CN100443999C - Backlight module and liquid crystal display containing the backlight module - Google Patents
Backlight module and liquid crystal display containing the backlight module Download PDFInfo
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- CN100443999C CN100443999C CNB2007101025754A CN200710102575A CN100443999C CN 100443999 C CN100443999 C CN 100443999C CN B2007101025754 A CNB2007101025754 A CN B2007101025754A CN 200710102575 A CN200710102575 A CN 200710102575A CN 100443999 C CN100443999 C CN 100443999C
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Abstract
The invention discloses a negative phototropism module and a relative liquid crystal display, which uses a thermal conductive structure to avoid non-uniform picture, wherein the negative phototropism module at least comprises a frame, a reflector plate, a thermal conductive plate, and a circuit board, the frame has a bottom with at least one step through hole, the reflector plate is on the inner surface of the bottom of the frame, the thermal conductive plate is in the step through hole, in preset distance from the reflector plate, the circuit board is on the outer surface of the bottom of the frame, with at least one electric element in the step through hole.
Description
Technical field
The present invention relates to a kind of backlight module and the LCD of using this backlight module, particularly relate to a kind of Backlight module and liquid crystal display with the conductive structure that can eliminate the display frame uneven phenomenon.
Background technology
Integrated circuit (IC) can produce high heat usually in the process of data processing, so how to strengthen heat dissipation design to increase heat dissipation, always be that electronic module designs a considerable ring, especially in the field of display.Because the display speed of data promotes day by day, and because of the volume restrictions field of notebook computer (particularly) causes the distance of electronic component in the liquid crystal display device module and optical element quite approaching, so the optical appearance of the liquid crystal of blooming, light guide plate or array/unit (Array/Cell) that the high heat that electronic component distributed can the local influence backlight module.
For stable twisted nematic LCD (TN LCD), its penetrance can present the relation of negative temperature coefficient along with temperature variation, and promptly temperature heals, and then penetrance is lower for height.Add, when liquid crystal cells and liquid crystal condition not simultaneously, the variable quantity of penetrance may strengthen, the phenomenon that makes temperature rising penetrance reduce is more remarkable.
In liquid crystal display device module, under the bigger display pattern of some load, the electronic component on the printed circuit board (PCB) can produce the phenomenon of high temperature, and its temperature can be up to more than 60 degree Celsius.On the more harsh product of module volume requirement, liquid crystal panel module as notebook computer, it can and be fixed on the backlight module the printed circuit board (PCB) reflexed when assembling, and in order to save volume, the electronic component on the printed circuit board (PCB) can be kept quite little distance inwardly and with reflector plate.In this case, when heat that electronic component produced concentrates on device without any heat insulation or heat conduction, can make liquid crystal produce the phenomenon of localized hyperthermia, thereby cause the local inhomogeneous of display frame.
Existing solution to the problems described above sticks in thermal conductive metal plate after the reflector plate, and in order to high heat evenly distributes with electronic component produced, and the partial penetration rate of avoiding concentrating on certain liquid crystal cells that a bit causes because of heat reduces.Yet directly attach the result of conducting strip, because the thermal expansivity of conducting strip is different with reflector plate, thus can cause the local inhomogeneous of display frame, and at the edge of conducting strip also vestige can appear, make picture produce tangible bright line on the contrary
Summary of the invention
Therefore, the present invention's one purpose is to provide a kind of backlight module and the LCD of using this backlight module, eliminates the phenomenon of display frame inequality by suitable conductive structure.
According to one embodiment of the invention, backlight module of the present invention comprises framework, reflector plate, first conducting strip and circuit board at least, and its middle frame has the bottom, and is formed with the staged through hole on the bottom.Reflector plate is arranged on the inner surface of base of frame, and first conducting strip is arranged at least one staged through hole, and with reflector plate predeterminable range is arranged apart.Circuit board is arranged on the outer surface of base of frame, and circuit board has at least one electronic component, and this electronic component is placed in the staged through hole.
