CN100456206C - Heat abstractor assembling - Google Patents

Heat abstractor assembling Download PDF

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Publication number
CN100456206C
CN100456206C CNB200510121409XA CN200510121409A CN100456206C CN 100456206 C CN100456206 C CN 100456206C CN B200510121409X A CNB200510121409X A CN B200510121409XA CN 200510121409 A CN200510121409 A CN 200510121409A CN 100456206 C CN100456206 C CN 100456206C
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CN
China
Prior art keywords
radiator
fan
heat
centrosome
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200510121409XA
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Chinese (zh)
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CN1991676A (en
Inventor
陈兵
彭学文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CNB200510121409XA priority Critical patent/CN100456206C/en
Publication of CN1991676A publication Critical patent/CN1991676A/en
Application granted granted Critical
Publication of CN100456206C publication Critical patent/CN100456206C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat abstractor combination is disclosed that includes a fan and a radiator, and the fan is fixed on the radiator and possesses at least two directing lines tied up side by side, and the radiator includes a center body and a dry plate radiating flange extending from the center body. Said directing lines is placed in the passage between the two adjacent radiating flanges along the outer rim of center body, and a blocking part is mounted on the one radiating flange of two adjacent radiating flanges to prevent the directing lines from sliding the passages. The design can prevent the directing lines from being loose and involving fan caused by the shake of fan or the air flow generated by the fan.

