissemination makes their corrode on adjacent machine components.And, when liquid residue or distribution, it for example causes the wherein variation of the residing environment of substrate (humidity etc.), cause the change of refractive index on the light path of the light that the optical interdferometer that is used for the platform position measurement detects, therefore the influence various measuring operation relevant with exposure process cause exposure accuracy to reduce.
Summary of the invention
Consider that such situation made the present invention, the purpose of this invention is to provide exposure method, exposure sources and device making method, wherein, can keep exposure accuracy when when via projection optical system and liquid irradiation substrate substrate being exposed with exposure light.
In order to solve the above problems, the present invention adopt show in an embodiment and corresponding to the following configuration of Fig. 1 to 19.Should be pointed out that each the bracket representative unit that is attached on each element, just to illustrating rather than limit this unit.
Exposure sources of the present invention (EX) is by exposure light (EL) is shone the expose exposure sources of substrate (P) of image surface one side that is placed on projection optical system (PL) via projection optical system (PL) and liquid (1), exposure sources comprises liquid organization of supply (10), is used for liquid is fed on the substrate (P); With liquids recovery mechanism (20), be used for reclaiming the liquid (1) that is supplied on the substrate (P), wherein when exposure light (EL) shone image surface one side of projection optical system (PL), liquids recovery mechanism (20) did not carry out liquid (1) and reclaims.
According to the present invention, by when exposure illumination is mapped to image surface one side of projection optical system (PL), liquids recovery mechanism does not carry out liquid (1) and reclaims, and can prevent to occur during substrate is carried out exposing operation to be mapped to image surface one side because liquids recovery is operated the sound that causes and/or vibrated the illumination that wherein exposes.Therefore, because sound and/or vibration cause the shortcoming that reduces exposure accuracy to be excluded.Be mapped to the operation of image surface one side of projection optical system (PL) for the illumination that wherein exposes, except exposing operation, for example also has detecting operation via the exposure light of liquid by means of the various optical receiving sensors on image surface one side that is placed on projection optical system to substrate.Do not carry out liquid (1) by liquids recovery mechanism during this exposure light detection operation of optical receiving sensor yet and reclaim, because sound and/or vibration cause the shortcoming that reduces exposure accuracy to avoid.
Exposure sources of the present invention (EX) is by exposure light (EL) is shone the expose exposure sources of substrate (P) of image surface one side that is placed on projection optical system (PL) via projection optical system (PL) and liquid (1), described exposure sources comprises substrate holding member (PST), and it is removable when keeping substrate (P); With liquids recovery mechanism (20), it is recovery port (23,23A-23D) be placed on chip bench (PST) top, reclaim the liquid (1) on the substrate (P), and wherein after the exposure of the substrate (P) that is kept by substrate holding member (PST) is finished, the recovery section of substrate holding member (PST) and substrate holding member (PST) (23,23A-23D) relatively move.
According to the present invention, after finishing in the exposure of substrate, the recovery port of relatively move substrate holding member and liquids recovery mechanism can be recovered at the liquid that is not reclaimed by liquids recovery mechanism between exposure period He still stay on substrate or the substrate holding member.Therefore, since liquid still residual that cause, get rusty and the generation of the shortcoming of the variation of environment or the like can be avoided such as appearance, the equipment of watermark.
Exposure sources of the present invention (EX) is to soak zone (AR2) and go up liquid (1) and projection optical system (PL) the irradiation substrate (P) that forms by an exposure light (EL) via soak zone (AR2) at liquid by form liquid on the part of substrate (P), and the exposure sources of exposure substrate (P), this exposure sources comprises liquid organization of supply (10), is used between substrate (P) exposure period liquid (1) being fed on the substrate (P); With liquids recovery mechanism (20), be used between substrate (P) exposure period from the suction of substrate (P) top and be recovered in liquid (1) on the substrate (P), and in large supply by the liquid of liquid organization of supply (10) supply between substrate (P) exposure period in liquids recovery amount by liquids recovery mechanism (20) suction.
Under the situation of the configuration of liquids recovery mechanism by reclaiming on-chip liquid from substrate top pumping liquid therein, may cause such situation, wherein liquid is recovered together with gas (just looking like to swallow gas) on every side, and to be looked at as the factor that causes sound and/or vibration to take place as the mode withdrawal liquid of swallowing gas.According to the present invention, by making that the liquid supply is bigger on the substrate, by when liquid is aspirated and reclaims with gas by liquids recovery mechanism, making that the part of liquid is bigger, thereby and by making the amount of the gas swallowed littler, sound and/or vibration can be reduced.
Exposure sources of the present invention (EX) is by exposure light is shone the expose exposure sources of substrate (P) of substrate (P) via projection optical system (PL) and liquid (1), this exposure sources comprises movably parts (PST), it is placed on image surface one side of projection optical system (PL), and remains on the movably liquid (1) between the parts and projection optical system (PL); With liquids recovery mechanism (20), it is placed to recovery section (23) and faces movably parts (PST), and can be recovered in the liquid on the parts (PST) movably, and the recovery section (23) of wherein relatively move movably parts (PST) and liquids recovery mechanism the time, the liquid on parts (PST) movably is recovered.
According to the present invention, the liquid on parts movably can reclaim reliably, therefore since the shortcoming that remaining liq causes such as the bonding agent track occurring, can be suppressed.
Device making method of the present invention is characterised in that it uses above-mentioned exposure sources (EX).According to the present invention, exposure process can be performed under the state of the high exposure accuracy of maintenance, therefore, can provide the device that can produce the performance of wanting.
Exposure method of the present invention is such exposure method, it movably forms liquid partly between movable body (PST) and the projection optical system (PL) and soaks zone (AR2) when keeping substrate (P), and by exposure light (EL) being radiated on the substrate (P) via the liquid (1) that projection optical system (PL) and formation liquid soak zone (AR2) (P) time with respect to exposure light (EL) mobile substrate, for a plurality of shooting area (S1-S20, T1-T32) each shooting area is carried out scan exposure, wherein (S1-S20, the position of each shooting area T1-T32) on substrate (P) is determined the translational speed of substrate (P) according to a plurality of shooting areas.
The upper surface that should be pointed out that above-mentioned movable body comprises the surface of the substrate that is kept by movable body.
According to the present invention, because when each shooting area is exposed, the translational speed of substrate is determined in on-chip position according to shooting area, and shooting area can be exposed, liquid is maintained between the upper surface of projection optical system and movable body well, no matter and on-chip position how.
Description of drawings
Fig. 1 is the schematic diagram that shows the embodiment of exposure sources of the present invention.
Fig. 2 is the plane graph that is used for the layout of example ground explanation liquid supply section and recovery section.
Fig. 3 is the plane graph of chip bench.
Fig. 4 shows that the flow path that constitutes liquid organization of supply and liquids recovery mechanism forms the perspective view of parts.
Fig. 5 shows to be included in the perspective view that flow path forms first parts in the parts.
Fig. 6 A and 6B show to be included in the perspective view that flow path forms second parts in the parts.
Fig. 7 A and 7B show to be included in the perspective view that flow path forms second parts in the parts.
Fig. 8 is the sectional view of getting along the A-A arrow of Fig. 4.
Fig. 9 is the sectional view of getting along the B-B arrow of Fig. 4.
Figure 10 is presented at the liquid supply between the substrate exposure period and the schematic diagram of reclaimer operation.
Figure 11 is the liquid supply after being presented at substrate exposure and finishing and the schematic diagram of reclaimer operation.
Figure 12 is the schematic diagram of the example of the liquids recovery operation after being presented at substrate exposure and finishing.
Figure 13 is the schematic diagram of another example of the liquids recovery operation after being presented at substrate exposure and finishing.
Figure 14 is the schematic diagram of another example of the liquids recovery operation after being presented at substrate exposure and finishing.
Figure 15 is the schematic diagram that shows another embodiment of exposure sources of the present invention.
Figure 16 shows that flow path forms the general perspective of another example of parts.
Figure 17 A is the figure that shows another example of the chip bench relevant with the present invention with 17B.
Figure 18 is the figure that is used to illustrate the example of exposure sequence.
Figure 19 is the flow chart that shows the example of fabrication of semiconductor device.
Embodiment
Below, the preferred embodiments of the present invention will be described with reference to the drawings.Yet, should be pointed out that the present invention is not limited only to following embodiment, but the element of the composition of these embodiment can be made up suitably.
Fig. 1 is the schematic diagram that shows the embodiment of exposure sources of the present invention.
With reference to figure 1, exposure sources EX is equipped with mask platform MST, is used for supporting mask M; Chip bench PST is used for supporting substrate P; Lamp optical system IL, the mask that utilizes exposure light EL irradiation to support by mask platform; Projection optical system PL, by the pattern image projection exposure of the mask M of exposure light EL irradiation on the substrate that supports by chip bench PST; With controller CONT, be used for controlling total operation of exposure sources EX.
The exposure sources EX of present embodiment is an immersion exposure equipment, and it is applied the liquid leaching method, makes exposure wavelength in fact be shortened with raising resolution and broadening depth of focus, and is equipped with liquid delivery system 10, and supply fluid 1 is to substrate P; With liquid recovery system 20, reclaim the liquid 1 that is supplied on the substrate P.Exposure sources EX soaks regional AR2 to comprise the AR1 of view field of projection optical system PL by the liquid that uses liquid 1 by liquid delivery system 10 supplies to be formed on the part of substrate P at least when the pattern image of mask M is transferred to substrate.More specifically, exposure sources EX adopts local liquid leaching method, wherein be filled with liquid 1 at the optical element 2 of image surface one side that is positioned at projection optical system PL and the space that is placed between the surface (exposed) of substrate P of image surface one side, and by shining substrate P, the design transfer of mask M-expose to substrate P via the exposure light EL of the liquid 1 between projection optical system PL and substrate P by mask M.
Present embodiment is described to (as an example) and supposes the situation of use as the scanning type exposure equipment (so-called scanning steeper) of exposure sources EX, wherein along the scanning direction in mutually different synchronously mobile mask M of direction (opposite direction) and substrate P, the pattern that is formed on the mask M is exposed on the substrate P.Should be pointed out that the structure that depends on projection optical system PL, the situation that can have wherein mask M and substrate P to move along identical direction.In the following description, suppose to be called as Z-direction with the corresponding to direction of optical axis AX of projection optical system PL, the synchronous moving direction (scanning direction) of mask M and substrate P is called as X-direction in perpendicular to the plane of Z axle, and is called as Y direction (non-scanning direction) perpendicular to the direction of Z direction and directions X.Should be pointed out that " substrate " that relate to comprises the semiconductor wafer that applies as the photoresist of light-sensitive material thereon here, " mask " comprises that reduced the mechanical of on-chip device pattern that be projected in wanted in formation thereon.
Lamp optical system IL is used for the mask M that exposure light EL illumination supported by mask platform MST, and it comprises and is used for exposure light source; Light integrator is used for making from the illumination homogenizing of the luminous flux of exposure light source emission; Collector lens is used to gather the exposure light EL from light integrator; Relay lens system; The variable field aperture is used for being set to seam shape by the field of illumination that exposure light EL forms on mask M.The field of illumination of the appointment on mask is light-struck with the exposure with even illumination profile by lamp optical system IL.As exposure light EL from lamp optical system IL emission, for example, can use from bright line (the g line of the ultraviolet range of mercury vapor lamp emission, h line, i line), swash the extreme ultraviolet light (DUF light) of base laser light (wavelength of 248nm) and swash the vacuum-ultraviolet light (VUF light) that base laser light (wavelength of 193nm) or F2 swash base laser light (wavelength of 157nm) such as KrF such as ArF.In the present embodiment, use ArF.
Mask platform MST is used to support mask, and it is on the plane perpendicular to optical axis AX, promptly on the XY plane, can two-dimentionally move, and can rotation minutely on θ Z direction.Mask platform MST is driven by the mask platform driver MSTD such as linear motor.Mask platform driver MSTD is controlled by controller CONT.Moving lens 50 is set on mask platform MST.And, provide laser interferometer 51 in position in the face of moving lens 50.The two-dimensional position of mask M and the anglec of rotation are measured in real time by laser interferometer 51 on mask platform MST, and measurement result is output to controller CONT.By driving mask platform driver MSTD according to the measurement result from laser interferometer 51, controller CONT carries out the location for the mask M that is supported by mask platform MST.