According to another embodiment of the present invention, LCD of the present invention comprises at least: the backlight module of aforesaid embodiment; Light guide plate with the reflector plate adjacency; Be arranged at least one blooming piece on the light guide plate; And be arranged at display panels on the blooming piece.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
For allowing above-mentioned and other purposes of the present invention, feature, advantage and embodiment can become apparent appended graphic being described in detail as follows:
Fig. 1 is the decomposing schematic representation of the LCD of one embodiment of the invention;
Fig. 2 A and Fig. 2 B are respectively the structural representation of the LCD of the first embodiment of the present invention, wherein use different modes that conducting strip is set;
Fig. 3 A and Fig. 3 B are respectively the cross-sectional view of the LCD of the second embodiment of the present invention, wherein use different modes that conducting strip is set;
Fig. 4 is the structural representation of the LCD of the third embodiment of the present invention;
Fig. 5 is the decomposing schematic representation of the LCD of an embodiment more of the present invention;
Fig. 6 is the synoptic diagram of electronic installation of the present invention.
The main element symbol description
100 circuit boards, 110,112 electronic components
120 frameworks, 180 circuit boards
200,202 conducting strips
210,212 bind element
220 retaining elements
302,304,306 staged through holes
310,312 through holes
320,322,330 depressed parts
400 reflector plates, 410 light guide plate
420 blooming pieces, 430 liquid crystal displays
440 LCD
500 backlight modules, 600 electronic installations
D1, d2 predeterminable range
Embodiment
Please refer to Fig. 1, it illustrates the decomposing schematic representation according to the LCD of one embodiment of the invention, does not wherein particularly point out the pattern of staged through hole.This LCD comprises less: circuit board 100, framework 120, conducting strip 200 and liquid crystal display 430, be formed with at least one through hole 310 (Fig. 1 only illustrates a through hole and illustrates) in the bottom of its middle frame 120, in order at least one electronic component 110 (Fig. 1 only illustrates an electronic component and illustrates) of ccontaining circuit board 100, conducting strip 200 is arranged on the sidewall of through hole 310.Between framework 120 and the liquid crystal display 430 and be provided with at least one blooming piece (not illustrating), light guide plate (not illustrating) and reflector plate (not illustrating), blooming piece, light guide plate and reflector plate will be illustrated among Fig. 2 A, Fig. 2 B, Fig. 3 A, Fig. 3 B and Fig. 4.
Below with Fig. 2 A, Fig. 2 B, Fig. 3 A, Fig. 3 B and Fig. 4 feature of the present invention is described, the structural representation of the LCD shown in it is the diagrammatic cross-section shown in the tangent line A-A ' that is similar among Fig. 1.
Please refer to Fig. 2 A and Fig. 2 B, it illustrates the structural representation according to the LCD of the first embodiment of the present invention respectively, wherein uses different modes that conducting strip is set.Backlight module 500 of the present invention comprises at least: circuit board 100, framework 120, conducting strip 200, reflector plate 400.LCD of the present invention comprises at least: backlight module 500, with the light guide plate 410 of reflector plate 400 adjacency, be arranged at least one blooming piece 420 on the light guide plate 410 and be arranged at liquid crystal display 430 (also being called display panels) on the blooming piece 420.Framework 120 has a bottom (indicate), and reflector plate 400 is arranged on the inner surface of bottom of framework 120.Be formed with at least one through hole 310 in the bottom of framework 120, at least one electronic component 110 in order to ccontaining circuit board 100, wherein circuit board 100 (except that electronic component 110) is arranged on the outer surface of bottom of framework 120, and circuit board 100 can be for example printed circuit board (as fibre-glass printed circuit board or other type) or flexible printed circuit.
