CN100464435C - LED and negative-light mould set therewith - Google Patents
LED and negative-light mould set therewith Download PDFInfo
- Publication number
- CN100464435C CN100464435C CNB2005101209369A CN200510120936A CN100464435C CN 100464435 C CN100464435 C CN 100464435C CN B2005101209369 A CNB2005101209369 A CN B2005101209369A CN 200510120936 A CN200510120936 A CN 200510120936A CN 100464435 C CN100464435 C CN 100464435C
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- China
- Prior art keywords
- light
- emitting diode
- opening
- face
- sheet metal
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The invention is concerned with the background light module group, includes: the light emitter diode (LEB) includes the crystal grain of LEB and the sealing body, the crystal grain of LEB is located in the sealing body, the sealing body includes the top surface and several sidewalls, the top surface is with a opening, the several sidewalls with at least one opening crosses the top surface.
Description
[technical field]
The invention relates to a kind of light-emitting diode and adopt the module backlight of this light-emitting diode, particularly about a kind of module backlight that is used for the light-emitting diode of LCD and adopts this light-emitting diode.
[background technology]
Because the liquid crystal itself in the display panels is not luminous, thereby for reaching display effect, needing provides a light supply apparatus to display panels, as module backlight, to realize Presentation Function.
A kind of module backlight of prior art as shown in Figure 1, this module 1 backlight comprises a light-emitting diode 11, a reflector plate 12, a light guide plate 13, a diffusion sheet 14 and a concentration piece 15.
This light-emitting diode 11 is positioned at incidence surface 131 1 sides of this light guide plate 13, makes these light-emitting diode 11 emitted lights enter this light guide plate 13 inside through incidence surface 131.The scattering of 133 sites (figure do not show) and reflector plate 12 reflections that place this bottom surface 133 through the bottom surface of the internal light of this light guide plate 13 are evenly penetrated by the exiting surface 132 of this light guide plate 13.This diffusion sheet 14 and concentration piece 15 are placed on the exiting surface 132 of this light guide plate 13 successively, by diffusion and optically focused effect, with the quality of improvement output light, and then provide liquid crystal panel (figure does not show) to show the area source of usefulness.
Light-emitting diode 11 is critical elements in the module 1 backlight, advantages such as the characteristics of this light-emitting diode 11 have life-span length, power saving, reaction speed is fast, reliability is high, environmental protection, safety, its packaged type is also different, common kenel has lamp type light-emitting diode and surface adhesion type (Surface Mounted Device, SMD) light-emitting diode.
See also Fig. 2 and Fig. 3, Fig. 2 is the schematic perspective view of the light-emitting diode of module backlight shown in Figure 1, and Fig. 3 is the generalized section along the III-III line of light-emitting diode shown in Figure 2.This light-emitting diode 11 is surface adhesion types.This light-emitting diode 11 comprises a LED crystal particle 111, a packaging body 112 and a translucent resin 113, and this LED crystal particle 111 is positioned at packaging body 112 inside, and this translucent resin 113 is sealed LED crystal particle 111 with filling mode.
This packaging body 112 comprises a metallic substrates 1121, four sidewalls 1122 and an end face 1123, and this four sidewall 1122 is between end face 1123 and metallic substrates 1121.This end face 1123 has a rectangular aperture 1124, and the light that LED crystal particle 111 is sent is penetrated by this opening 1124.This metallic substrates 1121 is engaged with insulative resin 1126 by sheet metal 1121a that constitutes positive electrode and the sheet metal 1121b that constitutes negative electrode, this LED crystal particle 111 is to be bonded in sheet metal 1121a by binder resin, and connects and composes the sheet metal 1121a of positive electrode and the sheet metal 1121b of formation negative electrode by lead 1127.
But this light-emitting diode 11 is that a side is luminous, light is only penetrated by opening 1124, the light that this light-emitting diode 11 sends has particular orientation, and the backlight that is used for mobile phone needs multi-angle luminous, satisfy the light demand from different angles, because except display screen need show the light of usefulness, operation push-button and numerical key also need a part of light, surround lighting make this part light see through operation push-button and numerical key, so that can accurately find respective keys when dying down.Therefore, this light-emitting diode 11 can't satisfy the luminous demand of backlight need multi-angle of mobile phone.
[summary of the invention]
Can't satisfy the luminous problem of multi-angle for overcoming the prior art light-emitting diode, the light-emitting diode that provides a kind of multi-angle luminous is provided.
Can't satisfy the luminous problem of multi-angle for overcoming prior art module backlight, be necessary to provide a kind of module backlight that adopts above-mentioned light-emitting diode.