Projection optical system PL is used for the pattern of mask M with predetermined projection multiplication factor β projection exposure to substrate P, it is made of a plurality of optical elements, comprise the optical element (lens) 2 of the terminal part office that is placed on substrate P one side (image surface one side of projection optical system PL), these optical elements are supported by lens barrel PK.In an embodiment, projection optical system PL is the system that dwindles, and its projection multiplication factor β for example is 1/4 or 1/5.Should be pointed out that projection optical system also can be magnification ratio system of unit or amplification system.The optical element 2 of the terminal part office of the projection optical system PL that should be pointed out that at embodiment is arranged with respect to lens barrel PK detachable (commutative), and the liquid 1 that liquid soaks regional AR2 contacts with optical element 2.
In an embodiment, pure water is used as liquid 1.Pure water singly can not transmit ArF and swash base laser light, and can transmit by the bright line (g line, h line, i line) of the ultraviolet range of mercury vapor lamp emission and swash the extreme ultraviolet light (DUF light) of base laser light (wavelength of 248nm) such as KrF.
Optical element 2 is made by fluorite.Because fluorite has high affinity for water, liquid 1 can be made basically with the whole surface of the liquid contact surface 2a of optical element 2 and closely contact.More specifically, in the present embodiment, because it is configured to supply the liquid (water) 1 that has for the high affinity of the liquid contact surface 2a of optical element 2, at the liquid contact surface 2a of optical element 2 and the exposure level between the liquid 1 is high, like this, the path of the light between optical element 2 and substrate P can guarantee to be full of with liquid 1.Should be pointed out that optical element 2 can be made by quartz, it has high affinity for glassware for drinking water.And the liquid contact surface 2a that can be configured to optical element 2 is applied in hydrophilic (lyophile) processing, to strengthen the affinity for liquid 1.
Chip bench PST is used for supporting substrate P, and it is equipped with Z platform 52, and this Z platform keeps substrate P via the substrate retainer; XY platform 53 is used for supporting Z platform 52; With pedestal 54, be used for supporting XY platform 53.Chip bench PST is driven by the chip bench driver PSTD such as linear motor.Chip bench driver PSTD is controlled by controller CONT.By driving Z platform 52, Z direction position (focal position) and θ-X and the θ-Y direction position Be Controlled of the substrate P that keeps by Z platform 52.And, by driving XY platform 53, the X-Y direction position of substrate P (substantially being parallel to the position on the direction of image surface of projection optical system PL) Be Controlled.And Z platform 52 makes that by means of autofocus system and automatically levelling system substrate P surface is consistent with the image surface of projection optical system PL by control focal position and the inclination angle of substrate P.The location of the substrate P that XY platform 53 is carried out in X-axis and Y direction.Should be pointed out that need not that Z platform and XY platform can integrally be made up.
On chip bench PST (Z platform 52), moving lens 55 is set.And, provide laser interferometer 56 in position in the face of moving lens 55.The two-dimensional position of substrate P and the anglec of rotation are measured in real time by laser interferometer 56 on chip bench PST, and measurement result is output to controller CONT.By the measurement result drive substrate platform driver PSTD of basis from laser interferometer 56, controller CONT carries out the location of the substrate P that is supported by chip bench PST.
And, on chip bench PST (Z platform 52), provide annular plate part 57, so that around substrate P.Plate portion 57 has plane surface 57A, and its height is substantially equal to the height by the surface of the substrate P of substrate retainer maintenance.0.1 to 1mm the slit though between the edge of substrate P and plate portion 57, have an appointment, but because the surface tension of liquid 1, liquid 1 is difficult to flow to the slit, therefore, even when exposing the periphery of substrate P, liquid 1 can by means of plate portion 57 be maintained at projection optical system PL below.
Liquid organization of supply 10 is to be used for 1 supply of predetermined liquid at substrate P, this liquid organization of supply be equipped with can transmit fluid 1 the first liquid supply section 11 and the second liquid supply section 12; And the first supply line 11A and the second supply line 12A also being equipped with, the end portion of each pipeline is connected to the first liquid supply section 11 and the second liquid supply section 12 respectively.Each of the first liquid supply section 11 and the second liquid supply section 12 all has container, booster pump of storage of liquids 1 or the like.
Liquids recovery mechanism 20 is used to reclaim the liquid 1 that is supplied on the substrate P, it be equipped with can withdrawal liquid 1 liquids recovery part 21; And recovery channel 22 (first to the 4th recovery channel 22A-22D) also being equipped with, its end portion is connected to liquids recovery part 21.Place, centre position at recovery channel 22 (first to the 4th recovery channel 22A-22D) provides spherical parts 24 (first to the 4th spherical parts 24A-24D).Liquids recovery part 21 has the vacuum system (aspirator) such as vacuum pump and stores container of the liquid 1 that is recovered or the like.
Flow path forms near the optical element 2 of terminal part office that parts 30 are held in place projection optical system PL.
It is endless members that flow path forms parts 30, is provided to be looped around the optical element 2 of substrate P top.Flow path forms parts 30 and is equipped with the first supply port 13 and the second supply port 14, and they are provided at the top of substrate P (chip bench PST), and are arranged to the surface in the face of substrate P (chip bench PST).And, flow path form parts 30 have therein supply flow path 82 (82A, 82B).The end of supply flow path 82A is connected to the first supply port 13; Another end portion is connected to the first liquid supply section 11 via the first supply line 11A.The end of supply flow path 82B is connected to the second supply port 14; Another end portion is connected to the second liquid supply section 12 via the second supply line 12A.Flow path forms parts 30 and is equipped with recovery port 23, and it is provided at the top of substrate P (chip bench PST), and is arranged to the surface in the face of substrate P (chip bench PST).In the present embodiment, flow path formation parts 30 have four recovery port 23A-23D.Flow path formation parts 30 also have the recovery path flow 84 (84A-84D) corresponding to recovery port 23 (23A-23D) therein.An end that reclaims flow path 84A-84D is connected to recovery port 23A-23D respectively; Another end portion is connected to liquids recovery part 21 via recovery channel 22A-22D.In the present embodiment, flow path forms the part that parts 30 constitute each mechanism of liquid organization of supply 10 and liquids recovery mechanism 20.
Should be understood that, though first to the 4th recovery channel 22A-22D is connected to single liquids recovery part 21 in an embodiment, but also can be configured to the number of a plurality of (being four in this example) liquids recovery part 21 corresponding to recovery channel, and first to the 4th recovery channel 22A-22D, each is connected to each described a plurality of liquids recovery part 21.
First to the 4th spherical parts 24A-24D that is provided to first to the 4th recovery channel 22A-22D opens and closes the flow path of first to the 4th recovery channel 22A-22D respectively, and the operation of spherical parts is controlled by controller CONT.When the flow path of recovery channel 22 (22A-22D) was opened, liquids recovery mechanism 20 can be from recovery section 23 (23A-23D) suction and withdrawal liquid 1; When the flow path of recovery channel 22 (22A-22D) by spherical parts 24 (24A-24D) when closing, liquid 1 is stopped via the suction and the recovery of recovery port 23 (23A-23D).
The liquid supply operation controlled device CONT control of the first liquid supply section 11 and the second liquid supply section 12.Controller CONT can control the liquid supply of the time per unit on substrate P by the first liquid supply section 11 and the second liquid supply section 12 independently of each other.The liquid 1 that transmits from the first liquid supply section 11 and the second liquid supply section 12 is from forming the supply flow path 82A of parts 30 and 82B supply at the supply port 13 that provides above the substrate P and 14 on substrate P (chip bench PST) via flow path.
And, the liquids recovery operation controlled device CONT control of liquids recovery part 21.Controller CONT may command is by the liquids recovery amount of the time per unit of liquids recovery part 21.Liquid 1 on substrate P (chip bench PST) and that reclaim from the recovery port 23 that provides at substrate P (chip bench PST) is recycled to liquids recovery part 21 via the recovery flow path 84 that flow path forms parts 30.
Lower surface at the flow path formation parts 30 that are arranged at recovery section 23 (in the face of the surface of substrate P side) outside with respect to projection optical system PL forms fluid acquisition face liquid 1, that have predetermined length of catching.Catch face 70 and be surface, and be inclined to and make that catching face 31 is inclined to and makes and separating with the surface of substrate P (being directed upwards towards) with respect to the external position place of the AR1 of view field (liquid soaks regional AR2) with respect to the XY face tilt.Catch face 70 and be applied in the lyophile processing.Because the film that applies on the surface of substrate P (photoresist, anti-reflective film or the like) is usually detested water (detesting liquid), catch on the liquid 1 that flows to the outside of recovery port 23 surface 70 that is hunted down.Should be pointed out that because the liquid 1 of present embodiment is the water with big polarity to have the film of material of the molecular structure of big polarity by formation, for example, alcohol, as being applied to hydrophilic (lyophile) processing of catching surface 70, hydrophily is given catches surface 70.More specifically, when water was used as liquid 1, the material of the molecular structure of the big polarity of OH base was disposed in lip-deep processing to expect for example wherein have.
Fig. 2 be presented at be formed on flow path form on the parts 30 the first and second supply ports 13 and 14 with the AR1 of view field of projection optical system PL between the plane graph that concerns of position.On Fig. 2, the AR1 of view field of projection optical system PL is set to rectangle, and Y direction (non-scanning direction) is its length direction.Being filled liquid with liquid 1 soaks regional AR2 part and is formed on basically on the part by the substrate P in four recovery port 23A-23D area surrounded, so that comprise the AR1 of view field.The first supply port 13 is disposed in scanning direction one side (X side) with respect to the AR1 of view field, and the second supply port 14 is disposed in another side (+X side).In other words, the first and second supply ports 13 and 14 are disposed in the either side of the both sides of the AR1 of view field respectively so that the AR1 of view field with respect to scanning direction (directions X) between them.The first and second supply ports 13 and 14 are longer than the length of the AR1 of view field in the Y direction at least in the length of Y direction.Liquid organization of supply 10 can from the first and second supply ports 13 and 14 simultaneously supply fluids 1 to the both sides of the AR1 of view field.
First to the 4th recovery port 23A-23D is arranged to surround supply port 13 and 14 and the AR1 of view field.In a plurality of (four) recovery port 23A-23D, each is disposed in the either side of the both sides of view field with respect to directions X the first recovery port 23A and the 3rd recovery port 23C, and the AR1 of view field is between them; Each is disposed in the either side of the both sides of view field with respect to the Y direction the second recovery port 23B and the 4th recovery port 23D, and the AR1 of view field is between them.Supply port 13 and 14 is configured to make supply port 13 to be disposed between AR1 of view field and the recovery port 23A, and supply port 14 is disposed between AR1 of view field and the recovery port 23C.Each is formed that to have when the top is watched be the slot-shaped shape of arc basically recovery port 23A-23D, and has predetermined length.Recovery port 23A and 23C are longer than supply port 13 and 14 length in the Y direction in the length of Y direction.Recovery port 23B is formed identical with 23C with recovery port 23A basically length respectively with 23B.First to the 4th recovery port 23A-23D is connected to liquids recovery part 21 via first to the 4th recovery channel 22A-22D respectively.
Though should be pointed out that each is formed and has basically the size (length) that equates a plurality of in an embodiment recovery port 23A to 23D, they can have different size mutually.And the number of recovery port 23 is not limited to four, and a plurality of recovery port of any number can be provided, as long as they are arranged to around AR1 of view field and supply port 13 and 14.Though it is approximately uniform supplying the gap width of port (13,14) and the gap width of recovery port (23A-23D) on Fig. 2, the gap width of recovery port (23A-23D) can be made into the gap width greater than supply port (13,14).