The present invention forms depressed part 320 on the sidewall of through hole 310, this through hole 310 with depressed part 320 promptly forms so-called staged through hole 302.Then, conducting strip 200 is arranged on the top surface of depressed part 320 of staged through hole 302, evenly distributes in order to the high heat that electronic component 110 is produced.Because the setting of staged through hole 302, conducting strip 200 just nature has a predeterminable range d1 (space) apart with reflector plate 400, so can avoid conducting strip 200 to cause the part rugosity to reflector plate effectively, and can remove existing conducting strip edge and be attached to vestige on the reflector plate because of being subjected to temperature variation.Shown in Fig. 2 A and Fig. 2 B, the staged through hole 302 of this first embodiment is at the opening that has larger sectional area near reflector plate 400 places, and promptly depressed part 320 is formed on the end of through hole 310 near reflector plate 400.Again, shown in Fig. 2 A, conducting strip 200 is fixed in the staged through hole 302 by binding element 210 (for example: adhesive plaster, double faced adhesive tape, viscose or other material); Shown in Fig. 2 B, conducting strip 200 is fixed in the staged through hole 302 by retaining element 220 (for example: screw, plug, rivet or other element).And the retaining element 220 of Fig. 2 B is to be example with the screw, and be to pass conducting strip 200 and be locked in the staged through hole 302 from the lateral surface of framework 120 with retaining element 220, yet, be not limited to this, retaining element 220 also can pass conducting strip 200 earlier, pass the lateral surface of framework 120 again, will be locked in the staged through hole 302.
Please refer to Fig. 3 A and Fig. 3 B, it illustrates the structural representation of LCD according to a second embodiment of the present invention respectively, wherein uses different modes that conducting strip is set.Different with the first embodiment of the present invention is, the staged through hole 304 of this second embodiment has the long-pending opening of small cross sections near reflector plate 400 places, be that depressed part 330 is formed on the relative other end of through hole 310 and reflector plate 400, and conducting strip 200 have a predeterminable range d2 (space) apart with reflector plate 400.Again, as shown in Figure 3A, conducting strip 200 is fixed in the staged through hole 304 by binding element 210 (for example: adhesive plaster, double faced adhesive tape, viscose or other material); Shown in Fig. 3 B, conducting strip 200 is fixed in the staged through hole 304 by retaining element 220 (for example: screw, plug, rivet or other element).
In the first embodiment of the present invention and second embodiment, electronic component 110 is preferable to contact with conducting strip 200, yet, electronic component 110 also can with conducting strip 200 at a distance of a gap, promptly do not contact with conducting strip 200, and also can cooperate other heat dissipation element (not illustrating) that produces forced convertion, as: fan, heat pipe or other element increase radiating effect.
Please refer to Fig. 4, it illustrates the structural representation of the LCD of a third embodiment in accordance with the invention.In some situation, the side of the framework 120 of backlight module (not indicating) also can be provided with circuit board 100.At this moment, just can not be formed with at least one through hole 312 on the side of framework 120 (indicating), in order at least one electronic component 112 of ccontaining circuit board 180.This 3rd embodiment is provided with conducting strip 202 between through hole 312 and electronic component 112, evenly distribute in order to the high heat that electronic component 112 is produced.Conducting strip 202 can be arranged on the electronic component 112; Or be arranged on through hole 312 by at least one that binds element 212 and retaining element (not illustrating).
Similarly, the third embodiment of the present invention also can form depressed part 322 on the sidewall of through hole 312, and forms staged through hole 306.Then, conducting strip 202 is arranged on the top surface of depressed part 322 of staged through hole 306.As shown in Figure 4, staged through hole 306 is at the opening that has larger sectional area near the inner surface place of frame sides.Again, according to still another embodiment of the invention, staged through hole 306 can have the long-pending opening of small cross sections at the inner surface place near frame sides.
What deserves to be mentioned is, the described conducting strip 200,202 of the above embodiment of the present invention can be made by any Heat Conduction Material, for example: aluminium foil, Copper Foil, silver foil, goldleaf, refrigerating sheet or other material or above-mentioned combination, embodiments of the invention are to be example with the aluminium foil.In addition, in the third embodiment of the present invention, electronic component 110 preferably contacts with conducting strip 200; Electronic component 112 is preferable to contact with conducting strip 202, yet, electronic component 110 and 112 also can be respectively with conducting strip 200 and 202 at a distance of gapped, promptly do not contact with conducting strip 200 and 202, and also can cooperate other to produce the heat dissipation element (not illustrating) of forced convertion again, as: fan, heat pipe or other element increase radiating effect.And the described through hole the 310, the 312nd of the above embodiment of the present invention serves as to implement example with a bottom surface and a side that is formed at framework 120, but is not limited thereto that framework 120 of the present invention also can have a plurality of through holes, for example: 2,3,4,5 etc.