A kind of light-emitting diode comprises a LED crystal particle and a packaging body, this LED crystal particle is positioned at package interior, this packaging body comprises an end face and a plurality of sidewall, this end face has an opening, these a plurality of sidewalls and end face intersect, wherein, at least one sidewall has an opening, and light is luminous to satisfy multi-angle by the opening outgoing of the opening of sidewall and end face.
A kind of module backlight comprises a light-emitting diode, this light-emitting diode comprises a LED crystal particle and a packaging body, this LED crystal particle is positioned at package interior, this packaging body comprises an end face and a plurality of sidewall, this end face has an opening, and these a plurality of sidewalls and end face intersect, wherein, at least one sidewall has an opening, and light is luminous to satisfy multi-angle by the opening outgoing of the opening of sidewall and end face.
Compared to prior art, because the end face of the light-emitting diode of this module backlight has an opening, and at least one sidewall of a plurality of sidewalls also has an opening, thereby can satisfy the luminous demand of multi-angle.
[description of drawings]
Fig. 1 is the schematic diagram of prior art module backlight.
Fig. 2 is the schematic perspective view of the light-emitting diode of module backlight shown in Figure 1.
Fig. 3 is the generalized section of prolonging the III-III line of light-emitting diode shown in Figure 2.
Fig. 4 is the schematic diagram of the present invention's module backlight.
Fig. 5 is the schematic perspective view of the light-emitting diode of module backlight shown in Figure 4.
Fig. 6 is the schematic perspective view at another visual angle of light-emitting diode shown in Figure 5.
Fig. 7 is the generalized section of prolonging the VII-VII line of light-emitting diode shown in Figure 5.
[embodiment]
Seeing also Fig. 4, is the schematic diagram of the present invention's module backlight.This module 2 backlight comprises a light-emitting diode 21, a reflector plate 22, a light guide plate 23, a diffusion sheet 24 and a concentration piece 25.
This light-emitting diode 21 is positioned at incidence surface 231 1 sides of this light guide plate 23, makes these light-emitting diode 21 emitted lights enter this light guide plate 23 inside through incidence surface 231.The scattering of 233 sites (figure do not show) and reflector plate 22 reflections that place this bottom surface 233 through the bottom surface of the internal light of this light guide plate 23 are evenly penetrated by the exiting surface 232 of this light guide plate 23.This diffusion sheet 24 and concentration piece 25 are placed on the exiting surface 232 of this light guide plate 23 successively, by diffusion and optically focused effect, with the quality of improvement output light, and then provide liquid crystal panel (figure does not show) to show the area source of usefulness.
See also Fig. 5 to Fig. 7, Fig. 5 is the schematic perspective view of the light-emitting diode of module backlight shown in Figure 4, Fig. 6 is the schematic perspective view at an other visual angle of light-emitting diode shown in Figure 5, and Fig. 7 is the generalized section along the VII-VII line of light-emitting diode shown in Figure 5.This light-emitting diode 21 is surface adhesion types.This light-emitting diode 21 comprises a LED crystal particle 211, a packaging body 212 and a translucent resin 213.This LED crystal particle 211 is positioned at packaging body 212 inside, and this translucent resin 213 is sealed LED crystal particle 211 with filling mode.
This packaging body 212 comprises a metallic substrates 2121, four sidewalls 2122 and an end face 2123, and this metallic substrates 2121 and end face 2123 are oppositely arranged, and this four sidewall 2122 is between end face 2123 and metallic substrates 2121.This metallic substrates 2121 is engaged with insulative resin 2126 by sheet metal 2121a that constitutes positive electrode and the sheet metal 2121b that constitutes negative electrode.This LED crystal particle 211 is to be bonded in sheet metal 2121a by binder resin, and connects and composes the sheet metal 2121a of positive electrode and the sheet metal 2121b of formation negative electrode by lead 2127.This end face 2123 has an opening 2124, and this opening 2124 is rectangles, and two sidewalls 2122 that are provided with relatively also have two openings 2125, and this opening 2125 is oval.
When assembling this light-emitting diode 21, its end face 2123 contiguous light guide plate 23 incidence surfaces 231 are provided with, the part light that light-emitting diode 21 sends incides light guide plate 23 inside by the opening on the end face 2,123 2124, provides liquid crystal panel (figure does not show) to show the area source of usefulness.Other a part of light that light-emitting diode 21 sends is penetrated by two openings 2125 on the two side 2122, satisfies the light source requirements from other angle.According to various demands, any one side that can select four sidewalls 2122 is as light-emitting area, relative set opening 2125, and its shape can be circular, rectangle and ellipse.