Description

The heat abstractor combination
[technical field]
The present invention relates to a kind of heat abstractor combination, be meant a kind of heat abstractor combination that comprises heating radiator and fan especially.
[background technology]
Heating radiator is a kind of device that electronic components such as central processing unit, video card chip are dispelled the heat commonly used.Wherein, a kind of heating radiator commonly used comprises a columniform centrosome and the some heat radiator that outwards divergently extend from this centrosome periphery.This centrosome absorbs heat from electronic component, and heat transferred is distributed to heat radiator.
For strengthening the heat-sinking capability of heating radiator, industry is arranged on the heating radiator top with a fan usually.This fan constantly blows to cold air the heat radiator of heating radiator, quickens the outside distribute heat of heat radiator.Fan is provided with lead, and lead is electrically connected fan with a power supply, so that to the fan power supply fan can be turned round.Lead is collected in the structure for arranging wires, thereby is fixed and is protected; Therefore, lead not the air-flow that produces of the vibrations of reason fan or fan become loose and be involved in the fan.
Usually, fan also comprises a framework, is used to carry elements such as rotor, stator.This structure for arranging wires is arranged on the framework.Framework has four sidewalls, longitudinally offers cell body on one of them sidewall.This cell body extends to the top of this sidewall, and lead can be entered in this cell body.After lead entered cell body, a stopper was inserted into cell body, with lead fixed in cell body.Yet cell body is generally cavity in irregular shape, and it is unfavorable for the manufacturing of fan frame.In addition, stopper is a discrete component that separates with fan frame, and it can increase the manufacturing cost of whole fan, also can prolong the assembling process of fan.
[summary of the invention]
In view of this, be necessary to provide a kind of heat abstractor combination.
A kind of heat abstractor combination comprises a fan and a heating radiator, and this fan is fixed on the heating radiator and has at least two leads that band together abreast, and this heating radiator comprises that a centrosome reaches from the extended some plate shape heat radiator of centrosome one.Described lead is placed in the formed passage of two adjacent heat radiator abreast along the centrosome outer rim, a heat radiator in described adjacent two heat radiator is provided with and prevents that lead from skidding off a stop part of this passage, extend towards another heat radiator on the heat radiator of this stop part from described adjacent two heat radiator, have a gap that can supply lead to pass through between its and this another heat radiator.
Compared with prior art, the lead of fan bands together abreast in the combination of this heat abstractor, and on heating radiator integrally formed ccontaining lead passage and prevent that lead from skidding off the stop part of this passage.This kind design prevents that effectively air-flow that lead produces because of the vibrations of fan or fan from becoming loose and being involved in the fan.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional combination figure of heat abstractor combination of the present invention.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 to Fig. 5 is the process synoptic diagram that the fan leads of heat abstractor combination of the present invention snaps in heating radiator.
[embodiment]
Please referring to Fig. 1 and Fig. 2, heat abstractor combination of the present invention comprises a heating radiator 10 and a fan 20.Three screws 30 pass a back up pad 26 of fan and combine with heating radiator and fan 20 is fixed on the heating radiator 10.
This fan 20 comprises a wheel hub 22, and from the divergently outward extending flabellum 24 of wheel hub 22 peripheries.Wheel hub 22 and flabellum 24 are carried by back up pad 26.Back up pad 26 is provided with three through holes 262, is arranged in wherein for screw 30.Article two, parallel lead 28 stretches out also and can be connected with a power supply (figure does not show) from back up pad 26, thereby gives fan 20 power supplies.Lead 28 bands together abreast, and its integral thickness equals the maximum gauge of lead 28, and its integral width is the diameter sum of lead 28.
Please referring to Fig. 1 to Fig. 5, heating radiator 10 can be one-body molded by the mode of aluminium extruded, and it comprises a discoid centrosome 12, divergently from the extended some plate shape heat radiator 14 of centrosome 12 periphery one.This centrosome 12 has a bottom surface (figure does not show) that can contact with the chip (figure does not show) on heat-generating electronic elements such as the video picture card and a upper surface (not label) that carries fan 20.This centrosome 12 is provided with three screws 122, for screw 30 wears fan is fixed on the centrosome 12.After fan 20 was fixed to centrosome 12 upper surfaces, heat radiator 14 was around fan 20.Form a passage 16 between the two adjacent heat radiator 14.This passage 16 is equal to or greater than the diameter sum of all leads 28 along the width of the periphery of centrosome 12, and therefore, lead 28 can be placed in along the outer rim of centrosome 12 in this passage 16 abreast.Be integrally formed with a flanging 144 that extends towards another heat radiator 14 on the heat radiator 14 in described adjacent two heat radiator 14.This flanging 144 perpendicular to this heat radiator 14 in described adjacent two heat radiator 14 and and this 14 of another heat radiator have the gap that can pass through for lead 28, enter the mouth 162 thereby make flanging 28 and 14 formation of this another heat radiator lead to one of passage 16.The gap that flanging 144 and this another heat radiator are 14 is less than the integral width of lead 28 but be equal to or greater than the integral thickness of lead 28, therefore, lead 28 can be in turn by inlet 162 in the admission passage 16.Two buckle ears 18 form from the extension of centrosome 12 periphery one symmetrically.Each buckle ear 18 is provided with a fixed orifice 182, for the fixture that cooperates with a pedestal (figure do not show) (scheming not show) thus wear heating radiator 10 be fixed on this pedestal.
Please referring to Fig. 1 to Fig. 3, screw 30 passes the through hole 262 of fan 20, and screws togather with screw 122 on the heating radiator 10, thereby fan 20 is fixed on the heating radiator 10, so that strengthen the cross-ventilation in the heating radiator 10.
Please referring to Fig. 3 to Fig. 5, during assembling, the lead 28 that at first makes fan 20 vertically rotates lead 28 then successively by inlet 162, and its admission passage 16 also finally is placed in the passage 16 along centrosome 12 outer rims abreast.Flanging 144 can be used as a stop part, prevents that lead 28 is non-through backward rotation artificially and skid off from passage 16.Therefore, lead 28 not the air-flow that produces of the vibrations of reason fan 20 or fan 20 become loose and be involved in the fan 20.During practical application, lead 28 is not limited to two, can also be three.
In the present embodiment, the passage of ccontaining lead 28 16 and prevent that the flanging 144 that lead 28 skids off from all forming together from passage 16 in manufacturing heating radiator 10 need not additional processing, also need not other element and fixes lead 28.Therefore, manufacturing and assembling process are simplified effectively, and production cost also can be minimized.