Please refer to Fig. 5, it illustrates according to the decomposing schematic representation of the LCD of an embodiment more of the present invention, does not wherein particularly point out the pattern of staged through hole, and framework 120 has a plurality of through holes 310 and 330, for example: 5.And, be not that each through hole all is equipped with at least one electronic component, but optionally holding electronic element or other element arranged at least a portion through hole according to design.Must it should be noted that, the above embodiment of the present invention is arranged on circuit board 100 ( electronic component 110 and 112 outer) on whole outer surfaces of bottom of framework 120 to illustrating, but the present invention is not limited to this, and circuit board 100 also can be arranged on the outer surface of part of bottom of framework 120.
Moreover, the described at least one blooming piece 420 of the above embodiment of the present invention comprises Polarizer, blast sheet, prismatic lens, half-transparent half-reflection sheet, diffusion sheet or other type or above-mentioned combination, and the figure of the above embodiment of the present invention is an example with three blooming pieces, but be not limited thereto, also a slice blooming piece at least.And the described framework 120 of the above embodiment of the present invention is with metal, alloy, plastic cement or above-mentioned combination, and the present invention implements example, and then framework 120 also is referred to as the glue frame, but is not limited thereto.In addition, the backlight module of the described embodiment of the foregoing description more comprises a light-emitting component (not shown) and is arranged on the reflector plate.
In addition, the display panels of LCD of the present invention, comprise multiple domain vertical alignment liquid crystal display panel (Multi-Domain Vertical Alignment liquid crystal display panel, MVA-LCDP), vertical alignment liquid crystal display panel (Vertical Alignment LCDP, MVA-LCDP), polymer stabilizing arrangement display panels (Polymer stabilized alignmentLCDP, PSA-LCDP), horizontal component of electric field switchable liquid crystal display panel (In-Plane Switch LCDP, IPS-LCDP), optical compensation curved arrangement display panels (Optically Compensated BendLCDP, OCB-LCDP), twisted nematic liquid crystal display panel (Twisted Nematic LCDP, TN-LCDP), Supertwist Nematic Liquid Crystal Display panel (Super Twisted Nematic LCDP, STN-LCDP) or similarly display panels.
Please refer to Fig. 6, it illustrates the synoptic diagram of electrooptical device of the present invention.As shown in Figure 6; described LCD 440 of the above embodiments of the present invention and backlight module 500 thereof also can apply in the electronic installation; and this electronic installation 600 has more an electronic component 110 that is connected with display panels 430; 112, as: control element; executive component; treatment element; input element; memory element; driving element; light-emitting component (as: Organic Light Emitting Diode; inorganic light-emitting diode; the cold cathode fluorescent lamp pipe; hot-cathode fluorescent light tube; the plane fluorescent tube; the outer electrode fluorescent tube; or other type fluorescent tube; or above-mentioned combination); protecting component; or other function element; or above-mentioned combination.And the type of electronic installation comprises portable product (as mobile phone, video camera, camera, notebook computer, game machine, wrist-watch, music player, electronic mail transceiver, digital photo frame, map navigator or similar products like), video and audio product (as audio-visual projector or similar products like), screen, TV, indoor or outdoors billboard etc.
By the invention described above embodiment as can be known, using advantage of the present invention is: the high heat affecting liquid crystal display 430 that can avoid electronic component to produce causes display frame inhomogeneous, and can avoid conducting strip to be subjected to temperature variation and reflector plate is caused local rugosity, and remove the vestige that conducting strip attaches the edge, thereby eliminate the phenomenon of display frame inequality effectively.
Though the present invention discloses as above with embodiment; right its is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (39)
1. backlight module comprises:
One framework has a bottom and at least one first staged through hole that is formed in this bottom;
One reflector plate is arranged on the inner surface of this bottom;
One first conducting strip is arranged in this first staged through hole, and wherein this first conducting strip and this reflector plate have a predeterminable range apart; And
One first circuit board is arranged on the outer surface of this bottom, and has at least one first electronic component that is placed in this first staged through hole.
2. backlight module as claimed in claim 1, wherein this first conducting strip comprises aluminium foil, goldleaf, Copper Foil, silver foil, refrigerating sheet or above-mentioned combination.
3. backlight module as claimed in claim 1, wherein this first staged through hole is at the opening that has larger sectional area near this reflector plate place.
4. backlight module as claimed in claim 1, wherein this first staged through hole has the long-pending opening of small cross sections near this reflector plate place.
5. backlight module as claimed in claim 1, wherein this first conducting strip binds the inner surface that element is arranged on this bottom by one.
6. backlight module as claimed in claim 1, wherein this first conducting strip is arranged on the inner surface of this bottom by a retaining element.
7. backlight module as claimed in claim 1, wherein this framework has more a sidewall, has at least one through hole on this sidewall, and this backlight module comprises more at least:
One second conducting strip is arranged in this through hole of this sidewall; And
One second circuit board is arranged on the outer surface of this sidewall, and has at least one second electronic component that is placed in this through hole.
8. backlight module as claimed in claim 7, wherein this through hole is a staged through hole.
9. backlight module as claimed in claim 8, this staged through hole wherein, the opening that has larger sectional area at inner surface near this sidewall.
10. backlight module as claimed in claim 8, wherein this staged through hole has the long-pending opening of small cross sections at the inner surface near this sidewall.
11. backlight module as claimed in claim 7, wherein this second conducting strip comprises aluminium foil, goldleaf, Copper Foil, silver foil, refrigerating sheet or above-mentioned combination.
12. backlight module as claimed in claim 7, wherein this second conducting strip binds the inner surface that element is arranged on this sidewall by one.
13. backlight module as claimed in claim 7, wherein this second conducting strip is arranged on the inner surface of this sidewall by a retaining element.
14. a LCD comprises:
One backlight module comprises:
One framework has a bottom and at least one first staged through hole that is formed in this bottom;
One reflector plate is arranged on the inner surface of this bottom;
One first conducting strip is arranged in this first staged through hole, and wherein this first conducting strip and this reflector plate have a predeterminable range apart; And
One first circuit board is arranged on the outer surface of this bottom, and has at least one first electronic component that is placed in this first staged through hole;
One light guide plate is with this reflector plate adjacency;
At least one blooming piece is arranged on this light guide plate; And
One display panels is arranged on this blooming piece.
15. LCD as claimed in claim 14, wherein this first conducting strip comprises aluminium foil, goldleaf, Copper Foil, silver foil, refrigerating sheet or above-mentioned combination.
16. LCD as claimed in claim 14, wherein this first staged through hole is at the opening that has larger sectional area near this reflector plate place.
17. LCD as claimed in claim 14, wherein this first staged through hole has the long-pending opening of small cross sections near this reflector plate place.
18. LCD as claimed in claim 14, wherein this first conducting strip binds the inner surface that element is arranged on this bottom by one.
19. LCD as claimed in claim 14, wherein this first conducting strip is arranged on the inner surface of this bottom by a retaining element.
20. LCD as claimed in claim 14, wherein this framework has more a sidewall, has at least one through hole on this sidewall, and this backlight module comprises more at least:
One second conducting strip is arranged in this through hole of this sidewall; And
One second circuit board is arranged on the outer surface of this bottom, and has at least one second electronic component that is placed in this through hole.
21. LCD as claimed in claim 20, wherein this through hole is a staged through hole.
22. LCD as claimed in claim 21, this staged through hole wherein, the opening that has larger sectional area at inner surface near this sidewall.
23. LCD as claimed in claim 21, wherein this staged through hole has the long-pending opening of small cross sections at the inner surface near this sidewall.
24. LCD as claimed in claim 20, wherein this second conducting strip comprises aluminium foil, goldleaf, Copper Foil, silver foil, refrigerating sheet or above-mentioned combination.
25. LCD as claimed in claim 20, wherein this second conducting strip binds the inner surface that element is arranged on this sidewall by one.
26. LCD as claimed in claim 20, wherein this second conducting strip is arranged on the inner surface of this sidewall by a retaining element.