This light-emitting diode 21 is during as the backlight of mobile phone, the light that is sent by the opening 2124 of end face 2123 can be used for the light that display screen shows usefulness, and can be used for the light that operation push-button and numerical key printing opacity are used by the light that the opening 2125 of sidewall 2122 sends, satisfy the luminous demand of module multi-angle backlight of mobile phone thus.
Claims (10)
1. light-emitting diode, it comprises a LED crystal particle and a packaging body, this LED crystal particle is positioned at package interior, this packaging body comprises an end face and a plurality of sidewall, this end face has an opening, these a plurality of sidewalls and end face intersect, and it is characterized in that: at least one sidewall has an opening, and light is luminous to satisfy multi-angle by the opening outgoing of the opening of sidewall and end face.
2. light-emitting diode as claimed in claim 1 is characterized in that: this packaging body further comprises a metallic substrates.
3. light-emitting diode as claimed in claim 2 is characterized in that: this metallic substrates is engaged with insulative resin by sheet metal that constitutes positive electrode and the sheet metal that constitutes negative electrode.
4. light-emitting diode as claimed in claim 3 is characterized in that: this LED crystal particle is bonded in the sheet metal that constitutes positive electrode by binder resin.
5. light-emitting diode as claimed in claim 4 is characterized in that: this LED crystal particle connects and composes the sheet metal of positive electrode by lead and constitutes the sheet metal of negative electrode.
6. light-emitting diode as claimed in claim 1 is characterized in that: this opening is one of rectangle, circle, ellipse.
7. module backlight, it comprises a light-emitting diode, this light-emitting diode comprises a LED crystal particle and a packaging body, this LED crystal particle is positioned at package interior, this packaging body comprises an end face and a plurality of sidewall, and this end face has an opening, and these a plurality of sidewalls and end face intersect, it is characterized in that: at least one sidewall has an opening, and light is luminous to satisfy multi-angle by the opening outgoing of the opening of sidewall and end face.
8. module backlight as claimed in claim 7 is characterized in that: this packaging body further comprises a metallic substrates.
9. module backlight as claimed in claim 8 is characterized in that: this metallic substrates is engaged with insulative resin by sheet metal that constitutes positive electrode and the sheet metal that constitutes negative electrode.
10. module backlight as claimed in claim 7 is characterized in that: this opening is one of rectangle, circle, ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101209369A CN100464435C (en) | 2005-12-17 | 2005-12-17 | LED and negative-light mould set therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101209369A CN100464435C (en) | 2005-12-17 | 2005-12-17 | LED and negative-light mould set therewith |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1983648A CN1983648A (en) | 2007-06-20 |
| CN100464435C true CN100464435C (en) | 2009-02-25 |
Family
ID=38166010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101209369A Active CN100464435C (en) | 2005-12-17 | 2005-12-17 | LED and negative-light mould set therewith |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100464435C (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2638097Y (en) * | 2003-06-23 | 2004-09-01 | 鸿富锦精密工业（深圳）有限公司 | Luminous diode area source |
| US20040246403A1 (en) * | 2002-12-03 | 2004-12-09 | Kyu-Seok Kim | Backlight assembly |
| JP2005038776A (en) * | 2003-07-17 | 2005-02-10 | Sony Corp | Light guide plate and its manufacturing method, surface light emitting device, and liquid crystal display |
| CN1612020A (en) * | 2003-11-01 | 2005-05-04 | 鸿富锦精密工业（深圳）有限公司 | Back light module assembly |
| CN1652366A (en) * | 2004-02-04 | 2005-08-10 | 西铁城电子股份有限公司 | Light emitting diode |
| JP2005317820A (en) * | 2004-04-30 | 2005-11-10 | Korai Kagi Kofun Yugenkoshi | Light emitting diode package structure |
-
2005
- 2005-12-17 CN CNB2005101209369A patent/CN100464435C/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040246403A1 (en) * | 2002-12-03 | 2004-12-09 | Kyu-Seok Kim | Backlight assembly |
| CN2638097Y (en) * | 2003-06-23 | 2004-09-01 | 鸿富锦精密工业（深圳）有限公司 | Luminous diode area source |
| JP2005038776A (en) * | 2003-07-17 | 2005-02-10 | Sony Corp | Light guide plate and its manufacturing method, surface light emitting device, and liquid crystal display |
| CN1612020A (en) * | 2003-11-01 | 2005-05-04 | 鸿富锦精密工业（深圳）有限公司 | Back light module assembly |
| CN1652366A (en) * | 2004-02-04 | 2005-08-10 | 西铁城电子股份有限公司 | Light emitting diode |
| JP2005317820A (en) * | 2004-04-30 | 2005-11-10 | Korai Kagi Kofun Yugenkoshi | Light emitting diode package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1983648A (en) | 2007-06-20 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |