CN100469220C - A method for making elastic circuit with the non-weaving cloth as base - Google Patents
A method for making elastic circuit with the non-weaving cloth as base Download PDFInfo
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- CN100469220C CN100469220C CNB2007100232988A CN200710023298A CN100469220C CN 100469220 C CN100469220 C CN 100469220C CN B2007100232988 A CNB2007100232988 A CN B2007100232988A CN 200710023298 A CN200710023298 A CN 200710023298A CN 100469220 C CN100469220 C CN 100469220C
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Abstract
This invention relate to a method for preparing soft circuit with non-woven cloth as the base, which takes normal non-woven cloth as the base to sputter a metal such as Al, Cu or Ag with good conduction performance on its surface in the way of low temperature magnetic control sputter to form a nm coat on it so as to build up various circuit patterns with specific functions.
Description
Technical field
A kind of is the method for substrate preparation flexible circuit with the bonded fabric, the present invention relates to the research of textile material performance and the design of electronic circuit, belongs to the interleaving techniques field of textile technology and electronic technology.
Background technology
Science and technology develops rapidly, people the clothing theory very big transformation has also taken place.Advanced clothing theory not only requires clothes to have traditional function, and it is various intelligent to require clothes to have, such as detecting humiture, playing back music, global location etc.This just requires textile garment technology and electronic technology to carry out cross coupled just to finish, so various intelligent clothing, intelligent textile arise at the historic moment.Because what the intelligent clothing of having developed at present mainly adopted is traditional rigid circuit printing plate, cause these intelligent clothing volume heavinesses, and wearing property is poor.So we have invested sight the exploitation of flexible circuit.In the integrated technology of present electronic textile, utilization embeds metal with electric function, alloy or semi-conducting material preparation in fabric silk thread is realized the function of electronic material, these materials have good electric property, but their weavability can be poor, easy fracture, poor as the wearability that can wear the type electronic textile; Technical matters such as chemical deposit and surface grafting polymerization often is used to deposit electric functionalization coating in polymeric fiber surface in addition, but this wet method processing technology, fiber material is immersed in the solution system, surface deposition electricity functionalization coating is to carry out in reactant liquor, can produce processing technology water and pollute; The dry process technology of vacuum evaporation in addition, vacuum evaporation coating is in a vacuum chamber, coating material is heated to the vaporization distillation, be used for depositing coating with electric functionization in polymeric fiber surface, but vacuum evaporation should not be processed the material of high-melting-point and complicated ingredient, and many polymer fiber non-refractories, be not suitable for the processing of high-temperature vacuum evaporation.
At these deficiencies, the present invention has adopted magnetron sputtering method under cryogenic conditions, the using polymer fiber is a base material, the nanostructure coating that has the good conductive function at its surface deposition, realized the surface-functionalized of polymer fiber, and the bond strength height of coating and polymeric fiber surface, the flexible circuit effect of this kind method preparation is very good.
Summary of the invention
The purpose of this invention is to provide a kind of novel method for preparing flexible circuit, utilize the magnetron sputtering surface diposition to realize having conductor, resistance or dielectric properties interface at the surface of bonded fabric structure under the cryogenic conditions, give the bonded fabric surface with special electric function.
Technical scheme of the present invention: a kind of is the method for substrate preparation flexible circuit with the bonded fabric, be to be substrate with the bonded fabric, metallic aluminium, copper or the silver that will have excellent conductive performance in the mode of low temperature magnetic sputtering sputter at bonded fabric substrate surface formation nanostructure coating, construct various circuit diagrams with specific function, give the bonded fabric surface with special electric function, step is:
(1) conventional bonded fabric polyester, polypropylene or the polymerizing polyamide fibres of utilization is base material, and the polymer fiber of selecting for use is carried out preliminary treatment, and it is inserted the plasma treatment device, adopts oxygen, at power is to handle about 60 seconds under 50 watts the condition;
(2) metallic aluminium, copper or the silver of selecting to have excellent conductive performance is coating material;
(3) design of functional circuit;
(4) circuit that design is finished is engraved as mould, sticks to the surface of bonded fabric;
(5) bonded fabric that will be stained with circuit die is put into low temperature magnetic sputtering equipment and carried out the coating sputter, sputtering technology: adopt JP-450A type magnetic control sputtering device, the sputter operating pressure is controlled at 1.3-2.0 * 10
-1Pa, substrate temperature＜50 ℃, target and base material be apart from 5-10cm, 5～8 ° at sputter angle, sputtering power 100-200W, film thickness monitoring is 50nm-300nm, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously, mold removal after sputter is finished, flexible circuit promptly prepares to be finished.