27. an electronic installation comprises backlight module as claimed in claim 1.
28. an electronic installation comprises LCD as claimed in claim 14.
29. a backlight module comprises:
One framework has a bottom and a plurality of first through holes that are formed in this bottom;
One reflector plate is arranged on the inner surface of this bottom;
One first conducting strip is arranged at least one of those first through holes, and wherein this first conducting strip and this reflector plate have a predeterminable range apart; And
At least one first circuit board is arranged on the outer surface of this bottom, and has at least one first electronic component at least one that is placed in those first through holes.
30. backlight module as claimed in claim 29, wherein this first conducting strip binds the inner surface that element is arranged on this bottom by one.
31. backlight module as claimed in claim 29, wherein this first conducting strip is arranged on the inner surface of this bottom by a retaining element.
32. backlight module as claimed in claim 29, wherein this framework has more at least one sidewall, has at least one second through hole on this sidewall, and this backlight module more comprises:
One second conducting strip is arranged in this second through hole of this sidewall; And
One second circuit board is arranged on the outer surface of this bottom, and has at least one second electronic component that is placed in this second through hole.
33. backlight module as claimed in claim 32, wherein this second through hole and those first through holes wherein one at least one be a staged through hole.
34. backlight module as claimed in claim 33, wherein wherein at least one opening that has larger sectional area at inner surface of one of this second through hole and those first through holes near this framework.
35. backlight module as claimed in claim 33, wherein wherein at least one inner surface at close this framework of one of this second through hole and those first through holes has the long-pending opening of small cross sections.
36. backlight module as claimed in claim 32, wherein at least one of this first conducting strip and this second conducting strip comprises aluminium foil, goldleaf, Copper Foil, silver foil, refrigerating sheet or above-mentioned combination.
37. backlight module as claimed in claim 32, wherein this second conducting strip binds the inner surface that element is arranged on this sidewall by one.
38. backlight module as claimed in claim 32, wherein this second conducting strip is arranged on the inner surface of this sidewall by a retaining element.
39. an electronic installation comprises backlight module as claimed in claim 29.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101025754A CN100443999C (en) | 2006-06-07 | 2007-05-16 | Backlight module and liquid crystal display containing the backlight module |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610087795 CN1862333A (en) | 2006-06-07 | 2006-06-07 | Liquid crystal display |
| CN200610087795.X | 2006-06-07 | ||
| CNB2007101025754A CN100443999C (en) | 2006-06-07 | 2007-05-16 | Backlight module and liquid crystal display containing the backlight module |
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| Publication Number | Publication Date |
|---|---|
| CN101059624A CN101059624A (en) | 2007-10-24 |
| CN100443999C true CN100443999C (en) | 2008-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101025754A Active CN100443999C (en) | 2006-06-07 | 2007-05-16 | Backlight module and liquid crystal display containing the backlight module |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055926B (en) * | 2009-11-06 | 2015-06-24 | 康佳集团股份有限公司 | Split liquid crystal television and realizing method thereof |
| TWI465797B (en) * | 2012-11-30 | 2014-12-21 | Au Optronics Corp | Panel module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000298265A (en) * | 1998-11-27 | 2000-10-24 | Hitachi Maxell Ltd | Liquid crystal display device |
| US20040119911A1 (en) * | 1998-11-27 | 2004-06-24 | Hitachi Maxell, Ltd. | Liquid crystal display device and liquid crystal production method |
| CN1544981A (en) * | 2003-11-18 | 2004-11-10 | 友达光电股份有限公司 | Backlight subassembly |
-
2007
- 2007-05-16 CN CNB2007101025754A patent/CN100443999C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000298265A (en) * | 1998-11-27 | 2000-10-24 | Hitachi Maxell Ltd | Liquid crystal display device |
| US20040119911A1 (en) * | 1998-11-27 | 2004-06-24 | Hitachi Maxell, Ltd. | Liquid crystal display device and liquid crystal production method |
| CN1544981A (en) * | 2003-11-18 | 2004-11-10 | 友达光电股份有限公司 | Backlight subassembly |
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| CN101059624A (en) | 2007-10-24 |
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