Fig. 3 is the plane graph of the Z platform 52 of the chip bench PST that watches from the top.Moving lens 55 is arranged in when the mutually perpendicular marginal portion that is foursquare Z platform 52 when the top is watched.In addition, the basic core of Z platform 52 is placed substrate P; Ring plain part 57 with the plane surface 57A on its surface that highly is substantially equal to substrate P integrally is provided so that surround substrate P with Z platform 52.
Two angles of the surperficial 57A of planar section 57 are made into wide; And provide datum mark FM on a wide part, it is used when mask M and substrate P are aligned with respect to preposition.Datum mark FM is detected via mask M and projection optical system PL by the mask alignment system 90 (with reference to Fig. 1) that is provided at mask M top.Just, mask alignment system 90 constitutes the alignment system of so-called TTM (passing through mask) type (being also referred to as TTR (by mechanical) type).Though should be pointed out that not shownly, exposure sources EX also is equipped with off-axis type substrate alignment system, and it is arranged in the side of projection optical system PL, and can detect alignment mask and the datum mark that forms on substrate P.
And, on another wide part of the surperficial 57A of planar section 57, provide optical sensor part 58.Optical sensor part 58 is to be used for detecting the exposure light that passes projection optical system PL, it is made of the luminance sensor that detects the light quantity (brightness) of the irradiation of exposure light on image surface one side of projection optical system PL, or by the luminance non transducer formation that detects in the Luminance Distribution (luminance non) of the AR1 of view field.Optical sensor part 58 is equipped with the transparent component that is provided on the plate part 57, and this transparent component has with the surperficial substantially the same height of substrate P and can send exposure light EL; Also be equipped with the light receiving element that is embedded in Z platform 52 (chip bench PST), be used for receiving the exposure light that passes above-mentioned transparent component.Should be pointed out that in the present embodiment datum mark FM is placed on plate part 57, be used to arrange that datum mark parts datum mark FM, that separate with plate part 57 can be provided at chip bench PST.Similarly, optical sensor part 58 can be provided at the position that separates that is different from plate part 57 that is positioned on the chip bench PST.
As shown in Figure 3, a plurality of shooting area S1-S20 are set on the substrate P, and a plurality of shooting area S1-S20s of controller CONT sequential exposure on substrate P.In the present embodiment, controller CONT monitors the output from laser interferometer 56 in mobile substrate platform PST, like this, the optical axis AX of projection optical system PL (AR1 of view field) extends along the dotted arrow 59 of Fig. 3, and a plurality of shooting area S1-S20 of controller sequential exposure.
Fig. 4 is the general perspective that flow path forms parts 30.
As shown in Figure 4, it is endless members that flow path forms parts 30, be provided to surround the optical element 2 of the end portion that is positioned at projection optical system PL, and first parts 31 are equipped with, be positioned at first parts 31 upper section second parts 32 and be positioned at the 3rd parts 33 of the upper section of second parts 32.Constitute first to the 3rd parts that flow path forms parts 30, each is plate shaped parts, and heart part has perforate part 31A-33A respectively therein, can arrange projection optical system PL (optical element 2).At the mid portion of first to the 4th recovery channel 22A-22D, provide first to the 4th spherical parts 24A-24D respectively.
Fig. 5 is the perspective view that is presented at first to the 3rd parts, first parts 31 middle, that be placed on lowermost layer.
First parts 31 be equipped be formed on projection optical system PL-X one side and supply fluid 1 to the first supply port 13 of substrate P and be formed on projection optical system PL+the second supply port 14 X one side and supply fluid 1 to substrate P.The first and second supply ports 13 and 14 each be the through hole that passes first parts 31, these ports are formed in the arc when the top is watched.And, first parts 31 be equipped be formed on projection optical system PL-first recovery port 23A X one side and that be recovered in the liquid 1 on the substrate P, be formed on projection optical system PL-second recovery port 23B Y one side and that be recovered in the liquid 1 on the substrate P, be formed on projection optical system PL+X one side and be recovered in the 3rd recovery port 23C of the liquid 1 on the substrate P and be formed on projection optical system PL+the 4th recovery port 23D Y one side and that be recovered in the liquid 1 on the substrate P.Each also is the through hole that passes first parts 31 for first to the 4th recovery port 23A-23D, and these ports are formed in the arc when the top is watched, and these recovery port are set up basically equidistantly along the periphery of projection optical system PL.Moreover, first to the 4th recovery port 23A-23D each with respect to projection optical system PL, compared with the supply port 13 and 14 more outwards be set up.Supply port 13 and 14 with substrate P between distance and be set to equate basically in recovery port 23A-23D and distance between the substrate P.That is, the height and position of supply port 13 and 14 height and position and recovery port 23A-23D is set to equate basically.
Fig. 6 A and 6B are presented at perspective view in first to the 3rd parts, that be placed on the second middle parts 32; Fig. 6 A is the perspective view of watching from the top, and Fig. 6 B is the perspective view of watching from below.Second parts 32 be equipped be formed on projection optical system PL-X one side, and when first parts 31 are connected with second parts 32, be connected to first parts 31 the first supply port 13 the first supply perforate part 15 and be formed on projection optical system PL+X one side and be connected to first parts 31 second supply second of port 14 and supply perforate part 16.The first and second supply perforate parts 15 and 16 are through holes, their shape and size from above when watching corresponding to the shape and size of the first and second supply ports 13 and 14.In other words, the first and second supply perforate parts 15 and 16 are formed in the slot-shaped flow path of the arc when the top is watched.
Shown in Fig. 6 B, the lower surface 32D of second parts 32, projection optical system PL-form the first accumulator tank part 25 on X one side, it is connected to the first recovery port 23A of first parts 31 when first parts 31 are connected with second parts 32; Projection optical system PL-form the second accumulator tank part 26 of the second recovery port 23B be connected to first parts 31 on Y one side; Projection optical system PL+form the 3rd accumulator tank part 27 of the 3rd recovery port 23C be connected to first parts 31 on X one side; And projection optical system PL+form the 4th accumulator tank part 28 of the 4th recovery port 23D be connected to first parts 31 on Y one side.Each is formed first to the 4th accumulator tank part 25-28 when being arc basically when the top is watched, with each shape and size corresponding to first to the 4th recovery port 23A-23D, and these accumulator tanks are provided along the periphery of projection optical system PL is equidistant basically.And the first recovery channel 22A and the first accumulator tank part 25 are connected via cone tank part 45.Cone tank part 45 is formed and makes it from expanding gradually with the connecting interface of first recovery channel 22A along continuous straight runs to the process of the first accumulator tank part 25.Similarly, the second recovery channel 22B and the second accumulator tank part 26 are connected via cone tank part 46; The 3rd recovery channel 22C and the 3rd accumulator tank part 27 are connected via cone tank part 47; And the 4th recovery channel 22D and the 4th accumulator tank part 28 be connected via cone tank part 48.
Fig. 7 A and 7B are presented at perspective view in first to the 3rd parts, that be placed on the 3rd parts of going up most 33; Fig. 7 A is the perspective view of watching from the top, and Fig. 7 B is the perspective view of watching from below.In the lower surface 33D of the 3rd parts 33, projection optical system PL-form the first supply tank part 41 on X one side, it is connected to the first supply tank part 41 that first of second parts 32 are supplied perforate part 15 when second parts 32 are connected with the 3rd parts 33; And projection optical system PL+form the second supply tank part 42 of the second supply perforate part 16 be connected to second parts 32 on X one side.The first and second supply tank parts 41 and 42 each be formed when when the top is watched, being arc basically, with corresponding to the first and second supply perforate parts 15 and 16 (and then corresponding to first and second supply ports 13 and 14).And the first supply line 11A and the first supply tank part 41 are connected via cone tank part 43.Cone tank part 43 is formed and makes it from expanding gradually with the connecting interface of first supply line 11A along continuous straight runs to the process of the first supply tank part 41.
Similarly, the second supply line 12A and the second supply tank part 42 are connected via cone tank part 44.
First to the 3rd parts 31-33 is formed by the metal such as stainless steel, titanium, aluminium or their alloy; Perforate part and the slot part of parts 31-33 are formed by for example edm.By come processing unit 31-33 by edm, by using bonding agent or fixed part to come link 31-33, form flow path and form parts 30 then.Should be pointed out that the surface that contacts with liquid preferably is applied in electrobrightening processing or the processing of non-conductor oxidation film.And each parts of liquid organization of supply 10 and liquids recovery mechanism 20 comprise that flow path forms parts 30, can be formed by the synthetic resin such as polytetrafluoroethylene.
For connected parts 31-33, the cone tank part that is linked in sequence 43, the first supply tank part 41, the first supply perforate part 15 and the first supply port 13 form the first supply flow path 82A that is connected to the first supply line 11A by them then.Similarly, cone tank part 44, the second supply tank part 42, the second supply perforate part 16 and the second supply port 14 by being linked in sequence form the second supply flow path 82B that is connected to the second supply line 12A.Therefore, from each liquid 1 of each transmission of the first and second liquid supply sections 11 and 12 from substrate P top via the first and second supply line 11A with 12A supplies flow path 82A with first and second and 82B is supplied to substrate P.
And, by cone tank part 45, the first accumulator tank part 25 and the first recovery port 23A that is linked in sequence, form the first recovery flow path 84A that is connected to the first recovery channel 22A.Similarly, by cone tank part 46, the second accumulator tank part 26 and the second recovery port 23B that is linked in sequence, form the second recovery flow path 84B that is connected to the second recovery channel 22B; By cone tank part 47, the 3rd accumulator tank part 27 and the 3rd recovery port 23C that is linked in sequence, form the 3rd recovery flow path 84C that is connected to the 3rd recovery channel 22C; And cone tank part 48, the 4th accumulator tank part 28 and the 4th recovery port 23D by being linked in sequence, form the 4th recovery flow path 84D that is connected to the 4th recovery channel 22D.Therefore, the liquid on the substrate P above the substrate P via being sucked and reclaiming from first to the 4th above-mentioned each that reclaims the flow path 84A-84D and first to the 4th recovery channel 22A-22D.
In this respect, because cone tank part 43 and 44 is connected to first and second supply line 11A and the 12A respectively, can carry out liquid supply operation, amount of flow distributes and flowing velocity distribution on the whole zone of supply port 13 and 14, be made into uniform, this supply port vertically be positioned at the Y direction.Similarly, because cone tank part 45-48 is connected to recovery channel 22A-22D respectively, can carry out the liquids recovery operation with uniform recovery power.
Fig. 8 is the sectional view of getting along the A-A arrow of Fig. 4; Fig. 9 is the sectional view of getting along the B-B arrow of Fig. 4.Should be understood that, though described in the following description, in flow path forms parts 30, be provided at projection optical system PL+the second supply flow path 82B and the 3rd on X one side reclaims flow path 84C, but be provided at projection optical system PL-the first supply flow path 82A on X one side, first reclaiming flow path 84A, on-Y one side, second reclaim flow path 84B and the 4th reclaiming flow path 84D and have equal structure on+Y one side on-X one side.
On Fig. 8, the second supply flow path 82B is made of above-mentioned cone tank part 44, the second supply tank part 42, the second supply perforate part 16 and the second supply port 14.The liquid that transmits from the second supply port 12 flows to the second supply flow path 82B via second supply line.Flow to the fluid 1 of the second supply flow path 82B, in the cone tank part 44 of the second supply flow path 82B, flow in substantial horizontal direction (XY in-plane), then near the second supply tank part 42 basically by vertically crooked, flow to the second supply perforate part 16 and the second supply port 14 with vertical direction (Z direction) then, be fed to substrate P from substrate P top at last.
The 3rd reclaims flow path 84C is made of the 3rd above-mentioned recovery port 23C, the 3rd accumulator tank part 27 and cone tank part 47.The driving of the liquids recovery part 21 by having vacuum system, vertically make progress at the liquid on the substrate P (+Z direction) flow to the 3rd and reclaims flow path 84C via being provided at the 3rd recovery port 23C on the substrate P.In this process, from the 3rd recovery port 23C, the gas (air) around liquid is together with the liquid on substrate P 1 mobile (recovery).For flowing to the liquid 1 that reclaims flow path 84C, its flow direction is changed near the 3rd accumulator tank part 27, and liquid flows in the substantial horizontal direction in cone tank part 47.After this, liquid is sucked and is recovered to liquids recovery part 21 via the 3rd recovery channel 22C.