The selection of base material: adopt conventional bonded fabric, such as polyester, polypropylene and polymerizing polyamide fibres.These materials have obtained using widely in weaving processing, and their good processability, cost are low, and wearability is good.The polymer fiber of selecting for use is carried out preliminary treatment, and Surface Treatment with Plasma is adopted in preliminary treatment, and it is inserted the plasma treatment device, and (model: HD-EA), adopt oxygen is to handle about 60S under 50 watts the condition at power.Plasma treatment mainly is to remove finish and other impurity of fiber surface, to improve the adhesion of fiber and coating material.
Preparation technology: adopt JP-450A type magnetic control sputtering device on fiber base material, to prepare electric work energy structure coating, and study in the magnetron sputtering main growth parameter(s) emphatically, as target, base material temperature, operating pressure, sputtering power and sputtering time to coating micro-structural and Effect on Performance.Conductive coating uses sputtered aluminum film, copper film and silver-colored film.The more little conductivity of the resistance of rete is good more, and its resistance should＜15 Ω.The sputter operating pressure is controlled at 1.3-2.0 * 10
-1Pa; Substrate temperature:＜50 ℃; Target and base material distance: 5-10cm; Sputter angle: 5～8 °; Sputtering power 100-200W; Film thickness monitoring is 50nm-300nm.
In addition, fall on the base material for avoiding the particulate goods and materials, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously.In order to control depositing temperature, reduce the distortion of polymer nanofiber, guarantee the quality of coating, adopt water cooling to control the temperature at the polymer nanofiber-based end.
The pattern and the chemistry analysis of polymer fiber electric function coating: the microstructure change of electric function coating and chemical property are the principal elements that influences film electricity and mechanical performance, pattern and chemical property for the polymer surfaces fiber electric function coating of analyzing and researching, to use the modern analysis means, as environmental scanning electron microscope (ESEM), scanning probe microscopy (SPM) and X-ray diffractometer instruments such as (XRD) characterize the surface texture microstructure change and the chemical property of fiber, particularly utilize ESEM, the microstructure change and the chemical property of advantages such as SPM and XRD primary study electric function coating on nanoscale.The microstructure of electric function coating sees Figure of description for details.By analysis, inquire into the influence mechanism of sputtering technology condition to the microstructure of electric function coating and chemical property to the microstructure change and the chemical property of electric function coating.
Description of drawings
Fig. 1 copper film (200nm).
Fig. 2 copper film (100nm).
Fig. 3 copper film (50nm).
Fig. 4 aluminium film (200nm).
Fig. 5 aluminium film (100nm).
Fig. 6 aluminium film (50nm).
Fig. 7 silverskin (200nm).
Fig. 8 silverskin (100nm).
Fig. 9 silverskin (50nm).
Figure 10 thermometric flexible circuit sample.
Embodiment
Embodiment 1
Selecting the conventional smooth bonded fabric polyester fiber of smooth surface is base material.The bonded fabric of selecting for use is carried out preliminary treatment, and it is inserted the plasma treatment device, and (model: HD-EA) adopts oxygen, at power is to handle about 60S under 50 watts the condition.
The metallic aluminium that selection has excellent conductive performance is a coating material.
The design of functional circuit.The circuit that design is finished is engraved as mould, sticks to the surface of bonded fabric.
The bonded fabric that is stained with circuit die is put into low temperature magnetic sputtering equipment carry out the coating sputter, sputtering technology: adopt JP-450A type magnetic control sputtering device, the sputter operating pressure is controlled at 1.3 * 10
-1Pa, 25 ℃ of substrate temperatures, target and base material be apart from 5cm, 5 ° at sputter angle, sputtering power 100W, film thickness monitoring is 50nm-200nm, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously, mold removal after sputter is finished, flexible circuit promptly prepares to be finished.
Embodiment 2
Selecting the conventional smooth bonded fabric polypropylene fibre of smooth surface is base material.The bonded fabric of selecting for use is carried out preliminary treatment, and it is inserted the plasma treatment device, and (model: HD-EA) adopts oxygen, at power is to handle about 60S under 50 watts the condition.
The metallic copper that selection has excellent conductive performance is a coating material.
The design of functional circuit.The circuit that design is finished is engraved as mould, sticks to the surface of bonded fabric.
The bonded fabric that is stained with circuit die is put into low temperature magnetic sputtering equipment carry out the coating sputter, sputtering technology: adopt JP-450A type magnetic control sputtering device, the sputter operating pressure is controlled at 1.6 * 10
-1Pa, 35 ℃ of substrate temperatures, target and base material be apart from 8cm, 7 ° at sputter angle, sputtering power 150W, film thickness monitoring is 50nm-200nm, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously, mold removal after sputter is finished, flexible circuit promptly prepares to be finished.