Claims (10)

1. heat abstractor combination, comprise a fan and a heating radiator, it is characterized in that: this fan is fixed on the heating radiator and has at least two leads that band together abreast, this heating radiator comprises that a centrosome reaches from the extended some plate shape heat radiator of centrosome one, described lead is placed in the formed passage of two adjacent heat radiator abreast along the centrosome outer rim, a heat radiator in described adjacent two heat radiator is provided with and prevents that lead from skidding off a stop part of this passage, extend towards another heat radiator on the heat radiator of this stop part from described adjacent two heat radiator, have a gap that can supply lead to pass through between its and this another heat radiator.
2. heat abstractor as claimed in claim 1 combination is characterized in that: this stop part is perpendicular to a heat radiator in described adjacent two heat radiator.
3. heat abstractor combination as claimed in claim 1 is characterized in that: the width in this gap is more than or equal to the maximum gauge of lead, less than the diameter sum of whole leads.
4. heat abstractor combination as claimed in claim 1, it is characterized in that: these some plate shape heat radiator divergently stretch out from centrosome.
5. heat abstractor as claimed in claim 1 combination is characterized in that: fan comprises a wheel hub, from a back up pad of the divergently outward extending flabellum of wheel hub periphery and carrying wheel hub and flabellum, and lead stretches out from this back up pad.
6. heat abstractor as claimed in claim 5 combination, it is characterized in that: this back up pad is provided with at least two through holes, correspondence is provided with at least two screws on this centrosome, this heat abstractor combination also comprise pass through hole and with at least two screws of screwhole spiro bonding.
7. heat abstractor combination as claimed in claim 1, it is characterized in that: also be provided with two buckle ears on this heating radiator symmetrically, buckle ear is provided with fixed orifice.
8. heat abstractor combination as claimed in claim 1, it is characterized in that: this centrosome is discoid, and fan is fixed on this centrosome.
9. heat abstractor combination as claimed in claim 8, it is characterized in that: these some plate shape heat radiator extend around fan from the centrosome periphery.
10. heat abstractor combination as claimed in claim 5 is characterized in that: the briquetting of a compacting lead is extended in described support plate edge and described stop part corresponding position, and the bearing of trend of described briquetting is opposite with the bearing of trend of described stop part.
CNB200510121409XA 2005-12-30 2005-12-30 Heat abstractor assembling Expired - Fee Related CN100456206C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB200510121409XA CN100456206C (en) 2005-12-30 2005-12-30 Heat abstractor assembling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB200510121409XA CN100456206C (en) 2005-12-30 2005-12-30 Heat abstractor assembling

Publications (2)

Publication Number Publication Date
CN1991676A CN1991676A (en) 2007-07-04
CN100456206C true CN100456206C (en) 2009-01-28

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101330817B (en) * 2008-06-10 2011-08-17 陈永璋 Radiator and method for manufacturing fin component thereof
TWI682143B (en) * 2018-12-28 2020-01-11 邁萪科技股份有限公司 Heat sink

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2371587Y (en) * 1998-06-29 2000-03-29 陈岩传 CPU radiator
US6109340A (en) * 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
CN2416534Y (en) * 2000-01-06 2001-01-24 许文昉 Radiator for micro-processing chip
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
CN2694484Y (en) * 2003-12-13 2005-04-20 鸿富锦精密工业(深圳)有限公司 Heat radiation fan wire fixing device combination
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6109340A (en) * 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
CN2371587Y (en) * 1998-06-29 2000-03-29 陈岩传 CPU radiator
CN2416534Y (en) * 2000-01-06 2001-01-24 许文昉 Radiator for micro-processing chip
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
CN2694484Y (en) * 2003-12-13 2005-04-20 鸿富锦精密工业(深圳)有限公司 Heat radiation fan wire fixing device combination

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Granted publication date: 20090128

Termination date: 20131230