Form formation small gap 100 between the side 2T of end portion optical element 2 of the inner surface 30T of parts 30 and, projection optical system PL 1 that contact with liquid at flow path.It is isolated that small gap 100 is provided to aspect vibration the optical element 2 of projection optical system PL and flow path to be formed parts 30, by doing like this, can avoid the vibration that occurs in liquid organization of supply 10 and/or liquids recovery mechanism 20 is sent to projection optical system PL.Each that comprises that flow path forms the liquid organization of supply 10 of parts 30 and liquids recovery mechanism 20 is by the supporting units support that is different from projection optical system PL and is different from the holding components of support projection optical system PL.
On the upper section of the inner surface 30T that should be pointed out that at the flow path formation parts 30 that form small gap 100 and the side 2T of optical element 2, preferably be applied in liquid repellence (water repulsion) and handle.Handle as liquid repellence, for example can list the coating processing of using material with liquid repellence.As material, for example can list fluorine compounds, silicon compound and such as poly synthetic resin with liquid repellence.And thin film can be monofilm or the film be made up of multilayer.At least one face that forms the side 2T of the inner surface 30T of parts 30 and optical element 2 by flow path is applied in this wise with liquid repellence (water repulsions) to be handled, and can avoid the upper section leakage of liquid from small gap 100.Should be pointed out that the seal such as the O ring is disposed in small gap 100, so that seal surrounds optical element 2.
Then, will describe by using above-mentioned exposure sources EX the method for the pattern exposure of mask M to substrate P.
The exposure sources EX of present embodiment in mobile mask M of directions X (scanning direction) and substrate P the pattern image projection exposure of mask M to substrate P; And during scan exposure, the pattern image of part mask M is projected to the following AR1 of rectangle view field of the end portion that is formed on projection optical system PL, and with mask M with speed V edge-directions X (or edge+directions X) synchronized movement ground, substrate P via the XY platform with speed β V edge-directions X (or edge+directions X) move (β is a projection magnification ratio).
As shown in Figure 3, a plurality of shooting area S1-S20 are set on substrate P; After the exposure of finishing a shooting area, next shooting area moves to the scanning starting position by the step motion of substrate P; Like this, the scan exposure process of each shooting area is carried out by adjoining land, and substrate P moves according to stepping and scan method.
In carrying out exposure process, controller CONT drives the liquid supply operation that liquid organization of supply 10 starting handle liquid are fed to substrate P.Flowing through supply line 11A and 12A after be supplied to substrate P from the liquid 1 of each transmission of the first and second liquid supply sections 11 of liquid organization of supply 10 and 12 by being formed on supply flow path 82A and the 82B that flow path forms parts 30 inside.The supply that should be pointed out that liquid 1 can begin on the plane surface 57A of plate part 57.
The liquid 1 that is fed to substrate P flows below projection optical system PL according to the motion of substrate P.For example, when at substrate P between given shooting area exposure period when directions X moves, the direction that liquid 1 edge below projection optical system PL is identical with substrate P, i.e. directions X and to flow with the essentially identical speed of substrate P.
Figure 10 shows wherein the schematic diagram of example of substrate P being carried out the state of exposing operation.On Figure 10, from image surface one side of lamp optical system IL exposure rayed irradiation, that pass mask M at projection optical system PL, thus, the pattern of mask M is exposed on the substrate P via the liquid 1 that projection optical system PL and liquid soak regional AR2.When exposure light EL was irradiated onto image surface one side of projection optical system PL, promptly during the exposing operation of substrate P, controller CONT supplied liquid 1 on substrate P by liquid organization of supply 10.By constantly carried out the supply of liquid 1 by liquid organization of supply 10 during exposing operation, liquid soaks regional AR2 and forms finely.On the other hand, when exposure light EL is irradiated onto image surface one side of projection optical system PL, promptly during the exposing operation of substrate P, controller CONT drives the flow path that each first to the 4th spherical parts 24A-24D closes first to the 4th recovery channel 22A-22D, so liquids recovery mechanism 20 does not carry out the recovery that substrate P goes up liquid 1.By not carrying out the recovery of liquid 1 in (when exposure illumination is mapped to image surface one side of projection optical system PL) liquids recovery mechanism 20 during the exposing operation, sound and the repressed state of vibration that exposure process can cause with the reclaimer operation owing to liquid 1 are performed.
Particularly, in the present embodiment, liquid soaks in the local liquid soaking system and test of a part that regional AR2 is formed on substrate P therein, when adopt wherein by use vacuum system (vacuum pump) via the recovery port 23 of liquids recovery mechanism 20 from the top suction of substrate P with when reclaiming the configuration of the liquid 1 on the substrate P, make and might liquids recovery mechanism 20 reclaim liquid 1 (seeming to swallow gas) on the substrate P together with the gas around the liquid.When liquids recovery mechanism 20 seemed to swallow gas ground withdrawal liquid via recovery port, occurring wherein, liquid 1 flow to the situation that reclaims flow path 84 (84A-84D) off and on.Flow to the liquid 1 that reclaims flow path 84 and be divided into form (for example, the water droplet form) then, and liquid 1 is inconsistent with recovery flow path 84 and/or recovery channel 22, generates sound and vibration with particle.Therefore, by not carrying out the recovery of liquid 1 in (when exposure illumination when being mapped to image surface one side of projection optical system PL) liquids recovery mechanism 20 during the exposing operation, exposure process can so that since the state that sound that the reclaimer operation of liquids recovery mechanism 20 causes and vibration do not produce be performed.
Should be understood that, though it is configured to close recovery channel 22 by driving spherical parts 24 here, do not carry out the recovery of liquid 1, but also can be configured to not use spherical parts 24, by for example stopping to drive the vacuum system (vacuum pump) that constitutes liquids recovery part 21, do not carry out the recovery of liquid 1 (when exposure illumination is mapped to image surface one side of projection optical system PL) during the exposing operation.
In the present embodiment, during exposing operation, liquid organization of supply 10 is fed to substrate P with liquid 1 simultaneously from supply port 13 and 14 two faces from the AR1 of view field.By doing like this, the liquid 1 that is fed to substrate P from supply port 13 and 14 enters the lower end face of the end portion (optical element 2) at projection optical system PL and the space between the substrate P with liquid wets surface and the substrate that expands to and the good condition of packing space, so liquid formation liquid at least greater than the zone of the AR1 of view field soaks regional AR2.
Should be understood that, when the both sides supply fluid of the scanning direction of the AR1 of view field is to substrate P, controller CONT can be by controlling liquid organization of supply 10 the first and second liquid supply sections 11 and 12 liquid supply operation, be provided with from the time per unit liquid of the liquid of the supply of supplying previously of the AR1 of view field in large supply with respect to the scanning direction in liquid supply from the liquid of the supply of opposite face supply.For example, when substrate P edge+directions X moved that simultaneously substrate is exposed, controller CONT made with respect to the AR1 of view field from the amount of liquid of-X one side (that is, from supply port 13) greater than the amount of liquid from+X one side (that is, from supply port 14); On the other hand, when substrate P edge-directions X moved that simultaneously substrate is exposed, controller CONT made with respect to the AR1 of view field from the amount of liquid of+X one side greater than the amount of liquid from-X one side.
It should be pointed out that if also can be configured to by omitting a supply port (for example, supply port 13) or by not using a supply port (for example, supply port 13), then liquid 1 is constantly supplied from another supply port 14.
Here, might be by for example edge+directions X mobile substrate P, with respect to the amount of liquid increase of the AR1 edge+X of view field one side shifting, and a large amount of liquid flows out to substrate P outside.Yet,, can suppress liquid and flow out or disperse to for example shortcoming of the peripheral region of substrate P because the liquid 1 of edge+X one side shifting will be by catching at+the face of catching 70 that the X side provides under the surface that forms parts 30 at flow path.
During exposing operation, do not carry out the liquids recovery operation of being undertaken by liquids recovery mechanism 20.After finishing exposure, controller CONT drives spherical parts 24, opens the flow path of recovery channel 22, and is recovered in the liquid 1 on the substrate P.Here, before by liquids recovery mechanism 20 beginning withdrawal liquid 1, a part of liquid 1 on substrate P is kept by the recovery port 23 (23A-23D) of liquids recovery mechanism 20, as shown in figure 10.During this, recovery port (liquid retaining part) 23 utilizes capillarity to keep liquid 1.In recovery port 23, upwards move by means of capillarity at a part of liquid 1 on the substrate P, and predetermined amount of liquid is kept by recovery port 23.As describing just now, do not carry out suction and reclaimer operation by liquids recovery mechanism 20, predetermined amount of liquid 1 can be held (recovery) by means of capillarity, and does not produce vibration or the like.In addition, be recovered port 23 by predetermined amount of liquid 1 and keep, the amount that flows out to the liquid 1 of substrate outside from substrate P between exposure period can be reduced.
Should be pointed out that in order to keep liquid 1 well by utilizing capillarity, reclaim near internal face flow path 84, recovery port at least and preferably be applied in lyophile processing (hydrophilic treated) by recovery port 23.By doing like this, recovery port 23 (reclaiming flow path 84) can keep liquid 1 well by utilizing capillarity.Because the liquid 1 of present embodiment is the water with big polarity, by material with molecular structure with big polarity, alcohol for example, form thin film as the hydrophilic treated (lyophile processing) that recovery port 23 is applied, near the internal face of the recovery flow path 84 recovery port can be given hydrophily, or pass through irradiating ultraviolet light thereon, can give hydrophily.
Should be pointed out that the lyophile processing may be used on surface flow path, near the surface the recovery port 23 except liquid organization of supply 10 and liquids recovery mechanism 20.
In the present embodiment, as shown in Figure 3, a plurality of shooting area S1-S20 are set up on substrate P, and a plurality of shooting area S1-S20 are sequentially exposed, and chip bench PST is moved simultaneously.During this is handled, carry out continuously from the liquid supply of supply port 13 and 14.On the other hand, the time interval of controller CONT between the exposure of the end exposure of given shooting area and next shooting area begins (in stepping time at least a portion at interval) inner control is recovered in liquid 1 on the substrate P by liquids recovery mechanism 20.
Figure 11 be show wherein the exposure of given shooting area finish and the exposure of the next shooting area inherent substrate P of the time interval (stepping time at interval) between beginning on the schematic diagram of example of the state that reclaims by liquids recovery mechanism 20 of liquid.
On Figure 11, exposure light EL is not radiated at image surface one side of projection optical system PL, and controller CONT drives the flow path that spherical parts 24 is opened recovery channel 22.By doing like this, at the liquid 1 of substrate P by being disposed in recovery port 23 suctions above the substrate and reclaiming.In this case, because the liquid 1 on substrate P is recovered together with the gas (being swallowed as gas) that surrounds liquid 1, liquid 1 flows to off and on and reclaims flow path 84.Flow to reclaim flow path 84 liquid 1 then, as shown in figure 11, be divided into form (for example, the water droplet form), and this liquid 1 generates sound and vibration with to reclaim flow path 84 and/or recovery channel 22 inconsistent with particle.Yet because during this is handled, exposure light does not shine image surface one side of projection optical system PL, and promptly the pattern of mask M is not exposed on the substrate P, and sound that is produced and vibration do not influence exposure accuracy.Though the amount in stepping time interim liquids recovery time and recovery of should be pointed out that preferably is provided so that between the shutter exposure period that is being right after in front and is recovered as much as possible with the light-struck liquid of exposure, do not need to reclaim all liquid.In addition, the amount of liquids recovery time and recovery preferably is provided so that in the light path space of image surface one side of optical element 2 and is filled with liquid 1.
Controller CONT between the exposure of end exposure that is included in given shooting area and next shooting area begins, by continuing by liquid organization of supply 10 withdrawal liquid 1 in the time interval in reclaimer operation time interval of the liquid on 20 couples of substrate P of liquids recovery mechanism.By doing like this, can avoid the generation (so-called water hammer) of the vibration of the supply of the repetition liquid 1 that between projection optical system PL and substrate P, takes place and supply stop liquid 1.If the generation water hammer, because vibrating liquid 1, it worsens pattern image, and causes that throughput reduces, and for example needs to be provided with, the stand-by period till the vibration calmness of liquid 1.Yet, by proceeding the supply of liquid 1 during the above-mentioned time interval of not shining exposure light therein, when next shooting area exposure begins, space between optical element 2 and substrate P can fully be filled with liquid 1, therefore can suppress the shortcoming such as exposure accuracy reduces and throughput reduces.Should be understood that, can be different with liquid supply during exposing operation in stepping time interim from the supply port 13 of liquid organization of supply 10 and 14 liquid supply, for example, may make liquid supply in stepping time interim less than the liquid supply during exposing operation.
Here, controller CONT controlling liquid recovering mechanism 20 after the exposure of the shooting area of at every turn finishing predetermined number is carried out the recovery of liquid 1.For example, controller CONT carries out the recovery of liquid 1 in a time interval after the exposure of at every turn finishing four shooting areas in the middle of a plurality of shooting area S1-S20.In this case, finish shooting area S4 at every turn, S8, S12 carries out the recovery of liquid 1 after the exposure of S16 and S20.Particularly, in shooting area S4 (S8, S12, S16, end exposure S20) and next shooting area S5 (S9, S13, the recovery of execution liquid 1 in the time interval between exposure S17) begins.Certainly, predetermined number is not limited to " 4 ", but can be " 1 ", promptly can carry out the recovery of liquid 1 for each shooting area.Alternatively, controller CONT can finish predetermined shooting area exposure back execution recovery.For example, carry out liquids recovery by being defined in the time interval after the exposure of finishing the tenth shooting area S10, at least part-time of controller CONT between the exposure of the end exposure of shooting area S10 and next shooting area S11 begins at interval in the recovery of execution liquid 1.By doing like this, can avoid liquid 1 to flow out to the shortcoming of the outside of substrate P.
And, the recovery of controller CONT controlling liquid recovering mechanism 20 execution liquid 1 during the exposure of given shooting area is finished the back and is being used for next shooting area step motion exposure, substrate P.In example shown in Figure 3, (S14 is after finish and be used for next shooting area S3 (S7, S11, S15, S19) recovery exposure, that carry out liquid 1 during the step motion of substrate P for S6, S10 by exposure S18) at shooting area S2 for controller CONT.During the step motion time interval, the pattern of mask M is not exposed to substrate P, therefore, by carry out the recovery of liquid 1 in this time interval, can suppress the influence to exposure accuracy that applies for the vibration that the recovery by liquid 1 causes.
After finishing for the exposure process of all shooting area S1-S20, promptly after the exposure of a substrate P was finished, controller CONT carried out suction and reclaims for remaining liquid 1 on substrate P and chip bench PST.Because, in the present embodiment, might remain on substrate P and the chip bench PST by liquid 1, though it is just a small amount of, controller CONT is after the exposure of a substrate P is finished, and the vacuum system of driving liquids recovery mechanism 20 aspirates and be recovered in substrate P via the recovery port 23 of liquids recovery mechanism 20 and chip bench PST goes up remaining liquid 1.After the exposure of a substrate P is finished, be recovered under the situation of the liquid 1 on the substrate P, controller CONT relatively move the recovery port 23 of the liquids recovery mechanism 20 that is disposed in chip bench PST top and when keeping substrate P chip bench (substrate holding member) PST movably so that be recovered in liquid 1 on substrate P or the chip bench PST.
Figure 12 shows wherein after the exposure of a substrate P is finished, the schematic diagram of the example of the mode that the chip bench PST that keeps substrate P moves on the XY plane with respect to the recovery port 23 of liquids recovery mechanism 20.
Controller CONT moves the XY platform, so that the recovery port 23 of liquids recovery mechanism 20 is advanced along the dotted arrow 60 of Figure 12.By XY face translational motion along chip bench PST, the entire upper surface basically of recovery port 23 scanning substrate P and chip bench PST; By doing like this, remaining liquid 1 is reclaimed via recovery port 23 reliably by liquids recovery mechanism 20 on substrate P and chip bench PST.
Should be understood that, though on figure shown in Figure 12, substrate P and chip bench PST follow wherein and repeat directions X scanning motion and Y direction step motion motion track with respect to recovery port 23, but movement locus can differently be provided with, be that they for example can follow the spiralling track, shown in the dotted arrow 61 of Figure 13, wherein be provided with the inside that begins to advance to gradually substrate from the outside of substrate P (or, from the inside to the outside) circuit orbit, or can move along the concentric circles that a plurality of circles wherein are set.
Should be understood that, it also can be configured to form parts 30 by motion being provided to the flow path with recovery port 23, come withdrawal liquid 1 and make recovery port 23 move simultaneously, or make recovery port 23 and chip bench PST all move along the chip bench PST of XY direction with respect to substrate P and maintenance substrate P.
And, in the time of also can being configured to the liquid 1 on being recovered in substrate P as mentioned above, make distance between the surface of projection optical system PL (optical element 2) and substrate P, i.e. distance between the surface of recovery port 23 and substrate P is less than the distance between exposure period.By doing like this, can improve the efficient that reclaims the liquid on the substrate P, and the liquid on the substrate P can be reclaimed reliably.This method is worked effectively, particularly when the liquid on the recovery substrate P after the exposure of a substrate P is finished.
And, also can be configured at mobile substrate platform PST so that, shown in the dotted arrow 62 of Figure 14, on chip bench PST, recovery port 23 is followed along the movement locus of the slit G1 between the plane surface 57A of the edge of substrate P and plate part 57, uses recovery port 23 to carry out reclaimer operations (suction operation).By doing like this, single remaining liquid on substrate P or plate part 57 not, and also the liquid 1 that has been penetrated among the G1 of slit also can reclaim well.Therefore, can avoid liquid 1 to be penetrated into chip bench PST the inside and the shortcoming of getting rusty and leaking electricity in chip bench PST the inside via slit G1.And, when the reclaimer operation carried out for slit G1, the translational speed of chip bench PST can be made into less than the translational speed when the reclaimer operation on the upper surface of surface of carrying out substrate P and chip bench PST, or when the motion that repeats chip bench PST and stopping, can carrying out near the recovery of the liquid the G1 of slit.And, when carrying out near the reclaimer operation of the liquid the G1 of slit, can also so that, promptly being in chip bench PST less than the distance during the immersion exposure of substrate P, the distance between recovery port 23 and chip bench PST (substrate P) be positioned at the state execution reclaimer operation that more approaches recovery port 23 to the lifting of chip bench PST edge+Z direction.Certainly, when the reclaimer operation on the upper surface (for example, the plane surface 57A of plate part 57) of surface of carrying out substrate P and chip bench PST, substrate P or chip bench PST can be positioned at and more approach recovery port 23, are similar to above-mentioned situation.Moreover, can be configured to that also the Z driving mechanism is provided to the flow path with recovery port 23 and form parts 30, and when after substrate P exposure, making recovery port 23 and chip bench PST adjacent to each other when carrying out liquids recovery, flow path forms parts 30 edge-Z directions and moves so that more approach chip bench PST, or flow path forms parts 30 and chip bench PST moves.
Should be understood that, after nearly all liquid 1 in the light path space of image surface one side of the optical element 2 of filling projection optical system PL is reclaimed by recovery port 23, preferably begin flow path and form the recovery port of parts 30 and the relative motion between the chip bench PST, with remaining liquid on the upper surface of the surface that is recovered in substrate P and chip bench PST.
And, as shown in figure 14, form on the substrate P, under the situation as the configuration of the groove part NT of cutting part, it can be configured to make after the immersion exposure of substrate P is finished, controller CONT is placed to groove NT in the face of substrate P to the recovery port 23 of liquids recovery mechanism 20, and emphasis is carried out liquids recovery operation (suction operation).Here, on Figure 14, be formed on the inner surface of plate part 57 corresponding to the bossing 57B of the shape of groove part NT, and predetermined slit G2 is formed between the inner surface of groove part NT and bossing 57B.Very possible liquid is penetrated among the slit G2 between groove part NT and bossing 57B; Yet, by strengthening carrying out near the reclaimer operation groove part NT, can avoid liquid 1 to be penetrated into slit G2, even and liquid 1 infiltration, liquid 1 also can be recovered.Therefore, can avoid liquid 1 to be penetrated into chip bench PST the inside and take place in chip bench PST the inside to pollute and the shortcoming of electric leakage via slit G2.And, when when using near the reclaimer operation that recovery port 23 carries out groove part NT, the state that reclaimer operation can stop with respect to recovery port 23 at chip bench PST is promptly carried out under the state that remains on the relative position between recovery port 23 and the groove part NT.Alternatively, when near carry out groove part NT reclaimer operation, can be so that the translational speed of chip bench PST be compared lower with the translational speed when the reclaimer operation carried out on above-mentioned slit G1 and/or when the reclaimer operation on the upper surface of the surface of execution substrate P and chip bench PST.
Should be pointed out that the above-mentioned liquids recovery on slit G1 and slit G2 can be performed with the liquids recovery operation shown in Figure 12 and 13 combinedly.
In addition, explanation is to make for the groove part NT as cutting part as an example, even but still can be performed well by strengthening carrying out near the reclaimer operation the orientation flat at reclaimer operation under the situation of the configuration that forms the orientation flat on the substrate P therein.
As mentioned above, for example during the exposing operation of substrate P by when exposure light EL is radiated at image surface one side of projection optical system PL, liquids recovery mechanism 20 does not carry out the recovery of liquid 1, can be so that do not generate during the exposing operation of substrate P because sound and the vibration that the reclaimer operation of liquid 1 causes.Therefore, owing to sound and the shortcoming of vibrating the exposure accuracy reduction that causes can be avoided.
And, in the present embodiment, by finish the maintenance substrate is moved in the back with respect to the recovery port 23 of liquids recovery mechanism 20 on the XY direction chip bench PST in substrate P exposure, be not recovered and can be recovered at remaining liquid 1 on substrate P and the chip bench PST and at the slit G1 of the edge of substrate P and the liquid among the G2 of slit.Therefore, can avoid because remaining liquid is 1 that cause, such as watermark appears, equipment gets rusty and the generation of the shortcoming of the variation of environment.
Should be understood that, though in an embodiment controller CONT when image surface one side of exposure rayed at projection optical system PL by using spherical parts 24A-24D to close all flow paths of recovery channel 22A-22D, but also can be configured to flow path by some recovery channel, for example be connected to and be located at the AR1 of view field and be closed at the recovery port 23B of the either side of non-scanning direction and recovery channel 22B and the 22D flow path of 23D, and the flow path of other recovery channel 23A and 23C is opened, and carries out the reclaimer operation of liquid during exposing operation by recovery port 23A and 23C.By doing like this, because producing the position, vibration reduces, the layer that influences that is applied to exposure accuracy reduces.Alternatively, for example can be arranged such that also that each recovery port 23A-23D (recovery channel 22A-22D) is connected to one of liquids recovery part separately independently of each other, and in a plurality of liquids recovery parts (vacuum system), part liquids recovery partly is driven, and another part liquids recovery part is not driven.
And, in the above-described embodiment, when between exposure period and/or before exposure/after be included on the edge of substrate P and the border between the plate part 57 liquid soak among the regional AR2 such shooting area (for example, S3, S6, S15, the sweep speed of the substrate P when S18) being exposed (chip bench PST) can be set to be lower than when near the center that be positioned at substrate P shooting area (for example, the S9) sweep speed of the substrate P when being exposed.By doing like this, even between the surface of the plane surface 57A of plate part 57 and substrate P, a point height difference is arranged, therefore the pressure change of the liquid 1 between projection optical system substrate P also can be suppressed, and can avoid the variation of the projection optical system PL (lens 2) that caused by pressure change and the variation of chip bench PST.The outflow of liquid 1 and distribution also can be suppressed.And by not limiting exposure time interval, when being positioned at liquid on the edge of substrate P and the border between the plate part 57 and soaking regional AR2, the translational speed of chip bench PST can be set to lower value.
By the way, the above embodiments are by wherein by means of the exposure light EL of image surface one side that is irradiated onto projection optical system PL, the pattern exposure of mask M is described in the situation of the example of substrate P, but the present invention also can be for example be employed in the operating period of detecting exposure light EL under image surface one side of the projection optical system PL situation detected via projection optical system PL and the liquid that kept below projection optical system PL 1 by the optical sensor part 58 that is placed on the chip bench PST at exposure light.Just when exposure light EL is radiated at optical sensor part 58 on the chip bench PST via projection optical system PL and liquid 1, controller CONT not controlling liquid recovering mechanism 20 carries out the recovery of liquid 1.By doing like this, because do not occur because sound and the vibration that the recovery of liquid 1 causes can be avoided because the shortcoming that the accuracy of detection that sound and vibration cause reduces in the operating period of detecting exposure light EL.
When detecting exposure light EL by use optical sensor part 58, controller CONT is (or afterwards) mobile substrate platform PST before the exposure-processed for substrate P, so that projection optical system PL and optical sensor part 58 face one another, then from liquid organization of supply 10 supply fluid 1 between projection optical system PL and optical sensor part 58.And, thereby the space between projection optical system PL and the optical sensor part 58 be filled form liquid with liquid 1 and soak regional AR2 after, controller CONT is from lamp optical system IL emission exposure light EL, and an exposure light is radiated at optical sensor part 58 via projection optical system PL and liquid 1.At this moment, do not carry out the recovery of 20 pairs of liquid 1 of liquids recovery mechanism.The testing result of optical sensor part 58 is output to controller CONT, controller CONT carries out such adjustment processing according to testing result then, imaging characteristic adjustment and/or brightness adjustment at for example projection optical system PL, perhaps under the state of wanting of the temperature adjustment of liquid, make exposure light EL can be radiated at image surface one side of projection optical system PL.And after optical sensor part 58 was finished detecting operation, controller CONT carried out the recovery of 20 pairs of liquid 1 of liquids recovery mechanism.And after the recovery of finishing above-mentioned adjustment processing procedure and liquid 1, controller CONT initiates the exposing operation for substrate P.Should be understood that, be radiated in the liquids recovery operation of carrying out optical sensor part 58 backs at exposure light EL, controller CONT can also describe as reference Figure 12, be recovered in chip bench PST and go up after the remaining liquid 1 by fully carrying out, carry out exposure process with respect to the recovery port 23 mobile substrate platform PST (optical sensor part 58) of liquids recovery mechanism 20.
Should be understood that, though in each the above embodiments, be configured to make when the light from lamp optical system IL emission is irradiated onto the plane of delineation side of projection optical system PL, do not carry out the recovery of liquid 1, be not limited to exposure light EL from lamp optical system IL but be radiated at light on image one side.For example, when for mask M and substrate P are aimed at preposition, by using mask alignment system 90, when detecting the datum mark FM that is provided on the chip bench PST by TTM (TTR) type system, the light of the aligning different with the exposure light EL that launches from lamp optical system IL is launched from the mask alignment system 90 that is positioned on the mask M.Alignment light is irradiated onto datum mark FM via the alignment mask and the projection optical system PL that are formed on the mask M.In this respect, it is contemplated that wherein at projection optical system PL and have datum mark FM and under the space between the datum mark parts on the chip bench PST was filled state with liquid 1, the rayed of above-mentioned aligning was in the detected then configuration of datum mark FM; But also be in this case, by during detecting operation for datum mark FM, promptly when image surface one side of the rayed of aiming at projection optical system PL, do not carry out recovery, can under sound and the repressed state of vibration, carry out detecting operation for datum mark FM by 20 pairs of liquid 1 of liquids recovery mechanism.
And in the above-described embodiment, it is configured to make that after the exposure of finishing a substrate P by the entire upper surface basically by recovery port 23 scanning substrate P and chip bench PST, remaining liquid 1 is recovered.Yet, under the situation that does not have remaining liquid (or only remaining some amount of liquid) on substrate P and the chip bench PST, can omit for the whole scanning of the upper surface of substrate P and chip bench PST therein by recovery port 23.Can also be configured to only carry out by the scanning of recovery port 23 finishing exposure back, and can omit for the scanning of the upper surface of chip bench PST for the whole face of substrate P.
Though should be pointed out that and carry out in an embodiment, can also be configured to omit each operation at the reclaimer operation of stepping time interim with by the reclaimer operation of recovery port 23 for remaining liquid on the upper surface of substrate P (chip bench PST).
Then, another embodiment of exposure sources of the present invention will be described with reference to Figure 15.In the following description, identically with in the above embodiments those represent with identical label, and their explanation will be abridged or be omitted with component units equivalence.
In the present embodiment, also between substrate P exposure period, carry out for suction and reclaimer operation by liquids recovery mechanism 20 at the liquid on the substrate P 1.And present embodiment is characterised in that between substrate P exposure period by liquid organization of supply 10 time per unit liquid of supply fluid on substrate P in large supply in by the time per unit liquids recovery amount of liquids recovery mechanism 20 from substrate P withdrawal liquid.
As shown in figure 15, between substrate P exposure period, controller CONT is from the supply port 13 and 14 supply fluids 1 of liquid organization of supply 10, and, soak regional AR2 with the liquid that is formed on the liquid 1 between projection optical system PL and the substrate P simultaneously by recovery port 23 suctions of liquids recovery mechanism 20 be recovered in liquid 1 on the substrate P.In this processing procedure, controller CONT makes by liquid organization of supply 10 time per unit liquid of supply fluid on substrate P in large supply in by the time per unit liquids recovery amount of liquids recovery mechanism 20 from substrate P withdrawal liquid between substrate P exposure period.
By doing like this, even in liquids recovery mechanism 20 suction and be recovered in liquid 1 on the substrate P above the substrate P, recovering mechanism is together with the gas withdrawal liquid of surrounding liquid, and when sound and vibration took place thus, such sound and/or vibration still can be reduced.More specifically, as mentioned above, the reason that sound and vibration take place is the gas swallowed, and liquid 1 flows into recovery flow path 84 off and on via recovery port 23; Flow into the recovery flow path off and on by liquid 1, liquid 1 is separated into particle; And such sound and/or vibration take place in liquid 1 and recovery flow path 84 and/or recovery channel 22 collisions by being separated into.In order to address this problem, by make liquid between exposure period be fed to the liquid of substrate P in large supply in yield so that in recovery port 23A-23D, fill as much as possible with liquid, make when liquids recovery mechanism 20 during together with gas withdrawal liquid 1 ratio of liquid bigger.
By doing like this, the quantitative change of the gas of being swallowed is for littler, can reclaim flow path 84 so that liquid 1 flows into basically continuously via recovery port 23, flow into the liquid 1 that reclaims the flow path from recovery port 23 and be difficult to be separated into particle, therefore can reduce sound and/or vibration.
Should be pointed out that in the present embodiment, also can be configured to by omitting a supply port (for example, supply port 13) or by not using a supply port (for example, supply port 13), liquid 1 is supplied continuously from another supply port 14.
And, also can be configured to, describe as reference Figure 12 and 13, controller CONT moves the chip bench PST that keeps substrate P with respect to the recovery port 23 of liquids recovery mechanism 20 after substrate P exposure is finished, be recovered in the liquid 1 on substrate P or the chip bench PST.
And, as shown in figure 14, also can be configured to be recovered in the slit G1 at the edge that is positioned at substrate P and the liquid at G2 place.Because feasible in the present embodiment in large supply in the time per unit liquids recovery amount by liquids recovery mechanism 20 withdrawal liquid by the liquid of liquid organization of supply 10 supply fluids, the liquid 1 that might also not be recovered remains on substrate P and/or the chip bench PST.Therefore, after substrate P exposure is finished,,, can avoid liquid 1 to remain in the generation of the shortcoming on substrate P and/or the chip bench PST with withdrawal liquid 1 by with respect to recovery port 23 mobile substrate P and the chip bench PST that keeps substrate P on the XY direction.
Should be understood that, though in referring to figs. 1 to 15 each embodiment that describes, be configured to liquid organization of supply 10 supply port 13 and 14 each be provided at the either side of the AR1 of view field both sides of (X-direction) in the scanning direction, but also can be configured to also provides supply port separately by the either side in the both sides of non-scanning direction (Y direction), and the liquid supply can be performed by making up these a plurality of supply ports.Alternatively, the supply port can be provided as ring-type supply port, so that surround the whole periphery of the AR1 of view field.
Though should be pointed out that be configured in the above-described embodiment catch the surface 70 each be provided at the either side of the AR1 of view field in the both sides of scanning direction, also can be configured to catch the surface and be provided at the both sides of the AR1 of view field in non-scanning direction.On the other hand, just on the scanning direction, liquid 1 is suitable for flowing out, and therefore, even be provided along the scanning direction being configured to catch 70 on surface, the liquid 1 that flow out can be caught well.In addition, catch surface 70 and need not be plane surface; For example, the surface can be configured by making up a plurality of plane surfaces.Alternatively, catching surface 70 can be curved surface, and can be applied to surface area increase processing, and particularly, surface roughening is handled.
Though should be pointed out that flow path formation parts 30 are formed by using three parts in the above-described embodiment, part count is not limited to " three ".And, though form in the above-described embodiment flow path form parts 30 parts 31-33 each be tetragonal plate-shaped part, they can be that circular plate-shaped part maybe can elongate at directions X, oval-shaped plate-shaped part.Moreover, with the supply flow path that is communicated with of port 13 and 14 and with recovery port 23A, 23B, the flow path of 23C and 23D connection can be formed with the parts that separate, and the flow path that is used for each port can be formed with each parts that separate.
Should be understood that, can integrally be provided in the flow path formation parts 30 though supply flow path 82 in an embodiment and reclaim flow path 84, but supply flow path 82 can be formed by mutual different parts with recovery flow path 84, as shown in figure 16.On Figure 16, projection optical system PL (optical element 2)-first supply part 120 that forms supply flow path 82A is provided on the directions X, and+-provide second supply part 121 that forms supply flow path 82B on the directions X.First supply part 120 and second supply part 121 have cone tank part 43 and cone tank part 44 respectively, and respectively from when the supply port 13 of arc when the top is watched and supply port 14 supply fluids 1 to substrate P.And, form optical element 2 and first and second supply parts 120 and 121 that the recovery part 122 that reclaims flow path 84 is provided to surround projection optical system PL.In the present embodiment, be connected to the recovery port 23 that reclaims flow path 84 and be formed annular, so that recovery port is surrounded the AR1 of view field of projection optical system PL and the periphery of supply port 13 and 14.In addition, a plurality of (four) conical flow paths 123 and recovery channel 22 are connected to recovery port 23.
Should be understood that, though be configured in the above-described embodiment make that chip bench PST is equipped with annular plate part 57, be provided to surround substrate P, but also can be configured to, shown in Figure 17 A and 17B, the upper surface of chip bench PST is set to upper surface and constitutes and surperficial identical plane by the substrate P of chip bench PST support.Here, Figure 17 A is the end view of chip bench PST; Figure 17 B is a plane graph.On Figure 17 A and 17B, on chip bench PST, provide sunk part 52B; The substrate retainer PH that keeps substrate P is provided in sunk part 52B.In addition, the height of the upper surface 52A except sunk part 52B of chip bench PST is substantially equal to the height (same plane) of plane surface on the surface of the substrate P that kept by the substrate retainer.In addition, the height of the upper surface of moving lens 55 also basically with the height identical (same plane) of the upper surface 52 of chip bench PST.