Embodiment 3
Selecting the conventional smooth bonded fabric Fypro of smooth surface is base material.The bonded fabric of selecting for use is carried out preliminary treatment, and it is inserted the plasma treatment device, and (model: HD-EA) adopts oxygen, at power is to handle about 60S under 50 watts the condition.
The metallic aluminium that selection has excellent conductive performance is a coating material.
The design of functional circuit.The circuit that design is finished is engraved as mould, sticks to the surface of bonded fabric.
The bonded fabric that is stained with circuit die is put into low temperature magnetic sputtering equipment carry out the coating sputter, sputtering technology: adopt JP-450A type magnetic control sputtering device, the sputter operating pressure is controlled at 2.0 * 10
-1Pa, 45 ℃ of substrate temperatures, target and base material be apart from 10cm, 8 ° at sputter angle, sputtering power 200W, film thickness monitoring is 50nm-200nm, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously, mold removal after sputter is finished, flexible circuit promptly prepares to be finished.
Claims (1)
1, a kind of is the method for substrate preparation flexible circuit with the bonded fabric, it is characterized in that with the bonded fabric being substrate, metallic aluminium, copper or the silver that will have excellent conductive performance in the mode of low temperature magnetic sputtering sputter at bonded fabric substrate surface formation nanostructure coating, construct various circuit diagrams with specific function, give the bonded fabric surface with special electric function
(1) conventional polyester, polypropylene or the polyamide polymer fiber non-woven of utilization weaved cotton cloth and is base material, and the bonded fabric of selecting for use is carried out preliminary treatment, and it is inserted the plasma treatment device, adopts oxygen, at power is to handle 60 seconds under 50 watts the condition;
(2) metallic aluminium, copper or the silver of selecting to have excellent conductive performance is coating material;
(3) design of functional circuit;
(4) circuit that design is finished is engraved as mould, sticks to the surface of bonded fabric;
(5) bonded fabric that will be stained with circuit die is put into low temperature magnetic sputtering equipment and carried out the coating sputter, sputtering technology: adopt JP-450A type magnetic control sputtering device, the sputter operating pressure is controlled at 1.3-2.0 * 10
-1Pa, substrate temperature＜50 ℃, target and base material be apart from 5-10cm, 5～8 ° at sputter angle, sputtering power 100-200W, film thickness monitoring is 50nm-300nm, adopt base material last, magnetic controlled sputtering target under structure, i.e. sputter from bottom to top, and vertically magnetic controlled sputtering target and substrate apart from online dynamically adjustable continuously, mold removal after sputter is finished, flexible circuit promptly prepares to be finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100232988A CN100469220C (en) | 2007-06-14 | 2007-06-14 | A method for making elastic circuit with the non-weaving cloth as base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100232988A CN100469220C (en) | 2007-06-14 | 2007-06-14 | A method for making elastic circuit with the non-weaving cloth as base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101080144A CN101080144A (en) | 2007-11-28 |
| CN100469220C true CN100469220C (en) | 2009-03-11 |
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| CNB2007100232988A Expired - Fee Related CN100469220C (en) | 2007-06-14 | 2007-06-14 | A method for making elastic circuit with the non-weaving cloth as base |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102208563B (en) * | 2011-04-18 | 2013-01-30 | 电子科技大学 | Substrate for flexible luminescent device and preparation method thereof |
| CN105338733A (en) * | 2015-09-30 | 2016-02-17 | 安徽省大富光电科技有限公司 | Graphic conductive material and electronic equipment |
| CN107734722B (en) * | 2015-12-31 | 2021-04-06 | 白德旭 | Graphene heating sheet and preparation method thereof |
| CN105671786B (en) * | 2016-03-18 | 2018-11-16 | 苏州椒图电子有限公司 | A kind of processing method of sensing circuit |
| CN106385769B (en) * | 2016-09-08 | 2018-09-04 | 信阳师范学院 | Production method based on the silver fiber flexible circuit that cotton is template |
| KR102009346B1 (en) * | 2018-08-14 | 2019-08-12 | (주)현대포멕스 | Lighting device with collapsible circuit wire and led, method of manufacturing the same |
| CN111636198A (en) * | 2020-06-11 | 2020-09-08 | 麦福枝 | Method for preparing sterilization film on fiber cloth |
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2007
- 2007-06-14 CN CNB2007100232988A patent/CN100469220C/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| PET基纳米ZnO溅射成膜及其紫外线通透性能. 候大寅，李良飞，魏取福.纺织学报，第28卷第2期. 2007 |
| PET基纳米ZnO溅射成膜及其紫外线通透性能. 候大寅，李良飞，魏取福.纺织学报，第28卷第2期. 2007 * |
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