After the immersion exposure process was finished on the substrate P on the chip bench PST shown in Figure 17 A and 17B, controller CONT stopped the liquid supply to be undertaken by liquid organization of supply 10.On the other hand, after the immersion exposure process is finished on the substrate P, the liquid 1 that controller CONT reclaims on the substrate P by liquids recovery mechanism 20 in vibration (moving with little haul distance) chip bench PST.By in vibration chip bench PST, carrying out reclaimer operation, can be at the liquid on the substrate P 1 compared with when not doing like this, being recovered better.
And, after in vibration chip bench PST, reclaiming the liquid 1 on the substrate P, controller CONT with respect to the recovery port 23 of liquids recovery mechanism 20 along predetermined movement locus mobile substrate platform PST (seeing Figure 12 and 13), scanning recovery port 23 on the whole surface of substrate P.Like this, after carrying out the liquids recovery operation on the whole surface of substrate P, controller CONT takes out (pulling down) substrate P from chip bench PST.The substrate P that then, be exposed is mounted (loading) to chip bench PST.After execution liquid soaked operation on this substrate P, controller CONT carried out the liquids recovery operation on the whole surface of substrate P, then, and to pull down substrate P with above-mentioned identical mode.
In an embodiment, after the immersion exposure of substrate P was finished, the liquids recovery of being carried out by the whole surface of 20 couples of substrate P of liquids recovery mechanism operated on each substrate P that sequentially is installed in chip bench PST and is exposed and is performed (based on substrate P).If residue has liquid 1 on by the substrate P of immersion exposure, cause on substrate P to form watermark, or on the transportation route of the substrate P under the dismounting liquid 1 from the drip shortcoming of (distribution) of substrate P.Yet, in the present embodiment,, can avoid because liquid remains in the shortcoming on the substrate P that carries out immersion exposure by carry out the whole liquid on surface reclaimer operation of substrate P based on substrate P.
In addition, controller CONT also based on the substrate (or based on preset time at interval) of the processing of predetermined number, carries out the liquids recovery operation to the whole area of the upper surface 52A of chip bench PST except the whole surface to substrate P.For example, controller CONT carries out the liquids recovery operation based on a plurality of substrate P for the whole surface of substrate P and the entire upper surface of chip bench PST.For for the whole surface of substrate P and the entire upper surface execution liquids recovery operation of chip bench PST, only need, describe as reference Figure 12 and 13, with respect to the predetermined movement locus mobile substrate platform PST in recovery port 23 edges of liquids recovery mechanism 20.The probability of liquid 1 is arranged is low to residue on the upper surface 52A at chip bench PST behind the immersion exposure; Even have under the situation of liquid 1 in residue on the upper surface 52A, if surplus is very little, then it is little for the influence that the exposure-processed of the substrate P that then will load applies.Therefore, based on a plurality of substrate P, carry out liquids recovery operation for the entire upper surface of chip bench PST by for example, the liquids recovery operating time can shorten, so throughput can be enhanced.And, can additionally use liquids recovery operation as shown in figure 14.
Should be pointed out that and to be configured to, except the whole surface of substrate P, also carry out the liquids recovery operation for the entire upper surface of chip bench PST based on a plurality of substrate P.Certainly, also can be configured to, except the whole surface of substrate P, also carry out the liquids recovery operation for the whole area of the upper surface 52A of chip bench PST based on a substrate P.And, also can be configured to after the datum mark FM on the chip bench PST and/or optical sensor part 58 are used under liquid soaks state, only carry out the liquids recovery operation for the upper surface of chip bench PST.Should be understood that, under such situation, littler by making that distance between the surface of recovery port 23 and substrate P (the upper surface 52A of chip bench PST) becomes, can be recovered more reliably on the surface of substrate P or the liquid on the upper surface of chip bench PST.By doing like this, can avoid on the upper surface 52A of chip bench PST, forming watermark.
Should be understood that, in each the above embodiments, also can be configured to the recovery port of separating that is different from recovery port 23 by providing, use the reclaimer operation of recovery port 23 and use the reclaimer operation of recovery port separately behind immersion exposure, to carry out concurrently.Here, recovery port separately is an obsolete port during immersion exposure, and they for example are the ports that provide on more outside one side with respect to the recovery port 23 of the AR1 of view field or at the upper surface of chip bench PST or the port that is provided on its peripheral region.
Figure 18 shows the example by the exposure sequence of the exposure sources EX execution of the above embodiments.Here, chip bench PST is identical with the chip bench PST of Figure 17.And exposure sequence as shown in figure 18 can be by being performed with the suitable combination referring to figs. 1 to 16 embodiment that describe before.
As shown in figure 18, a plurality of shooting area T1-T32 are set on substrate P, they are to be positioned in the predetermined spacing of X-direction (scanning direction) with in the predetermined spacing of Y direction.Controller CONT exposes since the first shooting area T1, sequential exposure shooting area T2 after this, and T3 ..., and T32.In this process, in above shooting area the scan track of the AR1 of slit-shaped view field respectively by arrow U1, U2 ... and U32 represents.In other words, in the exposure sequence of present embodiment, the exposure order of shooting area is set to when two shooting areas are in succession sequentially exposed, and substrate P (mask M) does not move with identical direction; Controller CONT is at alternately edge+directions X (first direction) and edge-directions X (second direction) mobile substrate P, and a plurality of shooting area T1-T32 on the substrate P that will be exposed sequentially expose.Because the height of the upper surface 52A of chip bench PST is substantially equal to the height on the surface of substrate P, can in this wise alternately in edge+directions X and the edge-directions X mobile substrate P exposure comprise near the shooting area of the shooting area the periphery that is positioned at substrate P.Should be pointed out that in fact because the exposure of each shooting area is by carrying out with respect to the AR1 of view field mobile substrate P, substrate P moves in the opposite direction along the side that represents with arrow shown in Figure 180.
And, can also be configured to when each shooting area T1-T32 of sequential exposure substrate P, make the position of the shooting area depend on selection, the sweep speed of substrate P is lower than the sweep speed when exposing other shooting area when the shooting area of some selection of exposure.
Under situation as shown in figure 18, because be formed on the shooting area T1 of the periphery of substrate P, T4, T5, T10, T23, T28, T29 and T32 lack a part and because with respect to shooting area T2, T3, T30 and T32, between exposure period or before/afterwards, be that border little and between the upper surface 52A of the edge of substrate P and chip bench PST becomes and is included in liquid and soaks regional AR2 in the distance between the edge of the edge of shooting area and substrate P.Therefore, when these exposure shooting areas, the sweep speed of substrate P preferably is set to be lower than the sweep speed of the substrate P when near the shooting area (for example, T13 and T14) the center that is positioned at substrate P of exposing.
By doing like this, even between the upper surface 52A of the surface of substrate P and chip bench PST, a point height difference is arranged, can make the pressure change of the liquid that between projection optical system PL and substrate P, exists very little, and simultaneously, can make the surface of shooting area accurately consistent with the automatically levelling system by autofocus system with the image surface of projection optical system PL.
And, also can be configured to, depend on chip bench PST upper surface 52A (surface that comprises substrate P) area and depend on that liquid soaks the area of regional AR2 (size), when the sweep speed of substrate P is adjusted in exposure during each shooting area.For example, when planning (for example to be similar near be applied to the center that is positioned at substrate P shooting area, T13 and T14) sweep speed exposure be positioned near the edge of substrate P shooting area (for example, T1-T4 and T29-T32) time, make and produce when substrate P is in acceleration starting position (run-up starting position), liquid soaks the upper surface 52A that regional AR2 uses up chip bench PST, or between the deceleration period of substrate P or at the deceleration end position time, liquid soaks the possibility that regional AR2 uses up the upper surface 52A of chip bench PST.Under such situation, preferably, near the shooting area the edge that is positioned at substrate P (for example, T1-T4 and T29-T32) reduces the sweep speed of substrate P when being exposed.By doing like this, be positioned at when exposure near the edge of substrate P shooting area (for example, T1-T4 and T29-T32) time, the acceleration distance of substrate P (run-up distance) and/or deceleration distance can be made into shorter, therefore, each shooting area (particularly, be positioned near the shooting area in edge of substrate P) can be exposed with high precision, and liquid soaks the upper surface 52A that regional AR2 does not use up chip bench PST, keeps liquid 1 well simultaneously between the upper surface 52A of projection optical system PL and chip bench PST.
Should be understood that, acceleration distance and/or deceleration distance owing to weak point when hope is avoided at some shooting area of exposure reduce sweep speed, and/or when avoiding when occurring by autofocus system and automatically levelling system difference in height between the upper surface 52A of the surface of substrate P and chip bench PST to the Position Control on the surface of substrate P wrong, be positioned near the shooting area T1 the edge of substrate P when exposure, T2, T3, T4, T5, T23, T28, T29, T30, when T31 and T32, the moving direction of substrate P can be provided so that the AR1 of view field moves to substrate P outside from substrate P the inside.In this case, preferably wherein substrate P alternately the exposure sequence (exposure order) that moves of edge+directions X and edge-X is far away as far as possible.
In the above-described embodiment, liquid 1 is made of pure water.Pure water has the advantage that obtains in a large number easily at for example semiconductor manufacturing factory, and has for substrate P, and optical element (lens) etc. does not have the advantage of injurious effects.And pure water does not have injurious effects for environment, and comprises any impurity hardly; Therefore, obviously can expect the effect on surface with the surface of the optical element of the end portion that is provided at projection optical system of its cleaning substrate P.
Exposure light EL for wavelength with about 193nm, the refractive index n of pure water (water) is about 1.44, therefore when using ArF to swash the light source of basic laser (having the 193nm wavelength) conduct exposure light EL, on substrate P, wavelength is shortened effectively, just looks like to multiply by 1/n, promptly, in fact become about 134nm, therefore can obtain high resolution.And, because comparing with in air the time, depth of focus increases about n doubly, promptly about 1.44 times, when suitable with the depth of focus realized during the use projection optical system in air as long as guarantee depth of focus, the numerical aperture of projection optical system PL just can further be increased; This also improves resolution.
The numerical aperture NA of projection optical system PL can become 1.0 to 1.3 when using the liquid leaching method as mentioned above.When the numerical aperture NA of projection optical system PL surpasses 1.0, be often used as light, because its polarization influence can influence imaging performance nocuously into the random polarization of exposure light; Therefore, preferably use the polarized light illuminating method.In this case, preferably by carrying out the linear polarization rayed, wherein the straight line on the mask (grating) is aimed at polarised direction with the longitudinal direction of the straight-line pattern of intermittent pattern, makes the ratio of diffraction light of S polarization components from the pattern of mask (grating) (having the diffraction light with the polarization components of the corresponding to polarised direction of longitudinal direction of line pattern) higher.When at projection optical system PL and be added to space between the etchant resist on surface of substrate P when being filled with liquid; from the diffraction light (helping to improve contrast) of S polarization at the transmission coefficient on protective layer surface compared with wherein being filled with the situation of gas (air) higher at projection optical system PL and the space that is applied between the etchant resist on surface of substrate P; even surpass under 1.0 the situation still available high imaging performance at the numerical aperture NA of projection optical system.Should be pointed out that it is more effectively worked when using phase shift mask as mask (mechanical).And, because depend on the condition of the liquid between projection optical system PL and substrate P, the pressure that moves (speed and direction) and liquid of the temperature of liquid, liquid for example, the polarization condition of exposure rayed on substrate P can change, can also be configured to, the polarization condition of the exposure light by considering to shine substrate P in various conditions (for example, by measuring polarization condition), carry out the light-struck optimization of polarization (according to the optimization of the measurement result of polarization condition) for polarised direction and polarizability.
In an embodiment, optical element 2 is attached to the end of projection optical system PL, and by means of lens, the optical characteristics of projection optical system PL (for example spherical aberration, coma aberration or the like) can be adjusted.Should be pointed out that as the optical flat that is attached to the optical element of the end of projection optical system PL, can utilizes the optical characteristics that is used to adjust projection optical system PL.Alternatively, can utilize can transmission the parallel surface flat board of exposure light EL.
Should be understood that, if what caused by liquid 1 mobile is being high at the optical element of the end of projection optical system PL and the pressure in the space between the substrate P, then can be configured to optical element is firmly fixed, avoiding, rather than make that optical element is interchangeable owing to pressure moves.
Should be understood that, though the space that is configured in an embodiment between the surface of projection optical system PL and substrate P is filled with liquid 1, for example can be configured to also to be attached to that this space is filled with liquid 1 under the condition on surface of substrate P at the cover glass that constitutes by the parallel surface flat board.
And, as disclosed in PCT international publication number No.WO 2004/019128, wherein also can be used as projection optical system PL in the light path space of image surface one side and the projection optical system that is filled with liquid in the light path space of the mask M of optical element 2 side.
Though should be pointed out that in an embodiment, liquid 1 is water, and liquid 1 can be the liquid except water.For example, when the light source of exposure light EL was the F2 laser, the light of F2 laser can not permeate water, therefore, as liquid 1, can use the fluorine fluid that can see through the light of F2 laser, such as fluorochemical oil or PFPE (PFPE).And, as liquid 1, also can use and can see through exposure light EL, have high index of refraction that can be practical and not influence projection optical system PL and be applied to substrate P the surface emulsion material (for example, cedar oil).
In addition, in this case, apply surface treatment according to the polarizability of liquid 1.
Should be understood that; substrate P for each above-mentioned embodiment; singly the semiconductor wafer that is used for producing the semiconductor devices can be used, but also the glass substrate that is used for display device, the ceramic wafers that is used for the film magnetic head, main mask or mechanical (synthetic quartz or silicon wafer) or the like can be used.
For exposure light EL, except wherein in moved further mask M and substrate P the pattern of mask M being carried out the scanning type exposure equipment (scanning stepper) of scan exposure, can using wherein, the pattern of mask M is static condition is exposed next time and substrate P moves by stepping ground adjoining land stepping and repetition type apparatus for projection exposure (stepper) at mask M and substrate P.In addition, the present invention can be applied to wherein at least two patterns and be sent to stepping and maqting type apparatus for projection exposure on the substrate P with local overlap mode.
And, the present invention can for example be applied in and not check patent disclosure in Japan, the first publication number No.H10-163099, Japan do not check the patent announcement, disclosed pair of bench-type exposure sources among the disclosed translator of Japanese No.2000-505958 of the first publication number No.H10-214783 and pct international patent application, it is equipped with two platforms, these two platforms are at the substrate that keeps being exposed, and for example can move along the XY direction independently of each other wafer the time.In this case, the embodiment that describes by use Fig. 1 to 18 also can be applied to each of two platforms.
Moreover, the present invention can be applied to for example not checking patent disclosure in Japan, disclosed exposure sources among the first publication number No.H11-135400, it is equipped with chip bench, this chip bench keep to be wanted processed substrate, for example can move along the XY direction wafer time, and have test desk, the Sensor section and/or the datum mark of above-mentioned light are set, and it can irrespectively move thereon with chip bench.In this case, also can be applied to chip bench by the embodiment that uses Fig. 1 to 18 to describe, and, also can be configured to by after liquid being soaked regional AR1 and being formed on various measurements that test desk carries out and finishing, in relatively move recovery port 23 and test desk, remaining liquid on the upper surface of recovery test desk.
For exposure sources EX type, exposure sources that the invention is not restricted to be used for producing the semiconductor devices, the semiconductor pattern of exposure on substrate P, but also can be applied to various exposure sources, for example be used to make liquid crystal display or display exposure sources, be used to make the exposure sources of film magnetic head, the exposure sources that is used to make the exposure sources of image pickup device and is used to make mechanical or mask.
(see U.S. Patent No. 5 when using linear motor, 623,853 or U.S. Patent No. 5,528, when 118) being used for chip bench PST and/or mask platform MST, can adopt air flotation molded lines motor that uses air bearing or the magnetic lever molded lines motor that uses Luo Lunzili or reaction force.And chip bench PST and mask platform MST each can be along the guide rail mobile model or not have the no rail type of guide rail.
For being used for each driving mechanism of chip bench PST and mask platform MST, can use wherein by the armature unit that makes magnet unit that magnet wherein is two-dimensionally arranged and coil wherein be two-dimensionally arranged to face one another and drive the planar motor of each chip bench PST and mask platform MST by electromagnetic force.In this case, any unit of magnet unit and armature unit is attached to chip bench PST and mask platform MST, and another unit is attached to all-moving surface one side of chip bench PST or mask platform MST.
The reaction force that produces by the motion of chip bench PST, do not announce as check patent in Japan, the first publication No. No.H08-166475 (U.S. Patent No. 5,528,118) describe in, can by use frame parts mechanically be discharged into ground () so that this power is not sent to projection optical system PL.The reaction force that produces by the motion of mask platform MST, do not announce as check patent in Japan, first publication No. No.H08-330224 (the U.S. Patent Application Serial Number No.08/416,558) describe in, can by use frame parts mechanically be discharged into ground () so that this power is not sent to projection optical system PL.
Exposure sources EX according to embodiments of the invention makes by the various subsystems that are included in each unit of listing in the claim of present patent application are assembled in such mode of mechanical precision, electric precision and the optical accuracy of maintenance regulation.In order to guarantee before assembling and various precision afterwards, each optical system is adjusted to reach its optical accuracy, and each mechanical system is adjusted to reach its mechanical precision, and each electric system is adjusted to reach its electric precision.
The process of each groups of subsystems being dressed up exposure sources comprises that mechanical interface, circuit connection connection and the air pressure pipeline between each subsystem connect.Need not, before dressing up exposure sources, the wherein assembled process of each subsystem can also be arranged from various groups of subsystems.When finishing the various subsystem of assembling in the exposure sources, carry out total adjustment, guarantee in the exposure sources of finishing, to keep every kind of precision.In addition, wish to make exposure sources in the room of the controlled cleaning of temperature, degree of purity or the like therein.
As shown in figure 19, make by series of steps, comprising such as the micro element of semiconductor device: step 201, carry out the function and the performance design of micro element; Step 202 is made mask (mechanical) according to design procedure; Step 203 is made the substrate as the stock of device; Step 204 is exposed mask pattern on substrate by the exposure sources EX according to the above embodiments; Device number of assembling steps 205 (comprising slicing treatment, joining process and encapsulation process); Checking procedure 206.
Industrial applicability
Because the invention provides exposure sources: expose light via projection optical system and liquid by handle Body shines on the substrate of image surface one side that is placed on described projection optical system, exposure institute State substrate, wherein provide liquid is fed to the liquid organization of supply of described substrate and reclaims quilt Be fed to the liquids recovery mechanism of the liquid of described substrate, and wherein when described exposure irradiation During to image surface one side of described projection optical system, described liquids recovery mechanism is withdrawal liquid not, Exposure process can be performed under sound and the state that is reduced of vibration, and can avoid by The deterioration of the pattern that causes in remaining liquid; Therefore, can make and have the performance wanted Device, and keep simultaneously high exposure accuracy.

Claims (19)

1. one kind by shining exposure light the exposure sources of the described substrate that exposes on the substrate of image surface one side that is placed on described projection optical system via projection optical system and liquid, and described exposure sources comprises:
Liquid organization of supply, its liquid are fed on the described substrate; And
Liquids recovery mechanism, it has recovery end above described substrate and chews to reclaim and be supplied to described on-chip liquid;
Wherein
When described exposure illumination was mapped to image surface one side of described projection optical system, described liquid organization of supply was carried out the liquid supply of described substrate, and described liquids recovery mechanism does not carry out the recovery of described liquid.
2. according to the exposure sources of claim 1, wherein
When described on-chip a plurality of shooting areas are sequentially exposed, described liquids recovery mechanism the exposure of given shooting area finish and the beginning of the exposure of next shooting area between part-time at least at interval in execution in the recovery of described on-chip described liquid.
3. according to the exposure sources of claim 2, wherein
The recovery of the liquid that is carried out in the described time interval by described liquids recovery mechanism is to carry out when finishing the exposure of the shooting area of predetermined number at every turn.
4. according to the exposure sources of claim 2, wherein
The recovery of the liquid that is carried out in the described time interval by described liquids recovery mechanism is to carry out after finishing the exposure of predetermined shooting area.
5. according to the exposure sources of claim 2, wherein
The described time interval is set in step motion, this step motion be after the exposure of given shooting area is finished, carry out and be to carry out for the exposure of next shooting area.
6. according to the exposure sources of claim 2, wherein
Described liquid organization of supply is proceeded the supply of liquid in the described time interval.
7. according to the exposure sources of claim 1, also comprise
Liquid retaining part, its maintenance are provided at least one part of described on-chip liquid, till the liquids recovery of being undertaken by described liquids recovery mechanism begins.
8. according to the exposure sources of claim 7, wherein
Described liquid retaining part keeps liquid by utilizing capillarity.
9. according to the exposure sources of claim 7, wherein
Described liquid retaining part also is used as the liquids recovery port of described liquids recovery mechanism.
10. according to the exposure sources of claim 1, wherein
Described on-chip liquid aspirates and is recovered in described liquids recovery mechanism after the exposure of a substrate is finished.
11. the exposure sources according to claim 10 also comprises
The substrate holding member, it is movably when keeping described substrate, and wherein
After the exposure of described substrate is finished, be recovered in the liquid on described substrate or the described substrate holding member, and relatively move simultaneously the described recovery port and the described substrate holding member of the described liquids recovery mechanism that is disposed in described substrate top.
12. a use is according to the device making method of the exposure sources of claim 1.
13. one kind by on the part of substrate, forming liquid soaks the zone and by the expose exposure sources of described substrate of the substrate that exposure light is shone image surface one side that is placed on described projection optical system via projection optical system and liquid, described exposure sources comprises:
The liquid organization of supply, it is being fed to liquid on the described substrate between the exposure period of described substrate;
Liquids recovery mechanism, it is aspirating and is being recovered in described on-chip liquid between the exposure period of described substrate above described substrate; And wherein
Between the exposure period of described substrate, the liquid of described liquid organization of supply is in large supply in the liquids recovery amount of described liquids recovery mechanism.
14. according to the exposure sources of claim 13, wherein
Described liquids recovery mechanism is recovered in described on-chip liquid together with the gas that surrounds liquid.
15. the exposure sources according to claim 13 also comprises
The substrate holding member, it is movably when keeping described substrate, and wherein
After the exposure of described substrate is finished, be recovered in the liquid on described substrate or the described substrate holding member, and relatively move simultaneously the recovery port of described liquids recovery mechanism and keep the described substrate holding member of described substrate.
16. a use is according to the device making method of the exposure sources of claim 12.
17. exposure method, this method movably forms liquid partly between the upper surface of movable body and the projection optical system and soaks the zone when keeping substrate, and by exposure light via described projection optical system with form that liquid that described liquid soaks the zone is radiated on the described substrate and simultaneously with respect to described exposure light mobile substrate, each shooting area for a plurality of shooting areas is carried out scan exposure, wherein
The translational speed of the described substrate the when translational speed of described substrate during near exposure is positioned at the periphery of described substrate shooting area is lower than when near the shooting area the center that is positioned at described substrate of exposing.
18. exposure method, this method movably forms liquid partly between the upper surface of movable body and the projection optical system and soaks the zone when keeping substrate, and by exposure light via described projection optical system with form that liquid that described liquid soaks the zone is radiated on the described substrate and simultaneously with respect to described exposure light mobile substrate, each shooting area for a plurality of shooting areas is carried out scan exposure, wherein
The translational speed of described substrate is confirmed as making when described liquid soaks the upper surface that the zone is maintained at described movable body, can exposes at described on-chip each shooting area.
19. according to the exposure method of claim 18, wherein
The translational speed of described substrate is confirmed as the feasible acceleration distance or the deceleration distance that can guarantee when the shooting area of described substrate is carried out scan exposure.
CNB2004800235779A 2003-08-21 2004-08-20 Exposure apparatus, exposure method and device manufacturing method Expired - Fee Related CN100470722C (en)

Applications Claiming Priority (3)

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JP2003297507 2003-08-21
JP297507/2003 2003-08-21
JP038411/2004 2004-02-16

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